Integrated circuit aging test fixture

Abstract

The invention discloses an integrated circuit aging test fixture, which comprises a fixture base, a fixture upper cover connected with the fixture base, and a temperature control module with an independent temperature control system, the temperature control module comprises a structure body, and a control module, a temperature sensor, a heating driving module and a heating rod which are arranged on the structure body; the control module is installed on one side of the structure body, and the heating driving module is installed on the other side of the structure body. The temperature sensor is used for collecting temperature data of the to-be-tested device; the control module is used for obtaining temperature data collected by the temperature sensor and controlling the working state of the heating driving module according to the temperature data; and the heating driving module is used for controlling the heating power of the heating rod. According to the aging test fixture, the aging temperature can be independently controlled without depending on external equipment, and the complexity of the aging test of the integrated circuit and the dependence on high-end aging test equipment can be reduced.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit testing, and more specifically to an integrated circuit aging test fixture. Background Technology

[0002] With the increasingly widespread application of integrated circuits in various technological fields such as civilian, military, and aerospace, the reliability requirements for integrated circuits are also becoming increasingly stringent. To ensure the reliability of integrated circuits, in addition to strengthening considerations in product design, material selection, and process quality during the early device design stages, aging testing has become a crucial reliability verification and evaluation method. Aging testing is currently the most commonly used and effective reliability screening test method. It involves applying certain stress conditions such as current, voltage, and temperature to the device under test for a specific period of time. Through the combined effect of electrical and thermal stress, most potential material and process defects within the device can be more fully activated, inducing related failures in the device under test. This eliminates some devices that fail early or barely pass the test, improving device reliability and ensuring the quality of products leaving the factory.

[0003] In existing technologies, there are generally two ways to conduct aging tests on integrated circuits: Method 1 uses a load board with soldered components and chip sockets as a base, mounts the device under test (DUT) on the sockets of the load board, and then places the entire load board in a high-temperature chamber to apply current, voltage, and temperature stress to the DUT to achieve the aging purpose. This method is suitable for aging tests of low-power devices with low self-heating. Method 2 uses an aging test fixture with built-in heating and temperature acquisition modules. The DUT is mounted in the test fixture on the load board, and current and voltage stress are applied to the load board, while temperature stress is applied to the fixture to achieve the aging test of the DUT. This method is suitable for aging tests of high-power devices.

[0004] The aging test fixtures used in Method 2 generally suffer from the following problems due to their embedded complex electronic modules, such as temperature acquisition modules, heating modules, and heat dissipation modules:

[0005] (1) The overall structure is relatively complex, and the electrical components such as temperature acquisition, heating and heat dissipation are integrated with the fixture body. Failure of related modules will cause the entire fixture to become unusable, and the replacement cost is high.

[0006] (2) It requires the use of external control equipment to achieve its temperature control function;

[0007] (3) The independent temperature-controlled aging test fixtures of different devices are not compatible;

[0008] (4) Temperature acquisition accuracy is low and is greatly affected by external control equipment. Summary of the Invention

[0009] This invention provides an integrated circuit aging test fixture to reduce the complexity of integrated circuit aging tests and the dependence on high-end aging test equipment, enabling the fixture itself to independently complete temperature acquisition and heating control operations.

[0010] Therefore, the embodiments of the present invention provide the following technical solutions:

[0011] An integrated circuit aging test fixture includes: a fixture base, a fixture cover connected to the fixture base, and a temperature control module with an independent temperature control system;

[0012] The temperature control module includes a structural body, and a control module, a temperature sensor, a heating drive module, and a heating rod disposed on the structural body; the control module is installed on one side of the structural body, and the heating drive module is installed on the other side of the structural body.

[0013] The temperature sensor is used to collect temperature data of the device under test;

[0014] The control module is used to acquire temperature data collected by the temperature sensor and control the working state of the heating drive module according to the temperature data.

[0015] The heating drive module is used to control the heating power of the heating rod.

[0016] Optionally, the clamp cover includes: a cover body and a mounting component;

[0017] The mounting component is used to mount the temperature control module onto the upper cover body.

[0018] Optionally, the upper cover body is a frame structure; the mounting component is a hollow frame structure adapted to the frame structure; and the temperature control module is installed in the hollow area of ​​the frame structure.

[0019] Optionally, the mounting component has vertically outward extending structures on both sides; the structural body is provided with mounting and fixing buckles on both sides, and the mounting and fixing buckles are connected to the structural body through a spring structure;

[0020] After the temperature control module is placed on the mounting component, the mounting and fixing buckle engages with the extension structure.

[0021] Optionally, the mounting component is provided with a positioning structure for positioning the temperature control module when it is placed.

[0022] Optionally, a first mounting hole is provided on one side of the structure body; a second mounting hole is provided on the other side of the structure body;

[0023] The control module includes: a control board and a first protective shell that is snapped onto the outside of the control board; the control board and the first protective shell are provided with through holes, and the control module is fixed to the structural body by screws passing through the through holes and the first mounting holes;

[0024] The heating drive module includes a drive board and a second protective shell that is snapped onto the outside of the drive board; the drive board and the second protective shell are provided with through holes, and the heating drive module is fixed to the structural body by screws passing through the through holes and the second mounting holes.

[0025] Optionally, the control board is provided with a first set of probes, and the driver board is provided with a second set of probes;

[0026] The fixture also includes a load plate that is connected to the bottom surface of the fixture base. The load plate is provided with a probe base for inserting the first set of probes and the second set of probes, so that the temperature control module establishes an electrical connection with the load plate.

