Rotary water supply device for process chamber, water supply system and vapor deposition equipment
By using a rotating motor to drive the magnet assembly and deliver cooling water between the frame and the rotating shaft, the high cost, large space occupation, and high vibration problems of existing process chamber water supply systems are solved, achieving a low-cost, low-vibration, and high-sealing cooling solution.
Patent Information
- Application Number
- CN202511487542.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-17
- Publication Date
- 2026-01-16
AI Technical Summary
The existing water supply system for process chambers has problems such as high cost, large space occupation, large vibration, and easy damage to dynamic seals leading to water leakage.
A rotary motor directly drives the magnet assembly to rotate, and cooling water is supplied between the frame and the rotating shaft. A dynamic seal is located on top, and the ceramic dynamic seal structure is used to improve the sealing effect and reduce intermediate power transmission components.
It reduces equipment costs, space requirements, and vibration, prevents dynamic seal leakage, and improves sealing performance.
Smart Images

Figure CN121344544A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor equipment technology, and more specifically, relates to a rotating water supply device, water supply system and vapor deposition equipment for a process chamber. Background Technology
[0002] In modern industrial coating, magnetron sputtering is an important branch of physical vapor deposition (PVD) technology. An inert gas is filled into the process chamber, which is grounded and serves as the anode of the circuit. The target material is made of the material to be deposited and serves as the cathode.
[0003] Magnets are mounted on the back of the target to generate a closed magnetic field of a specific shape above the target surface. This magnetic field penetrates the target, forming a raceway above its front side to trap electrons. In the vacuum environment of the process chamber, the interaction of the magnetic and electric fields generates plasma that bombards the target with high energy, causing sputtering. In the sputtered particles, neutral target atoms or molecules deposit on the substrate, forming a dense thin film. The magnetic field can significantly enhance the plasma density while confining electrons to the vicinity of the target, greatly accelerating the sputtering frequency and deposition rate.
[0004] When the process chamber is in operation, the magnet needs to rotate. The rotation of the target and magnet generates a significant amount of heat, necessitating a sophisticated water supply system to cool them. Current traditional technologies suffer from drawbacks such as high cost, large space requirements, significant vibration, and the risk of leakage due to damage to dynamic seals.
[0005] For example Figure 1 As shown, a traditional rotating unit includes a pulley A and a driven part B inside it. The lower end of the driven part B is fixedly connected to a magnet. The pulley A is driven to rotate by a belt drive, which in turn drives the driven part B to rotate, thereby driving the magnet to rotate. This driving method requires intermediate power transmission components such as belts, resulting in high equipment costs. Since power is transmitted to the driven part from the side, it occupies a large lateral space, and the large number of transmission components leads to greater vibration.
[0006] In addition, the hollow shaft C located inside the driven part B is used to transport cooling water from above and output cooling water to the target and magnet area from below. Two sets of bearings D are installed between the driven part B and the hollow shaft C.
[0007] To facilitate bearing installation, pulley A and driven part B are designed as separate units, allowing for bearing installation from the end. However, from... Figure 1It can be seen that the dynamic seal E in the original design is located below the bearing. Once the dynamic seal leaks, the cooling water that originally entered the process chamber on the back of the target material from the hollow shaft will enter the gap between the hollow shaft and the driven part B from the dynamic seal E. After passing through the upper and lower bearings, it will overflow to the outside from the gap between the pulley A and the driven part B.
[0008] In view of this, it is necessary to improve the existing process chamber water supply mechanism to solve the defects such as high cost, large space occupation, large vibration, and water leakage caused by dynamic seal failure. Summary of the Invention
[0009] To address the above problems, this application provides a rotary water supply device for a process chamber, comprising: The frame includes a chassis, an intermediate cylinder, and a top cover. A rotary motor is installed on the upper end of the top cover. The chassis is used to install on the upper end of the process chamber. The space between the intermediate cylinder and the rotating shaft forms a water flow channel. A first water inlet hole is provided on the side wall of the intermediate cylinder. A first water outlet hole communicating with the process chamber is provided at the center of the chassis. A rotary motor, whose output shaft is coaxially connected to the rotating shaft; A rotating shaft passes through the intermediate cylinder and exits from the first water outlet. Its lower end is used to connect with the magnet assembly inside the process chamber, forming a water outlet channel between the first water outlet and the rotating shaft.
