Full-automatic novel coating production line and production process flow thereof
By designing a fully automated new coating production line and coating tank, the problem of controlling thickness and uniformity on high-end fine lines using traditional electroplating technology has been solved. This has enabled highly efficient and automated coating production, improved production efficiency and electroplating uniformity, and reduced energy consumption and costs.
Patent Information
- Application Number
- CN202511466292.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-14
- Publication Date
- 2026-01-09
AI Technical Summary
Traditional electroplating technology struggles to meet the thickness and uniformity requirements of high-end precision circuits. Manual operation is inefficient and costly, and existing photosensitive film processing technology is energy-intensive and has a low degree of automation.
A fully automated new coating production line was designed, which uses automated equipment for PCB coating processing. It includes multiple washing areas, robotic arms for loading and unloading, and side spray pipes and bottom spray pipes in the coating tank. Combined with servo motor drive and lifting device, it can achieve rapid positioning and control of electroplating uniformity.
It achieves efficient and automated coating production, reduces manual labor intensity, increases production capacity and positioning accuracy, is suitable for PCBs of different sizes and thicknesses, and reduces energy consumption and costs.
Smart Images

Figure CN121295291A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electroplating, in particular to a full-automatic novel coating production line and a production process thereof. BACKGROUND
[0002] Traditional electroplating has two ways:
[0003] 1. Silk screen coating: for ordinary PCB single-sided and double-sided boards, the dry film is pressed on the surface of the circuit board by a film pressing device. Since the dry film material is relatively thick, it is difficult to meet the requirements on high-end fine lines. The silk screen printing machine is difficult to achieve full automation, and the production capacity is low. The front and back of the silk screen coated board needs to be coated twice, the efficiency is low, and the uniformity of manual operation is difficult to guarantee. The ink utilization rate of silk screen printing is low, and the cost is high.
[0004] 2. Coating machine with drying: for multi-layer boards above four layers, the coating machine is used to coat the photosensitive ink, and the photosensitive film is formed after drying, and then the electronic circuit is exposed. The liquid photosensitive ink is uniformly and quantitatively coated on the circuit by the coating device. Since the thickness and uniformity of the mechanical coating cannot be better controlled, it is difficult to meet the requirements on high-end fine lines, and the energy consumption is high.
[0005] For the processing method of photosensitive film in the board, it is mainly divided into dry film and wet film two processes:
[0006] I. Dry film processing flow
[0007] 1. Preparation before film pasting: The copper surface of the copper-clad plate needs to be polished to brightness with sandpaper to ensure that there is no oxidation layer; the photosensitive dry film needs to tear off the protective film and peel off with the aid of transparent glue to avoid air bubbles.
[0008] 2. Film pasting and exposure: The copper plate needs to be preheated (50-80 DEG C) when pasting the film, and the pressing temperature is controlled at 110-130 DEG C; the exposure time is adjusted according to the light intensity (about 12 minutes for a daylight lamp), and a negative film paper needs to be used.
[0009] 3. Development and etching: The developing solution is 1:100 sodium carbonate solution, and the unexposed part is dissolved to form a circuit pattern; etching uses ferric chloride or environmentally friendly etching agent to remove the exposed copper layer.
[0010] II. Wet film processing flow
[0011] 1. Coating photosensitive ink: evenly coat the photosensitive blue ink on the copper-clad plate and dry.
[0012] 2. Exposure and development: UV lamp irradiation for about 100 seconds (8W lamp tube 80mm away from the plate); after development, sodium hydroxide solution is used to remove the film. SUMMARY
[0013] The application aims to provide a full-automatic novel coating production line and a production process thereof.
[0014] To achieve the above-mentioned purpose, the application adopts the following technical scheme:
[0015] The full-automatic novel coating production line comprises a plate entering track, an oil removing area, a first hot water washing area, a second hot water washing area, a first water washing area, a second water washing area, a micro-etching area, a third water washing area, a fourth water washing area, a first DI water washing area, a second DI water washing area, a first blow-drying area, a coating tank, a recycled water washing area, a third hot water washing area, a fifth water washing area, a second blow-drying area, and a clamp blow-drying area.