[0027] The probe is used to transmit power signals and / or data signals.

[0028] Optionally, the control board and the driver board are provided with hardware circuitry, the hardware circuitry including:

[0029] The processor, temperature signal analog-to-digital conversion circuit, and power signal analog-to-digital conversion circuit are installed on the control board.

[0030] The drive power acquisition circuit and drive control circuit are installed on the drive board.

[0031] The temperature signal analog-to-digital conversion circuit is used to convert the temperature-related analog signal collected by the temperature sensor into a digital signal, and transmit the converted temperature data to the processor.

[0032] The drive power acquisition circuit is used to acquire the power signal of the heating rod;

[0033] The power signal digital-to-analog converter circuit is used to convert the power signal into a digital signal and transmit the converted power data to the processor.

[0034] The processor is used to run temperature control-related applications, send heating control signals to the drive control circuit according to the temperature data and the power data, and also to obtain the working current and leakage current data of the heating rod through the power signal digital-to-analog conversion circuit, and transmit the current data to the external control system.

[0035] The drive control circuit is used to convert the heating control signal into a drive signal that drives the heating rod to work.

[0036] Optionally, the control board is further provided with a self-recovering over-temperature protection circuit; the drive board is further provided with a drive switch circuit;

[0037] The self-recovering over-temperature protection circuit is used to control the opening or closing of the drive switch circuit based on the temperature signal collected by the temperature sensor.

[0038] The drive switch circuit, controlled by the self-recovering over-temperature protection circuit, is used to connect or disconnect the electrical connection between the heating rod drive signal and the heating rod.

[0039] Optionally, the control board may also be provided with any one or more of the following modules: status indicator light, RFID module, and detection module;

[0040] The processor is also used to control the status indicator to output an abnormal signal when the working current and leakage current data of the heating rod exceed the allowable range, and / or to feed back abnormal information to the external control system through the control signal probe;

[0041] The RFID module is used to store temperature control module information and cooperate with the processor to realize the external communication function of the temperature control module.

[0042] The detection module is used to detect the internal resistance and leakage current of the heating rod 205 based on the power signal of the heating rod.

[0043] Optionally, the control module and the heating drive module are integrated into one module.

[0044] Optionally, the heating drive module is specifically used to control the effective time or magnitude of the voltage or current applied to both ends of the heating rod.

[0045] Optionally, the temperature control module further includes: a heat conduction module;

[0046] The heat conduction module is fixed on the encapsulation-compatible component, which is floatingly mounted in the center of the structure body via a suspension spring.

[0047] The integrated circuit aging test fixture provided in this invention integrates a heating drive module, a temperature sensor, and a control module related to independent temperature control within the fixture. The control module controls the operating state of the heating drive module, thus enabling independent temperature acquisition and heating control operations without relying on external equipment. In this integrated circuit aging test fixture, the temperature control module integrates functions such as temperature acquisition, temperature control, and automatic operation control. It can operate independently of the aging test system, is not limited by the model or specifications of the aging test system, and is compatible with various models of aging test systems, regardless of whether they have independent temperature control functionality. Furthermore, it can be easily and conveniently adapted to various aging test equipment.

[0048] Furthermore, the temperature acquisition module and control module are integrated into the fixture, allowing the circuits within the temperature acquisition module and control module to be calibrated and adjusted as a whole. The calibrated and adjusted temperature acquisition accuracy is higher, which can meet the application requirements of high reliability fields.

[0049] Furthermore, the independent temperature control-related signals are connected to the load board via probes, avoiding problems such as cable aging and damage caused by the use of cables in traditional solutions.

[0050] Furthermore, the independent temperature control-related heating drive module, temperature sensor, and control module are designed independently from the fixture cover and are detachably installed on the fixture cover, which facilitates the disassembly and replacement of these modules.

[0051] Furthermore, the heat conduction module in the temperature control module adopts a floating mounting structure and replaceable packaged compatible components, which can ensure that the temperature control module is compatible with a variety of different package forms and different sizes of devices under test. The module has strong versatility and low mass production cost and maintenance cost.

[0052] Furthermore, the temperature control module has a built-in independent self-recovery over-temperature protection circuit, which can ensure that the temperature control module and the device under test operate within a safe temperature range.

[0053] Furthermore, the temperature control module has a built-in RFID module, enabling contactless identification and management. Moreover, when the aging test equipment lacks independent temperature control or its independent temperature control function is incompatible with the aging test fixture, the independent temperature control parameters can be written into the RFID module via its built-in RFID module. This interface also allows for the download, storage, and analysis of temperature monitoring data during the aging test process.

[0054] Furthermore, the temperature control module has a built-in detection module that can detect the internal resistance and leakage current of the heating rod in real time, predict in advance when the performance of the heating rod deteriorates, and detect abnormalities in time when leakage current occurs due to the decrease in the insulation performance of the heating rod, so as to avoid damage to the device under test. Attached Figure Description

[0055] Figure 1 This is a schematic diagram of a structure of an integrated circuit aging test fixture according to an embodiment of the present invention;

[0056] Figure 2 This is a schematic diagram of the temperature control module in the integrated circuit aging test fixture of this invention.

