Semiconductor light emitting device and lighting apparatus

Abstract

This invention relates to the field of light-emitting diode (LED) technology, and discloses a semiconductor light-emitting device and lighting apparatus. The semiconductor light-emitting device includes a light-emitting structure, a condensing lens, and a light-blocking element. The light-emitting structure includes a base and a light-emitting chip. The base has a mounting groove, and the light-emitting chip is disposed in the mounting groove. The condensing lens is disposed on the light-emitting structure and corresponds to the light-emitting chip. The light-blocking element is opaque and is disposed on the upper surface of the base, and has a light-emitting hole. The light-emitting hole corresponds to the condensing lens, so that the condensing lens is surrounded by the light-blocking element. This invention is beneficial for improving the brightness of the emitted light and the clarity of the cutoff line between light and dark areas of the light spot formed by the light.

Description

Technical Field

[0001] This invention relates to the field of semiconductor light-emitting technology, and more specifically to semiconductor light-emitting devices and lighting apparatuses. Background Technology

[0002] Chinese patent CN216389419 U discloses a light-emitting diode with an adjustable light-emitting surface, such as... Figure 1 As shown, the light-emitting diode 10 includes a substrate 12, a chip 14, a reflector cup 16, an encapsulation layer 18, and a light-blocking structure 22. The light-blocking structure 22 is located on the reflector cup 16 and the encapsulation layer 18, and it is used to block light, that is, to prevent light from passing through the light-blocking structure 22, so that more light can be emitted from the second light-emitting port 222, thus changing the light-emitting surface. The light-blocking structure 22 can be an optical film, which can be white, black, or other colors that can change the light pattern. The material can be silicone, plastic, glass, etc., and it can absorb or reflect light.

[0003] Because the light-emitting surface of chip 14 is transferred to the front side of the encapsulation layer 18, and the inner side of the reflector cup 16 can reflect light, the light emitted from the second light outlet 222 will be reflected at different angles, resulting in relatively disordered and chaotic light emission. Consequently, the cutoff of the projected light spot is poor, and the cutoff line between light and dark is unclear. At the same time, the light-blocking structure 22 blocks most of the light emitted by chip 14, wasting most of the light emitted by chip 14. Its energy loss is high, reaching more than 80% in some cases, which leads to low brightness of the light-emitting diode 10. Summary of the Invention

[0004] In view of this, the present invention provides a semiconductor light-emitting device and a heat dissipation system to solve the problems of poor cutoff of the light spot emitted by the semiconductor light-emitting device and low light brightness.

[0005] In a first aspect, the present invention provides a semiconductor light-emitting device, comprising:

[0006] A light-emitting structure includes a base and a light-emitting chip, wherein a mounting groove is provided on the base and the light-emitting chip is disposed in the mounting groove;

[0007] A condensing lens is disposed on the light-emitting structure and is positioned corresponding to the light-emitting chip;

[0008] A light cutoff element is provided, which is not light-transmitting. The light cutoff element is disposed on the upper surface of the base and has a light-emitting hole. The light-emitting hole is disposed corresponding to the condensing lens, so that the condensing lens is surrounded by the light cutoff element.

[0009] Beneficial effects: By setting a condensing lens and a light cutoff component on the light-emitting structure, and by making the light cutoff component opaque, the condensing lens can gather and concentrate the light emitted by the light-emitting chip. Only a small portion of the light emitted from the condensing lens is blocked by the light cutoff component, resulting in good cutoff of the light spot projected by the light-emitting chip. Furthermore, the condensing lens can guide the gathered light into the light-emitting aperture and then emit it through the light-emitting aperture, thereby significantly reducing energy loss and improving the uniformity and brightness of the light spot. In addition, the increased brightness of the light spot makes the light-dark boundary of the light spot more distinct, which helps to improve the clarity of the light-dark cutoff line of the light spot.

[0010] In one alternative embodiment, the condensing lens includes a lens portion and a support portion, the support portion extending outward from the edge of the lens portion;

[0011] The support portion is sealed on the base by a connecting structure, forming a closed cavity with the base, and the light-emitting chip is located inside the cavity; and the connecting structure is connected to at least two surfaces of the support portion.

[0012] In one alternative embodiment, the connection structure includes an adhesive, the support portion extends laterally and is sealed to the upper surface of the base by the adhesive, the adhesive covering at least the side surface, a portion of the upper surface and a portion of the lower surface of the support portion.