[0016] As a preferred technical scheme, the rear of the first blow-drying area is connected with a horizontal discharging section, the horizontal discharging section is located at the inner side of the first plate feeding mechanical arm, the rear of the horizontal discharging section is connected with an automatic feeding section, and the second plate feeding mechanical arm is located at the outer side of the automatic feeding section.
[0017] As a preferred technical scheme, the front of the coating tank is connected with a coating entering buffer section, and the rear of the coating tank is connected with a coating discharging buffer section.
[0018] As a preferred technical scheme, the rear of the second blow-drying area is connected with the first cross-tank section, and the automatic discharging area is arranged between the rear of the second blow-drying area and the first cross-tank section, and the first plate discharging mechanical arm and the second plate discharging mechanical arm are respectively arranged at the front end outer side and the rear end outer side of the automatic discharging area.
[0019] As a preferred technical solution, the first cross-tank section is connected with a clamp stripping area, the rear of the clamp stripping area is sequentially connected with a first return water washing area, a second return water washing area and a third return water washing area, and the third return water washing area is connected in front of the clamp blow-drying area.
[0020] As a preferred technical solution, the second cross-tank section and the clamp blow-drying area are provided with a sub-tank, the sub-tank is communicated with the film plating tank, the front end of the sub-tank is connected with a first temporary storage area, and the rear end of the sub-tank is connected with a second temporary storage area.
[0021] A production process of a full-automatic novel film plating production line comprises the following steps:
[0022] (1) The PCB is horizontally placed at the front end of the inboard track and conveyed backward by the inboard track;
[0023] (2) The PCB is degreased in the oil removal area, and the degreased PCB is cleaned by hot water in the first hot water washing area and the second hot water washing area;
[0024] (3) The PCB cleaned by hot water is washed by ordinary water in the first water washing area and the second water washing area;
[0025] (4) The PCB is micro-etched, and the micro-etched PCB is washed by ordinary water again in the third water washing area and the fourth water washing area;
[0026] (5) The PCB is washed by DI water in the first DI water washing area and the second DI water washing area, and the PCB washed by DI water needs to be blown dry in the first blow-drying area;
[0027] (6) The first loading manipulator places the PCB on the hanger of the horizontal outboard track, the horizontal outboard track moves the PCB into the automatic loading section, and the PCB is centered by plate beating in the automatic loading section;
[0028] (7) The second loading manipulator places the hanger with the PCB into the film plating in-buffer section, pure water is sprayed in the film plating in-buffer section, then the PCB is soaked for electroplating by the film plating tank, and pure water is sprayed in the film plating out-buffer section after the electroplating is completed;
[0029] (8) The PCB is washed by recovered water in the recovered water washing area, the PCB is cleaned by hot water in the third hot water washing area, and the PCB is washed by ordinary water in the fifth water washing area;
[0030] (9) The PCB enters the second blow-drying area for strong hot air blow-drying, then the first unloading manipulator grabs the hanger together with the PCB to enter the automatic unloading section, the second unloading manipulator takes the PCB off the hanger, and the hanger returns to the horizontal discharge section for recycling.
[0031] As a preferred technical solution, in (7), the side spray pipe and the bottom spray pipe arranged in the plating tank spray the PCB, the two sides of the plating tank are provided with cathode mesh boxes, copper balls are placed in the cathode mesh boxes to form cathodes, the PCB forms an anode, and a lifting device is arranged below the inside of the plating tank, the lifting device controls the up-down movement of the floating frame to block the power line at the lower end of the PCB.
[0032] As a preferred technical solution, in (9), the hanger enters the clamp stripping area after passing through the first cross-tank section, the film stripping and high-pressure jet immersion stripping are performed in the clamp stripping area, then the hanger is washed in the first return water washing area, the second return water washing area and the third return water washing area in turn, and then the hanger is subjected to strong wind blow-drying in the clamp blow-drying area.
