A tin removing device for LED module

Abstract

This invention discloses an LED module desoldering device, relating to the field of desoldering technology. It includes a workbench and a gantry frame fixed to the workbench. A moving component is mounted on the gantry frame, comprising a horizontally slidable frame and a vertically slidable lifting frame. An adjustment component is located at the bottom of the lifting frame, and a wire feeding component is mounted on the lifting frame. Operators can quickly adjust the horizontal position and height of the desoldering pump by holding the handle with one hand, rapidly moving the pump to the designated position. The electric desoldering pump automatically melts the old solder points and removes the molten waste solder. Furthermore, the wire feeding component automatically delivers new solder wire. Therefore, operation is simpler and easier with only one hand, improving work efficiency.

Description

Technical Field

[0001] This invention relates to the field of desoldering technology, and more specifically, to a desoldering device for LED modules. Background Technology

[0002] LED modules are integrated units composed of LED chips, circuit boards, solder pads, peripheral electronic components, and plastic brackets, and are widely used in display, lighting, and other fields. During LED module repair or refurbishment, such as when LED chips need replacement due to damage, the solder joints of the chips and the corresponding solder pads on the circuit board must be desoldered. In addition, excess solder remaining on the circuit board must be cleaned to prevent short circuits or cold solder joints. Existing desoldering devices typically include manual desoldering pumps and soldering irons, but desoldering pumps require manual hand-held operation to remove solder.

[0003] Existing desoldering devices require manual hand-held operation. When using a manual desoldering pump, one hand holds the soldering iron, and the other holds the desoldering pump. Prolonged operation can easily lead to hand fatigue and tremors. Furthermore, to improve heat conduction and melt the old solder more quickly, a small amount of new solder needs to be added to the old solder points. However, with both hands occupied, the operator cannot push the solder wire, affecting the accuracy and effectiveness of desoldering. This not only increases operational complexity and reduces efficiency but also poses a safety risk of burns from high temperatures. Additionally, manual operation involves the head being close to the work area, increasing the risk of inhaling solder fumes and harming the operator's health. Moreover, LED modules require manual pressing to hold them in place during desoldering. If the LED module is not firmly pressed and positioned, it can shift during the desoldering process, resulting in incomplete removal of waste solder, or even scratching or detaching of the solder pads, severely impacting the reliability of subsequent resoldering. Summary of the Invention

[0004] To solve the above-mentioned technical problems, the present invention provides an LED module desoldering device.

[0005] The technical solution is as follows:

[0006] A desoldering device for LED modules includes a worktable and a gantry frame fixed on the worktable, with a movable component mounted on the gantry frame;

[0007] The moving component includes a moving frame that is slidably mounted on the gantry in the horizontal direction, a lifting frame that slides in the vertical direction on the moving frame, and an adjustment component at the bottom of the lifting frame;

[0008] The adjustment assembly includes an adjustment frame rotatably connected to the bottom of the lifting frame, a worm gear fixedly connected to the adjustment frame, a worm gear meshing with the worm gear rotatably connected to the bottom of the lifting frame, and a desoldering pump fixedly connected to the bottom of the adjustment frame. The desoldering pump is an electric desoldering pump.

[0009] The lifting frame is equipped with a wire feeding assembly, which includes a push rod fixedly connected to one side of the lifting frame. A fixed block is fixedly connected to one side of the moving frame. A guide tube for guiding the solder wire to the bottom of the desoldering pump is fixedly connected to the fixed block. The guide tube is fixedly connected to the adjusting frame. A feeding block for pushing the solder wire downward is set inside the fixed block. The feeding block is located on the movement path of the push rod. The downward movement of the push rod can push the feeding block downward.

[0010] Furthermore, the fixed block has a movable groove inside, and a second spring is fixedly connected inside the movable groove. The top of the second spring is fixedly connected to the movable block. The two ends of the movable block are slidably disposed on the inner walls of the two movable grooves respectively. A feeding block is rotatably connected to the middle of the movable block. A torsion spring is connected between the feeding block and the movable block. The section of the guide tube located next to the feeding block is a flexible tube. After the feeding block rotates, it can squeeze the solder wire in the guide tube.

