Circuit board manufacturing process based on double-sided electrical property conduction and circuit board

Abstract

The invention discloses a circuit board manufacturing process based on double-sided electrical property conduction and a circuit board, and relates to the technical field of integrated circuit manufacturing, and the circuit board manufacturing process based on double-sided electrical property conduction comprises the following steps: S100, tensioning and positioning a metal wire by using a positioning jig; s200, putting the positioning jig after the positioning metal wire is tensioned into a cavity of a forming mold, and injecting an insulating medium in a molten state into the cavity of the forming mold; s300, after the insulating medium in the cavity of the forming mold is solidified, the positioning jig is taken out and detached, and an ingot material is obtained; and S400, cutting the ingot material into pieces along the radial direction of the metal wire according to the required thickness to obtain the circuit board with the metal wire penetrating through the two surfaces. According to the circuit board manufacturing process based on double-sided electrical property conduction, the manufacturing difficulty of a circuit board with large board body thickness, small conductor diameter or high conductor density can be reduced, and the yield is improved.

Description

Technical Field

[0001] This invention relates to the technical field of integrated circuit manufacturing, and in particular to a circuit board manufacturing process and circuit board based on double-sided electrical conductivity. Background Technology

[0002] Circuit boards based on double-sided electrical conductivity refer to boards with double-sided electrical conductivity. Common circuit boards based on double-sided electrical conductivity include high-density interconnect printed circuit boards, chip carrier boards, and medical multi-electrode boards.

[0003] In related technologies, common methods for achieving double-sided electrical conductivity of circuit boards include: (1) mechanically drilling holes in the circuit board and then achieving double-sided electrical conductivity of the circuit board through metallized vias; (2) laser drilling holes in the circuit board and then achieving double-sided electrical conductivity of the circuit board through metallized vias; (3) opening holes or slots on both sides of the circuit board, then embedding metal conductors into the vias or slots, and finally pressing them together to achieve double-sided electrical conductivity of the circuit board.

[0004] However, existing methods for achieving double-sided electrical conductivity on circuit boards are difficult to manufacture and have low yield rates for circuit boards with large board thickness, small conductor diameter, or high conductor density. Summary of the Invention

[0005] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a circuit board manufacturing process based on double-sided electrical conductivity, which can reduce the manufacturing difficulty of circuit boards with large board thickness, small conductor diameter, or high conductor density, and improve the yield rate.

[0006] The present invention also proposes a circuit board based on double-sided electrical conductivity, which is manufactured using the above-mentioned circuit board manufacturing process based on double-sided electrical conductivity.

[0007] The circuit board manufacturing process based on double-sided electrical conductivity according to a first aspect of the present invention includes the following steps: Step S100: Use a positioning fixture to tighten and position the metal wire; Step S200: Place the positioning fixture after tightening the positioning metal wire into the cavity of the forming mold, and inject the molten insulating medium into the cavity of the forming mold; Step S300: After the insulating medium in the cavity of the molding die has solidified, remove the positioning fixture and dismantle the positioning fixture to obtain the ingot material; Step S400: Cut the ingot into pieces along the radial direction of the metal wire to the required thickness to obtain a circuit board with the metal wire running through both sides.

[0008] The circuit board manufacturing process based on double-sided electrical conductivity according to embodiments of the present invention has at least the following beneficial effects: 1. This invention forms a stable structure by applying axial tension to the metal wire in a positioning fixture, which then forms a conductor distribution space together with the forming mold cavity. The molten insulating medium completely fills the conductor gaps under pressure, and after solidification, it forms an integral structure ingot containing the metal wire. The cutting process is carried out perpendicular to the length of the metal wire, so that each circuit board retains a complete metal wire through-structure. Thus, by pre-positioning the metal wire and simultaneously solidifying the insulating medium, the drilling and copper plating processes in traditional processes are eliminated, avoiding secondary processing on the forming substrate. This invention completes the metal wire layout during the circuit board substrate forming stage, avoiding the accumulation of processing errors. At the same time, the straight through-structure of the metal wire in the circuit board manufactured using the manufacturing process of this invention has better conductivity continuity than traditional through holes.

