Heat sink and heat dissipation system

Abstract

The application discloses a radiator and a heat dissipation system, and relates to the technical field of heat dissipation, which comprises a radiator, a micro-channel layer, a manifold distribution layer and a fluid inlet and outlet layer which are sequentially stacked from bottom to top; the fluid inlet and outlet layer is provided with a fluid inlet and a plurality of fluid outlets; the micro-channel layer comprises a central flow distribution area, a flow passage transition area and an annular flow passage area which are sequentially communicated; the manifold distribution layer is located between the micro-channel layer and the fluid inlet and outlet layer and comprises a central divergence area, a dispersed flow passage area and a peripheral convergence area; the central divergence area is communicated with the fluid inlet and the central flow distribution area; the dispersed flow passage area extends outward from the central divergence area, and the tail end is communicated with a first group of fluid outlets; the peripheral convergence area is communicated with the outlet of the annular flow passage area and a second group of fluid outlets, solves the problem that fluid distribution is uneven in the micro-channel, local hot spots are formed and a large pressure drop loss is caused, and the technical effects of flow uniformization and system pressure drop reduction are achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology, in particular to a heat sink and a heat dissipation system. BACKGROUND

[0002] With the rapid development of electronic and computer technology, especially the popularization of high-computing-power applications such as artificial intelligence, big data processing and cloud computing, the power density of high-performance components such as central processing units continues to rise, and the local heat flux density has far exceeded the carrying capacity of traditional heat dissipation technology. The traditional air cooling and conventional liquid cooling schemes are limited by low heat exchange efficiency, large thermal resistance and other problems, and are difficult to effectively export concentrated heat under high heat flux density, which easily leads to high temperature of high-performance components such as central processing units, performance reduction and even hardware damage.

[0003] Under this background, micro-channel heat dissipation technology emerged as the times require. Through micro-channel structure, the heat dissipation surface area is greatly increased, and the heat conduction path is shortened, thereby realizing extremely high heat exchange efficiency. However, due to the uneven distribution of fluid in the micro-channel, local hot spots are easily formed; and in order to improve the heat exchange performance, the slender micro-channel structure is often used, which brings larger flow resistance and causes larger pressure drop loss. SUMMARY

[0004] The present application provides a heat sink and a heat dissipation system to at least solve the problem of uneven distribution of fluid in the micro-channel, which easily leads to the formation of local hot spots; and in order to improve the heat exchange performance, the slender micro-channel structure is often used, which brings larger flow resistance and causes larger pressure drop loss.

[0005] The present application provides a heat sink, comprising a micro-channel layer, a manifold distribution layer and a fluid inlet and outlet layer which are sequentially stacked from bottom to top; the fluid inlet and outlet layer is provided with a fluid inlet and a plurality of fluid outlets, the plurality of fluid outlets comprises a first group of fluid outlets and a second group of fluid outlets; the micro-channel layer comprises a central flow distribution area, a flow passage transition area and an annular flow passage area which are sequentially communicated; the flow passage transition area is connected between the central flow distribution area and the annular flow passage area; the manifold distribution layer is located between the micro-channel layer and the fluid inlet and outlet layer, comprising a central diverging area, a dispersed flow passage area and a peripheral converging area; the central diverging area is in communication with the fluid inlet and the central flow distribution area; the dispersed flow passage area extends outward from the central diverging area, and the distal end is in communication with the first group of fluid outlets; the peripheral converging area is in communication with the outlet of the annular flow passage area and the second group of fluid outlets.

[0006] The present application also provides a heat dissipation system comprising the above-mentioned heat sink.

[0007] The micro-channel layer, the manifold distribution layer and the fluid inlet and outlet layer are sequentially arranged from bottom to top, so that the fluid is uniformly and efficiently distributed and orderly collected. The center flow distribution area, the flow channel transition area and the annular flow channel area are sequentially communicated to form a three-stage fluid distribution path which is gradually expanded, so as to effectively prolong the flow distance, enhance the heat exchange and promote the flow uniformization. The center divergent area in the manifold distribution layer synchronously distributes the inlet fluid to the micro-channel layer and the circumferential dispersion flow channel area, and in combination with the dispersion flow channel area and the peripheral convergent area, different groups of fluid outlets are corresponded, so that part of the fluid is guided out from the peripheral convergent area after being fully heat-exchanged in the micro-channel, and the other part of the fluid is directly returned through the low-resistance path formed by the dispersion flow channel area and the fluid outlet, so as to shorten the overall flow path and reduce the system pressure drop. Meanwhile, the fluid inlet and the plurality of fluid outlets are arranged to ensure that the initial conditions of the flow channel inlets are consistent and the outlet flow is coordinated, so as to effectively avoid local flow unevenness or hot spot concentration, and improve the heat dissipation performance and flow stability. BRIEF DESCRIPTION OF DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0009] Figure 1 A schematic diagram of the overall assembly structure of the heat sink provided by the embodiments of the present application is shown in the figure.

[0010] Figure 2 A schematic diagram of the overall assembly structure of the heat sink and the heat-dissipating component provided by the embodiments of the present application is shown in the figure.

[0011] Figure 3 A schematic diagram of the overall structure of the micro-channel layer of the heat sink provided by the embodiments of the present application is shown in the figure.

[0012] Figure 4 A structure top view of the micro-channel layer provided by the embodiments of the present application is shown in the figure.

[0013] Figure 5 A schematic diagram of the local enlarged structure of the micro-channel A is shown in the figure. Figure 4

[0014] A schematic diagram of the local enlarged structure of the micro-channel B is shown in the figure. Figure 6 Figure 4 A schematic diagram of the overall structure of the manifold distribution layer provided by the embodiments of the present application is shown in the figure.

[0015] Figure 7 A schematic diagram of the overall structure of the fluid inlet and outlet layer provided by the embodiments of the present application is shown in the figure.

[0016] Figure 8 A schematic diagram of the overall structure of the fluid inlet and outlet layer provided by the embodiments of the present application is shown in the figure.​

[0017] Figure 9 temperature cloud map of the surface of the heat-dissipating component provided by the embodiment of the present application;

[0018] Figure 10 temperature cloud map of the upper surface of the fluid inlet and outlet layer of the heat sink provided by the embodiment of the present application;

[0019] Figure 11 flow velocity cloud map of the fluid inside the micro-channel layer provided by the embodiment of the present application;

[0020] Figure 12 flow velocity cloud map of the fluid inside the manifold distribution layer provided by the embodiment of the present application.

[0021] wherein the above-mentioned drawings include the following reference signs:

[0022] 100, micro-channel layer; 110, central flow distribution area; 111, turbulence column; 120, flow passage transition area; 121, transition flow passage; 130, annular flow passage area; 131, annular flow passage; 132, connecting flow passage;

[0023] 200, manifold distribution layer; 210, central divergence area; 220, divergent flow passage area; 221, divergent flow passage; 2211, flow passage wall; 230, peripheral convergent area; 231, convergent port;

[0024] 300, fluid inlet and outlet layer; 310, fluid inlet; 320, fluid outlet;

[0025] 400, heat-dissipating component. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0027] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mount", "connect", "connect" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication between two elements inside. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the person skilled in the art considering the measurement being discussed and the error related to the measurement of the specific quantity (i.e. the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in specific cases.

[0028] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0029] The embodiments of the present application provide a heat sink and a heat dissipation system. The device is described in detail in combination with the structure and working principle of the heat sink and the heat dissipation system.

