Method for manufacturing electronic component

Abstract

Provided is a method for manufacturing an electronic component capable of achieving high-density mounting. The electronic component includes: a base portion having a first end surface and a second end surface facing each other in a longitudinal direction, a first side surface and a second side surface facing each other in a first direction orthogonal to the longitudinal direction, and a third side surface and a fourth side surface facing each other in a second direction orthogonal to the longitudinal direction and the first direction; and external electrodes respectively provided on the first end surface and the second end surface, the manufacturing method comprising: a step in which the base part is immersed from the first end surface side into a conductive paste layer that is a precursor for the external electrodes; moving the base part relative to the conductive paste layer in a direction from the first side surface toward the second side surface in a state in which the base part is immersed in the conductive paste layer from the first end surface side; the base portion is pulled up from the conductive paste layer during or after movement of the base portion relative to the conductive paste layer in a direction from the first side surface toward the second side surface.

Description

Technical Field

[0001] This invention relates to a method for manufacturing an electronic component. Background Technology

[0002] Previously known electronic components included: a generally rectangular cuboid-shaped base portion formed by alternating layers of dielectric and internal electrode layers; and external electrodes disposed on a pair of end faces along the length of the base portion. A laminated ceramic electronic component, one such electronic component, is disclosed in Japanese Patent Application Publication No. 2021-48388 (Patent Document 1).

[0003] Multilayer ceramic electronic components are mounted on a substrate, for example, by means of soldering external electrodes and pads provided on the substrate.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2021-48388 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] From the viewpoint of reliably mounting the electronic component on the substrate by stabilizing its orientation, it is required to provide pads on the substrate with a size corresponding to the size of the external electrodes. However, when the pad area is configured to be large, it is difficult to mount the electronic components at a high density.

[0009] Therefore, the present invention was made to solve the above-mentioned problems, with the aim of providing a method for manufacturing electronic components that can achieve high-density mounting.

[0010] Solution for solving the problem

[0011] The manufacturing method of the electronic component based on the present invention is a method for manufacturing the following electronic component, which includes: a substrate having a first end face and a second end face opposite to each other in the length direction, a first side face and a second side face opposite to each other in a first direction orthogonal to the length direction, and a third side face and a fourth side face opposite to each other in a second direction orthogonal to the length direction and the first direction; and external electrodes respectively disposed on the first end face and the second end face. The manufacturing method of the electronic component based on the present invention includes the following steps: impregnating the substrate with a conductive paste layer serving as a precursor of the external electrode from the side where the first end face is located; while the substrate is impregnated with the conductive paste layer from the side where the first end face is located, moving the substrate relative to the conductive paste layer in a direction from the first side face toward the second side face; and during or after the substrate is moved relative to the conductive paste layer in the direction from the first side face toward the second side face, lifting the substrate from the conductive paste layer.

[0012] The effects of the invention

[0013] According to the present invention, a method for manufacturing electronic components that enables high-density mounting can be provided. Attached Figure Description

[0014] Figure 1 This is a perspective view schematically showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the embodiment.

[0015] Figure 2 yes Figure 1 A schematic front view of the stacked ceramic capacitor shown.

[0016] Figure 3 yes Figure 1 A schematic bottom view of the stacked ceramic capacitor shown.

[0017] Figure 4 yes Figure 1 A schematic cross-sectional view of a multilayer ceramic capacitor is shown.

[0018] Figure 5 yes Figure 2 A schematic cross-sectional view of a multilayer ceramic capacitor is shown.

[0019] Figure 6 This is a flowchart illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment.

[0020] Figure 7 yes Figure 6 A detailed flowchart of step S8 in the manufacturing process shown.

[0021] Figure 8 It is used for explanation Figure 7 A schematic front view of step S812 in the manufacturing process shown.

[0022] Figure 9 It is used for explanation Figure 7 A schematic front view of step S813 in the manufacturing process shown.

[0023] Figure 10 It is used for explanation Figure 7 A schematic front view of step S813 in the manufacturing process shown.

[0024] Figure 11 It is used for explanation Figure 7 A schematic front view of step S814 in the manufacturing process shown.

[0025] Figure 12 This indicates that there are mounted on the substrate. Figure 1 A schematic cross-sectional view showing the state of the stacked ceramic capacitor.

[0026] Figure 13 This indicates that there are mounted on the substrate. Figure 1 A schematic cross-sectional view showing the state of the stacked ceramic capacitor.

[0027] Figure 14 This is used to illustrate the manufacturing method of the multilayer ceramic capacitor in the modified example. Figure 7 A schematic front view of step S814 in the manufacturing process shown.

[0028] Explanation of reference numerals in the attached figures

[0029] 20. Holding part; 21. Base layer; 22. Adhesive layer; 23. Actuator; 51. Conductive paste layer; 52. Bottom; 53. Conductive paste; 60. Flat plate part; 70. Substrate; 71. Solder pad; 72. Solder solder; 90. Control unit; 91. CPU; 92. Memory; 100. Multilayer ceramic capacitor; 110. Substrate part; 111. First side surface; 112. Second side surface; 113. Third side surface; 114. Fourth side surface; 115. First end face; 116. Second end face; 118. Internal electrode layer; 118a. First internal electrode layer; 118b. Second internal electrode layer; 119. Dielectric layer; 120. First external electrode ; 121, First external electrode on end face side; 122, First external electrode on side face side; 122a, First external electrode on first side face side; 122b, First external electrode on second side face side; 122c, First external electrode on third side face side; 122d, First external electrode on fourth side face side; 130, Second external electrode; 131, Second external electrode on end face side; 132, Second external electrode on side face side; 132a, Second external electrode on first side face side; 132b, Second external electrode on second side face side; 132c, Second external electrode on third side face side; 132d, Second external electrode on fourth side face side; 160, Substrate electrode layer; 170, Plating layer; C, Inner layer. Detailed Implementation

[0030] Hereinafter, embodiments of the present invention will be described in detail with reference to the figures. The embodiments shown below illustrate a method for manufacturing a multilayer ceramic capacitor as a method for manufacturing an electronic component. Furthermore, the method for manufacturing an electronic component of this embodiment shown below can also be applied to methods for manufacturing multilayer ceramic inductors or multilayer ceramic thermistors, etc.