[0010] Optionally, the upper cover includes a connecting cylinder and a connecting plate integral with the upper and lower ends of the connecting cylinder. A rotary motor is fixedly connected to the upper end of the upper connecting plate, and two sets of bearings are installed between the inner side of the intermediate cylinder and the rotating shaft.
[0011] Optionally, the two sets of bearings are an upper bearing and a lower bearing. The rotating shaft has a large-diameter section with an increased diameter at the corresponding position of the bearing. A first shoulder is provided on the outer periphery of the upper large-diameter section. A retaining ring is also fitted on the upper end of the upper large-diameter section. The upper bearing is installed between the retaining ring and the first shoulder. A second shoulder is provided on the inner wall of the intermediate cylinder at a position aligned with the end face of the first shoulder. The upper end face of the second shoulder contacts the lower end of the outer ring of the upper bearing.
[0012] Optionally, a third shoulder is provided on the outer periphery of the lower large-diameter section, an embedding groove is provided in the circumferential direction of the lower large-diameter section, a baffle is installed in the embedding groove, a lower bearing is installed between the third shoulder and the baffle, a fourth shoulder is provided on the inner wall of the intermediate cylinder at a position aligned with the end face of the third shoulder, the end face of the fourth shoulder contacts the upper end of the outer ring of the lower bearing, and a retaining ring is integrally connected to the inner side of the upper end of the chassis, the retaining ring contacts the lower end of the outer ring of the lower bearing.
[0013] Optionally, a follower ceramic part is connected to the upper end of the retaining ring, and a sliding column is fixedly connected to the lower end of the lower connecting plate of the upper cover. A sliding ceramic part is provided at the upper end of the follower ceramic part, and the sliding ceramic part is sleeved on the sliding column. An elastic element is provided inside the connecting cylinder, and the lower end of the elastic element abuts against the upper end of the sliding ceramic part. The elasticity of the elastic element forms a dynamic sealing structure between the sliding ceramic part and the follower ceramic part.
[0014] Optionally, a water passage hole may be provided on the lower large-diameter section of the rotating shaft.
[0015] Optionally, a second water outlet is provided on the side of the intermediate cylinder opposite to the first water inlet.
[0016] Optionally, the upper end of the retaining ring has a circular groove, and the follower ceramic part is installed in the circular groove in a concave-convex fit.
[0017] Optionally, the water passage extends to the edge of the large-diameter section to form a water passage gap.
[0018] Optionally, a sealing ring is installed between the retaining ring and the follower ceramic part, and / or a sealing ring is installed between the sliding ceramic part and the connecting cylinder.
[0019] According to another aspect of this application, a rotary water supply system for a process chamber is provided, comprising: The rotary water supply device described above; The second water inlet is located at the upper end of the process chamber and communicates with the second water outlet. A return water hole is located at the upper end of the process chamber and is used to lead the cooling water in the process chamber back to the first water inlet hole.
[0020] According to another aspect of this application, a vapor deposition apparatus is also provided, including a process chamber, a magnet assembly, a target material, a substrate support, a radio frequency source, and the aforementioned rotating water supply system.
[0021] This application is applicable not only to the target material and magnet cooling of magnetron sputtering cavities, but also to magnetron multifunctional coating machines. Compared with the prior art, this application has the following advantages: (1) Traditional process chamber cooling water supply requires the use of a hollow shaft to transport cooling water. The use of a rotary motor and intermediate power transmission components such as belts to transmit power to the rotating unit on the outer periphery of the hollow shaft results in high equipment cost. In contrast, this application directly uses a rotary motor to provide rotational power to the magnet assembly and transports cooling water in the space between the frame and the rotating shaft, reducing intermediate power transmission components and lowering equipment cost.
[0022] (2) Since this application does not require the installation of intermediate power transmission components from the side, but instead installs the rotary motor at the upper end of the rotating shaft, the lateral space occupied is small, which can provide more space for the operator to move around.
[0023] (3) This application directly connects the rotary motor and the rotary shaft coaxially to drive the magnet assembly to rotate, reducing intermediate power transmission components and reducing equipment vibration.
[0024] (4) The dynamic seal is set above the first water inlet and through the second water outlet, which can ensure that the cooling water will not rise to the dynamic seal, thereby preventing leakage at the dynamic seal.
[0025] (5) This application adopts a ceramic dynamic sealing structure, which has excellent wear resistance and improves the sealing effect. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of a rotating unit for water supply in a process chamber of existing technology.
