A cutting method, device and apparatus for a flat leadless package structure

Abstract

The application provides a cutting method, device and equipment for a flat leadless packaging structure, and the method comprises the following steps: determining a cutting channel for cutting the flat leadless packaging structure according to position information corresponding to each packaging substructure in the flat leadless packaging structure to be cut; determining a target position on the first channel according to length information of the first channel in the row direction; cutting the flat leadless packaging structure to obtain a plurality of single-row packaging substructures by respectively cutting to the target position along the first channels corresponding to the two rows of packaging substructures from the opposite sides of the flat leadless packaging structure in the row direction; and cutting the plurality of single-row packaging substructures along the second channels in the cutting channel for each adjacent two columns of packaging substructures to obtain a plurality of discrete packaging substructures, so that the stress of the single-row packaging substructure in the cutting process is reduced, the cutting deviation in the row direction is avoided, and the product scrapping is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging structure processing technology, and in particular to a method, apparatus and equipment for cutting a flat leadless packaging structure. Background Technology

[0002] In recent years, with the continuous development of microelectronics technology, chip packaging technology has also been advancing. Among them, the flat leadless package structure is a common chip packaging form, which has no external leads and has good electrothermal performance; it is small in size, light in weight, and has low development cost, and is widely used.

[0003] In existing technologies, when cutting flat leadless packages, especially rectangular flat leadless packages, the cutting path made by the cutting blade tends to be curved rather than straight. Consequently, when cutting the long side of the flat leadless package, cutting deviation is likely to occur, resulting in the direct scrapping of the package substructure cut from the flat leadless package. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0005] To address this, the present invention provides a method, apparatus, and cutting device for cutting flat leadless packaging structures, which reduces the distortion of the single-row package substructures being cut and separated, and avoids the cutting offset that occurs when cutting along the row direction of the flat leadless packaging structure in the prior art, thereby reducing the scrap of the cut package substructures.

[0006] According to a first aspect of the present invention, a method for cutting a flat, leadless package structure is provided, applied to a cutting device. The cutting device is used to cut the flat, leadless package structure, which includes multiple package substructures arranged sequentially in both row and column directions, with the row direction perpendicular to the column direction. The method includes:

[0007] Based on the position information of each of the package substructures in the flat leadless package structure to be cut, the cutting channel for the cutting equipment to cut the flat leadless package structure is determined; the cutting channel is the first channel for cutting each two adjacent rows of package substructures along the row direction, and the second channel for cutting each two adjacent columns of package substructures along the column direction.

[0008] For each first channel, the target position is determined on the first channel based on the length information of the first channel in the row direction;

[0009] For each pair of adjacent package substructures, the flat leadless package structure is cut along the first channel corresponding to the two rows of package substructures from the opposite sides of the flat leadless package structure in the row direction to the target position, so as to cut the flat leadless package structure into multiple single-row package substructures.

[0010] For each pair of adjacent package substructures, multiple single-row package substructures are cut along the second channel to obtain multiple discrete package substructures.

[0011] Optionally, for each pair of adjacent package substructures, the flat leadless package structure is cut along the first channel corresponding to the two rows of package substructures from opposite sides in the row direction to the target position, so as to cut the flat leadless package structure into multiple single-row package substructures, including:

[0012] For each first channel of the flat leadless package structure along the row direction and located on one side of the target position, the flat leadless package structure is cut along the first channel to the target position to obtain a flat leadless package structure cut on one side;

[0013] For each first channel of the flat leadless package structure along the row direction and on the other side of the target position, the flat leadless package structure cut along the first channel is cut to the target position, so that all the first channels in the flat leadless package structure are cut.

[0014] Optionally, for each first channel of the flat leadless package structure along the row direction and located on one side of the target position, the flat leadless package structure is cut along the first channel to the target position to obtain a flat leadless package structure cut on one side, including:

[0015] Control the movement of the stage used to support the flat leadless package structure so that one end of the first channel to be cut is moved to a position corresponding to the cutting blade of the cutting equipment;

[0016] For each first channel, the endpoint of the first channel closest to the cutting blade is taken as the cutting start point, and the target position on the first channel is taken as the cutting end point;

[0017] For each first channel, the cutting blade is controlled to move along the first channel from the cutting starting point to the cutting end point, resulting in a flat, leadless package structure cut on one side.

[0018] Accordingly, for each first channel of the flat leadless package structure along the row direction and located on the other side of the target position, the flat leadless package structure cut along the first channel is cut to the target position, so that all the first channels of the flat leadless package structure are cut, including:

[0019] Control the rotation of the worktable to move the other side of the flat leadless package structure to a position corresponding to the cutting blade of the cutting equipment;

[0020] For each first channel, the endpoint of the first channel to be cut that is closest to the cutting blade is taken as the new cutting starting point;

[0021] For each first channel, the cutting blade is controlled to move along the first channel to be cut from the new cutting starting point until the cutting blade moves to the cutting end point, so as to cut and separate each row of package substructures from the flat leadless package structure.

[0022] Optionally, for each pair of adjacent package substructures, multiple single-row package substructures are cut along the second channel to obtain multiple discrete package substructures, including:

[0023] For each pair of adjacent packaging substructures, the worktable is moved so that one end of the second channel moves to the position corresponding to the cutting blade of the cutting equipment;

[0024] The cutting blade is controlled to move along the second channel from one end of the second channel near the cutting blade until each pair of adjacent encapsulation substructures are cut and separated.

[0025] Optionally, the target position is the position corresponding to half the length of the first channel in the row direction.

[0026] Optionally, it also includes:

[0027] Acquire the target image to be identified; the target image is an image containing the flat, leadless package structure to be cut; the flat, leadless package structure includes a molding compound and package substructures arranged in an array within the molding compound;

[0028] The target image is identified to determine the position information of each package substructure in the flat leadless package structure.

