Inspection system and inspection method

Abstract

An inspection system and an inspection method are provided, the inspection system including: a stage disposed on a plane defined by a first direction and a second direction intersecting the first direction, where the stage is rotatable about an axis parallel to the first direction and a sample is located on the stage; an aligner that aligns the sample before or after the sample is located on the stage; a checker that irradiates the laser light to a detection position of the sample; and a controller that aligns the stage based on the detected position of the sample.

Description

Technical Field

[0001] The disclosed embodiments relate to an inspection system and a method of inspection using the inspection system. Background Technology

[0002] Raman spectroscopy is an analytical technique that uses laser light to illuminate a target sample and determines the material's composition based on the resulting spectrum. When a target sample is illuminated with a laser as a monochromatic light source, the light is scattered, and most of the scattered light is a signal corresponding to the wavelength of the laser. However, some of the scattered light is a signal representing the Raman shift, corresponding to the frequency of the sample's vibrational modes at the laser's wavelength. By analyzing this signal, information about the shape and symmetry of molecules or crystals can be provided, and the crystallinity of the sample can be determined. Because the pattern of wavelength variations changes according to the material's structural properties and exhibits unique characteristics for each specific material, Raman spectroscopy is often referred to as the fingerprint of a material. Summary of the Invention

[0003] The embodiments provide an inspection system with improved efficiency.

[0004] The embodiment provides a method for inspection using an inspection system.

[0005] The inspection system according to the disclosed embodiments includes: a stage disposed on a plane defined by a first direction and a second direction intersecting the first direction, wherein the stage is rotatable about an axis parallel to the first direction and a sample is located on the stage; an aligner for aligning the sample before or after the sample is located on the stage; an inspector for irradiating a detection position of the sample with a laser; and a controller for aligning the stage based on the detection position of the sample.

[0006] In an embodiment, the aligner may include: a first aligner for aligning the sample before it is placed on the stage; and a second aligner spaced apart from the first aligner and for aligning the sample after it is placed on the stage.

[0007] In an embodiment, the lens included in the first aligner may be different from the lens included in the second aligner.

[0008] In one embodiment, the inspector may include a Raman spectrometer.

[0009] In one embodiment, the inspector can extract image data of the sample upwards at each third point intersecting with the first and second directions.

[0010] In an embodiment, the inspector may include: a first lens; and a second lens having a higher magnification than the first lens.

[0011] In an embodiment, the working distance of the first lens can be equal to the working distance of the second lens.

[0012] In an embodiment, the controller may include: a first controller that transmits the detection position of the sample in another inspection; a second controller that calculates a compensation value for the stage based on the detection position of the sample; and a third controller that aligns the stage based on the compensation value for the stage.

[0013] In an embodiment, the platform can be movable in the first direction, the second direction, and a third direction intersecting with each of the first and second directions.

[0014] In one embodiment, the inspection system may further include a loader for loading or unloading samples onto a stage.

[0015] The inspection method according to the disclosed embodiments includes the following steps: placing a sample on a stage, the stage being disposed on a plane defined by a first direction and a second direction intersecting the first direction; aligning the sample; obtaining the detection position of the sample; aligning the stage based on the detection position of the sample; and inspecting the detection position of the sample.

[0016] In an embodiment, the step of aligning the sample may include: aligning the sample with a first aligner before placing the sample on the stage; and aligning the sample with a second aligner after placing the sample on the stage.

[0017] In an embodiment, the lens included in the first aligner may be different from the lens included in the second aligner.

[0018] In an embodiment, the step of obtaining the detection location of the sample may include: transmitting the detection location of the sample in another inspection via a first controller; and extracting image data of the sample upwards at each third intersection with the first and second directions via an inspector.

[0019] In one embodiment, the step of aligning the stage according to the detection position of the sample may include: calculating a compensation value for the stage based on the detection position of the sample using a second controller; and aligning the stage based on the compensation value using a third controller.

[0020] In an embodiment, the platform may be movable in a first direction, a second direction, and a third direction, and may be rotatable about an axis parallel to the first direction.