[0030] According to the embodiments of the present application, in one aspect, a heat sink is provided, such as Figure 1 and Figure 2As shown, the heat sink includes a micro-channel layer 100, a manifold distribution layer 200 and a fluid inlet and outlet layer 300 stacked in sequence from bottom to top; the fluid inlet and outlet layer 300 is provided with a fluid inlet 310 and a plurality of fluid outlets 320, the plurality of fluid outlets 320 includes a first group of fluid outlets 320 and a second group of fluid outlets 320; the micro-channel layer 100 includes a central flow distribution area 110, a flow passage transition area 120 and an annular flow passage area 130 which are sequentially communicated; the flow passage transition area 120 is connected between the central flow distribution area 110 and the annular flow passage area 130; the manifold distribution layer 200 is located between the micro-channel layer 100 and the fluid inlet and outlet layer 300, and includes a central diverging area 210, a dispersed flow passage area 220 and a peripheral converging area 230; the central diverging area 210 is communicated with the fluid inlet 310 and the central flow distribution area 110; the dispersed flow passage area 220 extends outwardly from the central diverging area 210, and the distal end thereof is communicated with the first group of fluid outlets 320; the peripheral converging area 230 is communicated with the outlet of the annular flow passage area 130 and the second group of fluid outlets 320.

[0031] In the above embodiment, by sequentially arranging the micro-channel layer 100, the manifold distribution layer 200 and the fluid inlet and outlet layer 300 from bottom to top, efficient and uniform distribution and orderly collection of fluid are achieved. The central flow distribution area 110, the flow passage transition area 120 and the annular flow passage area 130 are sequentially communicated to form a three-stage fluid distribution path which is gradually expanded, thereby effectively prolonging the flow distance, enhancing heat exchange and promoting flow uniformization; the central diverging area 210 in the manifold distribution layer 200 synchronously distributes the inlet fluid to the micro-channel layer 100 and the circumferential dispersed flow passage area 220, in combination with the dispersed flow passage area 220 and the peripheral converging area 230, to correspond to different groups of fluid outlets 320 respectively, so that part of the fluid is guided out by the peripheral converging area 230 after being fully heat-exchanged in the micro-channel, and the other part of the fluid is directly returned through the low-resistance path formed by the dispersed flow passage area 220 and the fluid outlet 320, thereby shortening the overall flow path and reducing the system pressure drop; at the same time, the arrangement of the fluid inlet 310 and the plurality of fluid outlets 320 ensures that the initial conditions of the flow passages are consistent and the outlet flow is coordinated, thereby effectively avoiding local flow unevenness or hot spot concentration and improving the heat dissipation performance and flow stability.

[0032] In a specific embodiment, as shown in Figure 3 and Figure 4 , the micro-channel layer 100 has a square planar layout as a whole, the length of the micro-channel layer 100 as a whole is , the width of the micro-channel layer 100 as a whole is , and satisfies = , so as to ensure that when installed on the surface of a high heat flux electronic device or other heat dissipation member 400, symmetrical coverage can be achieved, thereby matching the geometric characteristics of the heat generation area and promoting uniform distribution of the temperature field. The overall thickness of the micro-channel layer 100 is , The thickness not only needs to provide sufficient mechanical support to bear the assembly pressure and running load, but also needs to reserve sufficient space for the internal complex flow channel structure.

[0033] Specifically, the center flow distribution area 110, the flow channel transition area 120 and the annular flow channel area 130 inside the micro-channel layer 100 jointly constitute a complete path for the cooling fluid to diffuse from the inlet to the periphery and complete efficient heat exchange. The flow channel depth of the center flow distribution area 110, the flow channel transition area 120 and the annular flow channel area 130 is , that is, the height of the fluid flow cross section is , and satisfies > The larger overall thickness ensures a good heat conduction path between the bottom surface of the micro-channel layer 100 and the heat dissipation device 400 of high heat flux density, and enhances the structural rigidity.

[0034] Specifically, and The difference between the solid base part not only bears the dense arrangement of the microstructure such as the array of cylindrical turbulence columns 111, but also effectively avoids the problem of flow dead zone or excessive pressure drop caused by excessive flow channel depth. The micro-channel layer 100 maintains the overall regular shape while realizing the synergistic optimization among structural strength, flow uniformity and efficient heat exchange by controlling the hierarchical relationship between the overall thickness and the internal flow channel depth.

[0035] Specifically, the length of the micro-channel layer 100 as a whole is preferably , the width of the micro-channel layer 100 as a whole is preferably , and the thickness of the micro-channel layer 100 as a whole is preferably . The thickness of the flow channel in the center flow distribution area 110, the flow channel transition area 120 and the annular flow channel area 130 inside the micro-channel layer 100 is preferably .

[0036] In a specific implementation, the manifold distribution layer 200, serving as an intermediate structure connecting the microchannel layer 100 and the fluid inlet / outlet layer 300, performs bidirectional fluid regulation. The upper surface of the manifold distribution layer 200 is in close contact with the fluid inlet / outlet layer 300, while the lower surface is in close contact with the microchannel layer 100, forming a complete three-dimensional flow channel system. When the cooling liquid flows in from the fluid inlet 310 at the center of the fluid inlet / outlet layer 300, it first enters the manifold distribution layer 200 and undergoes initial diffusion within it through the central free divergence zone. A portion of the fluid is evenly and orderly distributed to each heat exchange area of ​​the microchannel layer 100, thereby ensuring a high degree of consistency in flow rate and pressure at each microchannel inlet, effectively avoiding localized insufficient flow or overheating. Another portion of the fluid is guided to the centrally symmetrically distributed petal-shaped distribution channels 221. After heat exchange is completed, the liquid flowing out of the microchannel layer 100 flows back to the peripheral convergence area 230 of the manifold distribution layer 200. It is efficiently collected in the peripheral convergence area 230 and guided to the second set of fluid outlets 320 directly opposite it, finally flowing out of the radiator through the fluid inlet / outlet layer 300. Therefore, the manifold distribution layer 200 is not only the distribution center for achieving uniform distribution of coolant from centralized input to the entire area, but also the convergence hub for multi-point convergence and orderly discharge.

[0037] In specific implementation methods, such as Figure 7 As shown, the manifold distribution layer 200 has a square planar configuration, and the overall length of the manifold distribution layer 200 is also [missing information]. The overall width of the manifold distribution layer 200 is also the same. The overall thickness of the manifold distribution layer 200 is... Specifically, the length of the manifold distribution layer 200 is... The width of the manifold distribution layer 200 is The thickness of the manifold distribution layer 200 is That is, the length and width are equal, forming a shape with a side length of... The cubic thin plate structure is not only convenient for use with other structures of the same side length. The microchannel layers 100 are aligned and stacked, which also fits the square heat-generating area of ​​the heat sink 400 for high heat flux density electronic devices, facilitating full coverage and symmetrical cooling. The overall thickness of the manifold distribution layer 200 is 0.5mm. While ensuring sufficient channel space to accommodate the petal-shaped branching channels 221, the central divergence area 210, and the peripheral convergence area 230, it minimizes the interlayer volume, reducing fluid stagnation and pressure loss. Furthermore, the 0.5mm thickness helps shorten the fluid transport path in the vertical direction, improves response speed, and reduces the amount of manufacturing materials, balancing performance and cost. It also facilitates the use of precision micromachining processes such as photolithography, etching, or laser micromachining to achieve high-precision forming of complex internal channels, ensuring the consistency of channel dimensions and surface finish, thereby guaranteeing the uniformity of fluid distribution.