[0011] Furthermore, a movable hole is provided in the middle of the gantry frame, and a fixed plate is fixedly connected in the movable hole. A cavity is provided in the middle of the movable frame, and a spring telescopic rod is fixedly connected on the fixed plate. The fixed plate and the spring telescopic rod are located in the cavity, and the other end of the spring telescopic rod is fixedly connected to the movable frame.

[0012] Furthermore, the movable frame is provided with a lifting hole, and the lifting frame is located in the lifting hole. Two guide rods are fixedly connected to the upper surface of the movable frame. The lifting frame is sleeved on the outer surface of the two guide rods. After the top ends of the two guide rods pass through the top of the lifting frame, a spring is sleeved on each of them. The two ends of the spring are fixedly connected to the top surface of the lifting frame and the top end of the guide rod, respectively. Handles are fixedly connected to both side walls of the lifting frame.

[0013] Furthermore, the moving assembly also includes two sets of guide wheels 1 rotatably connected to the opposite side walls inside the moving hole, the guide wheels 1 rollingly contacting the surface of the moving frame, and two sets of guide wheels 2 rotatably connected to the opposite side walls inside the lifting hole, the guide wheels 2 rollingly contacting the surface of the lifting frame.

[0014] Furthermore, the worm gear consists of a shaft and a threaded rod. The diameter of the shaft is smaller than the diameter of the threaded rod. The threaded rod of the worm gear meshes with a worm wheel. A knob is fixedly connected to the bottom of the shaft of the worm gear. A threaded frame is fixedly connected to the bottom of the lifting frame. A threaded hole is opened in the middle of the threaded frame. The bottom of the shaft of the worm gear passes through the threaded hole. A threaded sleeve is threadedly connected inside the threaded hole. The threaded sleeve is fitted on the outer surface of the shaft of the worm gear. The top of the threaded sleeve is in close contact with the bottom of the threaded rod.

[0015] Furthermore, the top of the workbench is provided with a positioning component for positioning LED modules. The positioning component includes a water trough platform fixedly connected to the top of the workbench. A moving slot for placing LED modules is opened in the middle of the water trough platform. Two sets of electric telescopic rods symmetrical about the moving slot are fixedly connected to the middle of the water trough platform. Positioning plates are fixedly connected to the telescopic shafts of the two sets of electric telescopic rods.

[0016] Furthermore, the sides of the two positioning plates that are close to each other are both made of rubber.

[0017] Based on the above, the beneficial effects of the LED module desoldering device of the present invention are as follows:

[0018] Workers can quickly adjust the horizontal position and height of the desoldering pump by holding the handle with one hand, and quickly move the desoldering pump to the designated position. The electric desoldering pump of this invention will automatically melt the old solder and suck away the melted waste solder. In addition, by setting the wire feeding component, it can automatically feed new solder wire. Therefore, workers can operate it with only one hand, making the operation simpler and easier, which is conducive to improving work efficiency.

[0019] After the worker aims the desoldering pump at the solder pad that needs to be removed, they can lift their head away from the solder pad, thus avoiding inhaling too much of the solder fumes and preventing burns, which helps protect the worker's health.