[0057] Figure 3 This is a schematic diagram of one structure of the clamp cover in an embodiment of the present invention;

[0058] Figure 4 This is a schematic diagram of the control module in an embodiment of the present invention;

[0059] Figure 5 This is a schematic diagram of an installation structure for encapsulating compatible components and a heat conduction module in an embodiment of the present invention;

[0060] Figure 6 This is a schematic diagram of a hardware circuit structure of the temperature control module in an embodiment of the present invention;

[0061] Figure 7 This is a schematic diagram of another hardware circuit structure of the temperature control module in an embodiment of the present invention;

[0062] Figure 8 This is a schematic diagram of the self-recovery over-temperature protection circuit in an embodiment of the present invention.

[0063] Figure label:

[0064] 11. Fixture base; 12. Fixture top cover; 13. Pull rod; 14. Top cover buckle;

[0065] 121 Top cover body;

[0066] 122 Mounting component, 1221 Positioning structure, 1222 Mounting hole, 1223 Extension structure;

[0067] 20 Temperature control module; 30 Probe base; 40 Load board;

[0068] 201 Structural body, 211 Cable tray and cover plate, 212 Mounting and fixing buckles; 213 Suspension spring;

[0069] 202 Control module, 221 Control board, 222 Protective housing, 223 Screws; 2021 First set of probes;

[0070] 203 Heating drive module, 2031 Second group of probes;

[0071] 204 temperature sensor, 205 heating rod;

[0072] 206 Thermal conduction module, 207 Heat dissipation module, 208 Packaged compatible component. Detailed Implementation

[0073] The principles and spirit of the invention will now be described with reference to exemplary embodiments shown in the accompanying drawings. It should be understood that these embodiments are described merely to enable those skilled in the art to better understand and implement the invention, and are not intended to limit the scope of the invention in any way.

[0074] To address the shortcomings of existing integrated circuit aging test fixtures with embedded temperature acquisition, heating, and heat dissipation modules, such as poor flexibility and the need for external control equipment to achieve temperature control, this invention provides an integrated circuit aging test fixture that integrates a temperature control module with an independent temperature control system within the fixture. This improves the fixture's flexibility and reduces reliance on external equipment. Furthermore, the detachable, independent structural design allows for convenient and rapid disassembly, replacement, and maintenance of the independent temperature control modules.

[0075] It should be noted that the temperature control module in the embodiments of the present invention can be integrated into aging test fixtures with structures such as pull rod type, knob type, and flip cover type. The installation method of the temperature control module is similar for aging test fixtures with different structures. The embodiments of the present invention do not limit the specific structure of the aging test fixture. In specific implementation, it can be selected as needed.

[0076] The following explanation uses a tie-rod type fixture for aging testing as an example.

[0077] like Figure 1 The diagram shown is a structural schematic of an integrated circuit aging test fixture according to an embodiment of the present invention.

[0078] In this embodiment, the integrated circuit aging test fixture includes: a fixture base 11, a fixture cover 12 connected to the fixture base 11, and a temperature control module 20 with an independent temperature control system. The temperature control module 20 is detachably mounted on the fixture cover 12.

[0079] Reference Figure 1 When testing the device under test, the device under test needs to be placed on the fixture base 11, and then the fixture cover 12 is rotated and pulled down to press the temperature control module 20 onto the device under test. Then, the pull rod 13 is rotated and the fixture cover 12 is pressed tightly by the cover buckle 14, and the temperature control module 20 provides vertical downward pressure to the device under test.

[0080] Reference Figure 2The diagram shows the structure of the temperature control module in this embodiment of the invention. The temperature control module 20 includes a structural body 201, and a control module 202, a temperature sensor 204, a heating drive module 203, and a heating rod 205 disposed on the structural body 201.

[0081] The control module 202 is installed on one side of the structure body 201, and the heating drive module 203 is installed on the other side of the structure body 201.

[0082] The structural body 201 serves as the mounting support structure for the other components of the temperature control module, and all other functional components of the temperature control module are mounted on the structural body 201. The structural body 201 is typically made of a material with poor thermal conductivity and high strength, and is manufactured through processes such as machining or molding.

[0083] In this embodiment, temperature sensor 204 is used to collect temperature data of the device under test; control module 202 is used to acquire the temperature data collected by temperature sensor 204 and control the working state of heating drive module 203 according to the temperature data; heating drive module 203 is used to control the heating power of heating rod 205.

[0084] In a non-limiting embodiment, the power supply to the temperature control module 20 and the signal transmission between different modules can be achieved via cables.

[0085] Furthermore, considering that cables are prone to aging and damage, in a preferred embodiment, referring to... Figure 1 and Figure 2 The fixture also includes a load plate 40 connected to the bottom surface of the fixture base 11, and a probe base 30 is provided on the load plate 40. Correspondingly, a first set of probes 2021 is provided on the control module 202, and a second set of probes 2031 is provided on the heating drive module 203.

[0086] The two sets of probes are spring-loaded probes. After the clamp is pressed down, they establish an electrical connection with the probe base 30 on the load plate 40, enabling data communication between the temperature control module 20 and the external control system. At the same time, the temperature control module 20 obtains operating power from the load plate 40 through the probes. In addition, the load plate 40 also provides support for the clamp base 11.

[0087] It should be noted that the aforementioned load board 40 can be used as part of the integrated circuit aging test fixture in the embodiment of the present invention, or as a supporting component of the fixture. The embodiment of the present invention does not limit this.