[0027] Figure 2 This is a cross-sectional view of a rotating water supply device for a process chamber according to an embodiment of this application.
[0028] Figure 3 This is a three-dimensional schematic diagram of the interior of a rotating water supply device for a process chamber according to an embodiment of this application.
[0029] Figure 4 This is a schematic diagram of a rotating water supply system for a process chamber according to an embodiment of this application.
[0030] Figure label: A. Pulley, B. Driven part, C. Hollow shaft, D. Bearing, E. Dynamic seal, Frame 1, Rotary water supply device 100, Chassis 101, Connecting cam 1011, First connecting through hole 1012, Retaining ring 1013, Second connecting through hole 1014, First water outlet 1015, Intermediate cylinder 102, First water inlet 1021, Second shoulder 1022, Fourth shoulder 1023, Second water outlet 1024, Upper cover 103, Lower connecting plate 1031, Connecting cylinder 1032, Upper connecting plate 1 033, sliding column 1034, rotary motor 2, rotating shaft 3, upper bearing 301, lower bearing 302, first shoulder 303, third shoulder 304, retaining ring 305, follower ceramic part 306, protrusion 3061, pit 3062, sliding ceramic part 307, elastic element 308, water passage hole 309, baffle plate 310, magnet assembly 4, magnet connecting plate 401, magnet 402, process chamber 500, second water inlet hole 501, water return hole 502, target material 600. Detailed Implementation
[0031] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0032] In the absence of a magnetic field, electrons emitted from the target surface, under the influence of an electric field, will fly almost in a straight line towards the substrate and the vacuum cavity wall at high speed. The chance of electrons colliding with argon atoms and generating plasma is very small, resulting in extremely low efficiency. By placing a magnet behind the target, a specific magnetic field distribution is formed above the target surface. When electrons move in the magnetic field, they are subjected to the Lorentz force, which constantly changes their direction of motion. Electrons no longer fly in a straight line but instead move in a spiral motion around the magnetic field lines. The Lorentz force generated by the magnetic field continuously drives the electrons to circle, effectively confining them within the magnetic field region near the target surface. During their spiraling motion within the magnetic field, electrons collide with a large number of argon atoms. Each collision has a high probability of ionizing the argon atoms, thus generating an exceptionally dense plasma within this magnetic field region on the target surface.
[0033] However, with a fixed magnet design, the plasma is confined to the region of strongest magnetic field lines. This causes sputtering to concentrate only in this narrow area. As a result, the target is quickly eroded in this region, while other areas of the target are almost unused. Target utilization is typically very low, only 20%-30%. By rotating the magnet behind the target, as the magnet rotates, the sputtering erosion is evenly distributed over a ring-shaped or wider area as the magnetic field sweeps across the entire target surface. This greatly avoids localized erosion and improves target utilization. Moreover, during deposition, the atomic flux received by the substrate becomes uniform over time, resulting in a significant improvement in the uniformity of film thickness across the entire substrate.
[0034] However, during the processing in the chamber, both the target material and the rotating magnet generate a significant amount of heat. Current solutions, such as those described in patent application (201880046250.5), involve supplying cooling water to the area above the target material along a hollow central axis to cool both the magnet and the target. The magnet's rotation is achieved by, for example, a gear-driven mechanism that rotates a main body located around the central axis, transmitting rotational power to the magnet. This driving method results in the drive motor being positioned on the side and incorporating a gear transmission structure, thus occupying a large space. Furthermore, since the motor does not directly drive the magnet's rotation, but rather transmits power through gear meshing, the resulting vibrations are significant.
[0035] According to one aspect of this application, this embodiment provides a rotary water supply device 100 for a process chamber, including a frame 1 for mounting a rotary motor and forming a water flow channel between the frame 1 and the rotary shaft, and mounting the rotary water supply system on the upper end of the process chamber; a rotary motor 2, mounted on the frame 1, with its output shaft coaxially connected to the rotary shaft to provide rotational power to the rotary shaft; and a rotary shaft 3, the lower end of which is connected to a magnet assembly 4 to drive the magnet assembly 4 to rotate.
[0036] The frame 1 is cylindrical and includes a base 101, an intermediate cylinder 102, and a top cover 103. It can be assembled from these components or integrally formed, for example, by casting. The base 101 is disc-shaped, with a connecting cam 1011 coaxially arranged at its upper end. A first connecting through hole 1012 is provided on the base 101 corresponding to the position of the connecting cam 1011. The first connecting through holes 1012 can be evenly distributed along the circumference of the connecting cam. For example, six first connecting through holes 1012 are evenly distributed along the circumference. The first connecting through holes 1012 are used to pass through connecting bolts to fix the base 101 and the intermediate cylinder 102.
