A vacuum hot-pressing composite sensor circuit board multilayer board lamination device

Abstract

This invention relates to the field of circuit board lamination technology, specifically to a vacuum hot-pressing composite sensor circuit board multilayer board bonding equipment. The equipment includes a frame and several pressing plates evenly distributed vertically within the frame cavity. It also includes a pushing mechanism, comprising a pushing plate movably mounted between adjacent pressing plates. The pressing plates are equipped with a moving unit for driving the pushing plate's forward and backward movement, and a flipping unit and a guiding unit for guiding the pushing plate's rotation. This invention uses the pushing plate to push the circuit boards out. When adjacent pressing plates move away from each other, the moving unit pushes the pushing plate backward, using the pushing plate to move the multilayer circuit boards pressed on the pressing plates backward. This eliminates the need for manual removal of circuit boards layer by layer from the pressing plates, facilitating the direct loading of subsequent circuit boards when the pressing plates are opened, thus improving circuit board processing efficiency.

Description

Technical Field

[0001] This invention relates to the field of circuit board lamination technology, specifically to a vacuum hot-pressing composite sensor circuit board multilayer board bonding equipment. Background Technology

[0002] The lamination process in PCB manufacturing is one of the core processes in multilayer board production. It is mainly used to bond multiple inner core boards, prepregs, and copper foils together into a single unit under high temperature and pressure. The lamination process is an irreplaceable and critical step in multilayer PCB manufacturing, directly affecting the mechanical strength, electrical performance, and reliability of the board.

[0003] Existing PCB lamination equipment requires stacking multiple layers of PCBs on a laminating plate before laminating them. A release film is used to separate the PCBs from the laminating plate to prevent adhesion. The laminating plates are then brought close together to press the PCBs together. After lamination, the laminating plates separate, and workers remove the PCBs from the plates once they are fully open. However, this process requires workers to remove each layer of PCBs from the laminating plate before placing a new PCB on it. As the number of layers increases, the time spent removing PCBs also increases, resulting in longer intervals between lamination operations and impacting PCB processing efficiency. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides a vacuum hot-pressing composite sensor circuit board multilayer board bonding device, comprising a frame and several pressing plates evenly distributed vertically within the frame cavity, and a pushing mechanism. The pushing mechanism includes a pushing plate movably mounted between two adjacent pressing plates. The pressing plates are equipped with a moving unit for driving the pushing plate to move back and forth, a flipping unit and a guiding unit for guiding the pushing plate to flip, and an adjustment unit for adjusting the height of the pushing plate is mounted on its top.

[0005] The flipping unit includes an arc-shaped frame that is movably mounted on the pressing plate and symmetrically distributed about the pusher plate. The pusher plate has a rotating shaft fixedly connected to both sides. The end of the rotating shaft away from the pusher plate rotates through to the side of the arc-shaped frame away from the pusher plate and is fixedly connected to a swing arm. The bottom end of the swing arm is rotatably connected to a rotating rod.

[0006] In one possible implementation, the moving unit includes a sliding frame fixedly connected to the top of the pressing plate and symmetrically distributed on the left and right sides. A lead screw is rotatably mounted inside the sliding frame, and a slider is threadedly connected to the outside of the lead screw. The slider is slidably connected to the sliding frame. A support seat is fixedly connected to the side of the slider near the pusher plate. The arc frame is fixedly mounted on the corresponding support seat. A drive assembly for driving the lead screw to rotate is installed between two adjacent pressing plates.

[0007] In one possible implementation, several drive components arranged vertically are staggered front to back. Each drive component includes a transmission gear that is coaxially fixedly connected to the rear of a slide frame after the rear end of a lead screw rotates through it. A rack is engaged on the side of the transmission gear away from the pusher plate. The top end of the rack is fixedly connected to the rear side of the adjacent moving unit above.