[0033] As a preferred technical solution, in (9), after the hanger is subjected to blow-drying in the clamp blow-drying area, the hanger passes through the first temporary storage area and the second temporary storage area, and then is transferred back to the horizontal discharge section by the second cross-tank section for recycling.
[0034] The beneficial effects of the present application are as follows:
[0035] 1. The present application provides a full-automatic novel plating film production line, which moves the PCB horizontally before plating, and sequentially processes oil removal, micro-etching and blow-drying, has good processing effect and high production capacity; the loading and unloading are both handled by manipulators, realizing automatic loading and unloading with high efficiency; the driving device on the production line adopts multiple servo motors, which can realize rapid lifting, rapid pushing and accurate positioning with small error; the bottom spray pipe and the side spray pipe are specially used for combined spraying in the plating tank, the switching mode is adapted to different PCB plating processes; the special hanger is automatically adjusted during the vertical movement of the PCB, which is applicable to different size plates and thin plates with different thicknesses without replacing the hanger, and has strong production capacity; data collection can be performed throughout the process according to requirements; monitoring is installed in key areas for convenient supervision and viewing.
[0036] 2. The present application provides a production process flow of a full-automatic novel plating film production line, which automatically electroplates the PCB with photosensitive film, has low labor requirement, high automation degree, can realize informatization, and realizes accurate positioning by servo application. BRIEF DESCRIPTION OF DRAWINGS
[0037] The present application will be further described in detail below according to the drawings and examples.
[0038] Figure 1The whole structure diagram of a new type of full-automatic coating production line (the direction is counterclockwise rotation 90°) as described in the embodiment;
[0039] Figure 2 The side view of a new type of full-automatic coating production line as described in the embodiment;
[0040] Figure 3 The perspective structure diagram of a moving support as described in the embodiment;
[0041] Figure 4 The first partial structure diagram of a moving support as described in the embodiment;
[0042] Figure 5 The second partial structure diagram of a moving support as described in the embodiment;
[0043] Figure 6 The whole structure diagram of a coating tank as described in the embodiment;
[0044] Figure 7 The sectional view of a coating tank as described in the embodiment;
[0045] Figure 8 The side view of a coating tank as described in the embodiment;
[0046] Figure 9 The internal perspective view of a coating tank as described in the embodiment.
[0047] Figures 1 to 9 In the middle:
[0048] 1, plate entering track; 2, oil removing area; 3, first hot water washing area; 4, second hot water washing area; 5, first water washing area; 6, second water washing area; 7, micro-etching area; 8, third water washing area; 9, fourth water washing area; 10, first DI water washing area; 11, second DI water washing area; 12, first blow-drying area; 13, horizontal discharging section; 14, automatic feeding section; 15, coating entering buffer section; 16, coating tank; 17, coating exiting buffer section; 18, recycling water washing area; 19, third hot water washing area; 20, fifth water washing area; 21, second blow-drying area; 22, automatic discharging area; 23, clamp stripping area; 24, first returning water washing area; 25, second returning water washing area; 26, third returning water washing area; 27, clamp blow-drying area; 28, first temporary storage area; 29, second temporary storage area; 30, first feeding mechanical arm; 31, second feeding mechanical arm; 32, first discharging mechanical arm; 33, second discharging mechanical arm; 34, first cross-tank section; 35, second cross-tank section; 36, auxiliary tank; 37, moving support;
[0049] 1601. Coating tank; 1602. Overflow box; 1603. Cathode mounting plate; 1604. Side spray pipe; 1605. Bottom spray pipe; 1606. Locking position; 1607. Overflow hole; 1608. Locking slot; 1609. Overflow outlet;