[0021] In one embodiment, the step of checking the detection location of the sample may include: irradiating the detection location of the sample with a laser through an inspector.

[0022] In one embodiment, the inspector may include a Raman spectrometer.

[0023] In an embodiment, the inspector may include: a first lens; and a second lens having a higher magnification than the first lens, wherein the working distance of the first lens may be equal to the working distance of the second lens.

[0024] In one embodiment, the inspector can use a first lens to extract image data and a second lens to illuminate a laser.

[0025] In the inspection system and method according to the disclosed embodiments, sample movement, alignment, inspection, etc., can all be performed automatically. The sample can be moved by a loader and precisely aligned by an aligner, and the inspection of the sample's detection position can be performed by a controller and an inspector. Furthermore, since the stage on which the sample is placed is rotatable, inspection and analysis can be performed efficiently even if the sample's detection position is located on a curved portion of the sample. Therefore, the inspection and analysis time for the sample can be reduced, and process efficiency can be improved because the sample's material can be utilized through non-destructive analysis. Attached Figure Description

[0026] Figure 1 This is a perspective view schematically illustrating an inspection system according to a disclosed embodiment.

[0027] Figure 2 It is shown that it includes Figure 1 The view of the platform in the inspection system.

[0028] Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 This is a view illustrating a method of inspection according to a disclosed embodiment. Detailed Implementation

[0029] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals throughout refer to the same elements.

[0030] It will be understood that when an element is referred to as being "on" another element, the element may be directly on the other element, or there may be an intermediary element between the element and the other element. Conversely, when an element is referred to as being "directly on" another element, there is no intermediary element.

[0031] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, without departing from the teaching herein, “first element,” “first component,” “first region,” “first layer,” or “first part” discussed below may be referred to as a second element, second component, second region, second layer, or second part.

[0032] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, “a,” “an,” “the,” and “at least one,” etc., do not indicate a limitation on quantity and are intended to include both singular and plural forms. Thus, a reference to an element “a” followed by a reference to an element “the” in a claim includes one element and multiple elements. For example, unless the context clearly indicates otherwise, “an element” has the same meaning as “at least one element.” “At least one” will not be construed as a limiting “a” or “an.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will also be understood that when the terms “comprising” or “including” and variations thereof are used in this specification, it indicates the presence of the stated features, areas, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, areas, integrals, steps, operations, elements, components and / or groups thereof.

[0033] Furthermore, relative terms such as “lower” or “bottom” and “upper” or “top” may be used herein to describe the relationship between one element and another as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the relative terms are intended to cover different orientations of the device. For example, if the device in one of the drawings is flipped, the element described as being “below” the other elements will subsequently be oriented “above” the other elements. Thus, the term “lower” can encompass both “lower” and “upper” orientations depending on the specific orientation of the drawing. Similarly, if the device in one of the drawings is flipped, the element described as being “below” or “under” the other elements will subsequently be oriented “above” the other elements. Thus, the terms “below” or “under” can encompass both above and below orientations.

[0034] As used herein, “about” or “approximately” includes the stated value and means within an acceptable deviation of the specific value as determined by a person of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, “about” may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0035] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and in this disclosure, and shall not be interpreted in an idealized or overly formalized sense, unless expressly defined herein.

[0036] Embodiments are described herein with reference to schematic diagrams of idealized embodiments. Thus, variations in the shapes illustrated will be expected due to factors such as manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the areas shown herein, but will include deviations in shape caused, for example, by manufacturing processes. For instance, areas shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded (rounded). Therefore, the areas shown in the figures are schematic in nature, and their shapes are not intended to show the precise shapes of the areas, nor are they intended to limit the scope of the claims.

[0037] In the following description, the disclosed embodiments will be described in more detail with reference to the accompanying drawings. The same or identical reference numerals are used for the same or identical components in the drawings, and any repeated detailed descriptions of the same or identical components will be omitted.

[0038] Figure 1 This is a perspective view schematically illustrating an inspection system according to a disclosed embodiment. Figure 2 It is shown that it includes Figure 1 The view of the platform in the inspection system.

