Integrated wafer chamfering processing equipment

Abstract

The invention discloses integrated wafer chamfering machining equipment which comprises a cabinet body, a detection unit, an automatic feeding and discharging unit, a main transmission mechanism, a transverse transmission mechanism, a longitudinal transmission mechanism, a thickness measurement and position calibration unit, a grinding unit and a cleaning unit. The detecting unit, the automatic feeding and discharging unit, the thickness measuring and position calibrating unit, the grinding unit and the cleaning unit are connected in series through the main conveying mechanism, the transverse conveying mechanism and the longitudinal conveying mechanism to jointly form an annular structure. The technical effects that the layout is more compact, and the production requirements of an automatic factory can be met; a wafer transmission path is annular, so that circulation conflicts among stations can be effectively reduced, and the production efficiency is improved; the main transmission mechanism is only responsible for feeding, discharging and sheet feeding detection, the precision requirement can be lowered, and the machining cost is lowered; and the thickness measuring and position calibrating unit, the grinding unit and the cleaning unit are linearly arranged and are transferred among the stations by virtue of the transverse transmission mechanism, so that the precision is easier to guarantee.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technology, and specifically to an integrated wafer chamfering processing equipment. Background Technology

[0002] As semiconductor manufacturing technology advances towards higher integration and smaller linewidths, the edge quality of the wafer, as the fundamental substrate material, (including geometry, roughness, and absence of cracks and defects) has a crucial impact on the yield of subsequent processes such as photolithography, etching, and thin film deposition. Wafer chamfering, which involves precision grinding and polishing of the wafer edges, is a key step in improving wafer edge quality, reducing particle contamination, and minimizing wafer breakage. The wafer chamfering machine is the core equipment for performing this process.

[0003] However, conventional wafer chamfering machines in existing technologies have significant shortcomings in terms of automation, integration, and production efficiency, making it difficult to meet the needs of modern semiconductor automated factories. Specifically, these shortcomings are manifested in the following aspects:

[0004] 1. Low degree of automation, relying on manual operation

[0005] Traditional wafer chamfering machines typically lack integrated automated chamfering inspection units. After chamfering, wafers must be manually removed from the equipment by operators and transferred to independent inspection equipment (such as optical microscopes or profile measuring instruments) for chamfering dimensional inspection (e.g., angles, widths, and radians). This manual loading, unloading, and intermediate inspection method not only introduces the risks of human error and surface contamination but also leads to production interruptions, failing to achieve a "one-click" closed-loop production from processing to inspection, thus contradicting the "unmanned" operation goal required by automated production lines.

[0006] 2. The equipment layout is unreasonable, resulting in low space utilization.

[0007] Traditional chamfering machines typically employ a linear layout, where functional units are arranged in a line along the length of the machine, from left to right: loading / unloading unit, transfer robot, calibration unit, grinding unit, cleaning unit, etc. This layout results in excessively large dimensions of the equipment along its length, occupying valuable cleanroom space. Furthermore, the linear structure leads to excessively long material flow lines, increasing wafer transport time and the risk of vibration.

[0008] 3. Limited production cycle time and low transmission efficiency.

[0009] In traditional linear layouts, wafer handling typically relies on one or more transfer robots running on a straight track. This serial transfer mechanism has an inherent bottleneck: complex coordination and waiting are required between multiple robots to avoid motion interference. When upstream or downstream units are processing wafers, the robots must remain in a waiting state and cannot perform other tasks. This effect severely restricts the overall transfer efficiency of the equipment, making it difficult to further increase production cycle time and becoming a major obstacle to improving production efficiency.

[0010] In summary, existing wafer chamfering machines have significant shortcomings in terms of automation, space utilization, and production efficiency. Therefore, there is an urgent need in the field for a novel wafer chamfering device that integrates automatic inspection functions, optimizes equipment layout to reduce floor space, and designs an efficient wafer transport system to overcome production cycle limitations, thereby meeting the stringent requirements of advanced semiconductor manufacturing for high efficiency, high automation, and high reliability. Summary of the Invention

[0011] Therefore, the present invention provides an integrated wafer chamfering processing device to solve the above-mentioned problems in the prior art.

