PCB board separating machine micro dust cleaning device

Abstract

The present application relates to the technical field of PCB manufacturing, and particularly relates to a micro-dust cleaning device for a PCB dividing machine, which comprises a rack, a conveying unit, a carrying mechanism and a dust removal mechanism installed on the rack, a casing installed outside the rack and surrounding the conveying unit, the carrying mechanism and the dust removal mechanism, the conveying unit comprising a feeding area arranged on one side of the rack, a discharging area arranged on the other side of the rack and a turnover area between the feeding area and the discharging area; the turnover area comprising a sliding module installed on the rack and a dust removal jig installed on the output end of the sliding module, the sliding module being used to drive the dust removal jig and the PCB board thereon to enter and exit the dust removal mechanism; and the dust removal mechanism being used to output ion cyclone; the dust removal mechanism generates high-speed ion cyclone to lift up and quickly suck away the dust, so that the dust removal of the PCB board is realized without dead angle.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and in particular to a micro-dust cleaning device for PCB depaneling machines. Background Technology

[0002] In existing SMT factories, after PCB depaneling machines complete the PCB cutting process, the dust generated during cutting is difficult to completely absorb by the dust collection mechanism, resulting in residual dust adhering to the PCB surface or component gaps. This problem is particularly pronounced in precision circuit boards such as high-density multilayer boards and BGA package boards. Residual dust may cause the following hidden dangers: 1) Differences in the conductivity of dust particles may lead to short circuits or leakage current; 2) Dust may clog solder joints or solder resist layers, affecting the accuracy of subsequent reflow soldering or AOI inspection; 3) Visible dust residue reduces product yield, especially in the consumer electronics field (such as mobile phone motherboards), directly affecting customer acceptance.

[0003] Existing depaneling machines often rely on a single vacuum cleaner or electrostatic adsorption device for dust collection, which has problems such as insufficient suction, blind spots, and secondary dust deposition. Using brushes or air blowers can easily damage the PCB surface or components, and they are inefficient at removing small particles, failing to remove 100% of the dust, resulting in residual dust adhering to any part of the PCB. This is a common pain point for depaneling machines. Summary of the Invention

[0004] To overcome the problem that existing PCB depaneling machines cannot remove 100% of the dust, resulting in residual dust adhering to any part of the PCB board.

[0005] The technical solution of this invention is as follows: A micro-dust cleaning device for a PCB depaneling machine, comprising a frame, a conveying unit, a handling mechanism, and a dust removal mechanism mounted on the frame. A housing surrounds the conveying unit, the handling mechanism, and the dust removal mechanism. The conveying unit includes a loading area on one side of the frame, a unloading area on the other side of the frame, and a transfer area between the loading and unloading areas. The PCB depaneling machine's feeder is used to convey PCB boards to the loading area, and the handling mechanism is used to move the PCB boards from the loading area to the transfer area. The PCB board is moved from the turnover area to the unloading area. The turnover area includes a sliding module mounted on the frame and a dust removal fixture mounted on the output end of the sliding module. The dust removal fixture has a cutout groove adapted to the shape of the PCB board. Several positioning parts are installed around the edge of the cutout groove. The positioning parts fix the PCB board on the dust removal fixture through point contact. The sliding module is used to drive the dust removal fixture and the PCB board on it to enter and exit the dust removal mechanism. The dust removal mechanism is used to output ion cyclones, which act on the PCB board.

[0006] Preferably, the dust removal fixture includes a slide block installed on the output end of the sliding module, a lower support plate installed on the slide block, a slide rail installed on one side of the lower support plate, and an upper cover plate slidably connected to the slide rail. Both the lower support plate and the upper cover plate are provided with hollow slots. A moving machine is installed on the slide rail. The upper cover plate is fixedly connected to the output end of the moving machine. The moving machine is used to drive the upper cover plate to move between one side and above the lower support plate. When the upper cover plate moves above the lower support plate, the two hollow slots are in an up-down relative state.

[0007] Preferably, the positioning component includes several lower ejector pins fixedly connected along the edge of the hollowed-out groove on the lower support plate and several retractable upper ejector pins installed along the edge of the hollowed-out groove on the upper cover plate. When the upper cover plate moves above the lower support plate, the retractable ends of the upper ejector pins make point contact with the upper surface of the PCB board. A limiter is installed at one end of the slide rail. Both the limiter and the upper cover plate are equipped with contact switches. When the upper cover plate moves above the lower support plate, the contact switches are energized and send a signal to the control unit of the dust removal mechanism.

[0008] Preferably, the conveying mechanism includes an X-axis conveying module mounted on the frame, a Z-axis lifting module mounted on the output end of the X-axis conveying module, and a suction unit mounted on the output end of the Z-axis lifting module. The suction unit includes a front suction cup fixing area and a rear suction cup fixing area on the same horizontal axis. The X-axis conveying module is used to drive the front suction cup fixing area to move between the loading area and the turnover area, and to drive the rear suction cup fixing area to move between the turnover area and the unloading area. The Z-axis lifting module is used to drive the front suction cup fixing area and the rear suction cup fixing area to move closer to or further away from the conveying unit in the vertical direction. The front suction cup fixing area is used to pick up the PCB board from the loading area and place it on the dust removal fixture, and the rear suction cup fixing area is used to pick up the PCB board from the dust removal fixture and place it on the unloading area.

[0009] Preferably, the dust removal mechanism includes an upper tornado mechanism and a lower tornado mechanism arranged symmetrically, as well as an ion fan. The upper tornado mechanism is equipped with an upper dust suction pipe, and the lower tornado mechanism is equipped with a lower dust suction pipe. The sliding module is used to drive the dust removal fixture and the PCB board on it to move back and forth between the upper and lower tornado mechanisms. Both the upper and lower tornado mechanisms are ion fans, and the ion fans are equipped with vortex airflow nozzles.