[0039] Reference Figure 1 and Figure 2 An embodiment of the inspection system SYS may include a board PL, a shuttle SH, a loader LD, a reader CR, an aligner AL, a stage ST, an inspector IP, and a controller CON.

[0040] The inspection system SYS can be used in the manufacturing process of a display device. In an embodiment, for example, the inspection system SYS can be used during the manufacturing process of the display device to inspect foreign objects included in the display device. However, the disclosure is not limited thereto, and the inspection system SYS can be used during the manufacturing process of the display device to inspect various other processes.

[0041] The plate PL can be disposed on a plane defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1, or disposed parallel to the plane defined by the first direction DR1 and the second direction DR2 intersecting the first direction DR1. In an embodiment, for example, the first direction DR1 and the second direction DR2 can be perpendicular to each other.

[0042] The shuttle SH can be mounted on the plate PL. Inspection objects can be inserted and positioned on the shuttle SH in tray units. The shuttle SH can support the inspection objects inserted into the inspection system SYS. In an embodiment, for example, the shuttle SH can be movable in a first direction DR1 and in the direction opposite to the first direction DR1.

[0043] The loader LD can be mounted on the plate PL. The loader LD can be positioned adjacent to the shuttle SH. In an embodiment, for example, the loader LD can be an articulated (e.g., six-axis) robotic arm. The loader LD can load or unload objects to be inspected. The loader LD can move objects to be inspected. In an embodiment, for example, the loader LD can load objects to be inspected from the shuttle SH and unload them onto the stage ST, or it can load objects to be inspected from the stage ST and unload them onto the shuttle SH.

[0044] The reader (CR) can be mounted on the board (PL). The reader (CR) can read unique information about the object being inspected. In an embodiment, for example, the reader (CR) can read the unit identifier (ID) of the object being inspected.

[0045] Alignment AL can be disposed on board PL. Alignment AL may include a first alignment AL1 and a second alignment AL2 spaced apart from each other. Alignment AL can align the object to be inspected (or change the position of the object to be inspected). In an embodiment, alignment AL can align the object to be inspected in a first direction DR1 and a second direction DR2.

[0046] In an embodiment, the first aligner AL1 and the second aligner AL2 can be aligned sequentially with the object to be inspected. For example, in an embodiment, the first aligner AL1 can be aligned with the object to be inspected first, and then the second aligner AL2 can be aligned with the object to be inspected.

[0047] The aligner AL may include a camera module. In one embodiment, for example, the aligner AL may capture an image on a third direction DR3 that intersects each of the first direction DR1 and the second direction DR2. In another embodiment, for example, the third direction DR3 may be perpendicular to each of the first direction DR1 and the second direction DR2. The aligner AL may identify an image of the object to be inspected on the third direction DR3 to align the object to be inspected.

[0048] In embodiments, the first aligner AL1 and the second aligner AL2 may include different lenses. For example, in embodiments, the second aligner AL2 may include a lens that is relatively more precise than the lens included in the first aligner AL1. The second aligner AL2 may include a lens having relatively less distortion than the lens included in the first aligner AL1. For example, in embodiments, the first aligner AL1 may include a macro lens, and the second aligner AL2 may include a telecentric lens.

[0049] The stage ST can be mounted on the board PL. The stage ST can be mounted on the plane defined by the first direction DR1 and the second direction DR2, or it can be mounted parallel to the plane defined by the first direction DR1 and the second direction DR2. The stage ST can be movable in the first direction DR1, in the direction opposite to the first direction DR1, in the second direction DR2, in the direction opposite to the second direction DR2, in the third direction DR3, and in the direction opposite to the third direction DR3.

[0050] In an embodiment, the stage ST can be positioned about an axis AX parallel to the first direction DR1 (see...). Figure 2 The stage ST is rotatable. The axis AX can be an imaginary extension parallel to the first direction DR1 and passing through the center of the stage ST. In an embodiment, for example, the stage ST can rotate approximately 90 degrees clockwise about the axis AX and approximately 90 degrees counterclockwise about the axis AX. That is, the stage ST can be movable about four axes. The object to be inspected can be located on the stage ST.

