Server cooling devices and server cooling control methods

Abstract

This application discloses a server heat dissipation device and a server heat dissipation control method. The server heat dissipation device includes a heat dissipation circuit, a heat exchange circuit for exchanging heat with the heat dissipation circuit, a cooling component, and a heat exchange box. The heat dissipation circuit has a first heat dissipation section, a first heat exchange section, and a cooling element connected sequentially along the flow direction of a first cooling medium. The cooling element is used for heat exchange with the load. The heat exchange circuit includes a compressor, a second heat dissipation section, and a second heat exchange section connected sequentially along the flow direction of a second cooling medium. Both the first heat dissipation section and the second heat dissipation section are located at the cooling component. The cooling component dissipates heat from the first cooling medium located in the first heat dissipation section after heat exchange with the load, and dissipates heat from the second cooling medium located in the second heat dissipation section after compression by the compressor. Both the first heat exchange section and the second heat exchange section are located in the heat exchange box and cooperate in heat exchange within the heat exchange box, solving the technical problem of poor flexibility in server heat dissipation devices in related technologies.

Description

Technical Field

[0001] This application relates to the field of computer technology, and in particular to server heat dissipation devices and server heat dissipation control methods. Background Technology

[0002] Currently, the commonly used server liquid cooling technologies mainly include immersion liquid cooling and cold plate liquid cooling. Immersion liquid cooling directly immerses the server in a special coolant for heat dissipation. Due to its high overall operating cost and difficult maintenance, its application scale is relatively small. Cold plate liquid cooling utilizes a liquid-cooled cold plate that is in direct contact with the server's heat-generating components for heat dissipation. Its heat dissipation principle is that a coolant pump drives a heat exchange system, with a water pump continuously flowing coolant (water, ethylene glycol, etc.) through channels inside the cold plate. The coolant exchanges heat with the server's heat-generating components through the cold plate wall within the channels, thereby removing the heat generated by the server's heat-generating components to achieve the purpose of heat dissipation. Currently, conventional cold plate liquid cooling server cooling supply systems must rely on large outdoor cold sources such as outdoor chillers or cooling towers for cooling, and rely on multiple large systems, including a primary side pump drive system, a primary side piping system, a liquid cooling distribution device, a secondary side piping system, and a water distributor, to meet the heat dissipation needs of liquid-cooled servers. The construction process requires the purchase and installation of outdoor chillers, cooling towers, primary and secondary side coolant circulation pipelines, power supply and other facilities. It involves a large amount of infrastructure construction and basic renovation, and its disadvantages such as high construction difficulty, long construction period and large resource investment are particularly obvious, resulting in poor flexibility. Summary of the Invention

[0003] This application provides a server heat dissipation device and a server heat dissipation control method to at least solve the problem of poor flexibility of server heat dissipation devices in related technologies.

[0004] This application provides a server heat dissipation device, including a heat dissipation circuit, a heat exchange circuit for exchanging heat with the heat dissipation circuit, a cooling component, and a heat exchange box. The heat dissipation circuit has a first heat dissipation section, a first heat exchange section, and a cooling element connected sequentially along the flow direction of a first cooling medium. The cooling element is used for exchanging heat with the load. The heat exchange circuit includes a compressor, a second heat dissipation section, and a second heat exchange section connected sequentially along the flow direction of a second cooling medium. The first heat dissipation section and the second heat dissipation section are both located at the cooling component. The cooling component dissipates heat from the first cooling medium located in the first heat dissipation section after exchanging heat with the load, and dissipates heat from the second cooling medium located in the second heat dissipation section after being compressed by the compressor. The first heat exchange section and the second heat exchange section are both located in the heat exchange box and cooperate in heat exchange within the heat exchange box.

[0005] This application also provides a server heat dissipation control method using the aforementioned server heat dissipation device, comprising: acquiring the liquid supply temperature at the inlet of the cooling component; comparing the liquid supply temperature with the ambient temperature; when the liquid supply temperature is greater than or equal to the ambient temperature, comparing the cooling capacity of the cooling component with the heat generated by the load; when the cooling capacity of the cooling component is greater than or equal to the heat generated by the load, starting the cooling component and turning off the compressor; when the cooling capacity of the cooling component is less than the heat generated by the load, starting the cooling component and the compressor; when the liquid supply temperature is less than the ambient temperature, acquiring the liquid return temperature at the outlet of the cooling component, comparing the liquid return temperature with the ambient temperature; when the liquid return temperature is greater than or equal to the ambient temperature, starting the cooling component and the compressor; when the liquid return temperature is less than the ambient temperature, starting the compressor and turning off the first heat dissipation section.

[0006] This application improves the flexibility of server cooling devices by configuring a cooling circuit, heat exchange circuit, cooling components, and a heat exchange box. This avoids the problems of conventional cold-plate liquid-cooled server cooling systems, such as high construction difficulty, inability to adaptively adjust the liquid supply status, and lack of easy relocation and reuse. Specifically, on the one hand, the cooling components in this embodiment can dissipate heat not only from the first cooling medium after heat exchange with the load but also from the second cooling medium compressed by the compressor, achieving high efficiency and compactness in dual-medium cooling. On the other hand, the first and second heat exchange sections within the heat exchange box cooperate to simultaneously exchange heat between the two cooling media, further simplifying the structure of the server cooling device and improving its cooling effect, thus enhancing the flexibility of server cooling device deployment. Furthermore, the modular design of the cooling circuit, heat exchange circuit, cooling components, and heat exchange box allows for easy relocation and reuse of the server cooling device, further reducing the threshold and complexity of liquid cooling environment deployment and further improving the flexibility of the server cooling device. Attached Figure Description

[0007] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 This is a schematic diagram of the server heat dissipation device of this application;

[0009] Figure 2 This is a schematic diagram of the cooling components, heat exchange circuit, and part of the heat dissipation circuit of this application;

[0010] Figure 3This is a schematic diagram of the cooling components and heat exchange circuit of this application;

[0011] Figure 4 This is a schematic diagram of the cooling components and part of the heat dissipation circuit of this application;

[0012] Figure 5 This is a schematic diagram of the structure of the spray assembly of this application;

[0013] Figure 6 This is a schematic diagram of the heat exchange box in this application;

[0014] Figure 7 For the purposes of this application, it is distinguished from Figure 4 A schematic diagram of the structure of another part of the heat dissipation circuit;

[0015] Figure 8 This is a schematic diagram of the liquid supply pipe section and heat dissipation branch of this application;

[0016] Figure 9 This is a schematic diagram of the return pipe section of this application;

[0017] Figure 10 This is a schematic diagram of the server heat dissipation control method of this application.

