Liquid cooling cabinet

Abstract

An upper plate and a lower plate of the liquid cooling case are flow channel cold plates, a left side plate of the liquid cooling case is provided with an inlet and an outlet of a liquid pipe, each flow channel cold plate comprises a base material, the base material is provided with a mounting groove with an opening facing the interior of a case body, the mounting grooves are used for containing the liquid pipe, and the liquid pipe is distributed in the base material in a snake shape. The opening end of the mounting groove is provided with brazing filler metal, the brazing filler metal is connected with the base metal in a welded mode so that the liquid pipe can be fixed in the base metal, and the liquid pipe in the upper plate communicates with the liquid pipe in the lower plate. According to the invention, the installation difficulty and cost of the liquid pipe in the liquid cooling cabinet are reduced, the possibility of leakage of the liquid pipe is reduced, and the working environment of the cabinet is ensured. The system can be applied to equipment with high integration level and large heat productivity, can realize distributed heat dissipation according to the position of a high-energy-consumption module, and has important application value for heat dissipation of the whole system.

Description

Technical Field

[0001] This invention relates to the field of liquid cooling technology, and more particularly to a liquid-cooled chassis. Background Technology

[0002] To provide a stable and cool working environment for the hardware inside the chassis, ensuring that the hardware performance can be fully utilized, the system can run stably for a long time, and the hardware lifespan is maximized, heat dissipation components need to be installed inside the chassis to dissipate the heat generated during operation.

[0003] In the field of chassis cooling, air cooling technology is widely used due to its low cost and ease of deployment. This technology mainly uses fans to generate forced airflow, utilizing convective heat transfer between the air and the surface of the equipment to achieve cooling. However, as electronic devices develop towards higher power and higher density, the shortcomings of traditional air cooling technology are becoming increasingly apparent: First, the low specific heat capacity and low thermal conductivity of air as a cooling medium constitute an inherent technical ceiling, limiting its heat dissipation capacity; second, to achieve effective heat dissipation, a high-volume, high-speed fan system is often required, which not only leads to a sharp increase in cooling energy consumption and operating noise, but its large physical structure also occupies valuable chassis space, forming a "heat sink" bottleneck that restricts the improvement of equipment power density.

[0004] In existing technologies, liquid cooling of the chassis is achieved by installing chilled water pipes inside the chassis. This is typically done by securing the chilled water pipes with locking rings and barbs, or locking rings and O-rings. However, these methods are difficult to install, costly to manufacture, and pose a risk of leakage. Summary of the Invention

[0005] In view of the deficiencies in the prior art, this application provides a liquid-cooled chassis to solve the above-mentioned technical problems.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solution: A liquid-cooled chassis has an upper and lower plate that are both flow channel cold plates. The left side plate of the liquid-cooled chassis is provided with an inlet and an outlet for a liquid pipe. The flow channel cold plate includes a base material with an installation groove facing the inside of the chassis. The installation groove is used to accommodate the liquid pipe, which is distributed in a serpentine pattern within the base material. A brazing filler metal is provided at the open end of the installation groove, and the brazing filler metal is welded to the base material to fix the liquid pipe inside the base material. The liquid pipe in the upper plate is connected to the liquid pipe in the lower plate.

[0007] In one embodiment, the inlet of the liquid pipe is provided with an inlet fluid connector, and the outlet of the liquid pipe is provided with an outlet fluid connector. Both the inlet fluid connector and the outlet fluid connector have self-pressure relief function and self-closing function.

[0008] In one embodiment, the temperature of the liquid in the liquid tube is 20°C-38°C, the pressure in the liquid tube is 0.3-0.4 MPa, and the pressure relief threshold of both the inlet fluid connector and the outlet fluid connector is 0.7 MPa.

[0009] In one embodiment, the liquid pipe in the upper plate is connected to the liquid pipe in the lower plate on the left side plate of the liquid cooling chassis. The inlet of the liquid pipe is lower than the outlet of the liquid pipe. The inlet of the liquid pipe is connected to the liquid pipe in the lower plate, and the outlet of the liquid pipe is connected to the liquid pipe in the upper plate.

[0010] In one embodiment, a cover plate is provided on the surface of the brazing filler metal, the surface of the cover plate being flush with the surface of the base metal, and the cover plate being fixedly connected to the base metal.

[0011] In one embodiment, the brazing filler metal is fixed to the base material by vacuum brazing.

[0012] In one embodiment, the base material, cover plate, and side plate of the chassis are all made of 6063 aluminum alloy.

[0013] In one embodiment, the liquid cooling chassis has a length of 482.6 mm, a width of 330 mm, and a height of 132 mm. The liquid cooling chassis can accommodate up to 18 4HP 3U board slots, with each 3U board slot containing a 3U board.

