Adhesive tape, article, and method for detaching article

Abstract

The invention relates to an adhesive tape, an article, and a method for detaching the article. The present invention addresses the problem of providing: an adhesive tape which contains a small amount of volatile components, has reduced adverse effects on the external environment, can be thermally peeled off in a short time, can prevent thermal damage to adherends, and is easy to perform thermal peeling operation; an article in which at least two adherends are adhered via the adhesive tape; and a method for detaching the article. An adhesive tape having at least an adhesive layer, a heat-generating body, and a melt-softening layer adjacent to the heat-generating body in this order, the melt-softening layer containing a thermoplastic resin having a weight-average molecular weight of 80000-150000, and a tackifier resin having a mass reduction rate of 3% or less when the temperature is increased from 25 DEG C to 200 DEG C in a nitrogen atmosphere under a temperature increase condition of 10 DEG C / min.

Description

TECHNICAL FIELD

[0001] The present application relates to an adhesive tape ("adhesive" in Japanese is "sticky"), an article, and a method for disassembling the article. In detail, the present application relates to an adhesive tape which can be applied in various fields such as manufacturing of electronic devices, an article having a structure bonded by the adhesive tape, and a method for disassembling the article. BACKGROUND

[0002] The adhesive tape is used for a component fixing purpose, a temporary fixing purpose of components, a label purpose of displaying product information, and the like in various industrial fields such as OA equipment, IT products, home electric appliances, automobiles, and the like, as a joining means which is excellent in workability and has high bonding reliability. In recent years, from the viewpoint of protecting the global environment, the demand for recycling and reuse of used products has increased in these various industrial fields such as home electric appliances, automobiles, and the like.

[0003] When recycling and reusing various products, a work of peeling the adhesive tape for fixing of components, labels is required, but since the adhesive tape is provided at various places in the product, it is desired to reduce the work cost by a simple removal process.

[0004] In order to separate the adherends from each other, for example, a hot melt adhesive composition which is rapidly dissolved in a short time by electromagnetic induction heating is proposed (for example, refer to Patent Literature 1).

[0005] As a method for separating the adherends from each other, a method for disassembling a building is proposed in which a metal base material is heated by an electromagnetic induction heating device, the adhesive between the base material and an interior material is heated and foamed to be peeled, and the interior material is peeled from the metal base material (for example, refer to Patent Literature 2).

[0006] In addition, a double-sided adhesive tape having a heat conductive layer is proposed in which the double-sided adhesive tape can be easily disassembled by directly heating the heat conductive layer by contact with a heat generation source (for example, refer to Patent Literature 3).

[0007] PRIOR ART DOCUMENTS PATENT LITERATURE Patent Literature 1: Japanese Patent Application Laid-Open No. 2002-188068 Patent Literature 2: Japanese Patent Application Laid-Open No. 2006-200279 Patent Literature 3: Japanese Patent Application Laid-Open No. 2016-108394 SUMMARY

[0008] PROBLEMS TO BE SOLVED BY THE INVENTION In the past, in the method of peeling and detaching by heating, since heat is applied from the outside, if the amount of heat generated from the heat generator is desired to generate heat required for peeling of the adhesive tape, there is a case where the adherend is heat deteriorated or heat damaged due to the generated heat. On the other hand, if heat deterioration or heat damage of the adherend is desired to be suppressed, there is a case where the amount of heat generated is reduced and the adhesive tape is not sufficiently heated and peeling is difficult to occur.

[0009] Therefore, in the adhesive tape in which the adherends such as rigid bodies are fixed to each other, an adhesive tape having a function of detaching and reusing the member as the adherend is desired, and an adhesive tape having a function of being simply detached and peeled by heating is more desired.

[0010] On the other hand, from the viewpoint of coping with environmental pollution, it is required to reduce the discharge of volatile organic substances (VOC) to the outside environment. In the case where the raw material used in the production of the adhesive tape contains a solvent, from the viewpoint of environmental regulation, it is preferable not to contain an environmentally regulated substance.

[0011] As the environmentally regulated substance frequently used in the above-mentioned raw material, toluene as a VOC can be cited. Toluene is strictly regulated for treatment by REACH regulation, PRTR law, VOC regulation, and the like, and reduction of the above-mentioned toluene is required.

[0012] From the above-mentioned viewpoint, in the case where toluene is not used, there is room for improvement in the selection of the solution type raw material which does not cause problems in solubility, miscibility, and the like and is capable of exerting the function of the above-mentioned adhesive tape.

[0013] The present inventors have found that, by having a melt-softening layer containing a specific thermoplastic resin and a specific tackifying resin, an adhesive tape in which an adhesive layer, a heat generator, and the melt-softening layer are of a specific constitution is capable of solving the above-mentioned technical problems, and thus the present invention has been completed.

[0014] That is, the object of the present invention is to provide an adhesive tape in which the content of volatile organic substances at the time of detachment is very small, heating and peeling can be performed in a short time, heat damage of the adherend can be prevented, heating and peeling operation is easy, an article having a constitution bonded by the adhesive tape, and a detachment method of the article.

[0015] Technical solution for solving technical problems The present invention relates to the following (1) to (16).

[0016] (1) An adhesive tape having, in this order, at least an adhesive layer, a heat generating body, and a fusion softening layer adjacent to the heat generating body, the fusion softening layer containing: a thermoplastic resin having a weight average molecular weight of 80,000 to 150,000; and a tackifying resin having a mass reduction rate of 3% or less when raised from 25°C to 200°C at a temperature increase rate of 10°C / minute under a nitrogen atmosphere.

[0017] (2) The adhesive tape according to (1), wherein the thermoplastic resin constituting the fusion softening layer contains a block copolymer or a hydrogenated product thereof, the block copolymer containing a polymer block containing a structural unit derived from an aromatic vinyl compound and a polymer block containing a structural unit derived from a conjugated diene compound.

[0018] (3) The adhesive tape according to (1) or (2), wherein the fusion softening layer has a storage modulus at 150°C in a range of 1.0 x 10 3 to 1.0 x 10 5 Pa.

[0019] (4) The adhesive tape according to any one of (1) to (3), wherein the thermoplastic resin constituting the fusion softening layer has a melt flow rate (MFR: 190°C, 21.6 kg load) of 9 g / 10 minutes or more.

[0020] (5) The adhesive tape according to any one of (1) to (4), wherein the content of the thermoplastic resin constituting the fusion softening layer is in a range of 30 to 80 mass% relative to the entire composition constituting the fusion softening layer.

[0021] (6) The adhesive tape according to any one of (1) to (5), wherein the content of the tackifying resin constituting the fusion softening layer is in a range of 20 to 100 parts by mass relative to 100 parts by mass of the thermoplastic resin constituting the fusion softening layer.

[0022] (7) The adhesive tape according to any one of (1) to (6), wherein, when the adhesive tape is heated at 150°C for 30 seconds under a nitrogen atmosphere, the mass reduction rate of the adhesive tape after the heating relative to the mass of the adhesive tape before the heating is 0.5% or less.

[0023] (8) The adhesive tape according to any one of (1) to (7), wherein the heat generating body has a volume resistivity at 20°C of 30 μ Ω-cm or more.

[0024] (9) The adhesive tape according to any one of (1) to (8), wherein the heat generating body has, in a plan view, one pair of protruding portions protruding from the outer periphery of the adhesive layer and the fusion softening layer.

[0025] (10) The adhesive tape according to any one of (1) to (9), wherein an adhesive layer is further provided on the side opposite to the surface of the fusion-softening layer which is adjacent to the heat generator.

[0026] (11) The adhesive tape according to any one of (1) to (10), wherein the fusion-softening layer is peelable by heating.

[0027] (12) The adhesive tape according to any one of (1) to (11), wherein the heat generator is an electrically conductive body which generates heat by electric conduction, and the adhesive tape is peeled by the heat generation of the electrically conductive body.

[0028] (13) An article comprising at least two adherends and the adhesive tape according to any one of (1) to (12) between the two adherends, the two adherends being bonded via the adhesive tape.

[0029] (14) The article according to (13), wherein the heat generator constituting the adhesive tape has one pair of protrusions protruding from the outer periphery of the adherend in a plan view.

[0030] (15) A method for disassembling the article according to (13) or (14), wherein the fusion-softening layer is fused and / or softened by heating of the heat generator, thereby separating the two adherends.

[0031] (16) The method for disassembling the article according to (15), wherein the heating of the heat generator is resistance heating, the heat generator is electrically connected to a power source, the heat generator is electrically conducted from the power source, and the fusion-softening layer is fused and / or softened by resistance heating, thereby separating the two adherends.

[0032] Effects of the Invention According to the present application, an adhesive tape which has a small amount of volatile components, has reduced adverse effects on the external environment, can be peeled in a short time, can prevent thermal damage to adherends, and is easy to operate for peeling can be provided.

[0033] In addition, according to the present application, an article in which at least two adherends are bonded via the adhesive tape, and a method for disassembling the article can be provided.

[0034] The article and the method for disassembling the article of the present application can suppress thermal deterioration of adherends such as electronic components, can be recycled, and disassembling work becomes easy.

[0035] In addition, the amount of volatile components is small, adverse effects on the external environment such as smoke are reduced, and safety for operators at the time of disassembly is also excellent. BRIEF DESCRIPTION OF DRAWINGS

[0036] Figure 1 is a schematic cross-sectional view showing one example of the adhesive tape of the present application.

[0037] Figure 2 is a schematic cross-sectional view showing another example of the adhesive tape of the present application.

[0038] Figure 3 is a schematic plan view showing another example of the adhesive tape of the present application.

[0039] Figure 4 is a schematic plan view showing an example of the pattern of the heat generating body in the adhesive tape of the present application.

[0040] Figure 5 is a schematic cross-sectional view showing another example of the adhesive tape of the present application.

[0041] Figure 6 is a schematic plan view showing one example of the article of the present application.

[0042] Figure 7 is a schematic cross-sectional view showing one example of the article of the present application.

[0043] Figure 8 is a view schematically showing the disassembly method of the article of the present application.

[0044] Figure 9 is a schematic plan view of the adhesive tape of Example 1.

[0045] Figure 10 is a schematic cross-sectional view of the adhesive tape of Example 1.

[0046] Figure 11 is a schematic plan view showing the article of the example, and the evaluation method.

[0047] Figure 12 is a schematic front view showing the article of the example, and the evaluation method.

[0048] Figure 13 is a schematic side view showing the article of the example, and the evaluation method. DETAILED DESCRIPTION

[0049] Hereinafter, the embodiments of the present application will be explained in detail. It should be noted that in this specification, the numerical range represented by "to" indicates a range including the numerical values recited before and after "to" as the minimum value and the maximum value, respectively.

[0050] 1. Adhesive tape The present application is an adhesive tape having at least in order an adhesive layer, a heat generating body, and a fusion-softening layer adjacent to the heat generating body, the fusion-softening layer containing a thermoplastic resin having a weight average molecular weight of 80,000 to 150,000 and a tackifying resin having a mass reduction rate of 3% or less when raised from 25°C to 200°C at a temperature increase of 10°C / minute in a nitrogen atmosphere.

