Ceramic ball grid array packaging device reinforcing device and process method
By combining right-angled adapter parts with reinforcing adhesive, and using high-temperature heating to peel off the adapter parts, the problem of damage during the disassembly of CBGA packaged devices is solved, achieving reliable reinforcement and non-destructive disassembly.
Patent Information
- Application Number
- CN202511443291.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-10
- Publication Date
- 2026-01-13
AI Technical Summary
In the prior art, the reinforcement devices for CBGA packaged devices are prone to damaging the packaged device body or the pads of the printed circuit board assembly during disassembly, and disassembly is difficult, making it hard to achieve efficient and non-destructive disassembly.
A combination of right-angled adapter parts and reinforcing adhesive is used to fix the CBGA packaged device by reinforcing the four corners. During disassembly, the adapter parts are peeled off by high temperature heating to prevent the adhesive from contacting the solder joints. Epoxy resin material is used to match the thermal expansion coefficient of the printed circuit board to ensure non-destructive disassembly.
It enables reliable hardening and non-destructive disassembly of CBGA packaged devices, avoiding damage to solder joints caused by traditional hardening methods, simplifying the disassembly process, and reducing the difficulty and cost of rework.
Smart Images
Figure CN121334982A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electrical assembly technology, specifically to a reinforcement device and process method for ceramic ball grid array packaged devices that can be disassembled without damage. Background Technology
[0002] As electronic components continue to evolve towards higher density, lighter weight, and thinner designs, ceramic ball grid array (CBGA) packages are widely used in high-reliability fields such as weaponry, aerospace, and rail transportation due to their excellent thermal conductivity, hermeticity, high-frequency characteristics, and device-level reliability. In practical applications, CBGA packages are assembled onto printed circuit boards (PCBs) using a soldering process. The CBGA package shell is made of alumina ceramic material with a coefficient of thermal expansion of approximately 6.9 ppm / ℃, while the coefficient of thermal expansion of a standard FR4 PCB is approximately 23 ppm / ℃. When the soldered components undergo cyclical temperature changes, the difference in their coefficients of thermal expansion leads to varying thermal deformations. This generates periodic stress within the solder joints, causing the initiation and propagation of microcracks, ultimately resulting in solder joint fracture and failure.
[0003] In existing technologies, reinforcing the four corners of CBGA packaged devices can improve the reliability of solder joints. Epoxy resin reinforcing adhesive has good mechanical properties and can effectively reduce the stress on the solder joints. However, during the reinforcement process, the fluidity of the adhesive can come into contact with the solder balls of the CBGA packaged device, potentially creating other sources of stress. Furthermore, when desoldering the CBGA packaged device, removing the reinforcing adhesive can damage the packaged device itself or the solder pads of the printed circuit board assembly, making rework difficult and potentially leading to the scrapping of the entire board. Therefore, how to efficiently reinforce CBGA packaged devices while ensuring non-destructive disassembly is a problem that urgently needs to be solved in existing technologies. Summary of the Invention
[0004] The purpose of this invention is to provide a reinforcement device and process method for ceramic ball grid array (CBGA) packaged devices, so as to solve the problems of disassembly difficulties and easy damage to the packaged device body or printed circuit board assembly pads caused by traditional reinforcement devices and processes for CBGA packaged devices.
[0005] To achieve the above objectives, the present invention is implemented through the following technical solution: On one hand, the present invention provides a ruggedization device for ceramic ball grid array packaged devices, comprising: A right-angled adapter component includes three fixing plates that are perpendicularly coupled in pairs to form a three-sided right-angled structure. The right-angled adapter component is used to fix the ceramic ball grid array packaged device at the four corners and to contact the surface of the printed circuit board assembly.
[0006] Preferably, the right-angled adapter is made of epoxy resin.
[0007] Preferably, it further includes: a reinforcing adhesive, which is used to fix the right-angled adapter to the ceramic ball grid array package device and is applied to the contact area between the bottom outer side of the right-angled adapter and the printed circuit board assembly.
[0008] Preferably, the reinforcing adhesive is made of epoxy resin.
[0009] Preferably, the coefficient of thermal expansion of the right-angled adapter is configured to match the coefficient of thermal expansion of the reinforcing adhesive and the printed circuit board assembly.
[0010] On the other hand, the present invention also provides a method for strengthening and non-destructive disassembly of a ceramic ball grid array (CBA) packaged device, which is implemented using the aforementioned CBA packaged device strengthening device, and the method includes: Step S1: Reflow solder the ceramic ball grid array packaged device onto the printed circuit board assembly; Step S2: Use reinforcing adhesive to fix the right-angled adapter parts to the four corners of the ceramic ball grid array packaged device; Step S3: Fix the bottom of the right-angle adapter to the contact area with the printed circuit board surface to reinforce the ceramic ball grid array packaging device; Step S4: When non-destructive disassembly is required, desolder the ceramic ball grid array package device on the printed circuit board assembly and separate the right-angle adapter from the ceramic ball grid array package device.