[0018] The above figures include the following reference numerals:

[0019] 10. Heat dissipation circuit; 11. Main circuit; 111. First heat dissipation section; 112. First heat exchange section; 1121. First heat exchange end; 1122. Second heat exchange end; 113. Cooling component; 114. Heat dissipation liquid supply flow sensor; 115. Heat dissipation inlet pressure sensor; 116. Heat dissipation inlet temperature sensor; 117. Heat dissipation outlet temperature sensor; 118. Heat dissipation outlet pressure sensor; 12. Heat dissipation branch; 121. End; 13. Adjusting component; 14. Liquid supply pipe section; 141. Ultraviolet sterilization device; 142. Filtration device; 1421. Filter; 1422. 1423. Inlet pressure sensor; 1424. Outlet pressure sensor; 1425. Inlet valve; 1426. Outlet valve; 143. Visual monitoring device; 144. Pressure measuring element; 15. Return liquid pipe section; 151. Return liquid flow sensor; 152. Return liquid check valve; 153. Pump drive suction flow sensor; 16. Temperature measuring element; 17. Bypass pipe section; 18. Regulating valve; 19. Pump drive assembly; 191. Return liquid inlet valve; 192. Pump drive component; 193. Pump drive outlet pressure sensor; 194. Return liquid outlet valve; 195. Pump drive safety overflow component; 196. Pump drive check valve; 20. Heat exchange return... Path; 21. Compressor; 22. Second heat dissipation section; 23. Second heat exchange section; 231. Heat exchange coil; 2311. Inlet side; 2312. Outlet side; 241. Refrigerant inlet temperature sensor; 242. Refrigerant inlet pressure sensor; 243. Gas-liquid separator; 244. Inlet switch; 245. Dryer filter; 246. Compressor outlet check valve; 247. Condenser inlet pressure sensor; 248. Condenser inlet temperature sensor; 251. Condenser outlet temperature sensor; 252. Condenser outlet pressure sensor; 253. Refrigerant outlet filter; 254. Condenser outlet... 255. Inlet switch; 256. Heat exchanger inlet check valve; 257. Throttling and pressure reducing valve; 258. Heat exchanger inlet pressure sensor; 259. Heat exchanger inlet temperature sensor; 30. Cooling assembly; 31. Air-cooled component; 32. Spray assembly; 321. Spray component; 322. Recovery tank; 323. Spray drive component; 3231. Switch section; 3232. Adjustment section; 324. Spray filter component; 325. Spray check component; 326. Spray flow sensor; 40. Heat exchanger box; 41. Mixed liquid storage tank; 42. Mixed liquid pressure stabilizer; 43. Mixed liquid pressure sensor; 44. Mixed liquid temperature sensor. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0021] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] The embodiments of this application provide a server heat dissipation device and a server heat dissipation control method. The server heat dissipation control method uses the server heat dissipation device described below. The server chassis is described in detail in conjunction with the structure and function of the server heat dissipation device.

[0024] like Figures 1 to 9A server heat dissipation device is shown, including a heat dissipation circuit 10, a heat exchange circuit 20 for exchanging heat with the heat dissipation circuit 10, a cooling assembly 30, and a heat exchange box 40. The heat dissipation circuit 10 has a first heat dissipation section 111, a first heat exchange section 112, and a cooling element 113 connected sequentially along the flow direction of a first cooling medium. The cooling element 113 is used for exchanging heat with the load. The heat exchange circuit 20 includes a compressor 21, a second heat dissipation section 22, and a second heat exchange section 23 connected sequentially along the flow direction of a second cooling medium. The first heat dissipation section 111 and the second heat dissipation section 22 are both located at the cooling assembly 30. The cooling assembly 30 dissipates heat from the first cooling medium located in the first heat dissipation section 111 after exchanging heat with the load, and dissipates heat from the second cooling medium located in the second heat dissipation section 22 after being compressed by the compressor 21. The first heat exchange section 112 and the second heat exchange section 23 are both located in the heat exchange box 40 and cooperate in heat exchange within the heat exchange box 40.

[0025] This embodiment improves the flexibility of the server cooling system by setting up a cooling circuit 10, a heat exchange circuit 20, a cooling component 30, and a heat exchange box 40. This avoids the problems of conventional cold-plate liquid-cooled server cooling systems, such as high construction difficulty, inability to adaptively adjust the supply state, and lack of convenient relocation and reuse. Specifically, on the one hand, the cooling component 30 in this embodiment can dissipate heat not only from the first cooling medium after heat exchange with the load but also from the second cooling medium compressed by the compressor 21, achieving high efficiency and compactness in dual-medium cooling. On the other hand, the first heat exchange section 112 and the second heat exchange section 23 within the heat exchange box 40 cooperate in heat exchange, enabling simultaneous heat exchange between the two cooling media. This further simplifies the structure of the server cooling system and improves the cooling effect, thereby enhancing the flexibility of the server cooling system's heat dissipation and deployment. Furthermore, the modular design of the heat dissipation circuit 10, heat exchange circuit 20, cooling component 30, and heat exchange box 40 allows the server heat dissipation device to be easily moved and reused, thereby further reducing the threshold and complexity of liquid cooling environment deployment and further improving the flexibility of the server heat dissipation device.

[0026] It should be noted that the first cooling medium in this embodiment is coolant, which can be water. The cooling medium in the heat dissipation circuit 10, the cooling component 30, and the heat exchange box 40 can all be water. The second cooling medium is refrigerant, and a suitable refrigerant can be selected according to the actual heat dissipation requirements. Figures 1 to 9The arrows indicate the flow direction of the first or second cooling medium. The letter P represents a pressure sensor, used to detect pressure at the corresponding location; the letter T represents a temperature sensor, used to detect temperature at the corresponding location; the letter F represents a flow sensor, used to detect flow rate at the corresponding location; and the letter M represents a motor, typically mounted on a drive unit, used to control the on / off state at the corresponding location. Figure 1 The M in the text represents the switch part 3231 of the spray drive unit 323, which is an electric switch valve equipped with a motor.

[0027] In this embodiment, the cooling assembly 30 includes an air-cooled component 31 and a spray assembly 32. The air-cooled component 31 has a blowing area for heat dissipation, and the first heat dissipation section 111 and the second heat dissipation section 22 are both located within the blowing area. The spray assembly 32 has a spray area for cooling, and the first heat dissipation section 111 and the second heat dissipation section 22 are both located within the spray area. Thus, the cooling assembly 30 integrates the air-cooled component 31 and the spray assembly 32. The first heat dissipation section 111 and the second heat dissipation section 22 share the air-cooled component 31 and the spray assembly 32, thereby achieving a dual cooling effect by simultaneously cooling the second cooling medium and the first cooling medium through natural cooling. This improves the temperature of the first and second cooling media to meet heat dissipation requirements, eliminates the need for other heat exchange devices, achieves high heat exchange efficiency and low energy consumption, and significantly improves the coefficient of performance (COP) of the server cooling system. Specifically, optionally, the air-cooled component 31 can be a fan, with its airflow area covering both heat dissipation sections. Forced convection cooling accelerates the heat dissipation of the first and second cooling media. Similarly, the spray assembly 32's spray area also covers both heat dissipation sections, employing water mist spraying and evaporative heat absorption to further enhance the cooling effect inside and outside the first heat dissipation section 111 and the second heat dissipation section 22. Especially in high-temperature environments, the spray assembly 32 can significantly improve heat dissipation efficiency. This design not only optimizes the cooling effect and achieves efficient utilization of cooling resources but also simplifies the structure of the server cooling device, effectively reducing its power consumption and size, significantly improving its utilization rate, and reducing space occupation, thereby enhancing the overall flexibility and economy of the server cooling device.