[0037] The chassis 101 also has a plurality of second connecting through holes 1014 on the outer periphery of the connecting cam 1011. These second connecting through holes 1014 are used to mount the chassis 101 onto the top cover of the process chamber. Specifically, the top cover of the process chamber may have threaded mounting holes. Connecting bolts are passed through the second connecting through holes 1014 and screwed into the threaded mounting holes to mount the chassis 101 onto the top cover of the process chamber. More specifically, the chassis 101 is fixedly connected to the upper end of the top cover of the process chamber through the second connecting through holes 1014.
[0038] A sealing ring mounting groove is provided on the top surface of the connecting cam 1011, in which a sealing ring is installed. There can be one or more sealing ring mounting grooves; for example, the figure shows one sealing ring mounting groove. The sealing ring can be an O-ring, and the diameter of the O-ring is approximately the same as the diameter of the sealing ring mounting groove. The O-ring is installed into the sealing ring mounting groove, protruding a portion of the groove, to facilitate compression of the O-ring during intermediate cylinder installation, using the deformation of the O-ring to seal the contact end face.
[0039] A retaining ring 1013 is integrally connected to the inner side of the upper end of the connecting cam 1011. The retaining ring 1013 is used to limit the bearing installed in the intermediate cylinder 102. The thickness of the retaining ring 1013 is less than or equal to the thickness of the outer ring of the bearing, so that the end of the retaining ring 1013 abuts against the end of the outer ring of the bearing, thereby restricting the axial movement of the outer ring of the bearing.
[0040] The intermediate cylinder 102 is a cylindrical shape with openings at both ends. A threaded mounting hole is provided at its lower end, corresponding to the position of the first connecting through hole. A connecting bolt passes through the first connecting through hole and screws into the threaded mounting hole, fixing the intermediate cylinder 102 to the upper end of the connecting cam 1011. Furthermore, the first connecting through hole 1011 on the chassis 101 can be a countersunk hole; specifically, it is a two-stage stepped hole with a lower section diameter larger than the upper section diameter. This allows the head of the connecting bolt to be recessed into the larger diameter lower section hole, forming a flat surface on the lower surface of the chassis. This structure allows the chassis 101 to be stably installed on the top cover of the process chamber through the second connecting through hole 1014.
[0041] The intermediate cylinder 102 has a first water inlet hole 1021 on its side wall for introducing cooling water. The cooling water enters the intermediate cylinder 102 through the first water inlet hole 1021 and flows into the chassis 101 from the lower end of the intermediate cylinder 102. The cooling water can be deionized water to prevent impurities from entering the process chamber.
[0042] The upper cover 103 is cylindrical and includes a connecting cylinder 1032 and connecting discs fixedly connected to its upper and lower ends, respectively. Specifically, it consists of an upper connecting disc 1033 connected to the upper end of the connecting cylinder 1032 and a lower connecting disc 1031 connected to the lower end of the connecting cylinder 1032. The lower connecting disc 1031 is used to fixally connect to the upper end of the intermediate cylinder 102. Specifically, a third connecting through hole is provided on the lower connecting disc 1031, which can be evenly distributed along its circumference. A connecting threaded hole is provided at the upper end of the intermediate cylinder 102, and the connecting threaded hole is aligned with the third connecting through hole. A connecting bolt is passed through the third connecting through hole and screwed into the connecting threaded hole to install the lower connecting disc 1031 at the upper end of the intermediate cylinder 102.
[0043] The upper end of the upper connecting plate 1033 is fixedly connected to a rotary motor 2. The end of the rotary motor 2 is fixedly connected to the upper connecting plate 1033 by connecting bolts, and the output shaft of the rotary motor 2 extends into the connecting cylinder 1032.
[0044] The lower end of the output shaft of the rotary motor 2 is coaxially fixedly connected to a rotating shaft 3, which extends into the intermediate cylinder 102 and is used to drive the magnet assembly 4 to rotate. The magnet assembly 4 includes a magnet connecting plate 401 and multiple magnets 402 mounted on the magnet mounting plate 401. The multiple magnets 402 can be evenly arranged around the rotating shaft 3. The magnet connecting plate 401 can be fixedly connected to the lower end of the rotating shaft 3 that extends into the process chamber, so that the magnets 402 on the magnet connecting plate 401 can rotate around the rotating shaft 3 under the drive of the rotary motor 2.
