Silicon wafer laser processing device and processing method thereof
By employing a flexible fixing and heat recovery mechanism, the problems of silicon wafer clamping damage and heat waste are solved, achieving efficient silicon wafer processing and resource conservation.
Patent Information
- Application Number
- CN202410968018.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-18
- Publication Date
- 2026-01-20
AI Technical Summary
Existing laser-processed silicon wafer equipment suffers from easy breakage of the silicon wafer clamping mechanism and lacks heat recovery and reuse capabilities, resulting in resource waste and increased production costs.
A flexible fixing mechanism is adopted to fit rectangular and circular silicon wafers. Combined with heat recovery and limiting mechanisms, the flexible fixing of silicon wafers and heat recovery and reuse are realized.
This effectively avoids damage to the silicon wafers during clamping, enables heat recovery and reuse, saves resources, and reduces production costs.
Smart Images
Figure CN121360892A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of silicon wafer processing, in particular to a laser processing silicon wafer device and a processing method thereof. BACKGROUND
[0002] Laser marking technology is one of the largest application fields of laser processing, which is a marking method that uses high-energy density laser to irradiate the workpiece locally, so that the surface layer material is vaporized or undergoes a chemical reaction to change color, thereby leaving a permanent mark.
[0003] Among them, a laser marking device needs to be used for marking processing when processing a silicon wafer. The fixing mechanism used in the existing laser processing silicon wafer device is rigidly fixed, and the silicon wafer has poor structural strength, which can easily cause the silicon wafer to be damaged during clamping. Moreover, the existing laser processing silicon wafer device does not realize heat recycling, thereby wasting resources.
[0004] In view of the above problems, the present application provides a laser processing silicon wafer device and a processing method thereof to solve the above problems. SUMMARY
[0005] In order to solve the problem that the fixing mechanism used in the existing laser processing silicon wafer device is rigidly fixed and can easily cause the silicon wafer to be damaged during clamping, and the heat is not recycled, the purpose of the present application is to provide a laser processing silicon wafer device and a processing method thereof.
[0006] To solve the above technical problems, the present application adopts the following technical scheme: a laser processing silicon wafer device, comprising a mounting chassis, a laser marking assembly is arranged on one side of the upper end of the mounting chassis, and a fixing mechanism is arranged on the other side of the upper end of the mounting chassis for cooperation, a heat dissipation mechanism is arranged on the inner side of the lower end of the mounting chassis for cooperation with the laser marking assembly, and a heat recovery mechanism and a limiting mechanism are arranged on the heat dissipation mechanism for cooperation, the use of the fixing mechanism can adapt to the fixing requirements of rectangular silicon wafers and circular silicon wafers, thereby effectively improving the practicality of the device, and the corresponding rectangular silicon wafer or circular silicon wafer to be marked can be flexibly fixed, thereby avoiding the phenomenon of clamping damage of the silicon wafer, the use of the heat recovery mechanism can suck indoor cold air and heat it in winter, and the heated air can be discharged to the indoor, thereby warming the indoor, thereby realizing heat recycling, without the need for air conditioning heating, thereby saving resources and reducing production costs, and the use of the limiting mechanism ensures the normal use of the heat recovery mechanism.
[0007] Preferably, the fixing mechanism comprises an electric telescopic rod and a water storage cylinder, the electric telescopic rod is fixedly installed at one side of the top end of the mounting chassis, the output end of the electric telescopic rod is slidably penetrated through the mounting chassis and is fixedly sleeved with a lifting support at the end thereof, the lifting support is integrally formed with a sliding guide block, a sliding guide groove is formed at one side of the upper end of the mounting chassis, the sliding guide block is slidably inserted into the sliding guide groove, a flow guide cylinder is fixedly inserted at the bottom end of the lifting support, Z-shaped flow guide grooves and flow guide recesses are formed in the flow guide cylinder, a first L-shaped pipe is fixedly connected at one end of the flow guide cylinder and cooperates with the Z-shaped flow guide grooves, a driven gear is rotatably sleeved on the flow guide cylinder and cooperates with the driven gear, symmetrical connecting rods are fixedly installed at one side of the driven gear, a rectangular pressing frame is fixedly installed at one end of the two connecting rods, first clamping seats are integrally formed at the bottom end of the rectangular pressing frame, first insertion pipes are fixedly inserted into the first clamping seats, a U-shaped pressing pipe and an L-shaped pressing pipe are in communication between the three first insertion pipes and cooperate with each other, a first flow guide pipe is in communication with the U-shaped pressing pipe, a ring-shaped pressing frame is fixedly installed at the other end of the two connecting rods, second clamping seats are integrally formed at the top end of the ring-shaped pressing frame, second insertion pipes are fixedly inserted into the second clamping seats, a first arc-shaped pressing pipe and a second arc-shaped pressing pipe are in communication between the three second insertion pipes and cooperate with each other, a second flow guide pipe is in communication with the second arc-shaped pressing pipe, the end of the second flow guide pipe and the end of the first flow guide pipe are slidably attached to the inner wall of the flow guide recess, a first electric push rod is fixedly inserted at the upper end of the lifting support, a driving push block is fixedly sleeved at the output end of the first electric push rod, an L-shaped connecting rod is fixedly connected to the driving push block, a driving rack is fixedly installed at the end of the L-shaped connecting rod and is engaged with the driven gear, the water storage cylinder is fixedly inserted into the mounting chassis, a water supplement pipe is in communication with the water storage cylinder, a sealing pipe cover is detachably sleeved on the water supplement pipe, one end of the water storage cylinder is in communication with a second L-shaped pipe, the end of the second L-shaped pipe is fixedly connected with a first hose, the end of the first hose is fixedly connected with the first L-shaped pipe, a second electric push rod is fixedly inserted into the mounting chassis, a driving piston is fixedly sleeved at the output end of the second electric push rod and is movably inserted into the water storage cylinder.