[0051] The adhesive tape of the present application can be used as an easily detachable adhesive tape which can be easily separated or detached after being fixed between adherends after being attached to the adherends. Since the adhesive tape of the present application has the above-described configuration, it can maintain a high adhesive force when fixed between adherends and can be easily separated or detached by heating when the adherends are separated or detached, regardless of the material of the adherends. Note that "separation or detachment" is simply referred to as "detachment" hereinafter.

[0052] The adhesive tape of the present application has a heat generating body. The heat generating body is heated by a heating means such as direct current, induction heating, infrared rays, microwaves, or the like from the outside, and the fusion-softening layer adjacent to the heat generating body is fused or softened.

[0053] In the present application, in order to be able to suppress the deterioration of the adherends caused by the energy irradiation from the outside and to be able to detach the article in a state where the adhesive tape is built in the article, the heat generating body is preferably a current passing body which generates heat by passing current, and the adhesive tape of the present application is preferably a peelable type by the heat generation of the current passing body.

[0054] Here, the fusion-softening layer of the adhesive tape of the present application has a thermoplastic resin having a weight average molecular weight in a specific range and a tackifying resin having a heating mass reduction rate of 3% or less, and thus the content of volatile components is small and the fusion-softening layer has sufficient initial adhesive force. As a result, the thermoplastic resin constituting the fusion-softening layer can be efficiently fused or softened.

[0055] Therefore, the adhesive tape of the present application has sufficient initial adhesive force at room temperature (0 to 40°C), and the adhesive strength becomes small with heating using the heat from the heat generating body, the residual adhesive force after current passing is small with respect to the initial adhesive force, and the reduction rate of the adhesive force by current passing is large. Thus, the detachability of an article made using the adhesive tape of the present application is excellent.

[0056] In other words, the adhesive tape of the present application causes heat generation inside the tape, and thus when an article in which at least two adherends are adhered via the adhesive tape of the present application is detached, heat damage to the adherends can be reduced, and the article can be easily detached.

[0057] In addition, the adhesive tape of the present application has a small amount of volatile components, and thus, when adherends are fixed to each other and when the adhesive tape is peeled off by heating, the adverse effects on the external environment, such as smoke, are reduced, and the safety for the worker at the time of peeling is also excellent.

[0058] In addition, even in an article in which the electronic component is built in a device, the adhesive tape cannot be touched, and the article is completely shielded from the outside, the electronic components can be easily peeled off from each other without preparing a large-scale device. In particular, in a state in which the electronic component is built in an electronic device, the adhesive tape is heated by using the driving current in the electronic component to peel off the adhesive tape, and thus, when the article is peeled off, the heat deterioration of the circuit in the electronic component can be prevented, and the heating peeling can be performed without an external device, and the peeling work becomes easy.

[0059] The way in which the adhesive tape of the present application "can be peeled off by heating" can be a way in which, by heating, the molten softening layer itself is molten or softened, and cohesive failure occurs inside the molten softening layer, and further, a part or the whole of the adhesive tape is peeled off from the adherend; or a way in which, by heating, the molten softening layer itself is molten or softened, and the adhesive force is reduced, and peeling (interfacial failure) occurs between the molten softening layer and the layer adjacent to the molten softening layer or the adherend, and further, a part or the whole of the adhesive tape is peeled off from the adherend. In addition, when the adhesive tape is peeled off by heating, the molten softening layer as a whole can be peeled off from the adherend, or a part of the molten softening layer can be peeled off from the adherend.

[0060] In addition, as described later, the adhesive layer constituting the adhesive tape of the present application is composed of a component which is not easily molten or softened by heating, compared with the component constituting the molten softening layer. Thus, the adhesive tape of the present application can heat the molten softening layer to selectively melt or soften the molten softening layer, and further, peel off, by heating the heating body.

[0061] Hereinafter, the structure of the adhesive tape of the present application will be described.

[0062] [Heating Body] The heating body can be appropriately selected from known heating bodies according to the heating means used. As the heating and heating means, for example, resistance heating, electromagnetic induction heating, infrared heating, microwave heating, heat conduction, and the like can be cited. Among them, from the viewpoint that even with a small amount of energy, the molten softening layer can be sufficiently softened or molten, for example, the adhesive tape can be heated and peeled off in a state in which the electronic component is built in an electronic device using the driving current in the electronic component, and from the viewpoint that the heating body does not need to be heated by an external heat source through the adherend, and the over-heating of the adherend can be prevented, resistance heating is preferred.

[0063] Here, "resistance heating" refers to one of the electric heating methods, and is a method in which an electric current is passed through an electrically conductive body (a heating body) having an electric resistance, and Joule heat is used to heat the electrically conductive body. If a constant electric current is passed through the electrically conductive body, the amount of Joule heat generated in a certain time is proportional to the square of the electric current and the electric resistance of the wire (Joule's law). The electrically conductive body has an electric resistance value (volume resistivity, etc.) inherent to the substance.

[0064] "Electromagnetic induction heating" refers to a non-contact heating method that is one of the electric heating methods, and is also called high-frequency induction heating. If an electrically conductive body (a heating body) having an electric resistance is placed in a magnetic field generated by passing a high-frequency electric current (an alternating current) through a coil-shaped wire, an electric current flows through the electrically conductive body according to the principle of electromagnetic induction, and Joule heat is used to heat the electrically conductive body.

[0065] "Infrared heating" and "microwave heating" refer to non-contact heating methods that use electromagnetic waves in specific wavelength regions such as infrared rays and microwaves, and utilize heat energy based on radiation. The bonds of atoms and molecules that constitute a substance perform thermal vibration (molecular motion, lattice vibration of a crystal) corresponding to the temperature inherent to the substance, and if electromagnetic waves of a wavelength corresponding to the vibration frequency are absorbed, the vibration of the molecules becomes intense and heat is generated.

[0066] "Heat conduction" is a heating method that utilizes the heat transfer phenomenon in which heat transfers from a high-temperature side to a low-temperature side inside a solid, and enables a heat source to directly contact a substance having excellent heat conductivity and transfer heat.

[0067] In the case where the heating means is resistance heating, the heating body is preferably an electrically conductive body having an electric resistance, and examples thereof include metals, non-metals, and organic-inorganic composite materials.

[0068] As the metal, for example, nickel-chromium alloy (108 μ Ω·cm); SUS410 (62.2 μ Ω·cm), SUS304 (72.0 μ Ω·cm), SUS430 (60.0 μ Ω·cm), and the like stainless steel; titanium (55.0 μ Ω·cm); nickel-silver (for example, "Yohaku C7701" manufactured by Takeuchi Metal Foil Powder Co., Ltd. is 34.0 μ Ω·cm), a metal fiber sheet (for example, "stainless steel fiber sheet" manufactured by Bachan Seizai), and the like. Note that the values in parentheses indicate approximate values of the volume resistivity of each substance at 20°C.

[0069] Among them, from the viewpoint of not being easily broken when made into a foil shape, being easy to handle as a tape, and being able to melt the molten softened layer in a short time to greatly reduce the adhesive force, nickel-chromium alloy and stainless steel are preferable.

[0070] As a nonmetal, for example, carbon nanomaterials such as graphite, graphene, graphene oxide, carbon nanotube, graphene platelet, carbon nanofiber, and the like, carbon (as one example, 3352 μ Ω·cm) or the like.

[0071] As an organic-inorganic composite material, for example, a metal vapor deposition film in which a metal such as aluminum or chromium is vapor-deposited on a polyester film, a woven fabric or nonwoven fabric on which electroconductive plating is performed, or an electroconductive coating film, and the like can be mentioned.

[0072] In the case where the heating means is a resistance heater, the volume resistivity of the heating element at 20°C is preferably 30 μ Ω·cm or more, more preferably 50 μ Ω·cm or more, further preferably 70 μ Ω·cm or more, particularly preferably 100 μ Ω·cm or more.

[0073] From the viewpoint of not excessively increasing the voltage required when electric power is supplied to the heating element, the volume resistivity of the heating element at 20°C is preferably 100000 μ Ω·cm or less, more preferably 20000 μ Ω·cm or less, further preferably 10000 μ Ω·cm or less, particularly preferably 5000 μ Ω·cm or less.

[0074] Specifically, the volume resistivity of the heating element can be in the range of 30 to 100000 μ Ω·cm, 50 to 20000 μ Ω·cm, 70 to 10000 μ Ω·cm, 100 to 5000 μ Ω·cm.

[0075] If the volume resistivity of the heating element is 30 μ Ω·cm or more, only the adhesive tape can be heated, and high-temperature deterioration of the wiring circuit can be prevented in the case where the driving current of the electronic device is supplied to the heating element by connecting the wiring circuit in the electronic device at the time of disassembly of the article, and the like.

[0076] In addition, if a heating element having a volume resistivity in the above range is used, the molten softened layer can be melted or softened in a short time, and the disassembly time can be shortened.

[0077] Further, when a driving current in the electronic component is used, it is possible to prevent excessive heating of the electronic circuit and the connection portion due to energization to the heat generating body, and it is possible to prevent thermal deterioration of the electronic component.

[0078] The volume resistivity of the heat generating body was measured at 20°C in accordance with JIS K 7194 using a low resistivity meter (manufactured by Soto Kagaku Analytech Co., Ltd., trade name "Loresta-AX MCT-T370") and a four-probe probe (manufactured by Soto Kagaku Analytech Co., Ltd., trade name "ASP Probe MCP-TP03P"). The number of measurement points was set to 1 point measurement, and the resistivity correction coefficient was 4.532.

[0079] In the case where the heating means is electromagnetic induction heating, the heat generating body is preferably an electrically resistive body, and examples thereof include metals such as iron, aluminum, nickel, stainless steel, zinc, lead, magnesium, oxides of these metals, alloys, and the like. Among these, aluminum and iron are preferable.

[0080] In the case where the heating means is infrared heating or microwave heating, the heat generating body is preferably a substance having a property of thermally vibrating (generating heat) by absorbing a specific wavelength of infrared heating or microwave heating, and examples thereof include organic substances, inorganic substances, and the like.

[0081] As the organic substance, examples include resins, rubbers, fibers, organic pigments, organic dyes, organic pigments, and the like.

[0082] As the inorganic substance, examples include metal-based inorganic substances, non-metal-based inorganic substances, inorganic pigments, inorganic dyes, inorganic pigments, and the like.

[0083] As the metal-based inorganic substance, examples include non-ferrous metals such as aluminum, titanium, chromium, manganese, cobalt, nickel, magnesium, zinc, and copper; iron; oxides of the non-ferrous metals and iron, and the like.

[0084] As the non-metal-based inorganic substance, examples include silicon, carbon; silicon oxides (e.g., SiO2), and the like.

[0085] In the case where the heating means is heat conduction, the heat generating body is preferably a substance having excellent heat conductivity, and examples thereof include metals, non-metals, and the like.

[0086] As the metal, examples include aluminum, iron, copper, oxides of these metals, nitrides, and the like.

[0087] As the non-metal, examples include ceramics such as silicon carbide, graphite, and the like.