[0020] By setting the adjustment component, the angle of the desoldering pump can be adjusted to place the desoldering pump at the optimal soldering angle, making it more reliable and flexible;

[0021] The LED module is fixed in position by two positioning plates to prevent shaking during the desoldering process. This avoids incomplete solder removal by the desoldering pump due to LED module shaking, reduces the risk of scratches or detachment of the LED module's pads caused by positional misalignment, and ensures the reliability of subsequent resoldering. Attached Figure Description

[0022] Figure 1 This is a three-dimensional schematic diagram of the overall components of the present invention;

[0023] Figure 2 This is a cross-sectional perspective view of the overall components of the present invention;

[0024] Figure 3 This is a three-dimensional schematic diagram of the gantry frame, guide wheels, and other components of the present invention;

[0025] Figure 4 This is a three-dimensional schematic diagram of the moving frame, guide wheels, and other components of the present invention;

[0026] Figure 5 For the present invention Figure 2Enlarged schematic diagram of component A in the middle;

[0027] Figure 6 This is a three-dimensional schematic diagram of the lifting frame, threaded frame, worm gear, and other components of the present invention;

[0028] Figure 7 This is a three-dimensional cross-sectional view of the lifting frame, handle, and other components of the present invention;

[0029] Figure 8 For the present invention Figure 7 Enlarged schematic diagram of component at point B;

[0030] Figure 9 This is a plan view of the desoldering pump, guide tube, and other components of the present invention;

[0031] Figure 10 This is a cross-sectional perspective view of the components such as the water tank platform of the present invention;

[0032] Figure 11 For the present invention Figure 10 Enlarged schematic diagram of component C in the middle.

[0033] The reference numerals in the accompanying drawings of this invention are as follows:

[0034] 1. Workbench; 2. Gantry crane;

[0035] 31. Guide wheel one; 32. Fixed plate; 33. Spring telescopic rod; 34. Moving frame; 341. Cavity; 35. Guide wheel two; 36. Lifting frame; 37. Guide rod; 38. Spring one; 39. Handle;

[0036] 41. Adjusting bracket; 42. Worm gear; 43. Worm; 44. Knob; 45. Threaded bracket; 46. Threaded sleeve; 47. Desoldering pump;

[0037] 51. Push rod; 52. Fixed block; 53. Guide tube; 54. Movable groove; 55. Spring II; 56. Movable block; 57. Feeding block;

[0038] 61. Water trough platform; 62. Electric telescopic rod; 63. Positioning plate. Detailed Implementation

[0039] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0040] The embodiments provided by the present invention will be described in detail below:

[0041] like Figures 1 to 10 As shown, an LED module desoldering device includes a worktable 1 and a desoldering pump 47. A gantry frame 2 is fixedly connected to the top of the worktable 1, and a moving component for moving the desoldering pump 47 is provided on the gantry frame 2.

[0042] A movable hole is provided in the middle of the gantry frame 2. The movable component includes two sets of guide wheels 31 rotatably connected to opposite side walls within the movable hole. Each set of guide wheels 31 has four wheels. A fixed plate 32 is fixedly connected to the movable hole of the gantry frame 2. Two spring telescopic rods 33 are fixedly connected to the fixed plate 32. A movable frame 34 is slidably disposed within the movable hole of the gantry frame 2. All four guide wheels 31 in each set are in rolling contact with the outer surface of the movable frame 34. A cavity 341 is provided in the middle of the movable frame 34, and the fixed plate 32 and the spring telescopic rods 33 are located within the cavity 341. Please refer to [link / reference]. Figure 2 Each spring telescopic rod 33 consists of a sleeve, a spring, and an abutment rod. One end of the sleeve is fixedly connected to the fixed plate 32, and the end of the sleeve away from the fixed plate 32 is open. The abutment rod is slidably connected inside the sleeve, and one end of the abutment rod extends out of the opening of the sleeve and is fixedly connected to the movable frame 34. The spring is located inside the sleeve, and both ends of the spring are fixedly connected to the inner wall of the sleeve and the abutment rod, respectively.