[0038] In a specific embodiment, the fluid inlet and outlet layer 300, as a key channel layer responsible for liquid introduction and discharge in the heat sink, is provided with an interface connected with an external pipeline for guiding the cooling liquid to enter the heat sink interior efficiently and orderly and finally flow out, thereby forming a complete cooling loop.

[0039] In a specific embodiment, the fluid inlet and outlet layer 300 has a square planar configuration as a whole, and the length of the fluid inlet and outlet layer 300 as a whole is also , and the width of the fluid inlet and outlet layer 300 as a whole is also ; and the thickness of the fluid inlet and outlet layer 300 as a whole is . Specifically, the length of the fluid inlet and outlet layer 300 is , the width of the fluid inlet and outlet layer 300 is , and the thickness of the fluid inlet and outlet layer 300 is ; that is, the length and the width are equal, forming a square thin plate structure with a side length of , which not only facilitates the alignment and superposition with the microchannel layer 100 and the manifold distribution layer 200 which also have a square shape with a side length of , but also fits the square heating area of the high heat flux electronic device to be cooled 400, which is conducive to achieving full-area coverage and symmetrical cooling. Moreover, the thickness of 0.5 mm maximally reduces the volume and flow dead zone of the fluid inlet and outlet layer 300 itself on the premise of ensuring the structural strength, which helps to reduce the local pressure drop in the fluid inlet 310 and the plurality of fluid outlets 320 regions and improve the fluid response speed.

[0040] In an embodiment, as shown in Figure 5 , the central flow distribution region 110 is located in the central region of the microchannel layer 100 and includes at least two concentrically arranged annular turbulence structures, and the annular turbulence structure includes a plurality of turbulence columns 111 distributed in the circumferential direction.

[0041] In the above embodiment, by arranging at least two concentrically arranged annular turbulence structures, the fluid can be effectively guided to diffuse in the circumferential direction orderly and uniformly from the central region of the microchannel layer 100. In the initial stage of fluid entering, multiple path shunts are formed, which relieves the flow concentration effect in the inlet region and avoids uneven heat exchange caused by flow overload or deficiency in the downstream local flow channel; at the same time, the concentric annular arrangement enhances the radial symmetry of the flow field, which helps to maintain the hydraulic balance of the flow channel in each direction and ensures the uniform flow and efficient heat exchange in the subsequent flow channel transition region 120 and the annular flow channel region 130.

[0042] Specifically, as shown in Figure 5 , the bottom surface radius of the turbulence column 111 is The height of the turbulence column 111 is equal to the thickness of the flow channel in the central flow distribution area 110, the flow channel transition area 120 and the annular flow channel area 130 in the micro-channel layer 100. The turbulence column 111 is ensured to extend vertically from the bottom wall of the micro-channel layer 100 to the vicinity of the top wall of the micro-channel layer 100 and form a small gap with the manifold distribution layer 200 of the upper layer, so as to maximize the lateral mixing and local turbulent effect of the fluid without hindering the overall flow channel.

[0043] Specifically, the bottom surface radius of the turbulence column 111 is .

[0044] Specifically, the turbulence column 111 is in a cylindrical structure.

[0045] In one embodiment, the number of turbulence columns 111 increases successively from the inner ring to the outer ring.

[0046] In the above embodiment, since the flow field coverage gradually expands from the inner ring to the outer ring, the successively increased number of turbulence columns 111 can more evenly maintain the shunt interval and flow resistance, avoid local blockage caused by over-dense inner ring or fluid segregation caused by over-sparse outer ring, further strengthen the turbulence effect, reduce the flow field dead zone, make the fluid achieve more balanced radial distribution in the central flow distribution area 110, improve the flow consistency at the inlet of the downstream flow channel, enhance the overall heat exchange uniformity and reduce the local thermal resistance.

[0047] In one embodiment, the number of turbulence columns 111 increases successively in an arithmetic sequence.

[0048] In the above embodiment, since the circumference of each ring-shaped turbulence structure increases linearly with the radius, the number of turbulence columns 111 is increased in an arithmetic sequence, so that the distance between the turbulence columns 111 of adjacent ring-shaped turbulence structures can be kept basically consistent, thereby maintaining the porosity, flow resistance and shunt density of each ring area to be balanced. Not only can the flow blockage caused by over-dense inner ring or the fluid segregation caused by over-sparse outer ring be effectively avoided, but also the flow distribution uniformity of the central flow distribution area 110 can be improved, so as to provide stable and uniform initial flow conditions for the downstream flow channel, thereby optimizing the heat exchange efficiency of the heat sink.

[0049] Specifically, the central flow distribution area 110 is provided with turbulence columns 111; wherein, .

[0050] Specifically, the number of turbulence columns 111 in each ring is from inside to outside; wherein, .

[0051] Specifically, as shown in Figure 5 the distance from the center position of the bottom surface of each circle of turbulence column 111 to the center position is respectively .

[0052] wherein, .

[0053] In a specific embodiment, a dense cylindrical array structure can be prepared on a substrate with excellent thermal conductivity such as silicon or copper by microfabrication techniques such as photolithography and etching to form the central flow distribution area 110; which can guide the liquid to diffuse orderly and uniformly from the center of the microchannel layer 100 to the surrounding flow channels after entering, effectively avoiding the problem of local flow overload or insufficient downstream flow channels caused by uneven liquid distribution in the inlet area, thereby improving the overall flow uniformity and system operation stability.

[0054] In one embodiment, the flow channel transition area 120 includes a plurality of transition flow channels 121, which are sequentially distributed around the circumference of the central flow distribution area 110; and the transition flow channels 121 extend from the central flow distribution area 110 to the annular flow channel area 130.

[0055] In the above embodiment, by using a plurality of transition flow channels 121 arranged sequentially around the circumference of the central flow distribution area 110 and extending to the annular flow channel area 130, the fluid distributed by the central flow distribution area 110 can be uniformly guided to different radial positions of the annular flow channel area 130, realizing orderly and uniform distribution of the fluid from the central flow distribution area 110 to the peripheral annular flow channel area 130, effectively avoiding the problems of uneven flow distribution and heat accumulation caused by the fluid concentrating in a local area; the extension layout of the transition flow channels 121 from inside to outside guides the fluid to diffuse naturally along the radial direction, improving the overall area utilization and flow coverage of the microchannel layer 100, and providing stable inlet flow conditions for the subsequent annular flow channel area 130.

[0056] Specifically, as shown in Figure 6 the width of the transition flow channel 121 is: ; wherein the radius of the central flow distribution area 110 is ; the number of transition flow channels 121 of the flow channel transition area 120 is .

[0057] Specifically, ; ; the width of the transition flow channel 121 is .

[0058] In one embodiment, the transition flow channel 121 is arranged in an arc shape.

[0059] In the above embodiment, the transition flow channel 121 is arranged in an arc shape, so that the fluid flows along a spiral divergence path during the outward flow. Compared with the traditional linear flow channel, the flow path of the fluid is lengthened, and the effective contact area between the fluid and the flow channel wall 2211 is increased; at the same time, the centrifugal secondary flow effect generated by the arc-shaped transition flow channel 121 can effectively disturb the main flow boundary layer, thin the thermal boundary layer thickness, thereby improving the local convective heat transfer coefficient and accelerating the heat transfer rate from the heat dissipation component to the cooling fluid. Moreover, the spiral transition structure formed by the arc-shaped transition flow channel 121 can guide the fluid distributed by the central flow distribution area 110 to the peripheral annular flow channel 131 in a spiral manner, realizing preliminary heat exchange and uniform flow before entering the annular flow channel area 130, and improving the flow stability.