[0008] In one possible implementation, the arc-shaped frame is further equipped with a reset unit for guiding the pusher plate to rotate counterclockwise. The reset unit includes a guide groove formed on the side of the arc-shaped frame near the pusher plate. A guide block is fixedly connected to the side of the pusher plate near the arc-shaped frame. The guide block is slidably installed in the guide groove. A reset spring is fixedly connected between the rear end of the guide block and the top wall of the guide groove.

[0009] In one possible implementation, the guide unit includes a vertical plate fixedly connected to the top of the slide frame, a support rod fixedly connected to the side of the vertical plate near the corresponding push plate, and a diagonal brace hinged to the rear end of the support rod, the rear end of the diagonal brace being inclined downward and abutting against the top of the slide frame.

[0010] In one possible implementation, the adjustment unit includes a movable plate that is slidably mounted on a pusher plate. The pusher plate has a plurality of grooves that are equidistantly distributed on the rear side. The bottom of the movable plate is fixedly connected to a plurality of sliding plates that correspond one-to-one with the grooves. The sliding plates are slidably connected to the corresponding grooves. The pusher plate is equipped with a drive unit for moving the movable plate up and down.

[0011] In one possible implementation, the drive unit includes a threaded rod rotatably mounted on a movable plate, the bottom end of which extends through the lower part of the movable plate and is threadedly connected to a pusher plate, and the top end of the threaded rod rotatably extends through the upper part of the movable plate and is fixedly connected to a knob.

[0012] In one possible implementation, a gap is reserved between the bottom of the pusher plate and the top of the corresponding pressing plate, the height of the gap being less than the thickness of a single-layer circuit board, and a plurality of rollers distributed left and right are rotatably mounted on the bottom of the pusher plate.

[0013] In one possible implementation, a conveying mechanism is also installed on the rear side of the frame. The conveying mechanism includes a support frame disposed on the rear side of the frame window, on which a plurality of conveyor belts corresponding one-to-one with the pressing plates are installed. The conveyor belts are located on the rear side of the pressing plates.

[0014] The beneficial effects of this invention are as follows: 1. This invention uses a pusher plate to push the circuit board out of the press. When two adjacent pressing plates are close to each other, the moving unit drives the pusher plate forward to the front of the pressing plate. When two adjacent pressing plates are far apart, the moving unit pushes the pusher plate backward. The pusher plate pushes the multi-layer circuit board that has been pressed on the pressing plate backward. When the pressing plate is fully opened, the circuit board is also completely removed from the pressing plate. It is not necessary to manually remove the circuit board layer by layer from the pressing plate. This makes it convenient to directly load the subsequent circuit boards when the pressing plate is fully opened, thus improving the processing efficiency of the circuit board.

[0015] 2. The rotating unit and the guiding unit of this invention cooperate to rotate the pusher plate. When the pusher plate moves forward, the swing arm rotates clockwise under the guidance of the guiding unit. The swing arm drives the pusher plate to rotate clockwise, so that a certain distance is reserved between the pusher plate and the pressing plate to avoid the pusher plate touching the stacked circuit board when it moves forward. When the pusher plate moves to the front of the pressing plate, the swing arm is no longer guided by the guiding unit, so that the pusher plate rotates counterclockwise to a vertical state, which facilitates the subsequent pushing and unloading of the circuit board. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural schematic diagram of the first angle of the present invention.

[0017] Figure 2 This is a three-dimensional structural schematic diagram of the second angle of the present invention.

[0018] Figure 3 This is a three-dimensional structural diagram of the feeding mechanism of the present invention.

[0019] Figure 4 This is a three-dimensional structural diagram of the moving unit of the present invention.

[0020] Figure 5 This is a breakdown diagram of the flipping unit of the present invention.

[0021] Figure 6 This is a three-dimensional structural diagram of the guiding unit of the present invention.

[0022] Figure 7 This is a three-dimensional structural schematic diagram of the adjustment unit of the present invention.

[0023] Figure 8 This is a motion diagram of the pusher plate of the present invention.