[0010] Most dust removal devices require the use of a mandrel or fixing fixture, occupying a large space and unable to meet the dust removal needs of irregularly shaped plates or flexible substrates. Therefore, the present invention preferably adopts the following solution.

[0011] Preferably, the upper ejector pin includes several pin sleeves fixedly connected to the edge of the hollowed-out groove on the upper cover plate, a pin rod movably connected in the pin sleeves, and a spring with one end connected to the pin sleeve. The other end of the spring is connected to the pin rod, which is cylindrical. The lower end of the pin rod is provided with a bevel, and the lowest end of the bevel can make point contact with the upper surface of the PCB board. The pin rod and the pin sleeve are connected by a spline. When the upper cover plate moves, the bevel always faces the PCB board on the lower ejector pin.

[0012] Preferably, the upper ejector pin includes several needle sleeves two fixedly connected to the edge of the hollowed-out groove on the upper cover plate, needle rods two movably connected to the needle sleeves two, a plug fixedly connected to the upper end of the needle rods two, and a spring two installed in the needle sleeves two. The needle rods two are cylindrical structures, and the lower end of the needle rods two can form point contact with the upper surface of the PCB board. The needle sleeves two are connected to an air pump through a hose. The air pump controls the flow of gas into or out of the needle sleeves two through the hose. When gas flows into the needle sleeves two, the air pressure drives the needle rods two closer to the PCB board. When gas flows out of the needle sleeves two, the spring two drives the needle rods two away from the PCB board.

[0013] Preferably, the upper ejector pin includes several needle sleeves three fixedly connected to the edge of the hollowed-out groove on the upper cover plate, needle rods three movably connected in the needle sleeves three, an airbag column and a spring three installed in the needle sleeves three. The needle rods three are cylindrical structures, and the lower end of the needle rods three can form point contact with the upper surface of the PCB board. The airbag column is connected to an air pump through a hose. The air pump controls the flow of gas into or out of the airbag column through the hose. When gas flows into the airbag column, the airbag column expands and drives the needle rods three closer to the PCB board. When gas flows out of the airbag column, the airbag column contracts, and the spring three drives the needle rods three away from the PCB board.

[0014] Preferably, the upper ejector pin includes several needle sleeves four fixedly connected to the edge of the hollowed-out groove on the upper cover plate, needle bars four movably connected to the needle sleeves four, and springs four installed inside the needle sleeves four. The upper end of the needle bars four is provided with a groove. The upper cover plate has a double-layer structure with a cavity between the layers. An airbag bed is installed in the cavity. The airbag bed is connected to an air pump through a hose. The air pump controls the flow of gas into or out of the airbag bed through the hose. The airbag bed includes an upper bed layer and a lower bed layer. When gas flows into the airbag bed, the lower bed layer expands and forms a bulge in the needle sleeves four. The bulge is used to drive the needle bars four closer to the PCB board. When gas flows out of the airbag bed, the lower bed layer contracts, and the springs four drive the needle bars four away from the PCB board.

[0015] Preferably, the upper bed layer is a low-deformation zone, and the lower bed layer is a high-deformation zone. The upper bed layer is made of thermoplastic polyurethane material (elongation: <150%, permanent deformation rate <3%, tear strength >50KN / m), and the lower bed layer is made of liquid silicone material (elongation: >500%, permanent deformation rate <5%, airtightness 0.01ml / min). 2The lower bed layer has a downward protruding structure at the position corresponding to the needle sleeve four.

[0016] Preferably, the needle sleeve four includes a conical part communicating with the inner cavity of the upper cover plate and a cylindrical part fixedly connected to the lower end of the conical part (the design of the conical part allows the bulge to have a larger expansion space, making it easier to enter the needle sleeve four). The connection point between the conical part and the upper cover plate is an arc-shaped connection (the arc design here makes it easier for the surrounding lower bed layers to slide into the conical part after inflation and expansion, and it is less prone to scratches and damage compared to a right-angle structure). The needle bar four is movably connected inside the cylindrical part. Each cylindrical part is provided with a through groove, and a connecting frame passing through the through groove is fixedly connected between adjacent needle bars four. An early warning device is installed on the frame, and a tension sensor is installed on the upper cover plate. A bracket is installed on the sensing end of the tension sensor, and the bracket is connected to the connecting frame. When the needle bar four moves, the tension sensor is used to detect the tension value at the sensing end and send a signal to the control unit of the early warning device.

[0017] Preferably, the connecting frame has a hollow structure, and the needle bar has a vertical flow channel. The flow channel is connected to the hollow structure of the connecting frame, and the hollow structure of the connecting frame is connected to the air outlet of the micro fan through a flexible hose.

[0018] The beneficial effects of this invention are:

[0019] 1. The dust removal mechanism adopts two tornado mechanisms, one above and one below, which release ion wind and generate high-speed cyclones to lift up and quickly suck away the dust. The two tornado mechanisms circulate back and forth to suck up the dust, achieving dust removal of the PCB board without dead corners.

[0020] 2. It has strong versatility and can easily remove dust from most PCB boards and high-end components. Through shuttle tracks and automated dust removal fixtures, it can achieve unmanned production operations.

[0021] 3. The bottom ejector pin + top ejector pin point contact design avoids scratches on the board surface caused by mechanical clamping, and at the same time, it can be adjusted to adapt to PCB boards of different thicknesses.