[0014] In one embodiment, the 3U board is installed in the 3U board slot using CPCI or CPEX interlocking, and both the inlet fluid connector and the outlet fluid connector 4 are TSAX fluid connectors.

[0015] In one embodiment, the liquid pipe is made of copper, has a wall thickness of 0.4 mm, uses fresh water as the coolant, has a rated flow rate of 1 L / min, and has a DN5 flange at both the inlet and outlet.

[0016] Compared with the prior art, this application has at least the following beneficial effects: The liquid-cooled chassis in this application uses upper and lower plates as flow channel cold plates. The flow channel cold plates have mounting slots for accommodating liquid pipes, which are then fixed to the flow channel cold plates using a welding process. This reduces the installation difficulty and cost of the liquid pipes within the chassis, also lowers the possibility of liquid pipe leakage, and ensures a safe operating environment for the chassis. The liquid-cooled chassis in this application can be applied to highly integrated devices with high heat generation, providing effective and noiseless cooling. It also allows for distributed heat dissipation based on the location of high-energy-consuming modules, making it of significant application value for the overall system's heat dissipation. Attached Figure Description

[0017] Figure 1 This is a front view of the liquid-cooled chassis in an embodiment of this application; Figure 2 This is a top view of the liquid-cooled chassis in an embodiment of this application; Figure 3 This is a left view of the liquid-cooled chassis in an embodiment of this application; Figure 4 This is a rear view of the liquid-cooled chassis in an embodiment of this application; Figure 5 This is a top view of the flow channel cold plate in the embodiment of this application; Figure 6 This is a cross-sectional view of the flow channel cold plate in an embodiment of this application; Figure 7 This is the 3U board module in the embodiments of this application; Reference numerals: 01, liquid cooling chassis; 1, inlet fluid connector; 2, liquid pipe; 3, flow channel cold plate; 301, base material; 302, mounting groove; 303, brazing filler metal; 304, cover plate; 4, outlet fluid connector; 5, 3U board module. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention is described below with reference to specific embodiments shown in the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and not intended to limit the scope of the invention. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of the invention.

[0019] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0020] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms and should not be construed as indicating or implying relative importance. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0021] In the description of this invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical connection or internal connection between two components. They can be direct connection or indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0022] To better understand the technical solution of the present invention, the present invention will be described in detail below with reference to the accompanying drawings.

[0023] This embodiment provides a liquid-cooled chassis 01, such as Figures 1-6 As shown, the upper and lower plates of the liquid cooling chassis 01 are both flow channel cold plates 3. The side plates of the liquid cooling chassis 01 are provided with inlets and outlets of liquid pipes 2. The flow channel cold plate 3 includes a base material 301. The base material 301 is provided with a mounting groove 302 with an opening facing the inside of the chassis. The mounting groove 302 is used to accommodate the liquid pipes 2. The liquid pipes 2 are distributed in a serpentine pattern inside the base material 301. The opening end of the mounting groove 302 is provided with a brazing filler metal 303. The brazing filler metal 303 is welded to the base material 301 to fix the liquid pipes 2 inside the base material 301. The liquid pipes 2 in the upper plate are connected to the liquid pipes 2 in the lower plate.

[0024] The inlet of the liquid pipe 2 is provided with an inlet fluid connector 1, and the outlet of the liquid pipe 2 is provided with an outlet fluid connector 4. Both the inlet fluid connector 1 and the outlet fluid connector 4 have self-pressure relief function and self-closing function to avoid pipe rupture and coolant leakage caused by excessive water pressure. In this embodiment, the pressure in the liquid pipe 2 is 0.3 to 0.4 MPa, and the pressure relief threshold of the inlet fluid connector 1 and the outlet fluid connector 4 is 0.7 MPa.

[0025] The inlet and outlet of liquid pipe 2 are located on the same side. The liquid pipe 2 in the upper plate and the liquid pipe 2 in the lower plate are connected by a side plate with a liquid pipe inlet in the liquid cooling chassis. In this embodiment, both the inlet and outlet of liquid pipe 2 are located on the left side of the liquid cooling chassis 01. The inlet of liquid pipe 2 is lower than the outlet of liquid pipe 2. The inlet of liquid pipe 2 is connected to the liquid pipe 2 in the lower plate, and the outlet of liquid pipe 2 is connected to the liquid pipe 2 in the upper plate, so that the coolant enters from the lower side of the chassis and flows out from the upper side of the chassis.