[0012] To achieve the above objectives, the present invention provides the following technical solution:

[0013] According to a first aspect of the present invention, an integrated wafer chamfering processing equipment includes a cabinet, a detection unit, an automatic loading and unloading unit, a main transmission mechanism, a transverse transmission mechanism, a longitudinal transmission mechanism, a thickness measurement and position calibration unit, a grinding unit, and a cleaning unit. The detection unit and the automatic loading and unloading unit are arranged laterally on one side of the cabinet. The main transmission mechanism, the transverse transmission mechanism, the longitudinal transmission mechanism, the thickness measurement and position calibration unit, the grinding unit, and the cleaning unit are all arranged inside the cabinet, and are arranged laterally on one side of the cabinet. The detection unit, the automatic loading and unloading unit, the thickness measurement and position calibration unit, the grinding unit, and the cleaning unit are connected in series through the main transmission mechanism, the transverse transmission mechanism, and the longitudinal transmission mechanism to form a ring structure.

[0014] The transverse transmission mechanism is arranged horizontally, and the main transmission mechanism and the transverse transmission mechanism are arranged parallel to each other. The main transmission mechanism is located on the side closer to the detection unit. The main transmission mechanism is matched with the detection unit, the automatic loading and unloading unit, the thickness measurement and position calibration unit, and the longitudinal transmission mechanism. The longitudinal transmission mechanism is arranged longitudinally, and the longitudinal transmission mechanism is matched with the cleaning unit.

[0015] Furthermore, the main transmission mechanism includes a main fixed frame, a main slide rail, a robot arm, a guide frame, a slide table, and a mounting frame. The main fixed frame is disposed inside the cabinet and has a channel arranged horizontally through it.

[0016] There are two main slide rails, which are arranged parallel to each other on both sides of the channel width; the slide table is located on the top of the mounting frame and is slidably connected to the main slide rails; the bottom of the mounting frame extends through the channel to the bottom of the main fixing frame.

[0017] The mounting frame is equipped with a lifting platform, and the lifting platform is equipped with a rotating mechanism. The output shaft of the rotating mechanism is connected to the guide frame. The robotic arm is slidably mounted on the guide frame, and the robotic arm is plate-shaped.

[0018] Furthermore, the end of the robotic arm is C-shaped, and the end of the robotic arm is provided with a vacuum nozzle.

[0019] Furthermore, the transverse transmission mechanism includes a transverse support, a transverse slide rail, a first transverse transmission device, and a second transverse transmission device. The transverse support is arranged transversely within the cabinet, and the transverse slide rail is arranged on the transverse support along the length of the transverse support. Both the first transverse transmission device and the second transverse transmission device are slidably arranged on the transverse slide rail.

[0020] Furthermore, the first transverse transmission device includes a first transverse moving plate, a first longitudinal moving plate, and a first vacuum suction cup. The first transverse moving plate is slidably disposed on the transverse slide rail, the first longitudinal moving plate is slidably disposed on the first transverse moving plate along the longitudinal direction, and the first vacuum suction cup is disposed on the first longitudinal moving plate, with the first vacuum suction cup vertically downward.

[0021] The second transverse conveying device includes a second transverse moving plate, a second longitudinal moving plate, and a second vacuum suction cup. The second transverse moving plate is slidably disposed on the transverse slide rail, the second longitudinal moving plate is slidably disposed on the second transverse moving plate along the longitudinal direction, and the second vacuum suction cup is disposed on the second longitudinal moving plate with the second vacuum suction cup facing vertically downward.

[0022] Furthermore, the transverse slide rail is disposed on the side of the transverse support, and there are two transverse slide rails, which are arranged parallel to each other.

[0023] Furthermore, the longitudinal transmission mechanism includes a longitudinal guide rail, a support frame, and a wafer chuck. The longitudinal guide rail is arranged longitudinally within the cabinet. One end of the support frame is slidably connected to the longitudinal guide rail, and the other end of the support frame is provided with the wafer chuck.

[0024] Furthermore, the grinding unit includes a first grinding unit and a second grinding unit, which are arranged side by side.

[0025] Furthermore, the top of the cabinet is equipped with an electrical box, the sides of the cabinet are equipped with multiple cabinet doors, and the bottom of the cabinet is equipped with support legs and casters. The support legs are height-adjustable, and there are multiple support legs and casters.