[0088] In the case where the heating means is resistance heating, the shape of the heat generating body is not particularly limited as long as the heat generating bodies are in electrical contact with each other and resistance heating can occur, and can be appropriately selected according to the purpose, and for example, a planar shape, a mesh shape, a granular shape, a fibrous shape, and the like can be given.

[0089] Among them, from the viewpoint that the molten softened layer which can sufficiently adhere to the heat generating body before energization, does not easily cause damage to the heat generating body itself or wire breakage at the time of energization and disassembly by heating on the surface at the time of energization, a planar shape is preferred.

[0090] As the planar heat generating body, for example, a metal foil containing the above-mentioned metal; a sheet of the above-mentioned non-metal; a metal vapor deposition film, a woven fabric or non-woven fabric on which electroconductive plating is performed, or an electroconductive coating film, and the like, a resin film or sheet in which particles or fibers containing the above-mentioned metal or the above-mentioned non-metal are dispersed at high density; a coating film of the metal or the non-metal; a sheet in which the metal or the non-metal is impregnated in a non-woven fabric; a non-woven fabric of the metal or the non-metal in which a fibrous sheet is included can be given.

[0091] In addition, the planar heat generating body can also be a heat generating body in which a fibrous or granular electroconductive filler composed of at least one or more of the above-mentioned metal, alloy, or carbon is bonded to a sheet by firing, a heat generating body in which the above-mentioned fibrous or granular electroconductive filler is bonded to a sheet, and further, a heat generating body in which a binder is impregnated.

[0092] The fibrous or granular electroconductive filler is preferably bonded to a sheet by firing after being formed into a non-woven fabric, and is formed into a heat generating body.

[0093] The planar heat generating body can be shaped in a pattern shape, or can be in a band shape or a wire shape (also refer to the pattern width of the planar heat generating body described later μ If the heat generating body is in a band shape or a wire shape, the heating efficiency is high, and the contact area with the adherend is small, and thus is advantageous in terms of easy peeling.

[0094] In this case, the length in the short axis direction of the heat generating body (band width or wire width) is preferably 0.5 to 20 mm, more preferably 1 to 10 mm, and further preferably 2 to 5 mm.

[0095] If the planar heat generating body is in a pattern shape (has a pattern shape), the distance between the terminals (terminals for connection to a power source) possessed by the heat generating body can be lengthened, and the resistance can be increased.

[0096] Therefore, the heating efficiency of the planar heat generating body becomes high, and the adhesive tape of the present application can be peeled in a short time.

[0097] The pattern width in the case where the planar heat generating body is in a pattern shape is not particularly limited, and can be the same as the above-mentioned preferred range of the band width.

[0098] The heating elements of the planar heating elements can be arranged on one side or both sides of the base material. In this case, the heating elements are arranged in direct contact with one side or both sides of the base material.

[0099] In addition, the heating elements can be arranged to cover the entire area of one side or both sides of the base material, or can be arranged in a linear, band-like, or patterned shape.

[0100] As the base material, there is no particular limitation as long as it can support the heating elements, and from the viewpoints of the followability of the adhesive tape, thinning, heat resistance, and the like, a film of a polyester such as polyethylene terephthalate or polyethylene naphthalate; a polyolefin such as polypropylene; or a resin such as polyimide is preferred.

[0101] As the mesh-shaped heating elements, for example, a heating element having a plurality of through-holes in a planar heating element, a mesh-shaped or lattice-shaped heating element, and the like can be given. They can also be integrally formed heating elements.

[0102] In addition, the shape of the heating elements can not necessarily be integrally formed as long as the heating elements can be in electrical contact with each other.

[0103] For example, the heating elements can be particles or fibers containing the metal or the non-metal, or the particle-shaped, mesh-shaped, or fiber-shaped heating elements can be dispersed in the above-mentioned resin film as the base material, thereby forming electrical contact between the heating elements.

[0104] In the case where the particle-shaped, mesh-shaped, or fiber-shaped heating elements are dispersed in the above-mentioned resin film as the base material, the content of the particle-shaped or fiber-shaped heating elements in the resin film as the base material is preferably 20 to 95% by mass, and more preferably 40 to 90% by mass.

[0105] The average thickness of the planar heating elements is usually 1 μ μm or more, preferably 2 μ μm or more, more preferably 3 μ μm or more, further preferably 5 μ μm or more, particularly preferably 10 μ μm or more. The average thickness of the planar heating elements is preferably 200 μ μm or less, more preferably 150 μ μm or less, further preferably 100 μ μm or less, particularly preferably 50 μ μm or less.

[0106] If the average thickness of the planar heating elements is within the above-mentioned range, sufficient electric current and heat generation amount can be obtained, the heating elements can be efficiently heated by resistance heating, and the followability of the adhesive tape and the workability of the bonding operation are excellent.

[0107] It should be noted that the average thickness of the planar heat generating body is the average of the thicknesses of five or more points arbitrarily selected. In the case where the planar heat generating body is provided on one or both surfaces of the base material, the average thickness of the planar heat generating body refers to the thickness excluding the base material, and in the case where the planar heat generating body is provided on both surfaces of the base material, it refers to the thickness of the heat generating body of each single surface.

[0108] In the case where the heating means is electromagnetic induction heating or heat conduction, the shape of the heat generating body can be appropriately selected, and for example, it can be planar, mesh-shaped, or a resin film or sheet in which particles or fibers containing the heat generating body are dispersed at high density.

[0109] The planar heat generating body can be shaped in a pattern, or can be in a band shape or a line shape. If the heat generating body is in a band shape or a line shape, the heating efficiency is high, and the contact area with the adherend is small, so peeling is easy.

[0110] The length in the short axis direction of the heat generating body (band width or line width) is preferably 1 to 10 mm, more preferably 2 to 5 mm. The average thickness of the planar heat generating body is preferably 5 to 200 μ m, more preferably 10 to 150 μ m, further preferably 12 to 100 μ m.

[0111] In the case where the heating means is infrared heating or microwave heating, the heat generating body can be a resin film or sheet in which particles or fibers containing the heat generating body are dispersed at high density.

[0112] In the case where the heating means is infrared heating, a pigment or the like can be used as the infrared absorbing material, and the above-mentioned pigment can be dispersed in the resin film or sheet, or can be coated on the resin film or sheet by coating or the like.

[0113] The heat generating body can be appropriately manufactured, or a commercially available product can be used. As commercially available products, for example, there are planar heat generating bodies such as "NCH1-H", "SUS304-H", "SUS430-H", "TR270C-H", "Hiroshita C7701" (all manufactured by Takehara Kakohki Co., Ltd.), nickel-chromium alloy foils, stainless steel foils, titanium foils, nickel-silver, and the like; and "stainless steel fiber sheet" by Baskawa Seishi Co., Ltd. In addition, a heat generating body in which these are patterned can also be used.

[0114] [Adhesive layer] In the adhesive tape of the present application, the components constituting the adhesive layer include, for example, acrylic adhesives, urethane adhesives, rubber-based adhesives such as synthetic rubber-based or natural rubber-based adhesives, silicone-based adhesives, vinyl ether-based adhesives, and the like.

[0115] Among them, an adhesive capable of being used as a pressure-sensitive adhesive is preferable, and an acrylic adhesive containing an acrylic polymer is more preferable. The acrylic adhesive containing an acrylic polymer is less likely to melt or soften due to heating.

[0116] Therefore, by the heat generated from the heat-generating body of the adhesive tape of the present application, the fusion-softening layer to be described later possessed by the adhesive tape of the present application is selectively fused or softened.

[0117] Note that the pressure-sensitive adhesive refers to an adhesive that is adhered by applying pressure for a short time at room temperature around 20°C, and has tackiness at ordinary temperature.

[0118] As the acrylic polymer, a homopolymer of a (meth)acrylate monomer, a copolymer of a (meth)acrylate monomer and another monomer, and the like can be exemplified.

[0119] In the present specification, "(meth)acrylic acid" is a term for the total of acrylic acid, methacrylic acid, and both of them. "(Meth)acrylate" is a term for the total of acrylate, methacrylate, and both of them.

[0120] As the (meth)acrylate monomer, for example, (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid propyl ester, (meth)acrylic acid butyl ester, (meth)acrylic acid hexyl ester, (meth)acrylic acid cyclohexyl ester, (meth)acrylic acid octyl ester, (meth)acrylic acid-2-ethylhexyl ester, (meth)acrylic acid isononyl ester, (meth)acrylic acid isodecyl ester, (meth)acrylic acid lauryl ester, and the like having an alkyl chain of 1 to 14 carbon atoms of (meth)acrylic acid alkyl ester can be exemplified.

[0121] The acrylic polymer can contain one of these monomers in the structural unit, or two or more kinds in the structural unit.

[0122] The content of the (meth)acrylate monomer is preferably in the range of 70 to 99.9% by mass, more preferably in the range of 80 to 99% by mass, and further preferably in the range of 90 to 97% by mass, with respect to the total components of the monomers constituting the acrylic polymer.

[0123] In addition, as other monomers for obtaining the acrylic polymer, a monomer containing a polar group can be contained. As the monomer containing a polar group, for example, a carboxylic acid having an ethylenic unsaturated group such as (meth)acrylic acid, itaconic acid, itaconic anhydride, maleic acid, maleic anhydride, crotonic acid; a (meth)acrylate having a hydroxyl group such as 2-hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, caprolactone-modified (meth)acrylate, polyoxyethylene (meth)acrylate, polyoxypropylene (meth)acrylate; a nitrogen-containing monomer having an ethylenic unsaturated group such as (meth)acrylonitrile, N-vinyl-2-pyrrolidone, N-vinylcaprolactam, N-vinyl lauryl lactam, (meth)acryloyl morpholine, (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-butoxymethyl (meth)acrylamide, N,N-dimethylamino methyl (meth)acrylate, 2-(perhydrophthaloyl-N-yl)ethyl acrylate can be exemplified.

[0124] In the case where the crosslinking agent described later is used in combination, from the viewpoint of being able to form a crosslinking structure between a hydroxyl group, a carboxyl group and the crosslinking agent, and being able to adjust the storage modulus of the adhesive layer, as the monomer containing a polar group, a (meth)acrylate having a hydroxyl group, a carboxylic acid having an ethylenic unsaturated group are preferred, and more preferably 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, acrylic acid.

[0125] The content of the monomer containing a polar group in the acrylic polymer is preferably in the range of 0.1 to 20% by mass, more preferably in the range of 1 to 13% by mass, and more preferably in the range of 1.5 to 8% by mass, relative to the total components of the monomers constituting the acrylic polymer.

[0126] The weight average molecular weight of the acrylic polymer is preferably in the range of 400 to 1,400, more preferably in the range of 600 to 1,200, and further preferably in the range of 650 to 1,100. Here, the weight average molecular weight is the weight average molecular weight converted to standard polystyrene as measured by gel permeation chromatography (GPC).

[0127] Specifically, as the GPC measuring device, "SC8020" manufactured by Tosoh Corporation was used, and the measurement was performed under the following measurement conditions.