[0031] In the embodiments shown below, the same reference numerals are used to label the same or common parts in the figures, and their descriptions are not repeated. Furthermore, in the figures, L represents the length direction of the base portion, W represents the width direction of the base portion, and T represents the stacking direction of the base portion. The base portion will then be discussed in detail.

[0032] (Implementation Method)

[0033] <A. Structure of Multilayer Ceramic Capacitors>

[0034] Figure 1 This is a perspective view schematically showing the appearance of a multilayer ceramic capacitor manufactured according to the manufacturing method of the multilayer ceramic capacitor according to the embodiment. Figure 2 yes Figure 1 A schematic front view of the stacked ceramic capacitor shown. Figure 3 yes Figure 1 A schematic bottom view of the stacked ceramic capacitor shown. Figure 4 yes Figure 1 A schematic cross-sectional view of the multilayer ceramic capacitor shown along line IV-IV. Figure 5 yes Figure 2 The diagram shows a schematic cross-sectional view of a multilayer ceramic capacitor along line VV. First, refer to... Figures 1-5 The structure of the multilayer ceramic capacitor 100 manufactured according to the manufacturing method of the multilayer ceramic capacitor of this embodiment will be described.

[0035] like Figures 1-5 As shown, the multilayer ceramic capacitor 100 of this embodiment includes a substrate 110 and external electrodes.

[0036] The substrate 110 has a generally cuboid shape. The substrate 110 has a first side surface 111 and a second side surface 112 facing each other in the stacking direction T, a third side surface 113 and a fourth side surface 114 facing each other in the width direction W orthogonal to the stacking direction T, and a first end surface 115 and a second end surface 116 facing each other in the length direction L orthogonal to both the stacking direction T and the width direction W. As an example, in this embodiment, the second side surface 112 defines a mounting surface when the multilayer ceramic capacitor 100 is mounted to a substrate. Furthermore, in this embodiment, the stacking direction T corresponds to the first direction, and the width direction W corresponds to the second direction.

[0037] For the dimensions of the base portion 110, for example, the dimension in the length direction L is 0.1 mm or more and 3.2 mm or less, the dimension in the width direction W is 0.05 mm or more and 1.6 mm or less, and the dimension in the lamination direction T is 0.05 mm or more and 1.6 mm or less. Furthermore, tolerances can be incorporated for the aforementioned dimensions.

[0038] The external electrode consists of a first external electrode 120 and a second external electrode 130. The first external electrode 120 is disposed on the first end face 115. The second external electrode 130 is disposed on the second end face 116.

[0039] The first external electrode 120 includes an end face side first external electrode 121 and a side face side first external electrode 122.

[0040] The end face-side first external electrode 121 is a portion disposed entirely on the first end face 115. The side face-side first external electrode 122 is a portion extending from the first end face 115 toward the first side face 111, the second side face 112, the third side face 113, and the fourth side face 114, respectively. More specifically, the side face-side first external electrode 122 includes a first side face-side first external electrode 122a covering the portion of the first side face 111 located on the first end face 115 side, a second side face-side first external electrode 122b covering the portion of the second side face 112 located on the first end face 115 side, a third side face-side first external electrode 122c covering the portion of the third side face 113 located on the first end face 115 side, and a fourth side face-side first external electrode 122d covering the portion of the fourth side face 114 located on the first end face 115 side.

[0041] In this embodiment, the area of ​​the second side-side first external electrode 122b is larger than the areas of the first side-side first external electrode 122a, the third side-side first external electrode 122c, and the fourth side-side first external electrode 122d. Furthermore, the area of ​​the first side-side first external electrode 122a is smaller than the areas of the second side-side first external electrode 122b, the third side-side first external electrode 122c, and the fourth side-side first external electrode 122d. The areas of the third side-side first external electrode 122c and the fourth side-side first external electrode 122d are configured in substantially the same manner.

[0042] Here, the area of ​​the first external electrode 122a on the first side refers to the area of ​​the first external electrode 122a on the first side when viewed from a direction orthogonal to the first side 111. The same applies to the areas of the first external electrodes 122b, 122c, and 122d on the second, third, and fourth sides.

[0043] The third side side first external electrode 122c and the fourth side side first external electrode 122d are offset from the second side side 112 in the stacking direction T.

[0044] The second external electrode 130 includes an end face side second external electrode 131 and a side face side second external electrode 132.

[0045] The end face-side second external electrode 131 is a portion disposed entirely on the second end face 116. The side face-side second external electrode 132 is a portion extending from the second end face 116 toward the first side face 111, the second side face 112, the third side face 113, and the fourth side face 114, respectively. More specifically, the side face-side second external electrode 132 includes a first side face-side second external electrode 132a covering the portion of the first side face 111 located on the second end face 116 side, a second side face-side second external electrode 132b covering the portion of the second side face 112 located on the second end face 116 side, a third side face-side second external electrode 132c covering the portion of the third side face 113 located on the second end face 116 side, and a fourth side face-side second external electrode 132d covering the portion of the fourth side face 114 located on the second end face 116 side.