[0060] In one embodiment, the annular flow channel area 130 includes a plurality of concentrically arranged annular flow channels 131, and the diameters of the annular flow channels 131 increase successively from inside to outside.

[0061] In the above embodiment, through the plurality of concentrically arranged annular flow channels 131, the fluid can flow continuously in the circumferential direction, so that the flow path length and flow resistance characteristics of the fluid in each layer of annular flow channels 131 remain highly consistent, avoiding flow dead zones and local pressure drop concentration caused by flow channel mutations or corners; at the same time, the multi-layer concentric ring layout effectively expands the heat exchange area, ensuring that the fluid can uniformly cover most of the planar area of the microchannel layer 100, and making the heat transfer more uniform in the radial and circumferential directions, avoiding local flow unevenness and overheating phenomena caused by asymmetric flow channel layout or flow path differences, thereby realizing stable and efficient overall heat exchange performance.

[0062] In a specific embodiment, as shown in Figure 4 , the plurality of concentrically arranged annular flow channels 131 include ring annular flow channels and ring arc flow channels arranged successively from the inner ring to the outer ring; wherein ; .

[0063] Specifically, the adjacent two annular flow channels 131 are spaced apart by .

[0064] Specifically, as shown in Figure 4 , the three ring arc flow channels are arranged in a stacked annular form from the center outward. Among them, the lower edge of the innermost arc flow channel in the right upper part is at an angle of with the horizontal direction, and the upper edge is at an angle of with the vertical direction; the lower edge of the middle arc flow channel in the right upper part is at an angle of with the horizontal direction, and the upper edge is at an angle of angles; the lower side edge of the outermost circular arc flow channel in the upper right part is at an angle of 45 degrees with the horizontal direction angles; the upper side edge is at an angle of 45 degrees with the vertical direction angles. By controlling the orientation of the flow channel cross section through specific angles while maintaining concentric expansion, each layer of flow channels helps to optimize the fluid flow path, improve distribution uniformity, and enhance the compactness and coordination of the overall structure. Among them, ; ; .

[0065] In one embodiment, the annular flow channel area 130 further comprises a connecting flow channel 132, which is in communication with the flow channel transition area 120 and between two adjacent annular flow channels 131 through the connecting flow channel 132.

[0066] In the above embodiment, the connecting flow channel 132 not only communicates between two adjacent annular flow channels 131, but also connects with the flow channel transition area 120, realizing the transition of fluid from the central flow distribution area 110 to the annular flow channel area 130 through the vortex-shaped flow channel transition area 120, and dynamic flow stringing and redistribution between annular flow channels 131 of different radii, extending the effective heat exchange path and improving the flow channel space utilization; at the same time, through the coordinated guidance of the connecting flow channel 132, the fluid can more evenly fill the entire annular flow channel area 130, effectively alleviating the problem of flow congestion or uneven distribution in a single annular flow channel 131, helping to balance the pressure distribution between the annular flow channels 131, reducing flow dead zones and pressure drop concentration, thereby improving the heat dissipation efficiency while enhancing the system flow stability and reliability.

[0067] In one embodiment, the connecting flow channel 132 is in one-to-one correspondence with the transition flow channel 121.

[0068] In the above embodiment, since the connecting flow channel 132 is in one-to-one correspondence with the transition flow channel 121, each connecting flow channel 132 can obtain an independent, equivalent, and non-interference transition path, effectively avoiding the crosstalk phenomenon between flow channels, making the flow distribution more uniform and reducing pressure loss during flow distribution, improving fluid transmission efficiency; at the same time, this one-to-one correspondence simplifies the flow channel layout, enabling the fluid to be smoothly and efficiently transported to the annular flow channel 131.

[0069] In one embodiment, the connecting flow channel 132 is arranged in an arc shape.

[0070] In the above embodiment, because the connecting channel 132 is arc-shaped, the fluid flows along a vortex-like divergence path during its outward flow. Compared to the traditional straight channel, this extends the fluid flow path and increases the effective contact area between the fluid and the channel wall 2211. Simultaneously, the centrifugal secondary flow effect generated by the arc-shaped connecting channel 132 effectively disturbs the mainstream boundary layer, thins the thermal boundary layer, thereby increasing the local convective heat transfer coefficient and accelerating the rate of heat transfer from the heat dissipation components to the cooling fluid. Furthermore, the vortex-like transition structure formed by the arc-shaped transition channel 121 guides the fluid distributed from the central flow distribution area 110 to the outer annular channel 131 in a spiral manner, achieving preliminary heat exchange and homogenized flow before entering the annular channel area 130, thus improving flow stability.

[0071] Specifically, the width of the transition channel 121 is the same as that of the connecting channel 132; the transition channel 121 and the corresponding connecting channel 132 are connected to form a complete arc-shaped channel; such as Figure 6 As shown, the upper edge of the arc-shaped flow channel begins at the 0-degree position of the central circle, forming an angle with the horizontal direction. The included angle, along the radius The arc-shaped trajectory extends to the inner edge of the microchannel layer 100, causing the arc-shaped flow channel to extend outward from the central flow distribution area 110 in a vortex-like divergence pattern. The arc-shaped flow channel smoothly guides the fluid dispersed from the central flow distribution area 110 to the annular flow channel 131 in a spiral flow manner. During this process, the fluid not only obtains a more uniform velocity distribution and flow direction, but also achieves preliminary heat exchange and flow homogenization before entering the annular flow channel 131, thereby effectively improving the uniformity of fluid distribution and overall heat transfer performance within the subsequent annular flow channel 131. The length of the inner edge of the microchannel layer 100... Width of the inner edge of the microchannel layer 100 .

[0072] In a specific implementation, a dense cylindrical array structure can be fabricated on a substrate with excellent thermal conductivity, such as silicon or copper, using microfabrication techniques such as photolithography and etching, to form a central flow distribution region 110 and an annular flow channel region 130.

[0073] Preferably, the arc-shaped flow channel and the annular flow channel 131 complement each other in terms of resistance characteristics. The vortex-shaped flow channel of the arc-shaped flow channel will produce a certain acceleration or deceleration effect due to the change of the flow channel radius, which may lead to local resistance fluctuations. However, the equal-width annular flow channel 131 provides a stable resistance section, making the resistance of the fluid in the annular section relatively stable. After the two are combined, the overall resistance distribution of the flow channel is more uniform, avoiding uneven flow distribution caused by excessive local resistance, and ensuring that the fluid can flow evenly through all heat exchange areas.

[0074] Specifically, the micro-channel layer 100 realizes a composite structure of a vortex flow channel combined with a concentric circular annular flow channel 131 through the flow channel transition zone 120 and the annular flow channel zone 130: the vortex flow channel effectively destroys the thermal boundary layer and strengthens local heat exchange by lengthening the fluid flow path and enhancing disturbance; and the concentric circular annular flow channel 131 maintains the uniformity of the flow field while expanding the effective heat exchange area. The two flow channels complement each other in flow resistance, and synergistically optimize the overall fluid dynamics performance and heat exchange efficiency.

[0075] In one embodiment, the central divergent zone 210 includes a divergent port arranged in the central region of the manifold distribution layer 200 and axially aligned with the fluid inlet 310 and the central flow distribution zone 110.

[0076] In the above embodiment, since the divergent port is arranged in the central region of the manifold distribution layer 200 and axially aligned with the fluid inlet 310 and the central flow distribution zone 110, a straight-line channel for fluid transmission is formed, allowing the fluid to enter the central flow distribution zone 110 directly from the fluid inlet 310, avoiding resistance loss and vortex caused by flow path deviation or turning; at the same time, the divergent port can buffer and uniformly distribute the incoming fluid, reducing local flow velocity unevenness caused by initial fluid impact, and ensuring the uniformity of subsequent flow distribution; the overall structure improves the continuity and stability of fluid flow.