[0009] 2. This invention completes the metal wire layout during the circuit board substrate forming stage, enabling the metal wires to directly serve as conductive conductors on both sides of the circuit board after the circuit board is formed. This eliminates the need for secondary processing of the circuit board substrate after substrate forming to lay the conductive circuits on both sides of the circuit board. It is particularly suitable for manufacturing circuit boards with large thicknesses and circuit boards with small conductor diameters or high conductor densities. Specifically, it can achieve double-sided electrical conductivity on circuit boards with conductor metal diameters of less than 10 micrometers, and double-sided electrical conductivity on circuit boards with through-hole or slot diameters greater than an aspect ratio of 30:1. It can meet the process requirements of high-density electrode boards, thereby reducing the manufacturing difficulty of circuit boards with large board thicknesses, small conductor diameters, or high conductor densities, and improving the yield rate.

[0010] According to some embodiments of the present invention, in step S100, the positioning fixture clamps both ends of the fixed metal wire to pull the metal wire taut and position it.

[0011] According to some embodiments of the present invention, in step S100, the positioning fixture arranges and tightens multiple metal wires in a designed arrangement to position them.

[0012] According to some embodiments of the present invention, the cross-sections of the plurality of said metal wires have the same shape and size.

[0013] According to some embodiments of the present invention, the cross-sections of the plurality of metal wires have the same shape but different sizes.

[0014] According to some embodiments of the present invention, the cross-sectional shapes of the plurality of said metal wires are different.

[0015] According to some embodiments of the present invention, the cross-sectional sizes and shapes of the multiple metal wires are all different.

[0016] According to some embodiments of the present invention, in step S200, an insulating medium is injected into the cavity of the molding die using an injection molding machine.

[0017] According to some embodiments of the present invention, in step S400, the ingot is cut into multiple plates of equal or unequal thickness along the radial direction of the metal wire to obtain multiple circuit boards.

[0018] According to a second aspect of the present invention, a circuit board based on double-sided electrical conductivity is manufactured using the circuit board manufacturing process based on double-sided electrical conductivity according to a first aspect of the present invention, and includes a board body and metal lines penetrating both sides of the board body.

[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a process flow diagram of the circuit board manufacturing process based on double-sided electrical conductivity according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure after the metal wires are tightened and positioned in the circuit board manufacturing process based on double-sided electrical conductivity, according to an embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of the molding die cavity after molten insulating medium is injected into it, according to an embodiment of the present invention, for a circuit board manufacturing process based on double-sided electrical conductivity. Figure 4 This is a schematic diagram of the ingot structure of the circuit board manufacturing process based on double-sided electrical conductivity, according to an embodiment of the present invention. Figure 5 This is a schematic diagram of the ingot cutting line distribution in a circuit board manufacturing process based on double-sided electrical conductivity according to an embodiment of the present invention. Figure 6 This is a cross-sectional view of a circuit board based on double-sided electrical conductivity according to an embodiment of the present invention; Figure 7 for Figure 6 The circuit board is shown in top view.

[0022] Reference numerals: 100-positioning fixture, 110-metal wire, 120-forming mold, 130-insulating medium, 140-cutting line, 150-plate. Detailed Implementation

[0023] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0024] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0025] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" and "second" are mentioned, this is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0026] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation, connection, and linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0027] The following is in conjunction with the appendix Figure 1 -Appendix Figure 7 This invention describes a circuit board manufacturing process and circuit board based on double-sided electrical conductivity according to embodiments of the present invention.

[0028] The present invention aims to provide a circuit board manufacturing process and embodiments of the circuit board based on double-sided electrical conductivity.

[0029] Example 1 This embodiment provides a circuit board manufacturing process based on electrical conductivity.