[0028] Preferably, the spray assembly 32 can automatically start and stop according to the heat dissipation requirements of the first heat dissipation section 111 and the second heat dissipation section 22, and the spray volume of the spray assembly 32 can be adjusted and the spray water can be recycled, thereby enabling the server heat dissipation device to automatically adjust the cooling strategy under different operating conditions, ensuring the cooling effect while reducing water waste. The spray water used by the spray assembly 32 and the first cooling medium of the heat dissipation circuit 10 can both be water.

[0029] In this embodiment, the spray assembly 32 includes a spray element 321, a recovery tank 322, and a spray drive 323. The spray element 321 has spray nozzles facing the first heat dissipation section 111 and the second heat dissipation section 22. When spraying, the nozzles form a spray area. The recovery tank 322 is located below the spray area. The spray drive 323 is located between the recovery tank 322 and the spray element 321. The spray drive 323 drives the first cooling medium to circulate between the recovery tank 322 and the spray element 321, and can adjust the spray flow rate of the spray element 321, thereby ensuring cooling effect while optimizing water resource utilization. Specifically, as... Figure 2 , Figure 5 As shown, in this embodiment, the spray element 321 is located on one side of the first heat dissipation section 111 and the second heat dissipation section 22. The spray drive element 323 may include a switch part 3231 and an adjustment part 3232. The switch part 3231 may be configured as an electric switch valve to realize the automatic opening and closing of the spray element 321. The adjustment part 3232 may be configured as a spray drive pump to adjust the spray flow rate of the spray element 321 according to the heat dissipation requirements of the first heat dissipation section 111 and the second heat dissipation section 22. The spray element 321 may be configured as a spray disperser to ensure the dispersion effect of water, thereby improving the cooling effect on the first heat dissipation section 111 and the second heat dissipation section 22. The recycling tank 322 can be located below the first heat dissipation section 111, the second heat dissipation section 22, and the spray component 321, so as to recycle and reuse the water sprayed by the spray component 321. The recycling tank 322, the spray drive component 323, and the spray component 321 of the spray assembly 32 are arranged sequentially along the water flow direction. The side or bottom of the recycling tank 322 is provided with an interface for connecting to the spray drive component 323, so that the spray drive component 323 can transport the water recycled into the recycling tank 322 back to the spray component 321.

[0030] Preferably, a spray filter element 324 for filtering water, a spray check valve element 325 for achieving unidirectional water flow, and a spray flow sensor 326 for detecting spray flow can be provided between the spray drive element 323 and the spray element 321. This allows the water in the recovery tank 322 to be filtered and then transported to the spray element 321, where the water is simultaneously filtered and the spray flow is detected, thereby ensuring the normal operation of the spray assembly 32.

[0031] like Figure 3 , Figure 4As shown, in this embodiment, both the first heat dissipation section 111 and the second heat dissipation section 22 are configured as heat dissipation coils extending in an S-shape. The heat dissipation coils include multiple heat dissipation pipe segments that are interconnected. The heat dissipation pipe segments of the first heat dissipation section 111 and the second heat dissipation section 22 are arranged side by side, thereby making the structure of the first heat dissipation section 111 and the second heat dissipation section 22 compact and able to obtain a good heat dissipation effect. Specifically, in this embodiment, the air-cooling component 31 blows air in a horizontal direction and the spraying component 321 sprays air in a horizontal direction. Each heat dissipation pipe segment is arranged along the air-blowing direction, and the heat dissipation pipe segments of the first heat dissipation section 111 and the second heat dissipation section 22 are arranged alternately along the air-blowing direction, thereby forming a double row of independent heat dissipation coils. The air from the air-cooling component 31 blows onto the surface of the heat dissipation coils, and the water mist sprayed by the spraying component 321 is directly sprayed onto the surface of the heat dissipation coils. This fully utilizes the cooling effect of the air from the air-cooling component 31 and the heat absorption effect of the water mist evaporation from the spraying component 321, thereby improving the heat dissipation and cooling effect of the first cooling medium inside the first heat dissipation section 111 and the second cooling medium inside the second heat dissipation section 22, which helps to reduce the energy consumption of the server heat dissipation device.

[0032] like Figure 4 , Figure 7 As shown, in this embodiment, the first heat exchange section 112 includes a first heat exchange end 1121 and a second heat exchange end 1122. Both the first heat exchange end 1121 and the second heat exchange end 1122 are located inside the heat exchange box 40 and are in communication with the heat exchange box 40. The first cooling medium enters the heat exchange box 40 from the first heat exchange end 1121 and mixes with the first cooling medium in the heat exchange box 40 before flowing into the second heat exchange end 1122. In this way, the second heat exchange section 23 can perform heat exchange and cooling on the first cooling medium in the heat exchange box 40, and the first cooling medium output from the first heat exchange end 1121 can also... It can exchange heat with the first cooling medium in the heat exchange box 40. Unlike the second heat exchange section 23, the first heat exchange section 112 flows into the heat exchange box 40 through the first cooling medium in the first heat exchange end 1121 and mixes with the first cooling medium in the heat exchange box 40 for heat exchange. After heat exchange, the first cooling medium flows from the second heat exchange end 1122 to the cooling element 113, where the cooling element 113 cools the load. The first cooling medium flowing out of the cooling element 113 can flow back into the first heat dissipation section 111 for cooling, thereby achieving heat dissipation for the load.

[0033] In this embodiment, the heat dissipation circuit 10 includes a main circuit 11 and a heat dissipation branch 12. The main circuit 11 has a first heat dissipation section 111, a first heat exchange section 112, and a cooling element 113. These components work together to ensure effective heat exchange of the first cooling medium during circulation. The heat dissipation branch 12 is connected to the main circuit 11, and its connection point is located between the cooling element 113 and the first heat dissipation section 111. The end 121 of the heat dissipation branch 12 is located within and connected to the heat exchange box 40. The first cooling medium, after heat exchange by the cooling element 113, flows into the first heat dissipation section 111 and / or the heat dissipation branch 12. Thus, the heat dissipation circuit 10 is divided into a main circuit 11 and a heat dissipation branch 12, allowing the first cooling medium to selectively flow into the first heat exchange section 1121 or the heat dissipation branch 12, thereby optimizing cooling efficiency and resource allocation and enhancing system flexibility. In other words, as... Figure 4 As shown, in this embodiment, the heat dissipation branch 12 is connected in parallel to both ends of the integral formed by the first heat dissipation section 111 and the first heat exchange end 1121, thereby allowing the first cooling medium to directly enter the heat exchange box 40 for cooling without passing through the first heat dissipation section 111 when necessary, thus achieving more precise temperature control. Through the dynamic switching of the main circuit 11 and the heat dissipation branch 12, this embodiment can optimize energy consumption according to actual needs while ensuring the cooling effect, reducing unnecessary resource waste, and improving the overall system energy efficiency. Optionally, the first heat exchange end 1121, the second heat exchange end 1122, and the end 121 of the heat dissipation branch 12 can all be configured as a mixer to facilitate the mixing and heat exchange of the first cooling medium with the cooling medium in the heat exchange box 40. The first heat exchange end 1121 and the end 121 of the heat dissipation branch 12 can be configured as an outlet mixer, and the second heat exchange end 1122 can be configured as an inlet mixer.