[0077] In one embodiment, the orthographic projection profile of the divergent port is circular.

[0078] In the above embodiment, since the projection profile of the divergent port is circular, it ensures that the fluid produces completely symmetrical and uniform diffusion in all directions around the cavity structure, thereby establishing uniform pressure distribution and initial flow conditions at the inlet of the manifold distribution layer 200 before the fluid impacts the micro-channel layer 100 structure, fundamentally eliminating the deflection or local vortex phenomenon that may be caused by asymmetric distribution zone shape, and ensuring that uniform fluid distribution can be achieved subsequently.

[0079] In a specific implementation, the divergent port is a circular hollow region with a radius of After the heat dissipation fluid flows in from the fluid inlet 310, it first converges to the circular hollow region, and since the lower side of the circular hollow region is directly opposite the central flow distribution zone 110 of the micro-channel layer 100, the flow path is divided after the liquid impacts the dense turbulence column 111 body structure of the lower side central flow distribution zone 110, where part of the liquid enters the central flow distribution zone 110 of the micro-channel layer 100 and diverges to the flow channel transition zone 120, and the other part is deflected about ninety degrees in the horizontal direction due to the resistance of the upper surface of the turbulence column 111, and enters the central symmetrically distributed dispersion flow channel zone 220, thereby realizing uniform and efficient flow distribution and heat exchange.

[0080] Specifically, the divergent port is a circular hollow area with a radius of The circular hollow area can be prepared on a substrate with excellent thermal conductivity such as silicon or copper by microfabrication techniques such as photolithography and etching, so that the heat dissipation fluid flowing from the fluid inlet 310 can converge in the area and be distributed to the four directions after impacting the turbulence structure of the central flow distribution area 110 of the microchannel layer 100.

[0081] In one embodiment, the dispersion flow channel area 220 includes multiple sets of sub-flow flow channels 221, which are sequentially and spaced apart around the central divergent area 210; one end of the sub-flow flow channel 221 is in communication with the central divergent area 210, and the other end extends to the peripheral area of the manifold distribution layer 200 and is in communication with the first set of fluid outlets 320.

[0082] In the above embodiment, the dispersion flow channel area 220 is arranged with multiple sets of sub-flow flow channels 221 sequentially and spaced apart around the central divergent area 210, so that the fluid from the central divergent area 210 can be uniformly and symmetrically distributed to each sub-flow flow channel 221 and further guided to the first set of fluid outlets 320 in the peripheral area of the manifold distribution layer 200. Not only does this improve the uniformity and stability of fluid distribution, reducing local pressure drop or flow deviation, but it also helps to optimize the overall flow field distribution and reduce flow resistance, thereby improving the heat transfer efficiency of the system.

[0083] In one embodiment, the multiple sets of sub-flow flow channels 221 are centrally symmetrically distributed.

[0084] In the above embodiment, the multiple sets of sub-flow flow channels 221 are centrally symmetrically distributed, which allows the fluid to be distributed from the central area to the four directions while maintaining the path length and flow resistance of each direction flow channel substantially consistent, thereby achieving uniform fluid distribution and supply and ensuring that each part of the manifold distribution layer 200 receives an equal amount of fluid, effectively avoiding the problem of uneven heat exchange caused by local flow imbalance and improving overall heat exchange efficiency and effectiveness; at the same time, the symmetrical layout is regular and uniform, which not only facilitates precision control during processing and manufacturing, but also enhances the stability of the flow channel structure, reduces energy loss during fluid flow, and further improves the thermal management performance, operating stability and working reliability of the overall system.

[0085] In one embodiment, the sub-flow flow channel 221 includes two flow channel walls 2211 symmetrically arranged; one end of the flow channel wall 2211 is connected to the central divergent area 210, and the other end extends to the peripheral area of the manifold distribution layer 200.

[0086] In the above embodiment, the flow channel 221 adopts the structure of two symmetrically arranged flow channel walls 2211, one end of the flow channel wall 2211 is connected to the central diverging area 210, and the other end extends to the periphery of the manifold distribution layer 200, which can ensure that the internal space of the flow channel is regular and symmetrical, so that the fluid is balanced in force and the path is smooth during flow, which helps to form a uniform and stable flow channel cross-section and flow channel, effectively reduces the phenomena of flow deviation, vortex or local resistance sudden change of the fluid during transmission, and improves the flow distribution efficiency. At the same time, the symmetrical flow channel wall 2211 structure can ensure that the fluid is balanced in force and the flow velocity distribution is uniform during flow distribution, thereby improving the uniformity and controllability of flow distribution. And the symmetrical structure is convenient for precision control during processing and manufacturing, and reduces production errors.

[0087] In one embodiment, the flow channel wall 2211 is arranged in an arc shape.

[0088] In the above embodiment, the flow channel wall 2211 is arranged in an arc shape, which can effectively avoid the problems of flow separation, vortex and local resistance increase caused by traditional right-angle or sharp turning structures. The arc transition makes the speed change of the fluid more gentle when flowing through the flow channel 221, and the flow path is smoother, which reduces the resistance along the way and the local pressure loss, thereby improving the overall flow efficiency; at the same time, it helps to maintain the stability and uniformity of the flow field, reduces energy loss, and further optimizes the heat exchange performance of the system.

[0089] In a specific embodiment, as shown in Figure 7 each group of flow channels 221 is composed of two circular-arc-shaped flow channel walls 2211 symmetrically arranged along the diagonal, and the whole has a petal-shaped structure. Taking the upper right flow channel 221 as an example, the starting point of the lower circular arc of the upper right flow channel 221 is the outer edge of the diverging port, the included angle between the line connecting the starting point of the lower circular arc and the center point of the diverging port and the horizontal direction is , and the end point of the lower circular arc of the upper right flow channel 221 is located at the diagonal vertex of the inner wall of the manifold distribution layer 200; wherein the radian of the lower circular arc of the upper right flow channel 221 is , and the arc radius is . The starting point of the upper circular arc of the upper right flow channel 221 is the outer edge of the diverging port, and the included angle between the line connecting the starting point of the upper circular arc and the center point of the diverging port and the vertical direction is also , and the upper circular arc of the upper right flow channel 221 also extends to the same diagonal vertex of the inner wall of the manifold distribution layer 200, has the same radian and the arc radius is . The upper and lower circular-arc-shaped flow channel walls 2211 are symmetric about the diagonal, and together form a smooth and symmetrical petal-shaped flow distribution channel.

[0090] In a specific embodiment, the included angle between the line connecting the starting point of the lower circular arc and the center point of the diverging port and the horizontal direction is ; the included angle between the line connecting the starting point of the upper side arc and the center point of the divergent port and the vertical direction is also ; the radian ; the arc radius .

[0091] Specifically, the length of the inner wall of the manifold distribution layer 200 is , and the width of the inner wall of the manifold distribution layer 200 is . Among them .

[0092] Specifically, the shunt flow channel 221 can be prepared on a substrate with excellent thermal conductivity such as silicon or copper by microfabrication techniques such as photolithography and etching.

[0093] In one embodiment, the peripheral convergence area 230 includes a plurality of convergence ports 231, and the convergence ports 231 are arranged between the two adjacent groups of shunt flow channels 221.

