Lamp substrate, lamp driving board, lamp module and display equipment

Abstract

The invention discloses a lamp substrate, a lamp driving board, a lamp module and display equipment, and relates to the technical field of display, the lamp substrate is used for being matched with the lamp driving board to work, the lamp driving board comprises a first connector, and the first connector comprises a first grounding end; the lamp substrate comprises a first circuit substrate, a lamp bead and a second connector, and the lamp bead is arranged on the first circuit substrate; the second connector is arranged on the first circuit substrate, the second connector is connected with the lamp beads, the second connector is used for being connected with the first connector through a connecting line, and the connecting line is sleeved with a shielding layer; the first connector comprises a first grounding end which is connected with one end of the shielding layer, and the second connector further comprises a second grounding end which is used for being connected with the other end of the shielding layer so as to neutralize the antenna effect of the first grounding end acting on the shielding layer; the technical scheme provided by the invention aims to reduce electromagnetic radiation emitted by the display equipment when the lamp beads of the display equipment are turned on and off.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a lamp substrate, a lamp driving board, a lamp module and a display device. BACKGROUND

[0002] With the progress of electronic information technology, display devices are more and more widely used. The light source of the mainstream display device can be formed by a lamp bead, which can be an LED lamp bead composed of red, blue and green high brightness. However, during the bright-dark change of the lamp bead, its current changes sharply, and the sharp change of the current will produce strong electromagnetic radiation, which will cause the antenna effect and emit electromagnetic radiation. SUMMARY

[0003] The present application provides a lamp substrate, a lamp driving board, a lamp module and a display device, which aims to reduce the electromagnetic radiation emitted by the display device when the lamp bead changes from bright to dark.

[0004] To achieve the above-mentioned purpose, the lamp substrate provided by the present application is used to adapt to the work of the lamp driving board, and the lamp driving board comprises a first connector, and the first connector comprises a first ground terminal; the lamp substrate comprises: a first circuit substrate; a lamp bead arranged on the first circuit substrate; a second connector arranged on the first circuit substrate, the second connector is connected with the lamp bead, and the second connector is used to be connected with the first connector through a connecting line, and the connecting line is provided with a shielding layer; the second connector is used to receive the driving instruction output by the lamp driving board through the first connector, and drive the lamp bead to work based on the driving instruction; the first ground terminal is connected with one end of the shielding layer, and the second connector further comprises a second ground terminal, and the second ground terminal is used to connect the other end of the shielding layer.

[0005] In an embodiment, the first circuit substrate comprises a wiring layer, an insulating layer and a metal layer arranged in sequence; the second connector comprises a ground pad arranged on the wiring layer, and the ground pad is used for the second ground terminal.

[0006] In an embodiment, the insulating layer is provided with an opening corresponding to the position of the ground pad, and the metal layer is provided with a metal boss portion corresponding to the position of the opening, and the metal boss portion is electrically connected with the ground pad.

[0007] In an embodiment, the second connector further comprises a first positive connection pad and a first negative connection pad on the trace layer, and the trace layer further comprises a lamp bead positive pad and a lamp bead negative pad, the lamp bead positive pad is connected with a positive electrode of the lamp bead, and the lamp bead negative pad is connected with a negative electrode of the lamp bead; the first positive connection pad is connected with the lamp bead positive pad, and the first negative connection pad is connected with the lamp bead negative pad.

[0008] In an embodiment, the first connector of the lamp driving board further comprises a first positive connection end and a first negative connection end. The second connector further comprises a second positive connection end and a second negative connection end, the second positive connection end is used for connecting the first positive connection end through a first connecting line, the second negative connection end is used for connecting the second negative connection end through a second connecting line, and the first connecting line and the second connecting line are sleeved with a shielding layer.

[0009] The application further provides a lamp driving board used for adapting to work of a lamp substrate, the lamp substrate comprising a second connector, and the lamp driving board comprising: a second circuit substrate; a driving module, the driving module being arranged on the second circuit substrate and being used for outputting a driving signal capable of driving the lamp substrate to work; a first connector, the first connector being connected with the driving module and being used for connecting the second connector of the lamp substrate to output the received driving signal to the lamp substrate; a filter circuit, the filter circuit being connected with the first connector and being used for eliminating at least part of electromagnetic interference signals between the driving module and the first connector.

