Circuit board electrical performance testing device

Abstract

The invention provides a circuit board electrical performance testing device, and the device comprises a feeding mechanism which is used for conveying a circuit board; the pushing mechanism is provided with a first station and a second station, the first station is in butt joint with the output end of the feeding mechanism so as to receive the circuit board from the feeding mechanism, and the pushing mechanism is used for transferring the circuit board located at the first station to the second station; the testing mechanism is arranged on one side of the material pushing mechanism, at least two testing contact parts are arranged on the testing mechanism, and each testing contact part can independently move towards the second station, so that when the testing contact parts are in contact with the circuit board located at the second station, an electrical performance test is executed on the circuit board; the material storage mechanism is arranged below the material pushing mechanism and is used for classifying and storing the circuit boards subjected to the electrical performance test; the technical problems that an existing electronic testing device lacks complete testing procedures and cannot conduct comprehensive electrical performance testing on circuit boards with pin contacts located on different side faces at a time are solved, and the complete testing procedures are formed.

Description

Technical Field

[0001] This application relates to the technical field of electrical performance testing, and more particularly to a circuit board electrical performance testing device. Background Technology

[0002] Electronic atomizers, widely used in consumer electronics and health fields, rely heavily on a main control circuit board as one of their core components. This board not only handles logical functions such as controlling power output and adjusting operating modes, but also directly regulates the current supplied to the heating coil. In this process, the resistance of the main control circuit board itself is a critical electrical parameter: if the resistance is too high, it will limit the current flowing through the heating coil, resulting in insufficient atomization, insufficient vapor production, and a dry flavor; conversely, if the resistance is too low, it may cause excessive current, leading to overheating or even burning of the heating coil, severely impacting user experience and product safety. Therefore, before the main control circuit board is incorporated into the atomizer assembly, its resistance must be rigorously tested to ensure it is within the design tolerances, guaranteeing the atomization performance and consistency of the final product.

[0003] Currently, the industry primarily uses two methods to test the resistance values ​​of main control circuit boards. The first is manual testing: operators place the main control circuit boards to be tested one by one in a plastic tray, manually touch the designated test points on the circuit board with the test probes of a digital multimeter, and visually read the resistance value displayed on the multimeter, judging whether it is qualified based on experience or standards. The second is semi-automatic testing: using a dedicated resistance testing device, the main control circuit board is placed on a preset test station, and a cylinder or motor drives the test probes to automatically contact the test contacts on the circuit board to complete the resistance measurement. These devices are usually equipped with simple data display or judgment modules, which can improve the consistency of the test to some extent.

[0004] However, the aforementioned existing technologies still have significant drawbacks. First, manual testing methods heavily rely on the operator's focus and skill, resulting in low automation, high labor intensity, and a high risk of missed or misjudged tests due to human error, making it difficult to meet the high efficiency and high yield requirements of modern electronics manufacturing. Second, while existing resistance testing devices possess some automation capabilities, their overall structure lacks a complete automated process—lacking continuous steps from automatic feeding, precise positioning, double-sided electrical connection, resistance testing, to the classification and storage of qualified / defective products. Especially when the test pins of the main control circuit board are located on both sides, existing equipment often requires manual flipping of the circuit board and re-clamping for testing, increasing the number of steps and significantly reducing the testing cycle time, making it unsuitable for the demands of today's high-speed, flexible, and intelligent electronics manufacturing production lines. Summary of the Invention

[0005] This application provides a circuit board electrical performance testing device to solve the technical problems of existing electronic testing devices lacking complete testing procedures and being unable to perform comprehensive electrical performance testing on circuit boards with pin contacts located on different sides at once. The technical solution is as follows: This application provides a circuit board electrical performance testing device, comprising: a feeding mechanism for conveying circuit boards; a pushing mechanism configured with a first station and a second station, the first station being connected to the output end of the feeding mechanism to receive circuit boards from the feeding mechanism, and the pushing mechanism for transferring circuit boards located at the first station to the second station; a testing mechanism disposed on one side of the pushing mechanism, the testing mechanism having at least two testing contact parts, and each testing contact part being able to move independently toward the second station, so as to perform electrical performance testing on the circuit board when the testing contact part contacts the circuit board located at the second station; and a storage mechanism disposed below the pushing mechanism for classifying and storing circuit boards that have completed electrical performance testing.

[0006] In one embodiment, the feeding mechanism includes: a feeding guide component with a linear feeding channel, a feed inlet communicating with a feeding mechanism on one side of the feeding guide component, and a first station formed by the middle section of the linear feeding channel facing the feed inlet; a feeding execution component slidably mounted on the feeding guide component through the linear feeding channel; and a feeding drive component disposed on one side of the feeding guide component and connected to one end of the feeding execution component, for driving the feeding execution component to perform linear reciprocating motion along the linear feeding channel, and a second station formed by the end section of the linear feeding channel away from the feeding drive component.

[0007] In one embodiment, the feeding mechanism further includes a material sensing component, which is mounted on the feeding guide component and arranged corresponding to the first station. The material sensing component is signal-connected to the feeding drive component, and the material sensing component is used to send a drive signal to the feeding drive component when it detects that the circuit board is located at the first station.

[0008] In one embodiment, the testing mechanism includes: an annular bracket mounted on one side of the feeding mechanism, and the annular bracket being arranged in a surrounding manner at the second station; a first testing component and a second testing component, respectively disposed on the annular bracket, for contacting the circuit board located at the second station to perform electrical performance testing.

[0009] In one embodiment, the first test component includes: a first driven component slidably mounted on an annular bracket; a first fixed base fixed to one end of the first driven component near the second station; a first test probe mounted on the first driven component via the first fixed base, and the first test probe pointing towards the second station; and a first driving component connected to the first driven component to control the first test probe to move closer to or further away from the second station by driving the first driven component to slide on the annular bracket. The second test component includes: a second driven component, slidably mounted on an annular bracket; a second fixed base, fixed to one end of the second driven component near the second workstation; a second test probe, mounted on the second driven component via the second fixed base, and the second test probe pointing towards the second workstation; and a second driving component, connected to the second driven component, to control the second test probe to move closer to or further away from the second workstation by driving the second driven component to slide on the annular bracket.