[0022] 4. The horizontal sliding closed dust collection fixture replaces the traditional flip-type structure, saving more than 30% of the equipment volume and making it easy to integrate into existing production lines;

[0023] 5. The airbag bed material (thermoplastic polyurethane + liquid silicone) combines fatigue resistance with low cost, greatly extending the maintenance cycle. Attached Figure Description

[0024] Figure 1 The diagram shown is a schematic representation of the internal structure of the micro-dust cleaning device for a PCB depaneling machine according to the present invention.

[0025] Figure 2 This is another schematic diagram of the internal structure of the micro-dust cleaning device for PCB depaneling machine of the present invention;

[0026] Figure 3 The diagram shown is a schematic representation of the external structure of the micro-dust cleaning device for a PCB depaneling machine according to the present invention.

[0027] Figure 4 The diagram shown is a schematic representation of the conveying unit structure of the micro-dust cleaning device for PCB depaneling machine according to the present invention.

[0028] Figure 5 The diagram shown is a schematic representation of the structure of the turnover area of ​​the micro-dust cleaning device for PCB depaneling machine according to the present invention.

[0029] Figure 6 The diagram shown is a schematic representation of the conveying mechanism of the micro-dust cleaning device for PCB depaneling machine of the present invention.

[0030] Figure 7 The diagram shown is a schematic representation of the dust removal mechanism of the micro-dust cleaning device for PCB depaneling machine of the present invention.

[0031] Figure 8 The diagram shown is a side view of the turnover area of ​​the micro-dust cleaning device for PCB depaneling machine according to the present invention.

[0032] Figure 9 The diagram shown is a schematic representation of the structure of the ejector pin in a micro-dust cleaning device for a PCB depaneling machine according to the present invention.

[0033] Figure 10 The diagram shown is a schematic representation of the structure of the ejector pin in a micro-dust cleaning device for a PCB depaneling machine according to the present invention.

[0034] Figure 11 The diagram shown is a schematic representation of the structure of the ejector pin in Embodiment 3 of the micro-dust cleaning device for PCB depaneling machine of the present invention;

[0035] Figure 12 The diagram shown is a schematic representation of the airbag bed structure of the micro-dust cleaning device for PCB depaneling machine of the present invention.

[0036] Figure 13 The diagram shown is a schematic representation of the structure of the ejector pin in Embodiment 4 of the micro-dust cleaning device for PCB depaneling machine of the present invention.

[0037] Figure 14 The diagram shown is a schematic representation of the fifth embodiment of the micro-dust cleaning device for PCB depaneling machines of the present invention.

[0038] Figure 15 The invention showcases a micro-dust cleaning device for a PCB depaneling machine. Figure 12 Enlarged structural diagram of point A in the middle.

[0039] Explanation of reference numerals in the attached diagram: 1. Frame; 2. Loading area; 3. Turnover area; 4. Unloading area; 5. Handling mechanism; 6. Dust removal mechanism; 7. Housing; 8. Airbag bed; 301. Slide; 302. Lower support plate; 303. Hollowed-out groove; 304. Slide rail; 305. Upper cover plate; 306. Lower ejector pin; 307. Upper ejector pin; 308. Limit switch; 309. Contact switch; 501. X-axis handling module; 502. Z-axis lifting module; 503. Front suction cup fixing area; 504. Rear suction cup fixing area; 601. Upper tornado mechanism; 602. Upper dust suction pipe; 603. Lower tornado mechanism; 604. Lower dust suction pipe; 605. Ionizing air bar; 311. Needle sleeve one; 312. Needle bar one; 313. Spring one; 314. Spline; 315. Sloping foot; 321. Needle sleeve two; 322. Needle bar two; 323. Plug; 324. Spring two; 331. Needle sleeve three; 332. Needle bar three; 333. Spring three; 334. Airbag column; 341. Conical part; 342. Cylindrical part; 343. Arc-shaped connecting part; 344. Needle bar four; 345. Spring four; 346. Groove; 347. Connecting frame; 351. Flow channel; 801. Upper bed layer; 802. Lower bed layer; 803. Bulging part; 901. Tension sensor; 902. Hanger. Detailed Implementation

[0040] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0041] Please see Figures 1-7This invention provides an embodiment of a micro-dust cleaning device for a PCB depaneling machine, comprising a frame 1, a conveying unit, a handling mechanism 5, and a dust removal mechanism 6 mounted on the frame 1. A housing 7 surrounds the conveying unit, the handling mechanism 5, and the dust removal mechanism 6. The conveying unit includes a loading area 2 on one side of the frame 1, a unloading area 4 on the other side of the frame 1, and a turnover area 3 between the loading area 2 and the unloading area 4. The PCB depaneling machine's feeder is used to convey PCB boards to the loading area 2, and the handling mechanism 5 is used to move the PCB boards from the loading area 2. The PCB board on the PCB board is moved to the unloading area 4. The PCB board on the PCB board is moved to the turnover area 3. The turnover area 3 includes a sliding module installed on the frame 1 and a dust removal fixture installed on the output end of the sliding module. The dust removal fixture has a hollow groove 303 that matches the shape of the PCB board. Several positioning parts are installed around the edge of the hollow groove 303. The positioning parts fix the PCB board on the dust removal fixture through point contact. The sliding module is used to drive the dust removal fixture and the PCB board on it to enter and exit the dust removal mechanism 6. The dust removal mechanism 6 is used to output ion cyclones, which act on the PCB board. Both the loading area 2 and the unloading area 4 adopt the structure of a track conveyor, on which a platform is set. Driven by a linear motor or other power device, the PCB board on the platform is transported to the appropriate position (the loading area 2 transports the PCB board to the working area of ​​the conveying mechanism 5, and the unloading area 4 transports the PCB board out of the working area of ​​the conveying mechanism 5). The sliding module controls the moving direction and distance of the dust removal fixture. The dust removal mechanism 6 is set on the moving path of the dust removal fixture. In actual application, the sliding module uses a reciprocating cycle to control the dust removal fixture to enter and exit the dust removal mechanism 6 multiple times. The hollow groove 303 on the dust removal fixture exposes the upper and lower surfaces of the PCB board to the ion cyclone area of ​​the dust removal mechanism 6. With the point contact between the positioning component and the PCB board, the upper and lower surfaces of the PCB board are almost unobstructed, and the ion cyclone dust removal is more comprehensive.