[0010] In an embodiment, the first connector comprises a first positive connection end and a first negative connection end, the first positive connection end being connected with a positive electrode of the driving module, and the first negative connection end being connected with a negative electrode of the driving module. The filter circuit comprises a first filter circuit and a second filter circuit, the first filter circuit being connected on a path between the first positive connection end and the driving module, and the second filter circuit being connected on a path between the first negative connection end and the driving module.

[0011] In an embodiment, the first filter circuit comprises a first capacitor, one end of the first capacitor being connected on the path between the first positive connection end and the driving module, and the other end of the first capacitor being grounded. The second filter circuit includes a second capacitor, one end of the second capacitor is connected to a path between the first negative connection end and the driving module, and the other end of the second capacitor is grounded.

[0012] The application further provides a lamp module, which comprises the lamp substrate as described above, and / or the lamp driving board as described above.

[0013] In an embodiment, the lamp module is specifically an LED module, the LED module comprises the lamp substrate, and the lamp beads in the lamp substrate are specifically LED lamp beads.

[0014] The application further provides a display device, which comprises the lamp module as described above.

[0015] To sum up, the lamp substrate provided by the application has a second connector for power supply and communication of the lamp substrate, and a second grounding end is additionally arranged on the second connector. Since the first grounding end on the lamp driving board side is separately connected to one end of the shielding layer, the other end of the shielding layer emits electromagnetic radiation. Therefore, the second grounding end and the first grounding end are connected to the two ends of the shielding layer respectively in the application, and thus the double-end grounding of the shielding wire is realized. In this way, a preset low-impedance return path is provided for the common-mode noise current, so that the antenna effect caused by the sudden change of the current is completely neutralized, the electromagnetic radiation emission is suppressed, and the EMC performance of the product is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the application, and for those skilled in the art, other drawings can also be obtained from the structures shown in these drawings without creative labor.

[0017] Figure 1 A structural schematic diagram of an embodiment of the lamp substrate and the lamp driving board provided by the application; Figure 2 A structural schematic diagram of another embodiment of the lamp substrate and the lamp driving board provided by the application; Figure 3 A structural schematic diagram of another embodiment of the lamp substrate and the lamp driving board provided by the application; Figure 2 A sectional view of A-A in FIG. 5; Figure 4 A structural schematic diagram of another embodiment of the lamp substrate and the lamp driving board provided by the application.

[0018] EXPLANATION OF DRAWINGS: 100, lamp substrate; 110, first circuit substrate; 111, trace layer; 112, insulating layer; 113, metal layer; 114, ground pad; 115, metal boss part; 120, lamp bead; 130, second connector; 131, first positive connection pad; 132, first negative connection pad; 133, lamp bead positive pad; 134, lamp bead negative pad; 135, second positive connection end; 136, second negative connection end; 137, second ground end; 140, shielding layer; 200, lamp driving board; 210, second circuit substrate; 220, driving module; 230, first connector; 231, first ground end; 232, first positive connection end; 233, first negative connection end; 240, filter circuit; C1, first capacitor; C2, second capacitor; 300, lamp module.

[0019] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0021] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, motion condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0022] In addition, if the embodiments of the present application involve descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first" and "second" can explicitly or implicitly include at least one of the features. In addition, "and / or" or "and / or" appearing throughout the text means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B are satisfied at the same time. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection claimed by the present application.

[0023] In current display device manufacturing, lamp modules can be used, and these lamp modules are usually LED modules, which are multi-color LED beads packaged from red, blue and green high-brightness LED chips. As the core light source, this has become the mainstream technical solution.

[0024] In one application scenario, LED modules can be used at the intersection of automotive electronics and augmented reality displays. Through optical synthesis, they generate extremely bright, color-accurate, and stable virtual images, seamlessly integrating them with the driver's field of vision to display key information such as vehicle speed, navigation, and driver assistance. To achieve this, the core technology relies on a light source module composed of red, blue, and green LEDs. This module uses PWM signals to control the duty cycle and timing of each primary color LED, performing light mixing in a very short time. Utilizing the refraction and reflection of an optical engine (including lenses, mirrors, and combiners), it ultimately generates a visually uniform and white-balanced virtual image in front of the driver.