[0010] In one embodiment, the storage mechanism includes: a material storage assembly having a first storage chamber and two second storage chambers located on both sides of the first storage chamber, the first storage chamber being used to store circuit boards that have failed the electrical performance test, and the two second storage chambers being used to store circuit boards that have passed the electrical performance test; and a material guiding assembly disposed above the material storage assembly, the material guiding assembly having a first guiding channel and two second guiding channels, the first guiding channel being directly opposite the first storage chamber, and the two second guiding channels being directly opposite the two second storage chambers respectively. The material guiding component has a first state and a second state; when in the first state, the first guiding channel is opened to guide the circuit board into the first storage chamber; when in the second state, the first guiding channel is closed and one of the second guiding channels is opened to guide the circuit board into the corresponding second storage chamber.

[0011] In one embodiment, the material guiding assembly includes: a guide cylinder disposed directly above the material storage assembly, the guide cylinder having upper and lower openings for a circuit board to pass through; a first rotating rod and a second rotating rod rotatably disposed on opposite side walls of the guide cylinder, the first rotating rod and the second rotating rod being spaced apart along the length of the guide cylinder; a first baffle being rotatably mounted inside the guide cylinder via the first rotating rod; and a second baffle being rotatably mounted inside the guide cylinder via the second rotating rod. A first guide channel is formed between the first baffle and the second baffle, and two second guide channels are formed on the opposite sides of the first baffle and the second baffle. When both the first baffle and the second baffle are in a vertical state, the material guiding component is in a first state. When the first baffle is in a vertical state and the second baffle is flipped so that its upper end overlaps the first baffle, the material guiding component is in a second state, and the second baffle is used to guide the circuit board into the corresponding second guide channel.

[0012] In one embodiment, the material guiding assembly further includes: a first transmission member, synchronously rotatably mounted on the end of a first rotating rod and located outside the guide cylinder, the first transmission member having a first mounting lug; a third driving member, mounted on the outer wall of the guide cylinder, the output end of the third driving member being hinged to the first mounting lug, for driving the first rotating rod and the first rotating rod to rotate, thereby causing the first baffle to flip; a second transmission member, synchronously rotatably mounted on the end of a second rotating rod and located outside the guide cylinder, the second transmission member having a second mounting lug; and a fourth driving member, mounted on the outer wall of the guide cylinder, the output end of the fourth driving member being hinged to the second mounting lug, for driving the second rotating rod and the second rotating rod to rotate, thereby causing the second baffle to flip.

[0013] In one embodiment, the feeding mechanism includes: a vibrating disc with a Teflon protective layer on its inner wall; a conveying track connected between the vibrating disc and the pushing mechanism; and a vibrating component connected to the bottom of the conveying track for providing vibrational conveying power to the conveying track.

[0014] In one embodiment, it further includes: a central processing unit, which is signal-connected to the feeding mechanism, the pushing mechanism, the testing mechanism and the storage mechanism respectively, and is used to coordinate the operation of the feeding mechanism, the pushing mechanism, the testing mechanism and the storage mechanism according to the received signals; The central processing unit includes: a touch screen for human-machine interaction and parameter input; a master control switch for controlling the start and stop of the feeding mechanism, pushing mechanism, testing mechanism, and storage mechanism; and an electrical performance tester, electrically connected to the testing mechanism, for analyzing the electrical performance parameters of the circuit boards measured by the testing mechanism and sending classification signals to the storage mechanism based on the analyzed test results.

[0015] Compared with existing technologies, the circuit board electrical performance testing device proposed in the above technical solution achieves efficient automated electrical performance testing of circuit boards, especially those with pin contacts located on different sides, through an integrated design of feeding mechanism, pushing mechanism, testing mechanism, and storage mechanism. By integrating automatic feeding, precise positioning, double-sided synchronous electrical connection, and classified storage, a complete testing process is formed, greatly improving production efficiency and product quality consistency. Specifically, the feeding mechanism can continuously provide circuit boards to be tested for the testing process, completing material supply without manual intervention, significantly improving the automation level of the production line. Furthermore, addressing the problem of repeated clamping required by existing testing equipment when handling circuit boards with pin contacts on both sides, the testing mechanism of this application is equipped with at least two independently moving testing contact parts, which can simultaneously establish electrical connections with the pin contacts on both sides of the circuit board, thereby achieving comprehensive electrical performance testing in one go. This not only simplifies the operation steps and reduces errors caused by human factors, but also speeds up the testing process, meeting the requirements of modern electronics manufacturing industries for rapid response to market demands. The storage mechanism's ability to classify and store circuit boards based on electrical performance test results further enhances the overall intelligence of the testing system. By effectively distinguishing and managing qualified and unqualified products, product quality can be monitored more efficiently, production processes can be adjusted in a timely manner, resource waste can be reduced, and economic benefits can be improved.

[0016] In summary, the circuit board electrical performance testing device provided in this application solves the problems of existing electronic testing devices lacking complete testing procedures and being unable to perform comprehensive electrical performance testing on circuit boards with pin contacts located on different sides at one time, providing strong technical support for the quality control of electronic atomizer main control circuit boards and similar products.

[0017] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0018] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0019] Figure 1 This is a three-dimensional structural schematic diagram of a circuit board electrical performance testing device according to an embodiment of this application; Figure 2 This is a three-dimensional structural diagram of the feeding mechanism in the embodiments of this application; Figure 3 This is a three-dimensional structural diagram of the testing mechanism in the embodiments of this application; Figure 4 This is a schematic diagram of the internal structure of the storage mechanism in an embodiment of this application; Figure 5 This is a three-dimensional structural diagram of the material guiding component in the embodiments of this application; Figure 6 This is a three-dimensional structural diagram of the feeding mechanism in the embodiments of this application.