[0046] In this embodiment, the area of ​​the second external electrode 132b on the second side is larger than the areas of the second external electrode 132a on the first side, the second external electrode 132c on the third side, and the second external electrode 132d on the fourth side. Furthermore, the area of ​​the second external electrode 132a on the first side is smaller than the areas of the second external electrode 132b on the second side, the second external electrode 132c on the third side, and the second external electrode 132d on the fourth side. The areas of the second external electrode 132c on the third side and the second external electrode 132d on the fourth side are configured in substantially the same manner.

[0047] The second external electrode 132c on the third side and the second external electrode 132d on the fourth side are offset on the second side 112 side in the stacking direction T.

[0048] Thus, the first external electrode 122 and the second external electrode 132 on the side side are configured such that they are generally biased towards the second side side 112 in the stacking direction T. This structure can be achieved using the manufacturing method of the stacked ceramic capacitor of this embodiment, which will be discussed in detail later.

[0049] like Figure 4 and Figure 5 As shown, the first external electrode 120 and the second external electrode 130 include a base electrode layer 160 and a plating layer 170. The plating layer 170 covers the base electrode layer 160.

[0050] The substrate electrode layer 160 includes at least one of a sintered layer, a resin layer, and a thin film layer. In this embodiment, the substrate electrode layer 160 is composed of a sintered layer.

[0051] The sintered layer contains, for example, metallic and glassy components. The metallic component is composed of one metal selected from the group consisting of Ni, Cu, Ag, Pd, and Au, or an alloy containing that metal; for example, an alloy of Ag and Pd can be used. The glassy component contains at least one of Si and Zn.

[0052] The sintered layer can consist of a single layer or multiple stacked layers. The sintered layer can be formed by sintering the conductive paste 53 after it has been applied to the substrate 110, or it can be formed simultaneously with the internal electrode layer 118. When the sintered layer is formed by sintering the conductive paste 53 after it has been applied to the substrate 110, the sintered layer preferably contains a glass component. When the sintered layer is formed simultaneously with the internal electrode layer 118, the sintered layer preferably contains a dielectric. The conductive paste 53 will be discussed next.

[0053] The plating layer 170 is disposed on the substrate electrode layer 160. As the material for forming the plating layer 170, a metal selected from the group consisting of Ni, Cu, Ag, Pd, Au, and Sn, or an alloy containing such metal, can be used. As an example, the plating layer 170 can be a plating layer formed by stacking a layer formed of Ni and a layer formed of Sn.

[0054] Alternatively, a resin layer containing metal filler may be provided between the sintered base electrode layer 160 and the plating layer 170. This allows for the fabrication of a multilayer ceramic capacitor according to this embodiment, including the process of forming the base electrode layer 160 (see the following description). Figure 7 The resin layer is formed by the same process as processes S811 to S815.

[0055] The substrate 110 has a plurality of internal electrode layers 118 and a plurality of dielectric layers 119 that are alternately stacked along the stacking direction T.

[0056] The plurality of internal electrode layers 118 include a plurality of first internal electrode layers 118a and a plurality of second internal electrode layers 118b. The plurality of first internal electrode layers 118a and the plurality of second internal electrode layers 118b are stacked alternately in the stacking direction T.

[0057] The first internal electrode layer 118a extends to the first end face 115. The first end face 115 is covered by the first external electrode 120. The first external electrode 120 is electrically connected to the first internal electrode layer 118a. The second internal electrode layer 118b extends to the second end face 116. The second end face 116 is covered by the second external electrode 130. The second external electrode 130 is electrically connected to the second internal electrode layer 118b.

[0058] In addition, Figure 4 and Figure 5 The example shown has seven sheets of each of the first internal electrode layer 118a and the second internal electrode layer 118b, but the number of sheets of each of the first internal electrode layer 118a and the second internal electrode layer 118b is not particularly limited to seven sheets.

[0059] Multiple dielectric layers 119 are composed of an outer dielectric layer and an inner dielectric layer. The outer dielectric layer is located between the first side 111 and the inner electrode layer 118 located on the side closest to the first side 111 in the stacking direction T, and between the second side 112 and the inner electrode layer 118 located on the side closest to the second side 112 in the stacking direction T. The inner dielectric layer is located between adjacent inner electrode layers 118 along the stacking direction T.

[0060] The first internal electrode layer 118a and the second internal electrode layer 118b each contain Ni as the main component. Alternatively, the first internal electrode layer 118a and the second internal electrode layer 118b may also contain a dielectric material with the same compositional system as the ceramic contained in the dielectric layer 119. Furthermore, the first internal electrode layer 118a and the second internal electrode layer 118b may each contain Sn at the interface between themselves and the dielectric layer 119.

[0061] Multiple dielectric layers 119 are formed, for example, of dielectric ceramic materials whose main components are perovskite compounds containing Ba and Ti. The dielectric layers 119 may also contain at least one of the following as additives: Si, Mg, Mn, V, Cr, and rare earth elements.

[0062] The substrate 110 includes an inner layer C. The inner layer C is stacked in the stacking direction T by portions of the first inner electrode layer 118a opposite to the second inner electrode layer 118b adjacent in the stacking direction T, and portions of the second inner electrode layer 118b opposite to the first inner electrode layer 118a adjacent in the stacking direction T, thereby having electrostatic capacitance.