[0029] Optionally, before cutting the flat leadless package structure into multiple single-row package substructures from opposite sides of the flat leadless package structure in the row direction for each pair of adjacent package substructures, the method further includes:

[0030] Based on the position information of each of the package substructures in the flat leadless package structure to be cut, determine whether there are any package substructures that are covered or whose similarity values ​​do not meet the standard in the flat leadless package structure.

[0031] If there is a covered or similarity value substructure, then based on the position information of the covered or similarity value substructure, determine whether the covered or similarity value substructure is the end of the row of the package substructure.

[0032] If the covered or similar value-inadequate encapsulation substructure is not the end of the encapsulation substructure in the row it belongs to, then the end of the encapsulation substructure in that row will be used as the flattening point.

[0033] If the covered or similarity value-inadequate encapsulation substructure is the end of the encapsulation substructure in the row it belongs to, then for the covered or similarity value-inadequate encapsulation substructure, find adjacent encapsulation substructures on both sides of the row direction that are not covered and have a similarity value that meet the requirements, so that the found encapsulation substructures can be used as the flattening points of the row encapsulation substructure.

[0034] After the flattening point is axially rotated by the worktable used to support the flat leadless package structure to flatten the package substructure, the first cutter endpoint for cutting the first channel is determined on the flat leadless package structure.

[0035] Optionally, it also includes:

[0036] Based on the scanning and identification results of the flat leadless package structure attached to the material carrier assembly, the quantity information of the flat leadless package structure and the position information of each flat leadless package structure are determined.

[0037] Based on the quantity information of the flat leadless package structure and the position information of each flat leadless package structure, determine whether there is a material shortage area in the material carrier assembly.

[0038] If there is a missing material area, the cutting equipment will skip cutting the missing material area when cutting the flat leadless package structure.

[0039] According to a second aspect of the present invention, a cutting apparatus for a flat, leadless package structure is provided, applied to a cutting device for cutting the flat, leadless package structure, the flat, leadless package structure including multiple package substructures arranged sequentially in both row and column directions, the row direction being perpendicular to the column direction, the apparatus comprising:

[0040] The cutting channel determination module is used to determine the cutting channel for the cutting equipment to cut the flat leadless package structure based on the position information of each package substructure in the flat leadless package structure to be cut. The cutting channel is a first channel for cutting each two adjacent rows of package substructures along the row direction, and a second channel for cutting each two adjacent columns of package substructures along the column direction.

[0041] The target location determination module is used to determine the target location on each first channel based on the length information of the first channel in the row direction.

[0042] The row cutting control module is used to cut the flat leadless package structure into multiple single-row package substructures from the opposite sides of the flat leadless package structure in the row direction to the target position, so as to cut the flat leadless package structure into multiple single-row package substructures.

[0043] The column cutting control module is used to cut multiple single-row package substructures along the second channel for each pair of adjacent package substructures to obtain multiple discrete package substructures.

[0044] According to a third aspect of the invention, a cutting apparatus is provided, including a memory and a processor, the memory for storing processor-executable instructions; the processor is configured to execute the executable instructions in the memory to implement the steps of the method as described in the first aspect or its various implementations.

[0045] According to a fourth aspect of the present invention, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the method as described in the first aspect or its various implementations.

[0046] Compared with the prior art, the beneficial effects of the present invention are:

[0047] The cutting method for a flat leadless package structure provided by this invention reduces the stress on a single row of package substructures during the cutting process in the row direction of the flat leadless package structure, thereby reducing the distortion of the cut single row package substructures and avoiding the cutting offset that occurs when cutting along the row direction of the flat leadless package structure in the prior art, thus reducing the scrap of the cut package substructures. Attached Figure Description

[0048] Figure 1 An application scenario diagram provided for one embodiment of this application;

[0049] Figure 2 A flowchart illustrating a cutting method for a flat, leadless package structure, as provided in this application embodiment;

[0050] Figure 3 A schematic diagram of a flat, leadless package structure with a covered or similar value-substructure as provided in an embodiment of this application;

[0051] Figure 4A schematic diagram of a cutting device for a flat, leadless package structure provided in one embodiment of this application;

[0052] Figure 5 This is a schematic block diagram of a cutting device according to one embodiment of the present application. Detailed Implementation

[0053] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0054] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0055] As mentioned above, in the prior art, when cutting flat leadless package structures, especially rectangular QFN or DFN packages, the cutting path on the flat leadless package structure will be arc-shaped rather than straight due to the deformation of the frame base island itself. This causes the cutting blade to deviate when cutting the long side of the flat leadless package structure, which can easily lead to the pin size of the package substructure cut from the flat leadless package structure not meeting the standards, and in severe cases, it can even lead to the direct scrapping of the package substructure.

[0056] To at least address one of the technical problems existing in the prior art or related technologies, the present invention provides a method, apparatus, cutting device, and storage medium for cutting a flat leadless package structure. The method includes: determining cutting channels for the cutting device to cut the flat leadless package structure based on the position information of each package substructure in the flat leadless package structure to be cut; the cutting channels are a first channel for cutting every two adjacent rows of package substructures along the row direction, and a second channel for cutting every two adjacent columns of package substructures along the column direction; for each first channel, determining a target position on the first channel based on the length information of the first channel in the row direction; for every two adjacent rows of package substructures, cutting along the corresponding first channels from opposite sides of the flat leadless package structure in the row direction to the target position, thereby cutting the flat leadless package structure into multiple single-row package substructures; for every two adjacent columns of package substructures, cutting along the second channels into multiple single-row package substructures to obtain multiple discrete package substructures. This application can avoid the cutting offset that occurs when cutting along the row direction of a flat, leadless package structure in the prior art, thereby reducing the scrap of the cut package substructures.