[0020] Figure label: 1. Feeding mechanism; 11. Vibrating disc; 12. Conveyor track; 13. Vibrating components; 2. Pushing mechanism; 21. Material pushing guide component; 22. Material pushing execution component; 23. Material pushing drive component; 24. Material sensing component; 211. Linear feeding channel; 212. Feed inlet; 3. Testing institutions; 31. Ring-shaped bracket; 32. First driven component; 33. First fixed base; 34. First test probe; 35. First driving component; 36. Second driven component; 37. Second fixed base; 38. Second test probe; 39. Second driving component; 4. Storage mechanism; 41. Material storage components; 42. Material guiding components; 411. First storage chamber; 412. Second storage chamber; 421. Guide cylinder; 422. First rotating rod; 423. Second rotating rod; 424. First baffle; 425. Second baffle; 426. First transmission component; 427. Second transmission component; 428. Third driving component; 429. Fourth driving component; 5. Guiding components; 6. Main frame; 7. First support frame; 8. Second support frame; 9. Third support frame; 10. Central processing equipment. Detailed Implementation

[0021] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0022] Reference Figure 1As shown, an embodiment of this application proposes a circuit board electrical performance testing device, which may include: a feeding mechanism 1 for conveying circuit boards; a pushing mechanism 2 configured with a first station and a second station, the first station being connected to the output end of the feeding mechanism 1 to receive circuit boards from the feeding mechanism 1, and the pushing mechanism 2 being used to transfer the circuit board located at the first station to the second station; a testing mechanism 3 disposed on one side of the pushing mechanism 2, the testing mechanism 3 having at least two testing contact parts, and each testing contact part being able to move independently toward the second station, so as to perform electrical performance testing on the circuit board when the testing contact part contacts the circuit board located at the second station; and a storage mechanism 4 disposed below the pushing mechanism 2 for classifying and storing the circuit boards that have completed the electrical performance testing.

[0023] Specifically, in the technical solution adopted in this application, the feeding mechanism 1 is used to temporarily store a large number of circuit boards and sequentially convey the circuit boards to the pushing mechanism 2. It should be noted that the circuit boards stored in the feeding mechanism 1 are all circuit boards to be tested, that is, circuit boards that need to undergo electrical performance testing. The pushing mechanism 2 is used to receive circuit boards from the feeding mechanism 1. When the circuit board enters the pushing mechanism 2, it is located at the first station. The pushing mechanism 2 pushes the circuit board located at the first station to the second station, and realizes that one circuit board is pushed to the second station for electrical performance testing at a time. The testing mechanism 3 is used to perform electrical performance testing on the circuit board located at the second station. The testing mechanism 3 is provided with at least two independently movable test contact parts, which can simultaneously make electrical connections to two or more pin contacts at different locations on the circuit board in a contact manner. This enables the testing mechanism 3 to connect multiple pin contacts to perform electrical performance testing on the circuit board. For example, when the pin contacts are located on the front and back of the circuit board, the test contact parts on the testing mechanism 3 can be controlled to move simultaneously until electrical connections are established with the pin contacts on both the front and back of the circuit board, thereby completing the connection of pin contacts at different locations on the circuit board and performing electrical performance testing on the circuit board. The storage mechanism 4 is used to collect circuit boards that have completed electrical performance testing and to classify and store the circuit boards according to the results of the electrical performance test. Specifically, it distinguishes between circuit boards that have passed electrical performance testing and those that have failed. The tested electrical performance can be whether the circuit can be powered on normally, or whether the integrated circuit is functionally complete and whether there are any defects. In a specific application scenario of this embodiment, the electrical performance can be the resistance value test of the circuit board. In this case, the storage mechanism needs to store circuit boards with qualified resistance values ​​separately from those with unqualified resistance values ​​so that qualified and unqualified circuit boards can be processed separately in the future.

[0024] Furthermore, refer to Figure 2As shown, in some embodiments, the pushing mechanism 2 includes: a pushing guide component 21, which has a linear pushing channel 211, and a feed inlet 212 communicating with the feeding mechanism 1 on one side of the pushing guide component 21. The middle section of the linear pushing channel 211 facing the feed inlet 212 constitutes a first station; a pushing execution component 22, which is slidably mounted on the pushing guide component 21 through the linear pushing channel 211; and a pushing drive component 23, which is disposed on one side of the pushing guide component 21 and connected to one end of the pushing execution component 22, for driving the pushing execution component 22 to perform linear reciprocating motion along the linear pushing channel 211. The end section of the linear pushing channel 211 away from the pushing drive component 23 constitutes a second station.