[0013] In one alternative embodiment, the light cutoff element is bonded to the upper surface of the base by the same layer of adhesive.

[0014] In one optional embodiment, the light-emitting aperture is arranged in a converging shape in the direction away from the light-emitting chip;

[0015] The side of the support portion is spaced apart from the inner wall of the light-emitting hole, and the adhesive fills the gap and covers at least a portion of the upper surface of the support portion under the guiding effect of the inner wall of the light-emitting hole.

[0016] In one optional embodiment, the connection structure includes an adhesive, the sidewall of the mounting groove has a stepped surface, the support extends laterally and is disposed on the stepped surface by the adhesive, and the adhesive at least covers the side surface, part of the upper surface and part of the lower surface of the support.

[0017] In one optional embodiment, the connection structure includes encapsulating adhesive disposed within the mounting groove and covering at least a portion of the bottom of the mounting groove and the side surface of the light-emitting chip;

[0018] The support portion extends toward the light-emitting chip and is inserted into the encapsulating adhesive, supporting it on the bottom of the mounting groove.

[0019] In one optional embodiment, a light-transmitting adhesive layer is further included, which is disposed on the front side of the light-emitting chip; the encapsulating adhesive covers a portion of the side surface of the light-transmitting adhesive layer and a portion of the groove wall of the mounting groove.

[0020] The light cutoff element is bonded to the upper surface of the base with adhesive, the adhesive at least covering the outer edge of the encapsulating adhesive, and both the adhesive and the encapsulating adhesive are light-absorbing.

[0021] In one alternative embodiment, the device further includes an encapsulating adhesive and a light-transmitting adhesive layer, the light-transmitting adhesive layer being disposed on the front side of the light-emitting chip, the light-concentrating lens being disposed on the light-transmitting adhesive layer, and the encapsulating adhesive filling the mounting groove and covering at least a portion of the side surface of the light-concentrating lens.

[0022] In one optional embodiment, the focusing lens includes a first lens portion and a second lens portion, both of which have convex curved surfaces. The first lens portion and the second lens portion are connected so that the two light-emitting surfaces overlap to form a recessed region, which is located at the center of the light-emitting chip.

[0023] In one alternative embodiment, the light cutoff element is configured to absorb light.

[0024] In one optional embodiment, the light-emitting aperture is arranged in a converging shape in the direction away from the light-emitting chip;

[0025] The light-emitting aperture includes two connected aperture segments. The aperture segment closer to the light-emitting chip is arranged in a converging shape in the direction away from the light-emitting chip, while the other aperture segment is arranged in an open shape in the direction away from the light-emitting chip.

[0026] The light-emitting aperture is open in the direction away from the light-emitting chip; or

[0027] The light-emitting aperture is arranged in a cylindrical shape in the direction away from the light-emitting chip.

[0028] Secondly, the present invention also provides a lighting device, including a circuit board and a plurality of the above-described semiconductor light-emitting devices, wherein any one of the semiconductor light-emitting devices is disposed on the circuit board. Attached Figure Description

[0029] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of a light-emitting diode with an adjustable light-emitting surface in the background art;

[0031] Figure 2 This is a first planar schematic diagram of a semiconductor light-emitting device according to an embodiment of the present invention;

[0032] Figure 3 This is a second planar schematic diagram of a semiconductor light-emitting device according to an embodiment of the present invention;

[0033] Figure 4 This is a third planar schematic diagram of a semiconductor light-emitting device according to an embodiment of the present invention;

[0034] Figure 5 This is a fourth planar schematic diagram of a semiconductor light-emitting device according to an embodiment of the present invention;

[0035] Figure 6 This is a fifth planar schematic diagram of a semiconductor light-emitting device according to an embodiment of the present invention;

[0036] Figure 7 This is a sixth planar schematic diagram of a semiconductor light-emitting device according to an embodiment of the present invention;

[0037] Figure 8 This is a plan view of a lighting device according to an embodiment of the present invention.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1-Light-emitting structure; 101-Base; 1011-Mounting groove; 1012-Step surface; 102-Light-emitting chip;

[0040] 2-Condensing lens; 201-Lens section; 202-Support section;

[0041] 3-Light cutoff piece; 301-Light exit hole;

[0042] 4-Adhesive; 5-Encapsulating adhesive; 6-Transparent adhesive layer; 7-Circuit board. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] For ease of explanation, in this embodiment, the direction in which the light-emitting aperture 301 is furthest away from the light-emitting chip 102 is set as follows: Figures 2-7 The direction indicated by the middle arrow A.

