A double-sided AOI detection device for a circuit board and a detection method thereof
By designing a double-sided AOI inspection device for circuit boards, and utilizing photoelectric sensors and robotic arms to achieve automatic flipping inspection of circuit boards, the problem of incomplete inspection in existing technologies is solved, and inspection efficiency and accuracy are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-15
- Publication Date
- 2026-04-07
AI Technical Summary
Existing AOI inspection equipment for circuit boards only inspects one side, neglecting the other side, resulting in insufficient comprehensiveness and accuracy of inspection, and manual flipping inspection is inefficient.
A double-sided AOI inspection device for circuit boards was designed, comprising a main frame, an image detection system, an inspection platform, a conveying platform, a telescopic conveying device, and a robotic arm. The device determines the position of the circuit board by using a photoelectric sensor, flips the circuit board using the robotic arm, and achieves double-sided inspection by coordinating the rotation speed of the robotic arm through a BP neural network and a particle swarm optimization algorithm.
It improves the comprehensiveness and accuracy of circuit board inspection, avoids the offset and damage of circuit boards during the flipping process, and enhances inspection efficiency and precision.
Smart Images

Figure CN121324385B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board inspection technology, and in particular to a double-sided AOI inspection device and inspection method for circuit boards. Background Technology
[0002] In circuit board production, AOI inspection is an extremely important step. AOI inspection equipment, also known as AOI optical automatic inspection equipment, is mainly used to detect whether there are defects on the surface of the circuit board.
[0003] However, existing manufacturers often only inspect one side of the circuit board during AOI inspection, neglecting the other side, resulting in insufficient comprehensiveness and accuracy of circuit board inspection. Manual flipping inspection also greatly reduces inspection efficiency. Therefore, there is an urgent need for a double-sided AOI inspection device and inspection method for circuit boards. Summary of the Invention
[0004] To address the technical problems existing in the prior art, this invention provides a double-sided AOI inspection device for circuit boards, including a main frame, an image detection system and a detection platform disposed within the main frame, and a first conveying platform and a second conveying platform respectively docked to the head and tail sides of the detection platform. The head and tail sides of the detection platform are respectively provided with photoelectric sensors for determining whether the circuit board enters the detection platform.
[0005] A telescopic conveying device is provided on each side of the surface of the detection platform, which is used to stabilize the circuit board and perform a conveying operation on the detection platform after the photoelectric sensor determines that the circuit board has entered the detection platform.
[0006] The second conveying platform is equipped with robotic arms on both sides for flipping the circuit boards.
[0007] After the robotic arm completes the flipping operation on the circuit board, the second conveying platform reverses the conveying process and sends the circuit board back to the detection platform to complete the double-sided detection.
[0008] During the flipping operation, the equipment control center coordinates the rotation speed of the rotating parts of the two robotic arms.
[0009] The photoelectric sensor on the head side operates only when the circuit board enters the detection platform from the first conveyor platform, and the photoelectric sensor on the tail side operates only when the circuit board enters the detection platform from the second conveyor platform.
[0010] Furthermore, the image detection system includes a camera device, a first fixed plate, and two first motorized sliding stages;
[0011] The two first electric sliding platforms are respectively located on both sides inside the main frame;
[0012] The two first electric slides each include a first track, a first slider disposed on the first track, and a first drive motor for driving the first slider to slide on the first track.
[0013] The two ends of the first fixed plate are mechanically connected to the two first sliders respectively;
[0014] The bottom of the first fixed plate is provided with a second electric slide. The second electric slide includes a second rail, a second slider disposed on the second rail, and a second drive motor for driving the second slider to slide on the second rail.
[0015] The camera device is equipped with a first electric telescopic mechanism, which is mechanically connected to the second slider.
[0016] Furthermore, the telescopic conveying device includes a fixing member, a conveying track, and a second electric telescopic mechanism connected to the fixing member and the conveying track;
[0017] A groove is provided on one side of the conveyor track, and an electric conveyor belt is installed in the groove.