[0025] Specifically, in the technical solution adopted in this application, the width of the linear push channel 211 is configured to accommodate only a single circuit board, and the opening direction of the inlet 212 is perpendicular to the extension direction of the linear push channel 211 on the push guide component 21. Thus, when the feeding mechanism 1 conveys the circuit board to the push mechanism 2, after the circuit board enters the linear push channel 211 from the inlet 212, the subsequent circuit boards are blocked and cannot continue to enter the linear push channel 211 through the inlet 212, so that only one circuit board is pushed by the push mechanism 2 from the first station to the second station for electrical performance testing each time. The feeding execution component 22 can be a long strip-shaped push rod that is slidably mounted on the feeding guide component 21 through the linear feeding channel 211. When the feeding execution component 22 slides in the linear feeding channel 211, the end of the feeding execution component 22 can push the circuit board entering the linear feeding channel 211 to the end of the linear feeding channel 211. In order to avoid the feeding execution component 22 directly pushing the circuit board out of the linear feeding channel 211, the limit pushing length of the feeding execution component 22 can be set to be less than the length of the linear feeding channel 211. Thus, the middle section of the linear feeding channel 211 facing the feed port 212 can be used as the first station, and the end of the linear feeding channel 211 corresponding to the pushing direction of the feeding execution component 22 can be used as the second station. The pusher drive component 23 can be configured as a drive cylinder. When the piston rod of the pusher drive component 23 is connected to the pusher execution component 22, the pusher drive component 23 can drive the pusher execution component 22 to make linear reciprocating motion in the linear pusher channel 211, thereby driving the pusher execution component 22 to continuously repeat the pusher action. When the pusher execution component 22 is driven by the pusher drive component 23 to push the circuit board from the first station to the second station, the pusher execution component 22 can also block the feed port 212, thereby preventing the next circuit board from entering the linear pusher channel 211 in advance after the circuit board leaves the first station. After the pusher execution component 22 completes the pusher action and resets, the obstruction of the feed port 212 is released, allowing the feed port 212 to reopen, and the next circuit board enters the linear execution channel. This cycle can realize the pusher of circuit boards one by one for electrical performance testing. It should be noted that after the circuit board located at the second station completes the electrical performance test through the testing mechanism 3, the pushing execution component 22 pushes the next circuit board to be tested into the second station, thereby pushing the circuit board that has completed the test out of the straight pushing channel 211, and the storage mechanism 4 receives and classifies it for storage.

[0026] Furthermore, refer to Figure 2As shown, in some embodiments, the feeding mechanism 2 further includes a material sensing component 24, which is mounted on the feeding guide component 21 and arranged corresponding to the first station. The material sensing component 24 is signal-connected to the feeding drive component 23. The material sensing component 24 is used to send a drive signal to the feeding drive component 23 when it detects that the circuit board is located at the first station.

[0027] Specifically, in the technical solution adopted in this application, the material sensing component 24 can be a sensing optical fiber, which is detachably installed on the pushing guide component 21 through an optical fiber mounting base, so that the material sensing component 24 can be located above the pushing guide component 21, and the sensing part at the end of the material sensing component 24 points to the first station in the linear pushing channel 211 to sense whether the circuit board has entered the linear pushing channel 211. In use, when the material sensing component 24 senses that the circuit board has entered the linear pushing channel 211, it sends a driving signal to the pushing drive component 23 to trigger the pushing drive component 23 to drive the pushing execution component 22 to perform a pushing action, thereby realizing an automated pushing process and saving manual control costs. In the embodiments of this application, the material sensing component 24 can also be other types of functional sensors that can sense whether there is a circuit board in the linear pushing channel 211 and send an electrical signal characterizing the pushing drive component 23 driving the pushing execution component 22 to operate. Such alternative solutions with the same functional components are all within the protection scope of this application.

[0028] Furthermore, refer to Figure 3 As shown, in some embodiments, the testing mechanism 3 includes: an annular support 31, which is installed on one side of the pushing mechanism 2 and is arranged in a surrounding manner at the second station; a first testing component and a second testing component, which are respectively disposed on the annular support 31 and are used to contact the circuit board located at the second station to perform electrical performance testing.

[0029] Specifically, in the technical solution adopted in this application, the first test component and the second test component can be fixed using an annular bracket 31. The annular structure of the annular bracket 31 facilitates alignment with the pin contacts on the circuit board, allowing the first and second test components to be installed and positioned according to the pin contact positions. This annular bracket 31 helps save on mounting space required for the bracket. For example, when the pusher mechanism 2 is set on a target platform, and the pusher guide component 21 extends beyond the edge of the target platform (i.e., the end of the linear pusher channel 211 extends beyond the edge of the target platform), and an insertion hole communicating with the linear pusher channel 211 is provided at the end of the pusher guide component 21, the first and second test components can enter the linear pusher channel 211 through the insertion hole. This enables electrical connection with the pin contacts on the circuit board. The annular bracket 31 can then be mounted on the side of the target platform using bolts or other fasteners. The central hole of the annular bracket 31 is arranged around the second station on the pusher guide component 21 to prevent the physical structure of the target platform from obstructing the electrical connection between the first or second test component and the pin contacts on the circuit board. Thus, the first and second test components mounted on the annular bracket 31 can be positioned to match the pin contacts on the circuit board. For example, when the pin contacts are located on opposite sides of the circuit board, the first and second test components can be detached from the annular bracket 31 and arranged vertically, with their test contacts pointing towards the second station on the pusher guide component 21. Alternatively, separate mounting brackets can be used to fix the first and second test components, but the positions of the first and second test components must be adjusted according to the actual positions of the pin contacts on the circuit board.

[0030] Furthermore, refer to Figure 3 As shown, in some embodiments, the first test component includes: a first driven component 32, slidably mounted on an annular bracket 31; a first fixed base 33, fixed to one end of the first driven component 32 near the second station; a first test probe 34, mounted on the first driven component 32 via the first fixed base 33, and pointing towards the second station; and a first driving component 35, connected to the first driven component 32, to control the first test probe 34 to move closer to or away from the second station by driving the first driven component 32 to slide on the annular bracket 31. The second test assembly includes: a second driven component 36, slidably mounted on an annular bracket 31; a second fixed base 37, fixed to one end of the second driven component 36 near the second workstation; a second test probe 38, mounted on the second driven component 36 via the second fixed base 37, and pointing towards the second workstation; and a second driving component 39, connected to the second driven component 36, to control the second test probe 38 to move closer to or further away from the second workstation by driving the second driven component 36 to slide on the annular bracket 31.