[0030] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 In this embodiment, the circuit board manufacturing process based on double-sided electrical conductivity mainly includes the following steps: Step S100: Use positioning fixture 100 to tighten and position metal wire 110; Step S200: Place the positioning fixture 100 after tightening the positioning metal wire 110 into the cavity of the molding mold 120, and inject the molten insulating medium 130 into the cavity of the molding mold 120. Step S300: After the insulating medium 130 in the cavity of the molding die 120 has solidified, the positioning fixture 100 is removed and the positioning fixture 100 is dismantled to obtain the ingot material; Step S400: Cut the ingot into pieces along the radial direction of the metal wire 110 to the required thickness to obtain a circuit board with the metal wire 110 running through both sides.

[0031] In this embodiment, the metal wire 110 is subjected to axial tension in the positioning fixture 100 to form a stable structure. Subsequently, it forms a conductor distribution space together with the cavity of the forming mold 120. The molten insulating medium 130 completely fills the conductor gap under pressure, and after solidification, it forms an integral structural ingot containing the metal wire 110. The cutting process is carried out along the direction perpendicular to the length of the metal wire 110, so that each circuit board retains a complete through-structure of the metal wire 110. Thus, by pre-positioning the metal wire 110 and simultaneously solidifying the insulating medium 130, the drilling and copper plating processes in the traditional process are eliminated, and secondary processing on the forming substrate is avoided. The present invention completes the layout of the metal wire 110 during the substrate forming stage of the circuit board, avoiding the superposition of processing errors. At the same time, the straight through-structure of the metal wire 110 of the circuit board manufactured using the manufacturing process of the present invention has better conductivity continuity than traditional through holes.

[0032] This embodiment completes the laying of metal lines 110 during the substrate forming stage of the circuit board, so that the metal lines 110 can directly serve as metal conductors for conduction on both sides of the circuit board after the circuit board is formed. This eliminates the need for secondary processing of the circuit board substrate after the circuit board substrate is formed to lay the conductive circuits on both sides of the circuit board. It is particularly suitable for the manufacturing of circuit boards with large thickness and circuit boards with small conductor diameter or high conductor density. Specifically, it can achieve double-sided electrical conductivity of circuit boards with conductor metal diameter of less than 10 micrometers, and double-sided electrical conductivity of circuit boards with through hole or slot diameter greater than 30:1 aspect ratio. It can meet the process requirements of high-density electrode boards, thereby reducing the manufacturing difficulty of circuit boards with large board thickness, small conductor diameter or high conductor density, and improving the yield rate.

[0033] It should be explained that the positioning fixture 100 can be a tooling fixture with clamping function. Specifically, it can be implemented by a metal frame with adjustable jaws. Tension is applied to both ends of the metal wire 110 through a mechanical locking mechanism to ensure that the metal wire 110 remains straight during the injection of the insulating medium 130 and to prevent the metal wire 110 from shifting due to the flow of the insulating medium 130. Alternatively, the positioning fixture 100 can also be set as an upper positioning plate and a lower positioning plate with positioning holes. After the two ends of the metal wire 110 pass through the positioning holes, they are welded and fixed to the upper positioning plate and the lower positioning plate. When the positioning fixture 100 is removed, the part of the metal wire 110 fixed to the upper positioning plate and the lower positioning plate can be directly cut off.

[0034] The insulating medium 130 can be a polymer material with electrical insulation properties, specifically epoxy resin or polyimide composite material. It fills the cavity of the molding mold 120 in a high-temperature molten state. After the insulating medium 130 material is cured, it forms a rigid structure that wraps around the metal wire 110, providing support for the subsequent cutting process.

[0035] Radial cutting can be performed by slicing a vertical plane along the extension direction of the metal wire 110. Specifically, it can be achieved using a diamond wire cutter or a laser cutting device. The above cutting method can simultaneously cut the insulating medium 130 and the metal wire 110 to form a circuit board unit with a flat end face.

[0036] In some specific embodiments, in step S100, the positioning fixture 100 clamps both ends of the fixed metal wire 110 to tighten and position the metal wire 110.