[0018] Furthermore, between the two telescopic conveying devices, a vacuum adsorption device is provided on the surface of the testing platform to keep the circuit board flat during testing.
[0019] Furthermore, the robotic arm includes a fixed base, a first extension arm, a second extension arm, a third extension arm, a rotator, a clamp, a first connector, a second connector, a third connector, and a fourth connector;
[0020] The fixed base is dynamically connected to the first extension arm via the first connector, the first extension arm is dynamically connected to the second extension arm via the second connector, the second extension arm is dynamically connected to the third extension arm via the third connector, the third extension arm is dynamically connected to the rotator via the fourth connector, the clamp is dynamically connected to the rotator, and the rotator controls the rotation angle through the equipment control center, thereby driving the clamp to rotate.
[0021] Furthermore, the equipment control center performs coordinated speed control on the rotating parts of the two robotic arms, specifically as follows:
[0022] The actual rotation speed of the rotating component motor is obtained by using the first BP neural network based on the rotation speed detected by the rotating component encoder.
[0023] The error is calculated based on the expected and actual rotation speeds of the rotating component motor, and the rotation speed of the corresponding robotic arm's rotating component is then calibrated.
[0024] Furthermore, the step of obtaining the actual rotational speed of the rotating component motor through the first BP neural network based on the detected rotational speed of the rotating component motor by the encoder is specifically as follows:
[0025] Acquire multiple historical detected speeds and their corresponding multiple historical actual speeds;
[0026] The BP neural network is iteratively trained using historical detected speeds and historical actual speeds as training samples.
[0027] The weights and thresholds of the BP neural network are updated in each iteration using the particle swarm optimization algorithm. When the number of iterations reaches the preset number of iterations, the iteration is completed and the first BP neural network is obtained.
[0028] The actual rotational speed of the rotating component motor is obtained by inputting the rotational speed detected by the encoder of the rotating component motor into the first BP neural network.
[0029] Furthermore, the step of updating the weights and thresholds of the BP neural network in each iteration using the particle swarm optimization algorithm specifically involves:
[0030] A1. Calculate the current fitness value SY1 for each particle;
[0031] A2. By comparing all fitness values S1 of each particle, obtain the current global extreme position gbest of the particle swarm and the current individual extreme position pbest of each particle.
[0032] A3. Update the weights and thresholds of the BP neural network to the weights and thresholds corresponding to the current global extreme value position;
[0033] A4. Proceed to the next iteration. Based on the current global extreme position and individual extreme position, update the position p of each particle. Repeat steps A1 to A4 until the number of iterations reaches the preset number of iterations.
[0034] The present invention also provides a method for double-sided AOI inspection of circuit boards, applicable to any of the double-sided AOI inspection devices for circuit boards described above, comprising the following steps:
[0035] When the circuit board enters the detection platform from the first conveying platform, the photoelectric sensor on the head side sends a signal to the equipment control center. The equipment control center controls the telescopic conveying devices on both sides to extend the circuit board to both sides to stabilize the circuit board and convey the circuit board to the detection platform, where the first side is detected by the image detection system.
[0036] The circuit board is then transferred from the testing platform to the second transfer platform. The circuit board is flipped over by the robotic arms on both sides of the second transfer platform. At the same time, the equipment control center coordinates the rotation speed of the rotating parts of the two robotic arms.
[0037] After flipping, the second conveyor platform reverses the circuit board and transfers it to the detection platform. The photoelectric sensor on the tail side sends a signal to the equipment control center. The equipment control center controls the telescopic conveyors on both sides to continue stabilizing the circuit board and transferring it to the detection platform, where the second side is detected by the image detection system.
[0038] Furthermore, during the first and second side inspections using the image inspection system, the non-real-time inspection surfaces of the circuit board are adsorbed by a vacuum adsorption device on the inspection platform, keeping the circuit board flat during inspection.