[0045] The following is combined with Figures 2 to 8 The following describes embodiments of the present invention.

[0046] According to embodiments of the present invention, in one aspect, a semiconductor light-emitting device is provided, such as... Figures 2 to 8 As shown, the light-emitting structure includes a light-emitting structure 1, a condensing lens 2, and a light-blocking component 3. The light-emitting structure 1 includes a base 101 and a light-emitting chip 102. The base 101 has a mounting groove 1011, and the light-emitting chip 102 is disposed in the mounting groove 1011. The condensing lens 2 is disposed on the light-emitting structure 1 and is disposed corresponding to the light-emitting chip 102. The light-blocking component 3 is opaque and is disposed on the upper surface of the base 101. It has a light-emitting hole 301, which is disposed corresponding to the condensing lens 2, so that the condensing lens 2 is surrounded by the light-blocking component 3.

[0047] The semiconductor light-emitting device with the above structure includes a condensing lens 2 and a light cutoff element 3 disposed on the light-emitting structure 1. The light-emitting structure 1 includes a base 101 and a light-emitting chip 102. The base 101 has a mounting groove 1011, and the light-emitting chip 102 is disposed in the mounting groove 1011. The condensing lens 2 is disposed on the light-emitting structure 1 and is positioned corresponding to the light-emitting chip 102. The light cutoff element 3 is opaque and is disposed on the upper surface of the base 101. The light cutoff element 3 has a light-emitting hole 301, which is positioned corresponding to the condensing lens 2. This allows the condensing lens 2 to be surrounded by the light cutoff element 3, so that the light emitted by the light-emitting chip 102 can pass through the condensing lens 2 and enter the light-emitting hole 301, forming a light spot through the light-emitting hole 301.

[0048] Furthermore, since the light cutoff element 3 is opaque, the condenser lens 2 can gather and concentrate the light emitted by the light-emitting chip 102. Only a small portion of the light emitted from the condenser lens 2 is cut off by the light cutoff element 3, resulting in good cutoff performance of the light spot projected by the light-emitting chip 102. The condenser lens 2 can also direct the gathered light into the light-emitting aperture 301 and then out through the light-emitting aperture 301, thereby significantly reducing the energy loss of the light and thus improving the uniformity and brightness of the light spot formed by the light. In addition, the increased brightness of the light spot makes the light and dark boundary of the light spot more distinct, which helps to improve the clarity of the light and dark cutoff line of the light spot.

[0049] Specifically, the number of light-emitting chips 102 can be two or more. When the number of light-emitting chips 102 is two, both light-emitting chips 102 can be red LED chips; when the number is three, the three light-emitting chips 102 can be red LED chips, green LED chips and blue LED chips respectively.

[0050] In one embodiment, such as Figures 2-5 As shown, the focusing lens 2 includes a lens portion 201 and a support portion 202. The support portion 202 extends outward from the edge of the lens portion 201. The support portion 202 is sealed on the base 101 by a connecting structure, and forms a closed cavity with the base 101. The light-emitting chip 102 is located in the cavity. The connecting structure is connected to at least two surfaces of the support portion 202.

[0051] The semiconductor light-emitting device with the above structure includes a condenser lens 2 comprising a lens portion 201 and a support portion 202. The support portion 202 extends outward from the edge of the lens portion 201 and can be sealed on the base 101 through a connecting structure, forming a sealed cavity with the base 101. The light-emitting chip 102 is located inside the cavity. In this way, the light-emitting chip 102 can be sealed, preventing the light-emitting chip 102 from being damaged by external factors.

[0052] In addition, the connecting structure is connected to the two surfaces of the support 202. Thus, when the support 202 is connected to the base 101 through the connecting structure, the connecting structure can improve the connection strength between the support 202 and the base 101, thereby improving the installation stability of the condenser lens 2 and enabling the condenser lens 2 to be stably fixed on the upper surface of the base 101.