[0088] The integrated circuit aging test fixture of this invention, by mounting a probe base 30 on the load plate 40 that matches the device under test (DUT), can achieve compatible support for various types of DUTs (e.g., different heights and dimensions). By replacing the control signal cables in conventional solutions with the probe base 30 and corresponding probes, problems such as aging damage and connection reliability of control signal harnesses can be solved. The probe base 30 can be installed on each side of the fixture, respectively electrically connected to the control module and heating drive module in the temperature control module 20 to provide them with power and communication electrical connections, or it can be installed only on the side where the control module is installed; this embodiment of the invention does not limit this.

[0089] like Figure 3 The diagram shown is a structural schematic of the clamp cover in an embodiment of the present invention.

[0090] In this embodiment of the invention, the clamp cover 11 includes a cover body 121 and a mounting component 122 for the temperature control module. The mounting component 122 is used to... Figure 2 The temperature control module is installed on the upper cover body 121.

[0091] In one non-limiting embodiment, the upper cover body 121 is a frame-shaped structure, and the mounting component 122 is a hollow frame-type structural member adapted to the frame-shaped structure. Figure 2 The temperature control module 20 is installed in the hollow area of ​​the frame structure.

[0092] Specifically, the mounting component 122 has vertically outward extending structures 1223 on both sides, and mounting holes 1222 are provided on the extending structures. The mounting component is connected to the upper cover body 121 through the mounting holes 1222. Two or more mounting holes 1222 can be provided; this embodiment of the invention does not limit the number of holes. See also... Figure 1 The structural body 11 is provided with mounting and fixing buckles 212 on both sides, and the mounting and fixing buckles 212 are connected to the structural body 11 by a spring structure.

[0093] After the temperature control module 20 is placed on the mounting component 122, the mounting and fixing clip 212 engages with the extension structure 1223, thereby fixing the temperature control module 20 to the clamp cover 12. When it is necessary to remove the temperature control module 20, simply apply force to the mounting and fixing clip 212 in the opposite direction to disengage it from the clamp cover 12, and the temperature control module 20 can be removed from the clamp cover 12.

[0094] This installation method has a simple structure and is easy to assemble and disassemble.

[0095] Furthermore, to facilitate rapid installation, such as Figure 3As shown, a positioning structure 1221 may also be provided on the mounting component 122 for positioning the temperature control module 20 during installation. The positioning structure 1221 may specifically be a positioning hole or similar structure. Correspondingly, the temperature control module 20 is provided with a positioning structure adapted to the positioning structure 1221. During installation, aligning the positioning structure on the temperature control module 20 with the positioning structure on the mounting component 122 can improve installation efficiency and effectiveness.

[0096] It should be noted that the contact area between the control module 202 and the structural body 201 should be as small as possible while maintaining the strength of the installation structure. Alternatively, heat insulation material can be applied to the contact surface to reduce the conduction of heat from the structural body 201 to the control module 202.

[0097] The control module 202 is connected to the temperature sensor 204 to acquire the temperature data collected by the sensor. The control module 202 is electrically connected to the heating drive module 203 through a cable between the two modules to control the working state of the heating drive module 203 and realize the control of the heating power.

[0098] like Figure 4 The diagram shown is a structural schematic of the control module in an embodiment of the present invention.

[0099] The control module 202 includes a control board 221 and a first protective housing 222 that is snapped onto the outside of the control board 221. The control board 221 and the first protective housing 222 are provided with through holes (not shown in the figure). During installation, the control module is reliably installed on the structure body 201 by passing screws 223 through the through holes and fixing them to the first mounting holes provided on the structure body. One or more through holes may be provided for installing the control board 221; this embodiment of the invention does not limit the number of through holes.

[0100] Accordingly, the first set of probes 2021 is mounted on the control board 221.

[0101] It should be noted that the protective housing 222 must be tightly fitted to the control board 221 on the side that contacts it to ensure that the entire control module can be reliably installed on the structural body 201 after the screws 223 are installed. Simultaneously, to ensure that the heat generated by the heat-generating components on the control board 221 can dissipate, the protective housing 222 also needs to be tightly fitted to the heat-generating components to conduct the generated heat to the protective housing 222 and dissipate it through convective airflow in the environment.

[0102] In this embodiment, the protective housing 222, in addition to fixing and supporting the control board 221, also serves to protect the circuitry of the control board 221 from exposure, thereby avoiding potential physical damage during use and ensuring the normal operation of the independent temperature control circuit. The fixing screws pass through the protective housing and the control board, and connect to the mounting holes on the structural body, reliably mounting the control module 202 onto the structural body 201.

[0103] Figure 2 The heating drive module 203 is installed and fixed on the other side of the structure body 201, and its structure and composition are the same as those of the structure body 201. Figure 4 Similar to the control module 202, specifically, the heating drive module 203 may include: a drive board and a second protective shell fastened to the outside of the drive board; the drive board and the second protective shell are provided with through holes, and the heating drive module 203 is fixed to the structure body 201 by screws passing through the through holes and the second mounting holes provided on the structure body 201. The aforementioned second set of probes 2031 is provided on the drive board.

[0104] It should be noted that in some application scenarios, the control board 221 and the driver board can be combined into one board.

[0105] After the fixture is installed, the heating drive module 203 connects with the fixture via its integrated spring probe (i.e., the second set of probes 2031 mentioned above). Figure 1 The control signal probe holder 30 on the load board 40 is electrically connected, and the power required for the operation of the heating drive module 203 is obtained through the probe holder 30.

[0106] Reference Figure 2 In this embodiment of the invention, the heating drive module 203 can be electrically connected to the control module 202 via a cable to obtain heating control signals. The heating drive module 203 is electrically connected to the heating rod 205, and the heating power can be controlled by controlling the effective time or magnitude of the voltage or current applied across the heating rod 205.