[0008] Preferably, the heat dissipation mechanism includes a water chiller body fixedly installed at the inner lower end of the mounting chassis, and a water outlet pipe is provided at the lower end of the water chiller body and fixedly inserted into the mounting chassis, and the distal end of the water outlet pipe is fixedly connected with a second hose, the distal end of the second hose is fixedly connected with a third L-shaped pipe, the distal end of the third L-shaped pipe is fixedly connected with the laser marking assembly, a fourth L-shaped pipe is fixedly connected with the laser marking assembly, the distal end of the fourth L-shaped pipe is fixedly connected with a third hose, the distal end of the third hose is fixedly connected with a return pipe, the return pipe is fixedly inserted into the mounting chassis, the distal end of the return pipe is in communication with the upper end of the water chiller body on one side, and the heat recovery mechanism includes a first frame body fixedly connected with the water chiller body, a second frame body is detachably provided at one side of the first frame body, a sealing ring is fixedly connected at one end of the second frame body, a sealing groove is formed at one end of the first frame body, the sealing ring is movably inserted into the sealing groove, a driving motor is fixedly installed on the second frame body, and a driving fan blade is rotatably penetrated through the second frame body and fixedly sleeved at the distal end of the driving motor, an air inlet slot is formed through the second frame body and used in cooperation with the driving fan blade, an air outlet hole is formed at one side of the first frame body and used in cooperation with the air inlet slot, a blocking filter plate is detachably provided at one end of the first frame body close to the second frame body, a serpentine heat pipe is fixedly inserted into the inner cavity of the first frame body, heat fins are fixedly sleeved on the outer side of the serpentine heat pipe and used in cooperation, one end of the serpentine heat pipe is fixedly connected with the return pipe, and the other end of the serpentine heat pipe is in communication with the water chiller body.
[0009] Preferably, the limiting mechanism includes a first side block and a second side block, the first side block is fixedly connected with the second frame body, a rotating through hole is formed through the first side block, a T-shaped rotating rod is rotatably inserted into the rotating through hole, a rotating ring groove is formed in the inner wall of the rotating through hole, a rotating snap ring is fixedly sleeved at one end of the T-shaped rotating rod and rotatably clamped in the rotating ring groove, a limiting rotating block is fixedly connected at the distal end of the T-shaped rotating rod, a reset torsional spring is fixedly installed at one side of the limiting rotating block and movably sleeved on the T-shaped rotating rod, the distal end of the reset torsional spring is fixedly connected with the first side block, the second side block is fixedly connected with the first frame body, and a limiting insertion slot is formed through the second side block.
[0010] A processing method of a laser processing silicon wafer device, comprising the following steps:
[0011] Step one, according to the shape of the silicon wafer to be marked, adjust the fixing mechanism, if the silicon wafer to be marked is square, no adjustment is needed to carry out the marking of the silicon wafer, if the silicon wafer to be marked is circular, start the first electric push rod, so as to drive the driving block to move to the side close to the lifting support, further drive the L-shaped connecting rod to move to the side close to the lifting support, further drive the driving rack to move, so as to drive the driven gear to rotate, further drive the rectangular pressing frame and the annular pressing frame to rotate through the connecting rod, and close the first electric push rod when the rectangular pressing frame and the annular pressing frame rotate one hundred and eighty degrees, at this time the first flow guide pipe will be blocked, and the second flow guide pipe will be connected with the Z-shaped flow guide groove, then the subsequent silicon wafer marking operation can be carried out, and then the fixing mechanism can be adjusted according to the above steps;
[0012] Step two, place the silicon wafer to be marked on the mounting base, then start the electric telescopic rod, so as to drive the lifting support to move down, further drive the flow guide cylinder and the like to move down, further drive the rectangular pressing frame and the annular pressing frame to move down, so as to drive the first insertion pipe, the U-shaped pressing pipe, the L-shaped pressing pipe, the second insertion pipe, the first arc-shaped pressing pipe and the second arc-shaped pressing pipe to move down, when the U-shaped pressing pipe and the L-shaped pressing pipe contact the top of the rectangular silicon wafer to be marked or the first arc-shaped pressing pipe and the second arc-shaped pressing pipe contact the top of the circular silicon wafer to be marked, close the electric telescopic rod, then start the second electric push rod, so as to drive the driving piston to move to the side close to the second L-shaped pipe, further drive the water source in the water storage cylinder into the first L-shaped pipe through the second L-shaped pipe and the first hose, further drive the water source in the water storage cylinder into the first flow guide pipe or the second flow guide pipe through the Z-shaped flow guide groove, so as to drive the water source in the water storage cylinder into the first insertion pipe, the U-shaped pressing pipe and the L-shaped pressing pipe or the second insertion pipe, the first arc-shaped pressing pipe and the second arc-shaped pressing pipe, so as to make the U-shaped pressing pipe and the L-shaped pressing pipe swell and deform by water or make the first arc-shaped pressing pipe and the second arc-shaped pressing pipe swell and deform by water, further to flexibly fix the corresponding rectangular silicon wafer or circular silicon wafer to be marked, and close the second electric push rod after fixing the corresponding rectangular silicon wafer or circular silicon wafer to be marked;
[0013] Step three, start the laser marking assembly and the water cooling machine body, so that the fixed silicon wafer can be marked, at the same time, the water cooling machine body can guide the cold water into the laser marking assembly through the water outlet pipe, the second hose and the third L-shaped pipe for cooling treatment, and the heat absorbed hot water will be returned to the water cooling machine body through the fourth L-shaped pipe, the third hose, the return pipe and the serpentine heat pipe for cooling treatment, during which, if the marking operation is carried out in winter, the driving motor is started, so that the driving fan blade can be driven to rotate, so that the indoor cold air can be sucked into the second frame, and then the interception filter plate can intercept the dust in the sucked cold air, and the filtered cold air can be guided into the first frame, at this time, the cold air can absorb the heat conducted from the serpentine heat pipe, so that the cold air can be heated, and the heated air can be guided out through the air outlet perforation, then the fixing mechanism is removed and the marked silicon wafer is taken off, and then the subsequent silicon wafer fixing and marking operation is carried out according to the above steps;
[0014] Step four, during subsequent use, when the interception filter plate needs to be cleaned or replaced, the two limiting blocks are rotated synchronously, so that the corresponding T-shaped rotating rod can be rotated, and the corresponding reset torsional spring can be twisted, when the limiting block is rotated by one hundred and eighty degrees, the two limiting blocks are pushed away from the first frame, so that the limiting block can be clamped into the corresponding limiting slot, then the limiting block is loosened and the second frame is moved away from the first frame, until the limiting block is completely separated from the corresponding limiting slot, the second frame is taken off, then the interception filter plate is cleaned or replaced, and after the cleaning or replacement operation is completed, the second frame is reset and fixed.