[0037] It is understandable that the metal wire 110 is susceptible to external interference during the injection molding process of the insulating medium 130, which can cause positional displacement. However, by clamping and tightening the positioning at both ends, the metal wire 110 is forcibly constrained during the injection molding stage of the insulating medium 130, and the positional accuracy is effectively controlled. This avoids deformation or misalignment of the metal wire 110 when the insulating medium 130 is filled. This method is particularly suitable for circuit board manufacturing scenarios where the diameter of the metal wire 110 is small or the arrangement density of the metal wire 110 is high, thereby improving the yield of circuit board products.

[0038] It should be explained that clamping and fixing the two ends of the metal wire 110 means applying a fixing force to the two ends of the metal wire 110 through the clamping mechanism of the positioning fixture 100. Specifically, mechanical fixtures or pneumatic fixtures can be used to prevent the metal wire 110 from shifting or loosening during subsequent processing.

[0039] Among them, tensioning and positioning refers to keeping the metal wire 110 taut by adjusting the tension of the clamping mechanism. Specifically, a spring loading device or a servo motor drive device can be used to ensure that the metal wire 110 maintains the preset straightness and spacing during the forming process.

[0040] Specifically, after the metal wire 110 is clamped and fixed, both ends of the metal wire 110 are subjected to uniform tension, so that the metal wire 110 maintains a stable state in the cavity of the molding mold 120. When the molten insulating medium 130 is injected into the cavity, the metal wire 110 will not bend or shift due to fluid impact. After the solidified insulating medium 130 ingot is cut, the metal wire 110 can accurately penetrate both sides of the circuit board to form a stable conductive path.

[0041] In some specific embodiments, in step S100, the positioning fixture 100 arranges and tightens the multiple metal wires 110 according to the designed arrangement.

[0042] It is understandable that when multiple metal wires 110 are arranged according to a preset spacing, angle, or topological relationship, and the cured insulating medium 130 ingot is cut to form a circuit board, the arrangement of the metal wires 110 directly determines the layout of the double-sided conductive path of the circuit board. In this embodiment, by pre-arranging the metal wires 110, the metal wires 110 are directly embedded inside the insulating medium 130. The positioning fixture 100 is used to achieve precise control of the conductor arrangement, avoiding the limitation of the drilling process on the positional accuracy of the metal wires 110 due to secondary processing. This solves the problem of difficulty in accurately controlling the spacing between adjacent metal wires 110 when arranging high-density metal wires 110, and realizes one-time forming and positioning of multiple metal wires 110, which is beneficial to improving the manufacturing accuracy of the circuit board.

[0043] In some specific embodiments, the cross-sections of the multiple metal wires 110 have the same shape and size.

[0044] It is understood that by making multiple metal wires 110 have the same cross-sectional shape and size, this embodiment ensures that the conductivity of each conductive structure on the circuit board is consistent. On the other hand, having the same cross-sectional shape and size ensures that the metal wires 110 maintain the symmetry of force during the forming and cutting stages, eliminating the accumulation of processing errors caused by shape differences. This solves the problem of reduced cutting accuracy caused by shape differences when the metal wires 110 have a high arrangement density, ensuring the geometric consistency of the conductive structure on both sides of the circuit board and reducing the risk of conductive failure caused by deformation of the metal wires 110.

[0045] It should be explained that the metal wire 110 refers to the conductor material used to achieve the double-sided conductivity of the circuit board. Specifically, it can be copper wire, aluminum wire or alloy wire, and its surface can be plated to enhance conductivity.

[0046] The fact that the cross-sections of the metal wires 110 are identical in shape and size means that all the metal wires 110 have an outer contour with the same shape and size on the cross-section perpendicular to the length direction. Specifically, they can be circular, rectangular, or hexagonal.

[0047] In other embodiments, the cross-sections of the multiple metal wires 110 have the same shape but different sizes.