[0025] In addition, LED modules have penetrated into core scenarios across multiple industries: in general lighting, they are used in smart home, commercial and industrial dimming systems; in visible light communication, they serve as data transmission carriers; in agriculture, they are used for artificial lighting and light environment control; in medical equipment, they are used in surgical shadowless lamps and phototherapy instruments; and in security monitoring, they are integrated into infrared night vision supplementary lighting modules.

[0026] LED chips control brightness and color through pulse width modulation (PWM) or current regulation. Their working principle is based on switching the input current to each color channel on and off, or varying its amplitude, to generate colors. However, this driving method inherently requires the current to undergo a rapid jump from zero to its peak value or vice versa within an extremely short time, resulting in an extremely high rate of change. According to Maxwell's electromagnetic theory, time-varying currents excite alternating electromagnetic fields, and rapidly changing current pulses create a wide-bandgap electromagnetic noise source, making the LED chip and its lead structure equivalent to a small dipole antenna, radiating electromagnetic energy.

[0027] To address the aforementioned issues and reduce electromagnetic radiation, this application proposes a lamp substrate 100 for adapting to the operation of a lamp driver board 200. The lamp driver board 200 includes a first connector 230, which includes a first ground terminal 231. In one embodiment, as... Figure 1As shown, the lamp substrate 100 proposed in the present application comprises a first circuit substrate 110, a lamp bead 120, and a second connector 130. The lamp bead 120 is arranged on the first circuit substrate 110; the second connector 130 is arranged on the first circuit substrate 110, and the second connector 130 is connected to the lamp bead 120 and is used to be connected to the first connector 230 through a connecting line, and the connecting line is sleeved with a shielding layer 140; the second connector 130 is used to receive a driving instruction output by the lamp driving board 200 through the first connector 230 and drive the lamp bead 120 to work based on the driving instruction; the first grounding end 231 is connected to one end of the shielding layer 140, and the second connector 130 further comprises a second grounding end 137, which is used to connect the other end of the shielding layer 140, so as to neutralize the antenna effect of the first grounding end 231 on the shielding layer 140.

[0028] In the embodiment, the lamp driving board 200 is the control core of the entire display system, can be built-in control circuit and power management chip, is responsible for generating PWM signal or current control signal, so as to command the brightness change of the lamp bead 120 in the lamp substrate 100. Optionally, the first connector 230 integrated on the edge or surface of the lamp driving board 200 is used as the physical interface for power transmission and signal instruction transmission. In the first connector 230, one or more first grounding ends 231 are designed, which has the core function of providing a reference potential reference point for the entire system, and is also the main return path of the high-frequency noise current generated in the lamp driving board 200, aiming to guide the noise back to the source and be absorbed or processed, instead of radiating out.

[0029] In the embodiment, the first circuit substrate 110 can be a metal-based copper-clad plate, such as an aluminum substrate or a copper substrate. The structure of the first circuit substrate 110 can comprise, from bottom to top, a metal layer 113 for conducting heat generated by the lamp bead 120 at high speed, a dielectric layer, i.e. an insulating layer 112, and a copper foil circuit layer at the topmost layer, which is formed by etching process to form precise electrical wiring for connecting the pins of each lamp bead 120 and the second connector 130.

[0030] Among them, the lamp bead 120 can refer to a semiconductor light-emitting device as a light source, such as an LED lamp bead. The LED lamp bead corresponds to an LED substrate. In order to realize full-color display, three micro-chips of red, green and blue can be integrated in one lamp bead 120. When the lamp driving board 200 applies current of different intensity or duty cycle to the three chips through the second connector 130, the light emitted by them is mixed in proportion, which can produce various colors including white light. The number of lamp beads 120 can be multiple or one, and the number of lamp beads 120 is not limited here.

[0031] The second connector 130 is a corresponding interface mounted on the first circuit substrate 110, which structure matches the first connector 230, and together forms a complete connector pair. The second connector 130 is used to receive power and control signals from the lamp driving board 200, and distribute them to each corresponding lamp bead 120 on the board.