[0039] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0040] This invention provides a telescopic conveying device on each side of the surface of the testing platform to ensure that the circuit board does not shift during the transfer from the testing platform to the testing platform, thereby improving testing efficiency and accuracy. At the same time, a second conveying platform equipped with a robotic arm is provided to transfer the circuit board back to the testing platform in the reverse direction after flipping, thus completing double-sided testing. Furthermore, the rotation speed of the rotating parts of the two robotic arms is coordinated to ensure that the rotation speed is synchronized during the flipping process, thereby avoiding damage to the circuit board. Attached Figure Description
[0041] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.
[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0043] Figure 1 This is a structural diagram of a double-sided AOI inspection device for circuit boards according to the present invention;
[0044] Figure 2 This is a structural block diagram of a telescopic conveying device in a double-sided AOI inspection equipment for circuit boards according to the present invention.
[0045] Figure 3 This is a structural block diagram of the robotic arm in a double-sided AOI inspection device for circuit boards according to the present invention.
[0046] Legend: 1. Main frame; 2. Detection platform; 31. First conveying platform; 32. Second conveying platform; 4. Telescopic conveying device; 41. Fixing component; 42. Conveying track; 421. Groove; 422. Electric conveyor belt; 43. Second electric telescopic mechanism; 51. First track; 52. First slider; 6. First fixing plate; 7. Camera device; 71. First electric telescopic mechanism; 8. Photoelectric sensor; 9. Vacuum adsorption device; 101. Fixed base; 102. First extension arm; 103. Second extension arm; 104. Third extension arm; 105. Rotator; 106. Clamp; 107. First connector; 108. Second connector; 109. Third connector; 110. Fourth connector. Detailed Implementation
[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.
[0048] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.
[0049] Furthermore, the use of terms such as "first" and "second" in this invention is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" and "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.
[0050] Example 1
[0051] See Figures 1 to 3 As shown, the present invention provides a double-sided AOI inspection device for circuit boards, specifically comprising:
[0052] The main frame 1, the image detection system and detection platform 2 disposed within the main frame 1, and the first transmission platform 31 and the second transmission platform 32 respectively connected to the head and tail sides of the detection platform 2;
[0053] The image detection system includes a camera device, a first fixed plate 6, and two first electric sliding tables.
[0054] The two first electric sliding platforms are respectively located on both sides inside the main frame 1;
[0055] The two first electric slides each include a first track 51, a first slider 52 disposed on the first track 51, and a first drive motor for driving the first slider to slide on the first track.
[0056] It should be noted that, in Figure 1 The viewpoint in the middle only shows the first electric slide on one side.
[0057] The first electric slide is embedded in the side of the main frame 1, and the first drive motor is built into the first electric slide (not shown in the figure). The first electric slide can be any electric slide in the prior art as needed. Its specific power connection and motor drive connection are prior art and will not be described in detail here.
[0058] The bottom of the first fixed plate 6 is provided with a second electric slide;
[0059] The second electric slide table includes a second track, a second slider disposed on the second track, and a second drive motor for driving the second slider to slide on the second track;
[0060] The sliding direction of the second slider is perpendicular to the sliding direction of the first slider on the same horizontal plane.
[0061] Similarly, in Figure 1 Since the second electric slide is not shown from the perspective of the middle, the second drive motor is built into the second electric slide. The second electric slide can also be any electric slide in the prior art according to the requirements. Its specific power connection and motor drive connection are prior art, and will not be described in detail here.
[0062] The camera device 7 is provided with a first electric telescopic mechanism 71, which is mechanically connected to the second slider. The second drive motor drives the second slider, thereby causing the camera device 7 to slide along the direction of the second track.
[0063] The electric telescopic mechanism 71 adjusts its telescopic length according to the telescopic parameters set by the equipment control center, thereby adjusting the focal length of the camera device 7 on the circuit board.