[0051] although Figure 1 An embodiment of the inspection system SYS comprising two STs is shown, but the disclosure is not limited thereto. In the disclosed embodiments, the number of STs included in the inspection system SYS is not limited, and the inspection system SYS may include one or more STs.

[0052] The inspector IP can be mounted on board PL. The inspector IP may include a camera module. The inspector IP can capture images of the inspected object on a third-party DR3. In an embodiment, for example, the inspector IP can obtain or extract image data of the inspected object on a third-party DR3.

[0053] Furthermore, the inspector IP can illuminate the object being inspected with a laser. In an embodiment, the inspector IP may include a Raman spectrometer. The inspector IP can analyze the light scattered from the object being inspected to examine the object.

[0054] The inspector IP may include a first lens and a second lens. In an embodiment, the second lens may have a higher magnification than the first lens. That is, the first lens may be a low-magnification lens, and the second lens may be a high-magnification lens. The first and second lenses may be automatically switched. In an embodiment, the working distance of the first lens may be equal to the working distance of the second lens. Here, the working distance may be defined as the distance from the front end of the first and second lenses to the upper surface of the object being inspected.

[0055] The controller CON may include a first controller CON1, a second controller CON2, and a third controller CON3. The controller CON can control components included in the inspection system SYS (e.g., the loader LD, the stage ST, etc.). The controller CON may include circuitry.

[0056] The first controller CON1 can transmit other inspection results of the inspected object. In an embodiment, for example, the first controller CON1 can transmit the coordinates of the detection location (e.g., defect location) of the inspected object in other inspections. Other inspections can be previously performed inspections. Other inspections can be image quality checks of the inspected object, appearance checks of the inspected object, etc.

[0057] The second controller CON2 can calculate the value that the stage ST should align with. The second controller CON2 can calculate the compensation value of the stage ST based on the detection position of the object being inspected on the stage ST. Furthermore, the second controller CON2 can match the results of the inspected objects checked by the inspector IP with a database, and can transmit the data of the inspected objects (e.g., to the first controller CON1, external devices, etc.).

[0058] The third controller CON3 can control the components that will be driven in the inspection system SYS. In an embodiment, the third controller CON3 can align the stage ST. The third controller CON3 can align the stage ST based on compensation values ​​calculated by the second controller CON2.

[0059] Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 This is a view illustrating a method of inspection according to a disclosed embodiment. For example, reference can be used... Figure 1 and Figure 2 The described inspection system SYS is used to perform the reference. Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 The method of inspection described (S10). In the following text, any repeated detailed descriptions of elements that are the same as or identical to those described above will be omitted or simplified.

[0060] Figure 3 This is a flowchart illustrating an embodiment of the inspection method (S10). Figure 4 It can be a flowchart illustrating an embodiment of the process (S100) for inserting sample SP, and Figure 5 This may be a view illustrating an embodiment of the process (S110) of inserting the tray TR.

[0061] Reference Figure 1 , Figure 3 , Figure 4 and Figure 5 In an embodiment of the inspection method (S10), a sample SP can be inserted into the inspection system SYS (S100). The sample SP can correspond to the object being inspected.

[0062] In an embodiment, the sample SP can be a display device under manufacture. For example, the sample SP may include components such as a substrate, inorganic layer, organic layer, metal layer, and window included in the display device.

[0063] In the insertion of sample SP (S100), a tray TR on which the sample SP is disposed can be inserted into the inspection system SYS (S110). In an embodiment, for example, sample SPs can be inserted in units of tray TRs. Multiple sample SPs can be arranged on tray TRs in a first direction DR1 and a second direction DR2. The tray TR on which the sample SPs are disposed can be disposed on a shuttle SH and inserted into the inspection system SYS. In an embodiment, for example, the tray TR can be inserted into the inspection system SYS, and the shuttle SH can support the tray TR and move in the opposite direction to the first direction DR1.