[0128] • Sample concentration: 0.5% by mass (tetrahydrofuran solution) • Sample injection amount: 100 Figure 1 L • Eluent: tetrahydrofuran (THF) • Flow rate: 1.0 mL / minute • Column temperature (measurement temperature): 40°C • Column: "TSKgel GMHHR-H" manufactured by Tosoh Corporation • Detector: Differential refractometer The adhesive layer can further contain a tackifying resin for the purpose of adjusting the adhesiveness thereof. Details of the tackifying resin will be described later in the item of the melt-softening layer.

[0129] In the case where the adhesive layer contains a tackifying resin, the amount of the tackifying resin is preferably in the range of 1 to 150 parts by mass, more preferably in the range of 10 to 150 parts by mass, relative to 100 parts by mass of the base resin such as an acrylic polymer constituting the adhesive layer, from the viewpoint of making the adhesiveness thereof good at around room temperature (0 to 40°C) and enabling thermal durability to be exerted.

[0130] In addition, in the case where the adhesive layer contains a tackifying resin, the total content of the base resin and the tackifying resin in the adhesive forming the adhesive layer is preferably 50% by mass or more, more preferably 70% by mass or more, and further preferably 90% by mass or more, relative to the total amount of the solid components of the adhesive.

[0131] The adhesive layer can further contain a cross-linking agent for the purpose of improving the cohesive force. As the cross-linking agent, for example, known cross-linking agents such as isocyanate-based, epoxy-based, aziridine-based, polyvalent metal salt-based, metal chelate-based, ketone-hydrazine-based, oxazoline-based, carbodiimide-based, silane-based, and glycidyl (alkoxy) epoxy silane-based cross-linking agents can be cited.

[0132] The adhesive layer can further contain, as necessary, an antioxidant, an anti-aging agent, a colorant such as a pigment and a dye, a thickening agent, a leveling agent, a film-forming aid, an infrared absorber, an ultraviolet absorber, a water repellent, and other additives, within a range that does not impair the effects of the present application.

[0133] The thickness of the adhesive layer is preferably in the range of 10 to 200 Figure 2 m, more preferably in the range of 20 to 100 Figure 3 m. It should be noted that the thickness of the adhesive layer is set as an average value obtained by measuring the thickness at an arbitrary 5 places.

[0134] The melting point of the adhesive layer is preferably higher than the melting point of the melt-softening layer described later. Here, the "melting point of the adhesive layer" refers to the melting point of a composition (hereinafter referred to simply as "adhesive layer composition") composed of an acrylic adhesive, a urethane adhesive, a rubber-based adhesive, a silicone-based adhesive, a vinyl ether-based adhesive, and the like constituting the adhesive layer, and a tackifying resin, a cross-linking agent, other additives, and a thermoplastic resin different from the thermoplastic resin contained in the melt-softening layer, and the like, which are contained as necessary.

[0135] The melting point of the adhesive layer (adhesive layer composition) is, for example, preferably 130°C or higher, and more preferably in the range of 130°C to 200°C. By adjusting the melting point of the adhesive layer to the above range and adjusting the melting point of the melt-softening layer to the range described later, the melting or softening of the melt-softening layer can be caused to occur prior to the melting or softening of the adhesive layer using the heat generated by the heat-generating body.

[0136] That is, when the article having the constitution bonded by the adhesive tape of the present application is subjected to thermal disassembly, the melting or softening of the melt-softening layer can be stably and preferentially caused to occur, and the disassembly can be easily performed.

[0137] Note that the "melting point of the adhesive layer" is the temperature of the endothermic peak accompanying the melting of the adhesive layer (adhesive layer composition) measured using differential scanning calorimetry (DSC).

[0138] In the temperature range of 40°C or higher, the tan Figure 4 of the adhesive layer (adhesive layer composition) is preferably higher than the tan Figure 4 of the melt-softening layer at the temperature at which the tan of the melt-softening layer reaches 0.8 or higher.

[0139] of the adhesive layer (adhesive layer composition) is more preferably higher than the tan Figure 3 of the melt-softening layer at the temperature at which the tan Figure 4 of the melt-softening layer reaches 1 or higher.

[0140] Specifically, in the temperature range of 40°C or higher, the tan Figure 4 of the adhesive layer (adhesive layer composition) is preferably higher than the tan Figure 4 of the melt-softening layer at the temperature at which the tan Figure 4 of the melt-softening layer reaches 0.8 or higher, and more preferably higher than the tan Figure 4 of the melt-softening layer at the temperature at which the tan

[0141] As one of the preferable modes of the adhesive layer (adhesive layer composition), the maximum value of the tan Figure 4 in the temperature range of 80°C to 160°C is preferably less than 1, more preferably less than 0.8, and further preferably 0.6 or lower.

[0142] From the viewpoint that the adhesive layer is able to exhibit adhesiveness and elasticity, the tan Figure 5 of the adhesive layer (adhesive layer composition) in the temperature range of 80°C to 160°C is preferably 0.2 or higher.

[0143] As one of the preferable modes of the adhesive layer, the tan μThe temperature range of 0.8 or more is preferably more than 150°C, more preferably 170°C or more. The upper limit of the above temperature range is not particularly limited, and can be set to 300°C, for example, preferably 250°C.

[0144] In the adhesive tape of the present application, if the adhesive layer has such properties, when the adhesive layer and the melt-softening layer receive the same heat from a heat-generating body, the melting and / or softening of the adhesive layer can be inhibited.

[0145] That is, when a product formed by bonding with the adhesive tape of the present application is thermally disassembled, the melting or softening of the adhesive layer can be inhibited while the melting or softening of the melt-softening layer stably and preferentially occurs, and the product can be easily disassembled in a short time.

[0146] Note that, from the viewpoint of exhibiting good adhesiveness with respect to an adherend before and after disassembly, the adhesive layer (adhesive layer composition) has a tan μ It is preferably 0.1 to 0.8, more preferably 0.2 to 0.6.

[0147] The adhesive layer (adhesive layer composition) has a tan μ It is measured by dynamic viscoelasticity measurement at a frequency of 1 Hz. For example, a test piece of the adhesive layer composition having a dry thickness of about 2 mm is prepared, and a dynamic viscoelasticity tester (ARES-G2, manufactured by TA Instruments Japan, Ltd.) is used to measure the storage modulus G' and the loss modulus (G'') at a frequency of 1 Hz, a temperature range of -40°C to 200°C, and a temperature increase rate of 2°C / minute. The tan μ It is calculated by the formula [tan μ = G'' / G'].

[0148] The adhesive layer (adhesive layer composition) has a tan μ It can be adjusted by the kind, combination, and blending ratio of the monomers of the base polymer constituting the adhesive as a main component, such as the above-described acrylic polymer, the blending amount of the tackifier resin added as needed, the addition amount (gel fraction) of the crosslinking agent added as needed, and the like.

[0149] 〔Melt-softening layer〕 The melt-softening layer constituting the adhesive tape of the present application contains a thermoplastic resin having a weight average molecular weight of 80,000 to 150,000, and a tackifier resin having a mass reduction rate of 3% or less when raised from 25°C to 200°C at a temperature increase rate of 10°C / minute under a nitrogen atmosphere.

[0150] <Thermoplastic resin> As the thermoplastic resin, for example, urethane-based resins, polycarbonates, vinyl chloride-based resins, acrylic-based resins, crystalline or non-crystalline polyester-based resins such as polyethylene terephthalate, polyamide-based resins, styrene-based resins, olefin-based resins, cellulose-based resins, silicone-based resins, fluorine-based resins, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, acrylic-based thermoplastic elastomers, urethane-based thermoplastic elastomers, ester-based thermoplastic elastomers, amide-based thermoplastic elastomers, and the like can be given. They can be used singly in one kind or in combination of two or more kinds.

[0151] The weight average molecular weight of the thermoplastic resin is preferably in the range of 80000 to 150000, more preferably in the range of 80000 to 130000. If the weight average molecular weight is set to the above range, it is easy to adjust the storage modulus and the tangent of the loss angle of the melt-softening layer to the desired range, and the melting or softening of the melt-softening layer by heating becomes easy.

[0152] In addition, the viscosity at the time of softening of the melt-softening layer can be reduced, and the ease of disassembly becomes easy. Note that the weight average molecular weight of the thermoplastic resin is obtained in the same manner as the measurement method of the weight average molecular weight of the above-described acrylic-based polymer.

[0153] In addition, the melt flow rate (MFR: 190°C, 21.6 kg load) or the melt index (MI: 190°C, 21.6 g load) of the thermoplastic resin preferably has a value corresponding to the above-described range of the weight average molecular weight, and is preferably 9 g / 10 minutes or more. For example, in the case of the styrene-based thermoplastic elastomer described later, under the measurement conditions of 190°C, 21.6 g load, it is preferably in the range of 9 to 30 g / 10 minutes, more preferably in the range of 10 to 25 g / 10 minutes.

[0154] The melt-softening layer is melted or softened by the heat generated by the heat generating body, whereby the adhesion in heating is lower than the adhesion in the vicinity of room temperature (0 to 40°C).

[0155] The content of the thermoplastic resin constituting the melt-softening layer is preferably in the range of 30 to 80% by mass, more preferably in the range of 35 to 70% by mass, with respect to the entire composition constituting the melt-softening layer.

[0156] If the compounding amount of the thermoplastic resin in the melt-softening layer is in the above-described range, it is advantageous from the viewpoint of controlling the coatability, the melt-softening temperature of the melt-softening layer.

[0157] As the thermoplastic resin, among the above, urethane-based resins, acrylic-based resins, polyester-based resins, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, acrylic-based thermoplastic elastomers, urethane-based thermoplastic elastomers, ester-based thermoplastic elastomers, amide-based thermoplastic elastomers are preferred, and styrene-based thermoplastic elastomers are more preferred.

[0158] These thermoplastic resins are able to melt or soften by the heat generated from the heat-generating body of the adhesive tape of the present application, and are able to melt or soften the melt-softened layer even without containing components that generate a peeling starting point at the bonding interface, such as a heat foaming agent, or components that induce a decrease in the adhesive force. Thus, the adhesive tape easily becomes peelable, and in addition, it is preferred to have a softening point, and the melt-softened layer sharply becomes soft by reaching a temperature higher than the softening point, and is easily made advantageous in terms of exhibiting high deformability and fluidity.

[0159] As the styrene-based thermoplastic elastomer, a block copolymer containing a polymer block containing a structural unit derived from an aromatic vinyl compound and a polymer block containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof is preferred.

[0160] Specific examples include polystyrene-polybutadiene diblock copolymers or polystyrene-poly(ethylene-butylene) diblock copolymers (SEB) as hydrogenated products thereof, polystyrene-polybutadiene-polystyrene triblock copolymers (SBS) or polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymers (SEBS) as hydrogenated products thereof, polystyrene-polyisoprene diblock copolymers or polystyrene-poly(ethylene-propylene) diblock copolymers (SEP) as hydrogenated products thereof, polystyrene-polyisoprene-polystyrene triblock copolymers (SIS) or polystyrene-poly(ethylene-propylene)-polystyrene triblock copolymers (SEPS) as hydrogenated products thereof, polystyrene-polybutadiene-polystyrene-polybutadiene tetrablock copolymers (SBSB) or hydrogenated products thereof, polystyrene-polybutadiene-polystyrene-polybutadiene-polystyrene pentablock copolymers (SBSBS), styrene-based multiblock copolymers, hydrogenated products of styrene-based random copolymers such as styrene-butadiene rubber (SBR) in which the olefinic double bonds are hydrogenated, and the like.