[0026] Furthermore, the support legs and the rollers are arranged in a one-to-one correspondence, and the rollers are universal wheels.

[0027] The present invention has the following advantages: the equipment adopts a layout of three functional areas: front, middle and rear, which takes into account automatic loading and unloading and automatic detection, and can meet the production needs of automated factories. Moreover, the layout is more compact and occupies less space. The wafer transfer path is circular, which can effectively reduce the flow conflict between each station and improve production efficiency. The main transfer mechanism is only responsible for loading and unloading and wafer feeding detection. It does not interface with the grinding unit and will not affect the grinding accuracy. Therefore, the accuracy requirements of the main transfer mechanism can be reduced and the processing cost can be reduced. The thickness measurement and position calibration unit is arranged in a straight line with the grinding unit and the cleaning unit. It relies on the lateral movement of the lateral transfer mechanism to transfer between each station, which makes it easier to ensure accuracy. Attached Figure Description

[0028] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0029] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0030] Figure 1 This is a first-view view of an integrated wafer chamfering processing device provided for some embodiments of the present invention.

[0031] Figure 2 This is a second-view view of an integrated wafer chamfering processing device provided for some embodiments of the present invention.

[0032] Figure 3 This is a third-view view of an integrated wafer chamfering processing apparatus provided for some embodiments of the present invention.

[0033] Figure 4 This is a cross-sectional view of an integrated wafer chamfering processing device provided for some embodiments of the present invention.

[0034] Figure 5 This is a longitudinal sectional view of an integrated wafer chamfering processing device provided for some embodiments of the present invention.

[0035] Figure 6 This is a first-view view of the internal structure of an integrated wafer chamfering processing device provided for some embodiments of the present invention.

[0036] Figure 7 This is a second-view view of the internal structure of an integrated wafer chamfering processing device provided for some embodiments of the present invention.

[0037] Figure 8 This is a third-view view of the internal structure of an integrated wafer chamfering processing device provided for some embodiments of the present invention.

[0038] Figure 9 This is a first-view view of the lateral transport mechanism of an integrated wafer chamfering processing apparatus provided in some embodiments of the present invention.

[0039] Figure 10 This is a second-view perspective view of the lateral transport mechanism of an integrated wafer chamfering processing apparatus provided in some embodiments of the present invention.

[0040] Figure 11 This is a schematic diagram of the main transmission mechanism of an integrated wafer chamfering processing equipment provided in some embodiments of the present invention.

[0041] In the diagram: 1. Cabinet, 2. Electrical box, 3. Cabinet door, 4. Support leg, 5. Roller, 6. Detection unit, 7. Automatic loading and unloading unit, 9. Main transmission mechanism, 10. First transverse transmission device, 11. Second transverse transmission device, 12. Longitudinal transmission mechanism, 13. Thickness measurement and position calibration unit, 14. First grinding unit, 15. Second grinding unit, 16. Cleaning unit, 18. Transverse support, 19. First transverse moving plate, 20. Second transverse moving plate, 21. First longitudinal moving plate, 22. Second longitudinal moving plate, 23. First vacuum suction cup, 24. Second vacuum suction cup, 25. Transverse slide rail, 26. Main fixed frame, 27. Channel, 28. Main slide rail, 29. Robot arm, 30. Guide frame, 31. Slide table, 32. Mounting frame. Detailed Implementation

[0042] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Example 1

[0044] like Figures 1 to 11 As shown, an integrated wafer chamfering processing device according to a first aspect embodiment of the present invention includes a cabinet 1, a detection unit 6, an automatic loading and unloading unit 7, a main transmission mechanism 9, a transverse transmission mechanism, a longitudinal transmission mechanism 12, a thickness measurement and position calibration unit 13, a grinding unit, and a cleaning unit 16. The detection unit 6 and the automatic loading and unloading unit 7 are arranged laterally on one side of the cabinet 1. The main transmission mechanism 9, the transverse transmission mechanism, the longitudinal transmission mechanism 12, the thickness measurement and position calibration unit 13, the grinding unit, and the cleaning unit 16 are all arranged inside the cabinet 1. The thickness measurement and position calibration unit 13, the grinding unit, and the cleaning unit 16 are arranged laterally on one side of the cabinet 1. Figure 8 As shown, the detection unit 6 and the automatic loading and unloading unit 7 are distributed in a straight line, the thickness measurement and position calibration unit 13, the grinding unit and the cleaning unit 16 are distributed in a straight line, and the detection unit 6, the automatic loading and unloading unit 7, the thickness measurement and position calibration unit 13, the grinding unit and the cleaning unit 16 are connected in series through the main transmission mechanism 9, the transverse transmission mechanism and the longitudinal transmission mechanism 12 to form a ring structure.