[0107] It should be noted that in some application scenarios, the heating drive module 203 and the control module 202 can also be integrated into one module.

[0108] The aforementioned control module 202 and heating drive module 203 are located on both sides of the temperature control module 20 and are fixed to the structural body 201 by a protective shell and screws. It should be noted that the contact area between the structural body 201 and the control module 202 and heating drive module 203 should be as small as possible. In some superior designs, heat insulation material can be installed to isolate the heat from the structural body 201, thereby minimizing the heat generated by the heating rod 205 inside the temperature control module 202 from being conducted to the control module 202 and heating drive module 203 on both sides through the structural body 201. Simultaneously, the protective shell and ambient airflow dissipate heat from the control module 202 and heating drive module 203, ensuring that the operating temperature of the electronic components inside the control module 202 and heating drive module 203 remains within a low temperature range, thus improving their lifespan and reducing the difficulty of selecting components for circuit design.

[0109] like Figure 2 As shown, in another non-limiting embodiment, the temperature control module 20 may further include a heat conduction module 206. The heat conduction module 206 is fixed to the packaged compatible component 208. The heat conduction module 206 is typically made of a material with a high thermal conductivity.

[0110] The package-compatible component 208 is a replaceable component for compatibility with devices under test (DUTs) in different package forms, and also serves to support and fix the thermal conductivity module 206. The package-compatible component 208 can be fixed to the main body 201 using the four corner screws.

[0111] In practical implementation, the package compatibility component 208 can be customized according to the package form of the device under test. When using it, select the package compatibility component 208 that is compatible with the device under test and install it on the structure body 201.

[0112] The packaged compatible component, after the device under test (DUT) is installed, makes close contact with its upper surface and applies downward pressure to ensure that the DUT is reliably installed inside the fixture.

[0113] Reference Figure 5 , Figure 5 This diagram illustrates an installation structure of a packaged compatible component and a heat conduction module according to an embodiment of the present invention.

[0114] In this example, the encapsulation-compatible component 208 is floatingly mounted in the center of the structure body 201 via a suspension spring 213. The heat conduction module 206 is fixed to the encapsulation-compatible component 208, thereby allowing the heat conduction module 206 to float up and down.

[0115] Figure 5The design structure shown ensures a tight fit between the heat conduction module 206 and the upper surface of the device under test (DUT) package, thereby accelerating heat conduction. The floating design, while guaranteeing a tight fit between the heat conduction module 206 and the DUT heat sink, also protects the DUT package, as the force on the DUT primarily originates from the elastic force of the suspension spring 213, resulting in relatively low stress.

[0116] Continue to refer to Figure 2 As shown, the heating rod 205 can be installed inside the heat conduction module 206. For example, a first receiving hole parallel to the upper surface of the device under test can be drilled inside the heat conduction module 206; the heating rod 205 can then be installed inside the first receiving hole.

[0117] It should be noted that the opening position of the first receiving hole can be determined by simulation based on the specifications and size of the selected heating rod 205.

[0118] The heating rod 205 typically has two control signal lines connected to both ends of the heating rod 205. The other two ends of the control signal lines can be soldered to the heating drive module 203, or installed to the heating drive module 203 via a connector. This embodiment of the invention does not limit the specific application of these methods.

[0119] In specific implementations, there may be one or two heating rods 205. The heating rod 205 may be a resistance heating wire, a semiconductor heating element, or a cooling element.

[0120] Continue to refer to Figure 2 As shown, the temperature sensor 204 can be installed inside the heat conduction module 206 by a floating spring. For example, a second receiving hole perpendicular to the upper surface of the device under test can be drilled inside the heat conduction module 206, and the temperature sensor 204 can be installed in the second receiving hole by a floating spring.

[0121] Typically, the second receiving hole can be located at the center of the heat conduction module 206. During testing of the device under test (DUT), the center of the heat conduction module 206 is aligned with the center of the upper surface of the DUT. Typically, the probe of the temperature sensor 204 protrudes from the lower surface of the heat conduction module 206 to ensure a tight fit between the temperature sensor 204 and the upper surface of the DUT, thus enabling the detection of the DUT's casing temperature.

[0122] In one non-limiting embodiment, the probe portion of the temperature sensor 204 and the heat conduction module 206 may be filled with thermal insulation material to avoid direct contact between the two and ensure that the temperature collected by the probe portion is the case temperature of the device under test.

[0123] The temperature sensor 204 is typically connected to two signal lines for outputting temperature sensing signals. These two signal lines can be soldered to the control module 202 or mounted on the control module 202 via connectors to provide a shell temperature signal to the control module 202.

[0124] like Figure 2 As shown, in another non-limiting embodiment, the temperature control module 20 may further include a heat dissipation module 207, which is installed above the heat conduction module 206 and is mainly used for heat exchange between the temperature control module 20 and the external environment to achieve precise control of the case temperature of the device under test, and to assist in heat dissipation at the end of the test so as to reduce the case temperature of the device under test to room temperature as soon as possible.

[0125] The heat dissipation module 207 is typically made of a material with a high thermal conductivity. In specific implementations, the structural shape of the heat dissipation module 207 can be designed according to the heat generation of the device under test. In some application scenarios, the heat dissipation module 207 can be combined with the heat conduction module 206 into a single module.