[0064] In inserting sample SP (S100), the loader LD can load sample SP (S120). The loader LD can load (or pick up) one of the sample SPs on a tray TR disposed on a shuttle SH disposed adjacent to the loader LD. In an embodiment, for example, the loader LD can be an articulated robotic arm. The loader LD can move the loaded sample SP. The loader LD can move the sample SP closer to the reader CR.

[0065] In the inserted sample SP (S100), the detection location DP of sample SP can be confirmed (see Figure 8 The first and second coordinates of the sample SP are (S130). Here, the detection location DP can be the location of a defect (e.g., foreign object, etc.) in the sample SP, the first coordinate can be the X coordinate (e.g., the coordinate on the first direction DR1), and the second coordinate can be the Y coordinate (e.g., the coordinate on the second direction DR2).

[0066] The reader CR can read specific information (e.g., the unit ID of the sample SP) moved by the loader LD, and the first controller CON1 can transmit the coordinates of other inspection results of the sample SP through this specific information. In an embodiment, the first controller CON1 can transmit the first and second coordinates of the detection position DP of the sample SP in other inspections. In an embodiment, for example, if the sample SP is a display device under manufacturing, other inspections may include image quality inspection to check for defects by driving the sample SP, appearance inspection to check for defects without driving the sample SP, etc. In an embodiment, the first controller CON1 can transmit the first and second coordinates of the detection position DP of the sample SP to the third controller CON3.

[0067] Figure 6 This is a flowchart illustrating an embodiment of the process (S200) of aligning a sample SP on a stage ST.

[0068] Reference Figure 1 , Figure 3 and Figure 6 In an embodiment of the inspection method (S10), the sample SP can be aligned on the stage ST (S200).

[0069] In aligning the sample SP on the stage ST (S200), the first aligner AL1 can initially align the sample SP (S210).

[0070] The first aligner AL1 can capture an image of the sample SP moved by the loader LD and can initially align the sample SP. In an embodiment, for example, the first aligner AL1 can identify the corner of the sample SP on a third direction DR3 to align the sample SP on the first direction DR1 and the second direction DR2. In an embodiment, the first aligner AL1 may include a macro lens. In an embodiment, for example, the error range of the first aligner AL1 may be approximately several hundred micrometers.

[0071] In aligning the sample SP on the stage ST (S200), the sample SP can be placed on the stage ST (S220).

[0072] The loader LD can unload the sample SP onto the stage ST. That is, the loader LD can place the sample SP, which has been initially aligned by the first aligner AL1, onto the stage ST. The stage ST, on which the sample SP is placed, can move toward the second aligner AL2 (e.g., in the first direction DR1).

[0073] During the alignment of sample SP on stage ST (S200), the second aligner AL2 can align sample SP a second time (S230).

[0074] The second aligner AL2 can capture an image of the sample SP located on the stage ST and can perform secondary alignment of the sample SP. In an embodiment, for example, the second aligner AL2 can identify the corner of the sample SP on a third direction DR3 to align the sample SP on the first direction DR1 and the second direction DR2. In an embodiment, the second aligner AL2 may include a telecentric lens. In an embodiment, for example, the error range of the second aligner AL2 may be approximately 30 micrometers. Because the second aligner AL2 includes a lens that is relatively more precise and has less distortion than the first aligner AL1, the sample SP can be aligned more accurately. Since the sample SP is sequentially and automatically aligned by the first aligner AL1 and the second aligner AL2, the inspection system SYS can repeatedly and accurately align the sample SP on the stage ST.

[0075] Figure 7 This could be a flowchart illustrating an embodiment of the process (S300) of aligning the stage ST with the detection position DP of the sample SP, and Figure 8 This may be a view showing an embodiment of the process (S330) of the alignment stage ST.

[0076] Reference Figure 1 , Figure 3 , Figure 7 and Figure 8 In an embodiment of the inspection method (S10), the alignment stage ST can be aligned according to (or based on) the detection position DP of the sample SP (S300).