[0094] In the above embodiment, the convergence ports 231 are arranged between the two adjacent groups of shunt flow channels 221, which not only makes full use of the gap space between the shunt flow channels 221, realizes the alternate arrangement of the convergence ports 231 and the shunt flow channels 221, makes the overall structure layout more compact, and effectively reduces the equipment occupied volume, but also avoids the mutual interference of the shunted fluid and the converged fluid, ensures the smoothness of the shunting and converging processes respectively, realizes the convergence and export of the multi-path fluid, ensures the flow and pressure balance of each transmission path, and improves the stability and adaptability of fluid flow.

[0095] In one embodiment, the convergence port 231 is in communication with the outlet of the annular flow channel area 130, and is arranged opposite to the second group of fluid outlets 320 in the axial direction.

[0096] In the above embodiment, the convergence port 231 is in communication with the outlet of the annular flow channel area 130, and is arranged opposite to the second group of fluid outlets 320 in the axial direction, realizing a short-range and straight-through flow path of the fluid from the peripheral convergence area 230 to the final outlet. The axial alignment layout effectively reduces the flow resistance and energy loss of the fluid in the turning or transition process, and avoids the increase of pressure drop or flow turbulence caused by the detour of the path.

[0097] In a specific embodiment, the convergence port 231 is a key hub for connecting the microchannel layer 100 and the fluid inlet and outlet layer 300, and is mainly used for collecting the fluid at the end of the microchannel layer 100. A plurality of convergence ports 231 are symmetrically distributed in the upper, lower, left and right four directions on the manifold distribution layer 200, and are alternately arranged with the shunt flow channels 221, forming an orderly layout around the inner edge of the manifold distribution layer 200. Each convergence port 231 has a radius of The circular shape of the converging port 231 is tangent to the inner edge of the manifold distribution layer 200, thereby achieving efficient and uniform fluid convergence and transmission while ensuring compact structure.

[0098] Specifically, the converging port 231 can be prepared on a substrate with excellent thermal conductivity such as silicon or copper by microfabrication techniques such as photolithography and etching.

[0099] Specifically, the fluid in the microchannel layer 100 fully develops in the flow passage transition region 120 and the annular flow passage region 130, flows into the corresponding converging port 231, and is discharged through the second group of fluid outlets 320. The design of multiple converging ports 231 not only effectively shortens the flow path of the fluid from the end of the microchannel layer 100 to the fluid outlet 320, but also significantly reduces the overall flow resistance, thereby improving the flow uniformity and thermal management efficiency of the heat dissipation system.

[0100] Specifically, the manifold distribution layer 200 is composed of a central diverging region 210, a dispersed flow passage region 220, and a peripheral converging region 230, which respectively assume the functions of initial diffusion distribution, circumferential uniform distribution, and end efficient convergence, forming an orderly flow regulation from the inlet to the outlet, and further improving the uniformity of flow distribution and system stability.

[0101] In one embodiment, the fluid inlet 310 is arranged at the center of the fluid inlet and outlet layer 300, and a plurality of fluid outlets 320 are distributed along the periphery of the fluid inlet and outlet layer 300.

[0102] In the above embodiment, by arranging the fluid inlet 310 at the center and the plurality of fluid outlets 320 along the periphery, a highly symmetrical and shortest-path fluid distribution system is formed. This ensures that the fluid radiates from the center to the periphery and reaches each outlet with uniform flow rate and pressure, thereby improving the distribution efficiency and consistency, minimizing flow resistance and energy loss, and optimizing the overall performance of the system, thereby providing stable and balanced fluid conditions for the heat exchange process.

[0103] In a specific embodiment, the fluid inlet and outlet layer 300 is provided with one fluid inlet 310, each fluid inlet 310 being a circular structure with a radius of for connecting with the external liquid supply pipeline to ensure that the cooling liquid can enter the heat sink uniformly and stably; and preferably .

[0104] In a specific embodiment, the fluid inlet 310 is located at the center of the fluid inlet / outlet layer 300, directly opposite the center dispersion area 210 of the manifold distribution layer 200 below and the center flow distribution area 110 of the microchannel layer 100, forming a vertically penetrating flow channel alignment structure. This ensures that the heat dissipation fluid can be evenly spread radially after being injected from the center, so that the initial flow conditions such as pressure and flow rate at the entrances of each flow channel 221 in the manifold distribution layer 200 and the microchannel layer 100 are highly consistent, effectively improving the uniformity of the entire internal flow field of the radiator and the thermal management performance.

[0105] Specifically, the fluid inlet 310 can be prepared on a substrate with excellent thermal conductivity such as silicon or copper by microfabrication techniques such as photolithography, etching, or drilling processes.

[0106] In a specific embodiment, the fluid inlet / outlet layer 300 is provided with a fluid outlet 320, each fluid outlet 320 being a circular structure with a radius of . The fluid outlet 320 is used to efficiently and uniformly guide the cooling liquid after heat exchange in the radiator to the external circuit, thereby ensuring the flow balance and heat exchange efficiency of the heat dissipation system; preferably , .

[0107] In a specific embodiment, as shown in Figure 8 , the fluid outlet 320 is arranged in the peripheral area of the fluid inlet / outlet layer 300, in a linear array and symmetrically distributed. Taking the fluid outlet 320 at the upper left side as an example, the distance from the center of the fluid outlet 320 to the upper edge and the left edge of the layer is ; along the direction of each side of the fluid inlet / outlet layer 300, the center distance between any two adjacent fluid outlets 320 is , thereby ensuring that the outlet layout is regular and the fluid discharge is uniform, which helps to maintain the overall pressure balance and flow stability of the system. Preferably , .

[0108] Specifically, the fluid outlet 320 can be prepared on a substrate with excellent thermal conductivity such as silicon or copper by microfabrication techniques such as photolithography, etching, or drilling processes.

[0109] In a specific embodiment, the first group of fluid outlets 320 includes four fluid outlets 320 distributed along diagonal directions, respectively facing the ends of the four petal-shaped shunt flow channels 221 in the manifold distribution layer 200, for efficiently discharging the coolant collected by the shunt flow channels 221; the second group of fluid outlets 320 includes four fluid outlets 320 distributed along the four orthogonal directions of up, down, left and right, respectively corresponding to and facing the four converging ports 231 in the manifold distribution layer 200, and are specially used to collect and discharge the fluid flowing to each converging port 231 from the end of the microchannel layer 100.

[0110] In a specific embodiment, the first group of four fluid outlets 320 distributed along the diagonal directions and the second group of four fluid outlets 320 located in the up, down, left and right directions are alternately and symmetrically arranged on the fluid inlet and outlet layer 300, and their spatial arrangement is accurately corresponding to the ends of the petal-shaped shunt flow channels 221 and the four converging ports 231 in the manifold distribution layer 200. It ensures that the coolant can be uniformly and orderly discharged to the external pipeline through each fluid outlet 320 after fully flowing through the internal flow channel of the microchannel. Compared with the traditional microchannel radiator with only a single inlet and a single outlet under the same size, the multi-inlet and multi-outlet structure shortens the flow path of the fluid from the fluid inlet 310 to the fluid outlet 320, greatly reduces the flow pressure drop, and effectively enhances the overall heat dissipation performance and energy efficiency ratio while improving the uniformity of flow distribution.

[0111] In a specific embodiment, the fluid inlet and outlet layer 300 adopts a layout of a centrally arranged fluid inlet 310 and a plurality of fluid outlets 320 symmetrically distributed around the fluid inlet 310. The fluid inlet 310 faces the central area of the lower manifold distribution layer 200, ensuring that the coolant is uniformly diffused radially when initially injected; each fluid outlet 320 is accurately aligned with the ends of the petal-shaped shunt flow channels 221 and the converging ports 231 of the manifold distribution layer 200, which not only ensures that the fluid can be orderly and uniformly discharged after fully flowing through the microchannel, but also shortens the overall flow path and effectively reduces the flow pressure drop.