[0031] Specifically, in the technical solution adopted in this application, the first test component and the second test component can adopt the same or similar structures. The first driven component 32 and the second driven component 36 are sliding rods, and guide holes adapted to the sliding rods can be opened on the annular bracket 31. The first driven component 32 and the second driven component 36 are slidably inserted into the corresponding guide holes. The first fixing seat 33 is detachably installed at the end of the first driven component 32 by bolts and is located in the central hole of the annular bracket 31. It is used to fix the first test probe 34 and point the first test probe 34 toward the second station. When the first driving component 35 drives the first driven component 32 to move toward the second station, the first test probe 34 can move accordingly until it contacts the circuit board located at the second station. Specifically, the first test probe 34 is electrically connected to the pin contacts of the circuit board. The second mounting base 37 is detachably mounted on the end of the second driven component 36 by bolts and is also located in the central hole of the annular bracket 31. It is used to fix the second test probe 38 and to point the second test probe 38 towards the second work station. When the second driving component 39 drives the second driven component 36 to move closer to the second work station, the second test probe 38 moves accordingly until it contacts the circuit board located at the second work station. Specifically, the second test probe 38 is electrically connected to the pin contacts of the circuit board. Thus, by using the first and second test components that cooperate in this embodiment, electrical connections can be established simultaneously with pin contacts at different locations on the circuit board to complete the electrical performance test of the circuit board.

[0032] In a further embodiment, the first driving component 35 and the second driving component 39 can be driving cylinders, and are respectively fixed to the annular bracket 31 via cylinder mounting seats. The piston rod of the first driving component 35 is connected to the end of the first driven component 32 located outside the annular bracket 31 to drive the first driven component 32 to slide in the corresponding guide hole; the piston rod of the second driving component 39 is connected to the end of the second driven component 36 located outside the annular bracket 31 to drive the second driven component 36 to slide in the corresponding guide hole. This configuration enables the first test probe 34 and the second test probe 38 to automatically contact or disengage from the pin contacts of the circuit board.

[0033] In some embodiments, an extended channel can be provided between the feeding mechanism 2 and the storage mechanism 4 to ensure that the circuit board that has completed the electrical performance test and detached from the feeding mechanism 2 can accurately fall into the storage mechanism 4. Specifically, a guide component 5 can be connected to the end of the feeding guide component 21. The guide component 5 has a groove for the circuit board to pass through, and the two slots of the groove are connected to the end of the straight feeding channel 211 and directly above the storage mechanism 4, so that the circuit board can be accurately received by the storage mechanism 4 through the guide component 5 after detaching from the straight feeding channel 211.

[0034] Furthermore, refer to Figure 4 As shown, in some embodiments, the storage mechanism 4 includes: a material storage assembly 41 having a first storage chamber 411 and two second storage chambers 412 located on both sides of the first storage chamber 411, the first storage chamber 411 being used to store circuit boards that have failed the electrical performance test, and the two second storage chambers 412 being used to store circuit boards that have passed the electrical performance test; and a material guiding assembly 42 disposed above the material storage assembly 41, the material guiding assembly 42 having a first guiding channel and two second guiding channels, the first guiding channel being directly opposite the first storage chamber 411, and the two second guiding channels being directly opposite the two second storage chambers 412 respectively. The material guiding component 42 has a first state and a second state; when in the first state, the first guiding channel is opened so that the circuit board can be introduced into the first storage chamber 411; when in the second state, the first guiding channel is closed and one of the second guiding channels is opened so that the circuit board can be introduced into the corresponding second storage chamber 412.

[0035] Specifically, in the technical solution adopted in this application, the material storage component 41 can be composed of one or more storage boxes. In order to achieve the purpose of classified storage, if the circuit board is stored in one storage box, the interior of the single storage box has multiple storage chambers. For example, the internal space of the storage box is divided into independent chambers by partitions. According to the above-described embodiment, taking two partitions as an example, the internal space of the storage box is divided into three parallel independent chambers, namely the first storage chamber 411 and two second storage chambers 412 located on both sides of the first storage chamber 411. In another embodiment, the material storage assembly 41 can be composed of multiple storage bins. According to the embodiment shown above, taking three storage bins as an example, the storage bins can be arranged side by side. The storage bin in the middle has an independent first storage chamber 411, and the two storage bins on both sides also have independent second storage chambers 412. Compared with the above-mentioned technical solution of dividing one storage bin into multiple storage chambers, the method of using multiple storage bins can transfer the circuit boards with qualified and unqualified electrical performance to different workstations for further processing after the circuit boards are collected.

[0036] In some embodiments, the material guiding component 42 guides the circuit board that has detached from the pushing mechanism 2 to the corresponding storage chamber according to the electrical performance test results of the testing mechanism 3. That is, the circuit board with unqualified electrical performance is introduced into the first storage chamber 411, and the circuit board with qualified electrical performance is introduced into one of the second storage chambers 412.

[0037] Furthermore, refer to Figure 4 and Figure 5 As shown, in some embodiments, the material guiding assembly 42 includes: a guide cylinder 421, disposed directly above the material storage assembly 41, the guide cylinder 421 having openings at both ends for the circuit board to pass through; a first rotating rod 422 and a second rotating rod 423, rotatably passing through opposite side walls of the guide cylinder 421, and the first rotating rod 422 and the second rotating rod 423 being spaced apart along the length direction of the guide cylinder 421; a first baffle 424, which is rotatably installed inside the guide cylinder 421 via the first rotating rod 422; and a second baffle 425, which is rotatably installed inside the guide cylinder 421 via the second rotating rod 423. A first guide channel is formed between the first baffle 424 and the second baffle 425, and two second guide channels are formed on the opposite sides of the first baffle 424 and the second baffle 425. When both the first baffle 424 and the second baffle 425 are in a vertical state, the material guide assembly 42 is in a first state. When the first baffle 424 is in a vertical state and the second baffle 425 is flipped so that its upper end overlaps the first baffle 424, the material guide assembly 42 is in a second state, and the second baffle 425 is used to guide the circuit board into the corresponding second guide channel.