[0126] The cable tray and cover plate are mainly used for laying the internal temperature acquisition signal, heating rod control signal and heating control signal cable of the temperature control module, and the cover plate is used to seal them between the main body of the structure and the cover plate.

[0127] like Figure 2 As shown, in another non-limiting embodiment, a cable tray and a cover plate 211 may also be provided on the structural body 201, with the cover plate covering the cable tray. The cable tray is used to lay the internal temperature acquisition signal cables, heating rod control signal cables, and heating control signal cables of the temperature control module 20. The cover plate seals these cables between the structural body 201 and the cover plate, which not only keeps the exterior of the temperature control module 20 clean but also prevents the cables from being pulled during testing, thus avoiding breakage and affecting signal transmission.

[0128] In this embodiment of the invention, the control module 202 mainly performs functions such as temperature data acquisition, heating control, system operation control, and external communication. It acquires the operating power through the first set of probes 2021 on the control module and communicates with the external control system to obtain operating commands and / or operating parameters. Based on the needs of the external control system, it uploads the real-time temperature, heating power, and other operating parameters of the temperature control module 20 to the external control system in real time.

[0129] The hardware circuit of the temperature control module 20 in the integrated circuit aging test fixture of this invention is set on the control board and the driver board. This circuit enables temperature acquisition, heating control, automatic operation control, and external communication within the fixture, and also provides certain fault protection functions. The following describes the process in conjunction with... Figure 6 The hardware circuit and its operation process are described in detail.

[0130] like Figure 6 The diagram shown is a schematic diagram of a hardware circuit structure of the control module in an embodiment of the present invention.

[0131] In one embodiment, the hardware circuit 60 includes:

[0132] The processor 611, temperature signal analog-to-digital converter circuit 612, power signal analog-to-digital converter circuit 613, and power management circuit 614 are configured on the control board 61; and

[0133] The drive control circuit 621 and the drive power acquisition circuit 622 are set on the driver board 62.

[0134] The processor 611 can obtain its operating power through the control signal probe 610, communicate with the external control system, and perform corresponding operations according to the external communication instructions.

[0135] The power required by other functional modules on the control board 61 can be provided by the power management circuit 614, which performs the voltage conversion function of the power required for the operation of other functional modules of the hardware circuit.

[0136] The power required for the operation of the driver board 62 is obtained from the load board 40 by the driver power probe 620. In some applications, this power can also be provided by the control board 61 via a cable, which is not limited in this embodiment of the invention.

[0137] It should be noted that the control signal probe 610 mentioned above is all or some of the probes in the first group of probes mentioned above, and the drive power probe 620 mentioned above is all or some of the probes in the second group of probes mentioned above.

[0138] The temperature signal analog-to-digital conversion circuit 612 is used to convert the temperature-related analog signal collected by the temperature sensor 204 into a digital signal that can be recognized by the processor 611, and transmit the converted temperature data to the processor 611.

[0139] The driving power acquisition circuit 622 is used to acquire the power signal of the heating rod 205, such as the current flowing into and out of the heating rod 205, to monitor the heating power, the internal resistance of the heating rod 205, and the leakage current. For example, a detection module (not shown in the figure) can be set to detect the internal resistance and leakage current of the heating rod 205 based on the power signal of the heating rod 205. The current value on the high side of the heating rod 205 refers to the magnitude of the current flowing into the heating rod 205, and the current value on the low side of the heating rod 205 refers to the magnitude of the current flowing out of the heating rod 205. Ideally, these two current values ​​should be equal. If leakage exists, these two current values ​​will not be equal. Therefore, the presence of leakage in the heating rod 205 can be monitored based on these two current values. The driving power acquisition circuit 622 converts the acquired current values ​​on the high and low sides of the heating rod 205 into analog signals that can be recognized by the power signal digital-to-analog converter circuit 613 on the control board 61, and outputs them to the power signal analog-to-digital converter circuit 613 for processing. It should be noted that the power detection of the heating rod 205 is usually expressed as the power data collected on the high side of the heating rod 205. The internal resistance monitoring of the heating rod is usually calculated using Ohm's law based on the power data collected on the high side of the heating rod 205. The leakage current monitoring can be obtained by dividing the difference between the high-side power and the low-side power by the heating rod driving voltage.

[0140] After a period of use, the internal resistance of the heating rod 205 will change as its service life increases. When its internal resistance exceeds the allowable range, the temperature control module may fail to heat to the preset temperature within a preset time, or the temperature control module may fail to control the shell temperature of the device under test. These failures will seriously affect the production progress of aging tests and need to be detected and eliminated as early as possible. Testing the leakage current of the heating rod 205 mainly involves checking its insulation performance. In practical applications, the operating voltage of the heating rod 205 is usually much higher than the withstand voltage of the device under test. In some application scenarios, the heat sink of the device under test is directly connected to the internal circuitry of the device under test. In this case, if the leakage current of the heating rod 205 exceeds a certain range, its leakage voltage will... Figure 2 The heat conduction module 206 in the middle is applied to the device under test, which causes some damage to the device under test.

[0141] Accordingly, the power signal analog-to-digital converter circuit 613 is mainly used to convert the analog power signal collected by the drive power acquisition circuit 622 into a digital signal that can be recognized by the processor 611, and transmit the converted power data to the processor 611.

[0142] Accordingly, the processor 611 runs a temperature control-related application program and sends a heating control signal to the drive control circuit 621 based on the temperature data and the power data, so that the drive control circuit 621 controls the working state of the heating rod 205 and realizes the control of the shell temperature of the device under test; in addition, the processor can also obtain the working current and leakage current data of the heating rod through the power signal digital-to-analog conversion circuit and transmit the current data to the external control system.