[0057] It should be understood that the technical solution of this application can be applied to the following scenarios, but is not limited to:

[0058] In some possible ways, Figure 1 An application scenario diagram provided for an embodiment of this application, such as... Figure 1 As shown, this application scenario may include a cutting device 110 and a network device 120. The cutting device 110 can establish a connection with the network device 120 via a wired network or a wireless network.

[0059] For example, the cutting device 110 can be a cutting machine or a dicing machine, but is not limited thereto. The network device 120 can be a desktop computer, a laptop computer, a tablet computer, etc., but is not limited thereto. In one embodiment of this application, the network device 120 can send a request message to the cutting device 110, which can be used to request the position information of each corresponding package substructure in the flat leadless package structure to be cut. Further, the network device 120 can receive a response message sent by the cutting device 110, which includes obtaining the position information of each corresponding package substructure in the flat leadless package structure to be cut.

[0060] also, Figure 1 An example of a cutting device and a network device are provided, but in practice, other numbers of cutting devices and network devices may be included, and this application does not limit this.

[0061] In other possible implementations, the technical solution of this application can also be executed by the cutting device 110, or by the network device 120, and this application does not limit the implementation in this regard.

[0062] After introducing the application scenarios of the embodiments of this application, the technical solution of this application will be described in detail below:

[0063] Figure 2 A flowchart illustrating a cutting method for a flat, leadless package structure provided in this application embodiment is shown. The method is applied to a cutting device used to cut the flat, leadless package structure. The flat, leadless package structure includes multiple package substructures arranged sequentially in both row and column directions, with the row direction perpendicular to the column direction. This method can be implemented using methods such as... Figure 1 The cutting device 110 shown performs the operation, but is not limited to it. For example... Figure 2 As shown, the method may include the following steps:

[0064] Step S210: Determine the cutting channel for the cutting equipment to cut the flat leadless package structure based on the position information of each of the package substructures in the flat leadless package structure to be cut.

[0065] The cutting channel is a first channel that cuts each pair of adjacent row package substructures along the row direction, and a second channel that cuts each pair of adjacent column package substructures along the column direction.

[0066] Here, the flat leadless package structure can be a QFN package structure or a DFN package structure; the flat leadless package structure can be a rectangular structure or a circular structure; when the flat leadless package structure is a rectangular structure, the length of the flat leadless package structure in its row direction can be greater than the length in its column direction. For example, the length of the flat leadless package structure in its row direction is 300mm, and the length of the flat leadless package structure in its column direction is 95mm.

[0067] It should be noted that the package substructure includes a molding compound, and a chip, frame base island, and pins located within the molding compound. The frame base island is located on the surface of the chip, and the pins are located on both sides of the frame base island. In a flat leadless package structure, the connection between two adjacent package substructures in the row or column direction can be understood as the connection of the molding compound in two adjacent package substructures in the row or column direction, and the connection of the pins in two adjacent package substructures.

[0068] Here, the first channel can be the connection position between each two adjacent rows of package substructures in the row direction of the flat leadless package structure, and the first channel is parallel to the row direction of the flat leadless package structure; the second channel can be the connection position between each two adjacent columns of package substructures in the column direction of the flat leadless package structure, and the second channel is parallel to the column direction of the flat leadless package structure; specifically, the first channel is located at the connection position between two adjacent rows of pins in the row direction of the flat leadless package structure; the second channel is located at the connection position between two adjacent columns of pins in the column direction of the flat leadless package structure.

[0069] Step S220: For each first channel, determine the target position on the first channel based on the length information of the first channel in the row direction.

[0070] It should be noted that the length of the flat leadless package structure in the row direction is greater than its length in the column direction.

[0071] Here, the target positions corresponding to each first channel can be located on the same straight line along the column direction, or they can not be located on the same straight line.

[0072] Step S230: For each pair of adjacent package substructures, cut along the first channel corresponding to the two rows of package substructures from the opposite sides of the flat leadless package structure in the row direction to the target position, so as to cut the flat leadless package structure into multiple single-row package substructures.

[0073] It should be noted that a single-row encapsulated substructure consists of multiple encapsulated substructures located in the same row, while a two-row encapsulated substructure consists of multiple encapsulated substructures located in two rows.

[0074] This step can be understood as follows: from one side of the flat leadless package structure in the row direction, cut along the first channel corresponding to the two adjacent rows of package substructures to the target position, and then from the other side of the flat leadless package structure in the row direction, cut along the first channel to the target position to complete the cutting of each pair of adjacent rows of package substructures, resulting in multiple single-row package substructures cut from the flat leadless package structure.

[0075] For example, single-row package substructure A and single-row package substructure B are two adjacent rows of package substructures. The first channel corresponding to single-row package substructure A and single-row package substructure B is the first channel 1. The target position corresponding to the first channel 1 is point S located on the first channel 1. When the single-row package substructure A and single-row package substructure B are cut, on one side of the flat leadless package structure in the row direction, the first channel 1 is cut towards point S from the endpoint corresponding to that side of the flat leadless package structure until point S is reached. Then, on the other side of the flat leadless package structure in the row direction, the first channel 1 is cut towards point S from the endpoint corresponding to that side of the flat leadless package structure until point S is reached. The single-row package substructure A and single-row package substructure B are cut and separated along the first channel 1.

[0076] In this step, the adjacent two rows of package substructures are cut from opposite sides of the flat leadless package structure in the row direction along the first channel corresponding to each row of package substructures to the target position. This separates the two adjacent rows of package substructures, avoiding the large stress experienced by the frame base island in the single row package substructure during the cutting process in the prior art, which involves cutting from one side of the flat leadless package structure in the row direction along the first channel corresponding to each row of package substructures to the other side of the flat leadless package structure in the row direction. This also avoids the distortion of the separated single row package substructures and reduces the cutting offset that occurs during the cutting process of the single row package substructure.