[0048] Understandably, the differentiated cross-sectional dimensions of the metal lines 110 allow for flexible configuration of metal lines 110 with different conductivity capabilities within the same circuit board, based on circuit functional requirements. For example, large-section metal lines 110 can be used in high-current areas, while small-section metal lines 110 can be used in signal transmission areas. After being cut into sheets, the conductive structure formed by each metal line 110 penetrating both sides of the board 150 can meet the performance requirements of multi-level circuits. Furthermore, this embodiment avoids the process complexity caused by processing multi-shaped metal lines 110 by combining metal lines 110 with uniform shape but differentiated size. It also solves the technical problem of functional partitioning of metal lines 110 by adjusting the size. Under the premise of ensuring processing efficiency, it achieves precise adaptation of different conductivity requirements in the circuit board, effectively reduces processing errors when arranging high-density metal lines 110, and improves the yield rate in scenarios with thick boards 150 or small-diameter conductors.

[0049] It should be explained that the identical shape of the cross-section of the metal wires 110 means that the cross-sectional geometry of all metal wires 110 is consistent. Specifically, they can be circular, square, or hexagonal, etc. Consistency in shape helps to simplify the processing technology and ensure the accuracy of the arrangement.

[0050] In addition, the fact that the cross-sections of the metal wires 110 have the same shape but different sizes means that the cross-sections of the metal wires 110 have the same geometric shape but different dimensions. This can be achieved by adjusting the diameter or side length parameters of the metal wires 110. For example, the circular cross-section metal wires 110 can be selected with different diameter specifications such as 10 micrometers and 20 micrometers. The size difference can be adapted to different current carrying requirements.

[0051] In other embodiments, the cross-sectional shapes of the multiple metal wires 110 are different.

[0052] It is understood that this embodiment uses a combination of metal wires 110 with different cross-sectional shapes, which can simultaneously achieve multiple electrical performance requirements in a single molding process. This avoids the process complexity caused by multiple drilling and electroplating in traditional processes. It can flexibly configure metal wires 110 with different cross-sectional shapes according to circuit design requirements. While ensuring double-sided conductivity, it effectively solves the problem of limited electrical performance caused by the shape of a single metal wire 110 when laying out high-density metal wires 110.

[0053] It should be explained that the different shapes of the cross-section of the metal wire 110 refer to the fact that the metal wire 110 has different geometric contours on the cross-section perpendicular to the length direction. Specifically, it can adopt a circular, rectangular, polygonal or irregular structure. The metal wires 110 of different shapes form differentiated conductor structures in the cured insulating medium 130.

[0054] Specifically, when arranging multiple metal wires 110 in the positioning fixture 100, by selecting combinations of metal wires 110 with different cross-sectional shapes, such as alternating between circular cross-sectional metal wires 110 and rectangular cross-sectional metal wires 110, after injecting insulating medium 130 and curing, conductor structures of different shapes can simultaneously meet the cross-sectional area requirements for high-frequency signal transmission and high current carrying. After being cut into circuit boards, metal wires 110 of different shapes directly form a conductive path that runs through both sides, without the need for subsequent drilling and in-hole metallization.

[0055] In other embodiments, the cross-sectional size and shape of the multiple metal wires 110 are different.

[0056] It is understood that this embodiment directly forms a through conductive path by pre-configuring differentiated metal lines 110 before molding, avoiding secondary processing steps. It is especially suitable for the manufacturing of high-density circuit boards that need to integrate multiple functional conductors, realizing diversified integration of conductor shapes. Conductive paths with different electrical characteristics are constructed simultaneously in a single molding process, solving the problems of low processing efficiency and poor structural stability of irregular conductors in the prior art, and effectively improving the production yield and reliability of complex circuit boards.

[0057] It should be explained that the different sizes and shapes of the cross-sections of the metal wires 110 refer to the differences in size and geometric shape of the metal wires 110 in the cross-section perpendicular to the length direction. Specifically, it can be achieved by using a combination of circular, rectangular, polygonal or irregular cross-sections. Different structural designs can meet different current carrying capacities and spatial layout requirements.

[0058] Specifically, multiple metal wires 110 are tightened and fixed in a preset arrangement in the positioning fixture 100. The cross-sections of each metal wire 110 have different configurations in terms of size and shape. For example, circular cross-section metal wires 110 and flat rectangular cross-section metal wires 110 can be arranged alternately, and their diameter or thickness parameters are different. During the injection molding process, molten insulating medium 130 fills the gaps between the metal wires 110 and solidifies. In the circuit board formed after solidification, metal wires 110 with different cross-sectional characteristics can be adapted to various electrical requirements such as high-frequency signal transmission and high current carrying.