[0034] In this embodiment, the heat dissipation circuit 10 further includes an adjusting component 13. The adjusting component 13 is located at the connection point between the heat dissipation branch 12 and the main circuit 11. The adjusting component 13 is used to adjust the flow rate of the first cooling medium through the first heat dissipation section 111 and the heat dissipation branch 12. Thus, when the first cooling medium flows out from the cooling component 113 and reaches the adjusting component 13, the adjusting component 13 can adjust the flow rate of the first cooling medium into the first heat dissipation section 111 and the heat dissipation branch 12 according to the heat dissipation requirements of the load. It can also adjust the flow rate so that the first cooling medium only flows into the first heat dissipation section 111 or only into the heat dissipation branch 12, thereby dynamically controlling the distribution flow rate of the first cooling medium between these two paths, thereby optimizing heat dissipation efficiency, improving the flexibility of the server heat dissipation device, and avoiding resource waste. Optionally, the adjusting component 13 can be configured as a flow distribution valve.

[0035] Preferably, the main circuit 11 further includes a heat dissipation liquid flow sensor 114 for detecting the flow rate at the inlet of the first heat dissipation section 111, a heat dissipation inlet pressure sensor 115 for detecting the pressure at the inlet of the first heat dissipation section 111, a heat dissipation inlet temperature sensor 116 for detecting the temperature at the inlet of the first heat dissipation section 111, a heat dissipation outlet temperature sensor 117 for detecting the temperature at the outlet of the first heat dissipation section 111, and a heat dissipation outlet pressure sensor 118 for detecting the pressure at the outlet of the first heat dissipation section 111. Along the flow direction of the first cooling medium, the heat dissipation liquid flow sensor 114, the heat dissipation inlet pressure sensor 115, the heat dissipation inlet temperature sensor 116, the first heat dissipation section 111, the heat dissipation outlet temperature sensor 117, the heat dissipation outlet pressure sensor 118, and the first heat exchange end 1121 are sequentially connected and arranged. When the cooling assembly 30 is working, the high-temperature coolant carrying the load heat reaches the adjusting component 13 through the return pipe section 15. The adjusting component 13 can intelligently regulate the flow rate of coolant entering the first heat dissipation section 111 and the heat dissipation branch 12, thereby controlling the temperature of the coolant inside the heat exchange box 40. The heat exchange box 40 can fully mix the high-temperature coolant with the coolant inside the heat exchange box 40, thereby ensuring the temperature consistency inside the heat exchange box 40. After the high-temperature coolant reaches the cooling assembly 30, it is cooled down to a low-temperature coolant by the combined action of forced convection of the air-cooled component 31 and spray evaporation and heat absorption of the spray component 32. Subsequently, the coolant reaches the first heat exchange end 1121 and enters the heat exchange box 40 to fully mix with the coolant inside the heat exchange box 40, thereby ensuring the temperature consistency inside the heat exchange box 40.

[0036] In this embodiment, the heat dissipation circuit 10 further includes a liquid supply pipe section 14, a liquid return pipe section 15, and a temperature measuring element 16. The liquid supply pipe section 14 is located between the first heat exchange section 112 and the cooling component 113, and the liquid return pipe section 15 is located between the cooling component 113 and the first heat dissipation section 111. The cooling component 113 is connected to the first heat exchange section 112 through the liquid supply pipe section 14, and the cooling component 113 is connected to the first heat dissipation section 111 through the liquid return pipe section 15. A temperature measuring element 16 is provided on both the liquid supply pipe section 14 and the liquid return pipe section 15. The temperature measuring element 16 is used to detect the liquid supply temperature of the liquid supply pipe section 14 and the liquid return temperature of the liquid return pipe section 15, thereby enabling the heat dissipation circuit 10 to integrate a temperature detection function. This allows for dynamic monitoring of the load's heat dissipation requirements based on the temperatures of the liquid supply pipe section 14 and the liquid return pipe section 15, and timely adjustment of the heat dissipation strategy. Specifically, the temperature measuring element 16 can be a temperature sensor. In this embodiment, after the first cooling medium in the heat dissipation circuit 10 cools the load at the cooling element 113, it flows into the adjusting element 13 through the return liquid pipe section 15, and the return liquid temperature is detected at the return liquid pipe section 15. The first cooling medium is split at the adjusting element 13, and according to the heat dissipation requirements, the first cooling medium can flow from the adjusting element 13 to the first heat dissipation section 111, and the cooling component 30 dissipates heat from the first heat dissipation section 111. The cooled first cooling medium continues to flow to the first heat exchange end 1121, and is mixed with the first cooling medium in the heat exchange box 40 for heat exchange. Then the first cooling medium enters the supply liquid pipe section 14 from the second heat exchange end 1122, and the supply liquid temperature is detected at the supply liquid pipe section 14. Then it flows into the cooling element 113 to cool the load, thereby forming a complete circulation circuit.

[0037] In this embodiment, the cooling component 113 can be configured as a cold plate assembly, etc. The load is usually composed of liquid-cooled servers and liquid-cooled cabinets and other related liquid-cooled products. The large amount of heat generated during the operation of the load is heated by the cooling component 113 to raise the temperature of the low-temperature first cooling medium provided by the second heat exchange end 1122 to the high-temperature first cooling medium, and then transported by the return pipe section 15 to the first heat dissipation section 111 for cooling, thereby completing the heat transfer conversion and heat dissipation operation of the load.