[0077] Step S240: For each pair of adjacent encapsulation substructures, cut the multiple single-row encapsulation substructures along the second channel to obtain multiple discrete encapsulation substructures.

[0078] It should be noted that a single-column package substructure consists of multiple package substructures located in the same column, while a two-column package substructure consists of multiple package substructures located in two columns.

[0079] Here, when cutting each pair of adjacent package substructures, each package substructure in the multiple single-row package substructures cut in step S230 maintains its position before the flat leadless package structure was cut. That is, the multiple single-row package substructures are kept on the work disk in the position before they were cut and separated from the flat leadless package structure, so that the cutting of a single package substructure located in the single-row package substructure can be achieved by cutting the multiple single-row package substructures along the second channel.

[0080] By using the above method, the stress of a single row of package substructures is reduced during the cutting process of the flat leadless package structure in the row direction, so as to reduce the distortion of the cut single row package substructures. This avoids the cutting offset that occurs when cutting along the row direction of the flat leadless package structure in the prior art, thereby reducing the scrap of the cut package substructures.

[0081] In some possible implementations, for each pair of adjacent package substructures, cutting is performed from opposite sides of the flat leadless package structure in the row direction along the first channel corresponding to the two rows of package substructures to the target position, so as to cut the flat leadless package structure into multiple single-row package substructures. This may include the following steps:

[0082] Step S310: For each first channel of the flat leadless package structure along the row direction and located on one side of the target position, the flat leadless package structure is cut along the first channel to the target position to obtain a flat leadless package structure cut on one side.

[0083] Here, the first channels between adjacent rows of package substructures in the flat leadless package structure can be sorted along the column direction by using the position information of each package substructure in the flat leadless package structure. When implementing step S310, each first channel in the flat leadless package structure can be cut sequentially according to the sorting corresponding to different first channels to obtain a flat leadless package structure cut on one side.

[0084] In this step, by cutting along the first channel of the flat leadless package structure to the target position for each first channel along the row direction, the corresponding part of each row of package substructures located on the target position side can be cut and separated from each other.

[0085] Step S320: For each first channel of the flat leadless package structure along the row direction and on the other side of the target position, cut along the first channel to the target position, so that all the first channels of the flat leadless package structure are cut.

[0086] When implementing step S320, each first channel in the flat leadless package structure cut on one side can also be cut sequentially according to the order corresponding to different first channels, so that all first channels in the flat leadless package structure are cut.

[0087] Taking the first channel A in a flat, leadless package structure cut from one side as an example, by cutting the flat, leadless package structure from the other side of the row direction along the first channel A to the target position, the uncut and unseparated parts of the package substructures in the two adjacent rows on both sides of the first channel A can be cut and separated.

[0088] Using the above method, it is possible to cut and separate the package substructure of each row in the flat leadless package structure from the flat leadless package structure, so as to quickly cut the flat leadless package structure into multiple single-row package substructures.

[0089] In some possible implementations, for each first channel of the flat leadless package structure along the row direction and located on one side of the target position, the flat leadless package structure is cut along the first channel to the target position to obtain a flat leadless package structure cut on one side, which may include the following steps:

[0090] Step S410: Control the movement of the stage used to support the flat leadless package structure so that one end of the first channel to be cut is moved to a position corresponding to the cutting blade of the cutting device.

[0091] Here, the worktable can rotate axially or move in a plane so that one end of the first channel moves to a position corresponding to the cutting blade of the cutting device.

[0092] Step S420: For each first channel, take the end point of the first channel closest to the cutting blade as the cutting start point and the target position on the first channel as the cutting end point.

[0093] Step S430: For each first channel, control the cutting blade to move along the first channel from the cutting starting point to the cutting end point, and obtain a flat, leadless package structure cut on one side.

[0094] By using the end point of the first channel near the cutting blade as the cutting start point and the target position on the first channel as the cutting end point, it is easier to control the cutting of the flat leadless package structure along the first channel by the cutting blade, thereby quickly obtaining a flat leadless package structure cut on one side.

[0095] Accordingly, for each first channel of the flat leadless package structure along the row direction and located on the other side of the target position, the flat leadless package structure cut along the first channel is cut to the target position, so that all the first channels of the flat leadless package structure are cut. This may include the following steps:

[0096] Step S510: Control the worktable to rotate, so that the other side of the flat leadless package structure moves to the position corresponding to the cutting blade of the cutting equipment.

[0097] Here, by controlling the worktable to rotate 180° axially, the other side of the flat leadless package structure can be moved to a position corresponding to the cutting blade of the cutting equipment, thereby bringing the other end of the first channel closer to the position corresponding to the cutting blade of the cutting equipment.

[0098] Step S520: For each first channel, take the end of the first channel to be cut that is closest to the cutting blade as the new cutting starting point.

[0099] Step S530: For each first channel, control the cutting blade to move along the first channel to be cut from the new cutting starting point until the cutting blade moves to the cutting end point, so as to cut and separate each row of package substructure from the flat leadless package structure.

[0100] By adjusting the flat leadless package structure, taking the end point of the first channel closest to the cutting blade as the new cutting starting point and the target position on the first channel as the cutting ending point, it is convenient to make the cutting blade perform a forward cutting on the part of the first channel that has not been cut in step S430, so as to quickly cut and separate the package substructure of each row from the flat leadless package structure.

[0101] Using the above method, the worktable can be rotated so that the cutting blade of the cutting equipment can travel from opposite sides of the flat leadless package structure in the row direction and cut along the first channel corresponding to the two rows of package substructures to the target position, so as to quickly cut and separate the package substructure of each row from the flat leadless package structure, thereby improving the cutting efficiency of each row of package substructures.

[0102] In some possible implementations, for each pair of adjacent encapsulation substructures, multiple single-row encapsulation substructures are cut along the second channel to obtain multiple discrete encapsulation substructures, which may include the following steps:

[0103] Step S610: For each pair of adjacent packaging substructures, control the worktable to move so that one end of the second channel moves to the position corresponding to the cutting blade of the cutting device.