[0063] <B. Manufacturing method of multilayer ceramic capacitors>

[0064] Figure 6 This is a flowchart illustrating a method for manufacturing a multilayer ceramic capacitor according to an embodiment. Figure 7 yes Figure 6 A detailed flowchart of step S8 in the manufacturing process shown. Figures 8-11 It is used for explanation Figure 7 The diagram shows a schematic front view of each step in the manufacturing process. The following refers to... Figures 6 to 11 The manufacturing method of the multilayer ceramic capacitor 100 of this embodiment will be described.

[0065] First, such as Figure 6As shown, a dielectric ceramic slurry is prepared (step S1). Specifically, dielectric ceramic powder, additive powder, binder resin, and solvent are dispersed and mixed. Thus, a dielectric ceramic slurry is prepared.

[0066] The dielectric ceramic powder is, for example, perovskite-structured dielectric particles such as BaTiO3, CaTiO3, SrTiO3, CaZrO3, or CaHfO3. The added powder is, for example, composed of at least one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds, and Co compounds. As the binder resin, polyurethane resin, urea-formaldehyde resin, melamine resin, epoxy resin, vinyl acetate resin, acrylic resin, or water-based polymers such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These can be used as monomers or in mixtures of two or more. The dielectric ceramic slurry can also be either solvent-based or water-based. When the dielectric ceramic slurry is designed as a water-based coating, it is prepared by mixing a water-soluble binder and dispersant with a water-soluble dielectric raw material.

[0067] Next, a dielectric ceramic sheet is formed (step S2). Specifically, a dielectric ceramic slurry is formed into a sheet on a carrier film using a die coater, gravure coater, or micro-gravure coater, and then dried. This forms the dielectric ceramic sheet. From the viewpoint of miniaturization and high capacitance of multilayer ceramic capacitors, the thickness of the dielectric ceramic sheet is preferably 0.4 μm or more and 0.8 μm or less.

[0068] Next, a master sheet is formed (step S3). Specifically, a conductive paste is applied to the dielectric ceramic sheet in a predetermined pattern. This forms a master sheet with a predetermined internal electrode pattern on the dielectric ceramic sheet. The conductive paste contains Ni powder, solvent, dispersant, and binder, and is adjusted to a certain viscosity. PVA or PVB is used as the binder. The application method for the conductive paste can be screen printing, inkjet printing, or gravure printing. From the viewpoint of miniaturization and high capacitance of multilayer ceramic capacitors, the thickness of the internal electrode pattern is preferably 0.3 μm or more and 0.8 μm or less. In addition to the master sheet with the internal electrode pattern, a dielectric ceramic sheet that has not undergone step S3 is also prepared as the master sheet.

[0069] Next, multiple master sheets are stacked (step S4). Specifically, a predetermined number of master sheets without internal electrode patterns, consisting only of dielectric ceramic sheets, are stacked with a thickness of, for example, 10 μm or more and 30 μm or less. A predetermined number of master sheets with internal electrode patterns are then stacked on top of these master sheets. The number of master sheets with internal electrode patterns stacked is, for example, 1 or more and 1000 or less. A predetermined number of master sheets without internal electrode patterns, consisting only of dielectric ceramic sheets, are then stacked on top of these master sheets with a thickness of, for example, 10 μm or more and 30 μm or less. This constitutes a master sheet group.

[0070] Next, a dielectric block is formed by pressing the mother sheet assembly together (step S5). Specifically, the mother sheet assembly is pressed together in the lamination direction using isostatic pressing or rigid pressing. This forms the dielectric block. At this time, the dielectric ceramic sheets are pressed together at a predetermined temperature to ensure they are tightly bonded. Furthermore, a dielectric ceramic sheet of a certain thickness is placed on the outermost layer in the lamination direction and pressed. This protects the dielectric sheet with the internal electrode pattern formed on it.

[0071] Next, the dielectric block is divided to form a chip (step S6). Specifically, the dielectric block is divided into a matrix shape by pressure cutting, dicing, or laser cutting, and then monolithically processed into multiple chips. Alternatively, the dielectric block can be divided while it is being heated and softened.

[0072] Next, the chip is fired (step S7). Specifically, the substrate 110 is formed by firing the dielectric and conductive materials contained in the chip by heating the chip. The firing temperature is set to, for example, 900°C or higher and 1300°C or lower. The firing temperature can be appropriately set corresponding to the dielectric and conductive materials.

[0073] Next, the external electrode is formed (step S8). For example... Figure 7 As shown, process S8 includes processes S81 to S83 as described below.

[0074] First, the first external electrode 120 is formed (step S81). Step S81 also includes steps S811 to S816, which are described below.

[0075] First, such as Figure 7 As shown, a conductive paste layer 51 serving as a precursor for an external electrode is formed on the plate portion 60 (step S811).

[0076] The conductive paste layer 51 is formed by layering conductive paste 53, which is a mixture of conductive particles, binders, solvents, and dispersants. The flat plate portion 60 is formed of, for example, a metallic material. The surface of the flat plate portion 60 extends in the horizontal direction. The thickness of the conductive paste layer 51 formed on the flat plate portion 60 (refer to the following discussion) is... Figure 8 The dimension H in the matrix is ​​preferably less than one-tenth of the dimension L in the length direction of the base portion 110.

[0077] Next, as Figure 7 and Figure 8 As shown, the substrate portion 110 is impregnated into the conductive paste layer 51 (step S812).