[0045] This application directly uses a rotary motor to provide rotational power to the magnet assembly, with cooling water supplied within the space between the frame and the rotating shaft. This reduces intermediate power transmission components and lowers equipment costs. Furthermore, by eliminating the need for lateral installation of intermediate power transmission components and mounting the rotary motor on top of the rotating shaft, lateral space is minimized, providing more room for operator movement. The application also directly coaxially connects the rotary motor to the rotating shaft to drive the magnet assembly's rotation, further reducing intermediate power transmission components and minimizing equipment vibration.
[0046] Two sets of bearings, namely an upper bearing 301 and a lower bearing 302, are installed between the inner side of the intermediate cylinder 102 and the rotating shaft 3. For connection with the bearings, the rotating shaft 3 has a large-diameter section with an increased diameter at corresponding positions at the upper and lower parts. A first shoulder 303 is provided on the outer circumference of the upper large-diameter section, and the diameter of the first shoulder 303 is larger than the diameter of the upper large-diameter section. The end face of the first shoulder 303 protruding beyond the diameter of the upper large-diameter section faces upwards. A retaining ring 305 is also fitted onto the upper end of the upper large-diameter section, and the diameter of the retaining ring 305 exceeds the diameter of the upper large-diameter section. The upper bearing 301 is installed between the retaining ring 305 and the first shoulder 303. The lower end face of the retaining ring 305 contacts and limits the upper end of the inner ring of the upper bearing 301, and the upper end face of the first shoulder 303 contacts and limits the lower end of the inner ring of the upper bearing 301. A second shoulder 1022 is provided on the inner wall of the intermediate cylinder 102 at a position aligned with the end face of the first shoulder 303. The upper end face of the second shoulder 1022 contacts the lower end of the outer ring of the upper bearing 301, thereby installing the upper bearing 301 between the rotating shaft 3 and the intermediate cylinder 102.
[0047] Similarly, a third shoulder 304 is provided on the outer periphery of the lower large-diameter section, and the diameter of the third shoulder 304 is larger than the diameter of the lower large-diameter section. The end face of the third shoulder 304 protruding from the diameter of the lower large-diameter section faces downward. The end face of the third shoulder contacts the upper end of the inner ring of the lower bearing 302. An insert groove is provided in the circumferential direction of the lower large-diameter section, and a baffle 310 is installed in the insert groove. The diameter of the baffle 310 is larger than the diameter of the lower large-diameter section, and its upper end face contacts the lower end of the inner ring of the lower bearing 302.
[0048] A fourth shoulder 1023 is provided on the inner wall of the intermediate cylinder 102 at a position aligned with the end face of the third shoulder 304. The end face of the fourth shoulder 1023 contacts the upper end of the outer ring of the lower bearing 302, and the retaining ring 1013 contacts the lower end of the outer ring of the lower bearing 302. The fourth shoulder 1023 and the retaining ring 1013 restrict the axial movement of the outer ring of the lower bearing.
[0049] The rotating shaft 3 is supported by the upper and lower bearings and can rotate to transmit rotation to the magnet mounting plate 401, thereby allowing the magnet to rotate.
[0050] The retaining ring 305 is disposed on the outer periphery of the rotating shaft 3. A follower ceramic part 306 is fixedly connected to the upper end of the retaining ring 305. The follower ceramic part 306 is circular, and the upper end face of the retaining ring 305 has a circular groove. The follower ceramic part 306 is installed in the circular groove, which can be installed in the circular groove of the retaining ring 305 by connecting bolts. Therefore, as the rotating shaft rotates, the follower ceramic part 306 rotates accordingly.
[0051] Alternatively, the follower ceramic part 306 can be installed without connecting bolts, and it can also be installed in the circular groove in a convex-concave fit with the circular groove. For example, one or more recesses 3062 are provided in the circumferential direction of the follower ceramic part 306, preferably at least two recesses 3062, and the recesses 3062 are arranged symmetrically about the center of the follower ceramic part 306, for example, two recesses 3062 are arranged symmetrically at 180°. Correspondingly, a corresponding number of protrusions 3061 are provided in the circumferential direction of the circular groove, their positions corresponding to the positions of the recesses. The protrusions 3061 are inserted into the recesses 3062, thereby transmitting rotational power.