[0038] Specifically, in the technical solution adopted in this application, the guide cylinder 421 can be configured as a rectangular structure and fixed directly above the material storage assembly 41. The upper opening inside the guide cylinder 421 can be connected to the end of the linear feeding channel 211. For example, the upper opening inside the guide cylinder 421 is connected to the linear feeding channel 211 through the guide component 5; the lower opening of the guide cylinder 421 is connected to both the first storage chamber 411 and the two second storage chambers 412. The first baffle 424 is rotatably installed inside the guide cylinder 421 through the first rotating rod 422, and the second baffle 425 is rotatably installed inside the guide cylinder 421 through the second rotating rod 423. The first baffle 424 and the second baffle 425 can be tightly arranged with the inner wall of the guide cylinder 421 along the width dimension of the guide cylinder 421, so that when the first baffle 424 or the second baffle 425 is flipped and tilted, the circuit board falling on the tilted baffle can change the falling direction. To achieve reliable guiding function, the second station can be aligned with the middle of the guide cylinder 421, or the guide component 5 can be used to align the second station with the middle of the guide cylinder 421, that is, the guide cylinder 421 corresponds to the first storage chamber 411. In use, when the testing mechanism 3 detects that the electrical performance of the circuit board is unqualified, the first baffle 424 and the second baffle 425 are in a vertical state, so that a first guiding channel for connecting the first storage chamber 411 is formed between the first baffle 424 and the second baffle 425, and a second guiding channel for connecting the second storage chamber 412 is formed on the opposite sides of the first baffle 424 and the second baffle 425. Since the second station can align with the middle of the guide cylinder 421, the circuit board will enter the first storage chamber 411 through the first guiding channel after being released from the pushing mechanism 2. When the testing mechanism 3 detects that the electrical performance of the circuit board is qualified, the first baffle 424 can be kept in a vertical state, and the second baffle 425 can be kept in a vertical state. The circuit board rotates around the second rotating rod 423 in the guide cylinder 421 until the upper end of the second baffle 425 overlaps the first baffle 424, thereby closing the first guide channel. After the circuit board detaches from the pushing mechanism 2 and falls into the guide cylinder 421, it can be guided by the inclined second baffle 425 to the second guide channel near the second baffle 425, and finally falls into the corresponding second storage chamber 412. It should be noted that when the second storage chamber 412 is full of circuit boards, the second baffle 425 can be reset to the vertical state, and the first baffle 424 rotates around the first rotating rod 422 in the guide cylinder 421 until the upper end of the first baffle 424 overlaps the second baffle 425, thereby restoring the closed first guide channel shape, so that the circuit board can be guided by the inclined first baffle 424 to the second guide channel near the first baffle 424, and finally fall into another second storage chamber 412.

[0039] Furthermore, refer to Figure 5As shown, in some embodiments, the material guiding assembly 42 further includes: a first transmission member 426, synchronously rotatably mounted on the end of the first rotating rod 422 and located outside the guide cylinder 421, the first transmission member 426 having a first mounting lug; a third driving member 428, mounted on the outer wall of the guide cylinder 421, the output end of the third driving member 428 being hinged to the first mounting lug, for driving the first rotating rod 422 and the first rotating rod 422 to rotate, thereby causing the first baffle 424 to flip; a second transmission member 427, synchronously rotatably mounted on the end of the second rotating rod 423 and located outside the guide cylinder 421, the second transmission member 427 having a second mounting lug; and a fourth driving member 429, mounted on the outer wall of the guide cylinder 421, the output end of the fourth driving member 429 being hinged to the second mounting lug, for driving the second rotating rod 423 and the second rotating rod 423 to rotate, thereby causing the second baffle 425 to flip.

[0040] Specifically, in the technical solution adopted in this application, the first transmission member 426 and the second transmission member 427 adopt the same structure, which can realize the transfer and transmission functions. One end of the first transmission member 426 is provided with a first mounting ear, and one end of the second transmission member 427 is provided with a second mounting ear. At the other end of the first transmission member 426 and the second transmission member 427, a clamping structure is provided respectively. The clamping structure has two clamps, and a notch is opened on the side of the two clamps that are close to each other. During installation, the first transmission component 426 is fixedly connected to the first rotating rod 422 by clamping, and the first rotating rod 422 is located in the recess of the first transmission component 426. The two clamps on the first transmission component 426 can be fastened with bolts to lock the first transmission component 426 onto the first rotating rod 422, so that the first transmission component 426 and the first baffle 424 rotate synchronously through the first rotating rod 422. The third drive component 428 can be a drive cylinder, which is fixed to the outside of the guide cylinder 421 by a cylinder mounting seat. The piston rod of the third drive component 428 is hinged to the first mounting lug so that when the piston rod of the third drive component 428 extends or retracts, it drives the first transmission component 426 to rotate and drives the first baffle 424 to rotate inside the guide cylinder 421 through the first rotating rod 422. The second transmission component 427 is fixedly connected to the second transmission rod by clamping, and the second rotating rod 423 is located in the recess of the second transmission component 427. The two clamps of the second transmission component 427 can be fastened by bolts to lock the second transmission component 427 onto the second rotating rod 423, so that the second transmission component 427 and the second baffle 425 rotate synchronously through the second rotating rod 423. The fourth drive component 429 is also a drive cylinder, and it is fixed to the outside of the guide cylinder 421 by a cylinder mounting seat. The piston rod of the fourth drive component 429 is hinged to the second mounting lug so that when the piston rod of the fourth drive component 429 extends or retracts, it drives the second transmission to rotate and drives the second baffle 425 to rotate inside the guide cylinder 421 through the second rotating rod 423.

[0041] Furthermore, refer to Figure 6 As shown, in some embodiments, the feeding mechanism 1 includes: a vibrating disc 11 with a Teflon protective layer on its inner wall; a conveying track 12 connected between the vibrating disc 11 and the pushing mechanism 2; and a vibrating component 13 connected to the bottom of the conveying track 12 for providing vibration conveying power to the conveying track 12.