[0059] In some specific embodiments, in step S200, an insulating medium 130 is injected into the cavity of the molding die 120 using an injection molding machine.

[0060] Understandably, traditional processes rely on mechanical drilling or laser drilling to form through holes, which requires additional metallization deposition or conductor embedding, resulting in complex processing steps and problems such as rough hole walls or conductor misalignment. In contrast, this embodiment directly achieves the integrated bonding of the insulating medium 130 and the metal wire 110 through injection molding, eliminating the need for subsequent drilling and metallization processes. This reduces the impact of processing steps on conductor position accuracy and is especially suitable for scenarios with small conductor diameters or high arrangement density.

[0061] This embodiment can effectively avoid conductor damage or dielectric layer defects caused by multiple processing steps in traditional processes, significantly improve the reliability and consistency of the double-sided conductive structure of the circuit board, and simplify the manufacturing process and reduce dependence on complex processing equipment.

[0062] It should be explained that an injection molding machine is a device that injects molten insulating medium 130 into a closed mold using mechanical pressure. Specifically, it can be a screw-type injection molding machine or a plunger-type injection molding machine. Its function is to ensure that the insulating medium 130 fills the cavity evenly during the flow process by precisely controlling the injection pressure and temperature, avoiding internal defects caused by local incomplete filling or air bubbles.

[0063] The cavity of the molding die 120 refers to a pre-designed hollow structure for accommodating the metal wire 110 and the insulating medium 130. It can be implemented using a split mold or an integral mold. Its function is to provide a fixed support space for the metal wire 110 and to constrain the curing form of the insulating medium 130 through the geometry of the inner wall of the mold, thereby ensuring the structural accuracy of the circuit board.

[0064] Specifically, after the metal wires 110 are tightened and arranged by the positioning fixture 100, the molding die 120 closes to form a sealed cavity. The barrel of the injection molding machine heats the solid insulating material to a molten state, and then injects the molten medium into the cavity under high pressure through the pushing action of the screw or plunger. During this process, the metal wires 110 are completely wrapped by the molten insulating medium 130. After the insulating medium 130 cools and solidifies in the mold, it forms a dense insulating layer.

[0065] In some specific embodiments, in step S400, the ingot is cut into multiple plates 150 of equal or unequal thickness along the radial direction of the metal wire 110 according to the required thickness, to obtain multiple circuit boards.

[0066] It is understood that in this embodiment, by cutting the ingot along the radial direction of the metal wire 110 into multiple plates 150 of equal or unequal thickness according to the required thickness, multiple circuit boards with the same thickness specifications or multiple circuit boards with different thickness specifications can be obtained, thereby meeting the flexibility requirements of circuit board manufacturing.

[0067] Example 2 Reference Figure 6 and Figure 7 This embodiment provides a circuit board based on electrical conductivity. The circuit board is manufactured using a circuit board manufacturing process based on electrical conductivity provided in Embodiment 1, and includes a board body 150 and metal lines 110 penetrating both sides of the board body 150.

[0068] Specifically, the plate 150 is a structure formed by curing the insulating medium 130. It can be made of epoxy resin or polyimide material through injection molding process. Its function is to provide fixed support and electrical isolation for the metal wire 110.

[0069] Among them, the metal wire 110 that runs through both sides of the plate 150 is a conductor that is pre-positioned in the forming mold 120. Specifically, it can be made of copper wire, aluminum wire or alloy wire through a tensioning and positioning process. Its function is to form a conductive channel through both sides of the plate 150 inside the plate 150 so as to realize double-sided electrical conduction of the plate 150.

[0070] Specifically, during the manufacturing process, the metal wire 110 is pre-tensioned and fixed in a specific spatial position by the positioning fixture 100. Subsequently, the insulating medium 130 is injected into the mold to wrap the metal wire 110. After curing, the resulting plate 150 is cut to obtain the required thickness. Since the metal wire 110 is completely embedded inside the insulating medium 130 during the forming stage, a conductive structure that runs through both sides can be formed without subsequent drilling or metallization.