[0045] like Figures 6 to 8As shown, the transverse transmission mechanism is arranged transversely, the main transmission mechanism 9 and the transverse transmission mechanism are arranged parallel to each other, and the main transmission mechanism 9 is arranged on the side closer to the detection unit 6. The main transmission mechanism 9 is matched with the detection unit 6, the automatic loading and unloading unit 7, the thickness measurement and position calibration unit 13 and the longitudinal transmission mechanism 12. The longitudinal transmission mechanism 12 is arranged longitudinally, and the longitudinal transmission mechanism 12 is matched with the cleaning unit 16.

[0046] In this embodiment, it should be noted that the front end of the equipment is the loading and unloading unit, the rear end of the equipment is the thickness measurement and position calibration unit 13, the grinding unit, the cleaning unit 16, and the longitudinal conveying mechanism 12, the middle of the equipment is the main conveying mechanism 9 and the transverse conveying mechanism, and the detection unit 6 can be selectively placed to the left of the loading and unloading unit, the right of the loading and unloading unit, the left of the main conveying mechanism, the right of the main conveying mechanism, or the right of the cleaning unit. In this embodiment, it is placed to the left of the loading and unloading unit; the loading and unloading unit is used to place the wafer box; the main conveying mechanism 9 is used for wafer position scanning and recording in the wafer box, wafer gripping, wafer transfer from the loading and unloading unit to the thickness measurement and position calibration unit, wafer transfer from the first longitudinal conveying device to the detection unit, and wafer transfer from the first longitudinal conveying device to the... The wafer loading and unloading unit transports wafers; the thickness measurement and position calibration unit 13 is used for wafer thickness measurement and wafer center, flat edge, and notch position calibration. The calibration unit uses a CCD camera to measure and dynamically adjust to obtain the position of the wafer center, flat edge, or notch. Compared with the traditional mechanical clamping alignment, it has higher accuracy and better compatibility with wafers of different specifications; the longitudinal transmission mechanism 12 can realize longitudinal movement, vacuum adsorption, and other actions to remove the cleaned wafers from the cleaning chamber; the grinding unit is used for wafer chamfering; the cleaning unit 16 is used for cleaning the wafers after grinding; the detection unit 6 is used to detect whether the wafer chamfer size meets the technical requirements. The detection unit 6 is compatible with the automatic detection of two wafer specifications.

[0047] Furthermore, there are multiple automatic loading and unloading units 7, which are arranged in a straight line to facilitate the track layout, positioning, and loading and unloading of material boxes in the automated factory crane system, while also being compatible with manual loading and unloading methods.

[0048] The top of the cabinet 1 is equipped with an electrical box 2, and the sides of the cabinet 1 are equipped with multiple cabinet doors 3. The cabinet doors 3 can be sliding or sliding, and the cabinet doors 3 can be made of transparent material to facilitate observation of the interior of the cabinet 1. The bottom of the cabinet 1 is equipped with support legs 4 and casters 5. The support legs 4 are height-adjustable, and the casters 5 are universal casters. There are multiple support legs 4 and multiple casters 5. Specifically, there are four support legs 4 and four casters 5. The four support legs 4 are respectively located at the four corners of the bottom of the cabinet 1, and each support leg 4 is accompanied by a caster 5. The casters 5 are arranged one-to-one with the support legs 4.

[0049] The technical effects achieved in this embodiment are as follows: The equipment adopts a layout of three functional areas: front, middle, and rear. The front is the loading and unloading and inspection area, the middle is the transmission area, and the rear is the wafer processing area. The zoning is clear, taking into account both automatic loading and unloading and automatic inspection, which can meet the production needs of automated factories. Moreover, the layout is more compact and occupies less space. The wafer transmission path is circular, which can effectively reduce the flow conflict between each station and improve production efficiency. The main transmission mechanism 9 is only responsible for loading and unloading and wafer feeding inspection. It does not connect with the grinding unit and will not affect the grinding accuracy. Therefore, the accuracy requirements of the main transmission mechanism 9 can be reduced, and the processing cost can be reduced. The thickness measurement and position calibration unit 13 is arranged in a straight line with the grinding unit and the cleaning unit 16. It relies on the lateral movement of the lateral transmission mechanism to transfer between each station, which makes it easier to ensure accuracy.