[0052] A second sealing ring mounting groove is provided on the upper end face of the retaining ring 305, and a sealing ring is installed in the second sealing ring mounting groove.
[0053] A sliding post 1034 is fixedly connected to the lower end of the upper cover 103, and a sliding ceramic part 307 is provided at the upper end of the follower ceramic part 306. The sliding ceramic part 307 is cylindrical, and a mounting plate is integrally formed on its outer wall. The sliding post 1034 passes through the mounting plate to slide the sliding ceramic part 307 to the lower end of the lower connecting plate 1031 of the upper cover 103. A dynamic contact seal is formed between the sliding ceramic part 307 and the follower ceramic part 306.
[0054] An elastic element 308 is provided inside the connecting cylinder 1032. The elastic element can be a spring, rubber component, etc. The upper end of the elastic element is fixed inside the connecting cylinder 1032, and the lower end abuts against the upper end of the sliding ceramic part 307. The elasticity of the elastic element forms a tight dynamic seal between the sliding ceramic part 307 and the following ceramic part 306. Ceramic has excellent wear resistance, which can improve the sealing effect of the dynamic seal.
[0055] A water passage hole 309 is provided on the lower large-diameter section of the rotating shaft 3. There can be multiple water passage holes 309, which can extend to the edge of the large-diameter section, forming a water passage gap. Cooling water can flow downwards through the water passage hole 309. The center of the chassis 101 has a first water outlet hole 1015. An annular space for cooling water to flow out is formed between the first water outlet hole 1015 and the rotating shaft 3. Cooling water entering from the first water inlet hole 1021 enters the annular space between the rotating shaft and the intermediate cylinder 102, passes through the water passage hole 309, and flows out into the process chamber from the annular space between the first water outlet hole 1015 and the rotating shaft 3. The cooling water flowing out from the first water outlet hole 1015 enters the space above the target material to cool the target material and the magnet.
[0056] During the rotation of the rotating shaft, the upper bearing can have a certain axial floating, which can adapt to the axial vibration of the rotating shaft. In addition, the elastic element has a certain degree of extensibility, which allows it to change its elongation with the vibration of the rotating shaft, thereby effectively pressing against the sliding ceramic part 307. This allows a reliable seal to be formed between the sliding ceramic part 307 and the follower ceramic part 306.
[0057] Because dynamic seals are more prone to leakage than static seals, in the prior art, the dynamic seal is located at the bottom, which easily leads to cooling water leakage after the dynamic seal fails. In this application, the dynamic seal is located above the upper bearing, while the first inlet and second outlet are both below the dynamic seal. When the water pressure is too high, the second outlet can be opened, ensuring that the cooling water between the rotating shaft and the intermediate cylinder does not rise to the dynamic seal between the sliding ceramic part 307 and the follower ceramic part 306, thereby reducing the possibility of cooling water leakage from the dynamic seal.
[0058] In some embodiments, a second water outlet 1024 is provided on the side of the intermediate cylinder 2 opposite to the first water inlet 1021. When the flow rate of cooling water is too large and cannot be discharged from the first water outlet 1015 in time, it will cause excessive water pressure. In order to prevent cooling water from leaking from the dynamic seal between the upper sliding ceramic part 307 and the follower ceramic part 306, the second water outlet 1024 can also play a diversion role, guiding the water from the side wall to the lower target material for cooling. When the water pressure is not large enough to leak from the dynamic seal between the upper sliding ceramic part 307 and the follower ceramic part 306, the second water outlet 1024 can also be blocked with a blind plate, which can increase the flow rate of the first water outlet 1015. The specific situation can be judged according to the water flow rate.
[0059] Furthermore, an observation window can be provided on the intermediate cylinder 102 to observe the water flow. If the water flow is large enough to rise to near the dynamic seal between the sliding ceramic part 307 and the follower ceramic part 306, the second water outlet 1024 can be opened.
[0060] According to another aspect of this application, a rotary water supply system for a process chamber is provided, including the aforementioned rotary water supply device 100, for supplying cooling water to the process chamber 500 while driving the magnet assembly 4 to rotate; a second water inlet 501, disposed at the upper end of the process chamber 500 and communicating with the second water outlet 1024, for introducing the cooling water flowing out of the second water outlet 1024 into the process chamber 500; and a return water hole 502, disposed at the upper end of the process chamber 500, for leading the cooling water in the process chamber after cooling the magnet assembly 4 back to the first water inlet 1021.