[0161] In addition, as the styrene-based thermoplastic elastomer, commercially available products can also be used.

[0162] The styrene-based thermoplastic elastomer can be used alone as one kind, or two or more kinds can be used in combination. That is, the styrene-based thermoplastic elastomer can be one or two or more kinds of triblock copolymers, or one or two or more kinds of diblock copolymers, or a mixture of triblock copolymers and diblock copolymers.

[0163] The styrenic thermoplastic elastomer preferably contains at least a diblock copolymer from the viewpoint of exhibiting moderate cohesion from the molten softened layer, good adhesion at room temperature (0 to 40°C) before heating, and easy melting or softening by heating.

[0164] The content of the diblock copolymer in the styrenic thermoplastic elastomer is preferably in the range of 10 to 100% by mass, more preferably in the range of 10 to 90% by mass, and further preferably in the range of 15 to 80% by mass; and particularly preferably in the range of 20 to 75% by mass from the viewpoint of excellent balance between adhesion at 20°C and heat-based meltability.

[0165] <Adhesion-Improving Resin> The adhesion-improving resin contained in the molten softened layer has a mass reduction rate of 3% or less when raised from 25°C to 200°C at a temperature increase of 10°C / minute under a nitrogen atmosphere. The mass reduction rate is more preferably 1% or less, and can be 0%.

[0166] In other words, the adhesion-improving resin having the mass reduction rate in the above range is one having a small content of low-molecular-weight and easily-volatile components.

[0167] If the molten softened layer contains the above adhesion-improving resin, the generation of smoke and the like due to volatile components when the molten softened layer is heated can be suppressed, and thus the adverse effects on the external environment can be reduced.

[0168] The mass reduction rate of the adhesion-improving resin is determined by using a commercially available thermogravimetric differential thermal analysis device (TG-DTA; for example, manufactured by Hitachi High-Technologies Corporation, trade name "TG-DTA7200") to measure the mass reduction when raised from 25°C to 200°C at a temperature increase of 10°C / minute.

[0169] As the adhesion-improving resin, various adhesion-improving resins such as rosin-based, polymerized rosin-based, polymerized rosin ester-based, rosinol-based, stabilized rosin ester-based, disproportionated rosin ester-based, hydrogenated rosin ester-based, terpene-based, terpene phenol-based, petroleum resin-based, C5 / C9 petroleum resin-based, and (meth)acrylate-based adhesion-improving resins can be given.

[0170] The adhesion-improving resin can be used as a commercially available product, and the adhesion-improving resin satisfying the mass reduction rate in the above range can be applied to the molten softened layer in the adhesive tape of the present application.

[0171] Note that the adhesion-improving resin that is liquid at room temperature (25°C) such as process oil, polyester-based adhesion-improving resin, and low-molecular-weight liquid rubber such as polybutene can be applied to the molten softened layer in the adhesive tape of the present application as long as it satisfies the mass reduction rate in the above range.

[0172] The tackifying resin can be contained alone or two or more kinds can be contained.

[0173] From the viewpoint of achieving good adhesiveness at around room temperature (0 to 40°C) and being able to exert thermal durability, the content of the tackifying resin in the melt-softening layer is preferably in the range of 20 to 100 parts by mass, and more preferably in the range of 30 to 90 parts by mass, relative to 100 parts by mass of the thermoplastic resin constituting the melt-softening layer.

[0174] In addition, the total content of the thermoplastic resin and the tackifying resin constituting the melt-softening layer is preferably in the range of 70 to 99.9% by mass, and more preferably in the range of 80 to 99.8% by mass, relative to the total mass of all components constituting the melt-softening layer, that is, the thermoplastic resin and the tackifying resin, and a crosslinking agent, a filler, and other additives, etc. that can be arbitrarily contained.

[0175] <Arbitrary Components> The melt-softening layer can further contain a filler for the purpose of improving initial adhesion by imparting softness and improving the heat storage effect of the melt-softening layer by reducing thermal conductivity. As the filler, organic fillers and inorganic fillers can be given, and they can be solid or hollow.

[0176] As the resin constituting the organic filler, for example, resins containing structural units derived from acrylonitrile, chlorovinyl, vinylidene chloride, styrene, vinyl acetate, ethylene, (meth)acrylate, etc. can be given.

[0177] For example, acrylonitrile-based copolymers, vinylidene chloride-based copolymers, acrylic acid-based copolymers, styrene-based copolymers, polyethylene-based copolymers, etc. can be given. The surface of the organic filler can be surface-treated with organic surface treatment agents such as fatty acids, fatty acid esters, etc.; inorganic surface treatment agents such as calcium carbonate, barium sulfate, talc, titanium oxide, titanium, clay, silica, etc.

[0178] As the inorganic substance constituting the inorganic filler, for example, metal oxide-based ceramics such as alumina, silica, silica alumina, zirconia, magnesium oxide, etc.; non-oxide-based ceramics such as silicon carbide, boron carbide, carbon nitride, aluminum nitride, silicon nitride, boron nitride, etc.; glass, calcium carbonate, volcanic ash (shirasu), fly ash, etc. can be given. The inorganic filler can be surface-treated with silane coupling agents, fluorine-based compounds, etc. to perform hydrophobization, etc.

[0179] The filler can be used alone or two or more kinds can be used in combination.

[0180] In the case where the melt-softening layer further contains a filler, the amount thereof is preferably in the range of 5 to 80% by volume, more preferably in the range of 10 to 65% by volume, with respect to the total volume of the melt-softening layer.

[0181] In addition, the content of the organic filler or the inorganic filler is preferably in the range of 0.01 to 30% by mass, more preferably in the range of 0.02 to 20% by mass, with respect to the total mass of the melt-softening layer.

[0182] The melt-softening layer can further contain a cross-linking agent for the purpose of improving cohesion. The cross-linking agent is the same as the cross-linking agent described in the item of the adhesive layer.

[0183] The melt-softening layer can further contain, as needed, an antioxidant, an anti-aging agent, a coloring agent such as a pigment and a dye, a thickening agent, a leveling agent, a film-forming aid, an infrared absorber, an ultraviolet absorber, a water repellent, and other additives, without impairing the effects of the present application.

[0184] <Physical properties of the melt-softening layer> The melting point of the melt-softening layer is preferably lower than the melting point of the adhesive layer, and specifically, is preferably in the range of 80 to 200°C, more preferably in the range of 90 to 180°C, and further preferably in the range of 100 to 160°C.

[0185] Here, the "melting point of the melt-softening layer" refers to the melting point of the composition containing the thermoplastic resin that constitutes the melt-softening layer. Hereinafter in the present specification, the "composition containing the thermoplastic resin that constitutes the melt-softening layer" will also be simply referred to as "melt-softening resin composition".

[0186] In other words, the melt-softening resin composition refers to a composition containing the thermoplastic resin that constitutes the melt-softening layer and a tackifying resin, a cross-linking agent, other additives, and the like, which are further contained as needed. The "melting point of the melt-softening layer" refers to the melting point of this melt-softening resin composition.

[0187] If the melting point of the melt-softening layer is in the above range, the adhesive tape of the present application can exert high adhesion before heating. Also, when an article having a constitution bonded by the adhesive tape of the present application is subjected to thermal disassembly, even if the amount of heating by heat generated from a heat generator is small, melting or softening of the melt-softening layer can stably and preferentially occur, and disassembly can be easily performed in a short time.

[0188] Note that the "melting point of the melt-softening layer" is the temperature of the endothermic peak accompanying the melting of the melt-softening resin composition, which is measured using differential scanning calorimetry (DSC).

[0189] From the viewpoint of firmly fixing adherends to each other at a temperature around room temperature (0 to 40°C), the storage modulus G' of the above-mentioned fusion-softening layer (i.e., the fusion-softening resin composition) at 23°C is preferably 1.0 x 10 23 Pa, more preferably 1.0 x 10 3 Pa, further more preferably 1.0 x 10 9 Pa, still more preferably 1.0 x 10 3 Pa, particularly preferably 1.0 x 10 7 Pa, more particularly preferably 1.0 x 10 3 Pa, still more particularly preferably 1.0 x 10 7 Pa, even more particularly preferably 1.0 x 10 3 Pa, particularly preferably 1.0 x 10 6 Pa, more particularly preferably 1.0 x 10 3 Pa, still more particularly preferably 1.0 x 10 6 Pa.

[0190] From the viewpoint of easily separating adherends from each other by heating, the storage modulus G' of the fusion-softening layer at 120°C is preferably 1.0 x 10 120 Pa, more preferably 1.0 x 10 0 Pa, further more preferably 1.0 x 10 6 Pa, still more preferably 1.0 x 10 3 Pa, particularly preferably 1.0 x 10 6 Pa, more particularly preferably 1.0 x 10 3 Pa, still more particularly preferably 1.0 x 10 6 Pa, even more particularly preferably 1.0 x 10 3 Pa, particularly preferably 1.0 x 10 5 Pa. If the storage modulus G' is in the above-mentioned range, the fusion-softening layer can be melted or softened by heating to be peeled off in a short time. 120

[0191] From the viewpoint of easily separating adherends from each other by heating, the storage modulus G' of the fusion-softening layer at 150°C is preferably 1.0 x 10 150 Pa, more preferably 1.0 x 10 3 Pa, further more preferably 1.0 x 10 5 Pa, still more preferably 1.0 x 10 3 Pa, particularly preferably 1.0 x 10 5 Pa. If the storage modulus G' is in the above-mentioned range, the fusion-softening layer can be melted or softened by heating to be peeled off in a short time. 150

[0192] In addition, the tan δ of the fusion-softening layer in a temperature range of 80°C or higher (preferably, the tan δ in a temperature range of 100°C or higher) is preferably 0.8 or higher, more preferably 1 or higher. Figure 6 Figure 7 ​​​​

[0193] As one of the preferable modes of the melt-softening layer, it is preferable that tan Figure 6 The temperature at which tan Figure 6 The temperature at which tan

[0194] In detail, tan Figure 5 The temperature range at which tan

[0195] More specifically, tan Figure 6 The temperature at which tan

[0196] In addition, tan Figure 8 The temperature at which tan

[0197] tan μ The temperature at which tan μ The temperature at which tan μ The temperature at which tan μ The temperature at which tan

[0198] In the adhesive tape of the present application, if the melt-softening layer has such properties, when the adhesive layer and the melt-softening layer receive the same amount of heat from the heat-generating body, the melting and / or softening of the melt-softening layer easily occurs preferentially. When the melt-softening layer reaches the desired peeling temperature range described later by the heat generated by the heat-generating body, plastic deformation easily occurs due to melting or softening, and by cohesive failure within the melt-softening layer, peeling can occur within the layer of the melt-softening layer, or at the interface of the layer adjacent to the melt-softening layer, the adherend.