[0078] In detail, firstly, a plurality of substrate portions 110 are held by a holding portion 20 such that their respective first end faces 115 face the conductive paste layer 51. The holding portion 20 is used to hold the substrate portion 110 with one of its pair of end faces facing downward in the vertical direction. Furthermore, as discussed later... Figures 9-11 The diagram shows only one of the multiple base portions 110.

[0079] The retaining portion 20 includes a base layer 21 and an adhesive layer 22 disposed on the main surface of the base layer 21. The base layer 21 is formed of, for example, a metal material. The adhesive layer 22 is formed of, for example, silicone rubber. In this embodiment, the base portion 110 is held by the retaining portion 20 with its first end face 115 facing downward in the vertical direction by attaching the second end face 116 of the base portion 110 to the adhesive layer 22.

[0080] An actuator 23 is mounted on the holding part 20. The actuator 23 can move the holding part 20 in any direction based on a signal from the control unit 90. More specifically, the actuator 23 drives the holding part 20 to move in three orthogonal axes: the length direction L, the width direction W, and the stacking direction T. The actuator 23 is composed of, for example, a servo motor, a stepper motor, or a Robo Cylinder, but the type of actuator 23 is not particularly limited to these.

[0081] The control unit 90 is used to control the operation of the actuator 23. The control unit 90 has a CPU (Central Processing Unit) 91, a memory 92, and input / output devices (not shown) for inputting and outputting various signals as its main components.

[0082] CPU 91 is used to execute programs. Memory 92 includes ROM (Read Only Memory) and RAM (Random Access Memory). ROM stores data non-volatilely. RAM volatilely stores data generated by CPU 91 executing programs.

[0083] The various components of the control unit 90 are interconnected via a data bus. Processing in the CPU 91 is implemented using various hardware components and software executed by the CPU 91. This software is pre-stored in ROM / RAM. Power is supplied to the control unit 90 using an internal power supply (not shown) or an external power supply (not shown). For connection to an external power supply, an AC adapter (not shown) is used, for example.

[0084] The control unit 90 drives the actuator 23 to impregnate the substrate 110 from the first end face 115 toward the conductive paste layer 51 such that the first end face 115 of the substrate 110 substantially reaches the bottom 52 of the conductive paste layer 51 (see the following discussion). Figure 9 ).

[0085] The phrase "the first end face 115 approximately reaches the bottom 52" ​​not only means that the first end face 115 abuts against the surface of the flat plate portion 60, but also that the first end face 115 is positioned slightly separated from the surface of the flat plate portion 60. This is because it is also conceivable that, due to dimensional tolerances in the length direction L of the base portion 110, the first end face 115 of a portion of the multiple base portions 110 abuts against the surface of the flat plate portion 60, while the first end face 115 of the remaining multiple base portions 110 does not abut against the surface of the flat plate portion 60.

[0086] Next, as Figure 7 , Figure 9 as well as Figure 10 As shown, the substrate portion 110 moves relative to the conductive paste layer 51 in the in-plane direction of the first end face 115 (step S813).

[0087] In detail, with the substrate 110 impregnated with the conductive paste layer 51 from the first end face 115 side, the control unit 90 drives the actuator 23, thereby moving the substrate 110 in a direction from the first side face 111 toward the second side face 112. Figure 9 The arrow AR1 in the image moves relative to the conductive paste layer 51 in a manner that is relatively movable.

[0088] By impregnating the substrate portion 110 with the conductive paste layer 51 and moving the substrate portion 110 relative to the conductive paste layer 51, the conductive paste 53 is applied to a portion of the substrate portion 110.

[0089] Here, the conductive paste layer 51 is moved relative to the substrate 110 in a direction from the first side 111 toward the second side 112, so that the portion of the conductive paste layer 51 located downstream of the substrate 110 in the moving direction is extruded from the substrate 110 toward the downstream side of the moving direction.

[0090] like Figure 10 As shown, the portion of the conductive paste layer 51 extruded thus flows in a manner that elevates it downstream of the substrate portion 110 in the aforementioned direction of movement. As a result, more conductive paste layer 51 is applied to the downstream portion of the substrate portion 110 in the aforementioned direction of movement than to the upstream portion. Consequently, the conductive paste 53 is applied to the substrate portion 110 in a manner that is generally biased towards the second side surface 112 in the lamination direction T.

[0091] Here, the direction from the first side 111 toward the second side 112 is not necessarily limited to a direction orthogonal to the first side 111. As long as the conductive paste 53 is applied to the substrate portion 110 in such a way that the conductive paste 53 is biased toward the second side 112 in the lamination direction T, the direction from the first side 111 toward the second side 112 can also be a direction inclined relative to the direction orthogonal to the first side 111.

[0092] The amount of movement of the substrate portion 110 in the direction from the first side surface 111 toward the second side surface 112 is preferably greater than the dimension of the lamination direction T of the substrate portion 110. As a result, the conductive paste 53 can be sufficiently biased towards the second side surface 112 in the lamination direction T as a whole.

[0093] Next, as Figure 7 and Figure 11 As shown, the substrate 110 is lifted from the conductive paste layer 51 (process S814).

[0094] In detail, the control unit 90 drives the actuator 23, thereby moving the substrate 110 in such a way that it lifts the substrate 110 from the conductive paste layer 51 during the period when the substrate 110 moves relative to the conductive paste layer 51 in a direction from the first side 111 toward the second side 112.

[0095] Therefore, with the conductive paste layer 51 and the substrate portion 110 connected to each other by the conductive paste layer 53 stretched by the self-conductive paste layer 51, the substrate portion 110 moves relative to the conductive paste layer 51 in the direction from the first side surface 111 towards the second side surface 112, and is simultaneously lifted obliquely upward from the conductive paste layer 51 (see reference). Figure 11 (Arrow AR2 in the image).