[0011] Preferably, in step S2, the right-angled adapter parts are fixed to the four corners of the ceramic ball grid array packaging device using reinforcing adhesive, specifically including: Step S201: Apply reinforcing adhesive to the corner of the ceramic ball grid array packaged device to be reinforced, with the coating area being the overlap area between the right-angled adhesive part and the ceramic ball grid array packaged device; Step S202: Install the right-angled adapter component at the corner of the ceramic ball grid array packaging device, and apply reinforcing adhesive again at the contact area; Step S203: Perform high-temperature curing on the ceramic ball grid array packaged device and the printed circuit board assembly.
[0012] Preferably, in step S3, fixing the bottom of the right-angled adapter component to the contact area with the printed circuit board surface specifically includes: The reinforcing adhesive coating at the contact point between the right-angled adapter and the printed circuit board is positioned on the outside of the right-angled adapter, ensuring that the solder joints of the ceramic ball grid array packaged device do not come into contact with the reinforcing adhesive.
[0013] Preferably, step S4, which involves desoldering the ceramic ball grid array (CBA) packaged device on the printed circuit board assembly and separating the right-angled adapter from the CBA packaged device, specifically includes: Step S401: Use a heatable pointed metal part and heat it to a first predetermined temperature, and use the heatable pointed metal part to remove the reinforcing adhesive at the contact area between the right-angled adapter and the printed circuit board assembly; Step S402: Desolder the ceramic ball grid array packaged device using an infrared rework station; Step S403: Use a heating platform to heat the ceramic ball grid array package device with the right-angled adapter part as a whole to a second predetermined temperature, and then peel off the right-angled adapter part.
[0014] Preferably, both the first predetermined temperature and the second predetermined temperature are greater than the glass transition temperature of the reinforcing adhesive.
[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The right-angled adapter part in this invention is made of epoxy resin, which is compatible with the reinforcing adhesive and the printed circuit board material. There is no risk of introducing secondary stress. As a reinforcing adapter layer, the right-angled adapter part can ensure that the reinforcing adhesive does not come into contact with the solder joints of the CBGA packaged device during the reinforcement process. 2. This invention uses a right-angled adapter part with four-corner reinforcement, which ensures the reliability of the reinforcement and takes into account the advantages of non-destructive repair. Before desoldering the CBGA, only the adhesive at the contact position between the right-angled adapter part and the printed circuit board surface needs to be removed, without contacting the CBGA packaged device body and the pad position of the printed circuit board assembly. 3. In this invention, the CBGA packaged device and the right-angled adapter can be directly separated by high-temperature heating, without the need for mechanical removal; 4. The process method of the present invention is stable and reliable, simple to implement and operate, and has a simple part structure and low processing cost, making it particularly suitable for the reinforcement connection of CBGA packaged devices. Attached Figure Description
[0016] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the drawings described below are one embodiment of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort: Figure 1 This is a schematic diagram of an embodiment of a CBGA packaged device ruggedization method provided by an embodiment of the present invention; Figure 2A cross-sectional view of an embodiment of a CBGA packaged device ruggedization method provided by the present invention; Figure 3 This is a schematic diagram of a right-angled adapter component structure provided in an embodiment of the present invention; Figure 4 This invention provides a process for reinforcing and disassembling a CBGA packaged device according to an embodiment of the present invention.
[0017] Figure labeling: 1-CBGA packaged device; 2-Right-angled adapter; 3-Printed circuit board; 4-Reinforcing adhesive; A-Height of right-angled adapter; B-Overlap length of right-angled adapter; C-Wall thickness of right-angled adapter. Detailed Implementation
[0018] The following is in conjunction with the appendix Figure 1-4 The following detailed description further illustrates the ceramic ball grid array packaging device reinforcement apparatus and process method proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of this invention. Please refer to the accompanying drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.
[0019] refer to Figure 1 As shown, this embodiment provides a reinforcement device for a ceramic ball grid array (CBA) package 1, including: a right-angled adapter 2, which includes three fixing plates. The three fixing plates are perpendicularly coupled in pairs to form a three-sided right-angle structure. The right-angled adapter 2 is used to fix the CBA package 1 at its four corners and to contact the surface of the printed circuit board assembly 3. It also includes: a reinforcement adhesive 4, which is used to fix the right-angled adapter 2 onto the CBA package 1 and is applied to the bottom outer side of the right-angled adapter 2 at the contact area with the printed circuit board assembly 3. The reinforcement adhesive 4 is made of epoxy resin.