[0050] Example 2

[0051] like Figures 1 to 11 As shown in the figure, another integrated wafer chamfering processing equipment provided in this embodiment has the same structure as in embodiment 1. Only the different parts are described below.

[0052] In this embodiment, as Figure 11 As shown, the main transmission mechanism 9 includes a main fixed frame 26, a main slide rail 28, a robot arm 29, a guide frame 30, a slide table 31, and a mounting frame 32. The main fixed frame 26 is installed inside the cabinet 1. The main fixed frame 26 is provided with a channel 27, which is arranged horizontally. The channel 27 is long and narrow, and it runs through the main fixed frame 26.

[0053] There are two main slide rails 28, which are arranged parallel to each other on both sides of the width of the channel 27; the slide table 31 is located on the top of the mounting frame 32, and the slide table 31 is slidably connected to the main slide rail 28. The slide table 31 is driven by the drive mechanism to move back and forth along the main slide rail 28. The bottom of the mounting frame 32 extends through the channel 27 to the bottom of the main fixed frame 26.

[0054] The mounting frame 32 is equipped with a lifting platform, and a rotating mechanism is provided on the lifting platform. The output shaft of the rotating mechanism is connected to the guide frame 30. The robot arm 29 is slidably mounted on the guide frame 30. The robot arm 29 can reciprocate along the guide frame 30 by being driven by a drive mechanism, and the robot arm 29 is plate-shaped.

[0055] In this embodiment, it should be noted that the end of the robotic arm 29 is C-shaped to facilitate exposing the center position of the wafer. The end of the robotic arm 29 is provided with a vacuum nozzle, which is used to adsorb and fix the wafer.

[0056] Furthermore, a manual loading and unloading unit can be used instead of the automatic loading and unloading unit 7. Specifically, both the manual loading and unloading unit and the automatic loading and unloading unit 7 are detachable. When manual loading and unloading is required, the automatic loading and unloading unit 7 can be replaced with the manual loading and unloading unit, so that the entire equipment can be compatible with both manual and automatic loading and unloading.

[0057] The technical effect achieved by this embodiment is that the robotic arm 29 of the main transmission mechanism 9 can move horizontally, lift and rotate, which facilitates accurate gripping and transfer of wafers.

[0058] Example 3

[0059] like Figures 1 to 11 As shown in the figure, another integrated wafer chamfering processing equipment provided in this embodiment has the same structure as in embodiment 1. Only the different parts are described below.

[0060] In this embodiment, as Figure 9 and Figure 10 As shown, the transverse transmission mechanism includes a transverse support 18, a transverse slide rail 25, a first transverse transmission device 10, and a second transverse transmission device 11. The transverse support 18 is arranged transversely inside the cabinet 1, and the transverse slide rail 25 is arranged on the transverse support 18 and along the length of the transverse support 18. Specifically, the transverse slide rail 25 is arranged on the side of the transverse support 18, and there are two transverse slide rails 25 arranged parallel to each other. The first transverse transmission device 10 and the second transverse transmission device 11 are both slidably arranged on the transverse slide rail 25, and are driven to reciprocate along the transverse slide rail 25 by a drive mechanism.

[0061] In this embodiment, it should be noted that the first transverse transmission device 10 includes a first transverse moving plate 19, a first longitudinal moving plate 21, and a first vacuum suction cup 23. The first transverse moving plate 19 is slidably disposed on the transverse slide rail 25 and is driven to reciprocate along the transverse slide rail 25 by a first transverse driving mechanism. The first longitudinal moving plate 21 is slidably disposed on the first transverse moving plate 19 and is driven to reciprocate along the longitudinal direction by a first longitudinal driving mechanism. The first vacuum suction cup 23 is disposed on the first longitudinal moving plate 21 and is disposed vertically downward.