[0104] Here, by controlling the worktable to rotate 90° axially, and then by controlling the worktable to move along the length of the single row of packaging substructures, one end of the second channel between two adjacent columns of packaging substructures can be moved to the position corresponding to the cutting blade of the cutting device.

[0105] Step S620: Control the cutting blade to move along the second channel from one end of the second channel near the cutting blade until each pair of adjacent encapsulation substructures are cut and separated.

[0106] In this step, by controlling the cutting blade to move along the second channel from one end of the cutting blade, the flat, leadless package structure that forms multiple single-row package substructures can be cut. After each pair of adjacent package substructures is cut and separated, multiple discrete package substructures are obtained.

[0107] Using the above method, by controlling the rotation of the worktable, one end of the second channel can be moved to a position corresponding to the cutting blade of the cutting equipment. Then, the cutting blade can be controlled to move along the second channel from the end closest to the cutting blade to cut, thereby quickly obtaining multiple discrete package substructures and improving the cutting efficiency of flat leadless package structures.

[0108] Optionally, the target position is the position corresponding to half the length of the first channel in the row direction.

[0109] Here, by selecting the target position as the position corresponding to half the length of the first channel in the row direction, it is not only convenient to determine the target position, but also to ensure that the cutting blade of the cutting device travels the same length from both sides of the first channel to the target position, thereby facilitating the control of the movement of the cutting blade.

[0110] In some possible implementations, it also includes:

[0111] Step S710: Obtain the target image to be identified.

[0112] The target image is an image containing a flat, leadless package structure to be cut. The flat, leadless package structure includes a molding compound and package substructures arranged in an array within the molding compound.

[0113] Here, the target image to be identified can be obtained through a visual recognition module installed on the cutting equipment.

[0114] Step S720: Identify the target image and determine the position information of each package substructure in the flat leadless package structure.

[0115] Using the above method, since the image shape of the frame base island and pins in the package substructure is easily distinguishable from the plastic body in the flat leadless package structure, and the corresponding frame base island and pins in each package substructure are also easy to determine, the position information of each package substructure in the flat leadless package structure can be quickly determined by recognizing the target image through the visual recognition module.

[0116] In some possible implementations, before cutting the flat, leadless package structure into multiple single-row package substructures from opposite sides of the flat, leadless package structure in the row direction along the first channel corresponding to the two adjacent rows of package substructures to the target position, the following steps may also be included:

[0117] Step S810: Based on the position information of each package substructure in the flat leadless package structure to be cut, determine whether there are any package substructures that are covered or whose similarity values ​​do not meet the standard in the flat leadless package structure.

[0118] It should be noted that in a flat, leadless package structure, a package substructure that is covered or whose similarity value does not meet the standard can be understood as a package substructure whose surface morphology is different from other package substructures. For example, if the frame base island and pins in package substructure A are covered due to being obscured by the molding compound, and thus have a different surface morphology from other package substructures, then package substructure A is considered to be covered. As another example, if the shape of the frame base island and pins in package substructure B is different from the shape of other package substructures, resulting in a different surface morphology from other package substructures, then package substructure B is considered to have a non-compliant similarity value.

[0119] Step S820: If there is a covered or sub-encapsulated structure with a similarity value that does not meet the standard, then based on the position information corresponding to the covered or sub-encapsulated structure with a similarity value that does not meet the standard, determine whether the covered or sub-encapsulated structure with a similarity value that does not meet the standard is the end of the sub-encapsulated structure in the row where it is located.

[0120] Since a covered or substandard encapsulated substructure is located at the end of a row of encapsulated substructures, applying tension to both ends of the row of encapsulated substructures to flatten them may cause the cutting blade of the cutting equipment to fail to align with the first channel, easily triggering an alarm in the cutting equipment and requiring manual intervention, thus interrupting the cutting process. Therefore, after identifying a covered or substandard encapsulated substructure, it is further determined whether the covered or substandard encapsulated substructure is at the end of its row of encapsulated substructures. When it is determined that the covered or substandard encapsulated substructure is at the end of its row of encapsulated substructures, the cutting channel is adjusted through the following steps to avoid the cutting blade of the cutting equipment failing to align with the first channel.

[0121] Step S830: If the covered or similar value-inadequate package substructure is not the end of the package substructure in the row it belongs to, then the end located in the package substructure in that row is taken as the flattening point.

[0122] Here, when it is determined that the covered or substandard packaging substructure is not at the end of the row of packaging substructures, that is, when it is determined that the covered or substandard packaging substructure is located in the middle of the row of packaging substructures, the entire row of packaging substructures can be flattened by using the end of the row of packaging substructures as a flattening point, so that the cutting blade of the cutting device is aligned with the first channel corresponding to the row of packaging substructures.

[0123] Step S840: If the covered or similarity value-inadequate encapsulation substructure is the end of the row of encapsulation substructures, then find adjacent encapsulation substructures that are not covered and have a similarity value on both sides of the row direction for the covered or similarity value-inadequate encapsulation substructure, and use the found encapsulation substructures as the flattening points of the row of encapsulation substructures.

[0124] Here, the covered or similarity-deficient encapsulation substructure can be moved left and right according to the step value to find adjacent encapsulation substructures. Here, the step value can be extended to the position range corresponding to 5 encapsulation substructures.

[0125] For example, see Figure 4 After a substructure at one end of the substructure in the first row is covered, the search continues along the row direction away from the covered substructure. Since the similarity value of the adjacent substructure, i.e., the substructure in the second column of the first row, is not up to standard, the search continues along the row direction away from the covered substructure. When it is determined that the substructure in the third column of the first row is not covered and the similarity value is up to standard, the substructure in the third column of the first row is taken as the flattening point of the substructure in the first row to improve the reliability of the flattening point as the reference point. The position corresponding to the end of the substructure in the third column of the first row that is close to the end of the substructure in the second column of the first row is taken as the first cutter endpoint of the cutting channel.