[0015] Compared with the prior art, the beneficial effects of the present application are that:
[0016] 1. Through the use of the fixing mechanism, the position of the rectangular compression frame and the annular compression frame can be conveniently adjusted, so that the position of the first insertion pipe, the U-shaped compression pipe, the L-shaped compression pipe, the second insertion pipe, the first arc-shaped compression pipe and the second arc-shaped compression pipe can be conveniently adjusted, so that the fixing requirements of rectangular silicon wafers and circular silicon wafers can be adapted, thereby effectively improving the practicality of the device, and the water source can be guided into the first insertion pipe, the U-shaped compression pipe and the L-shaped compression pipe, or the second insertion pipe, the first arc-shaped compression pipe and the second arc-shaped compression pipe, so that the U-shaped compression pipe and the L-shaped compression pipe can be water-filled and deformed, or the first arc-shaped compression pipe and the second arc-shaped compression pipe can be water-filled and deformed, so that the corresponding rectangular silicon wafer or circular silicon wafer to be marked can be flexibly fixed, thereby avoiding the phenomenon of damage to the silicon wafer caused by clamping;
[0017] 2. Through the use of the heat recovery mechanism, indoor cold air can be drawn into the second frame in winter and the dust in the drawn-in cold air can be intercepted by the interception filter plate. The filtered cold air is then introduced into the first frame and can absorb the heat conducted by the heat-conducting fins from the serpentine heat-conducting pipe, thereby heating the cold air and then leading the heated air into the room, thus raising the indoor temperature. This achieves heat recovery and reuse, eliminating the need for air conditioning heating, thereby saving resources and reducing production costs.
[0018] 3. The use of the limiting mechanism facilitates the locking and engagement of the limiting block and the second side block, and makes it easy to disassemble later. This facilitates the connection, fixation and separation of the first frame and the second frame, and in turn facilitates the cleaning and replacement of the filter plate, as well as the operation and use of the user. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a schematic diagram of the structure of the present invention.
[0021] Figure 2 This is a schematic diagram of the heat dissipation mechanism installation in this invention.
[0022] Figure 3 For the present invention Figure 2 Enlarged schematic diagram of the structure at point A in the middle.
[0023] Figure 4 For the present invention Figure 2 Enlarged schematic diagram of the structure at point B.
[0024] Figure 5 For the present invention Figure 2 Enlarged schematic diagram of the structure at point C.
[0025] Figure 6 For the present invention Figure 2 Enlarged schematic diagram of the structure at point D.
[0026] Figure 7 This is a schematic diagram of the connection of the fixing mechanism in this invention.
[0027] Figure 8 For the present invention Figure 7 Enlarged schematic diagram of the structure at point E in the middle.
[0028] Figure 9 For the present invention Figure 7 Structure enlarged schematic view at F in the present invention.
[0029] Figure 10 For the present invention Figure 7 Structure enlarged schematic view at G in the present invention.
[0030] Figure 11 Connection schematic view of heat recovery mechanism in the present invention.
[0031] Figure 12 For the present invention Figure 11 Structure enlarged schematic view at H in the present invention.
[0032] In the figure: 1, mounting chassis; 11, sliding guide groove; 2, laser marking assembly; 3, fixing mechanism; 31, electric telescopic rod; 32, water storage cylinder; 33, lifting support; 34, flow guide cylinder; 35, Z-shaped flow guide groove; 36, flow guide groove; 37, first L-shaped pipe; 38, driven gear; 39, connecting strut; 310, rectangular pressing frame; 311, first clamping seat; 312, first insertion pipe; 313, U-shaped pressing pipe; 314, L-shaped pressing pipe; 315, first flow guide pipe; 316, annular pressing frame; 317, second clamping seat; 318, second insertion pipe; 319, first arc-shaped pressing pipe; 320, second arc-shaped pressing pipe; 321, second flow guide pipe; 322, first electric push rod; 323, driving push block; 324, L-shaped connecting rod; 325, driving rack; 326, second L-shaped pipe; 327, first hose; 328, second electric push rod; 329, driving piston; 330, sliding guide block; 331, water supplement pipe body; 332, plugging pipe cover; 4, heat dissipation mechanism; 41, water cooling machine body; 42, water outlet guide pipe; 43, second hose; 44, third L-shaped pipe; 45, fourth L-shaped pipe; 46, third hose; 47, backflow guide pipe; 5, heat recovery mechanism; 51, first frame body; 52, second frame body; 53, driving motor; 54, driving fan blade; 55, air inlet through slot; 56, interception filter plate; 57, serpentine heat conducting pipe; 58, heat conducting fin; 59, sealing ring; 510, sealing clamping groove; 6, limiting mechanism; 61, first side block; 62, second side block; 63, rotating through hole; 64, T-shaped rotating rod; 65, limiting rotating block; 66, reset torsional spring; 67, limiting insertion slot; 68, rotating clamping ring; 69, rotating ring groove. DETAILED DESCRIPTION
[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0034] Example: Figures 1-12 As shown, this invention provides a laser processing silicon wafer apparatus, including a mounting base 1. A laser marking component 2 is provided on the upper end of one side of the mounting base 1. The laser marking component 2 is adjustable in position and performs laser marking, which is prior art and will not be described in detail here. A fixing mechanism 3 is provided on the upper end of the other side of the mounting base 1 for use with it. A heat dissipation mechanism 4 is provided on the lower inner side of the mounting base 1 for use with the laser marking component 2. The heat dissipation mechanism 4 is equipped with a heat recovery mechanism 5 and a limiting mechanism 6 for use with it. The fixing mechanism 3 is designed to accommodate rectangular and circular silicon wafers. The device effectively improves the practicality of the silicon wafer fixing requirement and can flexibly fix the corresponding rectangular or circular silicon wafers to be marked, thereby avoiding the phenomenon of silicon wafer clamping damage. The heat recovery mechanism 5 can draw in cold indoor air in winter and heat it, and can also exhaust the heated air into the room to raise the indoor temperature, thereby realizing heat recovery and reuse without the need for air conditioning heating, thus saving resources and reducing production costs. The setting of the limiting mechanism 6 ensures the normal operation of the heat recovery mechanism 5.