[0032] It should be noted that although the shielding layer 140 of the connecting line is used to wrap the internal wire, absorb and lead away electromagnetic radiation, if only one end of the shielding layer 140 is grounded (such as through the first grounding end 231 on the lamp driving board 200 side), a parasitic capacitor is formed between the shielding layer 140 itself and the internal wire, and the ungrounded end (i.e. the lamp board side) is in a suspended high impedance state for the system. That is, this makes the high-frequency noise current captured by the shielding layer 140 unable to form an effective low-impedance return path, and the entire shielding layer 140 instead becomes an equivalent monopole antenna, radiating noise energy to the surrounding space. In addition, since the lamp substrate 100 fails to form an effective reference ground potential at the ungrounded end of the shielding layer 140, the metal traces and copper substrate itself on it will also produce strong antenna effect under the excitation of noise current, exacerbating electromagnetic radiation emission, thereby seriously affecting the electromagnetic compatibility performance of the entire system.

[0033] In order to solve the above problems, the second grounding end 137 is additionally provided in the second connector 130 in addition to the conventional power and signal pins. The second grounding end 137 connects the other end of the shielding layer 140, and when the two ends of the shielding layer 140 are connected to the first grounding end 231 of the lamp driving board 200 and the second grounding end 137 of the lamp substrate 100 respectively, a low-impedance return path is constructed for common-mode noise current. The noise current is effectively limited in the shielding layer 140, and can be quickly discharged and neutralized through the metal layer 113, thereby completely destroying the conditions for it to radiate electromagnetic waves as an antenna, fundamentally suppressing the antenna effect, and improving the anti-interference ability and electromagnetic compatibility of the system.

[0034] In one feasible implementation, taking an LED light source module of an in-vehicle HUD (Head-Up Display) as an example: the lamp driver board 200 is installed inside the vehicle's electronic control unit, and its first connector 230 is connected via a one-meter-long shielded cable to a second connector 130 on a lamp substrate 100 installed deep within the dashboard. The lamp driver board 200 generates a PWM signal to control the brightness of the LED beads to generate navigation arrows. During this process, the rapidly changing current generates strong electromagnetic noise. In a conventional design, if the shielding layer 140 is only grounded at the lamp driver board 200 end, the entire cable will act like an antenna, interfering with the vehicle's radio, GPS, and sensors. To solve the above problem, a second grounding terminal 137 is designed on the second connector 130 of the lamp substrate 100, and the other end of the shielding layer 140 is connected to the second grounding terminal 137. In this way, the noise current is completely confined to the inside of the shielding layer 140, preventing it from radiating out and ensuring the operational stability of the HUD system and other precision electronic devices in the vehicle.

[0035] In summary, the lamp substrate 100 provided in this application has a second connector 130 for power supply and communication of the lamp substrate 100, and a second grounding terminal 137 is added to the second connector 130. Since the first grounding terminal 231 on the lamp driver board 200 side is only connected to one end of the shielding layer 140, the other end of the shielding layer 140 will emit electromagnetic radiation. Therefore, in this application, the second grounding terminal 137 cooperates with the first grounding terminal 231 to connect to both ends of the shielding layer 140, thereby realizing double-end grounding of the shielding wire. In this way, a preset low-impedance return path is provided for the common-mode noise current, thereby completely neutralizing the antenna effect caused by the sudden change in current, suppressing electromagnetic radiation emission, and improving the EMC performance of the product.

[0036] In one implementation, such as Figure 2 and Figure 3 As shown, the first circuit board 110 includes a trace layer 111, an insulating layer 112 and a metal layer 113 arranged sequentially; the second connector 130 includes a ground pad 114 disposed on the trace layer 111, and the ground pad 114 is used for the second ground terminal 137.

[0037] Understandably, the trace layer 111 is etched from copper foil and is used to lay signal and power lines, forming various pads; the insulating layer 112 is a high thermal conductivity dielectric that provides electrical isolation while also efficiently conducting heat; the bottom metal layer 113 mainly serves as mechanical support and heat dissipation. The key point of this embodiment is clarifying the physical form of the second ground terminal 137 of the second connector 130, which is a ground pad 114 on the trace layer 111, providing a foundation for subsequent efficient, low-impedance grounding connections. Grounding is achieved by connecting the second ground terminal 137 to this ground pad 114.