[0126] Step S850: After axially rotating the worktable used to support the flat leadless package structure at the flattening point to flatten the row package substructure, the first cutter endpoint for cutting the first channel is determined on the flat leadless package structure.

[0127] This can be understood as using the found package substructure as the flattening point of the package substructure in that row. The cutting equipment will use this flattening point to find the first cut, that is, to determine the endpoint of the first cut for cutting the first channel, so as to avoid the situation of cutting serially caused by the incorrect position of the first cut.

[0128] Using the above method, when it is determined that there is a covered or substandard package substructure in the flat leadless package structure, and the covered or substandard package substructure is the end of the package substructure in the row, the adjacent package substructures on both sides of the row direction are searched, and the found package substructures are used as the flattening points of the package substructure in the row. This allows for adjustment of the first cutter end position of the cutting channel, thus avoiding the cutting serialization caused by the incorrect first cutter position of the cutting equipment.

[0129] In some possible implementations, the method may further include the following steps:

[0130] Step S910: Based on the scanning and identification results of the flat leadless package structure attached to the carrier assembly, determine the quantity information corresponding to the flat leadless package structure and the position information corresponding to each flat leadless package structure.

[0131] Here, the barcodes on the flat, leadless package structure on the material carrier are identified by scanning the dock to determine the quantity information of the flat, leadless package structure and the location information of each flat, leadless package structure.

[0132] It should be noted that the material carrier assembly includes an iron ring and a film. The film is attached to the back of the iron ring, and the flat leadless package structure is attached to the film to enable the material carrier assembly to support the flat leadless package structure. When the cutting equipment cuts the flat leadless package structure, the material carrier assembly supporting the flat leadless package structure is placed on the worktable of the cutting equipment.

[0133] Step S920: Based on the quantity information corresponding to the flat leadless package structure and the position information corresponding to each flat leadless package structure, determine whether there is a material shortage area in the material carrier assembly.

[0134] Step S930: If there is a material shortage area, the cutting equipment will skip cutting the material shortage area when cutting the flat leadless package structure.

[0135] In existing cutting equipment, when a material shortage area appears in the material carrier component, the cutting equipment will trigger an alarm because there is no image corresponding to the packaged substructure in the material shortage area, requiring manual handling and thus interrupting the continuous cutting of the cutting equipment. Based on this, the above method can adjust the cutting channel according to the location information of the material shortage area when it is determined that there is a material shortage area in the material carrier component. This allows the cutting of the material shortage area to be skipped when cutting the flat leadless package structure, so that the cutting equipment can cut continuously and will not interrupt the cutting due to the alarm in the case of material shortage.

[0136] Figure 4This is a schematic diagram of a cutting device for a flat, leadless package structure according to an embodiment of the present invention, as shown below. Figure 4 As shown, the device is applied to a cutting equipment used to cut a flat, leadless package structure. The flat, leadless package structure includes multiple package substructures, which are arranged sequentially in the row and column directions, respectively, with the row direction perpendicular to the column direction. The device includes:

[0137] The cutting channel determination module 1010 is used to determine the cutting channel for the cutting device to cut the flat leadless package structure based on the position information of each package substructure in the flat leadless package structure to be cut; the cutting channel is a first channel for cutting each two adjacent rows of package substructures along the row direction, and a second channel for cutting each two adjacent columns of package substructures along the column direction.

[0138] The target position determination module 1020 is used to determine the target position on each first channel based on the length information of the first channel in the row direction.

[0139] The row cutting control module 1030 is used to cut the flat leadless package structure into multiple single-row package substructures from the opposite sides of the flat leadless package structure in the row direction to the target position, so as to cut the flat leadless package structure into multiple single-row package substructures.

[0140] The column cutting control module 1040 is used to cut multiple single-row package substructures along the second channel for each pair of adjacent package substructures to obtain multiple discrete package substructures.

[0141] In some possible implementations, the line-cutting control module 1030 includes:

[0142] A one-sided cutting unit is used to cut the flat leadless package structure along the first channel to the target position for each first channel of the flat leadless package structure along the row direction and located on one side of the target position, so as to obtain a flat leadless package structure cut on one side.

[0143] The other side cutting unit is used to cut the flat leadless package structure along the first channel to the target position for each first channel in the row direction and on the other side of the target position, so that all the first channels in the flat leadless package structure are cut.

[0144] In some possible implementations, the one-sided cutting unit includes:

[0145] The first position control subunit is used to control the movement of the worktable used to support the flat leadless package structure so that one end of the first channel to be cut is moved to a position corresponding to the cutting blade of the cutting equipment.

[0146] The first cutting start point determination subunit is used to determine the cutting start point for each first channel by taking the end point of the first channel closest to the cutting blade as the cutting start point and the target position on the first channel as the cutting end point.

[0147] A one-sided cutting subunit is used to control the cutting blade to move along the first channel from the cutting starting point to the cutting end point for each first channel, so as to obtain a flat, leadless package structure cut on one side.

[0148] In some possible implementations, the other side cutting unit includes:

[0149] The second position control subunit is used to control the rotation of the worktable so that the other side of the flat leadless package structure moves to the position corresponding to the cutting blade of the cutting equipment.

[0150] The second cutting start point determination sub-unit is used to determine the endpoint of the first channel to be cut that is closest to the cutting blade as the new cutting start point for each first channel.

[0151] The other side cutting subunit is used to control the cutting blade to move along the first channel to be cut from a new cutting starting point until the cutting blade moves to the cutting end point, so as to cut and separate each row of package substructures from the flat leadless package structure.