[0053] In one embodiment, such as Figure 2 As shown, the connection structure includes adhesive 4. The support portion 202 extends laterally and is sealed to the upper surface of the base 101 by adhesive 4. Adhesive 4 covers at least the side surface, part of the upper surface, and part of the lower surface of the support portion 202. The light cutoff member 3 is bonded to the upper surface of the base 101 by the same layer of adhesive 4.

[0054] The semiconductor light-emitting device with the above structure includes an adhesive 4 in the connection structure. The support part 202 is formed by lateral extension and can be sealed on the upper surface of the base 101 by the adhesive 4. When the support part 202 is placed on the base 101, the adhesive 4 will cover the side surface, part of the upper surface and part of the lower surface of the support part 202 to increase the bonding area between the adhesive 4 and the support part 202 and improve the bonding strength. In this way, the installation stability of the condenser lens 2 can be further improved, so that the condenser lens 2 can be more stably fixed on the upper surface of the base 101.

[0055] In addition, the light cut-off element 3 is bonded to the upper surface of the base 101 by the same layer of adhesive 4. That is, the light cut-off element 3 and the support part 202 are bonded to the upper surface of the base 101 by the same layer of adhesive 4. This can improve the bonding stability and airtightness of the adhesive 4. It should also be noted that when the adhesive 4 is connected to the side surface, part of the upper surface and part of the lower surface of the support part 202, the adhesive 4 will also be connected to part of the hole wall of the light outlet 301, so that the adhesive 4 will form a structure similar to a snap-fit ​​structure after curing, and the support part 202 will be embedded in the snap-fit ​​structure.

[0056] During assembly, the support part 202 of the condenser lens 2 is first positioned by the adhesive 4. Before the adhesive 4 is cured, the light cut-off part 3 is installed using the same adhesive 4. At this time, the adhesive 4 is fused and connected into the same layer, which further improves the bonding stability and airtightness.

[0057] In one embodiment, such as Figure 2 As shown, the light-emitting hole 301 is arranged in a converging shape in the direction away from the light-emitting chip 102; the side of the support portion 202 is spaced apart from the inner wall surface of the light-emitting hole 301 and has a gap, the adhesive 4 fills the gap, and under the guiding effect of the inner wall surface of the light-emitting hole 301, it covers at least a part of the upper surface of the support portion 202.

[0058] The semiconductor light-emitting device with the above-described structure, by setting the light-emitting aperture 301 to be converging in the direction away from the light-emitting chip 102 and by spacing the side surface of the support portion 202 from the inner wall surface of the light-emitting aperture 301, creates a gap between the side surface of the support portion 202 and the inner wall surface of the light-emitting aperture 301. This allows the adhesive 4 to fill the gap. Furthermore, because the light-emitting aperture 301 is converging in the direction away from the light-emitting chip 102, the space in this gap is smaller, making it easier for the adhesive 4 to cover part of the upper surface of the support portion 202 under the guidance of the inner wall surface of the light-emitting aperture 301. To better guide the adhesive 4, the connection between the upper surface and the side surface of the support portion 202 can be rounded or chamfered. Moreover, the converging aperture wall can better block lateral light emitted from the condenser lens.

[0059] In one embodiment, such as Figure 3 As shown, the connection structure includes adhesive 4, a stepped surface 1012 is provided on the side wall of the mounting groove 1011, the support part 202 extends laterally and is provided on the stepped surface 1012 by adhesive 4, and the adhesive 4 covers at least the side surface, part of the upper surface and part of the lower surface of the support part 202.

[0060] The semiconductor light-emitting device with the above structure includes an adhesive 4 and a stepped surface 1012 on the side wall of the mounting groove 1011. The support 202 is laterally extended and can be mounted on the stepped surface 1012 by the adhesive 4. When the support 202 is mounted on the stepped surface 1012, the adhesive 4 covers the side surface, part of the upper surface and part of the lower surface of the support 202 to increase the bonding area between the adhesive 4 and the support 202 and improve the bonding strength between the adhesive 4 and the support 202. In this way, the installation stability of the condenser lens 2 can be improved, and the condenser lens 2 can be more stably fixed on the stepped surface 1012.