[0042] Please see Figures 1-2 , Figures 4-5 and Figure 8In this embodiment, the dust removal fixture includes a slide block 301 mounted on the output end of the sliding module, a lower support plate 302 mounted on the slide block 301, a slide rail 304 mounted on one side of the lower support plate 302, and an upper cover plate 305 slidably connected to the slide rail 304. Both the lower support plate 302 and the upper cover plate 305 are provided with hollow slots 303. A moving machine is mounted on the slide rail 304. The upper cover plate 305 is fixedly connected to the output end of the moving machine. The moving machine is used to drive the upper cover plate 305 to move between one side and above the lower support plate 302. When the upper cover plate 305 moves above the lower support plate 302, the two hollow slots 303 are in a vertically opposite state. The positioning components include several lower ejector pins 306 fixedly connected along the edge of the cutout groove 303 on the lower support plate 302 and several retractable upper ejector pins 307 installed along the edge of the cutout groove 303 on the upper cover plate 305. When the upper cover plate 305 moves above the lower support plate 302, the retractable end of the upper ejector pin 307 makes point contact with the upper surface of the PCB board. A limiter 308 is installed at one end of the slide rail 304. Both the limiter 308 and the upper cover plate 305 are equipped with contact switches 309. When the upper cover plate 305 moves above the lower support plate 302, the contact switch 309 is energized and sends a signal to the control unit of the dust removal mechanism 6. The moving mechanism can use a linear motor to drive the upper cover plate 305 to move above the lower support plate 302. (This invention uses a horizontal sliding closing dust removal fixture, that is, the upper cover plate 305 slides relative to the lower support plate 302, forming a PCB board loading space between the two plates. The PCB board is pressed and positioned by the lower ejector pin 306 and the upper ejector pin 307. Some current dust removal devices use a flip-type positioning, which requires a large space for the flipping action, making the entire device very large and greatly increasing the manufacturing cost. The horizontal sliding positioning PCB board method used in this invention saves more space.) The moment the upper cover plate 305 slides into place (fully aligned with the lower support plate 302), the contact switch 309 on it and the contact switch 309 on the limiter 308 close and are energized. In this way, a signal is fed back to the control unit of the dust removal mechanism 6 to start or stop the dust removal mechanism 6.

[0043] Please see Figures 1-2 and Figures 4-6In this embodiment, the conveying mechanism 5 includes an X-axis conveying module 501 mounted on the frame 1, a Z-axis lifting module 502 mounted on the output end of the X-axis conveying module 501, and a suction unit mounted on the output end of the Z-axis lifting module 502. The suction unit includes a front suction cup fixing area 503 and a rear suction cup fixing area 504 on the same horizontal axis. The X-axis conveying module 501 is used to drive the front suction cup fixing area 503 to move between the loading area 2 and the turnover area 3, and to drive the rear suction cup fixing area 504 to move between the turnover area 3 and the unloading area 4. The Z-axis lifting module 502 is used to drive the front suction cup fixing area 503 and the rear suction cup fixing area 504 to move closer to or further away from the conveying unit in the vertical direction. The front suction cup fixing area 503 is used to pick up the PCB board from the loading area 2 and place it on the dust removal fixture, and the rear suction cup fixing area 504 is used to pick up the PCB board from the dust removal fixture and place it on the unloading area 4. The conveying mechanism 5 adopts a cross-shaped moving track composed of a conventional X-axis conveying module 501 and Z-axis lifting module 502. Specifically, it can be driven by a linear motor or cylinder to control the front suction cup fixing area 503 and the rear suction cup fixing area 504 to reach the conveying unit. The horizontal distance between the front suction cup fixing area 503 and the rear suction cup fixing area 504, the horizontal distance between the loading area 2 and the dust removal fixture, and the horizontal distance between the dust removal fixture and the unloading area 4 are all the same. That is to say, when the front suction cup fixing area 503 and the rear suction cup fixing area 504 move vertically at the same time, they can pick up and carry a PCB board from the loading area 2 and the dust removal fixture respectively, place the PCB board from the loading area 2 on the vacated dust removal fixture, and place the PCB board from the dust removal fixture on the unloading area 4.

[0044] Please see Figures 1-2 , Figures 4-5 and Figure 7 In this embodiment, the dust removal mechanism 6 includes an upper tornado mechanism 601 and a lower tornado mechanism 603 symmetrically arranged, as well as an ion fan 605. An upper dust suction pipe 602 is installed on the upper tornado mechanism 601, and a lower dust suction pipe 604 is installed on the lower tornado mechanism 603. The sliding module is used to drive the dust removal fixture and the PCB board on it to move back and forth between the upper tornado mechanism 601 and the lower tornado mechanism 603. Both the upper tornado mechanism 601 and the lower tornado mechanism 603 are ion fans, and vortex airflow nozzles are installed on the ion fans. The ion bar 605 generates corona discharge at the electrode tip through a high-voltage DC power supply (usually above 10kV), which ionizes the air to generate positive and negative ions. The ion fan generates a cyclone through the vortex airflow nozzle, which forms an ion cyclone after passing through the ion bar 605. This neutralizes the static charge on the PCB board surface, causing the dust to lose its static adhesion. The ion cyclone then draws the dust into the suction port and discharges it through the upper suction pipe 602 and the lower suction pipe 604.