[0043] A lifting hole is provided at the end of the movable frame 34 away from the spring telescopic rod 33. Two sets of guide wheels 35 are rotatably connected to the opposite side walls of the lifting hole of the movable frame 34. Each set of guide wheels 35 has four wheels. A lifting frame 36 is slidably installed in the lifting hole of the movable frame 34. All four guide wheels 35 in each set are in rolling contact with the outer surface of the lifting frame 36. Two guide rods 37 are fixedly connected to the upper surface of the movable frame 34. The two guide rods 37 are symmetrically located on both sides of the lifting hole. The lifting frame 36 is sleeved on the outer surface of the two guide rods 37 and can move up and down along the guide rods 37. The top ends of the two guide rods 37 pass through the top of the lifting frame 36. A spring 38 is sleeved at the end of the two guide rods 37 that passes through the top of the lifting frame 36. The two ends of the spring 38 are fixedly connected to the top surface of the lifting frame 36 and the top end of the guide rod 37, respectively. Handles 39 are fixedly connected to both side walls of the lifting frame 36. A desoldering pump 47 is installed and fixed at the bottom end of the lifting frame 36.

[0044] When the LED module desoldering device is not used, the spring telescopic rod 33 is in the extended state, and the spring 38 is not stretched, that is, the spring 38 makes the lifting frame 36 in the highest position.

[0045] To ensure the bottom of the desoldering pump 47 is aligned with the solder pads of the LED module, its horizontal position and height need to be adjusted. When adjusting the horizontal position of the desoldering pump 47, the operator can hold handle 39 and pull it horizontally, causing the moving frame 34 to move within the moving hole of the gantry 2. As the moving frame 34 moves, it drives the guide wheel 31 to roll, making the movement of the moving frame 34 smoother and more stable. The movement of the moving frame 34 also compresses the abutment of the spring telescopic rod 33, causing the abutment to move closer to the spring within the sleeve, thus compressing the spring. When adjusting the height of the desoldering pump 47, the operator pulls handle 39 downwards, causing the lifting frame 36 to move downwards within the lifting hole of the moving frame 34. As the lifting frame 36 moves up and down, it drives the guide wheel 35 to roll, making the movement of the lifting frame 36 smoother and more stable. Furthermore, when the lifting frame 36 moves downward, it slides downward along the guide rod 37. At this time, the downward movement of the lifting frame 36 stretches the spring 38. Through the above operation, the desoldering pump 47 can be moved close to the solder joint of the LED module. When the operator releases the handle 39, the lifting frame 36 moves upward and resets under the elastic reset action of the spring 38. At the same time, the spring of the spring extension rod 33 moves in the opposite direction under the elastic reset action. At this time, the desoldering pump 47 can be quickly moved away from the LED module and kept suspended in the air. This prevents the desoldering pump 47 from burning other parts of the LED module after desoldering, thus ensuring the safety of the desoldering pump 47 in desoldering the LED module. In addition, it can also improve the stability of the desoldering pump 47 in the desoldering process.

[0046] like Figure 1 , Figure 2 , Figures 5 to 7 and Figure 9As shown, the bottom of the lifting frame 36 is provided with an adjustment assembly for adjusting the angle of the desoldering pump 47. The adjustment assembly includes an adjustment frame 41 rotatably connected to the bottom of the lifting frame 36. The adjustment frame 41 consists of a rotating rod and a U-shaped frame. The rotating rod of the adjustment frame 41 is rotatably connected to the bottom of the lifting frame 36. The desoldering pump 47 is fixedly connected to the U-shaped frame of the adjustment frame 41. A worm gear 42 is fixedly connected to the middle of the rotating rod of the adjustment frame 41. A worm 43 is rotatably connected to the bottom of the lifting frame 36. The worm 43 consists of a shaft and a threaded rod. The diameter of the shaft is smaller than the diameter of the threaded rod. The threaded rod of the worm 43 meshes with the worm gear 42. A knob 44 is fixedly connected to the bottom of the shaft of the worm 43. The bottom of the lifting frame 36 is fixedly connected to a threaded frame 45. A threaded hole is opened in the middle of the threaded frame 45. The bottom of the shaft of the worm 43 passes through the threaded hole. A threaded sleeve 46 is threadedly connected inside the threaded hole. The threaded sleeve 46 is sleeved on the outer surface of the shaft of the worm 43. The top of the threaded sleeve 46 is in close contact with the bottom of the threaded rod of the worm 43.