[0096] Conductive paste 53, serving as a precursor to the base electrode layer 160 of the first external electrode 120, is applied to the first end face 115, first side face 111, second side face 112, third side face 113, and fourth side face 114 of the substrate portion 110, which is thus lifted from the conductive paste layer 51. Furthermore, by lifting the substrate portion 110 obliquely upward from the conductive paste layer 51, the conductive paste 53 can be sufficiently biased towards the second side face 112 in the lamination direction T.

[0097] Next, as Figure 7 As shown, the conductive paste 53 is sintered (step S815). Specifically, by heating the conductive paste 53, which has been applied to the first end face 115 and its surrounding area, using, for example, a drying oven, a sintered layer for constituting the base electrode layer 160 is formed. The sintering temperature is set, for example, to between 700°C and 900°C. Furthermore, the sintering temperature can be appropriately varied depending on the dielectric material and the conductive material.

[0098] Next, as Figure 7 As shown, a coating 170 is formed on the surface of the sintered layer (refer to...). Figure 4 (etc.) (process S816). Thus, a first external electrode 120 is provided on the first end face 115.

[0099] Next, as Figure 7 As shown, the base portion 110 is flipped over (step S82). Specifically, firstly, a retaining portion 20 is prepared, having a structure substantially the same as that of the retaining portion 20 used to retain the base portion 110 and being separately constructed from the retaining portion 20. Furthermore, for ease of explanation, the retaining portion 20 used to retain the base portion 110 is referred to as the first retaining portion, and the retaining portion 20 separately constructed from the first retaining portion is referred to as the second retaining portion.

[0100] Next, the second holding portion is positioned relative to the first holding portion with the adhesive layer 22 of the second holding portion facing the first external electrode 120. Then, the first holding portion is moved relative to the second holding portion so that the first holding portion and the second holding portion approach each other. As a result, the first external electrode 120 abuts against the adhesive layer 22 of the second holding portion.

[0101] Next, the first retaining part, the second retaining part, and the base part 110 are flipped together in an upside-down manner.

[0102] Next, the first holding portion is moved relative to the second holding portion in such a way that the first holding portion and the second holding portion are moved away from each other. Here, the adhesive force of the adhesive layer 22 of the second holding portion is stronger than that of the adhesive layer 22 of the first holding portion. As a result, the base portion 110 to which the first external electrode 120 is attached to the adhesive layer 22 of the second holding portion is peeled off from the adhesive layer 22 of the first holding portion.

[0103] As a result, the base portion 110 is held by the second retaining portion with the second end face 116 facing downward in the vertical direction.

[0104] Next, as Figure 7 As shown, a second external electrode 130 is formed on the second end face 116 (step S83). Step S83 also includes steps corresponding to steps S811 to S816 described above, but since the content of these steps is basically the same as that of steps S811 to S816, their description is omitted.

[0105] Next, as Figure 6 As shown, the multilayer ceramic capacitor 100 is recycled (step S9). For example, the multilayer ceramic capacitor 100 is recycled by inserting the tip of a recycling blade into the gap between the adhesive layer 22 of the second holding portion and the first external electrode 120 to remove the multilayer ceramic capacitor 100 from the second holding portion.

[0106] The multilayer ceramic capacitor 100 can be manufactured according to the manufacturing method of the multilayer ceramic capacitor of this embodiment by going through the processes described above.

[0107] Furthermore, in the method for manufacturing the multilayer ceramic capacitor of this embodiment, as described above, a retaining portion 20 including a base layer 21 and an adhesive layer 22 is used. However, it is also possible to use a retaining portion including a base layer with a plurality of through holes arranged in a grid pattern and generally cylindrical adhesive portions inserted into the plurality of through holes instead of a retaining portion 20 having such a structure.

[0108] In this case, the multiple base portions 110 are held by the holding portion by inserting the multiple adhesive portions respectively. In addition, in this case, the multilayer ceramic capacitor 100 can be transferred to the holding portion integrally formed with the holding portion or retrieved by using a pin or the like to push the multilayer ceramic capacitor 100 out of the through hole.

[0109] <C. Installation of Multilayer Ceramic Capacitors>

[0110] Figure 12 and Figure 13 These respectively indicate that there are mounted on the substrate. Figure 1 A schematic cross-sectional view showing the state of the multilayer ceramic capacitor. Next, refer to... Figure 12and Figure 13 An example of a method for mounting a multilayer ceramic capacitor 100 manufactured according to the manufacturing method of the multilayer ceramic capacitor of this embodiment onto a substrate 70 will be described.

[0111] like Figure 12 and Figure 13 As shown, when mounting the multilayer ceramic capacitor 100 onto the substrate 70, firstly, a pair of conductive pads 71 ​​are provided on the main surface of the substrate 70.

[0112] Next, the multilayer ceramic capacitor 100 is disposed on the substrate 70 such that the first external electrode 120 is located on one of the pair of pads 71 ​​and the second external electrode 130 is located on the other of the pair of pads 71. In this embodiment, the multilayer ceramic capacitor 100 is disposed on the substrate 70 such that the second side surface 112, which serves as the mounting surface, faces the main surface of the substrate 70.

[0113] Next, the multilayer ceramic capacitor 100 disposed on the substrate 70 is soldered. As a result, the multilayer ceramic capacitor 100 is fixed to the substrate 70 by means of solder 72 that wets and rises to the first external electrode 120 and the second external electrode 130.