[0045] Example 1 based on the upper ejector pin 307: Please refer to Figure 5 , Figures 8-9 The upper ejector pin 307 includes several pin sleeves 311 fixedly connected to the edge of the hollow groove 303 on the upper cover plate 305, a pin bar 312 movably connected in the pin sleeve 311, and a spring 313 with one end connected in the pin sleeve 311. The other end of the spring 313 is connected to the pin bar 312, which is a cylindrical structure. The lower end of the pin bar 312 is provided with a bevel foot 315. The lowest end of the bevel foot 315 can form a point contact with the upper surface of the PCB board. The pin bar 312 and the pin sleeve 311 are connected by a spline 314. When the upper cover plate 305 moves, the bevel foot 315 always faces the PCB board on the lower ejector pin 306. Because this invention employs a sliding opening and closing design for the upper cover plate 305 and the lower support plate 302, a pin bar 312 with a beveled foot 315 is specifically designed. When the upper cover plate 305 moves towards the lower support plate 302, the beveled foot 315 first contacts the edge of the PCB board (it is worth noting that the PCB board has holes, and the end of the lower ejector pin 306 is located within the holes, which will horizontally limit the PCB board and prevent it from moving due to contact with the beveled foot 315. If there is no socket structure between the PCB board and the lower ejector pin 306, then this embodiment is not feasible, and embodiments two to five below need to be used instead). Under the pressure, the beveled foot 315 can... As the PCB board slides upwards, the pin 312 overcomes the elastic force of the spring 313 and moves upwards until the lowest point of the bevel foot 315 makes point contact with the upper surface of the PCB board. (It is worth noting that in Embodiment 1, it is essential to ensure that the bevel foot 315 does not change its horizontal angle and always faces the PCB board. To achieve this effect in this embodiment, the pin sleeve 311 and the pin 312 are connected by a spline 314 to form a moving guide.) As the upper cover plate 305 continues to move, all the pins 312 retract sequentially onto the upper surface of the PCB board in the manner described above, generating a downward squeezing and locking force on the PCB board with the help of the elastic force of the spring 313. However, the elastic locking method used in Embodiment 1 may fail due to the fatigue of the spring 313, and there is significant friction between the bevel foot 315 and the PCB board surface, which can easily damage the PCB board surface.

[0046] Example 2 based on the upper ejector pin 307: Please refer to Figure 5 , Figure 8 and Figure 10The upper ejector pin 307 includes several needle sleeves 321 fixedly connected to the edge of the hollow groove 303 on the upper cover plate 305, a needle rod 322 movably connected in the needle sleeves 321, a plug 323 fixedly connected to the upper end of the needle rod 322, and a spring 324 installed in the needle sleeves 321. The needle rod 322 has a cylindrical structure, and the lower end of the needle rod 322 can form a point contact with the upper surface of the PCB board. The needle sleeves 321 are connected to an air pump through a hose. The air pump controls the flow of gas into or out of the needle sleeves 321 through the hose. When gas flows into the needle sleeves 321, the air pressure drives the needle rod 322 to approach the PCB board. When gas flows out of the needle sleeves 321, the spring 324 drives the needle rod 322 away from the PCB board. In practical applications, the start and stop of the air pump can be linked to the movement and positioning of the upper cover plate 305. That is, the contact switch 309 can send a signal to the air pump control unit, activating it when the upper cover plate 305 is in place. This inflates the needle sleeve 321, increasing the air pressure within it and pushing the plug 323 and needle bar 322 downwards (overcoming the elastic force of the spring 324) towards the upper surface of the PCB board until point contact is formed. (It is worth noting that the air pump's output power and time are pre-determined through testing to ensure that the vertical pressure exerted by the needle bar 322 on the PCB board reaches a preset value.) The upper cover plate 305 and the lower support... When board 302 separates, the air pump extracts the gas and automatically stops supplying gas. At this time, spring 324 recovers its elasticity and automatically lifts needle bar 322 away from the PCB board. In embodiment two, a liquid medium can be used instead of air pump for charging and discharging. Needle bar 322 is moved by hydraulic drive. However, whether it is pneumatic or hydraulic drive, there is a sealing problem. The sealing requirements for the upper pin 307 are high. Otherwise, as the usage time increases, the sealing will inevitably decrease, which will lead to air and liquid leakage and the expected movement of needle bar 322 cannot be achieved. Therefore, embodiments three to five are required.