[0035] The fixing mechanism 3 comprises an electric telescopic rod 31 and a water storage cylinder 32. The electric telescopic rod 31 is fixedly installed at the top end of the mounting chassis 1, and the output end of the electric telescopic rod 31 slidably penetrates the mounting chassis 1 and is fixedly sleeved with a lifting support 33 at the end thereof. The lifting support 33 is integrally formed with a sliding guide block 330. A sliding guide groove 11 is formed in the side upper end of the mounting chassis 1. The sliding guide block 330 is slidably inserted into the sliding guide groove 11. The cooperation between the sliding guide block 330 and the sliding guide groove 11 ensures the stable sliding of the lifting support 33. The bottom end of the lifting support 33 is fixedly inserted with a flow guide cylinder 34. The flow guide cylinder 34 is provided with a Z-shaped flow guide groove 35 and a flow guide recess 36 in cooperation. One end of the flow guide cylinder 34 is fixedly connected with a first L-shaped pipe 37 in cooperation with the Z-shaped flow guide groove 35. The flow guide cylinder 34 is rotatably sleeved with a driven gear 38 in cooperation. The driven gear 38 is fixedly installed with symmetrically arranged connecting rods 39 on one side. The one end of the two connecting rods 39 is fixedly installed with a rectangular pressing frame 310. The bottom end of the rectangular pressing frame 310 is integrally formed with an array of first clamping seats 311. The first clamping seats 311 are fixedly inserted with first insertion pipes 312. The three first insertion pipes 312 are communicated with a U-shaped pressing pipe 313 and an L-shaped pressing pipe 314 in cooperation. The U-shaped pressing pipe 313 is communicated with a first flow guide pipe 315. The other end of the two connecting rods 39 is fixedly installed with an annular pressing frame 316. The top end of the annular pressing frame 316 is integrally formed with an array of second clamping seats 317. The second clamping seats 317 are fixedly inserted with second insertion pipes 318. The three second insertion pipes 318 are communicated with a first arc-shaped pressing pipe 319 and a second arc-shaped pressing pipe 320 in cooperation. The second arc-shaped pressing pipe 320 is communicated with a second flow guide pipe 321. The ends of the second flow guide pipe 321 and the first flow guide pipe 315 are slidably attached to the inner wall of the flow guide recess 36. The upper end of the lifting support 33 is fixedly inserted with a first electric push rod 322. The output end of the first electric push rod 322 is fixedly sleeved with a driving push block 323. The driving push block 323 is fixedly connected with an L-shaped connecting rod 324. The end of the L-shaped connecting rod 324 is fixedly installed with a driving rack 325. The driving rack 325 is engaged with the driven gear 38. The water storage cylinder 32 is fixedly inserted into the mounting chassis 1. The water storage cylinder 32 is communicated with a water supplement pipe 331. The water supplement pipe 331 is detachably sleeved with a sealing pipe cover 332. The cooperation between the water supplement pipe 331 and the sealing pipe cover 332 facilitates the water supplement in the water storage cylinder 32. One end of the water storage cylinder 32 is communicated with a second L-shaped pipe 326. The end of the second L-shaped pipe 326 is fixedly connected with a first hose 327. The end of the first hose 327 is fixedly connected with the first L-shaped pipe 37. The mounting chassis 1 is fixedly inserted with a second electric push rod 328. The output end of the second electric push rod 328 is fixedly sleeved with a driving piston 329. The driving piston 329 is movably inserted into the water storage cylinder 32.
[0036] By adopting the above technical scheme, according to the shape of the silicon wafer to be marked, if the silicon wafer to be marked is square, the marking operation of the silicon wafer can be carried out without adjustment, if the silicon wafer to be marked is circular, the first electric push rod 322 is started, thereby driving the driving push block 323 to move to the side close to the lifting support 33, further driving the L-shaped connecting rod 324 to move to the side close to the lifting support 33, further driving the driving rack 325 to move, thereby driving the driven gear 38 to rotate, further driving the rectangular pressing frame 310 and the annular pressing frame 316 to rotate through the connecting rod 39, and closing the first electric push rod 322 when the rectangular pressing frame 310 and the annular pressing frame 316 rotate one hundred and eighty degrees, at this time the first flow guide pipe 315 is blocked, and the second flow guide pipe 321 is in communication with the Z-shaped flow guide groove 35, then the subsequent silicon wafer marking operation can be carried out, and then the fixing mechanism 3 can be adjusted according to the above steps, the silicon wafer to be marked is placed on the mounting base 1, then the electric telescopic rod 31 is started, thereby driving the lifting support 33 to move down, further driving the flow guide cylinder 34 to move down, further driving the rectangular pressing frame 310 and the annular pressing frame 316 to move down, thereby driving the first insertion pipe 312, the U-shaped pressing pipe 313, the L-shaped pressing pipe 314, the second insertion pipe 318, the first arc-shaped pressing pipe 319 and the second arc-shaped pressing pipe 320 to move down, when the U-shaped pressing pipe 313 and the L-shaped pressing pipe 314 contact the top of the rectangular silicon wafer to be marked or the first arc-shaped pressing pipe 319 and the second arc-shaped pressing pipe 320 contact the top of the circular silicon wafer to be marked, the electric telescopic rod 31 is closed, then the second electric push rod 328 is started, thereby driving the driving piston 329 to move to the side close to the second L-shaped pipe 326, further driving the water source in the water storage cylinder 32 to be introduced into the first L-shaped pipe 37 through the second L-shaped pipe 326 and the first hose 327, further driving the water source in the water storage cylinder 32 to be introduced into the first flow guide pipe 315 or the second flow guide pipe 321 through the Z-shaped flow guide groove 35, thereby driving the water source in the water storage cylinder 32 to be introduced into the first insertion pipe 312, the U-shaped pressing pipe 313 and the L-shaped pressing pipe 314 or the second insertion pipe 318, the first arc-shaped pressing pipe 319 and the second arc-shaped pressing pipe 320, thereby making the U-shaped pressing pipe 313 and the L-shaped pressing pipe 314 swell and deform or making the first arc-shaped pressing pipe 319 and the second arc-shaped pressing pipe 320 swell and deform, further flexibly fixing the corresponding rectangular silicon wafer or circular silicon wafer to be marked, and closing the second electric push rod 328 after fixing the corresponding rectangular silicon wafer or circular silicon wafer to be marked.