[0047] It should be noted that the desoldering pump 47 is an electric desoldering pump with suction and heating functions, which is existing technology and will not be described in detail here.

[0048] When not in use, the desoldering pump 47 is in a vertical position and the threaded sleeve 46 is in the highest position, that is, the top of the threaded sleeve 46 is in close contact with the threaded rod of the worm 43.

[0049] For different solder leads, it is sometimes necessary to adjust the angle of the desoldering pump 47. When the angle of the desoldering pump 47 needs to be adjusted, the operator rotates the threaded sleeve 46, causing the threaded sleeve 46 to move downwards until the top of the threaded sleeve 46 no longer abuts against the bottom of the threaded rod of the worm gear 43. At this time, the worm gear 43 can be rotated arbitrarily. The operator rotates the knob 44, which drives the worm gear 43 to rotate. When the worm gear 43 rotates, it causes the worm wheel 42 to rotate. The worm wheel 42 drives the adjusting frame 41 to rotate at the bottom of the lifting frame 36. When the adjusting frame 41 rotates, it drives the desoldering pump 47 to rotate. The rotating desoldering pump 47 can achieve different angle adjustments.

[0050] It should be noted that after the angle of the desoldering pump 47 is adjusted, the operator rotates the threaded sleeve 46 in the opposite direction, causing the threaded sleeve 46 to move upward. The threaded sleeve 46 then comes into close contact with the threaded rod of the worm gear 43, preventing the worm gear 43 from rotating. At this time, the worm gear 43, the worm wheel 42, and the adjusting bracket 41 maintain their adjusted positions, thereby locking the desoldering pump 47 at the adjusted angle.

[0051] like Figure 1 , Figure 6 , Figure 8 and Figure 9As shown, the lifting frame 36 is equipped with a wire feeding assembly for automatically feeding new solder wire. The wire feeding assembly includes a push rod 51 fixedly connected to the outer surface of the lifting frame 36. A fixed block 52 corresponding to the position of the push rod 51 is fixedly connected to one side of the moving frame 34. A guide tube 53 is fixedly connected to the fixed block 52, and the middle part of the guide tube 53 is fixedly connected to the rotating rod of the adjusting frame 41. The fixed block 52 has a movable groove 54 inside, and a second spring 55 is fixedly connected inside the movable groove 54. A movable block 56 is fixedly connected to the top of the second spring 55. The two ends of the movable block 56 are slidably disposed on the inner walls of the two movable grooves 54, respectively. A feeding block 57 is rotatably connected to the middle of the movable block 56. The feeding block 57 is located on the movement path of the push rod 51 and is inclined. A torsion spring is connected between the feeding block 57 and the movable block 56, and the feeding block 57 is kept inclined under the action of the torsion spring.

[0052] It should be noted that the solder wire is inserted into the interior of the guide tube 53 and exits from the bottom of the guide tube 53. The section of the guide tube 53 located next to the feeding block 57 is a flexible tube, while the guide tube 53 in other areas can be a rigid metal tube. The bottom of the guide tube 53 extends to the side of the desoldering pump 47. The bottom of the guide tube 53 is shaped to be inclined downwards towards the desoldering pump 47, so that the solder wire exiting from the guide tube 53 can move to the bottom of the desoldering pump 47.