[0062] The second transverse transmission device 11 includes a second transverse moving plate 20, a second longitudinal moving plate 22, and a second vacuum suction cup 24. The second transverse moving plate 20 is slidably disposed on the transverse slide rail 25 and is driven to reciprocate along the transverse slide rail 25 by a second transverse driving mechanism. The second longitudinal moving plate 22 is slidably disposed on the second transverse moving plate 20 and is driven to reciprocate along the longitudinal direction by a second longitudinal driving mechanism. The second vacuum suction cup 24 is disposed on the second longitudinal moving plate 22 and is vertically downward.

[0063] The first transverse transfer device 10 can perform transverse movement, lifting, vacuum adsorption and other actions, and is used for wafer transfer from the thickness measurement and position calibration unit 13 to the grinding unit; the second transverse transfer device 11 can perform transverse movement, lifting, vacuum adsorption and other actions, and is used for wafer transfer from the grinding unit to the cleaning unit 16, and wafer transfer from the cleaning unit 16 to the longitudinal transfer mechanism 12.

[0064] Furthermore, during the entire equipment operation, the wafer processing path is as follows: First, the main transfer mechanism 9 transfers the wafer to be processed from the loading / unloading unit to the thickness measurement and position calibration unit 13 for wafer thickness measurement and position calibration; after the thickness measurement and position calibration are completed, the first transverse transfer device 10 moves the wafer to the grinding unit for grinding; after the grinding is completed, the second transverse transfer device 11 moves the wafer to the cleaning unit for cleaning; after the cleaning is completed, the longitudinal transfer mechanism 12 moves the wafer to the inspection unit 6 for inspection; after the inspection is completed, the main transfer mechanism 9 moves the processed wafer to the loading / unloading unit to complete the entire processing operation.

[0065] The technical effect achieved by this embodiment is that the first transverse transmission device 10 and the second transverse transmission device 11 have different functions and do not interfere with each other, which facilitates precise control.

[0066] Example 4

[0067] like Figures 1 to 11 As shown in the figure, another integrated wafer chamfering processing equipment provided in this embodiment has the same structure as in embodiment 1. Only the different parts are described below.

[0068] In this embodiment, the longitudinal transmission mechanism 12 includes a longitudinal guide rail, a support frame, and a wafer chuck. The longitudinal guide rail is arranged longitudinally inside the cabinet 1. One end of the support frame is slidably connected to the longitudinal guide rail. The support frame is driven to reciprocate along the longitudinal guide rail by a drive mechanism. The other end of the support frame is provided with a wafer chuck.

[0069] In this embodiment, it should be noted that the grinding unit includes a first grinding unit 14 and a second grinding unit 15. The first grinding unit 14 and the second grinding unit 15 are arranged side by side. By setting up two grinding units, the processing efficiency can be effectively improved and continuous production can be achieved.

[0070] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

[0071] The terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Any changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention.

Claims

1. An integrated wafer chamfering apparatus, characterized by comprising: Including cabinet (1), detection unit (6), automatic feeding and discharging unit (7), main transmission mechanism (9), horizontal transmission mechanism, longitudinal transmission mechanism (12), thickness and position calibration unit (13), grinding unit and cleaning unit (16), the detection unit (6) and the automatic feeding and discharging unit (7) are transversely distributed on one side of the cabinet (1), the main transmission mechanism (9), the horizontal transmission mechanism, the longitudinal transmission mechanism (12), the thickness and position calibration unit (13), the grinding unit and the cleaning unit (16) are all arranged in the cabinet (1), the thickness and position calibration unit (13), the grinding unit and the cleaning unit (16) are transversely distributed on one side in the cabinet (1);The detection unit (6), the automatic feeding and discharging unit (7), the thickness and position calibration unit (13), the grinding unit and the cleaning unit (16) are connected in series through the main transmission mechanism (9), the horizontal transmission mechanism and the longitudinal transmission mechanism (12), which form a ring structure together; The horizontal transmission mechanism is transversely arranged, the main transmission mechanism (9) and the horizontal transmission mechanism are arranged parallel to each other, and the main transmission mechanism (9) is arranged on the side close to the detection unit (6), the main transmission mechanism (9) is arranged in the detection unit (6), the automatic feeding and discharging unit (7), the thickness and position calibration unit (13) and the longitudinal transmission mechanism (12) are matched with each other;The longitudinal transmission mechanism (12) is arranged along the longitudinal direction, and the longitudinal transmission mechanism (12) and the cleaning unit (16) are matched with each other.