[0199] That is, when performing thermal peeling of an article having a configuration bonded by the adhesive tape of the present application, melting or softening of the melt-softening layer can occur stably and preferentially, and peeling can be performed easily in a short time.

[0200] It should be noted that, from the viewpoint of good adhesion before disassembly, the tan μ It is preferably 0.1 to 0.8, more preferably 0.2 to 0.6.

[0201] It should be noted that the storage modulus G and tan δ are obtained by dynamic viscoelasticity measurement.

[0202] For example, a test piece of the melt-softening resin composition having a dry thickness of about 2 mm is prepared, and the storage modulus G' and loss modulus (G'') at each temperature are measured using a viscoelasticity tester (ARES-G2, manufactured by TA Instruments Japan, Inc.) under conditions of a frequency of 1 Hz, a temperature range of -40°C to 200°C, and a temperature increase rate of 2°C / minute.

[0203] tan δ can be obtained by the calculation formula [tan δ = G'' / G'].

[0204] In the case where the melt-softening layer contains a filler, the dynamic viscoelasticity measurement is performed on the melt-softening resin composition excluding the filler, and the storage modulus G and tan δ .

[0205] The storage modulus G 23 , the storage modulus G 120 , tan δ , and the melting point of the melt-softening layer can be adjusted by the type and combination of the thermoplastic resin, the compounding amount of the tackifying resin added as necessary, the addition amount of the crosslinking agent added as necessary, and the like.

[0206] From the viewpoints of coatability, adhesion retention to the adherend, and disassembly, the thickness of the melt-softening layer can be set to 500 δ μm or less, preferably in the range of 10 to 200 δ μm, and more preferably in the range of 20 to 150 δ μm. It should be noted that the thickness of the melt-softening layer is set to the average value obtained by measuring the thickness at any 5 points.

[0207] The adhesive tape of the present application has at least one melt-softening layer adjacent to the heat-generating body, and can have a melt-softening layer cl adjacent to one face of the layered heat-generating body and a melt-softening layer c2 adjacent to the other face of the heat-generating body. The specific layer constitution of the adhesive tape having two melt-softening layers will be described later.

[0208] The adhesive tape of the present application has a mass reduction rate of the adhesive tape after heating relative to the mass of the adhesive tape before heating of 0.5% or less, preferably in the range of 0.0 to 0.4%, and more preferably in the range of 0.0 to 0.2% when heated at 150°C for 30 minutes under a nitrogen atmosphere.

[0209] The adhesive tape of the present application having a mass reduction rate before and after heating in the above range, the adhesive layer and the melt-softening layer contain specific constituent components, and thus the content of volatile components is small, and the adverse effects on the external environment such as smoking during detachment by peeling by heating are reduced. In addition, the detachability is excellent, and the safety for the operator during detachment is also excellent.

[0210] The adhesive tape of the present application has a push strength of 40 N / 0.8 cm or more before heating, preferably in the range of 45 N / 0.8 cm or more, and more preferably in the range of 50 N / 0.8 cm or more, when measured by the method described in the Examples. 2 More preferably, 45 N / 0.8 cm or more. 2 If the push strength before heating is in the above range, the adhesive tape of the present application is sufficiently bonded to the adherend, and thus can be used as a joining means with high bonding reliability.

[0211] In addition, in the case where the article bonded with the adhesive tape of the present application is peeled by resistance heating (electricity heating), the push strength of the adhesive tape of the present application after electricity heating at 1.5 A for 10 seconds is preferably less than 2.90 N / 0.8 cm, more preferably in the range of 2.5 N / 0.8 cm or less, and further preferably in the range of 2.0 N / 0.8 cm or less. 2 More preferably, 2.5 N / 0.8 cm or less. 2 Further preferably, 2.0 N / 0.8 cm or less. 2 If the push strength after electricity heating at 1.5 A for 10 seconds is in the above range, the adhesive tape of the present application can be easily peeled from the heated adherend, and the detachability is excellent.

[0212] [Layer structure of adhesive tape] The first mode of the adhesive tape of the present application, as shown in δ and δ The adhesive tape 10 can be in the form of a laminate having a planar heating element b, an adhesive layer a disposed on one side of the planar heating element b, and a melt-softening layer c disposed on the other side of the planar heating element b, and laminated in the order of the adhesive layer a / heating element b / melt-softening layer c. By the heat generated from the heating element b, the melt-softening layer c adjacent to the heating element b melts or softens, the adhesive force decreases, and becomes peelable.

[0213] The planar heating element b preferably has one pair of protruding portions e (refer to δ and δThere can be two or more protrusions e, and their positions within the heating element are not particularly limited and can be appropriately selected according to the purpose. The two protrusions e can be located on the same side of the outer periphery of the adhesive layer a and the melt-softened layer c (see reference). δ (1) to (3) can also be located on different two sides (see reference). δ , δ (4) to (6)).

[0214] The protrusion e is preferably located on two opposite sides of the outer periphery of the adhesive layer a and the melt-softened layer c (see reference). μ (4) to (6) are preferably located on approximately the diagonal lines of the outer periphery of the adhesive layer a and the melt-softened layer c, respectively (see reference). μ (2) to (7)). Furthermore, when the protrusion e is located on the same side of the outer periphery of the adhesive layer a and the melt-softened layer c, it is preferable that the heating element b has a U-shape or a serrated shape in the top view (see reference). μ (1) to (4), (8)), as long as the heating element b can uniformly heat the surface of the adhesive layer a and the melted softened layer c, they can also be located on the same side in close proximity (see reference). μ (3), (8)).

[0215] Therefore, current can flow through the entire area of ​​the planar heating element b, which can further improve the heating efficiency.

[0216] The protruding part e can also be 3 or more (see reference). μ (9) can also be appropriately selected to energize the heating element by selecting 1 pair (2 places).

[0217] The pair of protrusions e of the heating element b function as a pair of terminals for electrical connection to a power source in the article disassembly method described later, allowing for easy power supply to the heating element b.

[0218] From the viewpoint of easy contact with power source and heat source, the length of the protrusion is preferably 1 to 50 mm, more preferably 2 to 25 mm.

[0219] Each protrusion can be bent in a direction different from the surface direction of the adhesive tape. For example, when the objects to be glued together are in a state of being bonded together, the protrusion can be bent and tucked in a direction perpendicular to the surface direction of the adhesive tape; when it is desired to release the objects from each other (during disassembly), the protrusion can be bent again in the surface direction so that the protrusion comes into contact with the power source or heat source.

[0220] Furthermore, as a second aspect of the adhesive tape of the present invention, such as Figure 9As shown, the adhesive tape 20 can be in the form of a laminate in which the adhesive layer a1, the heat generator b, the melt-softening layer c, and the adhesive layer a2 are sequentially stacked. Alternatively, the adhesive tape 20 can be in the form of a laminate in which the adhesive layer a1, the melt-softening layer c1, the heat generator b, the melt-softening layer c2, and the adhesive layer a2 are sequentially stacked. In this case, the adhesive layer a2 can be further provided on the side of the melt-softening layer c2 opposite to the side of the heat generator b.

[0221] That is, as the second embodiment of the adhesive tape of the present application, there can be mentioned a laminate having the heat generator b, the adhesive layer a1 provided on one face of the heat generator b, the melt-softening layer c provided on the other face of the heat generator b, and the adhesive layer a2 provided on a face of the melt-softening layer c different from the face adjacent to the heat generator b. Alternatively, as another example of the second embodiment, there can be mentioned a laminate having the heat generator b, the melt-softening layers c1 and c2 provided on both faces of the heat generator b, the adhesive layer a1 provided on a face of the melt-softening layer c1 different from the face adjacent to the heat generator b, and the adhesive layer a2 provided on a face of the melt-softening layer c2 different from the face adjacent to the heat generator b.

[0222] By the heat generated by the heat generator b, the melt-softening layer c1 or c2 adjacent to the heat generator b is melted or softened, the adhesive force is reduced, and peeling becomes possible.

[0223] The adhesive tape of the present application of the above-described second embodiment, in which the adhesive layer is further provided on a face of the melt-softening layer different from the face adjacent to the heat generator (the opposite face), can increase the initial adhesive force, and the rate of reduction in the adhesive force due to heating becomes large.

[0224] In a plan view, the planar heat generator b preferably has one pair of protrusions protruding from the outer periphery of the adhesive layers a1 and a2 and the melt-softening layer c. The details of the protrusions are the same as those of the protrusions possessed by the planar heat generator b in the first embodiment.

[0225] The adhesive tape of the present application can have a release layer (also referred to as a release sheet or a release liner). As the release layer, there can be mentioned, for example, glassine paper; kraft paper; clay coated paper; paper laminated with a film of polyethylene or the like; paper coated with a resin such as polyvinyl alcohol, acrylate copolymer, or the like; a synthetic resin film of polyester, polypropylene, or the like coated with a fluororesin, silicone resin, or the like. The release layer can be provided on one face of the adhesive tape of the present application, or on both faces.

[0226] In the adhesive tape of the present application, as long as the outermost layer (excluding the release layer) arranged opposite in the thickness direction has an adhesive surface capable of adhering to an adherend, other layers such as an insulating layer, a heat insulating layer (e.g., a foamed resin layer, a layer containing a hollow, and a layer containing hollow particles, etc.), and a functional layer having a function such as insulation, heat insulation, or thermal insulation, etc. can be provided in addition to the adhesive layer, the heat generating body, and the melt-softening layer.

[0227] The adhesive layer a and the melt-softening layer c in the above-described first mode of the adhesive tape of the present application can be the adhesive surface of the adherend, and the adhesive layer a1 and the adhesive layer a2 in the above-described second mode can be the adhesive surface of the adherend.

[0228] The adhesive tape of the present application can have the following exemplary configurations, but is not limited to these. In the following laminated configurations, " / " indicates a laminated interface, and for example, in "Layer A / Layer B", Layer A and Layer B are adjacent, i.e., directly connected. • Release layer / adhesive layer a / heat generating body b / melt-softening layer c • Adhesive layer a / heat generating body b / melt-softening layer c / release layer • Release layer / adhesive layer a / heat generating body b / melt-softening layer c / release layer • Adhesive layer a / functional layer / heat generating body b / melt-softening layer c / release layer • Release layer / adhesive layer a / functional layer / heat generating body b / melt-softening layer c / release layer • Release layer / adhesive layer a / heat generating body b / melt-softening layer c / adhesive layer a • Adhesive layer a / heat generating body b / melt-softening layer c / adhesive layer a / release layer • Release layer / adhesive layer a / heat generating body b / melt-softening layer c / adhesive layer a / release layer • Release layer / adhesive layer a / heat generating body b / melt-softening layer c / functional layer / adhesive layer a • Release layer / adhesive layer a / functional layer / heat generating body b / melt-softening layer c / adhesive layer a / release layer • Release layer / adhesive layer a / functional layer / heat generating body b / melt-softening layer c / functional layer / adhesive layer a / release layer • Release layer / adhesive layer a / melt-softening layer c / heat generating body b / melt-softening layer c / release layer The thickness of the adhesive tape of the present application as a whole is preferably 50 Figure 10 m to 2000 Figures 11 to 13 m, more preferably 50 Figures 11 to 13 m to 1000 Figures 11 to 13 m, further preferably 50 Figures 11 to 13 m to 800 Figure 11 m. In this case, in addition to being able to impart a cushioning property (flexibility) and the like when the adherends are joined to each other, the mechanical strength and the processability and the like of the adhesive tape can be further improved.