[0112] In a specific embodiment, the microchannel layer 100, the manifold distribution layer 200 and the fluid inlet and outlet layer 300 are sequentially stacked from bottom to top, and the microchannel layer 100, the manifold distribution layer 200 and the fluid inlet and outlet layer 300 are designed to have special structures. The microchannel layer 100 provides an efficient heat exchange surface, the manifold distribution layer 200 realizes uniform flow distribution and convergence through the petal-shaped shunt flow channels 221 and the converging ports 231, and the fluid inlet and outlet layer 300 is configured with multiple inlets and outlets to optimize the fluid inlet and outlet path. The three work together to not only improve the uniformity of fluid distribution in the flow channel, effectively reduce the overall flow pressure drop, but also greatly improve the heat exchange coefficient of the radiator, thereby achieving efficient thermal management of high heat flux electronic devices and other heat dissipation components 400.

[0113] In a specific embodiment, the length of the whole heat dissipation piece 400 is , and the width of the whole heat dissipation piece 400 is .

[0114] Specifically, the length of the heat dissipation piece 400 is , and the width of the heat dissipation piece 400 is , which is the same as the length and width of the bottom surface of the heat sink.

[0115] In a specific embodiment, the high heat flux electronic device to be cooled by the heat dissipation piece 400 includes, but is not limited to, a central processing unit, a graphics processing unit, etc.

[0116] In a specific embodiment, the prepared microchannel layer 100, manifold distribution layer 200 and fluid inlet and outlet layer 300 are stacked in order from bottom to top and assembled. During the assembly process, it is necessary to strictly ensure that the flow channel, inlet and outlet interface and functional area between the layers are accurately aligned in space to maintain the continuity and uniformity of the fluid path. The layers can be firmly connected by bonding, welding or high-performance bonding process, and at the same time, the connection interface must have good sealing performance to effectively prevent the leakage of the heat dissipation fluid during operation, thereby ensuring the reliability and long-term stability of the whole heat dissipation structure.

[0117] In a specific embodiment, the assembled manifold type microchannel heat sink is installed on the high heat flux electronic device to be cooled by the heat dissipation piece 400, ensuring that the microchannel layer 100 is in full contact with the heat generating surface of the high heat flux electronic device to be cooled by the heat dissipation piece 400, so as to realize efficient heat conduction. Then the external pipeline is connected to the fluid inlet 310 and the fluid outlet 320 of the fluid inlet and outlet layer 300 respectively, and water or other cooling medium is introduced as the heat dissipation fluid. The heat dissipation fluid flows from the fluid inlet 310 of the fluid inlet and outlet layer 300, is uniformly distributed by the manifold distribution layer 200, and then enters the microchannel layer 100. In the microchannel layer 100, the fluid flows through the flow channel transition area 120 and the annular flow channel area 130 in sequence, and exchanges heat with the high heat flux electronic device to be cooled by the heat dissipation piece 400, thereby absorbing the heat generated by the high heat flux electronic device to be cooled by the heat dissipation piece 400. The heated fluid is collected through the converging port 231 and discharged in order from the multiple outlets of the fluid inlet and outlet layer 300, returning to the external circulation system. Efficient, uniform and low resistance active cooling of the high heat flux electronic device to be cooled by the heat dissipation piece 400 is realized, and the overall thermal management performance is improved.

[0118] In a specific embodiment, the thickness of the high heat flux electronic device to be cooled by the heat dissipation piece 400 is set to .

[0119] Specifically, the present embodiment combines simulation software to apply the heat sink to the thermal management of the central processing unit to quantitatively evaluate the heat dissipation performance. As shown inFigure 2 As shown in FIG. 6, a central processing unit with the same length and width as the bottom surface of the micro-channel heat sink is placed on the bottom surface of the heat sink, and the thickness of the central processing unit is set to , and the upper surface of the central processing unit and the bottom surface of the micro-channel heat sink are set to be in ideal contact, that is, there is no contact thermal resistance; at the same time, the total power consumption of the central processing unit is set to 150 W. The simulation results are shown in FIGS. 7 and 8. Figure 9 and Figure 10 respectively show the temperature distribution cloud map of the upper surface of the central processing unit and the temperature cloud map of the upper surface of the fluid inlet and outlet layer 300 after the heat sink is applied. As shown in FIG. 7, Figure 9 It can be seen that the surface temperature of the central processing unit presents a concentric circle distribution with the center as the reference and gradually increasing towards the periphery: the temperature in the central region is relatively low, about 40.59°C-45.71°C; as the radial distance increases, the temperature rises steadily, and the edge region reaches the highest temperature, about 54.26°C-55.97°C. The overall temperature gradient is gentle, and there is no obvious local hot spot, indicating that the heat sink can achieve uniform cooling of the high heat flux density area. It shows that the unique flow channel design of the heat sink in the present application, such as the petal-shaped distribution flow channel 221, the vortex flow channel and the annular flow channel 131, synergistically promotes the uniform distribution and efficient heat exchange of the cooling fluid, thereby improving the heat management effect.

[0120] Specifically, Figure 11 and Figure 12 respectively show the velocity distribution cloud map of the micro-channel layer 100 and the manifold distribution layer 200 after the heat sink of the present embodiment is applied. Figure 11 It is shown that the velocity distribution of the micro-channel layer 100 presents a trend of gradually decreasing towards the periphery with the central region as the core: the flow velocity in the central region is relatively high, between 0.327 m / s and 0.4200 m / s; as it expands outward, the flow velocity gradually decreases to the interval of 0 to 0.093 m / s. This velocity distribution helps to enhance the fluid disturbance in the central region and destroy the boundary layer effect, thereby improving the convective heat transfer coefficient and strengthening the heat exchange efficiency in this region.

[0121] Specifically, Figure 12 The velocity distribution characteristics of the manifold distribution layer 200 are shown, which also take the central region as the core and gradually decrease towards the periphery of the petal-shaped distribution flow channel 221 and the circular converging port 231. The high flow velocity in the central region helps to enhance the fluid disturbance and destroy the fluid boundary layer, thereby improving the convective heat transfer coefficient and strengthening the heat exchange effect in the central region, and through the optimized design, it ensures that the fluid can be uniformly distributed to each petal-shaped distribution flow channel 221. The relatively low but uniformly distributed flow velocity on the periphery ensures the continuous flow of the cooling medium in each flow channel in the entire micro-channel layer 100, avoiding the phenomenon of insufficient heat exchange due to too low flow velocity, and realizing the overall uniform heat exchange effect.

[0122] Specifically, the velocity distribution of the fluid in the microchannel layer 100 is highly matched with the flow channel design, which not only guarantees the strong heat exchange capacity of the central region, but also takes into account the uniform heat exchange performance of the peripheral region, thereby ensuring the efficient and stable operation of the entire heat dissipation system. The overall thermal management performance of the heat sink is effectively improved, and the occurrence of local overheating problems is prevented. The combination analysis of the velocity distribution cloud map and the central processor temperature cloud map fully proves that the fluid velocity distribution in the microchannel layer 100 effectively supports excellent heat dissipation performance. The higher flow rate in the central region enhances fluid disturbance and improves convective heat transfer efficiency, while the uniformly distributed lower flow rate around ensures that there is enough fluid flow in each flow channel in the entire microchannel layer 100, avoiding the problem of insufficient local heat exchange. At the same time, these results also verify the effectiveness of the manifold distribution layer 200 in terms of uniform fluid distribution, which enables the cooling medium to be efficiently and evenly distributed to each sub-flow channel, further strengthening the overall heat dissipation effect. In summary, this structure not only optimizes the heat exchange efficiency of the single-point region, but also guarantees the uniform heat dissipation performance of the entire heat sink, thereby ensuring the improvement of the overall performance of the heat dissipation system.