[0024] In the diagram: 1. Frame; 2. Pressing plate; 3. Pushing mechanism; 31. Pushing plate; 32. Moving unit; 321. Sliding frame; 322. Lead screw; 323. Sliding block; 324. Support base; 325. Drive assembly; 3251. Transmission gear; 3252. Rack; 33. Tilting unit; 331. Arc frame; 332. Rotating shaft; 333. Guide groove; 334. Guide block; 335. Return spring; 336. Swing arm; 337. Rotating rod; 34. Guide unit; 341. Vertical plate; 342. Support rod; 343. Diagonal brace; 35. Adjustment unit; 351. Movable plate; 352. Slide groove; 353. Slide plate; 354. Threaded rod; 355. Knob; 36. Roller; 4. Conveying mechanism; 41. Support frame; 42. Conveyor belt. Detailed Implementation

[0025] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described below, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0026] Please see Figure 1 - Figure 4 A vacuum hot-press composite sensor circuit board multilayer board bonding equipment includes a frame 1 and several pressing plates 2 evenly distributed in the inner cavity of the frame 1. It also includes a pushing mechanism 3, which includes a pushing plate 31 that is movably installed between two adjacent pressing plates 2. The pressing plates 2 are equipped with a moving unit 32 for driving the pushing plate 31 to move back and forth. The pressing plates 2 are also equipped with a flipping unit 33 and a guiding unit 34 for guiding the pushing plate 31 to flip. The top of the pushing plate 31 is equipped with an adjusting unit 35 for adjusting its height.

[0027] Please see Figure 3 - Figure 5 The flipping unit 33 includes an arc-shaped frame 331 that is movably mounted on the pressing plate 2 and symmetrically distributed about the pusher plate 31. The left and right sides of the pusher plate 31 are fixedly connected to a rotating shaft 332. The end of the rotating shaft 332 away from the pusher plate 31 rotates through to the side of the arc-shaped frame 331 away from the pusher plate 31 and is then fixedly connected to a swing arm 336. The bottom end of the swing arm 336 is rotatably connected to a rotating rod 337.

[0028] Please see Figure 1 - Figure 8In practical use, when the pressing plates 2 are completely separated, the pusher plate 31 moves to the rear side of the pressing plates 2 to avoid blocking the pressing plates 2 and to facilitate the placement of circuit boards on the pressing plates 2. When the pressing plates 2 are close to each other, the moving unit 32 drives the arc frame 331 and the pusher plate 31 to move forward. When the pusher plate 31 moves to the guide unit 34, the guide unit 34 guides the swing arm 336 to rotate clockwise. The swing arm 336 drives the pusher plate 31 to rotate clockwise backward, so that the bottom of the pusher plate 31 is kept at a certain distance from the top of the pressing plates 2. The pusher plate 31 moves forward from above the circuit boards to avoid touching the stacked circuit boards and causing the circuit boards to shift.

[0029] When the pusher plate 31 moves to the front of the pressing plate 2, the guide unit 34 no longer guides the swing arm 336. At this time, the pusher plate 31 can deflect counterclockwise downward under its own gravity, so that the pusher plate 31 returns to the vertical state. Then, the adjacent pressing plates 2 perform hot pressing composite on the circuit board. After pressing is completed, the adjacent pressing plates 2 separate from each other. At this time, the moving unit 32 drives the arc frame 331 and the pusher plate 31 to move backward. The pusher plate 31 pushes the circuit board on the pressing plate 2 to move backward and push it out. There is no need to manually remove the circuit board from the pressing plate 2 layer by layer, which improves the processing efficiency of the circuit board.

[0030] Please see Figure 3 , Figure 4 and Figure 6 The moving unit 32 includes a sliding frame 321 fixedly connected to the top of the pressing plate 2 and symmetrically distributed on the left and right. The front end of the sliding frame 321 extends to the front of the pressing plate 2. A lead screw 322 is rotatably installed inside the sliding frame 321. A slider 323 is threadedly connected to the outside of the lead screw 322. The slider 323 is slidably connected to the sliding frame 321. A support base 324 is fixedly connected to the side of the slider 323 near the pusher plate 31. An arc frame 331 is fixedly installed on the corresponding support base 324. A drive assembly 325 for driving the lead screw 322 to rotate is installed between two adjacent pressing plates 2.