[0038] In one implementation, such as Figure 3 As shown, the insulating layer 112 has an opening at the position corresponding to the grounding pad 114, and the metal layer 113 has a metal boss 115 at the position corresponding to the opening. The metal boss 115 is electrically connected to the grounding pad 114.

[0039] Understandably, an opening is made in the insulating layer 112 at the position corresponding to the grounding pad 114 of the trace layer 111, i.e., a window is created. Simultaneously, a raised metal boss 115 is fabricated at the corresponding position in the underlying metal layer 113. This allows the boss of the metal layer 113 to directly contact and electrically connect with the grounding pad 114 on the trace layer 111 through the opening in the insulating layer 112. Electrically, this provides an extremely low-impedance, high-capacity discharge path to the underlying metal for the noise current introduced by the shielding layer 140, significantly improving EMI suppression. Thermally, it also creates a direct heat conduction channel from the connector to the metal baseplate, helping to dissipate heat generated by contact resistance during connector operation and improving system reliability.

[0040] In one implementation, such as Figure 2 As shown, the second connector 130 further includes a first positive electrode connection pad 131 and a first negative electrode connection pad 132 disposed on the wiring layer 111, and the wiring layer 111 further includes a positive electrode pad and a negative electrode pad of the LED chip 120. The positive electrode pad of the LED chip 120 is connected to the positive electrode of the LED chip 120, and the negative electrode pad of the LED chip 120 is connected to the negative electrode of the LED chip 120. The first positive electrode connection pad 131 is connected to the positive electrode pad of the LED chip 120, and the first negative electrode connection pad 132 is connected to the negative electrode pad of the LED chip 120.

[0041] Understandably, in addition to the second ground terminal 137, the second connector 130 also has a first positive connection pad 131 and a first negative connection pad 132 for receiving power and drive signals from the lamp driver board 200. Simultaneously, positive and negative pads for the lamp beads 120 are distributed on the trace layer 111, with the electrodes of the lamp beads 120 soldered to the corresponding pads, thus forming a complete circuit. In this way, after the power and drive signals enter from the second connector 130, they are directly delivered to the lamp beads 120 through a preset wiring path, reducing parasitic inductance and resistance along the path. This itself also helps improve power integrity and reduce potential noise.

[0042] In one implementation, such as Figure 1As shown, the first connector 230 of the lamp driver board 200 further includes a first positive connection terminal 232 and a first negative connection terminal 233; the second connector 130 further includes a second positive connection terminal 135 and a second negative connection terminal 136. The second positive connection terminal 135 is used to connect to the first positive connection terminal 232 through a first connection line, and the second negative connection terminal 136 is used to connect to the second negative connection terminal 136 through a second connection line. The first connection line and the second connection line are covered with a shielding layer 140.

[0043] It is understood that in the above embodiment, a complete power transmission channel is constructed. The second positive terminal 135 is connected to the far-end first positive terminal 232 via the first connecting line to receive power, and the second negative terminal 136 is connected to the first negative terminal 233 via the second connecting line to form a current loop. Crucially, these two wires carrying rapidly changing currents are jointly encased in the same shielding layer 140. This shielding layer 140, acting as a unified Faraday cage, is designed to effectively suppress the magnetic field generated by the two wires and absorb their radiated electromagnetic noise. This lays the structural foundation for subsequent efficient double-ended grounding and EMI suppression by connecting the two ends of the shielding layer 140 to the first grounding terminal 231 and the second grounding terminal 137, respectively.

[0044] Optionally, the second positive terminal 135 is connected to the first positive terminal pad 131, and the second negative terminal 136 is connected to the first negative terminal pad 132. The lamp driver board 200 has a second positive terminal pad and a second negative terminal pad, the first positive terminal 232 is connected to the second positive terminal pad, and the first negative terminal 233 is connected to the second negative terminal pad.