[0071] In some specific embodiments, the metal wires 110 may be arranged in a parallel array, an interlaced grid, or a radial distribution pattern, for example, using copper wires with a diameter of 0.05 mm to 0.5 mm arranged in parallel at a spacing of 0.1 mm. The insulating medium 130 may be an epoxy resin composite material with added glass fibers, for example, injected into a mold cavity at 150°C using an injection molding machine.

[0072] This embodiment eliminates the limitation on the thickness of the board 150 caused by the drilling process by directly constructing conductive channels during the molding stage, thus avoiding potential breakage problems in the metallized hole walls. For metal lines 110 with a diameter of less than 10 micrometers or board 150 thickness exceeding 5 millimeters, the circuit board of this embodiment can maintain the integrity of the conductive structure.

[0073] This embodiment solves the problem of difficult processing when the conductor diameter is too small or the plate 150 is too thick in the prior art. It achieves precise positioning of high-density metal wire 110 through a one-time molding process, avoiding damage to the micro conductive structure by secondary processing. It is especially suitable for application scenarios that require dense micro conductors, such as medical electrode plates.

[0074] In the description of this specification, the references to terms such as "an embodiment, some embodiments, illustrative embodiments, example, specific example, or examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0075] The terms "first," "second," "third," "fourth," etc. (if applicable) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein.

[0076] It should also be noted that, in the description of this specification, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0077] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may also include other steps or units that are not explicitly listed or that are inherent to such processes, methods, products, or apparatus.

[0078] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0079] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A circuit board manufacturing process based on double-sided electrical conductivity, characterized in that, Includes the following steps: Step S100: Use a positioning fixture to tighten and position the metal wire; Step S200: Place the positioning fixture after tightening the positioning metal wire into the cavity of the forming mold, and inject the molten insulating medium into the cavity of the forming mold; Step S300: After the insulating medium in the cavity of the molding die has solidified, remove the positioning fixture and dismantle the positioning fixture to obtain the ingot material; Step S400: Cut the ingot into pieces along the radial direction of the metal wire to the required thickness to obtain a circuit board with the metal wire running through both sides.

2. The circuit board manufacturing process based on double-sided electrical conductivity according to claim 1, characterized in that, In step S100, the positioning fixture clamps both ends of the fixed metal wire to tighten and position the metal wire.

3. The circuit board manufacturing process based on double-sided electrical conductivity according to claim 1, characterized in that, In step S100, the positioning fixture arranges and tightens multiple metal wires according to the designed arrangement.

4. The circuit board manufacturing process based on double-sided electrical conductivity according to claim 3, characterized in that, The cross-sections of the multiple metal wires are identical in shape and size.

5. The circuit board manufacturing process based on double-sided electrical conductivity according to claim 3, characterized in that, The cross-sections of the multiple metal wires have the same shape but different sizes.

6. The circuit board manufacturing process based on double-sided electrical conductivity according to claim 3, characterized in that, The cross-sectional shapes of the multiple metal wires are different.

7. The circuit board manufacturing process based on double-sided electrical conductivity according to claim 3, characterized in that, The cross-sectional dimensions and shapes of the multiple metal wires are all different.

8. The circuit board manufacturing process based on double-sided electrical conductivity according to claim 1, characterized in that, In step S200, an insulating medium is injected into the cavity of the molding die using an injection molding machine.

9. The circuit board manufacturing process based on double-sided electrical conductivity according to claim 1, characterized in that, In step S400, the ingot is cut into multiple plates of equal or unequal thickness along the radial direction of the metal wire to obtain multiple circuit boards.

10. A circuit board based on double-sided electrical conductivity, characterized in that, The circuit board is manufactured using the circuit board manufacturing process based on double-sided electrical conductivity as described in any one of claims 1 to 9, and includes a board body and metal lines penetrating both sides of the board body.

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