[0038] Preferably, the heat dissipation circuit 10 further includes a pressure measuring element 144 for detecting the supply pressure and return pressure, an ultraviolet sterilization device 141 for ultraviolet sterilization of the first cooling medium, a filter device 142 for filtering the first cooling medium, a visual monitoring device 143 for monitoring the circulation status of the first cooling medium, a pump drive assembly 19 for driving the first cooling medium to circulate within the heat dissipation circuit 10, a return flow sensor 151 for detecting the flow rate of the first cooling medium flowing through the cooling element 113, a return check valve 152 for preventing the backflow of the first cooling medium, and a pump drive suction flow sensor 153 for measuring the total flow rate of the first cooling medium flowing through the cooling element 113 and the bypass pipe section 17. The pump drive assembly 19 includes a return inlet valve 191, a pump drive element 192, a pump drive outlet pressure sensor 193, a return outlet valve 194, a pump drive safety overflow element 195, and a pump drive check valve 196, etc. Along the flow direction of the first cooling medium, an ultraviolet sterilization device 141, a visual monitoring device 143, a filter device 142, a temperature measuring element 16, and a pressure measuring element 144 are sequentially arranged on the supply pipe section 14. Similarly, the pressure measuring element 144, the temperature measuring element 16, the return flow sensor 151, the return check valve 152, the pump drive suction flow sensor 153, and the pump drive assembly 19 are sequentially arranged on the return pipe section 15. Pressure measuring elements 144 are installed on both the supply pipe section 14 and the return pipe section 15 to ensure that the pressure of the first cooling medium entering the cooling unit 113 meets the usage requirements. Timely monitoring of the pressure in both the supply pipe section 14 and the return pipe section 15 is crucial for the differential pressure operation mode of the server cooling system. Optionally, the pressure measuring element 144 can be a pressure sensor. In this way, the first cooling medium in the heat dissipation circuit 10 is driven by the pump drive assembly 19 to circulate within the heat dissipation circuit 10, continuously transferring the heat generated by the server, switch, and other loads to the heat dissipation circuit 10, and completing the heat dissipation and cooling of the first cooling medium and the temperature control of the mixed liquid. Specifically, the first cooling medium in the heat dissipation circuit 10 can be uniformly introduced into the liquid supply pipe section 14 through the second heat exchange end 1122 under the drive of the pump drive assembly 19, and the ultraviolet sterilization technology of the ultraviolet sterilization device 141 is used to actively disinfect microorganisms and bacteria in the first cooling medium, preventing the occurrence of problems such as corrosion and damage to various components due to the contamination of coolant water quality caused by excessive microorganisms and bacteria in the first cooling medium.

[0039] In this embodiment, the return liquid inlet valve 191 and the return liquid outlet valve 194 of the pump drive assembly 19 are located on both sides of the pump drive component 192. Along the flow direction of the first cooling medium, the return liquid inlet valve 191, the pump drive component 192, and the return liquid outlet valve 194 are arranged in sequence. This allows the return liquid inlet valve 191 and the return liquid outlet valve 194 to be disconnected from other positions of the return liquid pipe section 15 when the pump drive component 192 needs maintenance. In this way, only the first cooling medium in the pipe section connected to the pump drive component 192 between the return liquid inlet valve 191 and the return liquid outlet valve 194 needs to be drained to carry out the relevant maintenance operations of the pump drive component 192, thereby avoiding the waste of manpower and material resources and the increased maintenance difficulty and cost caused by large-scale drainage. Along the flow direction of the first cooling medium, both the pump-driven check valve 196 and the pump-driven safety relief element 195 are located downstream of the pump-driven element 192. The pump-driven check valve 196 is mainly used to prevent the pump-driven element 192 from experiencing a decrease in driving force due to the backflow of the first cooling medium output from the pump-driven element 192. The pump-driven safety relief element 195 is mainly used to perform pressure relief operations when there is blockage or obstruction in the return pipe section 15, causing overpressure in the pipeline, thereby preventing pipeline rupture or damage to the pump-driven element 192 caused by overpressure.

[0040] Optionally, the visual monitoring device 143 can be designed with transparent tempered glass, allowing staff to intuitively and clearly view the circulation status of the first cooling medium at close range, including but not limited to the degree of water turbidity, the amount of impurities and bubbles in the water, and other related conditions.

[0041] Optionally, the pump drive component 192 of the pump drive assembly 19 can be a circulating pump, thereby continuously delivering the heated first cooling medium that has completed heat exchange with the load to the cooling component 30 for heat exchange and cooling, and delivering it to the first heat exchange section 112 for mixing, and delivering the first cooling medium that meets the heat dissipation requirements of the load to the cooling component 113 to meet the cooling and heat dissipation requirements of the load.

[0042] Optionally, the filtration device 142 may include a filter 1421, an inlet pressure sensor 1422 and an outlet pressure sensor 1423 for detecting the filter element status of the filter 1421, and an inlet valve 1424 and an outlet valve 1425 for facilitating filter 1421 replacement and maintenance. This allows for timely detection of the pressure difference between the inlet and outlet of the filter 1421, enabling timely assessment of the filter element's filtration capacity. When the pressure difference between the inlet and outlet of the filter 1421 exceeds a set value, it automatically alerts personnel to perform operations such as filter element cleaning and replacement. Simultaneously, the inlet valve 1424 and outlet valve 1425 can be configured to control the opening and closing of the liquid supply pipe section 14, facilitating filter 1421 replacement and maintenance and preventing leakage of the first cooling medium during filter 1421 replacement. The filter element of the filter 1421 may be designed as a washable stainless steel filter element, thereby removing impurities from the first cooling medium and preventing impurities from clogging the liquid supply pipe section 14 or damaging the impeller of the pump drive assembly 19.

[0043] In this embodiment, the server heat dissipation device also includes a control component, which is electrically connected to the temperature measuring element 16. The control component can acquire the temperature of the temperature measuring element 16 and compare the supply temperature measured by the temperature measuring element 16 on the supply pipe section 14 with the return temperature measured by the temperature measuring element 16 on the return pipe section 15 to determine whether the server heat dissipation device can meet the actual heat dissipation and cooling needs of the load. The control component can also control the opening and closing of the heat dissipation circuit 10 and the heat exchange circuit 20 according to the difference between the heat dissipation requirements of the server heat dissipation device and the load.

[0044] Preferably, the control unit is electrically connected to the pressure measuring element 144 on the supply pipe section 14 and the pressure measuring element 144 on the return pipe section 15. The control unit can obtain the pressure of the pressure measuring element 144 and compare the pressure values ​​of the pressure measuring element 144 on the supply pipe section 14 and the pressure measuring element 144 on the return pipe section 15 in order to determine whether the pump drive assembly 19 meets the actual use requirements and facilitates the implementation of the differential pressure control mode.

[0045] Preferably, the control unit is electrically connected to the return liquid flow sensor 151 and can acquire the flow data of the return liquid flow sensor 151 so as to be able to monitor the flow information of the first cooling medium flowing through the cooling unit 113 in real time and make relevant adjustments according to actual needs.