[0037] The heat dissipation mechanism 4 comprises a water cooling machine body 41 fixedly installed at the inner lower end of the mounting chassis 1, and the lower end of the water cooling machine body 41 is provided with a water outlet pipe 42 fixedly inserted into the mounting chassis 1, and the tail end of the water outlet pipe 42 is fixedly connected with a second hose 43, the tail end of the second hose 43 is fixedly connected with a third L-shaped pipe 44, and the tail end of the third L-shaped pipe 44 is fixedly connected with the laser marking assembly 2, and the laser marking assembly 2 is fixedly connected with a fourth L-shaped pipe 45 used in cooperation, and the tail end of the fourth L-shaped pipe 45 is fixedly connected with a third hose 46, the tail end of the third hose 46 is fixedly connected with a return flow pipe 47 fixedly inserted into the mounting chassis 1, and the tail end of the return flow pipe 47 is in communication with the upper end of the water cooling machine body 41, and the heat recovery mechanism 5 comprises a first frame body 51 fixedly connected with the water cooling machine body 41, and the side of the first frame body 51 is detachably provided with a second frame body 52, one end of the second frame body 52 is fixedly connected with a sealing ring 59, and one end of the first frame body 51 is provided with a sealing groove 510, the sealing ring 59 can be movably inserted into the sealing groove 510, and the cooperation of the sealing ring 59 and the sealing groove 510 provides a guarantee for the sealing of the insertion joint of the first frame body 51 and the second frame body 52, a driving motor 53 is fixedly installed on the second frame body 52, and the output end of the driving motor 53 is rotatably penetrated through the second frame body 52 and fixedly sleeved with a driving fan blade 54 at the tail end, a air inlet slot 55 is penetrated through and provided on the second frame body 52 and used in cooperation with the driving fan blade 54, and the side of the first frame body 51 is provided with an air outlet hole used in cooperation with the air inlet slot 55, the end of the first frame body 51 close to the second frame body 52 is detachably provided with a cooperation intercepting filter plate 56, a serpentine heat conducting pipe 57 is fixedly inserted into the inner cavity of the first frame body 51, heat conducting fins 58 are fixedly sleeved on the outer side of the serpentine heat conducting pipe 57 and used in cooperation, one end of the serpentine heat conducting pipe 57 is fixedly connected with the return flow pipe 47, and the other end of the serpentine heat conducting pipe 57 is in communication with the water cooling machine body 41.
[0038] By adopting the above technical scheme, the laser marking assembly 2 and the water cooler body 41 are started, so that the fixed silicon wafer can be marked, at the same time, the water cooler body 41 can guide the cold water into the laser marking assembly 2 through the water outlet pipe 42, the second hose 43 and the third L-shaped pipe 44 for cooling treatment, and the heat-absorbed hot water is returned to the water cooler body 41 through the fourth L-shaped pipe 45, the third hose 46, the return pipe 47 and the serpentine heat pipe 57 for cooling treatment. During this period, if the marking operation is carried out in winter, the driving motor 53 is started, so that the driving fan blade 54 can be driven to rotate, and then the indoor cold air can be sucked into the second frame body 52, and then the interception filter plate 56 can intercept the dust in the sucked cold air, and the filtered cold air can be guided into the first frame body 51, at this time, the cold air can absorb the heat conducted out of the serpentine heat pipe 57 by the heat conduction fin 58, so that the cold air can be heated, and the heated air can be guided out through the air outlet perforation, then the fixing mechanism 3 is removed and the marked silicon wafer is taken down, and then the subsequent silicon wafer fixing and marking operation is carried out according to the above steps.
[0039] The limiting mechanism 6 comprises a first side block 61 and a second side block 62, the first side block 61 is fixedly connected with the second frame body 52, a rotating through hole 63 is formed through the first side block 61, a T-shaped rotating rod 64 is rotatably inserted into the rotating through hole 63, a rotating clasp 68 is fixedly sleeved on one end of the T-shaped rotating rod 64, a rotating ring groove 69 is formed in the inner wall of the rotating through hole 63, the rotating clasp 68 is rotatably clamped in the rotating ring groove 69, the cooperation between the rotating clasp 68 and the rotating ring groove 69 provides protection for the stable rotation of the T-shaped rotating rod 64, the other end of the T-shaped rotating rod 64 is fixedly connected with a limiting rotating block 65, a reset torsional spring 66 is fixedly installed on one side of the limiting rotating block 65, the reset torsional spring 66 is movably sleeved on the T-shaped rotating rod 64, the other end of the reset torsional spring 66 is fixedly connected with the first side block 61, the other end of the reset torsional spring 66 is fixedly connected with the first side block 61 through a sleeve ring, and the sleeve ring is rotatably sleeved on the T-shaped rotating rod 64. This is prior art, which will not be described in detail here, and the second side block 62 is fixedly connected with the first frame body 51, a limiting insertion groove 67 is formed through the second side block 62, and the limiting rotating block 65 can slidably penetrate the limiting insertion groove 67.
[0040] By adopting the technical scheme, during subsequent use, when the intercepting filter plate 56 needs to be cleaned or replaced, the two limiting rotating blocks 65 are synchronously rotated, so as to drive the corresponding T-shaped rotating rod 64 to rotate, and then the corresponding reset torsional spring 66 can be twisted, when the limiting rotating block 65 is rotated by one hundred and eighty degrees, the two limiting rotating blocks 65 are pushed to the side away from the first frame body 51, so that the limiting rotating block 65 can be clamped into the corresponding limiting slot 67, then the limiting rotating block 65 is loosened and the second frame body 52 is moved to the side away from the first frame body 51, until the limiting rotating block 65 is completely separated from the corresponding limiting slot 67, the second frame body 52 is removed, then the intercepting filter plate 56 is cleaned or replaced, and after the cleaning or replacement operation is completed, the second frame body 52 is reset and fixed.