[0047] Embodiment 3 based on the upper ejector pin 307: Please refer to Figure 5 , Figure 8 and Figure 11The upper ejector pin 307 includes several needle sleeves 331 fixedly connected to the edge of the hollow groove 303 on the upper cover plate 305, needle rods 332 movably connected in the needle sleeves 331, an airbag column 334 and a spring 333 installed in the needle sleeves 331. The needle rods 332 are cylindrical structures, and the lower end of the needle rods 332 can form point contact with the upper surface of the PCB board. The airbag column 334 is connected to an air pump through a hose. The air pump controls the flow of gas into or out of the airbag column 334 through the hose. When gas flows into the airbag column 334, the airbag column 334 expands and drives the needle rods 332 closer to the PCB board. When gas flows out of the airbag column 334, the airbag column 334 contracts, and the spring 333 drives the needle rods 332 away from the PCB board. In practical applications, the start and stop of the air pump can be linked to the movement and positioning of the upper cover plate 305. That is, the contact switch 309 can send a signal to the air pump control unit, which starts when the upper cover plate 305 is in place, inflating the airbag column 334. This causes the airbag column 334 to expand and deform, pushing the needle bar 332 downward (overcoming the elastic force of the spring 333) close to the upper surface of the PCB board until it makes point contact with it. When the upper cover plate 305 separates from the lower support plate 302, the air pump extracts the gas and automatically stops supplying air. At this time, the airbag column 334 contracts, the pushing force on the needle bar 332 disappears, and the elasticity of the spring 333 recovers, automatically lifting the needle bar 332 away from the PCB board. Compared to Embodiment 2, the expansion and pushing scheme of the airbag column 334 used in Embodiment 3 has lower requirements for sealing and lower risk of air leakage. However, all airbag columns 334 are independent, and repeated expansion of the airbag will cause aging. If the aging of the airbag columns 334 is inconsistent, the degree of expansion during inflation will be different, which will cause the pushing distance of each pin bar 332 to be inconsistent. This will result in some pin bars 332 being able to make point contact with the PCB board, while others will not. Therefore, Embodiments 4 to 5 are required.

[0048] Example 4 based on the upper ejector pin 307: Please refer to Figure 5 , Figure 8 , Figure 12 and Figure 15The upper pin 307 includes several needle sleeves fixedly connected to the edge of the hollow groove 303 on the upper cover plate 305, needle bars 344 movably connected to the needle sleeves, and springs 345 installed inside the needle sleeves. The upper end of the needle bars 344 is provided with a groove 346. The needle sleeves include a conical part 341 communicating with the cavity inside the upper cover plate 305 and a cylindrical part 342 fixedly connected to the lower end of the conical part 341. The connection point between the conical part 341 and the upper cover plate 305 is an arc-shaped connecting part 343. The needle bars 344 are movably connected inside the cylindrical part 342. Each cylindrical part 342 is provided with a through groove, and a connecting frame 347 passing through the through groove is fixedly connected between adjacent needle bars 344. The connecting frame 347 connects all the needle bars 344 into a whole, so that the movement distance of all the needle bars 344 is the same.

[0049] In embodiment four, the upper cover plate 305 has a double-layer structure with a cavity between the layers. An airbag bed 8 is installed in the cavity. The airbag bed 8 is connected to an air pump via a hose, and the air pump controls the flow of gas into or out of the airbag bed 8 via the hose. The airbag bed 8 includes an upper bed layer 801 and a lower bed layer 802. When gas flows into the airbag bed 8, the lower bed layer 802 expands and forms a bulge 803 inside the needle sleeve. The bulge 803 is used to drive the needle bar 344 closer to the PCB board. When gas flows out of the airbag bed 8, the lower bed layer 802 contracts, and the spring 345 drives the needle bar 344 away from the PCB board. The upper bed layer 801 is a low-deformation zone, and the lower bed layer 802 is a high-deformation zone. The upper bed layer 801 is made of thermoplastic polyurethane material, and the lower bed layer 802 is made of liquid silicone material. The lower bed layer 802 has a downward protrusion structure at the position corresponding to the needle sleeve. Traditional single-material airbags (such as single-layer silicone) expand as a whole during inflation, making it impossible to precisely control the deformation of the lower layer and ensuring sufficient deformation of the lower layer. This results in inconsistent pushing of the needle rod 344. Therefore, this invention uses an airbag bed 8 made of two materials. The thermoplastic polyurethane material selected for the upper bed 801 can provide sufficient rigid support, limit the deformation of the upper layer, and prevent the airbag bed 8 from collapsing as a whole. It also has high adhesion to the liquid silicone material and is manufactured by hot pressing (adhesion strength ≥15 N / mm). At the same time, it has good wear resistance and avoids wear caused by friction with the needle sleeve 4. The liquid silicone material selected for the lower bed 802 can easily expand into the needle sleeve 4 to achieve point contact drive. Moreover, liquid silicone material, as a commonly used material for industrial-grade airbags, has high fatigue resistance. Liquid silicone material can be injection molded into complex shapes, such as the protrusions on the lower bed 802 corresponding to the needle sleeves used in this invention, which can be easily manufactured. Using this protrusion structure, it can be pre-expanded to form a bulge 803 during inflation, resulting in a faster response speed. As the bulge 803 gradually expands, it exerts a downward pushing force on the needle rods 344. Even if the overall airbag bed 8 ages, the degree of aging tends to be uniform, and the degree of expansion is relatively balanced. With the help of the connecting frame 347, it can be ensured that all the needle rods 344 make point contact with the PCB board.

[0050] An alarm is installed on the frame 1, and a tension sensor 901 is installed on the upper cover 305. A bracket 902 is installed on the sensing end of the tension sensor 901, and the bracket 902 is connected to the connecting frame 347. When the needle bar 344 moves, the tension sensor 901 detects the tension value at its sensing end and sends a signal to the control unit of the alarm. If the upper ejector pin 307 cannot extend to the preset length due to sealing problems, aging of the airbag column 334, or airbag bed 8, the tension sensor 901 will detect that the tension value has not reached the preset value. At this time, it will send a signal to the alarm to prompt the operator to take appropriate action, such as improving the sealing structure or replacing the airbag column 334 or airbag bed 8 in a timely manner.