[0042] Specifically, in the technical solution adopted in this application, the vibrating feeder 11 is used to store and organize the circuit boards to be tested. The Teflon protective layer on its inner wall has good wear resistance and a low coefficient of friction, effectively reducing scratches and wear on the circuit board surface during vibratory feeding. The vibrating feeder 11 vibrates itself, causing the circuit boards to rise orderly along the spiral track on its inner wall and enter the conveying track 12 one by one. The conveying track 12 is typically a straight line or a slide with a specific orientation, and its bottom is connected to the vibrating component 13 (such as an electromagnetic vibrator). Vibration causes the circuit boards to move directionally along the track until they are conveyed to the feed inlet 212 of the pushing mechanism 2. This feeding method achieves automatic and continuous supply of circuit boards.

[0043] Furthermore, refer to Figure 1 As shown, in some embodiments, it further includes: a central processing unit 10, which is signal-connected to the feeding mechanism 1, the pushing mechanism 2, the testing mechanism 3 and the storage mechanism 4 respectively, and is used to coordinate the operation of the feeding mechanism 1, the pushing mechanism 2, the testing mechanism 3 and the storage mechanism 4 according to the received signals; The central processing unit 10 includes: a touch screen for human-machine interaction and parameter input; a master control switch for controlling the start and stop of the feeding mechanism 1, the pushing mechanism 2, the testing mechanism 3, and the storage mechanism 4; and an electrical performance tester, electrically connected to the testing mechanism 3, for analyzing the electrical performance parameters of the circuit board measured by the testing mechanism 3, and sending a classification signal to the storage mechanism 4 based on the analyzed test results.

[0044] Specifically, in the technical solution adopted in this application, the central processing unit 10 serves as the control core, receiving feedback signals from various mechanisms and issuing corresponding control commands, such as the arrival signal of the material sensing component 24, the test signal of the testing mechanism 3, and the drive signals to start the pushing drive component 23, the first drive component 35, the second drive component 39, the third drive component 428, and the fourth drive component 429. This enables the feeding, pushing, testing, and receiving actions to work in coordination according to a predetermined program. Operators can set test parameters (such as resistance threshold, test voltage, etc.) and display the operating status through a touch screen. The electrical performance tester receives electrical signals from the test probes, performs real-time analysis and judgment, obtains qualified or unqualified test results, and then generates corresponding classification control signals to send to the storage mechanism 4, driving its guiding components to move, thereby realizing automatic sorting and storage of circuit boards. The master control switch is used to realize one-button start and stop of the entire device, ensuring operational safety. The entire system realizes full-process automation from feeding, positioning, testing to sorting.

[0045] In some embodiments, in order to meet the spatial arrangement and height matching requirements among the feeding mechanism 1, the pushing mechanism 2, the testing mechanism 3 and the storage mechanism 4, the circuit board electrical performance testing device of this application further includes: a main frame 6, a first support frame 7, a second support frame 8 and a third support frame 9.

[0046] A base platform is provided on the main frame 6 to support the central processing unit 10 and the material storage assembly 41 of the storage mechanism 4. A first support frame 7 is provided on the main frame 6 and has a first platform higher than the base platform. The material guiding assembly 42 and the vibration component 13 are mounted on this first platform. The material guiding assembly 42 is embedded through the first platform so that its outlet corresponds to each storage chamber of the material storage assembly 41 below. A second support frame 8 is provided on the first support frame 7 and has a second platform higher than the first platform. The pushing mechanism 2 and the testing mechanism 3 are mounted on this second platform. By setting the second platform at a higher position, the circuit board that has completed the test can fall into the material guiding assembly 42 located below it under the action of gravity after being released from the pushing mechanism 2. A third support frame 9 is provided on the base platform and has a third platform for placing the vibrating disc 11. The height of the third platform is configured such that when the vibrating disc 11 is placed on the third platform, the height of the discharge port of the vibrating disc 11 matches the height of the inlet 212 of the pushing mechanism 2, so that the conveying track 12 can be nearly parallel after being connected to the vibrating disc 11 and the pushing mechanism 2.

[0047] Specifically, in the technical solution adopted in this application, a layered main frame 6 and multiple support frames are used to accommodate multiple functional mechanisms within a limited floor space, and the automatic flow of materials is achieved through a rationally planned height difference. The height settings of each platform are guided by functional connection: the base platform carries the control and storage unit; the first platform carries the sorting guide and feeding drive unit; the second platform carries the positioning and testing unit, ensuring that the circuit board under test can be smoothly pushed into the testing station, and after testing, it can fall into the sorting channel by gravity; the third platform, through an adjustable or preset height design, ensures that the discharge port of the vibrating tray 11 and the inlet 212 of the pushing mechanism 2 are precisely connected to form a smooth feeding path. This structure is compact and logically clear, effectively ensuring the continuity and stability of the automated testing process.

[0048] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0050] Any process or method description in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or more executable instructions for implementing a particular logical function or process. Furthermore, the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functionality involved.

[0051] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus or device (such as a computer-based system, a processor-included system or other system that can fetch and execute instructions from, an instruction execution system, apparatus or device).

[0052] It should be understood that various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. All or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware, the program being stored in a computer-readable storage medium, which, when executed, includes one or a combination of the steps of the method embodiments.

[0053] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium. This storage medium can be a read-only memory, a disk, or an optical disk, etc.

[0054] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board electrical performance testing apparatus, characterized by, The application relates to a circuit board testing device, which comprises: a feeding mechanism for feeding circuit boards; a pushing mechanism, which is provided with a first station and a second station, the first station is connected with the output end of the feeding mechanism to receive the circuit boards from the feeding mechanism, and the pushing mechanism is used for moving the circuit boards in the first station to the second station; a testing mechanism, which is arranged on one side of the pushing mechanism, is provided with at least two testing contact parts, and each testing contact part can independently move towards the second station to perform electrical performance testing on the circuit boards when the testing contact part contacts the circuit boards in the second station; and a storage mechanism, which is arranged below the pushing mechanism, is used for classifying and storing the circuit boards which have completed electrical performance testing.