[0061] The lower end of the output shaft of the rotary motor 2 is coaxially fixedly connected to a rotating shaft 3, which extends into the intermediate cylinder 102 and is used to drive the magnet assembly 4 to rotate. The magnet assembly 4 includes a magnet connecting plate 401 and multiple magnets 402 mounted on the magnet mounting plate 401. The multiple magnets 402 can be evenly arranged around the rotating shaft 3. The magnet connecting plate 401 can be fixedly connected to the lower end of the rotating shaft 3 that extends into the process chamber, so that the magnets 402 on the magnet connecting plate 401 can rotate around the rotating shaft 3 under the drive of the rotary motor 2.
[0062] Cooling water enters the cavity between the rotating shaft 3 and the intermediate cylinder 102 through the first inlet 1021, and flows out into the process chamber 500 through the annular space between the first outlet 1015 and the rotating shaft, that is, into the space above the target material 600, to cool the magnet assembly and the target material 600. After exchanging heat with the magnet assembly and the target material 600, the cooling water returns to the first inlet 1021 through the return water hole 502.
[0063] It should be noted that the cooling water coming out of the return water hole 502 needs to be cooled before returning to the first water inlet hole 1021. Specifically, a heat exchanger can be used to cool the cooling water. After exchanging heat with the heat exchanger, the cooled water returns to the first water inlet hole 1021 and is circulated for cooling the target material and magnet assembly.
[0064] In addition, a liquid pump is provided to enable the cooling water to circulate. The liquid pump can be located between the heat exchanger and the first water inlet 1021.
[0065] According to another aspect of this application, a vapor deposition apparatus is also provided, which can be a target and magnet cooling chamber for magnetron sputtering, or a magnetron multifunctional coating machine. It includes the aforementioned rotating water supply system; a process chamber 500 for providing a vacuum environment, with the process chamber grounded as the anode and the rotating water supply system mounted on its upper end; a target 600 made of the material to be deposited, serving as the cathode; a magnet assembly 4 for generating a closed magnetic field of a specific shape above the target surface; a substrate support for placing the substrate to be processed; and a radio frequency source for applying a high voltage between the target and the substrate to form plasma.
[0066] An inert gas, such as argon, is filled into the process chamber. A radio frequency source applies a high voltage between the target and the substrate, causing the argon gas to undergo glow discharge. Electrons are accelerated and collide with argon atoms, ionizing them into argon ions and more electrons, forming a stable plasma. The positively charged argon ions are accelerated under the influence of the electric field and bombard the target surface with extremely high energy. The sputtered target atoms fly towards the substrate with high kinetic energy, and these atoms form a thin film on the substrate surface.
[0067] The magnetic field generated by the rotation of magnet assembly 4 confines electrons near the target surface, causing them to spiral. This significantly increases the probability of collisions between electrons and argon atoms, thus generating high-density plasma even at lower gas pressures and voltages. This results in higher sputtering rates and less thermal damage to the substrate.
[0068] The heat generated by the rotation of the magnet assembly is cooled by the rotating water supply system. The cooling water enters the cavity between the rotating shaft 3 and the intermediate cylinder 102 from the first water inlet 1021 of the intermediate cylinder 102, and flows out into the process chamber 500 through the annular space between the first water outlet 1015 and the rotating shaft 3, that is, into the space above the target material 600 to cool the magnet assembly and the target material 600. After the cooling water exchanges heat with the magnet assembly and the target material 600, it returns to the first water inlet 1021 from the return water hole 502.
[0069] When the target material is locally overheated, uneven thermal expansion and contraction can generate enormous internal stress, leading to cracking or even breakage. Uniform and effective cooling of the target material allows vapor deposition equipment to operate at higher power, thereby improving sputtering rates and production efficiency.
[0070] If the magnet operates at too high a temperature, its magnetism weakens drastically, making it impossible to maintain a strong magnetic field. Consequently, the plasma cannot be effectively confined to the target surface, and the sputtering rate decreases. Cooling the magnet assembly ensures that the magnetic field strength and distribution remain stable, thereby guaranteeing the plasma density and the repeatability of the sputtering process.
[0071] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications are all within the protection scope of the claims of the present invention.