[0041] A processing method of a laser processing silicon wafer device, comprising the following steps:
[0042] Step one, adjust the fixing mechanism 3 according to the shape of the silicon wafer to be marked, if the silicon wafer to be marked is square, no adjustment is needed to carry out the marking operation of the silicon wafer, if the silicon wafer to be marked is circular, start the first electric push rod 322, so as to drive the driving push block 323 to move to the side close to the lifting support 33, then drive the L-shaped connecting rod 324 to move to the side close to the lifting support 33, further drive the driving rack 325 to move, so as to drive the driven gear 38 to rotate, then drive the rectangular pressing frame 310 and the annular pressing frame 316 to rotate through the connecting rod 39, and when the rectangular pressing frame 310 and the annular pressing frame 316 are rotated by one hundred and eighty degrees, the first electric push rod 322 is closed, at this time, the first flow guide pipe 315 is blocked, and the second flow guide pipe 321 is connected with the Z-shaped flow guide groove 35, then the subsequent silicon wafer marking operation can be carried out, and then the fixing mechanism 3 can be adjusted according to the above steps;
[0043] Step two, place the silicon wafer to be marked on the mounting chassis 1, then start the electric telescopic rod 31, which can drive the lifting bracket 33 to move down, and then drive the flow cylinder 34 to move down, further drive the rectangular pressure frame 310 and the annular pressure frame 316 to move down, so that the first insertion pipe 312, the U-shaped pressure pipe 313, the L-shaped pressure pipe 314, the second insertion pipe 318, the first arc-shaped pressure pipe 319 and the second arc-shaped pressure pipe 320 move down, when the U-shaped pressure pipe 313 and the L-shaped pressure pipe 314 contact the top of the rectangular silicon wafer to be marked, or the first arc-shaped pressure pipe 319 and the second arc-shaped pressure pipe 320 contact the top of the circular silicon wafer to be marked, turn off the electric telescopic rod 31, then start the second electric push rod 328, which can drive the drive piston 329 to move towards the side close to the second L-shaped pipe 326, then the water source in the water storage cylinder 32 is guided into the first L-shaped pipe 37 through the second L-shaped pipe 326 and the first hose 327, further the water source in the water storage cylinder 32 is guided into the first flow guide pipe 315 or the second flow guide pipe 321 through the Z-shaped flow guide groove 35, so that the water source in the water storage cylinder 32 is guided into the first insertion pipe 312, the U-shaped pressure pipe 313 and the L-shaped pressure pipe 314, or the second insertion pipe 318, the first arc-shaped pressure pipe 319 and the second arc-shaped pressure pipe 320, so that the U-shaped pressure pipe 313 and the L-shaped pressure pipe 314 are water-filled and deformed, or the first arc-shaped pressure pipe 319 and the second arc-shaped pressure pipe 320 are water-filled and deformed, then the corresponding rectangular silicon wafer or circular silicon wafer to be marked is flexibly fixed, and the second electric push rod 328 is turned off after the corresponding rectangular silicon wafer or circular silicon wafer to be marked is fixed;
[0044] Step three, start the laser marking assembly 2 and the water cooler body 41, so that the fixed silicon wafer can be marked, at the same time, the water cooler body 41 can guide the cold water into the laser marking assembly 2 through the water outlet pipe 42, the second hose 43 and the third L-shaped pipe 44 for cooling treatment, and the heat-absorbed hot water is returned to the water cooler body 41 through the fourth L-shaped pipe 45, the third hose 46, the return flow pipe 47 and the serpentine heat pipe 57 for cooling treatment, during which, if the marking operation is carried out in winter, the drive motor 53 is started, which can drive the drive fan blade 54 to rotate, then the interception filter plate 56 can intercept the dust in the suction cold air, and the filtered cold air is guided into the first frame 51, at this time, the cold air can absorb the heat from the heat dissipation fins 58 in the serpentine heat pipe 57, so that the cold air can be heated, and the heated air is guided out through the air outlet perforation, then the fixing mechanism 3 is removed and the marked silicon wafer is taken down, then the subsequent silicon wafer fixing and marking operation is carried out according to the above steps;
[0045] Step four, during the subsequent use, when the interception filter plate 56 needs to be cleaned or replaced, the two limiting rotating blocks 65 are synchronously rotated, so as to drive the corresponding T-shaped rotating rod 64 to rotate, and then the corresponding reset torsional spring 66 is twisted, when the limiting rotating block 65 rotates one hundred and eighty degrees, the two limiting rotating blocks 65 are pushed to the side away from the first frame body 51, so that the limiting rotating block 65 is clamped into the corresponding limiting slot 67, then the limiting rotating block 65 is loosened and the second frame body 52 is moved to the side away from the first frame body 51, until the limiting rotating block 65 is completely separated from the corresponding limiting slot 67, the second frame body 52 is removed, then the interception filter plate 56 is cleaned or replaced, and after the cleaning or replacement work is completed, the second frame body 52 is reset and fixed.
[0046] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.
Claims
1. A device for laser processing of silicon wafers, comprising a mounting chassis (1), characterized in that: The side upper end of the mounting chassis (1) is provided with a laser marking assembly (2), and the other side upper end of the mounting chassis (1) is provided with a fixed mechanism (3) used in cooperation, the inner side lower end of the mounting chassis (1) is provided with a heat dissipation mechanism (4) used in cooperation with the laser marking assembly (2), and the heat dissipation mechanism (4) is provided with a heat recovery mechanism (5) and a limiting mechanism (6) used in cooperation, the setting of the fixed mechanism (3) can adapt to the fixing requirements of rectangular silicon wafers and circular silicon wafers, thereby effectively improving the practicability of the device, and the corresponding rectangular silicon wafers or circular silicon wafers to be marked can be flexibly fixed, thereby avoiding the phenomenon of clamping damage of the silicon wafers, the setting of the heat recovery mechanism (5) can suck indoor cold air in and heat it in winter, and the heated air can be discharged to the indoor, thereby the indoor can be warmed, thereby realizing the recycling of heat, without air conditioning heating, thereby saving resources and reducing production cost, and the setting of the limiting mechanism (6) ensures the normal use of the heat recovery mechanism (5).