[0123] Specifically, the manifold-type microchannel heat sink microchannel layer 100, manifold distribution layer 200 and fluid inlet and outlet layer 300 of the present application are coordinated, first, the microchannel layer 100 is arranged with a dense cylindrical disturbance array, the manifold distribution layer 200 adopts a center-symmetric petal-shaped sub-flow channel 221, and the fluid inlet and outlet layer 300 is configured with a central fluid inlet 310 and a plurality of fluid outlets 320 symmetrically distributed around, the three are highly adapted in geometry and function, which together ensures that the cooling fluid is highly uniformly distributed inside the entire heat sink, effectively avoiding the problem of local overheating of the high heat flux electronic device to be cooled 400 caused by local flow imbalance. Second, the vortex-shaped flow channel and the concentric circular ring-shaped flow channel 131 in the microchannel layer 100 are complementary in flow resistance, the arc-shaped flow channel of the manifold distribution layer 200 has low flow resistance characteristics, combined with the multi-inlet and outlet layout of the fluid inlet and outlet layer 300, which shortens the path of the fluid from the inlet to the outlet, the overall flow pressure drop is greatly reduced, thereby reducing the pump power consumption and improving the energy utilization efficiency. In addition, the vortex-shaped flow channel effectively breaks the thermal boundary layer by lengthening the fluid path and strengthening the disturbance; the concentric circular ring-shaped flow channel 131 expands the heat exchange area while maintaining flow uniformity. The organic combination of the above flow channel structure and fluid distribution strategy not only reduces the pressure drop, but also significantly improves the effective heat exchange coefficient of the heat sink, which can efficiently dissipate the heat generated by the high heat flux electronic device to be cooled 400, and ensure its stable operation within a safe temperature range.

[0124] According to an embodiment of the present application, in another aspect, a heat dissipation system is also provided, which comprises the above-mentioned heat sink.

[0125] The above describes in detail the heat spreader and the heat dissipation system provided by the present application. The principles and implementation manners of the present application are described by using specific examples, and the above description of the examples is only used to help understand the method of the present application and the core idea thereof. It should be noted that, for those skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A heat sink, characterized by, The micro-channel layer (100), the manifold distribution layer (200) and the fluid inlet and outlet layer (300) are sequentially stacked from bottom to top. The fluid inlet and outlet layer (300) is provided with a fluid inlet (310) and a plurality of fluid outlets (320), and the plurality of fluid outlets (320) include a first group of fluid outlets (320) and a second group of fluid outlets (320). The micro-channel layer (100) includes a central flow distribution area (110), a flow passage transition area (120) and an annular flow passage area (130) which are sequentially communicated; the flow passage transition area (120) is connected between the central flow distribution area (110) and the annular flow passage area (130). The manifold distribution layer (200) is located between the micro-channel layer (100) and the fluid inlet and outlet layer (300) and includes a central diverging area (210), a dispersed flow passage area (220) and a peripheral converging area (230); the central diverging area (210) is communicated with the fluid inlet (310) and the central flow distribution area (110); the dispersed flow passage area (220) extends outward from the central diverging area (210), and the terminal end is communicated with the first group of fluid outlets (320); the peripheral converging area (230) is communicated with the outlet of the annular flow passage area (130) and the second group of fluid outlets (320). The dispersed flow passage area (220) includes a plurality of sub-flow passages (221), one end of the sub-flow passage (221) is communicated with the central diverging area (210), and the other end extends to the peripheral region of the manifold distribution layer (200) and is communicated with the first group of fluid outlets (320). The peripheral converging area (230) includes a plurality of converging openings (231), and the converging opening (231) is arranged between two adjacent groups of sub-flow passages (221). The converging opening (231) is communicated with the outlet of the annular flow passage area (130) and is arranged opposite to the second group of fluid outlets (320) in the axial direction. The central diverging area (210) in the manifold distribution layer (200) synchronously distributes the inlet fluid to the micro-channel layer (100) and the circumferential dispersed flow passage area (220), part of the fluid is guided out by the peripheral converging area (230) after being fully heat-exchanged in the micro-channel layer (100), and the other part of the fluid is directly returned through the low-resistance path formed by the dispersed flow passage area (220) and the fluid outlet (320).

2. The heat spreader of claim 1, wherein, The central flow distribution area (110) is located in the central region of the micro-channel layer (100) and includes at least two annular turbulence structures arranged concentrically, and the annular turbulence structure includes a plurality of turbulence columns (111) distributed in the circumferential direction.

3. The heat sink of claim 2, wherein, From the inner ring to the outer ring, the number of turbulence columns (111) increases sequentially.

4. The heat sink of claim 3, wherein, The number of turbulence columns (111) increases sequentially in an arithmetic sequence.

5. The heat sink of any one of claims 1 to 4, wherein, The flow channel transition region (120) comprises a plurality of transition flow channels (121), which are sequentially distributed around the circumference of the central flow distribution region (110); and the transition flow channels (121) extend from the central flow distribution region (110) to the annular flow channel region (130).

6. The heat sink of claim 5, wherein, The transition flow channels (121) are arranged in an arc shape.

7. The heat sink of claim 5, wherein, The annular flow channel region (130) comprises a plurality of annular flow channels (131) arranged concentrically, and the diameters of the annular flow channels (131) sequentially increase from inside to outside.

8. The heat sink of claim 7, wherein, The annular flow channel region (130) further comprises a connecting flow channel (132), which communicates with the flow channel transition region (120), and two adjacent annular flow channels (131) communicate through the connecting flow channel (132).

9. The heat sink of claim 8, wherein, The connecting flow channel (132) corresponds to the transition flow channel (121) one by one.

10. The heat spreader of claim 8, wherein, The connecting flow channel (132) is arranged in an arc shape.

11. The heat spreader of any one of claims 1-4 or 6-10, wherein, The central divergence region (210) comprises a divergence port, which is arranged in the central region of the manifold distribution layer (200) and is aligned with the fluid inlet (310) and the central flow distribution region (110) in the axial direction.

12. The heat spreader of claim 11, wherein, The orthographic projection profile of the divergence port is circular.

13. The heat spreader of any one of claims 1-4 or 6-10 or 12, wherein, A plurality of groups of the shunt flow channels (221) are sequentially and spacedly arranged around the central divergence region (210).

14. The heat spreader of claim 13, wherein, A plurality of groups of the shunt flow channels (221) are symmetrically distributed.

15. The heat spreader of claim 13, wherein, The shunt flow channel (221) comprises two flow channel walls (2211) symmetrically arranged; one end of the flow channel wall (2211) is connected with the central divergence region (210), and the other end extends to the peripheral region of the manifold distribution layer (200).

16. The heat spreader of claim 15, wherein, The flow channel wall (2211) is arranged in an arc shape.

17. The heat spreader of any one of claims 1-4 or 6-10 or 12 or 14-16, wherein, The fluid inlet (310) is arranged in the central region of the fluid inlet and outlet layer (300), and a plurality of fluid outlets (320) are distributed along the periphery of the fluid inlet and outlet layer (300).

18. A heat dissipation system, characterized by, The heat sink comprises any one of claims 1-17. The heat sink comprises any one of claims 1-17.

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