[0045] This application also provides a lamp driver board 200, such as Figure 4 As shown, the lamp driver board 200 is used to adapt to the operation of the lamp substrate 100, which includes a second connector 130. In one embodiment, as... Figure 4 As shown, the lamp driver board 200 includes a second circuit board 210, a driver module 220, a first connector 230, and a filter circuit 240. The driver module 220 is disposed on the second circuit board 210 and is used to output a drive signal capable of driving the lamp substrate 100 to operate. The first connector 230 is connected to the driver module 220 and is used to connect to the second connector 130 of the lamp substrate 100 to output the received drive signal to the lamp substrate 100. The filter circuit 240 is connected to the first connector 230 and is used to eliminate at least a portion of the electromagnetic interference signals between the driver module 220 and the first connector 230.

[0046] In this embodiment, the second circuit board 210 can be a metal-based copper-clad laminate, such as an aluminum substrate or a copper substrate. The structure of the second circuit board 210 from bottom to top may include: a metal layer 113 for rapidly conducting the heat generated by the lamp bead 120; a dielectric layer, i.e., an insulating layer 112; and an uppermost copper foil circuit layer, which forms precise electrical traces through an etching process.

[0047] In this embodiment, the driving module 220 can be composed of a microcontroller unit, a dedicated LED driver chip, a MOSFET switch, an inductor, a capacitor, and other components. It receives low-voltage DC power from an external input or power that has been internally converted, and generates a driving signal that can drive the LED beads 120 on the lamp substrate 100. Optionally, the driving signal can be a high-frequency pulse width modulation (PWM) signal or a constant current output. By controlling the signal duty cycle, frequency, and amplitude, the brightness, color, and dynamic effect of the LED beads 120 can be adjusted.

[0048] In this embodiment, the first connector 230 acts as a physical and electrical bridge between the lamp driver board 200 and the external lamp substrate 100. It may include a multi-pin standardized connector (such as a board-to-board connector, wire-to-board connector, or pin header / female header), whose pin definitions fully match those of the second connector 130 on the lamp substrate 100. The first connector 230 is directly connected to the output terminal of the driver module 220 via copper foil traces on the second circuit board 210, and is responsible for transmitting the drive signals (including power and control signals) generated by the driver module 220.

[0049] In this embodiment, a filter circuit 240 is connected in the signal path between the drive module 220 and the first connector 230. This filter circuit 240 can eliminate or significantly attenuate high-frequency noise and electromagnetic interference signals generated from the drive module 220 and attempting to be transmitted outward through the first connector 230, while allowing the low-frequency components of the useful drive signal to pass smoothly. This is equivalent to setting up a purification filter between the noise source and the transmission antenna (connector and cable), reducing the intensity of electromagnetic radiation at the source.

[0050] In one feasible embodiment, the filtering module may include a Y capacitor. A Y capacitor is added to the power line on the first connector 230 of the lamp driver board 200, bridging the positive power line and ground. Utilizing the capacitor's "DC blocking, AC passing" characteristic, the Y capacitor presents high impedance for the low-frequency or DC current required to drive the LED, effectively acting as an open circuit, thus ensuring that the normal drive current is not attenuated or affected. However, for high-frequency electromagnetic interference noise generated by the high-speed switching of the internal MOSFET switching transistors, the Y capacitor presents extremely low impedance, efficiently bypassing (or shunting) this noise to the GND network of the lamp driver board 200, where it is ultimately absorbed or dissipated.

[0051] In summary, the lamp driver board 200 provided in this application is based on the second circuit board 210, integrates a driver module 220 as its control and signal generation core, and uses the first connector 230 as a standardized interface for connecting to the lamp board 100. Its integrated filter circuit 240 is positioned on the path between the interference source (driver module 220) and the external interface (first connector 230), actively filtering out electromagnetic noise and preventing noise from radiating out through the connector and cables, thereby improving the electromagnetic compatibility of the display device.

[0052] In one implementation, such as Figure 4 As shown, the first connector 230 includes a first positive terminal 232 and a first negative terminal 233. The first positive terminal 232 is connected to the positive terminal of the drive module 220, and the first negative terminal 233 is connected to the negative terminal of the drive module 220. The filter circuit 240 includes a first filter circuit and a second filter circuit. The first filter circuit is connected to the path between the first positive terminal 232 and the drive module 220, and the second filter circuit is connected to the path between the first negative terminal 233 and the drive module 220.