Claims
1. A rotating water supply apparatus for a process chamber, comprising: The utility model relates to a rotating water supply device for magnetron sputtering system, comprising: a frame, including a base plate, a middle cylinder and an upper cover, a rotary motor is installed on the upper end of the upper cover, the base plate is used for installing on the upper end of a process chamber, the space between the middle cylinder and a rotating shaft forms a water flow channel, a first water inlet hole is formed on the side wall of the middle cylinder, and the center of the base plate is provided with a first water outlet hole communicated with the process chamber; a rotary motor, the output shaft of which is coaxially connected with the rotating shaft; a rotating shaft, which passes through the middle cylinder and penetrates out of the first water outlet hole, and the lower end of the rotating shaft is used for being connected with a magnet assembly in the process chamber, and a water outlet channel is formed between the first water outlet hole and the rotating shaft.
2. The rotating water supply apparatus for a process chamber of claim 1, wherein, The upper cover comprises a connecting cylinder and a connecting disc integrally formed on the upper and lower ends of the connecting cylinder, the upper end of the upper connecting disc is fixedly connected with a rotary motor, and two sets of bearings are installed between the inner side of the middle cylinder and the rotating shaft.
3. The rotating water supply apparatus for a process chamber of claim 2, wherein, The two sets of bearings are an upper bearing and a lower bearing, the rotating shaft has a large-diameter section with an increased diameter at the corresponding position of the bearings, a first shoulder is arranged on the outer periphery of the upper large-diameter section, a retaining ring is further sleeved on the upper end of the upper large-diameter section, the upper bearing is installed between the retaining ring and the first shoulder, a second shoulder is arranged on the inner wall of the middle cylinder and aligned with the end face of the first shoulder, and the upper end face of the second shoulder is in contact with the lower end of the outer ring of the upper bearing.
4. The rotating water supply apparatus for a process chamber of claim 3, wherein, A third shoulder is arranged on the outer periphery of the lower large-diameter section, an embedded groove is arranged in the circumferential direction of the lower large-diameter section, a retaining piece is installed in the embedded groove, the lower bearing is installed between the third shoulder and the retaining piece, a fourth shoulder is arranged on the inner wall of the middle cylinder and aligned with the end face of the third shoulder, and the end face of the fourth shoulder is in contact with the upper end of the outer ring of the lower bearing.
5. The rotating water supply apparatus for a process chamber of claim 4, wherein, A retaining ring is further integrally connected to the inner side of the upper end of the base plate, and the retaining ring is in contact with the lower end of the outer ring of the lower bearing.
6. The rotating water supply apparatus for a process chamber of claim 5, wherein, A follow-up ceramic part is connected to the upper end of the retaining ring, a sliding column is fixedly connected to the lower end of the lower connecting disc of the upper cover, a sliding ceramic part is arranged on the upper end of the follow-up ceramic part, the sliding ceramic part is sleeved on the sliding column, and an elastic element is arranged in the connecting cylinder.
7. The rotating water supply apparatus for a process chamber of claim 6, wherein, The lower end of the elastic element abuts against the upper end of the sliding ceramic part, and the sliding ceramic part and the follow-up ceramic part form a dynamic sealing structure through the elasticity of the elastic element.
8. The rotating water supply apparatus for a process chamber of claim 6, wherein, A water passing hole is arranged on the lower large-diameter section of the rotating shaft.
9. The rotating water supply apparatus for a process chamber of claim 6, wherein, A second water outlet hole is arranged on the side of the middle cylinder opposite to the first water inlet hole.
10. The rotating water supply apparatus for a process chamber of claim 6, wherein, The upper end of the retaining ring has a circular groove, and the follow-up ceramic part is installed in the circular groove in the form of concave-convex matching.
11. A rotating water supply system for a process chamber, comprising: The water passing hole extends to the edge of the large-diameter section to form a water passing gap. Sealing rings are installed between the retaining ring and the follow-up ceramic part, and / or between the sliding ceramic part and the connecting cylinder. The utility model relates to a rotating water supply device for magnetron sputtering system, comprising: the rotating water supply device of claim 7; 12. A vapour deposition apparatus characterised by a second water inlet hole arranged on the upper end of the process chamber and communicated with the second water outlet hole; a water return hole arranged on the upper end of the process chamber and used for leading out the cooling water in the process chamber to return to the first water inlet hole. The utility model relates to a rotating water supply device for magnetron sputtering system, comprising: a process chamber, a magnet assembly, a target material, a substrate support, a radio frequency source and the rotating water supply system of claim 11.
Citation Information
Patent Citations
Cathode assembly having a dual position magnetron and centrally fed coolant
CN111033683A