[0061] Furthermore, since the condenser lens 2 is mounted on the stepped surface 1012, and the stepped surface 1012 is located on the side wall of the mounting groove 1011, the distance between the condenser lens 2 and the light-emitting chip 102 becomes smaller, allowing more light emitted by the light-emitting chip 102 to enter the condenser lens 2, which is beneficial to improving the light emission utilization rate and thus improving the brightness of the projected light spot. At the same time, the condenser lens 2 can be designed to be smaller, which is beneficial to reducing the volume of the condenser lens 2, saving lens material, and also beneficial to the miniaturization of the entire light-emitting device.

[0062] The connection structure also includes encapsulating adhesive 5, which fills the mounting groove 1011 and covers at least part of the bottom of the mounting groove 1011 and the side of the light-emitting chip 102. The encapsulating adhesive 5 covers the bottom of the mounting groove 1011, thereby improving the airtightness of the bottom of the base 101.

[0063] In one embodiment, such as Figure 4 and Figure 5 As shown, the connection structure includes an encapsulating adhesive 5, which is disposed within the mounting groove 1011 and covers at least a portion of the bottom of the mounting groove 1011 and the side of the light-emitting chip 102; a support portion 202 extends toward the light-emitting chip 102 and is inserted into the encapsulating adhesive 5, supporting it on the bottom of the mounting groove 1011. It also includes a light-transmitting adhesive layer 6, which is disposed on the front side of the light-emitting chip 102; the encapsulating adhesive 5 covers a portion of the side of the light-transmitting adhesive layer 6 and a portion of the groove wall of the mounting groove 1011; a light cutoff element 3 is bonded to the upper surface of the base 101 by an adhesive 4, which at least covers the outer edge of the encapsulating adhesive 5; both the adhesive 4 and the encapsulating adhesive 5 are light-absorbing components.

[0064] The semiconductor light-emitting device with the above-described structure also includes an encapsulating adhesive 5 through the connection structure. The encapsulating adhesive 5 can be a light-transmitting colloid without particles, or it can be an opaque colloid, specifically white or black adhesive. Black adhesive can absorb reflected light and reduce stray and scattered light in the cavity. In this embodiment, the encapsulating adhesive 5 is black adhesive. The encapsulating adhesive 5 is specifically disposed in the mounting groove 1011 and covers the bottom of the mounting groove 1011 and part of the side of the light-emitting chip 102, thereby improving the airtightness of the bottom of the mounting groove 1011. The support portion 202 extends toward the light-emitting chip 102 and can be inserted into the encapsulating adhesive 5 and supported on the bottom of the mounting groove 1011 to provide support for the lens portion 201. In this way, the distance between the lens portion 201 and the light-emitting chip 102 can be reduced, and the light-emitting utilization rate can be improved. When the support portion 202 is inserted into the encapsulating adhesive 5, the encapsulating adhesive 5 can fix the support portion 202 after curing.

[0065] During assembly, encapsulating adhesive 5 is first filled into the mounting groove 1011, covering part of the side surface of the light-emitting chip 102. Then, the support part 202 of the condensing lens 2 is inserted into the encapsulating adhesive 5, so that the lens part 201 corresponds to the light-emitting chip 102. After the encapsulating adhesive 5 cures, the condensing lens 2 is fixed to the bottom of the mounting groove 1011. The encapsulating adhesive 5 serves both to seal the bottom of the mounting groove 1011 and to bond and fix the condensing lens 2.

[0066] Additionally, a light-transmitting adhesive layer 6 is included. This layer is specifically disposed on the front side of the light-emitting chip 102. The light-transmitting adhesive layer 6 reduces Fresnel loss in the light emitted by the light-emitting chip 102, thus improving light extraction efficiency. The light-transmitting adhesive layer 6 is a wavelength conversion layer, specifically a phosphor layer. The light-emitting chip 102 is a blue LED chip, and the blue light emitted by it is converted into white light by the phosphor layer. In other embodiments, the light-transmitting adhesive layer 6 can be a transparent colloid.

[0067] Meanwhile, the encapsulating adhesive 5 can cover part of the side surface of the light-transmitting adhesive layer 6 and part of the groove wall of the mounting groove 1011. The encapsulating adhesive 5 is light-absorbing, so that some of the light in the light-transmitting adhesive layer 6 cannot be emitted from its side, which is beneficial to improving the light utilization rate. The light cut-off component 3 is bonded to the upper surface of the base 101 by the adhesive 4. The adhesive 4 is light-absorbing, and the adhesive 4 can cover the outer edge of the encapsulating adhesive 5, so that the groove wall of the mounting groove 1011 cannot reflect light. As a result, some of the light emitted from the light-transmitting adhesive layer 6 will not be reflected by the groove wall of the mounting groove 1011, and the light that shines on the adhesive 4 and the encapsulating adhesive 5 will be absorbed, thus greatly reducing reflected light, stray light, etc.