[0114] By performing the same process on multiple stacked ceramic capacitors 100, multiple stacked ceramic capacitors 100 are arranged adjacent to each other on the substrate 70.

[0115] <D. Summary>

[0116] In the manufacturing method of the multilayer ceramic capacitor of this embodiment, as described above, when the external electrode is provided to the substrate 110, the substrate 110 is immersed in the conductive paste layer 51 from one end face side, and the substrate 110 moves relative to the conductive paste layer 51 in the direction from the first side face 111 toward the second side face 112.

[0117] Therefore, the portion of the substrate 110 located downstream in the aforementioned moving direction is coated with a greater amount of conductive paste layer 51 than the portion of the substrate 110 located upstream in the aforementioned moving direction. As a result, the first external electrode 122 and the second external electrode 132 on the side side are configured to be biased towards the second side side 112 in the stacking direction T. By configuring the stacked ceramic capacitor 100 in this way, high-density mounting can be achieved.

[0118] That is, the multilayer ceramic capacitor 100 is provided by means of solder 72 to cover the surface of the external electrode by wetting and extending it towards the external electrode, thereby fixing it to the substrate 70 by means of solder 72. As a result, it is not easy to selectively wet and extend the solder 72 only to the desired portion of the external electrode.

[0119] Therefore, when the external electrodes are provided on the substrate 110 to a required degree, the solder 72 also wets and extends into the portion of the external electrodes that is provided to a required degree, which necessitates ensuring that the area of ​​the pads 71 ​​is large enough. As a result, it is difficult to mount the multilayer ceramic capacitors 100 on the substrate 70 with high density.

[0120] In this regard, by manufacturing the multilayer ceramic capacitor 100 according to the manufacturing method of the multilayer ceramic capacitor of this embodiment, the areas of the end face side first external electrode 121 and end face side second external electrode 131 electrically connected to the inner electrode layer 118, and the area of ​​the second side side first external electrode 122b and second side side second external electrode 132b located on the second side side 112 which is the mounting surface, can be configured to be sufficiently large, while effectively suppressing the area of ​​the remaining part of the external electrode from being too large to be required.

[0121] As a result, the amount of solder 72 extending into the external electrodes is suppressed to a minimum required level, thereby suppressing the area of ​​the pads 71 ​​to a minimum required size. Therefore, in particular, the distance between the pads 71 ​​corresponding to the two adjacent stacked ceramic capacitors 100 in the width direction W (refer to...) is... Figure 13 The size w1) is significantly shortened, allowing for high-density mounting of stacked ceramic capacitors 100 in the aforementioned width direction W.

[0122] Therefore, a manufacturing method for electronic components that can achieve high-density mounting can be established by means of the above configuration.

[0123] Furthermore, in this embodiment, as described above, when the first end face 115 has approximately reached the bottom 52 of the conductive paste layer 51, the substrate portion 110 is moved relative to the conductive paste layer 51 in a direction from the first side surface 111 toward the second side surface 112. This effectively suppresses the formation of bubbles, which is the so-called bubbling, that occurs when bubbles are entrained in the gap between the first end face 115 and the first external electrode 121 on the end face side. This is because bubbles that are unexpectedly entrained in the gap are squeezed out of the gap due to the relative movement of the substrate portion 110 relative to the conductive paste layer 51.

[0124] Furthermore, in this embodiment, the following situation is illustrated: in step S814, the substrate portion 110 is lifted from the conductive paste layer 51 during the period when the substrate portion 110 moves relative to the conductive paste layer 51 in the direction from the first side surface 111 toward the second side surface 112. However, it is also possible that the substrate portion 110 is lifted from the conductive paste layer 51 after the substrate portion 110 has moved relative to the conductive paste layer 51 in the direction from the first side surface 111 toward the second side surface 112.

[0125] In addition, in this embodiment, the case in which the first side 111 and the second side 112 are opposite each other in the stacking direction T, and the third side 113 and the fourth side 114 are opposite each other in the width direction W which is orthogonal to the stacking direction T, has been described. However, it is also possible that the first side 111 and the second side 112 are opposite each other in the width direction W, and the third side 113 and the fourth side 114 are opposite each other in the stacking direction T.

[0126] Furthermore, in this embodiment, the case in which the substrate portion 110 is impregnated into the conductive paste layer 51 in such a way that the first end face 115 of the substrate portion 110 substantially reaches the bottom 52 of the conductive paste layer 51 is described. However, it is also possible that when the substrate portion 110 is impregnated into the conductive paste layer 51, the first end face 115 may not substantially reach the bottom 52.

[0127] (Modified Example)

[0128] Figure 14 This is used to illustrate the manufacturing method of the multilayer ceramic capacitor in the modified example. Figure 7 The schematic front view shows step S814 of the manufacturing process. Hereinafter, refer to... Figure 14 The manufacturing method of a multilayer ceramic capacitor based on a modified embodiment of the above-described embodiments will be described.

[0129] Compared with the method for manufacturing a multilayer ceramic capacitor in the above-described embodiment, the method for manufacturing a multilayer ceramic capacitor in this modified example differs in the direction of movement of the substrate portion 110 in step S814.

[0130] In detail, in this variation, such as Figure 14 As shown, the actuator 23 is driven by the control unit 90, so that after the substrate 110 moves relative to the conductive paste layer 51 in the direction from the first side 111 toward the second side 112, the substrate 110 is lifted vertically upward from the conductive paste layer 51 (see arrow AR3 in the figure).