[0064] The first fixed plate 6 is mechanically connected to two first sliders 52 at both ends. The first drive motor drives the first sliders 52, thereby causing the first fixed plate 6 to slide along the direction of the first track 51, which in turn causes the camera device 7 to slide along the direction of the first track 51.
[0065] The detection platform 2 is provided with a telescopic conveyor 4 on each side of its surface, and photoelectric sensors 8 are provided on the other two sides, that is, photoelectric sensors 8 are provided on the head side and tail side of the detection platform 2 respectively.
[0066] The photoelectric sensor 8 is used to determine whether the circuit board has entered the detection platform 2.
[0067] The telescopic conveyor 4 is used to stabilize the circuit board and perform the conveying operation of the circuit board in the testing platform 2.
[0068] The telescopic conveying device 4 includes a fixing member 41, a conveying track 42, and a second electric telescopic mechanism 43 connected to the fixing member 41 and the conveying track 42.
[0069] The second electric telescopic mechanism 43 is driven to extend and retract by the drive motor built into the telescopic conveying device 4, which in turn drives the corresponding connected conveying track 42 to extend and retract.
[0070] A groove 421 is provided on one side of the conveyor track 42, and an electric conveyor belt 422 is provided in the groove;
[0071] The electric conveyor belt 422 is driven by a drive motor built into the conveyor track, thereby driving the circuit board to be conveyed in the testing platform 2.
[0072] After the circuit board enters the detection platform 2 from the first conveying platform 31, the photoelectric sensor 8 closest to the first conveying platform 31 changes its signal and sends an operation signal to the telescopic conveyor 4 through the equipment control center. The conveying tracks 42 of the telescopic conveyors 4 on both sides extend synchronously to both sides of the circuit board through their respective second electric telescopic mechanisms 43 until both sides of the circuit board are respectively inserted into the grooves 421 of the conveying track 42 and continue to be conveyed on the detection platform 2 through the electric conveyor belt 422, so as to stabilize the circuit board and prevent the circuit board from shifting during the conveying process.
[0073] Between the two telescopic conveying devices 4, the surface of the detection platform 2 is provided with a vacuum adsorption device 9, which is used to keep the circuit board flat during detection. The surface of the vacuum adsorption device 9 is on the same horizontal plane as the surface of the detection platform 2.
[0074] During the production process, various factors may cause the circuit board to have a certain curvature. In AOI inspection, this curvature may cause changes in texture or shadow tone, which may lead to misjudgment. Therefore, this invention uses a vacuum adsorption device to keep the circuit board flat and thus improve the accuracy of inspection.
[0075] The second conveying platform 32 is equipped with robotic arms on both sides for flipping the circuit board.
[0076] The robotic arm includes a fixed base 101, a first extension arm 102, a second extension arm 103, a third extension arm 104, a rotator 105, a clamp 106, a first connector 107, a second connector 108, a third connector 109, and a fourth connector 110.
[0077] The fixed base 101 is movably connected to the first extension arm 102 through the first connector 107. The first extension arm 102 is movably connected to the second extension arm 103 through the second connector 108. The second extension arm 103 is movably connected to the third extension arm 104 through the third connector 109. The third extension arm 104 is movably connected to the rotator 105 through the fourth connector 110. The clamp 106 is movably connected to the rotator 105. The rotator 105 controls the rotation angle through the equipment control center, thereby driving the clamp 106 to rotate, and thus performing a flipping operation on the circuit board.
[0078] The fixed base 101 is fixedly installed on one side of the second conveyor platform 32.
[0079] After the circuit board is flipped, the second conveying platform 32 performs reverse conveying, sending the circuit board back to the detection platform 2 to complete the double-sided detection.
[0080] When the robotic arms on both sides flip the circuit board, the equipment control center coordinates the rotation speed of the rotating parts of the robotic arms on both sides, specifically:
[0081] The actual rotation speed of the rotating component motor is obtained by using the first BP neural network based on the rotation speed detected by the rotating component encoder.
[0082] The error is calculated based on the expected and actual rotation speeds of the rotating component motor, and the rotation speed of the corresponding robotic arm's rotating component is then calibrated.