[0051] Example 5 based on the upper ejector pin 307: Please refer to Figure 5 , Figure 8 and Figure 15 The connecting frame 347 has a hollow structure, and the pin bar 344 has a vertical flow channel 351. The flow channel 351 is connected to the hollow structure of the connecting frame 347, which is connected to the air outlet of the micro fan through a flexible hose. If dust and debris adhering to the upper surface of the PCB board are at the point of contact between the upper ejector pin 307 and the PCB board, it will affect the stability of the PCB board. Therefore, after the upper cover plate 305 is moved into place, a small airflow is output by the micro fan during the extension of the upper ejector pin 307. The airflow flows out from the bottom of the upper ejector pin 307 through the flow channel 351 and acts on the corresponding position on the PCB board to blow away the dust and debris that will form a point of contact. The airflow velocity and air pressure output by the micro fan need to be determined experimentally to prevent the PCB board from falling due to air disturbance if it is not completely fixed.

[0052] During operation, the PCB separator automatically transports the PCB board to the loading area 2 on one side of the secondary dust cleaning device for waiting buffering. The secondary dust cleaning machine's transport mechanism 5 picks up the PCB board and places it onto the dust removal fixture in the turnover area 3 (supported by the lower ejector pin 306). The upper cover plate 305 moves to the lower support plate 302 side. After it is fully in place, the upper ejector pin 307 extends and presses down on the PCB board. The contact area between the dust removal fixture and the PCB board is point contact, maximizing the exposure of dust for suction. The dust removal fixture moves the PCB board at a constant speed towards the dust removal mechanism 6 and begins dust removal. The upper tornado mechanism 601 and the lower tornado mechanism 6 of the dust removal mechanism 6 move respectively... The dust removal fixture moves vertically above and below (specifically, the lifting and lowering of the two can be controlled by a cylinder device), releasing an ion cyclone to lift up and quickly suck away the dust. The dust removal fixture moves back and forth at a uniform speed through a sliding module to achieve dust removal of PCB boards without dead corners. The dust removal mechanism 6 requires an external 6-horsepower dust removal device (using a centrifugal fan to draw air) to achieve dust removal. After dust removal is completed, the upper cover 305 is removed, and the conveying mechanism 5 simultaneously picks up the dust-removed PCB boards (turnover area 3) and the PCB boards to be dust-removed (loading area 2). The PCB boards to be dust-removed are transported to the dust removal fixture, and the dust-removed PCB boards are transported to the discharge fixture track (unloading area 4) and flow out.

Claims

1. A micro-dust cleaning device for a PCB depaneling machine, characterized in that: The PCB separator includes a frame (1), a conveying unit, a handling mechanism (5) and a dust removal mechanism (6) mounted on the frame (1). The frame (1) is surrounded by a housing (7) that encloses the conveying unit, the handling mechanism (5) and the dust removal mechanism (6). The conveying unit includes a loading area (2) on one side of the frame (1), a unloading area (4) on the other side of the frame (1) and a turnover area (3) between the loading area (2) and the unloading area (4). The PCB separator's feeder is used to convey PCB boards to the loading area (2). The handling mechanism (5) is used to move the PCB boards in the loading area (2) to the turnover area (3) and move the PCB boards in the turnover area (3) to the unloading area (4). The turnover area (3) includes a sliding module installed on the frame (1) and a dust removal fixture installed on the output end of the sliding module. The dust removal fixture has a hollowed-out groove (303) that is adapted to the shape of the PCB board. Several positioning components are installed around the edge of the hollowed-out groove (303). The positioning components fix the PCB board on the dust removal fixture through point contact. The sliding module is used to drive the dust removal fixture and the PCB board on it to enter and exit the dust removal mechanism (6). The dust removal mechanism (6) is used to output ion cyclones, which act on the PCB board; The dust removal fixture includes a slide block (301) installed on the output end of the sliding module, a lower support plate (302) installed on the slide block (301), a slide rail (304) installed on one side of the lower support plate (302), and an upper cover plate (305) slidably connected to the slide rail (304). Both the lower support plate (302) and the upper cover plate (305) are provided with hollow slots (303). A moving machine is installed on the slide rail (304). The upper cover plate (305) is fixedly connected to the output end of the moving machine. The moving machine is used to drive the upper cover plate (305) to move between one side and above the lower support plate (302). When the upper cover plate (305) moves above the lower support plate (302), the two hollow slots (303) are in a vertically opposite state. The positioning component includes several lower ejector pins (306) fixedly connected along the edge of the cutout groove (303) on the lower support plate (302) and several retractable upper ejector pins (307) installed along the edge of the cutout groove (303) on the upper cover plate (305). When the upper cover plate (305) moves above the lower support plate (302), the retractable end of the upper ejector pin (307) makes point contact with the upper surface of the PCB board. A limit switch (308) is installed at one end of the slide rail (304). A contact switch (309) is installed on both the limit switch (308) and the upper cover plate (305). When the upper cover plate (305) moves above the lower support plate (302), the contact switch (309) is energized and sends a signal to the control unit of the dust removal mechanism (6). The dust removal mechanism (6) includes an upper tornado mechanism (601) and a lower tornado mechanism (603) arranged symmetrically above and below, as well as an ion bar (605). An upper dust suction pipe (602) is installed on the upper tornado mechanism (601), and a lower dust suction pipe (604) is installed on the lower tornado mechanism (603). The sliding module is used to drive the dust removal fixture and the PCB board on it to move back and forth between the upper tornado mechanism (601) and the lower tornado mechanism (603). Both the upper tornado mechanism (601) and the lower tornado mechanism (603) are ion fans, and the ion fans are equipped with vortex airflow nozzles.