[0131] After the substrate portion 110 is lifted from the conductive paste layer 51, and the conductive paste layer 51 and the substrate portion 110 are connected to each other by the conductive paste 53 stretched from the conductive paste layer 51, the substrate portion 110 is moved relative to the conductive paste layer 51 again in the direction from the first side 111 toward the second side 112 (see arrow AR4 in the figure).

[0132] By moving the substrate 110 in such a way that the conductive paste 53 is sufficiently biased toward the second side 112 in the stacking direction T.

[0133] In the manufacturing method of the multilayer ceramic capacitor in this modified example, the effects described in the above embodiments can also be obtained, and it can be set as a manufacturing method for electronic components that can achieve high-density mounting.

[0134] (appendix)

[0135] If we summarize the characteristic configuration of the method for manufacturing electronic components disclosed in the above embodiments and their variations, it is as follows.

[0136] [Appendix 1] A method for manufacturing an electronic component, the electronic component comprising: a substrate having a first end face and a second end face opposite each other in a longitudinal direction, a first side face and a second side face opposite each other in a first direction orthogonal to the longitudinal direction, and a third side face and a fourth side face opposite each other in a second direction orthogonal to the longitudinal direction and the first direction; and external electrodes respectively disposed on the first end face and the second end face, wherein the method for manufacturing the electronic component includes the following steps:

[0137] The substrate portion is impregnated with a conductive paste layer serving as the precursor of the external electrode from the side where the first end face is located.

[0138] With the substrate portion immersed in the conductive paste layer from the side where the first end face is located, the substrate portion is moved relative to the conductive paste layer in a direction from the first side face toward the second side face; and

[0139] During or after the aforementioned substrate portion moves relative to the aforementioned conductive paste layer in a direction from the aforementioned first side to the aforementioned second side, the aforementioned substrate portion is lifted from the aforementioned conductive paste layer.

[0140] [Appendix 2] The manufacturing method of the electronic component according to Appendix 1, wherein,

[0141] After the substrate portion is lifted from the conductive paste layer, with the conductive paste layer and the substrate portion connected to each other by the conductive paste stretched from the conductive paste layer, the substrate portion is moved relative to the conductive paste layer again in the direction from the first side to the second side.

[0142] [Appendix 3] A method for manufacturing electronic components according to Appendix 1 or 2, wherein,

[0143] In the process of moving the substrate portion relative to the conductive paste layer in a direction from the first side to the second side, the amount of movement of the substrate portion is greater than the dimension of the substrate portion in the first direction.

[0144] [Appendix 4] A method for manufacturing an electronic component according to any one of Appendices 1 to 3, wherein,

[0145] The thickness of the conductive paste layer is less than one-tenth of the length dimension of the substrate.

[0146] (Other methods, etc.)

[0147] In the embodiments and variations thereof described above, a multilayer ceramic capacitor was exemplified as an electronic component, and its manufacturing method was explained. However, the manufacturing method of the electronic component shown in these embodiments and variations can also be applied to, for example, the manufacturing method of a multilayer ceramic inductor or a multilayer ceramic thermistor, which are electronic components. When the electronic component is a multilayer ceramic inductor, for example, the dielectric is made of magnetic ceramic, and the internal electrodes are made of coil-shaped conductors. When the electronic component is a multilayer ceramic thermistor, for example, the dielectric layer is made of semiconductor ceramic.

[0148] Furthermore, various changes can be made to the shape, structure, size, quantity, material, etc. of each part shown in the above-described embodiments and variations of the present invention, as long as they do not depart from the spirit of the present invention.

[0149] Furthermore, the characteristic configurations shown in the above-described embodiments and variations of the present invention can naturally be combined with each other without departing from the spirit of the present invention.

[0150] Therefore, the above-disclosed embodiments and their variations are illustrative in all respects and are not restrictive. The scope of protection of this invention is defined by the claims, and also includes all modifications within the meaning and scope equivalent to the claims.

Claims

1. A method of manufacturing an electronic component, the electronic component having a base portion having a first end surface and a second end surface opposite to each other in a length direction, a first side surface and a second side surface opposite to each other in a first direction orthogonal to the length direction, and a third side surface and a fourth side surface opposite to each other in a second direction orthogonal to the length direction and the first direction, and external electrodes provided on the first end surface and the second end surface, respectively, wherein the method of manufacturing the electronic component comprises the steps of: impregnating the base portion from a side on which the first end surface is located with a conductive paste layer as a precursor of the external electrodes; relatively moving the base portion with respect to the conductive paste layer in a direction from the first side surface toward the second side surface while the base portion is impregnated with the conductive paste layer from the side on which the first end surface is located; and pulling up the base portion from the conductive paste layer during or after the relative movement of the base portion with respect to the conductive paste layer in the direction from the first side surface toward the second side surface.

2. The method of manufacturing the electronic component according to claim 1, wherein the base portion is relatively moved with respect to the conductive paste layer in the direction from the first side surface toward the second side surface again after the base portion is pulled up from the conductive paste layer in a state in which the conductive paste layer and the base portion are connected to each other by the conductive paste elongated from the conductive paste layer.

3. The method of manufacturing the electronic component according to claim 1, wherein the base portion is moved by an amount larger than a dimension of the first direction of the base portion in the step of relatively moving the base portion with respect to the conductive paste layer in the direction from the first side surface toward the second side surface.

4. The method of manufacturing the electronic component according to any one of claims 1 to 3, wherein a dimension of a thickness of the conductive paste layer is a dimension of one-tenth or less of a dimension of the length direction of the base portion. ​ ​ ​ ​ ​ ​ ​ ​

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