[0229] [Use of the adhesive tape] The two surfaces of the adhesive tape of the present application, from which the release layer is removed, function as surfaces having adhesiveness (adhesive surfaces), and thus the adhesive tape can be used for bonding of adherends to each other. The adhesive tape of the present application can be peeled by heating, preferably resistance heating, and thus is particularly suitable for use as a resistance heating (electricity heating) peeling tape.

[0230] The adhesive tape of the present application can be used, for example, for bonding of adherends to each other, and for separation of adherends to each other. The adhesive tape of the present application can be easily peeled by heating, and thus can be used for applications in which the adhesive tape needs to be peeled for separation of components for the purpose of recycling.

[0231] For example, the adhesive tape can be used for fixing of components of various products in industrial applications such as electronic devices, automobiles, building materials, OA, and home electric appliances, and for improving work efficiency in separation of components, label peeling, and the like.

[0232] [Method for manufacturing adhesive tape] The method for manufacturing the adhesive tape of the present application is not particularly limited. For example, the adhesive tape of the present application of the above-described first mode can be manufactured by a method in which a composition containing components constituting the adhesive layer and a solvent is applied to a release sheet and dried to form the adhesive layer, a composition containing components constituting the melt-softening layer and a solvent is applied to another release sheet and dried to form the melt-softening layer, and the two are sequentially attached to each face of a planar heat-generating body.

[0233] Here, the release sheet on the face side of the melt-softening layer of the obtained adhesive tape is peeled, and the adhesive layer formed on the release sheet is further attached to the exposed face of the melt-softening layer, whereby the adhesive tape of the present application of the above-described second mode can be manufactured.

[0234] Alternatively, the adhesive layer formed on the release sheet is attached to one face of a planar heat-generating body, and then a composition containing components constituting the melt-softening layer and a solvent is applied to the other face of the planar heat-generating body and dried to form the melt-softening layer, whereby the adhesive tape of the present application of the above-described first mode can be manufactured.

[0235] In addition, the adhesive tape of the present application of the above-described second mode can be manufactured by further attaching the adhesive layer formed on the release sheet to the face of the melt-softening layer of the obtained adhesive tape.

[0236] Further, the composition containing components constituting the adhesive layer and the composition containing components constituting the melt-softening layer can also be molded by extrusion molding, press molding, injection molding, or the like.

[0237] The solvent is not particularly limited, and toluene has been strictly regulated in recent years as an environmentally controlled substance due to REACH regulations, PRTR regulations, VOC regulations, and the like, and thus a solvent other than toluene, such as an organic solvent such as ethyl acetate, propyl acetate, butyl acetate, acetone, methyl ethyl ketone, hexane, water, or an aqueous solvent in which water is the main component, is preferred.

[0238] In the composition containing the component constituting the adhesive layer and the composition containing the component constituting the melt-softening layer, the reduction of toluene required from the viewpoint of environmental regulation can also be addressed by using the above-described solvent other than toluene.

[0239] Note that the adhesive layer and the melt-softening layer of the obtained adhesive tape preferably do not generally contain a solvent.

[0240] 2. Article The present application also provides an article including at least two adherends and the adhesive tape of the present application between the two adherends, the two adherends being bonded via the adhesive tape.

[0241] The adherend can be rigid or flexible like a film. The material and shape of the adherend are not particularly limited, and examples include a plate-shaped adherend including resin, glass, or metal, a case and a cover, a member having any of them on an adherend surface, and the like.

[0242] The two adherends bonded via the adhesive tape can be the same as or different from each other. As the bonding method of the adherend, a method in which the adherend is attached to each of the surfaces of the adhesive tape of the present application having adhesion can be given.

[0243] The article is not particularly limited, and is preferably an electronic device, a component built into an electronic device, or the like from the viewpoint of being able to effectively utilize the effects exerted by the adhesive tape of the present application.

[0244] The article of the present application is preferably an article in which the heat-generating body constituting the adhesive tape has one pair of protrusions protruding from the outer periphery of the adherend in a plan view.

[0245] For example, as shown in the schematic plan view of Figures 12 to 13 and the schematic cross-sectional view of Figures 12 to 13 , the article 100 of the present application is an article including two adherends 50 and an adhesive tape 10 between the two adherends 50, the two adherends 50 being bonded via the adhesive tape 10, the adhesive tape 10 including a laminate of an adhesive layer a / a planar heat-generating body b / a melt-softening layer c in this order.

[0246] In a plan view (in which the adhesive tape is not shown) of the article 100 of the present application, the heat-generating body constituting the adhesive tape has one pair of protrusions protruding from the outer periphery of the adherend in the plan view. ​In the figure, the planar heating element b extends from the outer periphery of the adhesive layer a and the melt-softening layer c at both ends along the long axis.

[0247] In the method of disassembling the article described later, the two ends of the extended adhesive tape 10 can be used as a pair of terminals for electrical connection to a power source in the case where the heating means is either resistance heating or heat conduction, or as ends in contact with a heat source, so that the heating element b of the adhesive tape 10 can be easily heated.

[0248] In addition, such as ​ As shown in the top view, the smaller the contact area between the object being adhered to and the adhesive tape, the higher the heating efficiency of the heating element, and the easier it is to disassemble during heating, thus it is advantageous in terms of ease of disassembly.

[0249] Additionally, although not illustrated, the article of the present invention may also comprise two adhered objects and a space between the two adhered objects. ​ The adhesive tape shown is used to bond two objects together.

[0250] In a top view of an object, the adhesive tape can be applied to the entire surface of the object to be bonded, or it can be applied to a portion of the surface to be bonded. For example, ​ As shown, the adhesive tape 10 is preferably attached to a portion of the adhesive surface of the object 50. In this case, the top view shape of the adhesive tape 10 in the article can be strip-shaped, line-shaped, or patterned.

[0251] If the contact area between the adhered object and the adhesive tape is small, then when the adhesive tape is peeled off from the adhered object by resistance heating, it is easier to create a peeling start point between the adhered object and the adhesive tape, which is advantageous from the point of view of easy peeling.

[0252] Furthermore, in the top view of the article of the present invention, when the adhesive tape is adhered to the entire area of ​​the adhesive tape side of the object to be adhered, i.e., the surface to be adhered, the top view shape of the planar heating element in the adhesive tape can be the same as the top view shape of the adhesive tape, or it can be strip-shaped, line-shaped, or patterned.

[0253] 3. Methods for disassembling items In addition, the present invention also provides a method for disassembling the article of the present invention described above, wherein the molten softening layer is melted or softened by heating with a heating element, thereby separating the two adhered objects.

[0254] The disassembly method of the present invention preferably includes a step (separation step) in which the molten softening layer is melted or softened by heating with a heating element to separate at least two adhered objects. Other steps may also be included as needed.

[0255] The heating means and method of the heat generating body are not particularly limited, and examples include resistance heating, electromagnetic induction heating, infrared heating, microwave heating, and heat conduction. Among these, resistance heating is preferable.

[0256] In the case where the heating of the heat generating body is resistance heating, the separating step is preferably a step of electrically connecting the heat generating body to a power source, applying electric power from the power source to the heat generating body, and melting or softening the fusion-softening layer adjacent to the heat generating body by resistance heating, thereby separating the two adherends.

[0257] The power source can be an external power source or a driving power source of an electronic device or an article built in a component of the electronic device.

[0258] In addition, in the case where the article is an electronic device or a component built in the electronic device and the power source is a driving power source of the electronic device, the separating step is preferably a step of electrically connecting the heat generating body to the driving power source and a circuit of the electronic device, applying electric power from the driving power source to the heat generating body, and melting or softening the fusion-softening layer by resistance heating, thereby separating the two adherends.

[0259] The method of electrical connection can be any method of electrically connecting one pair of protruding portions of the heat generating body, which protrude from the heat generating body or the outer periphery of the adhesive layer and the fusion-softening layer, to the power source using a publicly known means such as an alligator clip. The circuit and the means of electrical connection are preferably formed of an electrically conductive material exhibiting a volume resistivity different from that of the material of the heat generating body in the adhesive tape, and more preferably formed of an electrically conductive material having a lower volume resistivity than the heat generating body.

[0260] In this case, when the heat generating body is electrically connected to the circuit and electric power is applied from the driving power source to the heat generating body, excessive heating of the circuit and the means of electrical connection can be prevented, and at the same time, electric voltage can be efficiently applied to the heat generating body, so that peeling can be performed in a short time, which is advantageous.

[0261] The method of applying electric power can be appropriately selected depending on the size of the adhesive tape of the present application or the type of the heat generating body, and examples include a method of applying electric voltage of 0.1 to 200 V until the fusion-softening layer is melted or softened (for example, in the range of 0.5 seconds to 30 minutes).

[0262] As ​ As schematically shown, a simple power source can be used. By electrically connecting the heat generating body of the adhesive tape of the present application to the power source and applying electric voltage to the heat generating body to apply electric power thereto, the heat generating body and its periphery can be heated by resistance heating.

[0263] By the above heating, the fusion-softening layer is melted or softened, the bonded state is released, and peeling becomes possible, and the adherends in the bonded state become detachable.

[0264] The voltage applied to the heat generating body by the electric current is preferably in the range of 0.1 V to 200 V, more preferably in the range of 0.5 V to 150 V, and further preferably in the range of 1.0 V to 100 V.

[0265] The adhesive tape of the present application melts or softens the molten softening layer in a short time even if a low voltage is applied, and thus, by setting the voltage applied in the separation process in the above range, the article can be detached in a short time without applying an excessive voltage, and damage to the article due to heat can be prevented.

[0266] In particular, by applying a voltage corresponding to the article such as a small electronic device or a household appliance, the article can be easily detached.

[0267] The current applied to the heat generating body is not particularly limited, and is preferably in the range of 0.01 A to 20 A, more preferably in the range of 0.03 A to 15 A, further preferably in the range of 0.05 A to 10 A, and particularly preferably in the range of 0.1 A to 5 A. Since the adhesive tape of the present application melts or softens the molten softening layer in a short time, if the current applied in the separation process is set in the above range, the current flowing in a general electronic device or a household appliance is allowed to flow, and thus the article can be detached in a short time, and damage to the article due to heat can be prevented.

[0268] In particular, by applying a current corresponding to the article such as a small electronic device or a household appliance, the article can be easily detached.

[0269] The application time is not particularly limited, and is preferably in the range of 0.5 seconds to 30 minutes, more preferably in the range of 0.5 seconds to 120 seconds, and further preferably in the range of 0.5 seconds to 30 seconds. If the application time is set in the above range, damage to the article due to heat does not occur, and the article can be easily detached in a short time.