[0026] To ensure a smooth internal surface, a cover plate 304 is provided on the surface of the brazing filler metal 303. The surface of the cover plate 304 is flush with the surface of the base material 301, and the cover plate 304 is fixedly connected to the base material 301. The brazing filler metal 303 is welded to the base material 301 via vacuum brazing. The base material 301, the cover plate 304, and the side plates of the chassis are all made of 6063 aluminum alloy. Vacuum brazing is used in this embodiment because it offers high yield and safe production conditions. Heating and welding are performed in a vacuum chamber at a temperature lower than the solidus of the base material but higher than the liquidus of the brazing filler metal. The liquid phase brazing filler metal fills the gap and dissolves and diffuses with the base material to achieve the connection of the parts. During the process, there are no oxidation, carbonization, decarburization, or contamination and deterioration phenomena. The brazed seam is aesthetically pleasing and resistant to corrosion. Furthermore, the workpiece produced by vacuum brazing is heated uniformly, with low thermal stress and minimal deformation, allowing for small allowances and smooth processing. The welded parts formed by vacuum brazing have heat dissipation characteristics, ensuring welding performance and the corrosion resistance of the chassis body, and reducing the tendency for stress corrosion cracking.

[0027] In this embodiment, the liquid cooling chassis is a standard 3U size, with a length of 482.6mm, a width of 330mm, and a height of 132mm. The chassis can accommodate up to 18 4HP 3U board slots, each containing the following: Figure 7 The 3U board 5 shown is installed in the 3U board slot using CPCI or CPEX mating. Both the inlet fluid connector 1 and the outlet fluid connector 4 are TSAX fluid connectors.

[0028] To improve heat exchange efficiency, in this embodiment, the liquid pipe 2 is made of copper, the wall thickness of the liquid pipe 2 is 0.4mm, the coolant is fresh water, the water temperature inside the liquid cooling box is 20℃-38℃, the rated flow rate of the coolant is 1L / min, and the flange size at the inlet and outlet of the liquid pipe 2 is DN5.

[0029] The working principle of the liquid-cooled chassis in this embodiment is as follows: external water flows into the lower flow channel cold plate from the inlet installed on the left side plate of the chassis. After passing through the lower flow channel cold plate, it flows through the left side plate to the upper flow channel cold plate, then through the upper flow channel cold plate back to the left side plate and flows out through the outlet, forming a fluid loop for the liquid-cooled chassis, effectively dissipating heat for the internal modules. Based on the dimensions of the upper and lower flow channel cold plates and the left side plate, the total length of the liquid cooling pipeline in this embodiment is calculated to be 4.77m.

[0030] The liquid-cooled chassis in this embodiment is calculated based on the above conditions as follows.

[0031] 1. Known design requirements Liquid-cooled reinforced submersible: Inlet and outlet flange size is DN5, medium is liquid fresh water, water temperature is normal temperature (20℃-38℃), and flow rate is not less than 1L / min.

[0032] The water-cooled connector is DN5, with an effective cross-sectional area of ​​19.6 mm². Flow velocity = flow rate / cross-sectional area = 1000000 mm³ / 60 s / 19.6 mm², therefore the minimum specified flow velocity for DN5 is 0.85 m / s. To reduce pressure loss in the liquid cooling channel, a coolant flow velocity of 1.5 m / s is selected for design.

[0033] The characteristic temperature of the coolant in the system is 33.5℃. At this characteristic temperature, the physical properties of the coolant are as follows: ρ=1000kg / m³; λ=0.343W / (m·K); cp=3124.31 J / kg·℃; ν=3.95×10-6m² / s.

[0034] The system's maximum operating ambient temperature is 50℃, the liquid coolant inlet temperature is 20℃, and the maximum outlet temperature is 38℃.

[0035] 2. Flow rate calculation m

[0036] in The flow rate of the coolant is m³ / s; Q represents the thermal power consumption of the device, in W; Let be the density of the coolant, in kg / m³; Cp is the specific heat capacity of the coolant, J / kg·℃; Tout is the coolant outlet temperature, in °C; Tin is the temperature at the coolant inlet, in °C.

[0037] The maximum heat dissipation of the equipment is estimated to be 200W. Coolant flow rate: qv=Q / (ρcp△t)=200 / (1000×3124.31×18)=0.36×10~5m³ / s The input flow rate of the socket design is not less than 1L / min, that is, 1.6×10~5 m³ / s>>0.36×10~5 m³ / s, which meets the cooling requirements of the 3U liquid-cooled host socket.

[0038] 3. Flow resistance calculation Reynolds number calculation formula:

[0039] Since the Reynolds number Re < 2300, the fluid flow is determined to be laminar. According to basic fluid mechanics theory, there are two types of resistance losses in fluid flow: friction loss hf and local resistance loss hm. Formula for calculating friction loss hf:

[0040] In the above formula, l is the initially assumed pipe length; de is the equivalent diameter; v is the cross-sectional average flow velocity; g is the gravitational acceleration; and λ is the friction coefficient.