[0143] Accordingly, the drive control circuit 621 processes the heating control signal from the processor 611 and converts it into a drive signal to drive the heating rod 205 to work.

[0144] like Figure 7 The diagram shown is a schematic diagram of another hardware circuit structure of the control module in an embodiment of the present invention.

[0145] Compared to Figure 6 The illustrated embodiment, in Figure 7 In the illustrated embodiment, the control board 61 may also be equipped with any one or more of the following circuits or modules: RFID (Radio Frequency Identification) module 616, self-recovering over-temperature protection circuit 615, and status indicator light 617; the drive board 62 may also be equipped with a drive switch circuit 623. Wherein:

[0146] The self-resetting over-temperature protection circuit 615 is an over-temperature protection circuit independent of the temperature control module control system. Specifically, it can employ some existing conventional self-resetting over-temperature protection circuits. The working principle of the self-resetting over-temperature protection circuit 615 is as follows: Figure 8As shown, the temperature signal collected by temperature sensor 204 is amplified by a differential amplifier, and after addition and subtraction with the cold junction compensation voltage and amplification, it is sent to a hysteresis comparator to output a temperature control switch signal, directly controlling the opening or closing of the drive switch circuit 623. The cold junction compensation voltage is the voltage compensation value for thermocouple-type temperature sensors. The reference voltage 1 required by the differential amplifier is used to bias the temperature-related voltage signal collected by the temperature sensor to a voltage value within a voltage range equivalent to the cold junction compensation voltage. The determination of this voltage value is related to the characteristics of the temperature sensor itself and the voltage-temperature relationship of the cold junction compensation voltage. The reference voltage 2 required by the hysteresis comparator is related to the protection temperature and recovery temperature of the temperature protection circuit. Reference voltage 1 and reference voltage 2 can be set according to the protection temperature and recovery temperature, referring to relevant existing technologies and actual application scenarios. This embodiment of the invention does not limit this setting. The self-recovery over-temperature protection circuit 615 operates independently of the processor 611 and is not controlled by the processor 611. When the temperature collected by the temperature sensor 204 is higher than the preset protection temperature, the self-recovery over-temperature protection circuit 615 will control the drive switch circuit 623 to disconnect the drive signal output to the heating rod 205 so that the heating rod 205 stops heating; when the temperature collected by the temperature sensor 204 is lower than the preset recovery temperature, the self-recovery over-temperature protection circuit 615 will control the drive switch circuit 623 to reconnect the drive signal output to the heating rod 205 so that the heating rod 205 can continue to heat up under the control of the drive control circuit 620.

[0147] The drive switch circuit 623 is controlled by the output signal of the self-recovery over-temperature protection circuit 615 to connect or disconnect the electrical connection between the heating rod drive signal and the heating rod 205.

[0148] In this embodiment, the processor 611 can also determine whether the operating current and leakage current data of the heating rod 205 obtained by the power signal digital-to-analog converter circuit 613 exceed the allowable range. When the data exceeds the allowable range, the control status indicator 617 outputs an abnormal signal (such as turning on the indicator or turning off the indicator). It can also feed back abnormal information to the external control system through the control signal probe 610.

[0149] Furthermore, the processor 611 can also achieve data communication with an external control system through the RFID module 616.

[0150] It should be noted that, in practical implementation, temperature control modules can be set up for different applications to match more integrated circuit product packaging forms. Accordingly, the RFID module 616 is also used to store temperature control module information and cooperate with the processor to realize the external communication function of the temperature control module. The temperature control module information may include information such as the model, serial number, expiration date, and availability status of the temperature control module.

[0151] Using RFID technology to store the temperature control module information allows for the reading and comparison of the module's information even when the module is not powered on. This ensures that the correct temperature control module is used during testing and avoids production anomalies caused by using a malfunctioning module. Furthermore, RFID technology enables rapid inventory checks of temperature control module assets.

[0152] The external communication function is mainly used when the aging test system itself does not have an independent temperature control function or its independent temperature control function is incompatible with the independent temperature control aging test fixture. Temperature control parameters can be written into the temperature control module through the RFID module 616 so that the temperature control module can operate independently. At the same time, the aging test process temperature monitoring data stored in the temperature control module can be transmitted to external devices for storage or analysis through the RFID module 616.

[0153] The integrated circuit aging test fixture provided in this invention integrates a heating drive module, a temperature sensor, and a control module related to independent temperature control within the fixture. The control module controls the operating state of the heating drive module, thus enabling independent temperature acquisition and heating control operations without relying on external equipment. In this integrated circuit aging test fixture, the temperature control module integrates functions such as temperature acquisition, temperature control, and automatic operation control. It can operate independently of the aging test system, is not limited by the model or specifications of the aging test system, and is compatible with various models of aging test systems, regardless of whether they have independent temperature control functionality. Furthermore, it can be easily and conveniently adapted to various aging test equipment.

[0154] In specific implementation, the modules / units included in the various devices and products described in the above embodiments can be software modules / units, hardware modules / units, or a combination of both.