[0031] Please see Figure 3 - Figure 6 Several drive components 325 arranged vertically are staggered. Each drive component 325 includes a transmission gear 3251 that is coaxially fixedly connected to the rear end of a lead screw 322 that rotates through to the rear of a slide frame 321. A rack 3252 is meshed on the side of the transmission gear 3251 away from the pusher plate 31. The top end of the rack 3252 is fixedly connected to the rear side of the adjacent moving unit 32 above.

[0032] In practical use, when two adjacent moving units 32 approach each other, the pressing plate 2 drives the rack 3252 to move downward relative to the transmission gear 3251. The rack 3252 drives the transmission gear 3251 to rotate, and the transmission gear 3251 drives the lead screw 322 to rotate, so that the lead screw 322 drives the slider 323 and the support seat 324 to move forward, and the support seat 324 drives the arc frame 331 and the pusher plate 31 to move forward.

[0033] When two adjacent moving units 32 move away from each other, the pressing plate 2 drives the rack 3252 to move upward relative to the transmission gear 3251, causing the rack 3252 to drive the transmission gear 3251 to rotate in the opposite direction. The transmission gear 3251 then drives the lead screw 322 to rotate in the opposite direction, causing the lead screw 322 to drive the slider 323 and the support seat 324 to move backward. This causes the support seat 324 to drive the arc frame 331 and the pusher plate 31 to move backward, and the pusher plate 31 to push the circuit board backward off the pressing plate 2.

[0034] The opening and closing of the pressing plate 2 drives the lead screw 322 to rotate, so that the pusher plate 31 can move forward or backward with the opening and closing of the pressing plate 2, which improves the fit between the pusher plate 31 and the pressing plate 2. Before the pressing plate 2 presses the circuit board, the pusher plate 31 is moved out from between two adjacent pressing plates 2 to avoid the pressing plate 2 clamping the pusher plate 31.

[0035] By staggering the drive assembly 325, when the pressing plates 2 approach each other, the upper rack 3252 can move up and down behind the lower rack 3252, avoiding the two adjacent racks 3252 from colliding and ensuring the normal movement of the rack 3252.

[0036] Please see Figure 4 , Figure 5 and Figure 8 The arc frame 331 is also equipped with a reset unit for guiding the pusher plate 31 to rotate counterclockwise. The reset unit includes a guide groove 333 opened on the side of the arc frame 331 near the pusher plate 31. A guide block 334 is fixedly connected to the side of the pusher plate 31 near the arc frame 331. The guide block 334 is slidably installed in the guide groove 333. A reset spring 335 is fixedly connected between the rear end of the guide block 334 and the top wall of the guide groove 333.

[0037] In practical use, when the pusher plate 31 rotates, it drives the guide block 334 to rotate together. The guide groove 333 guides and limits the guide block 334, which can prevent the pusher plate 31 from shaking when rotating and improve the stability of the pusher plate 31 when rotating. When the pusher plate 31 pushes the circuit board backward, the bottom end of the guide groove 333 can block the guide block 334 to prevent the pusher plate 31 from continuing to rotate forward, so that the pusher plate 31 can maintain a vertical state, which makes it easier for the pusher plate 31 to push the circuit board out.

[0038] When the pusher plate 31 moves forward, the guide block 334 rotates clockwise along the guide groove 333. At this time, the reset spring 335 is compressed and contracts. When the pusher plate 31 moves to the front of the pressing plate 2, the guide unit 34 no longer guides the swing arm 336. At this time, the rebound force of the reset spring 335 pushes the guide block 334 and the pusher plate 31 to deflect counterclockwise downward, so that the pusher plate 31 is reset to the vertical state, which facilitates the subsequent pushing and unloading of the circuit board.