[0020] The right-angled adapter 2 is made of epoxy resin. The coefficient of thermal expansion of the right-angled adapter 2 is configured to match the coefficient of thermal expansion of the reinforcing adhesive 4 and the printed circuit board assembly 3.
[0021] In this embodiment, the right-angled adapter 2 has a three-sided right-angled structure with a wall thickness of 1.6mm to 2.0mm. Its height is the same as the height of the CBGA packaged device 1, and the length and width of the overlap surface with the CBGA are 25% to 40% of the CBGA package body size. In one application example, refer to... Figure 3 As shown, the CBGA packaged device has a side length of 21mm and a height of 4.65mm. The right-angled adapter part has a height A of 4.65mm, an overlap length B of 4.40mm, and a wall thickness C of 1.6mm. The right-angled adapter part 2 is made of epoxy resin. The reinforcing adhesive 4 is made of black epoxy resin. The curing temperature of the reinforcing adhesive 4 is 130℃, the curing time of the reinforcing adhesive 4 is 15min, and the glass transition temperature of the reinforcing adhesive 4 should be between 130℃ and 150℃. In this embodiment, the preferred glass transition temperature of the reinforcing adhesive 4 is 134℃.
[0022] On the other hand, reference Figure 2 and Figure 4 As shown, this embodiment also provides a method for reinforcing and non-destructively disassembling a ceramic ball grid array (CBA) packaged device 1, which is implemented using the aforementioned reinforcing device 1. The method includes: Step S1: Reflow solder the ceramic ball grid array package device 1 onto the printed circuit board assembly 3.
[0023] Step S2: Use reinforcing adhesive 4 to fix the right-angled adapter 2 to the four corners of the ceramic ball grid array package device 1, specifically including: Step S201: Apply reinforcing adhesive 4 to the corner of the ceramic ball grid array packaging device 1 to be reinforced, with the coating area being the overlap area between the right-angled adhesive part and the ceramic ball grid array packaging device 1.
[0024] Step S202: Install the right-angled adapter 2 at the corner of the ceramic ball grid array packaging device 1, and apply reinforcing adhesive 4 again at the contact area.
[0025] Step S203: The ceramic ball grid array packaging device 1 and the printed circuit board assembly 3 are subjected to high-temperature curing. The high-temperature curing temperature is preferably 130°C and the high-temperature curing time is preferably 15 min.
[0026] Step S3: Fix the bottom of the right-angled adapter to the contact area with the printed circuit board surface to reinforce the ceramic ball grid array packaging device 1, specifically including: The reinforcing adhesive 4 is applied to the contact area between the right-angled adapter 2 and the printed circuit board surface, and is positioned on the outside of the right-angled adapter 2, so that the solder joints of the ceramic ball grid array package device 1 do not come into contact with the reinforcing adhesive 4.
[0027] Step S4: When non-destructive disassembly is required, the ceramic ball grid array package device 1 on the printed circuit board assembly 3 is desoldered using a combination of mechanical and high-temperature heating methods to separate the right-angled adapter part 2 from the ceramic ball grid array package device 1. This specifically includes: Step S401: A heatable pointed metal part is used and heated to a first predetermined temperature. The reinforcing adhesive 4 at the contact area between the right-angled adapter 2 and the printed circuit board assembly 3 is removed by heating and friction using the heatable pointed metal part. The first predetermined temperature is greater than the glass transition temperature of the reinforcing adhesive 4. In one embodiment, the first predetermined temperature is greater than or equal to 150°C. Preferably, the first predetermined temperature is 200°C.
[0028] Step S402: Desolder the ceramic ball grid array packaged device 1 using an infrared rework station.
[0029] Step S403: The ceramic ball grid array package device 1 with the right-angled adapter 2 is heated as a whole using a heating platform to a second predetermined temperature. The right-angled adapter 2 is then peeled off using a thin-bladed tool. The second predetermined temperature is greater than the glass transition temperature of the reinforcing adhesive 4. In this embodiment, the second predetermined temperature is greater than or equal to 150°C, and preferably, the second predetermined temperature is 160°C.
[0030] In summary, compared with existing CBGA package device reinforcement processes, the present invention provides a non-destructive CBGA package device reinforcement device and process method. By using right-angle adapter parts to fix the CBGA package device to the printed circuit board assembly, and by using high-temperature heating to soften the reinforcement adhesive when the CBGA package device is removed, the present invention solves the shortcomings of traditional reinforcement methods, such as disassembly difficulties and easy damage to the printed circuit board assembly pads, thus ensuring high reliability and non-destructive disassembly of the CBGA package device.