[0053] In this embodiment, the first connector 230 includes a first positive terminal 232 and a first negative terminal 233, which serve as the output and return paths of the drive current, respectively. They are directly connected to the corresponding positive and negative output pins of the drive module 220, forming a complete power transmission channel. The filter circuit 240 includes two independent circuits: a first filter circuit and a second filter circuit. The first filter circuit is connected in series in the forward current path between the first positive terminal 232 and the drive module 220, while the second filter circuit is connected in series in the return current path between the first negative terminal 233 and the drive module 220. This effectively suppresses both differential-mode interference (noise existing between the positive and negative terminals) and common-mode interference (noise shared by the positive and negative terminals to ground), improving electromagnetic interference suppression capabilities.

[0054] In one implementation, such as Figure 4 As shown, the first filter circuit includes a first capacitor C1, one end of which is connected to the path between the first positive terminal 232 and the driving module 220, and the other end of which is grounded; the second filter circuit includes a second capacitor C2, one end of which is connected to the path between the first negative terminal 233 and the driving module 220, and the other end of which is grounded.

[0055] In this embodiment, the first capacitor C1 and the second capacitor C2 serve as low-impedance bypass paths for high-frequency noise. For example, when high-frequency electromagnetic interference noise generated by the MOSFET switch in the drive module 220 attempts to propagate outwards through the power line, the first capacitor C1 and the second capacitor C2, due to their DC blocking and AC passing characteristics, exhibit high impedance to low-frequency DC drive current but extremely low impedance to high-frequency noise. This immediately diverts or short-circuits this noise energy from the positive and negative paths to the ground line, preventing it from reaching the first connector 230 and ultimately radiating outwards through the cable, thus significantly attenuating the electromagnetic interference near its source.

[0056] This application also provides a lamp module 300. In one embodiment, the lamp module 300 includes a lamp substrate 100 as described above, and / or a lamp driver board 200 as described above. It should be noted that the specific implementations of the lamp substrate 100 and the lamp driver board 200 are as described above. Since this lamp module 300 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be repeated here.

[0057] In this embodiment, as Figure 4 As shown, the lamp module 300 includes a lamp substrate 100 and a lamp driver board 200 as described above. The second connector 130 of the lamp substrate 100 is connected to the first connector 230 of the lamp driver board 200, realizing a complete connection of power, signal, and grounding circuits, and in particular ensuring that the shielding layer 140 is grounded at both the driver board end and the lamp board end. Furthermore, the output end of the lamp driver board 200 is connected to a filter circuit 240 composed of a first filter circuit and a second filter circuit, optionally including optimized components such as Y capacitors. The combination of these two electromagnetic interference cancellation schemes forms a multi-layered, all-round EMI protection system from source suppression (driver board filtering), path blocking (double-ended grounding of the shielding layer 140) to end absorption (lamp board grounding discharge), thereby achieving a synergistic effect that far exceeds the electromagnetic radiation suppression effect of a single technical means.

[0058] In one embodiment, the lamp module 300 is specifically an LED module, which includes the lamp substrate 100, and the lamp beads 120 in the lamp substrate 100 are specifically LED beads. This LED module greatly suppresses electromagnetic interference, providing crucial reliability assurance for display applications requiring high brightness, high color accuracy, and high refresh rate, and improving the overall system's operational stability.

[0059] This application also provides a display device, which includes the lamp module 300 as described above. It should be noted that the specific embodiments of the lamp substrate 100 and the lamp driver board 200 are as described above. Since this lamp module 300 adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be repeated here.

[0060] It is understood that display devices can be various types of electronic display products such as televisions, computer monitors, commercial advertising screens, vehicle displays, and virtual reality (VR) headsets, without any specific limitations.