[0046] In this embodiment, the heat dissipation circuit 10 also includes a bypass pipe section 17 and a regulating valve 18. The two ends of the bypass pipe section 17 are connected to the liquid supply pipe section 14 and the liquid return pipe section 15, respectively. The regulating valve 18 is located on the bypass pipe section 17 and is used to regulate the flow rate of the first cooling medium in the bypass pipe section 17, thereby controlling the flow rate of the first cooling medium into the cooling component 113, so as to more flexibly meet different cooling needs. Specifically, the bypass pipe section 17 is connected to the liquid supply pipe section 14 between the filter device 142 and the temperature measuring element 16, thereby ensuring that the temperature measuring element 16 and the pressure measuring element 144 on the liquid supply pipe section 14 measure the temperature and pressure flowing through the cooling element 113; the bypass pipe section 17 is connected to the liquid supply pipe section 14 between the return liquid check valve 152 and the pump suction flow sensor, thereby ensuring that the temperature measuring element 16, the pressure measuring element 144 and the return liquid flow sensor 151 on the return liquid section 15 measure the temperature, pressure and flow rate flowing through the cooling element 113, and ensuring that the pump drive assembly 19 drives the circulation of the first cooling medium in the entire heat dissipation circuit 10, including the bypass pipe section 17, and ensuring that the flow rate measured by the pump drive suction flow sensor 153 is the flow rate of the first cooling medium in the entire heat dissipation circuit 10, including the bypass pipe section 17. Thus, when the heat dissipation demand of the load is lower than the minimum flow rate delivered by the pump drive assembly 19, the bypass pipe section 17 can be used to prevent a portion of the first cooling medium delivered by the pump drive assembly 19 from flowing through the cooling element 113. This allows the bypass pipe section 17 to effectively divert a portion of the first cooling medium, avoiding unnecessary overcooling under low load conditions and achieving energy savings. The opening of the regulating valve 18 can be automatically adjusted according to the heat dissipation demand. In other embodiments not shown, the layout and design parameters of the bypass pipe section 17 and the regulating valve 18 may differ, but their fundamental purpose is always to optimize the flow rate of the first cooling medium and balance the supply and demand of cooling capacity during system operation to achieve the best heat dissipation effect and resource utilization. The regulating valve 18 can also be electrically connected to the control components and work in conjunction with the heat exchange box 40 and the pump drive assembly to form a more complete closed-loop heat dissipation control system.

[0047] In this embodiment, the second heat exchange section 23 contacts and exchanges heat with the first cooling medium in the heat exchange box 40. The second heat exchange section 23 has an S-shaped heat exchange coil 231. The heat exchange coil 231 has an inlet side 2311 for the second cooling medium to flow in and an outlet side 2312 for the second cooling medium to flow out. The inlet side 2311 and the outlet side 2312 are both located in the heat exchange box 40 and are arranged opposite to each other. The first heat exchange end 1121 is located on the outlet side 2312, and the second heat exchange end 1122 is located on the inlet side 2311. This makes the second heat exchange end 1122 close to the inlet side 2311 with a lower temperature, thereby maximizing the supply of the lower temperature first cooling medium to the cooling element 113 to cool the load and avoiding the effect of uneven mixing of the first cooling medium in the heat exchange box 40, which would cause different temperatures at different locations and affect the cooling effect of the cooling element 113 on the load. Of course, depending on the actual situation, the second heat exchange section 23 can also be set to other structural forms, such as adding fins, as long as it can ensure sufficient heat exchange with the first cooling medium in the heat exchange box 40.

[0048] like Figure 6 As shown, in this embodiment, the heat exchange box 40 includes a mixed liquid storage tank 41, a mixed liquid pressure stabilizer 42, a mixed liquid pressure sensor 43, and a mixed liquid temperature sensor 44, thereby enabling real-time output of data such as pressure and temperature of the heat exchange box 40, and using the pressure stabilizer to ensure stable pressure inside the heat exchange box 40. The heat exchange box 40 has two main functions: firstly, it uses the low-temperature second cooling medium delivered by the first heat exchange section 112 of the heat exchange circuit 20 to exchange heat and cool the first cooling medium inside the heat exchange box 40; secondly, it uses the low-temperature first cooling medium delivered by the first heat exchange end 1121 of the heat dissipation circuit 10 to mix with the first cooling medium inside the heat exchange box 40 for cooling. Both aspects can maintain the first cooling medium inside the heat exchange box 40 within the temperature range required for load heat dissipation under different cooling modes.

[0049] In this embodiment, the heat exchange circuit 20 also includes a refrigerant pump and a refrigerant valve. The refrigerant pump and refrigerant valve work in conjunction with the compressor 21, the second heat exchange section 23, and the second heat dissipation section 22 to dynamically sense and adjust the heat exchange capacity to meet the load heat dissipation requirements. The main principle is to use the vaporization heat absorption and liquefaction heat release principle of the second cooling medium, i.e., the refrigerant, to generate cooling capacity. The heat generated by the load is carried away and discharged to the external environment through the cooperation of various components such as the second heat dissipation section 22, the spray assembly 32, the air-cooled component 31, the heat exchange box 40, and the pump drive assembly 19.

[0050] Preferably, the heat exchange circuit 20 further includes a refrigerant inlet temperature sensor 241 for detecting the inlet temperature of the compressor 21, a refrigerant inlet pressure sensor 242 for detecting the inlet pressure of the compressor 21, a gas-liquid separator 243 for gas-liquid separation, an inlet switch 244 for starting and stopping the compressor 21, a drying filter 245 for drying the second cooling medium, a compressor outlet check valve 246 for preventing the backflow of the second cooling medium, a condenser inlet pressure sensor 247 for detecting the inlet pressure of the second heat dissipation section 22, a condenser inlet temperature sensor 248 for detecting the inlet temperature of the second heat dissipation section 22, and a sensor for detecting... The following sensors are used to detect the outlet temperature of the second heat dissipation section 22: a condenser outlet temperature sensor 251, a condenser outlet pressure sensor 252, a refrigerant outlet filter 253, a condenser outlet switch 254, a heat exchange inlet check valve 255, a throttling and pressure reducing valve 256, a heat exchange inlet pressure sensor 257, and a heat exchange inlet temperature sensor 258. These sensors are used to detect the outlet temperature of the second heat exchange section 23. Figure 3As shown, along the flow direction of the second cooling medium, the following components are sequentially arranged: refrigerant inlet temperature sensor 241, refrigerant inlet pressure sensor 242, gas-liquid separator 243, inlet switch 244, dryer filter 245, compressor 21, compressor outlet check valve 246, condenser inlet pressure sensor 247, condenser inlet temperature sensor 248, second heat dissipation section 22, condenser outlet temperature sensor 251, condenser outlet pressure sensor 252, refrigerant outlet filter 253, condenser outlet switch 254, heat exchange inlet check valve 255, throttling and pressure reducing valve 256, heat exchange inlet pressure sensor 257, heat exchange inlet temperature sensor 258, and second heat exchange section 23. Since the second cooling medium in this embodiment is the refrigerant and the first cooling medium is the coolant, the second cooling medium is referred to as the refrigerant, and the first cooling medium as the coolant. When the heat exchange circuit 20 is working, the liquid refrigerant and the coolant exchange heat within the heat exchange box 40, respectively transforming into low-temperature, low-pressure gaseous refrigerant and low-temperature coolant. The low-temperature, low-pressure gaseous refrigerant, after heat exchange, enters the gas-liquid separator 243 for gas-liquid separation to ensure that all refrigerant entering the compressor 21 is gaseous. Subsequently, the inlet switch 244 for starting and stopping the compressor 21 automatically opens. The gaseous refrigerant, after being dried, dehumidified, and cleaned of impurities by the dryer filter 245, enters the compressor 21. Under the compression action of the compressor 21, the low-temperature, low-pressure gaseous refrigerant becomes a high-temperature, high-pressure gaseous refrigerant. To prevent the high-temperature, high-pressure gaseous refrigerant from flowing back into the compressor 21 and affecting its operation, a compressor outlet check valve 246 is installed at the compressor 21 outlet, ensuring the correct refrigerant flow direction. The high-temperature, high-pressure gaseous refrigerant then enters the second heat dissipation section 22 for heat release and cooling, releasing the heat it carries to the external environment. Simultaneously, the high-temperature, high-pressure gaseous refrigerant becomes a high-pressure liquid refrigerant. The high-pressure liquid refrigerant then enters the refrigerant outlet filter 253 for filtration to remove impurities and ensure its cleanliness. Subsequently, the condenser outlet switch 254 opens, and the high-pressure liquid refrigerant passes through the heat exchange inlet check valve 255 to reach the throttling and pressure-reducing valve 256. The throttling and pressure-reducing valve 256 uses the throttling effect to convert the high-pressure liquid refrigerant into a low-pressure, low-temperature liquid refrigerant. The low-temperature, low-pressure liquid refrigerant then enters the second heat exchange section 23 and undergoes evaporation and heat absorption within it, transforming the high-temperature coolant into a low-temperature coolant for cooling and heat dissipation of the load.