[0050] 3701, Servo motor; 3702, Synchronous sprocket; 3703, Synchronous belt pulley; 3704, Synchronous gear; 3705, Synchronous rod; 3706, Lifting vehicle; 3707, Guide wheel; 3708, Cylinder; 3709, Synchronous rack; 3710, Guide rail. Detailed Implementation
[0051] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0052] like Figures 1 to 9 As shown in this embodiment, a fully automated novel coating production line includes an infeed track 1, an oil removal zone 2, a first hot water wash zone 3, a second hot water wash zone 4, a first water wash zone 5, a second water wash zone 6, a micro-etching zone 7, a third water wash zone 8, a fourth water wash zone 9, a first DI water wash zone 10, a second DI water wash zone 11, a first drying zone 12, a coating tank 16, a recovery water wash zone 18, a third hot water wash zone 19, a fifth water wash zone 20, a second drying zone 21, and a fixture drying zone 27. The oil removal zone 2 is located at the front end of the infeed track 1. The first hot water wash zone 3 and the second hot water wash zone 4 are sequentially connected to the rear of the oil removal zone 2. The first water wash zone 5 and the second water wash zone 6 are sequentially arranged between the second hot water wash zone 4 and the micro-etching zone 7. The third water wash zone 8 and the fourth water wash zone 9 are sequentially connected to the front end of the infeed track 1. Following the micro-etching area 7, the first DI water washing area 10 and the second DI water washing area 11 are located in front of the first drying area 12. A first loading robot 30 is located on the outer side of the rear end of the board entry track 1. A second loading robot 31 is located in front of the coating tank 16. The recycling water washing area 18 is connected to the rear of the coating tank 16. The third hot water washing area 19 and the fifth water washing area 20 are connected sequentially between the recycling water washing area 18 and the second drying area 21. The rear end of the second drying area 21 is connected to the first cross-slot section 34. A first unloading robot 32 and a second unloading robot 33 are located on the outer side between the second drying area 21 and the first cross-slot section 34. The first cross-slot section 34 is connected to the front of the fixture drying area 27. A second cross-slot section 35 is connected between the rear of the fixture drying area 27 and the rear of the first drying area 12.
[0053] More specifically, in terms of structure, a horizontal discharge section 13 is connected to the rear of the first drying area 12. The horizontal discharge section 13 is located inside the first loading robot 30. An automatic loading section 14 is connected to the rear of the horizontal discharge section 13, and a second loading robot 31 is located outside the automatic loading section 14. A coating inlet buffer section 15 is connected to the front of the coating tank 16, and a coating outlet buffer section 17 is connected to the rear of the coating tank 16. An automatic unloading area 22 is connected between the rear of the second drying area 21 and the first cross-tank section 34. The first unloading robot 32 and the second unloading robot 33 are respectively located at... The automatic unloading area 22 is located on the outer front end and outer rear end. A clamping stripping area 23 is connected to the first cross-slot section 34. A first return washing area 24, a second return washing area 25, and a third return washing area 26 are connected sequentially behind the clamping stripping area 23. The third return washing area 26 is connected in front of the clamping drying area 27. A secondary slot 36 is provided between the second cross-slot section 35 and the clamping drying area 27. The secondary slot 36 is connected to the coating tank 16. A first temporary storage area 28 is connected to the front end of the secondary slot 36, and a second temporary storage area 29 is connected to the rear end of the secondary slot 36.
[0054] DI water is ultrapure water, also known as deionized water. Specifically, it is produced by the adsorption of cations and anions by resin on water containing no large physical particles. Common cations include calcium ions, chloride ions, and magnesium ions. The resin needs to be regularly acid-base washed and backwashed. The conductivity of the treated water is measured in millisiemens (mSEMs). The lower the mSEM value, the higher the purity.