[0077] In the alignment stage ST (S300) based on the detection position DP of the sample SP, the third coordinate of the detection position DP of the sample SP can be analyzed by the inspector IP (S310). Here, the third coordinate can be the Z coordinate (e.g., the coordinate on the third direction DR3).

[0078] The inspector IP can capture an image of the sample SP on the third-direction DR3 to extract image data of the sample SP on the third-direction DR3. In an embodiment, for example, the third controller CON3 can move the stage ST such that the first and second coordinates of the detection position DP of the sample SP correspond to the imaging position of the inspector IP, and the inspector IP can capture an image of the detection position DP of the sample SP on the third-direction DR3 to extract image data of the detection position DP of the sample SP on the third-direction DR3.

[0079] In such an embodiment, firstly, the inspector IP can identify the uppermost surface of the sample SP using a first lens (e.g., a 10X lens). Subsequently, taking into account the thickness, refractive index, etc. of the uppermost layer of the sample SP, the inspector IP can scan an image for a predetermined range in an area decreasing in thickness from the uppermost surface to extract image data for the layers below the uppermost layer.

[0080] In an embodiment, for example, when the sample SP is a display device under manufacture, taking into account the thickness, refractive index, etc. of the window of the sample SP, the inspector IP can scan an image for a predetermined range in an area where the thickness is reduced from the top surface by a predetermined amount, and can extract three-dimensional (3D) image data for the layers below the window (i.e., organic layers, inorganic layers, metallic layers, etc.). In an embodiment, for example, taking into account the thickness, refractive index, etc. of the window, the inspector IP can extract 3D image data for an area of ​​approximately ±125 micrometers (μm) after reducing the thickness by approximately 400 μm from the top surface, but the disclosure is not limited thereto.

[0081] By extracting the image data, the inspector IP can confirm the third coordinate of the detection location DP. In other words, the third coordinate can be obtained by the inspector IP from the first and second coordinates of the detection location DP.

[0082] In the alignment stage ST (S300) based on the detection position DP of the sample SP, the detection position DP of the sample SP can be obtained (S320).

[0083] The second controller CON2 can calculate the compensation value of the stage ST based on (or based on) the first, second, and third coordinates of the detection position DP of the sample SP. In other words, the second controller CON2 can calculate the compensation value of the stage ST based on (or based on) the detection position DP of the sample SP and the inspection position of the inspector IP.

[0084] In the alignment stage ST (S300) based on the detection position DP of the sample SP, the alignment stage ST (S330) can be used.

[0085] The third controller CON3 can drive and align the stage ST according to (or based on) the compensation value calculated by the second controller CON2. The stage ST can be moved according to (or based on) the detection position DP of the sample SP in the first direction DR1, the direction opposite to the first direction DR1, the second direction DR2, the direction opposite to the second direction DR2, the third direction DR3, or the direction opposite to the third direction DR3. Furthermore, when the detection position DP of the sample SP is located at a curved portion of the sample SP, the stage ST can rotate according to (or based on) the detection position DP of the sample SP about an axis AX parallel to the first direction DR1. Therefore, the stage ST can move in a manner that makes the detection position DP of the sample SP correspond to the inspection position of the inspector IP.

[0086] Figure 9 This could be a flowchart illustrating an embodiment of the process (S400) for inspecting the detection location DP of the sample SP, and Figure 10 This may be a view illustrating an embodiment of the process (S420) of irradiating a sample SP at a detection location DP with a laser.

[0087] Reference Figure 1 , Figure 3 , Figure 9 and Figure 10 In an embodiment of the inspection method (S10), the detection location DP of the sample SP can be inspected (S400).

[0088] In the detection position DP (S400) of the sample SP, the lens of the inspector IP can be changed (S410).

[0089] In an embodiment, the lens of the inspector IP can automatically change from a first lens (e.g., a 10X lens) to a second lens (e.g., a 50X lens) and the laser is irradiated using the second lens. The working distance of the first lens and the working distance of the second lens can be the same. That is, the working distance of the low-magnification lens can be equal to the working distance of the high-magnification lens.