[0083] A rotating component motor is a motor that drives a rotating component to rotate, and a rotating component encoder is an encoder that detects the rotational speed of the rotating component motor.
[0084] The step of obtaining the actual rotational speed of the rotating component motor through the first BP neural network based on the rotational speed detected by the rotating component encoder is as follows:
[0085] Acquire multiple historical detected speeds and their corresponding multiple historical actual speeds;
[0086] The BP neural network is iteratively trained using historical detected speeds and historical actual speeds as training samples.
[0087] The weights and thresholds of the BP neural network are updated in each iteration using the particle swarm optimization algorithm. When the number of iterations reaches the preset number of iterations, the iteration is completed and the first BP neural network is obtained.
[0088] The actual rotational speed of the rotating component motor is obtained by inputting the rotational speed detected by the encoder of the rotating component motor into the first BP neural network.
[0089] The step of updating the weights and thresholds of the BP neural network in each iteration using the particle swarm optimization algorithm is specifically as follows:
[0090] A1. Calculate the current fitness value SY1 for each particle using the following formula:
[0091] ;
[0092] in, Represents a random positive number, accessible through custom settings. This represents the nth historical actual rotational speed. This represents the nth corresponding network output speed, where N is the number of historical actual speed samples;
[0093] A2. By comparing all fitness values S1 of each particle, obtain the current global extreme position gbest of the particle swarm and the current individual extreme position pbest of each particle.
[0094] A3. Update the weights and thresholds of the BP neural network to the weights and thresholds corresponding to the current global extreme value position;
[0095] A4. In the next iteration, update the position p of each particle based on the current global extreme position and individual extreme position, using the following formula:
[0096] ;
[0097] ;
[0098] in, This represents the position of the j-th particle after the iteration. This represents the current position of the j-th particle. This represents the velocity of the j-th particle after the iteration. Indicates inertia weight, Let represent the current velocity of the j-th particle. and These represent the first and second learning factors, respectively, and indicate the step size by which the particle adjusts towards its individual extreme position and global extreme position, respectively. Positive values are used. and Represents a random number between 0 and 1. This represents the current individual extreme value position of the j-th particle;
[0099] Repeat steps A1 to A4 until the preset number of iterations is reached.
[0100] The Particle Swarm Optimization (PSO) algorithm automatically searches for the optimal weights and thresholds of the Backpropagation (BP) neural network, exhibiting strong global search capabilities and fast convergence speed. It also avoids the BP neural network getting trapped in local optima, reducing the risk of overfitting and improving its generalization ability. The optimized BP neural network more accurately fits the complex relationship between encoder detection data and the actual motor speed, reducing measurement errors, improving encoder error compensation accuracy, and enhancing the accuracy of obtaining the actual speed.
[0101] It should be noted that, Figures 1 to 3 This does not represent the actual design dimensions of the equipment; you can design the dimensions according to your actual needs.
[0102] The operating process of the equipment in this solution is as follows:
[0103] The circuit board is conveyed from the first conveyor platform 31 into the detection platform 2. The photoelectric sensor on the head side of the detection platform 2 detects the change in photoelectric signal and sends the signal to the equipment control center. The equipment control center sends an operation signal to the telescopic conveyor 4. The telescopic conveyors 4 on both sides of the detection platform 2 extend the conveyor track 42 toward the circuit board through the second electric telescopic mechanism 43 until the edge of the circuit board is inserted into the groove 421 in the conveyor track 42. The circuit board is then conveyed to the vacuum adsorption device 9 through the electric conveyor belt 422 in the groove 421. After the vacuum adsorption device 9 begins to adsorb and flatten the circuit board, the camera device 7 is adjusted to the preset focal length through the first electric telescopic mechanism 71. It first moves the second slider along the direction of the first fixed plate. The circuit board is captured by moving the first slider 52 along the first track 51 by a preset distance, and then the second slider is moved along the first fixed plate to capture images. This process is repeated until all captured images cover the first surface of the circuit board, completing the first side inspection. The circuit board is then transported to the second conveyor platform 32 by the electric conveyor belt 422. The mechanical arms on both sides of the second conveyor platform 32 clamp the two sides of the circuit board and flip it over. The second conveyor platform 32 then reverses the process and transports the flipped circuit board to the inspection platform 2. The photoelectric sensor on the tail side of the inspection platform 2 detects the change in photoelectric signal and sends a running signal to the telescopic conveyor 4 through the equipment control center. The subsequent process is the same as when inspecting the first side, until the second side inspection is completed.