[0061] In one feasible embodiment, when the display device is a head-up display (HUD), its core light source is constituted by the lamp module 300 of this application, which is precisely installed within the HUD optical engine. This ensures that while the HUD generates a high-brightness, high-contrast virtual image, the electromagnetic radiation generated by its driving circuit is strictly suppressed, effectively avoiding interference with critical electronic devices such as in-vehicle radios, GPS navigation, millimeter-wave radar, and various sensors, greatly improving the electromagnetic compatibility and driving safety reliability of the entire vehicle.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no technical conflict, the various technical features mentioned in the various embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A lamp substrate, characterized in that, The lamp substrate is used to adapt to the operation of the lamp driver board, the lamp driver board includes a first connector, the first connector includes a first ground terminal; the lamp substrate includes: First circuit board; LED beads, wherein the LED beads are disposed on the first circuit board; The second connector is disposed on the first circuit board, the second connector is connected to the lamp bead, and the second connector is used to connect to the first connector through a connecting wire, the connecting wire being covered with a shielding layer; The second connector is used to receive the driving command output by the lamp driver board through the first connector, and drive the lamp bead to work based on the driving command; The first grounding terminal is connected to one end of the shielding layer, and the second connector further includes a second grounding terminal, which is used to connect to the other end of the shielding layer.

2. The lamp substrate as described in claim 1, characterized in that, The first circuit board includes a wiring layer, an insulating layer, and a metal layer disposed sequentially. The second connector includes a ground pad located on the trace layer, the ground pad being used as the second ground terminal.

3. The lamp substrate as described in claim 2, characterized in that, The insulating layer has an opening at the position corresponding to the grounding pad, and the metal layer has a metal boss at the position corresponding to the opening. The metal boss is electrically connected to the grounding pad.

4. The lamp substrate as described in claim 2, characterized in that, The second connector further includes a first positive electrode connection pad and a first negative electrode connection pad disposed on the wiring layer, and the wiring layer further includes a lamp bead positive electrode pad and a lamp bead negative electrode pad, wherein the lamp bead positive electrode pad is connected to the positive electrode of the lamp bead, and the lamp bead negative electrode pad is connected to the negative electrode of the lamp bead; the first positive electrode connection pad is connected to the lamp bead positive electrode pad, and the first negative electrode connection pad is connected to the lamp bead negative electrode pad.

5. The lamp substrate as described in claim 1, characterized in that, The first connector of the lamp driver board further includes a first positive terminal and a first negative terminal; The second connector further includes a second positive terminal and a second negative terminal. The second positive terminal is used to connect to the first positive terminal via a first connecting line, and the second negative terminal is used to connect to the second negative terminal via a second connecting line. The first connecting line and the second connecting line are covered with a shielding layer.

6. A lamp driver board, characterized in that, The lamp driver board is used to adapt to the operation of the lamp substrate, the lamp substrate includes a second connector, and the lamp driver board includes: Second circuit board; A driving module is disposed on the second circuit board, and the driving module is used to output a driving signal that can drive the lamp board to work. A first connector is connected to the drive module and is used to connect to a second connector on the lamp substrate to output the received drive signal to the lamp substrate. A filtering circuit, connected to the first connector, is used to eliminate at least a portion of the electromagnetic interference signals between the drive module and the first connector.

7. The lamp driver board as described in claim 6, characterized in that, The first connector includes a first positive terminal and a first negative terminal, the first positive terminal being connected to the positive terminal of the drive module, and the first negative terminal being connected to the negative terminal of the drive module; The filtering circuit includes a first filtering circuit and a second filtering circuit. The first filtering circuit is connected to the path between the first positive terminal and the driving module, and the second filtering circuit is connected to the path between the first negative terminal and the driving module.

8. The lamp driver board as described in claim 7, characterized in that, The first filter circuit includes a first capacitor, one end of which is connected to the path between the first positive terminal and the driving module, and the other end of which is grounded. The second filter circuit includes a second capacitor, one end of which is connected to the path between the first negative terminal and the driving module, and the other end of which is grounded.

9. A lamp module, characterized in that, The lamp module includes a lamp substrate as described in any one of claims 1 to 5, and / or a lamp driver board as described in any one of claims 6 to 8.

10. The lamp module as described in claim 9, characterized in that, The lamp module is specifically an LED module, which includes the lamp substrate, and the lamp beads in the lamp substrate are specifically LED lamp beads.

11. A display device, characterized in that, The display device includes the lamp module as described in claim 9 or 10.

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