2. A laser processing silicon wafer apparatus as claimed in claim 1, wherein, The fixed mechanism (3) includes an electric telescopic rod (31) and a water storage cylinder (32), the electric telescopic rod (31) is fixedly installed on the top end side of the mounting chassis (1), and the output end of the electric telescopic rod (31) is slidably penetrated through the mounting chassis (1) and is fixedly sleeved with a lifting support (33) at the end thereof, the bottom end of the lifting support (33) is fixedly inserted with a flow guide cylinder (34), and the flow guide cylinder (34) is provided with a Z-shaped flow guide groove (35) and a flow guide groove (36) matched for use, one end of the flow guide cylinder (34) is fixedly connected with a first L-shaped pipe (37) matched for use with the Z-shaped flow guide groove (35), and the flow guide cylinder (34) is rotatably sleeved with a driven gear (38) matched for use, one side of the driven gear (38) is fixedly installed with symmetrically arranged connecting struts (39), and one end of the two connecting struts (39) is fixedly installed with a rectangular pressing frame (310), the bottom end of the rectangular pressing frame (310) is integrally formed with an array of first clamping seats (311), and the first clamping seats (311) are fixedly inserted with first insertion pipes (312), the three first insertion pipes (312) are communicated with a U-shaped pressing pipe (313) and an L-shaped pressing pipe (314) matched for use, and the U-shaped pressing pipe (313) is communicated with a first flow guide pipe (315), the other end of the two connecting struts (39) is fixedly installed with an annular pressing frame (316), and the top end of the annular pressing frame (316) is integrally formed with an array of second clamping seats (317), the second clamping seats (317) are fixedly inserted with second insertion pipes (318), and the three second insertion pipes (318) are communicated with a first arc-shaped pressing pipe (319) and a second arc-shaped pressing pipe (320) matched for use, the second arc-shaped pressing pipe (320) is communicated with a second flow guide pipe (321), and the ends of the second flow guide pipe (321) and the first flow guide pipe (315) are slidably attached to the inner wall of the flow guide groove (36), the upper end of the lifting support (33) is fixedly inserted with a first electric push rod (322), and the output end of the first electric push rod (322) is fixedly sleeved with a driving push block (323), the driving push block (323) is fixedly connected with an L-shaped connecting rod (324), and the end of the L-shaped connecting rod (324) is fixedly installed with a driving rack (325), the driving rack (325) is engaged with the driven gear (38), the water storage cylinder (32) is fixedly inserted in the mounting chassis (1), and one end of the water storage cylinder (32) is communicated with a second L-shaped pipe (326), the end of the second L-shaped pipe (326) is fixedly connected with a first hose (327), and the end of the first hose (327) is fixedly connected with the first L-shaped pipe (37), the mounting chassis (1) is fixedly inserted with a second electric push rod (328), and the output end of the second electric push rod (328) is fixedly sleeved with a driving piston (329), and the driving piston (329) is movably inserted in the water storage cylinder (32).
3. A laser processing silicon wafer apparatus as claimed in claim 2, wherein, The lifting support (33) is integrally formed with a sliding guide block (330), and a sliding guide groove (11) is formed through the upper end of one side of the mounting base (1), and the sliding guide block (330) is slidingly inserted into the sliding guide groove (11).
4. A laser processing silicon wafer apparatus as described in claim 2, wherein, The water storage cylinder (32) is communicated with a water supplement pipe body (331), and the water supplement pipe body (331) is detachably sleeved with a blocking pipe cover (332).
5. The laser processing device for silicon wafers as described in claim 1, characterized in that, The heat dissipation mechanism (4) comprises a water cooler body (41), which is fixedly installed on the inner lower end of the mounting base (1), and the lower end of one side of the water cooler body (41) is provided with a water outlet guide pipe (42), which is fixedly inserted into the mounting base (1), and the tail end of the water outlet guide pipe (42) is fixedly connected with a second hose (43), and the tail end of the second hose (43) is fixedly connected with a third L-shaped pipe (44), and the tail end of the third L-shaped pipe (44) is fixedly connected with the laser marking assembly (2), and the laser marking assembly (2) is fixedly connected with a fourth L-shaped pipe (45) used in cooperation, and the tail end of the fourth L-shaped pipe (45) is fixedly connected with a third hose (46), and the tail end of the third hose (46) is fixedly connected with a return flow guide pipe (47), and the return flow guide pipe (47) is fixedly inserted into the mounting base (1), and the tail end of the return flow guide pipe (47) is communicated with the upper end of one side of the water cooler body (41).
6. A laser processing silicon wafer apparatus as described in claim 5, wherein, The heat recovery mechanism (5) comprises a first frame body (51), which is fixedly connected with the water cooler body (41), and a second frame body (52) is detachably arranged on one side of the first frame body (51), and a driving motor (53) is fixedly installed on the second frame body (52), and the output end of the driving motor (53) is rotatably penetrated through the second frame body (52) and fixedly sleeved with a driving fan blade (54) at the tail end, and a air inlet slot (55) is formed through the second frame body (52) and used in cooperation with the driving fan blade (54), and an air outlet hole is formed on one side of the first frame body (51) and used in cooperation with the air inlet slot (55), and a blocking filter plate (56) is detachably arranged on one end of the first frame body (51) and used in cooperation, and a serpentine heat conducting pipe (57) is fixedly inserted into the inner cavity of the first frame body (51), and a heat conducting fin (58) is fixedly sleeved on the outer side of the serpentine heat conducting pipe (57) and used in cooperation, and one end of the serpentine heat conducting pipe (57) is fixedly connected with the return flow guide pipe (47), and the other end of the serpentine heat conducting pipe (57) is communicated with the water cooler body (41).
7. A laser processing silicon wafer apparatus as claimed in claim 6, wherein, One end of the second frame body (52) is fixedly connected with a sealing collar (59), and one end of the first frame body (51) is provided with a sealing clamping groove (510), and the sealing collar (59) can be movably inserted into the sealing clamping groove (510).