[0051] The server cooling device in this embodiment employs the following server cooling control method. It utilizes an air-cooled component 31, a spray assembly 32, a compressor 21, a second heat dissipation section 22, a first heat dissipation section 111, a second heat exchange section 23, and a heat exchange box 40, along with relevant dynamically sensing and adjusting control components, to provide the system with coolant at a specified temperature. Cooling is achieved using the principles of heat conduction, latent heat of vaporization, heat absorption during refrigerant vaporization, and heat release during liquefaction. The heat generated by the server is carried away and discharged to the external environment through the heat exchange box 40 and pump-driven assembly 19. The device mainly consists of a mechanical refrigeration unit (compressor 21), a natural refrigeration unit (first heat dissipation section 111), a dual independent cooling unit (cooling assembly 30), a spray assembly 32, a mixed-liquid heat exchange temperature control unit (heat exchange box 40), and related pipelines (supply pipe section 14 and return pipe section 15). In this way, the server cooling device can automatically select the cooling mode based on the ambient temperature, supply liquid temperature, and return liquid temperature, forming a dual-cold-source synergistic cooling system. This maximizes power savings, achieving efficient and low-energy cooling, in line with the low-carbon and green concept. The heat exchange circuit 20 and the heat dissipation circuit 10 are used for mechanical active refrigeration and natural cooling to cool the coolant, respectively. Both rely on the dual independent heat dissipation unit - cooling component 30 for heat dissipation.

[0052] The innovative dual-source cooling technology of the core cooling component 30 of the server heat dissipation device in this embodiment, which combines natural cooling and mechanical cooling of the heat exchange circuit 20, along with the dual-effect cooling technology of the same cooling component 30, enables the server heat dissipation device to intelligently select the cooling method and cooling capacity ratio according to the ambient temperature and usage requirements. This allows for intelligent switching and allocation of cooling modes. By adjusting the ratio of the low-temperature freezing medium generated by mechanical cooling and the room-temperature cooling medium produced by natural cooling, ultra-wide-range temperature cooling water can be achieved. This dual-effect cooling hybrid cooling technology, combined with single-stage heat exchange technology, can significantly improve the energy efficiency of the server heat dissipation device. This modular, high-efficiency, and energy-saving server cooling device organically combines a dual-cold-source cooling system, pump drive components 19, direct cooling devices, piping systems, and various coolant sensing and adjustment devices to form a mobile, stand-alone heat exchange unit. It achieves de-engineering design of the liquid cooling system, perfectly adapting to the liquid cooling upgrade of existing air-cooled data centers without requiring large-scale construction modifications or downtime in existing server rooms. It is also perfectly suited for scenarios requiring small-scale liquid cooling testing environments, such as educational and research institutions, universities, and laboratories. It completely solves the shortcomings of existing liquid cooling systems, such as inability to be moved and reused, high construction difficulty, long construction cycles, large resource investment, serious waste of personnel and materials, environmental pollution, inability to monitor coolant quality online, and inability to self-adaptively adjust the system. This effectively improves the safety, practicality, reliability, flexibility, and reusability of server cooling devices, significantly reducing the construction cycle, construction and maintenance difficulty, and resource investment required for server cooling systems. Simultaneously, its unique dual-source cooling system combining natural and mechanical refrigeration, along with the innovative dual-effect cooling technology of the same cooling component and single-stage heat exchange technology, achieves the goals of low cost, rapid construction, and high energy utilization of the liquid cooling system.

[0053] like Figure 10As shown, this application also provides a server heat dissipation control method using the aforementioned server heat dissipation device, comprising: obtaining the liquid supply temperature at the inlet of the cooling component 113; comparing the liquid supply temperature with the ambient temperature; when the liquid supply temperature is greater than or equal to the ambient temperature, comparing the cooling capacity of the cooling component 30 with the heat generated by the load; when the cooling capacity of the cooling component 30 is greater than or equal to the heat generated by the load, starting the cooling component 30 and turning off the compressor 21; when the cooling capacity of the cooling component 30 is less than the heat generated by the load, starting the cooling component 30 and the compressor 21; when the liquid supply temperature is less than the ambient temperature, obtaining the liquid return temperature at the outlet of the cooling component 113, comparing the liquid return temperature with the ambient temperature; when the liquid return temperature is greater than or equal to the ambient temperature, starting the cooling component 30 and the compressor 21; when the liquid return temperature is less than the ambient temperature, starting the compressor 21 and turning off the first heat dissipation section 111. The closure of the first heat dissipation section 111 here means that the first cooling medium in the heat dissipation circuit 10 is controlled by the adjusting component 13 to enter the heat exchange box 40 from the end 121 of the heat dissipation branch 12, instead of flowing through the first heat dissipation section 111 and the first heat exchange end 1121. In this way, through the intelligent switching and adjustment of the heat dissipation circuit 10 and the heat exchange circuit 20, the cooling component 30 can simultaneously perform natural cooling of the heat dissipation circuit 10 and the heat exchange circuit 20, effectively achieving physical isolation of different functional cooling media and optimal adaptation of different performance cooling working fluids. This effectively reduces the minimum load gradient, and the number of components to be turned on can be determined according to the load, thereby achieving precise, ultra-wide-range and flexible control of the coolant temperature and flow rate required by the load. At the same time, it can significantly reduce the operation and maintenance difficulty of the server heat dissipation device, reduce the maintenance difficulty and cost of the server heat dissipation device, avoid the disadvantages of large systems requiring overall draining and cleaning, and the mutual backup of natural cooling and mechanical cooling can greatly improve the reliability of the server heat dissipation device.

[0054] It should be noted that "multiple" in the above embodiments refers to at least two.