[0068] In one embodiment, such as Figure 6 and Figure 7As shown, it also includes encapsulating adhesive 5 and a light-transmitting adhesive layer 6. The light-transmitting adhesive layer 6 is disposed on the front side of the light-emitting chip 102, and the condensing lens 2 is disposed on the light-transmitting adhesive layer 6. The encapsulating adhesive 5 fills the mounting groove 1011 and covers at least a portion of the side surface of the condensing lens 2. The condensing lens 2 includes a first lens portion and a second lens portion. The light-emitting surfaces of both the first lens portion and the second lens portion are convex curved surfaces. The first lens portion and the second lens portion are connected so that the two light-emitting surfaces overlap to form a recessed area. The recessed area is located at the center of the light-emitting chip 102.

[0069] The semiconductor light-emitting device with the above structure utilizes a light-transmitting adhesive layer 6 disposed on the light-emitting chip 102 and an encapsulating adhesive 5 disposed in the mounting groove 1011. A condensing lens 2 is disposed on the light-transmitting adhesive layer 6, which reduces Fresnel loss in the light emitted by the light-emitting chip 102, thus improving the light extraction efficiency. The encapsulating adhesive 5 covers a portion of the side surface of the condensing lens 2. The encapsulating adhesive 5 is opaque, specifically an opaque white adhesive, allowing it to reflect light emitted from the side surface of the condensing lens 2, thereby improving the light utilization efficiency of the light-emitting chip 102. During assembly, the light-transmitting adhesive layer 6 is first molded onto the light-emitting chip 102, then the condensing lens 2 is molded onto the light-transmitting adhesive layer 6, and finally the encapsulating adhesive 5 is filled into the mounting groove 1011 until it covers at least a portion of the side surface of the condensing lens 2.

[0070] Specifically, the five layers of encapsulating adhesive completely cover the side of the condenser lens 2, and the side of the condenser lens 2 is inverted conical, which can reflect the large-angle lateral light emission of the light-emitting chip 102 upward, thereby improving the light extraction rate.

[0071] Furthermore, the condensing lens 2 includes a first lens section and a second lens section. The light-emitting surface of the first lens section is a convex curved surface, and the light-emitting surface of the second lens section is a convex curved surface. The first lens section and the second lens section are connected, so that the light-emitting surfaces of the first lens section and the second lens section overlap to form a recessed area. The recessed area is located at the center of the light-emitting chip 102. This recessed area can diffuse light, avoiding excessive brightness in the center area of ​​the projected light spot due to strong central light, thus making the light intensity of the light spot more uniform. When molding the condensing lens 2, glue can be added to the mold cavity first, and then the mold can be inverted on the encapsulating glue 5 to directly mold the condensing lens 2 on the light-transmitting adhesive layer 6 and the encapsulating glue 5. In other embodiments, the condensing lens 2 can be pre-molded and then bonded to the light-transmitting adhesive layer 6.

[0072] In one embodiment, such as Figures 2-8 As shown, the light cutoff element 3 is designed to absorb light.

[0073] The semiconductor light-emitting device with the above structure, by setting the light cut-off element 3 as a light-absorbing element, whose material can be, but is not limited to, silicone filled with carbon black, can absorb the light that shines on its hole wall, reduce stray light and scattered light, and greatly reduce the reflected light emitted from the light outlet, making the light spot purer and basically free of stray and scattered light points.

[0074] In one embodiment, such as Figures 2-8 As shown, the light-emitting aperture 301 is arranged in a converging shape in the direction away from the light-emitting chip 102; the light-emitting aperture 301 includes two connected aperture segments, the aperture segment near the light-emitting chip 102 is arranged in a converging shape in the direction away from the light-emitting chip 102, and the other aperture segment is arranged in an open shape in the direction away from the light-emitting chip 102; the light-emitting aperture 301 is arranged in an open shape in the direction away from the light-emitting chip 102; or the light-emitting aperture 301 is arranged in a cylindrical shape in the direction away from the light-emitting chip 102.