[0039] Please see Figure 3 , Figure 4 , Figure 6 and Figure 8 The guide unit 34 includes a vertical plate 341 fixedly connected to the top of the slide frame 321. The front end of the vertical plate 341 is flush with the front side of the pressing plate 2. A support rod 342, which is placed horizontally in front and behind, is fixedly connected to the side of the vertical plate 341 near the corresponding push plate 31. A diagonal brace 343 is hinged to the rear end of the support rod 342. The rear end of the diagonal brace 343 is inclined downward and abuts against the top of the slide frame 321.

[0040] In practical use, when the pusher plate 31 moves to the rear of the pressing plate 2, the rotating rod 337 is located behind the support rod 342. When the arc frame 331 and the pusher plate 31 move forward, the arc frame 331 drives the swing arm 336 and the rotating rod 337 to move forward together. When the rotating rod 337 contacts the inclined support rod 343, the inclined support rod 343 guides the rotating rod 337 and the swing arm 336 to deflect clockwise, thereby driving the pusher plate 31 to flip clockwise backward. Then the rotating rod 337 moves along the inclined support rod 343 to the top of the support rod 342. As the arc frame 331 and the pusher plate 31 continue to move forward, the rotating rod 337 rolls forward along the top of the support rod 342. The support rod 342 supports the rotating rod 337, keeping the pusher plate 31 in a flipped and lifted state, preventing the pusher plate 31 from contacting the circuit board stacked on the pressing plate 2.

[0041] When the pusher plate 31 moves to the front of the pressing plate 2, the support rod 342 no longer supports the rotating rod 337. At this time, the swing arm 336 will drive the pusher plate 31 to rotate counterclockwise downwards, so that the pusher plate 31 can return to a vertical state. At this time, the height of the rotating rod 337 is lower than the height of the corresponding support rod 342. When the arc frame 331 drives the pusher plate 31 and the swing arm 336 to move backwards, the rotating rod 337 moves backwards from below the support rod 342. When 337 moves to the diagonal brace 343, the rotating rod 337 pushes the diagonal brace 343 to rotate clockwise backward, thereby opening the bottom of the diagonal brace 343, so that the rotating rod 337 can move from the bottom of the diagonal brace 343 to the rear side of the diagonal brace 343. When the rotating rod 337 separates from the diagonal brace 343, the diagonal brace 343 can rotate counterclockwise downward under its own weight, so that the bottom end of the diagonal brace 343 abuts against the top of the slide frame 321 again.

[0042] By setting the rotating rod 337, when the swing arm 336 moves to the diagonal brace 343 and the support rod 342, the rotating rod 337 rolls along the surface of the diagonal brace 343 and the support rod 342, which can reduce friction and avoid wear after long-term use.

[0043] Please see Figure 3 , Figure 4 and Figure 7 The adjustment unit 35 includes a movable plate 351 that is slidably mounted on the pusher plate 31. The rear side of the pusher plate 31 is provided with a plurality of grooves 352 that are equidistantly distributed from left to right. The bottom of the movable plate 351 is fixedly connected with a plurality of sliding plates 353 that correspond one-to-one with the grooves 352. The sliding plates 353 are slidably connected to the corresponding grooves 352. The rear sides of the pusher plate 31, the movable plate 351 and the sliding plates 353 are flush. The pusher plate 31 is equipped with a drive unit for driving the movable plate 351 to move up and down.

[0044] Please see Figure 7 The drive unit includes a threaded rod 354 rotatably mounted on a movable plate 351. The bottom end of the threaded rod 354 passes through the lower part of the movable plate 351 and is threadedly connected to the pusher plate 31. The top of the threaded rod 354 rotatably passes through the upper part of the movable plate 351 and is fixedly connected to a knob 355.