[0152] In some possible implementations, the column cutting control module 1040 includes:

[0153] The third position control subunit is used to control the movement of the worktable for each pair of adjacent packaging substructures so that one end of the second channel moves to the position corresponding to the cutting blade of the cutting device;

[0154] The three-sided cutting subunit is used to control the cutting blade to travel along the second channel from one end of the second channel near the cutting blade until each pair of adjacent encapsulation substructures are cut and separated.

[0155] In some possible implementations, the target position is the position corresponding to half the length of the first channel in the row direction.

[0156] In some possible implementations, the apparatus further includes:

[0157] The image acquisition module is used to acquire the target image to be identified; the target image is an image containing a flat, leadless package structure to be cut; the flat, leadless package structure includes a molding compound and package substructures arranged in an array within the molding compound;

[0158] The image recognition module is used to recognize the target image and determine the position information of each package substructure in the flat leadless package structure.

[0159] In some possible implementations, it also includes:

[0160] The first judgment module is used to determine whether there are any covered or non-compliant package substructures in the flat leadless package structure based on the position information of each package substructure in the flat leadless package structure to be cut.

[0161] The second judgment module is used to determine whether a covered or non-compliant encapsulated substructure is the end of its row of encapsulated substructures based on the position information of the covered or non-compliant encapsulated substructures.

[0162] The first flattening point determination module is used to determine the end of the package substructure in the row as the flattening point if the covered or similar value substructure is not the end of the package substructure in the row it belongs to.

[0163] The second flattening point determination module is used to find, on both sides of the row direction, an adjacent encapsulation substructure that is not covered and has a similarity value that meets the standard if the covered or similar value substructure is the end of the row encapsulation substructure. The found encapsulation substructure is used as the flattening point of the row encapsulation substructure.

[0164] The first cut endpoint determination module is used to determine the first cut endpoint for cutting the first channel on the flat leadless package structure after the worktable for supporting the flat leadless package structure is axially rotated at the flattening point to flatten the package substructure.

[0165] In some possible implementations, it also includes:

[0166] The information determination module is used to determine the quantity information of the flat leadless package structure and the position information of each flat leadless package structure based on the scanning and identification results of the flat leadless package structure attached to the material carrier assembly.

[0167] The missing material area determination module is used to determine whether there is a missing material area in the material carrier component based on the quantity information corresponding to the flat leadless package structure and the position information corresponding to each flat leadless package structure.

[0168] The equipment control module is used to ensure that the cutting equipment skips cutting areas with insufficient material when cutting the flat leadless package structure.

[0169] This disclosure provides an embodiment of a cutting device. Optionally, the cutting device includes a memory for storing processor-executable instructions; a processor configured to execute the executable instructions in the memory to implement the steps of the cutting device control method provided in this disclosure.

[0170] Figure 5 This is a schematic block diagram of a cutting device 110 according to an embodiment of the present invention.

[0171] like Figure 5 As shown, the cutting device 110 may include:

[0172] The system includes a memory 1101 and a processor 1102. The memory 1101 stores computer programs and transfers the program code to the processor 1102. In other words, the processor 1102 can retrieve and run the computer programs from the memory 1101 to implement the methods described in the embodiments of the present invention.

[0173] For example, the processor 1102 can be used to execute the above-described method embodiments according to instructions in the computer program.

[0174] In some embodiments of the present invention, the cutting device 110 may include, but is not limited to:

[0175] General-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0176] In some embodiments of the present invention, the memory 1101 includes, but is not limited to:

[0177] Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0178] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 1101 and executed by the processor 1102 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0179] like Figure 5 As shown, the cutting device 110 may further include:

[0180] Transceiver 1103, which can be connected to processor 1102 or memory 1101.

[0181] The processor 1102 can control the transceiver 1103 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 1103 may include a transmitter and a receiver. The transceiver 1103 may further include antennas, and the number of antennas may be one or more.

[0182] It should be understood that the various components in the cutting equipment are connected through a bus system, which includes a data bus, a power bus, a control bus, and a status signal bus.

[0183] The present invention also provides a computer storage medium having a computer program stored thereon, which, when executed by a computer, enables the computer to perform the methods of the above-described method embodiments. Alternatively, one embodiment of the present invention also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the methods of the above-described method embodiments.

[0184] When implemented using software, it can be implemented entirely or partially as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Video Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)).

[0185] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0186] In the several embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0187] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. For example, the functional modules in the various embodiments of this application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0188] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for cutting a flat, leadless package structure, applied to a cutting device, the cutting device being used to cut the flat, leadless package structure, the flat, leadless package structure comprising multiple package substructures, the multiple package substructures being arranged sequentially in a row direction and a column direction respectively, the row direction being perpendicular to the column direction, characterized in that... The method includes: Based on the position information of each of the package substructures in the flat leadless package structure to be cut, the cutting channel for the cutting device to cut the flat leadless package structure is determined; the cutting channel is a first channel for cutting each two adjacent rows of package substructures along the row direction, and a second channel for cutting each two adjacent columns of package substructures along the column direction. For each of the first channels, a target position is determined on the first channel based on the length information of the first channel in the row direction; the target position is the position corresponding to half the length of the first channel in the row direction. For each pair of adjacent package substructures, the flat leadless package structure is cut along the first channel corresponding to the two rows of package substructures from opposite sides in the row direction to the target position, so as to cut the flat leadless package structure into multiple single rows of package substructures. For each pair of adjacent encapsulation substructures, the multiple single-row encapsulation substructures are cut along the second channel to obtain multiple discrete encapsulation substructures.