[0055] When the PCB moves horizontally, the servo motor 3701 drives the synchronous sprocket 3702 to rotate, engaging the synchronous chain drive, causing the transmission rod below to rotate. The synchronous pulley 3703 on the transmission rod rotates, driving the hanger on the synchronous belt to move horizontally. When the coating tank 16 moves up and down, the servo motor 3701 also drives it, causing the synchronous gears 3704 to mesh, driving the synchronous rod 3705 to rotate, which in turn drives the lifting carrier 3706 below the synchronous rod 3705 to rise and fall. The lifting carrier 3706 drives the coating tank 16 to rise and fall. The lifting carrier 3706 is equipped with guide wheels 3707, which roll on the moving bracket 37. In the automatic feeding section 14, the PCB needs to be centered. The cylinders 3708 on both sides are used to move them towards the center to center the PCB. Above, the servo motor 3701, through the meshing of the synchronous gears 3704 and the synchronous rack 3709, causes the hanger to slide along the guide rail.
[0056] The coating tank 16 includes a coating tank body 1601, an overflow box 1602, a cathode mesh box, side spray pipes 1604, and a bottom spray pipe 1605. Cathode mounting plates 1603 are provided on both sides of the coating tank body 1601. A locking position 1606 is provided at the upper end of the cathode mounting plate 1603, and the upper end of the cathode mesh box is locked in the locking position 1606. Several copper balls are loaded in the cathode mesh box. The overflow box 1602 is located outside the coating tank body 1601. An overflow hole 1607 is provided at the upper end of the side of the coating tank body 1601. The overflow hole 1607 is connected to the overflow box 1602. The side spray pipes 1604 and the bottom spray pipe 1605 are both fixed inside the coating tank body 1601. A float is provided between the side spray pipes 1604. The float moves up and down vertically above the bottom spray pipe 1605.
[0057] The fixture moves the PCB between the side spray pipes 1604 on both sides. The floating frame is raised and lowered according to the PCB size, effectively preventing the deposition of electrical lines on the lower part of the PCB, ensuring uniform electroplating. This effectively controls the required electroplating film thickness, making it more suitable for high-precision circuits and improving exposure yield. It also reduces the light source energy of the exposure equipment to a certain extent, thus achieving cost reduction and efficiency improvement. Furthermore, the upper part of the floating frame has a V-shaped structure to protect the lower part of the PCB. With both side spray pipes 1604 and bottom spray pipes 1605 present, different spray patterns can be used for different types of PCBs to achieve the best electroplating effect. The spraying method of the side spray pipes 1604 and bottom spray pipes 1605 effectively prevents stagnant water. The copper balls in the cathode mesh boxes on both sides form cathodes, making the PCB the anode and improving the electroplating effect.
[0058] A slot 1608 is provided on the inner side of the coating tank 1601. An adjusting plate is inserted into the slot 1608. The adjusting plate covers the overflow hole 1607. The position of the overflow hole 1607 is adjusted by adjusting the height of the adjusting plate to achieve the desired liquid level control.
[0059] The lower end of the coating tank 1601 is equipped with a lifting device, which controls the movement of the floating frame without manual operation, greatly reducing the intensity of labor.
[0060] The number of slots 1606 is distributed horizontally, and the distance between the cathode mesh box and the PCB is controlled in different positions of slots 1606.
[0061] The lower end of the overflow box 1602 is connected to the overflow outlet 1609. The overflow box 1602 is tilted toward the overflow outlet 1609. The medicine flowing out from the overflow hole 1607 is discharged from the tilted structure along the overflow outlet 1609.
[0062] The coating tank 1601 is equipped with a secondary tank 36, and the chemical solution overflows from the coating tank 1601 into the secondary tank 36.
[0063] The production process of a fully automated new coating production line includes the following steps:
[0064] (1) Place the PCB horizontally at the front end of the board entry track 1 and convey it backward from the board entry track 1;
[0065] (2) The PCB is degreased in the degreasing zone 2, and the degreased PCB is then cleaned with hot water in the first hot water washing zone 3 and the second hot water washing zone 4.
[0066] (3) The PCB after hot water cleaning is then rinsed with ordinary water in the first water washing zone 5 and the second water washing zone 6.