[0045] In practical use, when it is necessary to push circuit boards of different heights, rotating the knob 355 drives the threaded rod 354 to rotate, and the threaded rod 354 drives the movable plate 351 to move up and down, which can adjust the height of the push plate 31, making it convenient to push circuit boards of different heights out.

[0046] By setting a sliding plate 353 to block the gap between the pusher plate 31 and the movable plate 351, when the movable plate 351 separates from the pusher plate 31, the sliding plate 353 can block the gap between the pusher plate 31 and the movable plate 351, preventing the circuit board at the gap from not being effectively pushed; since the rear sides of the pusher plate 31, the movable plate 351 and the sliding plate 353 are flush, it can be ensured that the upper and lower circuit boards remain aligned during the process of pushing the circuit board, and the circuit board is prevented from being tilted.

[0047] Please see Figure 4 and Figure 7 A gap is reserved between the bottom of the pusher plate 31 and the top of the corresponding pressing plate 2. The height of the gap is less than the thickness of the single-layer circuit board. Several rollers 36 distributed on the left and right are rotatably installed on the bottom of the pusher plate 31.

[0048] In practical use, by leaving a gap between the pusher plate 31 and the pressing plate 2, friction can be avoided during the back-and-forth movement of the pusher plate 31, which helps to maintain the flatness of the surface of the pressing plate 2. The roller 36 can roll on the surface of the pressing plate 2 when the pusher plate 31 moves backward. The roller 36 supports the pusher plate 31 and avoids friction between the pusher plate 31 and the pressing plate 2.

[0049] Please see Figure 2 A conveying mechanism 4 is also installed on the rear side of the frame 1. The conveying mechanism 4 includes a support frame 41 located on the rear side of the window of the frame 1. Several conveyor belts 42 corresponding to the pressing plate 2 are installed on the support frame 41. The conveyor belts 42 are located on the rear side of the pressing plate 2.

[0050] In practical use, the circuit board that is pushed backward will move backward onto the corresponding conveyor belt 42 to prevent the circuit board from falling. Then, the conveyor belt 42 will transport the circuit board backward to the subsequent processing steps, thereby improving the processing efficiency of the circuit board.

[0051] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," "installed," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, an integral connection, or a sliding connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0052] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made based on the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A vacuum thermoforming composite sensor circuit board multilayer board bonding equipment, comprising a frame (1) and a plurality of pressing plates (2) equally spaced vertically within the cavity of the frame (1), characterized in that: It also includes a pushing mechanism (3), which includes a pushing plate (31) that is movably installed between two adjacent pressing plates (2). The pressing plate (2) is equipped with a moving unit (32) for driving the pushing plate (31) to move back and forth. The pressing plate (2) is also equipped with a flipping unit (33) and a guiding unit (34) for guiding the pushing plate (31) to flip. The top of the pushing plate (31) is equipped with an adjusting unit (35) for adjusting its height. The flipping unit (33) includes an arc-shaped frame (331) that is movably mounted on the pressing plate (2) and symmetrically distributed about the pusher plate (31). The pusher plate (31) is fixedly connected to the left and right sides of the pusher plate (31) with a rotating shaft (332). The end of the rotating shaft (332) away from the pusher plate (31) rotates through to the side of the arc-shaped frame (331) away from the pusher plate (31) and is fixedly connected to a swing arm (336). The bottom end of the swing arm (336) is rotatably connected to a rotating rod (337). When two adjacent pressing plates (2) approach each other, the moving unit (32) drives the pusher plate (31) to move forward to the front side of the pressing plate (2). When two adjacent pressing plates (2) move away from each other, the moving unit (32) pushes the pusher plate (31) to move backward. The pusher plate (31) pushes the multilayer circuit board that has been pressed on the pressing plate (2) to move backward. When the pressing plate (2) is fully opened, the circuit board is also moved out of the pressing plate (2).