2. The cutting method for the flat, leadless package structure according to claim 1, characterized in that, For each pair of adjacent rows of the package substructures, the flat, leadless package structure is cut from opposite sides in the row direction along the first channel corresponding to the two rows of package substructures to the target position, thereby cutting the flat, leadless package structure into multiple single rows of package substructures, including: For each of the first channels of the flat leadless package structure along the row direction and located on one side of the target position, the flat leadless package structure is cut along the first channel to the target position to obtain a flat leadless package structure cut on one side; For each of the first channels of the flat leadless package structure along the row direction and on the other side of the target position, the flat leadless package structure, which has been cut on one side, is cut along the first channel to the target position, so that all the first channels of the flat leadless package structure are cut.

3. The cutting method for the flat, leadless package structure according to claim 2, characterized in that, The step of cutting the flat, leadless package structure along each of the first channels in the row direction and located on one side of the target position to the target position, to obtain a flat, leadless package structure cut on one side, includes: The worktable used to support the flat leadless package structure is moved so that one end of the first channel to be cut is moved to a position corresponding to the cutting blade of the cutting device; For each of the first channels, the endpoint of the first channel closest to the cutting blade is taken as the cutting start point, and the target position on the first channel is taken as the cutting end point. For each of the first channels, the cutting blade is controlled to move along the first channel from the cutting starting point to the cutting end point, resulting in a flat, leadless package structure cut on one side. Accordingly, for each of the first channels of the flat leadless package structure along the row direction and located on the other side of the target position, the flat leadless package structure, which has been cut on one side, is cut along the first channel to the target position, so that all the first channels of the flat leadless package structure are cut, including: Control the worktable to rotate, so that the other side of the flat leadless package structure moves to a position corresponding to the cutting blade of the cutting device; For each of the first channels, the endpoint of the first channel to be cut that is closest to the cutting blade is taken as the new cutting starting point; For each of the first channels, the cutting blade is controlled to move along the first channel to be cut from the new cutting starting point until the cutting blade moves to the cutting ending point, so as to cut and separate each row of the package substructure from the flat leadless package structure.

4. The cutting method for the flat, leadless package structure according to claim 3, characterized in that, For each pair of adjacent encapsulation substructures, the multiple single-row encapsulation substructures are cut along the second channel to obtain multiple discrete encapsulation substructures, including: For each pair of adjacent packaging substructures, the worktable is controlled to move so that one end of the second channel moves to a position corresponding to the cutting blade of the cutting device; The cutting blade is controlled to travel along the second channel from one end of the cutting blade near the cutting blade until each pair of adjacent encapsulation substructures are cut and separated.

5. The cutting method for the flat, leadless package structure according to claim 1, characterized in that, Also includes: Acquire a target image to be identified; the target image is an image containing the flat, leadless package structure to be cut; the flat, leadless package structure includes a molding compound and package substructures arranged in an array within the molding compound; The target image is identified to determine the position information of each of the package substructures in the flat leadless package structure.

6. The cutting method for the flat, leadless package structure according to claim 5, characterized in that, Before cutting the flat, leadless package structure into multiple single-row package substructures from opposite sides of each of the two adjacent rows of package substructures in the row direction, the method further includes: Based on the position information of each of the package substructures in the flat leadless package structure to be cut, determine whether there are any package substructures that are covered or whose similarity values ​​do not meet the standard in the flat leadless package structure. If there is a covered or similarity value substructure, then based on the position information corresponding to the covered or similarity value substructure, it is determined whether the covered or similarity value substructure is the end of the substructure in the row it belongs to. If the covered or similarity value-deficient encapsulation substructure is not the end of the encapsulation substructure in the row it belongs to, then the end of the encapsulation substructure in that row will be used as the flattening point. If the covered or similarity value-deficient encapsulation substructure is the end of the encapsulation substructure in the row it belongs to, then find the adjacent encapsulation substructures that are not covered and have the similarity value on both sides of the row direction, so as to use the found encapsulation substructures as the flattening points of the encapsulation substructure in that row. After the flattening point is axially rotated by a worktable that supports the flat leadless package structure to flatten the package substructure, the first cut endpoint for cutting the first channel is determined on the flat leadless package structure.

7. The cutting method for the flat, leadless package structure according to any one of claims 1 to 6, characterized in that, Also includes: Based on the scanning and identification results of the flat leadless package structure attached to the material carrier assembly, the quantity information corresponding to the flat leadless package structure and the position information corresponding to each flat leadless package structure are determined. Based on the quantity information corresponding to the flat leadless package structure and the position information corresponding to each of the flat leadless package structures, it is determined whether there is a material shortage area in the material carrier assembly. If there is a missing material area, the cutting device will skip cutting the missing material area when cutting the flat leadless package structure.

8. A cutting device for a flat, leadless package structure, applied to a cutting equipment, the cutting equipment being used to cut the flat, leadless package structure, the flat, leadless package structure comprising a plurality of package substructures, the plurality of package substructures being arranged sequentially in a row direction and a column direction respectively, the row direction being perpendicular to the column direction, characterized in that, The device includes: The cutting channel determination module is used to determine the cutting channel for the cutting device to cut the flat leadless package structure based on the position information of each package substructure in the flat leadless package structure to be cut; the cutting channel is a first channel cutting every two adjacent rows of package substructures along the row direction, and a second channel cutting every two adjacent columns of package substructures along the column direction. The target position determination module is used to determine a target position on each of the first channels based on the length information of the first channel in the row direction; the target position is the position corresponding to half the length of the first channel in the row direction. The row cutting control module is used to cut the flat leadless package structure from the opposite sides of the two adjacent rows of the package substructures in the row direction to the target position along the first channel corresponding to the two rows of the package substructures, so as to cut the flat leadless package structure into multiple single rows of the package substructures. The column cutting control module is used to cut multiple single-row encapsulation substructures along the second channel for each pair of adjacent encapsulation substructures to obtain multiple discrete encapsulation substructures.

9. A cutting device, characterized in that, include: Memory is used to store processor-executable instructions; A processor is configured to execute executable instructions in the memory to implement the steps of the method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 7.

Images