[0067] (4) The PCB is micro-etched, and the micro-etched PCB is then washed again in the third water washing area 8 and the fourth water washing area 9.
[0068] (5) The PCB is washed with DI water in the first DI water washing area 10 and the second DI water washing area 11. After the DI water washing, the PCB needs to be dried in the first drying area 12.
[0069] (6) The first loading robot 30 grabs the PCB and places it on the hanger of the horizontal discharge section 13 for clamping. The horizontal discharge section 13 moves the PCB into the automatic loading section 14 and performs centering processing in the automatic loading section 14.
[0070] (7) The second loading robot 31 picks up the hanger along with the PCB and puts it into the coating buffer section 15. Pure water is sprayed in the coating buffer section 15. Then the coating tank 16 is raised to immerse the PCB for electroplating. After electroplating, pure water is sprayed in the coating exit buffer section 17. The side spray pipe 1604 and bottom spray pipe 1605 in the coating tank 16 spray the PCB. There are cathode mesh boxes on both sides of the coating tank 16. Copper balls are placed in the cathode mesh boxes to form cathodes, so that the PCB forms anodes. A lifting device is set at the bottom of the interior of the coating tank 16. The lifting device controls the up and down movement of the floating frame to block the electric lines at the bottom of the PCB.
[0071] (8) The PCB is recycled and washed in the recycling water washing area 18, the PCB is washed with hot water in the third hot water washing area 19, and the PCB is washed with ordinary water in the fifth water washing area 20.
[0072] (9) The PCB enters the second drying area 21 for strong hot air drying. Then, the first unloading robot 32 grabs the hanger and the PCB together and enters the automatic unloading section. The second unloading robot 33 removes the PCB from the hanger. The hanger returns to the horizontal discharge section 13 for recycling. The hanger enters the clamping stripping area 23 after passing through the first cross-slot section 34. In the clamping stripping area 23, the coating is stripped and the high-pressure jet is used for immersion stripping. Then, it passes through the first return water washing area 24, the second return water washing area 25 and the third return water washing area 26 for water washing. Then, the hanger is dried by strong air in the clamping drying area 27. After being dried in the clamping drying area 27, the hanger passes through the first temporary storage area 28 and the second temporary storage area 29. Then, it is transferred back to the horizontal discharge section 13 by the second cross-slot section 35 for recycling.
[0073] It should be stated that the above specific embodiments are merely preferred embodiments of the present invention and the technical principles applied thereto. Within the scope of the technology disclosed in the present invention, any variations or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of the present invention.
Claims
1. A fully automated new type of coating production line, characterized in that, The system includes an infeed track, an oil removal area, a first hot water wash area, a second hot water wash area, a first water wash area, a second water wash area, a micro-etching area, a third water wash area, a fourth water wash area, a first DI water wash area, a second DI water wash area, a first drying area, a coating tank, a recycling water wash area, a third hot water wash area, a fifth water wash area, a second drying area, and a fixture drying area. The oil removal area is located at the front end of the infeed track. The first and second hot water wash areas are sequentially connected to the rear of the oil removal area. The first and second water wash areas are sequentially arranged between the second hot water wash area and the micro-etching area. The third and fourth water wash areas are sequentially connected to the rear of the micro-etching area. The first DI water washing area and the second DI water washing area are located in front of the first drying area. A first loading robot is located on the outer rear end of the plate entry track. A second loading robot is located in front of the coating tank. The recycling water washing area is connected to the rear of the coating tank. The third hot water washing area and the fifth water washing area are sequentially connected between the recycling water washing area and the second drying area. A first cross-slot section is connected to the rear end of the second drying area. A first unloading robot and a second unloading robot are located on the outer side between the second drying area and the first cross-slot section. The first cross-slot section is connected to the front of the fixture drying area. A second cross-slot section is connected between the rear of the fixture drying area and the rear of the first drying area.