[0090] In the inspection of the detection position DP (S400) of the sample SP, a laser can be irradiated onto the detection position DP (S420) of the sample SP. The inspector IP may include a Raman spectrometer and can perform Raman inspection. Raman inspection can be an examination of the molecular structure and optical properties of a material using Raman spectroscopy.

[0091] Raman spectroscopy uses Raman scattering, which alters the wavelength of light, and measures the vibrational energy of a material by observing the decrease or increase in the energy of the scattered light relative to Rayleigh scattering. The spectrum expresses the shift of the scattered light as a Raman shift, and the Raman shift corresponds to the vibrational frequency of the molecule. Qualitative and quantitative analysis of materials can be performed using spectra in which the intensity of the scattered light is indicated by frequency as bands or a series of peaks.

[0092] In an embodiment, such as Figure 10 As shown, the inspector IP may include a light source LS, a first beam splitter SL1, a second beam splitter SL2, and a detector DT. The inspector IP can perform Raman inspection on the sample SP at the detection position DP located at the inspection position of the inspector IP.

[0093] A light source LS emits a laser L with a specific wavelength. The laser L emitted from the light source LS can be reflected by a first beam splitter SL1 and incident (i.e., illuminated) onto the sample SP. The laser L incident on the sample SP can be reflected again from the sample SP, pass through the first beam splitter SL1, be reflected by a second beam splitter SL2, and incident on the detector DT. The detector DT can detect the Raman spectrum of the laser L incident on the detector DT. Therefore, by analyzing the Raman spectrum detected from the detector DT, the inspector IP can examine the composition included in the sample SP (e.g., the composition of foreign matter located at the detection position DP of the sample SP).

[0094] Although not in Figure 10 As shown, however, at least one reflector or lens may be further disposed between the light source LS, the first beam splitter SL1, the second beam splitter SL2, and the detector DT. In embodiments, for example, at least one reflector or lens may include a plane mirror, a convex mirror, a concave mirror, etc. At least one reflector or lens can focus the laser L, disperse the laser L, or change the path of the laser L.

[0095] In the inspection of the detection location DP of the sample SP (S400), the inspection result of the detection location DP of the sample SP can be matched with the database, and the data of the detection location DP of the sample SP can be transmitted (S430).

[0096] The second controller CON2 can match the inspection results of the detection positions DP of the sample SP inspected by the inspector IP with the database, and can analyze the composition of the detection positions DP. Furthermore, the second controller CON2 can transmit data of the detection positions DP of the sample SP. In an embodiment, for example, the second controller CON2 can transmit the data to the first controller CON1, external devices, etc.

[0097] Figure 11This is a flowchart illustrating an embodiment of the process (S500) for removing sample SP.

[0098] Reference Figure 1 , Figure 3 and Figure 11 In an embodiment of the inspection method (S10), the sample SP can be removed (S500).

[0099] In the sample retrieval process (S500), the loader LD can unload the sample SP (S510). The loader LD can load (or pick up) the sample SP set on the stage ST and unload the sample SP onto the shuttle SH. That is, the loader LD can return the sample SP that has been inspected to the shuttle SH.

[0100] Subsequently, when there are unchecked sample SPs remaining in the tray TR, the loader LD can load the unchecked sample SPs (S120). The loading (S120) of sample SPs through the loader LD to the unloading (S510) of sample SPs through the loader LD can be repeated until the inspection of all sample SPs set on the tray TR is completed.

[0101] In the sample removal step (S500), the tray TR on which the sample SP is placed can be removed from the inspection system SYS (S520). When the inspection of all sample SPs placed on the tray TR is completed, the tray TR on which the inspected sample SPs are placed can be placed on the shuttle SH and removed from the inspection system SYS. In an embodiment, for example, the shuttle SH can support the tray TR and move in a first direction DR1, and the tray TR can be removed from the inspection system SYS.