[0053] Specifically, during the solder removal process, new solder wire needs to be brought close to the solder pads of the LED module. To achieve this, as the lifting frame 36 moves downwards, it drives the pushing rod 51 to move downwards simultaneously. As the pushing rod 51 moves downwards, it comes into contact with the end of the feeding block 57 furthest from the guide tube 53, causing the feeding block 57 to rotate around the movable block 56. The rotating feeding block 57 then comes into close contact with the solder wire located inside the guide tube 53, at which point the feeding block 57 can no longer rotate. However, as the push rod 51 continues to move downwards, it will cause the feeding block 57 to move downwards. The feeding block 57 will cause the movable block 56 to slide downwards within the movable groove 54. When the movable block 56 moves downwards, it will compress the second spring 55, and at the same time, it will cause the solder wire located in the guide tube 53 to move downwards. When the solder wire moves downwards inside the guide tube 53, it will move from the bottom of the guide tube 53 to the bottom of the desoldering pump 47. After moving to the bottom of the desoldering pump 47, the solder wire can contact the solder feet to be removed on the LED module. By automatically contacting the new solder wire with the solder feet, the old solder on the solder feet can be melted quickly, which makes it easier for the desoldering pump 47 to quickly remove the old solder, improving the desoldering efficiency of the LED module. Compared with the existing method that requires manual placement of the new solder wire near the soldering position, automatically delivering the solder wire to the soldering position can avoid the desoldering pump 47 burning the operator, thus improving the safety during desoldering.

[0054] It should be noted that when the lifting frame 36 moves upward, the lifting frame 36 will drive the pushing rod 51 to move upward, and then the pushing rod 51 will no longer push the feeding block 57, the torsion spring will reset, and the end of the feeding block 57 near the inside of the guide tube 53 will no longer be in close contact with the solder wire. As the pushing rod 51 moves upward, the elastic reset action of the second spring 55 will cause the movable block 56 to drive the feeding block 57 to move upward, so that all components are reset.

[0055] like Figures 1 to 4 , Figure 7 , Figure 10 and Figure 11 As shown, the top of the workbench 1 is provided with a positioning component for positioning LED modules. The positioning component includes a water trough platform 61 fixedly connected to the top of the workbench 1. The water trough platform 61 has a moving slot for placing LED modules in the middle. Two sets of electric telescopic rods 62 symmetrical about the moving slot are fixedly connected to the middle of the water trough platform 61. A positioning plate 63 is fixedly connected to the telescopic shaft of each of the two sets of electric telescopic rods 62.

[0056] It should be noted that the sides of the two positioning plates 63 that are close to each other are made of rubber to prevent damage to the LED module when they come into contact with it.

[0057] Specifically, refer to Figure 1 The operator places the LED module into the moving slot of the flow tray 61 from the left side, and then pushes the LED module to the right side within the moving slot of the flow tray 61. When the LED module moves to the position corresponding to the positioning plate 63, the operator controls the extension shafts of the two sets of electric telescopic rods 62 to extend. The extension shafts of the two sets of electric telescopic rods 62 will drive the two positioning plates 63 to move closer to each other. At this time, the two positioning plates 63 will position the LED module to avoid shaking during the desoldering process, thereby preventing the solder from being completely removed by the desoldering pump 47, and preventing the solder pads of the LED module from being scratched or falling off due to positional displacement, ensuring the reliability of subsequent resoldering.