2. The fully automated novel coating production line according to claim 1, characterized in that, A horizontal discharge section is connected to the rear of the first drying area. The horizontal discharge section is located inside the first feeding robot. An automatic feeding section is connected to the rear of the horizontal discharge section. The second feeding robot is located outside the automatic feeding section.
3. The fully automated novel coating production line according to claim 1, characterized in that, A coating inlet buffer section is connected to the front of the coating tank, and a coating outlet buffer section is connected to the rear of the coating tank.
4. The fully automated novel coating production line according to claim 1, characterized in that, An automatic unloading area is connected between the rear of the second drying area and the first cross-slot section. The first unloading robot and the second unloading robot are located on the outer front end and outer rear end of the automatic unloading area, respectively.
5. The fully automated novel coating production line according to claim 1, characterized in that, A clamp stripping area is connected to the first cross-slot section. A first return water washing area, a second return water washing area and a third return water washing area are connected in sequence behind the clamp stripping area. The third return water washing area is connected in front of the clamp drying area.
6. The fully automated novel coating production line according to claim 1, characterized in that, A secondary groove is provided between the second cross-groove section and the fixture drying area. The secondary groove is connected to the coating tank. The front end of the secondary groove is connected to a first temporary storage area, and the rear end of the secondary groove is connected to a second temporary storage area.
7. A production process flow for a fully automated new type of coating production line, characterized in that, Includes the following steps: (1) Place the PCB horizontally at the front end of the board entry track and transport it backward from the board entry track; (2) The PCB is degreased in the degreasing area, and the degreased PCB is then cleaned with hot water in the first hot water washing area and the second hot water washing area. (3) The PCB after hot water cleaning is then rinsed with ordinary water in the first and second water washing areas. (4) The PCB is micro-etched, and the micro-etched PCB is then rinsed again in the third and fourth water washing areas. (5) The PCB is washed with DI water in the first DI water washing area and the second DI water washing area. After the DI water washing, the PCB needs to be dried in the first drying area. (6) The first loading robot grabs the PCB and places it on the hanger of the horizontal discharge section. The horizontal discharge section moves the PCB into the automatic loading section and performs centering processing in the automatic loading section. (7) The second loading robot grabs the hanger along with the PCB and puts it into the coating buffer section. Pure water is sprayed in the coating buffer section. Then the coating tank is raised to immerse the PCB for electroplating. After the electroplating is completed, pure water is sprayed in the coating exit buffer section. (8) The PCB is recycled and washed in the recycling water washing area, the PCB is washed with hot water in the third hot water washing area, and the PCB is washed with ordinary water in the fifth water washing area. (9) The PCB enters the second drying area and is dried by strong hot air. Then, the first unloading robot grabs the hanger and the PCB together and enters the automatic unloading section. The second unloading robot removes the PCB from the hanger and the hanger returns to the horizontal discharge section for recycling.
8. The production process flow of a fully automated new coating production line according to claim 7, characterized in that, In (7), the side spray pipe and bottom spray pipe installed in the coating tank spray the PCB. There are cathode mesh boxes on both sides of the coating tank. Copper balls are placed in the cathode mesh boxes to form cathodes, so that the PCB forms anodes. A lifting device is installed at the bottom of the interior of the coating tank. The lifting device controls the up and down movement of the floating frame to block the electric lines at the bottom of the PCB.
9. The production process flow of a fully automated new coating production line according to claim 7, characterized in that, In (9), after passing through the first cross-slot section, the hanger enters the clamp stripping area, where the coating is stripped and the high-pressure jet is used for immersion stripping. Then, it passes through the first return water washing area, the second return water washing area and the third return water washing area in sequence, and then the hanger is dried by strong wind in the clamp drying area.
10. The production process flow of a fully automated novel coating production line according to claim 9, characterized in that, In (9), after the hanger is dried in the clamp drying area, it passes through the first temporary storage area and the second temporary storage area, and then is transferred back to the horizontal discharge section by the second cross-channel section for recycling.