[0075] The semiconductor light-emitting device with the above-described structure, by setting the light-emitting aperture 301 to be converging in the direction away from the light-emitting chip 102, can concentrate the light within the light-emitting aperture 301, thereby increasing the light brightness; by setting the light-emitting aperture 301 to include two connected aperture ends, with the aperture segment near the light-emitting chip 102 converging in the direction away from the light-emitting chip 102, and the other aperture segment being open in the direction away from the light-emitting chip 102, the light-emitting aperture 301 can first concentrate the light within it, increasing the light brightness, and then diffuse the light outward to obtain a larger illumination field of view; by setting the light-emitting aperture 301 to be open in the direction away from the light-emitting chip 102, the light-emitting aperture 301 can diffuse the light within it, thereby obtaining a larger illumination field of view.

[0076] In other embodiments, the light-emitting aperture 301 may be configured to be cylindrical in the direction away from the light-emitting chip 102.

[0077] According to an embodiment of the present invention, in another aspect, a lighting device is also provided, such as... Figure 8 As shown, the device includes a circuit board 7 and several of the aforementioned semiconductor light-emitting devices, with any one of the semiconductor light-emitting devices disposed on the circuit board 7.

[0078] The lighting device described above includes a circuit board 7 and several semiconductor light-emitting devices. Each semiconductor light-emitting device is mounted on the circuit board 7 and arranged in a rectangular array. The light spots projected by the multiple semiconductor light-emitting devices in the rectangular array can be seamlessly stitched together to form a larger pattern. This allows the lighting device to create different patterns by controlling the on / off state of different light-emitting devices, and to achieve intelligent interaction through these different patterns. The lighting device can be an automotive interactive light; no specific limitation is made here.

[0079] In other embodiments, multiple light-emitting devices arranged in a rectangular array can form a display surface. By controlling the light emission of different light-emitting devices, different patterns can be displayed to achieve intelligent interaction. When the cut-off element is black or dark, the contrast of the displayed pattern is high, improving the quality of the display screen.

[0080] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and all such modifications and variations fall within the scope defined by the appended claims.

Claims

1. A semiconductor light-emitting device, characterized in that, include: The light-emitting structure (1) includes a base (101) and a light-emitting chip (102). The base (101) has a mounting groove (1011) and the light-emitting chip (102) is disposed in the mounting groove (1011). A condensing lens (2) is disposed on the light-emitting structure (1) and is disposed corresponding to the light-emitting chip (102); The light cut-off element (3) is designed to be opaque. The light cut-off element (3) is located on the upper surface of the base (101) and has a light outlet hole (301). The light outlet hole (301) is provided corresponding to the condensing lens (2), so that the condensing lens (2) is surrounded by the light cut-off element (3). The light cutoff element (3) is configured to absorb light; The light-emitting aperture (301) is arranged in a converging shape in the direction away from the light-emitting chip (102); or the light-emitting aperture (301) includes two connected aperture segments, the aperture segment closer to the light-emitting chip (102) is arranged in a converging shape in the direction away from the light-emitting chip (102), and the other aperture segment is arranged in an open shape in the direction away from the light-emitting chip (102). The condenser lens (2) includes a lens portion (201) and a support portion (202), the support portion (202) extending outward from the edge of the lens portion (201); The support (202) is sealed on the base (101) by a connecting structure, and forms a closed cavity with the base (101), in which the light-emitting chip (102) is located; and the connecting structure is connected to at least two surfaces of the support (202). The connection structure includes an adhesive (4), the support (202) extends laterally and is sealed on the upper surface of the base (101) by the adhesive (4), the adhesive (4) at least covering the side surface, part of the upper surface and part of the lower surface of the support (202); The light cutoff element (3) is bonded to the upper surface of the base (101) by the same layer of adhesive (4); The side of the support (202) is spaced apart from the inner wall of the light-emitting hole (301) and has a gap. The adhesive (4) fills the gap and covers at least a portion of the upper surface of the support (202) under the drainage effect of the inner wall of the light-emitting hole (301).

2. A lighting device, characterized in that, It includes a circuit board (7) and at least one semiconductor light-emitting device as claimed in claim 1, wherein any one of the semiconductor light-emitting devices is disposed on the circuit board (7).

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