2. The micro-dust cleaning device for a PCB depaneling machine according to claim 1, characterized in that: The conveying mechanism (5) includes an X-axis conveying module (501) mounted on the frame (1), a Z-axis lifting module (502) mounted on the output end of the X-axis conveying module (501), and a suction unit mounted on the output end of the Z-axis lifting module (502); The suction unit includes a front suction cup fixing area (503) and a rear suction cup fixing area (504) on the same horizontal axis. The X-axis conveying module (501) is used to drive the front suction cup fixing area (503) to move between the loading area (2) and the turnover area (3), and to drive the rear suction cup fixing area (504) to move between the turnover area (3) and the unloading area (4). The Z-axis lifting module (502) is used to drive the front suction cup fixing area (503) and the rear suction cup fixing area (504) to move closer to or further away from the conveying unit in the vertical direction. The front suction cup fixing area (503) is used to pick up the PCB board from the loading area (2) and place it on the dust removal fixture, and the rear suction cup fixing area (504) is used to pick up the PCB board from the dust removal fixture and place it on the unloading area (4).

3. The micro-dust cleaning device for a PCB depaneling machine according to claim 1, characterized in that: The upper pin (307) includes several needle sleeves (311) fixedly connected to the edge of the hollow groove (303) on the upper cover plate (305), a needle bar (312) movably connected in the needle sleeve (311), and a spring (313) with one end connected in the needle sleeve (311). The other end of the spring (313) is connected to the needle bar (312), and the needle bar (312) is a cylindrical structure. The lower end of the first needle bar (312) is provided with a bevel foot (315). The lowest end of the bevel foot (315) can form a point contact with the upper surface of the PCB board. The first needle bar (312) and the first needle sleeve (311) are connected by a spline (314). When the upper cover plate (305) moves, the bevel foot (315) always faces the PCB board on the lower ejector pin (306).

4. The micro-dust cleaning device for a PCB depaneling machine according to claim 1, characterized in that: The upper ejector pin (307) includes several pin sleeves (321) fixedly connected to the edge of the hollow groove (303) on the upper cover plate (305), a pin bar (322) movably connected in the pin sleeve (321), a plug (323) fixedly connected to the upper end of the pin bar (322), and a spring (324) installed in the pin sleeve (321). The pin bar (322) is a cylindrical structure, and the lower end of the pin bar (322) can form a point contact with the upper surface of the PCB board. The second needle sleeve (321) is connected to the air pump through a hose. The air pump controls the flow of gas into or out of the second needle sleeve (321) through the hose. When gas flows into the second needle sleeve (321), the air pressure drives the second needle bar (322) to approach the PCB board. When gas flows out of the second needle sleeve (321), the second spring (324) drives the second needle bar (322) away from the PCB board.

5. The micro-dust cleaning device for a PCB depaneling machine according to claim 1, characterized in that: The upper ejector pin (307) includes several pin sleeves (331) fixedly connected to the edge of the hollow groove (303) on the upper cover plate (305), a pin bar (332) movably connected in the pin sleeves (331), an airbag column (334) and a spring (333) installed in the pin sleeves (331). The pin bar (332) is a cylindrical structure, and the lower end of the pin bar (332) can form a point contact with the upper surface of the PCB board. The airbag column (334) is connected to the air pump through a hose. The air pump controls the flow of gas into or out of the airbag column (334) through the hose. When gas flows into the airbag column (334), the airbag column (334) expands and drives the needle bar three (332) to approach the PCB board. When gas flows out of the airbag column (334), the airbag column (334) contracts, and the spring three (333) drives the needle bar three (332) away from the PCB board.

6. The micro-dust cleaning device for a PCB depaneling machine according to claim 1, characterized in that: The upper pin (307) includes several needle sleeves four fixedly connected to the edge of the hollow groove (303) on the upper cover plate (305), a needle bar four (344) movably connected in the needle sleeve four, and a spring four (345) installed in the needle sleeve four. The upper end of the needle bar four (344) is provided with a groove (346). The top cover (305) has a double-layer structure with a cavity between the layers. An airbag bed (8) is installed in the cavity. The airbag bed (8) is connected to an air pump through a hose. The air pump controls the flow of gas into or out of the airbag bed (8) through the hose. The airbag bed (8) includes an upper bed layer (801) and a lower bed layer (802). When gas flows into the airbag bed (8), the lower bed layer (802) expands and forms a bulge (803) inside the needle sleeve four. The bulge (803) is used to drive the needle bar four (344) to approach the PCB board. When gas flows out of the airbag bed (8), the lower bed layer (802) contracts, and the spring four (345) drives the needle bar four (344) away from the PCB board. The upper bed (801) is a low deformation zone, and the lower bed (802) is a high deformation zone. The upper bed (801) is made of thermoplastic polyurethane material, and the lower bed (802) is made of liquid silicone material. The lower bed (802) has a downward protrusion structure at the position corresponding to the needle sleeve four. The needle sleeve four includes a conical part (341) that communicates with the inner cavity of the upper cover plate (305) and a cylindrical part (342) that is fixedly connected to the lower end of the conical part (341). The connection point between the conical part (341) and the upper cover plate (305) is an arc-shaped connecting part (343). The needle bar four (344) is movably connected inside the cylindrical part (342). Each cylindrical part (342) is provided with a through groove, and a connecting frame (347) passing through the through groove is fixedly connected between adjacent needle bars (344).

7. A micro-dust cleaning device for a PCB depaneling machine according to claim 6, characterized in that: An early warning device is installed on the frame (1), and a tension sensor (901) is installed on the upper cover plate (305). A bracket (902) is installed on the sensing end of the tension sensor (901). The bracket (902) is connected to the connecting frame (347). When the needle bar (344) moves, the tension sensor (901) is used to detect the tension value at the sensing end and send a signal to the control unit of the early warning device. The connecting frame (347) is a hollow structure. The needle bar four (344) has a vertical flow channel (351). The flow channel (351) is connected to the hollow structure of the connecting frame (347). The hollow structure of the connecting frame (347) is connected to the air outlet of the micro fan through a flexible hose.

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