[0058] It should be noted that after the LED module is desoldered, the telescopic shaft of the electric telescopic rod 62 is retracted. The telescopic shaft of the electric telescopic rod 62 will drive the positioning plate 63 away from the LED module. At this time, the LED module can move freely in the moving slot of the water tank platform 61, which makes it convenient to remove the LED module.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A LED module tin removal device, comprising a workbench (1) and a gantry (2) fixed on the workbench (1), characterized in that, A movable component is provided on the gantry (2); the movable component includes a movable frame (34) that is slidably disposed on the gantry (2) in the horizontal direction, a lifting frame (36) that is slidably disposed on the movable frame (34) in the vertical direction, and an adjustment component is provided at the bottom of the lifting frame (36); the adjustment component includes an adjustment frame (41) that is rotatably connected to the bottom of the lifting frame (36), a worm gear (42) that is fixedly connected to the adjustment frame (41), a worm (43) that meshes with the worm gear (42) that is rotatably connected to the bottom of the lifting frame (36), and a desoldering pump (47) that is fixedly connected to the bottom end of the adjustment frame (41); the desoldering pump (47) is an electric desoldering pump; The lifting frame (36) is provided with a wire feeding assembly, which includes a push rod (51) fixedly connected to one side of the lifting frame (36). A fixed block (52) is fixedly connected to one side of the moving frame (34). A guide tube (53) for guiding the solder wire to the bottom of the desoldering pump (47) is fixedly connected to the fixed block (52). The guide tube (53) is fixedly connected to the adjusting frame (41). A feeding block (57) for pushing the solder wire downward is provided inside the fixed block (52). The feeding block (57) is located on the movement path of the push rod (51). The downward movement of the push rod (51) can push the feeding block (57) downward. The fixed block (52) has an open movable groove (54) inside. A second spring (55) is fixedly connected inside the movable groove (54). A movable block (56) is fixedly connected to the top of the second spring (55). The two ends of the movable block (56) are slidably set on the inner walls of the two movable grooves (54). A feeding block (57) is rotatably connected to the middle of the movable block (56). A torsion spring is connected between the feeding block (57) and the movable block (56). The section of the guide tube (53) located next to the feeding block (57) is a flexible tube. After the feeding block (57) rotates, it can squeeze the tin wire in the guide tube (53). The gantry (2) has a moving hole in the middle, and a fixed plate (32) is fixedly connected in the moving hole. A cavity (341) is opened in the middle of the moving frame (34). A spring telescopic rod (33) is fixedly connected on the fixed plate (32). The fixed plate (32) and the spring telescopic rod (33) are located in the cavity (341). The other end of the spring telescopic rod (33) is fixedly connected to the moving frame (34).

2. The LED module tin removal apparatus of claim 1, wherein, The movable frame (34) has a lifting hole, and the lifting frame (36) is located in the lifting hole. Two guide rods (37) are fixedly connected to the upper surface of the movable frame (34). The lifting frame (36) is sleeved on the outer surface of the two guide rods (37). The top ends of the two guide rods (37) pass through the top of the lifting frame (36) and are each sleeved with a spring (38). The two ends of the spring (38) are fixedly connected to the top surface of the lifting frame (36) and the top end of the guide rod (37) respectively. Handles (39) are fixedly connected to both sides of the lifting frame (36).

3. The LED module tin removal apparatus of claim 2, wherein, The moving assembly also includes two sets of guide wheels (31) rotatably connected to the opposite side walls inside the moving hole. The guide wheels (31) roll in contact with the surface of the moving frame (34). Two sets of guide wheels (35) are rotatably connected to the opposite side walls inside the lifting hole. The guide wheels (35) roll in contact with the surface of the lifting frame (36).

4. The LED module desoldering device according to claim 1, characterized in that, The worm (43) consists of a shaft and a threaded rod. The diameter of the shaft is smaller than the diameter of the threaded rod. The threaded rod of the worm (43) meshes with the worm wheel (42). A knob (44) is fixedly connected to the bottom of the shaft of the worm (43). A threaded frame (45) is fixedly connected to the bottom of the lifting frame (36). A threaded hole is opened in the middle of the threaded frame (45). The bottom of the shaft of the worm (43) passes through the threaded hole. A threaded sleeve (46) is threadedly connected inside the threaded hole. The threaded sleeve (46) is sleeved on the outer surface of the shaft of the worm (43). The top of the threaded sleeve (46) is in close contact with the bottom of the threaded rod.

5. The LED module desoldering device according to claim 1, characterized in that, The top of the workbench (1) is provided with a positioning component for positioning LED modules. The positioning component includes a water trough platform (61) fixedly connected to the top of the workbench (1). A moving slot for placing LED modules is opened in the middle of the water trough platform (61). Two sets of electric telescopic rods (62) symmetrical about the moving slot are fixedly connected in the middle of the water trough platform (61). A positioning plate (63) is fixedly connected on the telescopic shaft of the two sets of electric telescopic rods (62).

6. The LED module desoldering device according to claim 5, characterized in that, The sides of the two positioning plates (63) that are close to each other are made of rubber.

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