2. The vacuum hot-pressing composite sensor circuit board multilayer board bonding equipment according to claim 1, characterized in that: The moving unit (32) includes a sliding frame (321) fixedly connected to the top of the pressing plate (2) and symmetrically distributed on the left and right. A lead screw (322) is rotatably installed inside the sliding frame (321). A slider (323) is threadedly connected to the outside of the lead screw (322). The slider (323) is slidably connected to the sliding frame (321) back and forth. A support seat (324) is fixedly connected to the side of the slider (323) near the pusher plate (31). The arc frame (331) is fixedly installed on the corresponding support seat (324). A drive assembly (325) for driving the lead screw (322) to rotate is installed between two adjacent pressing plates (2).

3. The vacuum thermoforming composite sensor circuit board multilayer board bonding equipment according to claim 2, characterized in that: Several drive components (325) arranged vertically are staggered. Each drive component (325) includes a transmission gear (3251) that is rotatably connected to the rear of a slide frame (321) and is coaxially fixed. A rack (3252) is engaged on the side of the transmission gear (3251) away from the pusher plate (31). The top of the rack (3252) is fixedly connected to the rear side of the adjacent moving unit (32) above.

4. The vacuum thermoforming composite sensor circuit board multilayer board bonding equipment according to claim 1, characterized in that: The arc frame (331) is also equipped with a reset unit for guiding the pusher plate (31) to rotate counterclockwise. The reset unit includes a guide groove (333) opened on the side of the arc frame (331) near the pusher plate (31). A guide block (334) is fixedly connected to the side of the pusher plate (31) near the arc frame (331). The guide block (334) is slidably installed in the guide groove (333). A reset spring (335) is fixedly connected between the rear end of the guide block (334) and the top wall of the guide groove (333).

5. The vacuum hot-pressing composite sensor circuit board multilayer board bonding equipment according to claim 2, characterized in that: The guide unit (34) includes a vertical plate (341) fixedly connected to the top of the slide frame (321). A support rod (342) is fixedly connected to the side of the vertical plate (341) near the corresponding push plate (31). A diagonal brace (343) is hinged to the rear end of the support rod (342). The rear end of the diagonal brace (343) is inclined downward and abuts against the top of the slide frame (321).

6. The vacuum thermoforming composite sensor circuit board multilayer board bonding equipment according to claim 1, characterized in that: The adjustment unit (35) includes a movable plate (351) that is slidably mounted on the pusher plate (31). The pusher plate (31) has several grooves (352) that are equidistantly distributed on the rear side. The bottom of the movable plate (351) is fixedly connected to several sliding plates (353) that correspond one-to-one with the grooves (352). The sliding plates (353) are slidably connected to the corresponding grooves (352) in the upper and lower directions. The pusher plate (31) is equipped with a drive unit for moving the movable plate (351) up and down.

7. The vacuum thermoforming composite sensor circuit board multilayer board bonding equipment according to claim 6, characterized in that: The drive unit includes a threaded rod (354) rotatably mounted on a movable plate (351). The bottom end of the threaded rod (354) passes through the lower part of the movable plate (351) and is threadedly connected to the pusher plate (31). The top of the threaded rod (354) rotatably passes through the upper part of the movable plate (351) and is fixedly connected to a knob (355).

8. The vacuum thermoforming composite sensor circuit board multilayer board bonding equipment according to claim 1, characterized in that: A gap is reserved between the bottom of the pusher plate (31) and the top of the corresponding pressing plate (2). The height of the gap is less than the thickness of the single-layer circuit board. Several rollers (36) distributed on the left and right are rotatably installed on the bottom of the pusher plate (31).

9. The vacuum thermoforming composite sensor circuit board multilayer board bonding equipment according to claim 1, characterized in that: A conveying mechanism (4) is also installed on the rear side of the frame (1). The conveying mechanism (4) includes a support frame (41) set on the rear side of the window of the frame (1). Several conveyor belts (42) corresponding to the pressing plate (2) are installed on the support frame (41). The conveyor belts (42) are located on the rear side of the pressing plate (2).

Images