[0055] The above provides a detailed description of a server heat dissipation device and a server heat dissipation control method provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and its core ideas. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server heat dissipation device, characterized in that, The application relates to a cooling system. The cooling system comprises: a heat dissipation loop (10) having a first heat dissipation section (111), a first heat exchange section (112) and a cooling member (113) sequentially communicated along a flow direction of a first cooling medium, the cooling member (113) being used for heat exchange with a load; a heat exchange loop (20) used for heat exchange with the heat dissipation loop (10), the heat exchange loop (20) comprising a compressor (21), a second heat dissipation section (22) and a second heat exchange section (23) sequentially communicated along a flow direction of a second cooling medium; a cooling assembly (30), the first heat dissipation section (111) and the second heat dissipation section (22) being located at the cooling assembly (30), the cooling assembly (30) dissipating heat of the first cooling medium located in the first heat dissipation section (111) and heat-exchanged with the load, and the cooling assembly (30) dissipating heat of the second cooling medium located in the second heat dissipation section (22) and compressed by the compressor (21); a heat exchange box (40), the first heat exchange section (112) and the second heat exchange section (23) being located in the heat exchange box (40) and heat-exchanged in the heat exchange box (40); the cooling assembly (30) comprising an air cooling member (31) and a spraying assembly (32), the air cooling member (31) having a blowing area for heat dissipation, the first heat dissipation section (111) and the second heat dissipation section (22) being located in the blowing area, and the spraying assembly (32) having a spraying area for spraying cooling, the first heat dissipation section (111) and the second heat dissipation section (22) being located in the spraying area; 2. The server heat dissipation device of claim 1, wherein, the first heat dissipation section (111) and the second heat dissipation section (22) are both provided as heat dissipation coils extending in an S shape, the heat dissipation coils comprising a plurality of heat dissipation pipe sections communicated with each other, the heat dissipation pipe sections of the first heat dissipation section (111) and the second heat dissipation section (22) being distributed side by side and alternately along a blowing direction of the air cooling member (31). The first heat exchange section (112) comprises: a first heat exchange end (1121); 3. The server heat dissipating device of claim 1, wherein, a second heat exchange end (1122), the first heat exchange end (1121) and the second heat exchange end (1122) being located in the heat exchange box (40) and communicated with the heat exchange box (40), the first cooling medium entering the heat exchange box (40) from the first heat exchange end (1121) and flowing into the second heat exchange end (1122) after mixing with the first cooling medium in the heat exchange box (40). The heat dissipation loop (10) comprises: a main loop (11) having the first heat dissipation section (111), the first heat exchange section (112) and the cooling member (113). A heat dissipation branch (12) is connected in communication with the main loop (11), the connection position of the heat dissipation branch (12) with the main loop (11) is located between the cooling member (113) and the first heat dissipation section (111), the end (121) of the heat dissipation branch (12) is located in the heat exchange box (40) and is in communication with the heat exchange box (40), and the first cooling medium flows into the first heat dissipation section (111) and / or the heat dissipation branch (12) after being exchanged by the cooling member (113).

4. The server heat dissipation device of claim 3, wherein, The heat dissipation loop (10) further comprises an adjusting member (13), the adjusting member (13) is arranged at the connection position of the heat dissipation branch (12) with the main loop (11), and the adjusting member (13) is used for adjusting the flow of the first cooling medium flowing through the first heat dissipation section (111) and the heat dissipation branch (12).

5. The server heat dissipating device of claim 1, wherein, The heat dissipation loop (10) further comprises: A liquid supply pipe section (14) and a liquid return pipe section (15), the liquid supply pipe section (14) is located between the first heat exchange section (112) and the cooling member (113), the liquid return pipe section (15) is located between the cooling member (113) and the first heat dissipation section (111), the cooling member (113) is connected with the first heat exchange section (112) through the liquid supply pipe section (14), and the cooling member (113) is connected with the first heat dissipation section (111) through the liquid return pipe section (15); A temperature measuring member (16), the temperature measuring member (16) is arranged on the liquid supply pipe section (14) and the liquid return pipe section (15), and is used for detecting the liquid supply temperature of the liquid supply pipe section (14) and the liquid return temperature of the liquid return pipe section (15).

6. The server heat dissipating device of claim 5, wherein, The server heat dissipation device further comprises a control member, the control member is electrically connected with the temperature measuring member (16), the control member can acquire the temperature of the temperature measuring member (16) and control the opening and closing of the heat dissipation loop (10) and the heat exchange loop (20).

7. The server heat dissipation device of claim 5, wherein, The heat dissipation loop (10) further comprises a bypass pipe section (17) and an adjusting valve (18), two ends of the bypass pipe section (17) are respectively in communication with the liquid supply pipe section (14) and the liquid return pipe section (15), and the adjusting valve (18) is arranged on the bypass pipe section (17) and is used for adjusting the flow of the first cooling medium in the bypass pipe section (17).

8. The server heat dissipation device according to claim 1, characterized in that, The spraying assembly (32) comprises a spraying member (321), a recovery groove (322) and a spraying driving member (323), the spraying member (321) has a spraying opening, the spraying opening is directed to the first heat dissipation section (111) and the second heat dissipation section (22), the spraying opening forms the spraying area when spraying, the recovery groove (322) is located below the spraying area, the spraying driving member (323) is located between the recovery groove (322) and the spraying member (321), the spraying driving member (323) is used for driving the circulation flow of the first cooling medium between the recovery groove (322) and the spraying member (321), and the spraying flow of the spraying member (321) can be adjusted; The first heat exchange section (112) comprises a first heat exchange end (1121) and a second heat exchange end (1122), the first heat exchange end (1121) and the second heat exchange end (1122) are both located in the heat exchange box (40) and communicate with the heat exchange box (40), the first cooling medium enters the heat exchange box (40) from the first heat exchange end (1121) and flows into the second heat exchange end (1122) after mixing with the first cooling medium in the heat exchange box (40); The second heat exchange section (23) is in contact with the first cooling medium in the heat exchange box (40) for heat exchange, the second heat exchange section (23) has an S-shaped extending heat exchange coil pipe (231), the heat exchange coil pipe (231) has an inlet side (2311) for the flow of the second cooling medium and an outlet side (2312) for the flow of the second cooling medium, the inlet side (2311) and the outlet side (2312) are both located in the heat exchange box (40) and oppositely arranged, the first heat exchange end (1121) is located at the outlet side (2312), and the second heat exchange end (1122) is located at the inlet side (2311).

9. A server heat dissipation control method using the server heat dissipation device according to any one of claims 1 to 8, characterized by, It comprises: acquiring the liquid supply temperature at the inlet of the cooling member (113); comparing the liquid supply temperature with the ambient temperature; when the liquid supply temperature is greater than or equal to the ambient temperature, comparing the refrigerating capacity of the cooling assembly (30) with the heat production of the load, when the refrigerating capacity of the cooling assembly (30) is greater than or equal to the heat production of the load, starting the cooling assembly (30) and stopping the compressor (21), when the refrigerating capacity of the cooling assembly (30) is less than the heat production of the load, starting the cooling assembly (30) and the compressor (21); when the liquid supply temperature is less than the ambient temperature, acquiring the liquid return temperature at the outlet of the cooling member (113), comparing the liquid return temperature with the ambient temperature, when the liquid return temperature is greater than or equal to the ambient temperature, starting the cooling assembly (30) and the compressor (21), when the liquid return temperature is less than the ambient temperature, starting the compressor (21) and stopping the first heat dissipation section (111).

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