[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0032] It should be noted that the apparatus and methods disclosed in the embodiments herein can also be implemented in other ways. The apparatus embodiments described above are merely illustrative; for example, the flowcharts and block diagrams in the accompanying drawings show the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments herein. In this regard, each block in a flowchart or block diagram may represent a module, program, or part of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system to perform the specified function or action, or can be implemented using a combination of dedicated hardware and computer instructions.
[0033] In addition, the functional modules in the various embodiments of this article can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.
[0034] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.
Claims
1. A ruggedization device for ceramic ball grid array packaged devices, characterized in that, include: A right-angled adapter component includes three fixing plates that are perpendicularly coupled in pairs to form a three-sided right-angled structure. The right-angled adapter component is used to fix the ceramic ball grid array packaged device at the four corners and to contact the surface of the printed circuit board assembly.
2. The ceramic ball grid array packaged device ruggedization device as described in claim 1, characterized in that, The right-angled adapter is made of epoxy resin.
3. The ceramic ball grid array packaged device reinforcement device as described in claim 2, characterized in that, Also includes: A reinforcing adhesive is used to fix the right-angled adapter to the ceramic ball grid array package device and is applied to the contact area between the bottom outer side of the right-angled adapter and the printed circuit board assembly.
4. The ceramic ball grid array packaged device ruggedization device as described in claim 3, characterized in that, The reinforcing adhesive is made of epoxy resin.
5. The ceramic ball grid array packaged device ruggedization device as described in claim 4, characterized in that, The coefficient of thermal expansion of the right-angled adapter is configured to match the coefficient of thermal expansion of the reinforcing adhesive and the printed circuit board assembly.
6. A method for reinforcing and non-destructively disassembling a ceramic ball grid array packaged device, characterized in that, It is implemented using the ceramic ball grid array packaged device ruggedization device as described in claim 5, the method comprising: Step S1: Reflow solder the ceramic ball grid array packaged device onto the printed circuit board assembly; Step S2: Use reinforcing adhesive to fix the right-angled adapter parts to the four corners of the ceramic ball grid array packaged device; Step S3: Fix the bottom of the right-angle adapter to the contact area with the printed circuit board surface to reinforce the ceramic ball grid array packaging device; Step S4: When non-destructive disassembly is required, desolder the ceramic ball grid array package device on the printed circuit board assembly and separate the right-angle adapter from the ceramic ball grid array package device.
7. The method for reinforcing and non-destructive disassembly of ceramic ball grid array packaged devices as described in claim 6, characterized in that, In step S2, reinforcing adhesive is used to fix the right-angled adapter parts to the four corners of the ceramic ball grid array package device, which specifically includes: Step S201: Apply reinforcing adhesive to the corner of the ceramic ball grid array packaged device to be reinforced, with the coating area being the overlap area between the right-angled adhesive part and the ceramic ball grid array packaged device; Step S202: Install the right-angled adapter part at the corner of the ceramic ball grid array packaging device, and apply reinforcing adhesive again at the contact area; Step S203: Perform high-temperature curing on the ceramic ball grid array packaged device and the printed circuit board assembly.
8. The method for reinforcing and non-destructive disassembly of ceramic ball grid array packaged devices as described in claim 6, characterized in that, In step S3, fixing the bottom of the right-angled adapter component to the contact area with the printed circuit board surface specifically includes: The reinforcing adhesive coating at the contact point between the right-angled adapter and the printed circuit board is positioned on the outside of the right-angled adapter, ensuring that the solder joints of the ceramic ball grid array packaged device do not come into contact with the reinforcing adhesive.
9. The method for reinforcing and non-destructive disassembly of ceramic ball grid array packaged devices as described in claim 6, characterized in that, Step S4, which involves desoldering the ceramic ball grid array (CBA) packaged device on the printed circuit board assembly and separating the right-angled adapter from the CBA packaged device, specifically includes: Step S401: Use a heatable pointed metal part and heat it to a first predetermined temperature, and use the heatable pointed metal part to remove the reinforcing adhesive at the contact area between the right-angled adapter and the printed circuit board assembly; Step S402: Desolder the ceramic ball grid array packaged device using an infrared rework station; Step S403: Use a heating platform to heat the ceramic ball grid array package device with the right-angled adapter part as a whole to a second predetermined temperature, and then peel off the right-angled adapter part.
10. The method for reinforcing and non-destructive disassembly of ceramic ball grid array packaged devices as described in claim 9, characterized in that, Both the first predetermined temperature and the second predetermined temperature are greater than the glass transition temperature of the reinforcing adhesive.