[0102] In the inspection system SYS and inspection method (S10) according to the disclosed embodiments, the movement, alignment, and inspection of the sample SP can be performed entirely automatically. The sample SP can be moved by the loader LD and precisely aligned by the aligner AL, and the inspection of the detection position DP of the sample SP can be performed by the controller CON and the inspector IP. Furthermore, since the stage ST on which the sample SP is mounted is rotatable, its inspection and analysis can be performed effectively even if the detection position DP of the sample SP is located at a curved portion of the sample SP. Therefore, the inspection and analysis time for the sample SP can be reduced, and process efficiency can be improved because the material of the sample SP can be utilized through non-destructive analysis.

[0103] The disclosed process can be applied to the manufacturing of various display devices and electronic devices. For example, the disclosed process is applicable to the manufacturing of various display devices (such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for display or information transmission, medical display devices, etc.).

[0104] The invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those skilled in the art.

[0105] Although the invention has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. An inspection system, the inspection system comprising: A platform is disposed on a plane defined by a first direction and a second direction intersecting the first direction, wherein the platform is rotatable about an axis parallel to the first direction, and a sample is located on the platform; An aligner that aligns the sample before or after the sample is placed on the stage; The inspector directs a laser beam to the detection location of the sample; and The controller aligns the stage based on the detection position of the sample.

2. The inspection system according to claim 1, wherein, The aligner includes: A first aligner aligns the sample before the sample is placed on the stage; and A second aligner is spaced apart from the first aligner and aligns the sample after the sample is placed on the stage.

3. The inspection system according to claim 2, wherein, The lens included in the first aligner is different from the lens included in the second aligner.

4. The inspection system according to claim 1, wherein, The inspector includes a Raman spectrometer.

5. The inspection system according to claim 1, wherein, The inspector extracts image data of the sample upwards at each third point intersecting with the first and second directions.

6. The inspection system according to claim 1, wherein, The inspector includes: The first lens; and The second lens has a higher magnification than the first lens.

7. The inspection system according to claim 6, wherein, The working distance of the first lens is equal to the working distance of the second lens.

8. The inspection system according to claim 1, wherein, The controller includes: A first controller transmits the detection location of the sample in another inspection; The second controller calculates the compensation value of the stage based on the detection position of the sample; and The third controller aligns the station based on the compensation value of the station.

9. The inspection system according to claim 1, wherein, The platform is movable in the first direction, the second direction, and a third direction intersecting with each of the first and second directions.

10. The inspection system according to claim 1, further comprising: The loader loads or unloads the sample onto the platform.

11. A method of inspection, the method comprising the following steps: The sample is placed on a platform, which is positioned on a plane defined by a first direction and a second direction intersecting the first direction; Align the sample; Obtain the detection location of the sample; The stage is aligned based on the detection position of the sample; as well as Examine the detection location of the sample.

12. The method according to claim 11, wherein, The steps for aligning the sample include: Before placing the sample on the stage, the sample is aligned using a first aligner; and After the sample is placed on the stage, it is aligned using a second aligner.

13. The method according to claim 12, wherein, The lens included in the first aligner is different from the lens included in the second aligner.

14. The method according to claim 11, wherein, The step of obtaining the detection location of the sample includes: The first controller transmits the detection location of the sample in another inspection; and The image data of the sample is extracted upwards from each third point intersecting with the first and second directions by an inspector.

15. The method according to claim 14, wherein, The step of aligning the stage based on the detection position of the sample includes: The compensation value of the station is calculated by the second controller based on the detection position of the sample; and The station is aligned by a third controller based on the compensation value of the station.

16. The method of claim 14, wherein, The platform is movable in the first direction, the second direction, and the third direction, and is rotatable about an axis parallel to the first direction.

17. The method of claim 14, wherein, The steps for checking the detection location of the sample include: The laser is directed onto the detection location of the sample using the inspector.

18. The method according to claim 17, wherein, The inspector includes a Raman spectrometer.

19. The method of claim 17, wherein, The inspector includes: The first lens; and The second lens has a higher magnification than the first lens. The working distance of the first lens is equal to the working distance of the second lens.

20. The method according to claim 19, wherein, The inspector uses the first lens to extract the image data and uses the second lens to illuminate the laser.

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