[0155] For example, for various devices and products applied to or integrated into a chip, each module / unit can be implemented using hardware methods such as circuits, or at least some modules / units can be implemented using software programs that run on a processor integrated within the chip, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits; for various devices and products applied to or integrated into a chip module, each module / unit can be implemented using hardware methods such as circuits, and different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components of the chip module, or at least some modules / units can be implemented using hardware methods such as circuits. The components can be implemented using software programs that run on the processor integrated within the chip module. The remaining (if any) modules / units can be implemented using hardware methods such as circuits. For various devices and products applied to or integrated into the terminal, each of its components / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or in different components within the terminal. Alternatively, at least some modules / units can be implemented using software programs that run on the processor integrated within the terminal, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits.

[0156] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An integrated circuit burn-in test fixture, comprising: The clamp base, the clamp upper cover connected with the clamp base, and the temperature control module with an independent temperature control system are included. The temperature control module includes a structure body, and a control module, a temperature sensor, a heating drive module, and a heating rod arranged on the structure body; the control module is installed on one side of the structure body, and the heating drive module is installed on the other side of the structure body. The temperature sensor is used to collect temperature data of a device to be measured. The control module is used to acquire the temperature data collected by the temperature sensor, and control the working state of the heating drive module according to the temperature data. The heating drive module is used to control the heating power of the heating rod. The clamp upper cover includes an upper cover body and a mounting component.

2. The integrated circuit burn-in test fixture of claim 1, wherein, The mounting component is used to mount the temperature control module on the upper cover body. The upper cover body is a frame structure; the mounting component is a hollow frame structure matched with the frame structure; and the temperature control module is mounted in the hollow area of the frame structure.

3. The integrated circuit burn-in test fixture of claim 2, wherein, Both sides of the mounting component have vertically outward extending structures; both sides of the structure body are provided with mounting fixing buckles connected with the structure body through spring structures.

4. The integrated circuit burn-in test fixture of claim 3, wherein, After the temperature control module is placed on the mounting component, the mounting fixing buckles are clamped with the extending structures. The mounting component is provided with a positioning structure for positioning the temperature control module when the temperature control module is placed.

5. The integrated circuit burn-in fixture of claim 4, wherein, One side of the structure body is provided with a first mounting hole; and the other side of the structure body is provided with a second mounting hole.

6. The integrated circuit burn-in fixture of claim 1, wherein, The control module includes a control board card and a first protective shell buckled on the outside of the control board card; the control board card and the first protective shell are provided with through holes, and the control module is fixed on the structure body through screws passing through the through holes and the first mounting hole; The heating drive module includes a drive board card and a second protective shell buckled on the outside of the drive board card; the drive board card and the second protective shell are provided with through holes, and the heating drive module is fixed on the structure body through screws passing through the through holes and the second mounting hole. The control board card is provided with a first group of probes, and the drive board card is provided with a second group of probes.

7. The integrated circuit burn-in test fixture of claim 6, wherein, The clamp further includes a load board connected with the bottom surface of the clamp base, and the load board is provided with a probe base for plugging the first group of probes and the second group of probes, so that the temperature control module and the load board are electrically connected. The probes are used to transmit power signals and / or data signals. The control board card and the drive board card are provided with hardware circuits, and the hardware circuits include:

8. The integrated circuit burn-in test fixture of claim 7, wherein, a processor, a temperature signal analog-to-digital conversion circuit, and a power signal analog-to-digital conversion circuit arranged on the control board card; a drive power acquisition circuit and a drive control circuit arranged on the drive board card; The temperature signal analog-to-digital conversion circuit is used to convert an analog signal related to temperature collected by the temperature sensor into a digital signal, and transmit the converted temperature data to the processor. ​ The driving power acquisition circuit is configured to acquire a power signal of the heating rod. The power signal digital-to-analog conversion circuit is configured to convert the power signal into a digital signal and transmit the converted power data to the processor. The processor is configured to run a temperature control related application program, send a heating control signal to the driving control circuit according to the temperature data and the power data, and acquire working current and leakage current data of the heating rod through the power signal digital-to-analog conversion circuit and transmit the current data to an external control system. The driving control circuit is configured to convert the heating control signal into a driving signal for driving the heating rod to work.

9. The integrated circuit burn-in test fixture of claim 8, wherein, The control board card is further provided with a self-recovery over-temperature protection circuit, and the driving board card is further provided with a driving switch circuit. The self-recovery over-temperature protection circuit is configured to control the opening or closing of the driving switch circuit according to a temperature signal acquired by the temperature sensor. The driving switch circuit is controlled by the self-recovery over-temperature protection circuit and is configured to connect or disconnect the electrical connection between the heating rod driving signal and the heating rod.

10. The integrated circuit burn-in test fixture of claim 9, wherein, The control board card is further provided with any one or more of the following modules: a state indicator, an RFID module, and a detection module. The processor is further configured to control the state indicator to output an abnormal signal when the working current and the leakage current data of the heating rod exceed a permissible range, and / or feed back abnormal information to an external control system through the control signal probe. The RFID module is configured to store temperature control module information and cooperate with the processor to realize the external communication function of the temperature control module. The detection module is configured to detect the internal resistance and leakage of the heating rod 205 according to the power signal of the heating rod.

11. The integrated circuit burn-in test fixture of claim 6, wherein, The control module and the heating driving module are integrated in one module.

12. The integrated circuit aging test fixture of claim 1, wherein, The heating driving module is specifically configured to control the effective time or size of the voltage or current loaded on both ends of the heating rod.

13. The integrated circuit burn-in fixture of any of claims 1 to 12, wherein, The temperature control module further comprises a heat conduction module. The heat conduction module is fixed on a packaging compatible component, and the packaging compatible component is floatingly installed on the center of the structural body through a suspension spring.

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