8. A laser processing silicon wafer apparatus as described in claim 6, wherein, The limiting mechanism (6) includes a first side block (61) and a second side block (62), the first side block (61) is fixedly connected with the second frame body (52), and a rotating through hole (63) is formed through the first side block (61), a T-shaped rotating rod (64) is rotatably inserted into the rotating through hole (63), and the end of the T-shaped rotating rod (64) is fixedly connected with a limiting rotating block (65), one side of the limiting rotating block (65) is fixedly installed with a reset torsional spring (66), the reset torsional spring (66) is movably sleeved on the T-shaped rotating rod (64), the end of the reset torsional spring (66) is fixedly connected with the first side block (61), and the second side block (62) is fixedly connected with the first frame body (51), a limiting insertion slot (67) is formed through the second side block (62), and the limiting rotating block (65) can slide through the limiting insertion slot (67).
9. A laser processing silicon wafer apparatus as described in claim 8, wherein, One end of the T-shaped rotating rod (64) is fixedly sleeved with a rotating clasp (68), and a rotating ring groove (69) is formed in the inner wall of the rotating through hole (63), and the rotating clasp (68) is rotatably clamped in the rotating ring groove (69).
10. A processing method of a laser processing silicon wafer apparatus, characterized by, Use the laser processing silicon wafer device of any one of claims 1-9, comprising the following steps: Step one, adjust the fixing mechanism (3) according to the shape of the silicon wafer to be marked, if the silicon wafer to be marked is square, no adjustment is needed to carry out the marking of the silicon wafer, if the silicon wafer to be marked is circular, start the first electric push rod (322), so as to drive the driving push block (323) to move to the side close to the lifting support (33), further drive the L-shaped connecting rod (324) to move to the side close to the lifting support (33), further drive the driving rack (325) to move, so as to drive the driven gear (38) to rotate, further drive the rectangular pressing frame (310) and the annular pressing frame (316) to rotate through the connecting rod (39), and close the first electric push rod (322) when the rectangular pressing frame (310) and the annular pressing frame (316) rotate one hundred and eighty degrees, at this time the first flow guide pipe (315) will be blocked, and the second flow guide pipe (321) will be communicated with the Z-shaped flow guide groove (35), then the subsequent silicon wafer marking work can be carried out, and then the fixing mechanism (3) can be adjusted according to the above steps; Step two, place the silicon wafer to be marked on the mounting chassis (1), then start the electric telescopic rod (31), which can drive the lifting bracket (33) to move down, and further drive the flow cylinder (34) to move down, and further drive the rectangular pressure frame (310) and the annular pressure frame (316) to move down, so that the first cannula (312), the U-shaped pressure pipe (313), the L-shaped pressure pipe (314), the second cannula (318), the first arc-shaped pressure pipe (319) and the second arc-shaped pressure pipe (320) can move down, when the U-shaped pressure pipe (313) and the L-shaped pressure pipe (314) are in contact with the top of the rectangular silicon wafer to be marked or the first arc-shaped pressure pipe (319) and the second arc-shaped pressure pipe (320) are in contact with the top of the circular silicon wafer to be marked, the electric telescopic rod (31) is closed, then the second electric push rod (328) is started, which can drive the driving piston (329) to move towards the side close to the second L-shaped pipe (326), and further can guide the water source in the water storage cylinder (32) into the first L-shaped pipe (37) through the second L-shaped pipe (326) and the first hose (327), and further can guide the water source in the water storage cylinder (32) into the first flow pipe (315) or the second flow pipe (321) through the Z-shaped flow groove (35), so that the water source in the water storage cylinder (32) can be guided into the first cannula (312), the U-shaped pressure pipe (313) and the L-shaped pressure pipe (314), or the second cannula (318), the first arc-shaped pressure pipe (319) and the second arc-shaped pressure pipe (320), so that the U-shaped pressure pipe (313) and the L-shaped pressure pipe (314) can be expanded and deformed by water, or the first arc-shaped pressure pipe (319) and the second arc-shaped pressure pipe (320) can be expanded and deformed by water, and further can flexibly fix the corresponding rectangular silicon wafer or circular silicon wafer to be marked, and the second electric push rod (328) is closed after fixing the corresponding rectangular silicon wafer or circular silicon wafer to be marked; Step three, start the laser marking assembly (2) and water cooling machine body (41), so that the fixed silicon wafer marking processing, at the same time, the water cooling machine body (41) can be through the water outlet pipe (42), the second hose (43) and the third L type pipe (44) into the laser marking assembly (2) cooling water cooling treatment, while the heat after the hot water will be through the fourth L type pipe (45), the third hose (46), reflux pipe (47) and the serpentine heat pipe (57) back to the water cooling machine body (41) cooling treatment, during this period, if the marking operation is carried out in winter, start the drive motor (53), so that the drive fan blade (54) rotation, in turn, can the indoor cold air into the second frame (52), then the interception filter plate (56) can intercept the dust in the suction of cold air, while the filtered cold air will be introduced into the first frame (51), the cold air can be heat dissipation fins (58) from the serpentine heat pipe (57) exported heat absorption, so as to be able to heat treatment of cold air, while the heated air will be through the air outlet perforated, then remove the fixing mechanism (3) and the silicon wafer after marking is taken down, then according to the above steps for subsequent silicon wafer fixation and marking operation; Step four, during subsequent use, when the need for cleaning or replacement of interception filter plate (56) is synchronous rotation of two limit block (65), so as to be able to drive the corresponding T type rotating rod (64) rotation, in turn, can twist the corresponding reset torsional spring (66), when the limit block (65) is rotated one hundred and eighty degrees to the side away from the first frame (51) push two limit block (65), so as to make the limit block (65) is inserted into the corresponding limit slot (67), then release the limit block (65) and the second frame (52) to the side away from the first frame (51) movement, until the limit block (65) and the corresponding limit slot (67) completely separated from the second frame (52) can be taken down, then the interception filter plate (56) is cleaned or replaced and after the cleaning or replacement operation is completed, the second frame (52) reset fixed can.