2. The circuit board electrical performance testing apparatus of claim 1, wherein, The pushing mechanism comprises: a pushing guide part, which is provided with a linear pushing channel, one side of the pushing guide part is provided with an inlet connected with the feeding mechanism, and the middle section of the linear pushing channel opposite to the inlet constitutes the first station; a pushing execution part, which is slidingly installed in the pushing guide part through the linear pushing channel; a pushing driving part, which is arranged on one side of the pushing guide part and is connected with one end of the pushing execution part, is used for driving the pushing execution part to linearly reciprocate along the linear pushing channel, and the end section of the linear pushing channel away from the pushing driving part constitutes the second station.

3. The circuit board electrical performance testing apparatus of claim 2, wherein, The pushing mechanism further comprises: a material sensing part, which is installed on the pushing guide part and is arranged corresponding to the first station, is signal-connected with the pushing driving part, and is used for sending a driving signal to the pushing driving part when the circuit boards are detected in the first station.

4. The circuit board electrical performance testing apparatus of claim 1, wherein, The testing mechanism comprises: a ring-shaped support, which is installed on one side of the pushing mechanism and is arranged in a surrounding manner on the second station; a first testing assembly and a second testing assembly, which are arranged on the ring-shaped support respectively and are used for contacting the circuit boards in the second station to perform electrical performance testing.

5. The circuit board electrical performance testing apparatus of claim 4, wherein, The first testing assembly comprises: a first driven part, which is slidingly installed on the ring-shaped support; a first fixed seat, which is fixed on one end of the first driven part close to the second station; a first testing probe, which is installed on the first driven part through the first fixed seat and points to the second station; a first driving part, which is connected with the first driven part to control the first testing probe to approach or move away from the second station by driving the first driven part to slide on the ring-shaped support; The second testing assembly comprises: a second driven part, which is slidingly installed on the ring-shaped support; a second fixed seat, which is fixed on one end of the second driven part close to the second station; a second testing probe, which is installed on the second driven part through the second fixed seat and points to the second station; A second driving component is connected with the second driven component to control the second test probe to approach or move away from the second station by driving the second driven component to slide on the annular support.

6. The circuit board electrical performance testing apparatus of claim 1, wherein, The storage mechanism comprises: The material storage assembly comprises a first storage chamber and two second storage chambers located on both sides of the first storage chamber, the first storage chamber is used for storing the circuit boards that fail in the electrical performance test, and the two second storage chambers are used for storing the circuit boards that pass the electrical performance test; The material guiding assembly is arranged above the material storage assembly, and comprises a first guiding channel and two second guiding channels, the first guiding channel is opposite to the first storage chamber, and the two second guiding channels are opposite to the two second storage chambers respectively; The material guiding assembly has a first state and a second state; When the material guiding assembly is in the first state, the first guiding channel is opened to guide the circuit boards into the first storage chamber; When the material guiding assembly is in the second state, the first guiding channel is closed and one of the second guiding channels is opened to guide the circuit boards into the corresponding second storage chamber.

7. The circuit board electrical performance testing apparatus of claim 6, wherein, The material guiding assembly comprises: A guiding cylinder is arranged directly above the material storage assembly, and has upper and lower end openings through which the circuit boards pass; A first rotating rod and a second rotating rod are rotatably arranged on opposite side walls of the guiding cylinder, and the first rotating rod and the second rotating rod are arranged at intervals along the length direction of the guiding cylinder; A first baffle is reversibly installed in the guiding cylinder through the first rotating rod; A second baffle is reversibly installed in the guiding cylinder through the second rotating rod; The first guiding channel is formed between the first baffle and the second baffle, and the two second guiding channels are formed on both sides of the first baffle and the second baffle respectively; When the first baffle and the second baffle are both in the vertical state, the material guiding assembly is in the first state; When the first baffle is in the vertical state and the second baffle is reversely turned to have its upper end overlapped on the first baffle, the material guiding assembly is in the second state, and the second baffle is used for guiding the circuit boards into the corresponding second guiding channel.

8. The circuit board electrical performance testing apparatus of claim 7, wherein, The material guiding assembly further comprises: A first transmission member is synchronously rotatably installed at the end of the first rotating rod and located outside the guiding cylinder, and a first mounting lug is arranged on the first transmission member; A third driving component is installed on the outer wall of the guiding cylinder, and the output end of the third driving component is hingedly connected with the first mounting lug, and is used for driving the first rotating rod and the first baffle to rotate; A second transmission member is synchronously rotatably installed at the end of the second rotating rod and located outside the guiding cylinder, and a second mounting lug is arranged on the second transmission member; A fourth driving component is installed on the outer wall of the guide cylinder, and the output end of the fourth driving component is hinged with the second mounting lug for driving the second rotating rod and the second rotating rod to rotate so as to drive the second baffle to overturn.

9. The circuit board electrical performance testing apparatus of claim 1, wherein, The feeding mechanism comprises: The inner wall of the vibrating disc is provided with a Teflon protective layer; A conveying track is connected between the vibrating disc and the pushing mechanism; A vibrating component is connected to the bottom of the conveying track for providing vibrating conveying power to the conveying track.

10. The circuit board electrical performance testing apparatus of claim 1, wherein, Further comprising: A central processing device is respectively connected with the feeding mechanism, the pushing mechanism, the testing mechanism and the storage mechanism for coordinating the operation of the feeding mechanism, the pushing mechanism, the testing mechanism and the storage mechanism according to the received signals; The central processing device comprises: A touch display screen is used for human-computer interaction and input parameter; A general control switch is used for controlling the start and stop of the feeding mechanism, the pushing mechanism, the testing mechanism and the storage mechanism; An electrical performance tester is electrically connected with the testing mechanism for analyzing the electrical performance parameters of the circuit board measured by the testing mechanism and sending a classification signal to the storage mechanism according to the analysis result.

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