[0104] Example 2
[0105] This invention also provides a double-sided AOI inspection method for circuit boards, specifically including:
[0106] When the circuit board enters the detection platform 2 from the first conveying platform 31, the photoelectric sensor 8 on the head side sends a signal to the equipment control center. The equipment control center controls the telescopic conveying devices 4 on both sides to extend the circuit board to both sides to stabilize the circuit board and convey the circuit board to the detection platform 2 for the first side detection through the image detection system.
[0107] The circuit board is then transferred from the testing platform 2 to the second transfer platform. The circuit board is flipped by the robotic arms on both sides of the second transfer platform 32. At the same time, the equipment control center coordinates the rotation speed control of the rotating parts of the two robotic arms.
[0108] After flipping, the second conveyor platform 32 transmits the circuit board in reverse to the detection platform 2. The photoelectric sensor 8 on the tail side sends a signal to the equipment control center. The equipment control center controls the telescopic conveyor devices 4 on both sides to continue stabilizing the circuit board and transmit it to the detection platform 2 for second-side detection through the image detection system.
[0109] In some embodiments, when performing first-side and second-side detection using an image detection system, the non-real-time detection surface of the circuit board is adsorbed by a vacuum adsorption device 9 on the detection platform, keeping the circuit board flat during detection.
[0110] Example 3
[0111] The present invention also provides an electronic device, including: a processor, a transmitting device, an input device, an output device, and a memory. The processor may be implemented using a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit, or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application. The memory may be implemented using a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM), and is used to store computer program code, which includes computer instructions. When the processor executes the computer instructions, the electronic device executes a method as described in any of the above possible implementation methods.
[0112] Example 4
[0113] The present invention also provides a computer-readable storage medium storing a computer program, the computer program including program instructions, which, when executed by a processor of an electronic device, cause the processor to perform a method as described in any of the above possible implementations.
[0114] The beneficial effects of this invention are as follows:
[0115] This invention provides a telescopic conveying device on each side of the surface of the testing platform to ensure that the circuit board does not shift during the transfer from the testing platform to the testing platform, thereby improving testing efficiency and accuracy. At the same time, a second conveying platform equipped with a robotic arm is provided to transfer the circuit board back to the testing platform in the reverse direction after flipping, thus completing double-sided testing. Furthermore, the rotation speed of the rotating parts of the two robotic arms is coordinated to ensure that the rotation speed is synchronized during the flipping process, thereby avoiding damage to the circuit board.
[0116] In the description of this specification, the references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0117] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0118] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.
Claims
1. A double-sided AOI inspection device for circuit boards, comprising a main frame, an image detection system and a detection platform disposed within the main frame, and a first conveying platform and a second conveying platform respectively docked to the head and tail sides of the detection platform, characterized in that, The detection platform is equipped with photoelectric sensors on its head and tail sides to determine whether the circuit board has entered the detection platform. A telescopic conveying device is provided on each side of the surface of the detection platform, which is used to stabilize the circuit board and perform a conveying operation on the detection platform after the photoelectric sensor determines that the circuit board has entered the detection platform. The second conveying platform is equipped with robotic arms on both sides for flipping the circuit boards. After the robotic arm completes the flipping operation on the circuit board, the second conveying platform reverses the conveying process and sends the circuit board back to the detection platform to complete the double-sided detection. During the flipping operation, the equipment control center coordinates the rotation speed of the rotating parts of the two robotic arms. The photoelectric sensor on the head side operates only when the circuit board enters the detection platform from the first conveyor platform, and the photoelectric sensor on the tail side operates only when the circuit board enters the detection platform from the second conveyor platform. The telescopic conveyor includes a fixing component, a conveyor track, and a second electric telescopic mechanism connected to the fixing component and the conveyor track; a groove is provided on one side of the conveyor track, and an electric conveyor belt is provided in the groove. The second electric telescopic mechanism is driven by a drive motor built into the telescopic conveying device, which in turn drives the corresponding connected conveying track to extend and retract.