[0041] Since the fluid flow is in a laminar state, the friction factor λ is:

[0042] The total length of the flow channel has been calculated to be l = 4.77 m. From this, the friction loss of the system can be obtained:

[0043] The pressure loss along the flow path of the coolant in the system, Pf, is:

[0044] In a liquid cooling system flow channel, local resistance losses include two types: one is the local resistance loss ht at bends; the other is the resistance loss hn between the inlet and outlet connecting pipes. Generally, the local resistance loss at bends is four times the velocity head per stroke, i.e.:

[0045] The local pressure loss Pt at the bend in the system is:

[0046] The resistance loss hn of the inlet and outlet connecting pipes is:

[0047] The inner diameter of the DN5 inlet and outlet connecting pipes is 5mm, and the inner diameter of the internal pipe is 12mm. According to the continuity equation... Therefore, vi = 8.64 m / s.

[0048] Local pressure loss Pn at the inlet and outlet connection pipes

[0049] The total pressure loss Pz in the flow channel is:

[0050] The system pressure bearing capacity of the liquid-cooled cold plate is 0.25MPa, and the fluid resistance loss in this design is less than the system pressure bearing capacity.

[0051] The liquid-cooled chassis in this embodiment can be applied to highly integrated devices with large heat generation. It can effectively cool down the device without noise and can also distribute heat dissipation according to the location of high-energy-consuming modules, which has important application value for the heat dissipation of the entire system.

[0052] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of the invention or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solutions of the present invention, and all such modifications and substitutions should be covered within the scope of the technical solutions claimed in the present invention.

Claims

1. A liquid-cooled chassis, characterized in that, The upper and lower plates of the liquid cooling chassis are both flow channel cold plates. The left side plate of the liquid cooling chassis is provided with an inlet and an outlet for the liquid pipe. The flow channel cold plate includes a base material, on which an installation groove with an opening facing into the chassis is provided. The installation groove is used to accommodate the liquid pipe. The liquid pipe is distributed in a serpentine pattern within the base material. A brazing filler is provided at the opening end of the installation groove. The brazing filler is welded to the base material to fix the liquid pipe inside the base material. The liquid pipe in the upper plate is connected to the liquid pipe in the lower plate.

2. The liquid-cooled chassis according to claim 1, characterized in that, The inlet of the liquid pipe is equipped with an inlet fluid connector, and the outlet of the liquid pipe is equipped with an outlet fluid connector. Both the inlet and outlet fluid connectors have self-pressure relief and self-closing functions.

3. The liquid-cooled chassis according to claim 2, characterized in that, The temperature of the liquid in the liquid tube is 20℃-38℃, the pressure in the liquid tube is 0.3~0.4 MPa, and the pressure relief threshold of both the inlet fluid connector and the outlet fluid connector is 0.7 MPa.

4. The liquid-cooled chassis according to claim 1, characterized in that, The liquid pipe in the upper plate is connected to the liquid pipe in the lower plate on the left side of the liquid cooling chassis. The inlet of the liquid pipe is lower than the outlet of the liquid pipe. The inlet of the liquid pipe is connected to the liquid pipe in the lower plate, and the outlet of the liquid pipe is connected to the liquid pipe in the upper plate.

5. The liquid-cooled chassis according to claim 1, characterized in that, The surface of the brazing filler metal is provided with a cover plate, the surface of the cover plate is flush with the surface of the base metal, and the cover plate is fixedly connected to the base metal.

6. The liquid-cooled chassis according to claim 1, characterized in that, The brazing filler metal is fixed to the base material by vacuum brazing.

7. The liquid-cooled chassis according to claim 1, characterized in that, The base material, cover plate, and side panels of the chassis are all made of 6063 aluminum alloy.

8. The liquid-cooled chassis according to claim 1, characterized in that, The liquid cooling chassis is 482.6mm long, 330mm wide, and 132mm high. The liquid cooling chassis can accommodate up to 18 4HP 3U board slots, with each 3U board slot containing a 3U board.

9. The liquid-cooled chassis according to claim 1, characterized in that, The 3U board is installed in the 3U board slot using CPCI or CPEX interlocking. Both the inlet fluid connector and the outlet fluid connector are TSAX fluid connectors.

10. The liquid-cooled chassis according to claim 1, characterized in that, The liquid pipe is made of copper with a wall thickness of 0.4 mm. The coolant is fresh water with a rated flow rate of 1 L / min. The flanges at the inlet and outlet of the liquid pipe are both DN5.

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