2. The integrated wafer bevel processing apparatus of claim 1, wherein The main transmission mechanism (9) comprises a main fixed frame (26), a main slide rail (28), a mechanical hand (29), a guide frame (30), a slide table (31) and a mounting frame (32), the main fixed frame (26) is arranged in the cabinet (1), the main fixed frame (26) is provided with a channel (27), the channel (27) is arranged transversely, and the channel (27) penetrates through the main fixed frame (26); The main slide rail (28) is two, and the two main slide rails (28) are arranged parallel to each other on both sides of the width of the channel (27);The slide table (31) is arranged on the top of the mounting frame (32), and the slide table (31) is slidably connected with the main slide rail (28), and the mounting frame (32) extends to the lower side of the main fixed frame (26) through the channel (27) at the bottom; The mounting frame (32) is provided with a lifting platform, the lifting platform is provided with a rotating mechanism, the output shaft of the rotating mechanism is connected with the guide frame (30), the mechanical hand (29) is slidably arranged on the guide frame (30), and the mechanical hand (29) is in the shape of a sheet.

3. The apparatus according to claim 2, wherein The end of the mechanical hand (29) is C-shaped, and the end of the mechanical hand (29) is provided with a vacuum suction nozzle.

4. The apparatus according to claim 1, wherein The transverse conveying mechanism comprises a transverse support (18), a transverse sliding rail (25), a first transverse conveying device (10) and a second transverse conveying device (11), the transverse support (18) is arranged in the transverse direction in the cabinet body (1), the transverse sliding rail (25) is arranged on the transverse support (18), and the transverse sliding rail (25) is arranged along the length direction of the transverse support (18); the first transverse conveying device (10) and the second transverse conveying device (11) are both slidingly arranged on the transverse sliding rail (25).

5. The apparatus according to claim 4, wherein The first transverse conveying device (10) comprises a first transverse moving plate (19), a first longitudinal moving plate (21) and a first vacuum chuck (23), the first transverse moving plate (19) is slidingly arranged on the transverse sliding rail (25), the first longitudinal moving plate (21) is slidingly arranged on the first transverse moving plate (19) in the longitudinal direction, the first vacuum chuck (23) is arranged on the first longitudinal moving plate (21), and the first vacuum chuck (23) is arranged vertically downward; The second transverse conveying device (11) comprises a second transverse moving plate (20), a second longitudinal moving plate (22) and a second vacuum chuck (24), the second transverse moving plate (20) is slidingly arranged on the transverse sliding rail (25), the second longitudinal moving plate (22) is slidingly arranged on the second transverse moving plate (20) in the longitudinal direction, the second vacuum chuck (24) is arranged on the second longitudinal moving plate (22), and the second vacuum chuck (24) is arranged vertically downward.

6. The apparatus according to claim 4, wherein The transverse sliding rail (25) is arranged on the side of the transverse support (18), the number of the transverse sliding rails (25) is two, and the two transverse sliding rails (25) are arranged in parallel with each other.

7. The apparatus according to claim 1, wherein The longitudinal conveying mechanism (12) comprises a longitudinal guide rail, a support frame and a wafer chuck, the longitudinal guide rail is arranged in the longitudinal direction in the cabinet body (1), one end of the support frame is slidingly connected with the longitudinal guide rail, and the other end of the support frame is provided with the wafer chuck.

8. The apparatus according to claim 1, wherein The grinding unit comprises a first grinding unit (14) and a second grinding unit (15), and the first grinding unit (14) and the second grinding unit (15) are arranged side by side.

9. The apparatus according to claim 1, wherein The top of the cabinet body (1) is provided with an electrical box (2), the side of the cabinet body (1) is provided with a plurality of cabinet doors (3), the bottom of the cabinet body (1) is provided with a plurality of supporting legs (4) and a plurality of rollers (5), the supporting legs (4) are liftable, and the number of the supporting legs (4) and the rollers (5) is both multiple.

10. The apparatus according to claim 9, wherein The supporting legs (4) and the rollers (5) are arranged in one-to-one correspondence, and the rollers (5) are universal wheels.

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