2. The double-sided AOI inspection equipment for circuit boards according to claim 1, characterized in that, The image detection system includes a camera device, a first fixed plate, and two first electric sliding tables; The two first electric sliding platforms are respectively located on both sides inside the main frame; The two first electric slides each include a first track, a first slider disposed on the first track, and a first drive motor for driving the first slider to slide on the first track. The two ends of the first fixed plate are mechanically connected to the two first sliders respectively; The bottom of the first fixed plate is provided with a second electric slide. The second electric slide includes a second rail, a second slider disposed on the second rail, and a second drive motor for driving the second slider to slide on the second rail. The camera device is equipped with a first electric telescopic mechanism, which is mechanically connected to the second slider.
3. The double-sided AOI inspection equipment for circuit boards according to claim 1, characterized in that, Between the two telescopic conveyors, the surface of the testing platform is equipped with a vacuum adsorption device to keep the circuit board flat during testing.
4. The double-sided AOI inspection equipment for circuit boards according to claim 1, characterized in that, The robotic arm includes a fixed base, a first extension arm, a second extension arm, a third extension arm, a rotator, a clamp, a first connector, a second connector, a third connector, and a fourth connector. The fixed base is dynamically connected to the first extension arm via the first connector, the first extension arm is dynamically connected to the second extension arm via the second connector, the second extension arm is dynamically connected to the third extension arm via the third connector, the third extension arm is dynamically connected to the rotator via the fourth connector, the clamp is dynamically connected to the rotator, and the rotator controls the rotation angle through the equipment control center, thereby driving the clamp to rotate.
5. A method for double-sided AOI inspection of a circuit board, applied to the double-sided AOI inspection equipment for the circuit board according to any one of claims 1 to 4, characterized in that, Includes the following steps: When the circuit board enters the detection platform from the first conveying platform, the photoelectric sensor on the head side sends a signal to the equipment control center. The equipment control center controls the telescopic conveying devices on both sides to extend the circuit board to both sides to stabilize the circuit board and convey the circuit board to the detection platform, where the first side is detected by the image detection system. The circuit board is then transferred from the testing platform to the second transfer platform. The circuit board is flipped over by the robotic arms on both sides of the second transfer platform. At the same time, the equipment control center coordinates the rotation speed of the rotating parts of the two robotic arms. After flipping, the second conveyor platform reverses the circuit board and transfers it to the detection platform. The photoelectric sensor on the tail side sends a signal to the equipment control center. The equipment control center controls the telescopic conveyors on both sides to continue stabilizing the circuit board and transfer it to the detection platform, where the second side is detected by the image detection system. The telescopic conveyor includes a fixing component, a conveyor track, and a second electric telescopic mechanism connected to the fixing component and the conveyor track; a groove is provided on one side of the conveyor track, and an electric conveyor belt is provided in the groove. The second electric telescopic mechanism is driven by a drive motor built into the telescopic conveying device, which in turn drives the corresponding connected conveying track to extend and retract.
6. The double-sided AOI inspection method for circuit boards according to claim 5, characterized in that, When performing first and second side inspections using an image inspection system, the non-real-time inspection surfaces of the circuit board are adsorbed by a vacuum adsorption device on the inspection platform, keeping the circuit board flat during inspection.
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