[0270] In the case where the heating of the heat generating body is electromagnetic induction heating, the separation process is preferably a process of melting or softening the molten softening layer by electromagnetic induction heating using an electromagnetic induction heating means, thereby separating the two adherends. The electromagnetic induction heating means is not particularly limited, and a publicly known electromagnetic induction heating device can be appropriately selected.

[0271] In the case where the heating of the heat generating body is either of infrared heating and microwave heating, the separation process is preferably a process of melting or softening the molten softening layer by either of infrared heating using an infrared heating means and microwave heating using a microwave heating means, thereby separating the two adherends. The infrared heating means and the microwave heating means are not particularly limited, and publicly known infrared heating devices and microwave heating devices can be appropriately selected.

[0272] In the case where the heating of the heat generating body is heat conduction, the separating step is preferably a step of bringing the heat generating body into contact with a heat generating source to melt or soften the molten and softened layer by heat conduction, thereby separating the two adherends. The heat generating source is not particularly limited, and a publicly known heater can be appropriately selected.

[0273] The method using heat conduction of the heat generating source can be appropriately selected depending on the size of the adhesive tape, the type of the heat generating body, and the like, and for example, a method of bringing it into contact at a desired temperature until the molten and softened layer is melted or softened can be mentioned.

[0274] The detaching temperature of the article is preferably in the range of 80°C to 160°C, more preferably in the range of 90°C to 150°C, and further preferably in the range of 100°C to 130°C.

[0275] By setting the detaching temperature in the above range, thermal damage to the article and the adherend can be suppressed, and detachment can be easily performed. In particular, in the case where the heating of the adhesive tape is resistance heating (electrical resistance heating), detachment can be performed before heat is transferred to the article and the adherend by directly generating heat inside the tape.

[0276] The detaching temperature of the article can be measured by using a temperature sensor using a thermocouple as the temperature of the heat generating body of the adhesive tape of the present application (the achieved temperature of the heat generating body at the time of detachment).

[0277] The above describes one embodiment of the adhesive tape, the article, and the detaching method of the article of the present application, but the present application is not limited to the configuration of the above-described embodiment.

[0278] For example, the adhesive tape of the present application can be additionally provided with any other arbitrary configuration in the configuration of the above-described embodiment, or can be replaced with any arbitrary configuration that produces the same effect.

[0279] Example Hereinafter, the present application will be specifically described by examples. However, the present application is not limited to the following examples. The materials used in the present examples and the like are shown below.

[0280] "Heat generating body" Nickel-chromium alloy foil: "Nickel-chromium NCH1-H" [trade name, manufactured by Takumi Metal Foil Kogyo Co., Ltd., thickness 10 ​ m. Volume resistivity 108 ​ Ω·cm (catalog value), 105 ​ Ω·cm (measured value)] "Molten and softened layer" <Thermoplastic resin constituting the molten and softened layer> Styrene-based thermoplastic elastomers (all manufactured by ZEON Corporation, Japan, MFR measured at 190°C, 21.6 kg load).

[0281] Thermoplastic resin 1: "Quintac (registered trademark) 3270", structural unit derived from styrene 24 mass%, MFR 20 g / 10 minutes Thermoplastic resin 2: "Quintac (registered trademark) 3280", structural unit derived from styrene 25 mass%, MFR 12 g / 10 minutes Thermoplastic resin 3: "Quintac (registered trademark) 3520", structural unit derived from styrene 15 mass%, MFR 6.5 g / 10 minutes <Adhesion-imparting resin constituting the melt-softening layer> The following commercially available products were used. The mass reduction rate (hereinafter, abbreviated as "mass reduction rate") of each of the commercially available products when raised from 25°C to 200°C at a temperature increase of 10°C / minute under a nitrogen atmosphere was calculated based on the measured value using a thermogravimetric differential thermal analysis device "TG-DTA7200" (manufactured by Hitachi High-Technologies Corporation).

[0282] Adhesion-imparting resin 1: "Quintone (registered trademark) G115", C5 / C9 petroleum resin, manufactured by ZEON Corporation, Japan, mass reduction rate 0.6%, softening point 115°C Adhesion-imparting resin 2: "Quintone (registered trademark) M100", aliphatic hydrocarbon resin, manufactured by ZEON Corporation, Japan, mass reduction rate 0.9%, softening point 95.0°C Adhesion-imparting resin 3: "Pensel D-160", polymerized rosin ester resin, manufactured by Arakawa Chemical Industries, Ltd., mass reduction rate 1.6%, softening point 150-165°C Adhesion-imparting resin 4: "Pensel D-125", rosin ester, manufactured by Arakawa Chemical Industries, Ltd., mass reduction rate 0.4%, softening point 15-150°C Adhesion-imparting resin 5: "Nisshin Polybutene HV-50", polybutene (number average molecular weight 800), manufactured by ENEOS Corporation, mass reduction rate 3.4%, flow point -12.5°C <Anti-aging agent> Anti-aging agent: "Irganox (registered trademark) 1010", manufactured by BASF Japan Ltd. <Functional layer> Thermal insulation layer: polyethylene foam layer (thickness 100 ​ m, void ratio 60%) <Release layer> Release liner: a release-treated one-side, thickness 75 ​ m polyethylene terephthalate film Preparation Example of the melt-softening layer (melt-softening resin composition) [Preparation Example 1-1] 100 parts by mass of the thermoplastic resin 1, 36.3 parts by mass of the tackifying resin 1, 28.6 parts by mass of the tackifying resin 3, and 0.9 parts by mass of the anti-aging agent were mixed and dissolved in 150 parts by mass of n-propyl acetate as a solvent, thereby obtaining a resin composition (1-1).

[0283] The obtained resin composition (1-1) was applied to the release-treated surface of the release liner so as to have a thickness of about 2 mm after drying, thereby producing a layer (1-1). The storage modulus G' and the loss modulus (G'') were measured using a viscoelastic tester (ARES-G2, manufactured by TA Instrument Japan, Inc.) under conditions of a frequency of 1 Hz, a temperature range of -40°C to 200°C, and a temperature increase rate of 2°C / minute. In addition, tan ​ was calculated by the formula [tan ​ = G'' / G'].

[0284] The melting point of the layer (1-1) was 140°C, the storage modulus G 23 at 23°C was 2.5 x 10 5 Pa, the storage modulus G 120 at 120°C was 5.0 x 10 4 Pa, the storage modulus G 150 at 150°C was 2.0 x 10 4 Pa, and the temperature at which tan ​ reached 0.8 was 125°C (tan ​ was 125°C or higher).

[0285] [Preparation Example 1-2] In Preparation Example 1-1, 100 parts by mass of the thermoplastic resin 2 was used instead of the thermoplastic resin 1, and otherwise the same as in Preparation Example 1-1, thereby obtaining a resin composition (1-2).

[0286] The same as in Preparation Example 1-1, a layer (1-2) was produced from the obtained resin composition (1-2). The storage modulus G 23 at 23°C of the layer (1-2) was 6.0 x 10 5 Pa, the storage modulus G 120 at 120°C was 8.0 x 10 4 Pa, the storage modulus G 150was 7.7 x 10 4 Pa, tan ​ The temperature at which 0.8 was reached was 115°C.

[0287] [Preparation Example 1-3] 100 parts by mass of the thermoplastic resin 2, 36.3 parts by mass of the tackifying resin 2, 28.6 parts by mass of the tackifying resin 4, and 0.9 parts by mass of the anti-aging agent were mixed and dissolved in n-propyl acetate 150 parts by mass as a solvent, thereby obtaining a resin composition (1-3).

[0288] The layer (1-3) was produced from the obtained resin composition (1-3) in the same manner as in Preparation Example 1-1. The storage modulus G 23 was 8.5 x 10 4 Pa, the storage modulus G 120 was 4.0 x 10 4 Pa, the storage modulus G 150 was 2.0 x 10 4 Pa, tan ​ The temperature at which 0.8 was reached was 80°C.

[0289] [Preparation Example 1-4] 100 parts by mass of the thermoplastic resin 3, 36.3 parts by mass of the tackifying resin 1, 28.6 parts by mass of the tackifying resin 3, 50.8 parts by mass of the tackifying resin 5, and 0.9 parts by mass of the anti-aging agent were mixed and dissolved in toluene 181.5 parts by mass as a solvent, thereby obtaining a resin composition (1-4).

[0290] The layer (1-4) was produced from the obtained resin composition (1-4) in the same manner as in Preparation Example 1-1. The storage modulus G 23 was 2.5 x 10 5 Pa, the storage modulus G 120 was 5.5 x 10 4 Pa, the storage modulus G 150 was 1.5 x 10 4 Pa, tan ​ The temperature at which 0.8 was reached was 125°C.

[0291] [Preparation Example 1-5] In Preparation Example 1-4, the tackifying resin 5 was not added, and otherwise, the same as in Preparation Example 1-4, thereby obtaining a resin composition (1-5).

[0292] The layer (1-5) was produced from the obtained resin composition (1-5) in the same manner as in Preparation Example 1-1. The storage modulus G23 was 2.0 x 10 5 Pa, the storage modulus G' at 120°C 120 was 6.7 x 10 4 Pa, the storage modulus G' at 150°C 150 was 1.5 x 10 4 Pa, tan ​ The temperature at which 0.8 was reached was 120°C.

[0293] [Preparation Example 1-6] In Preparation Example 1-4, tackifying resin 3 and tackifying resin 5 were not added, and otherwise, the same operations as in Preparation Example 1-4 were performed to obtain a resin composition (1-6).

[0294] The layer (1-6) was produced from the obtained resin composition (1-6) in the same manner as in Preparation Example 1-1. The storage modulus G' at 23°C of the layer (1-6) 23 was 1.7 x 10 5 Pa, the storage modulus G' at 120°C 120 was 8.2 x 10 4 Pa, the storage modulus G' at 150°C 150 was 3.0 x 10 4 Pa, tan ​ The temperature at which 0.8 was reached was 127°C.

[0295] [Preparation Example 1-7] 100 parts by mass of the thermoplastic resin 3, 36.3 parts by mass of the tackifying resin 2, 28.6 parts by mass of the tackifying resin 4, and 0.9 parts by mass of the anti-aging agent were mixed and dissolved in 181.5 parts by mass of toluene as a solvent, thereby obtaining a resin composition (1-7).

[0296] The layer (1-7) was produced from the obtained resin composition (1-7) in the same manner as in Preparation Example 1-1. The storage modulus G' at 23°C of the layer (1-7) 23 was 1.9 x 10 5 Pa, the storage modulus G' at 120°C 120 was 6.0 x 10 4 Pa, the storage modulus G' at 150°C 150 was 1.8 x 10 4 Pa, tan ​ The temperature at which 0.8 was reached was 120°C.

[0297] <Preparation Example of the Adhesive Layer> [Preparation Example 2] In a reaction vessel equipped with a stirrer, a reflux condenser, a nitrogen inlet tube, and a thermometer, 79.9 parts by mass of n-butyl acrylate, 6 parts by mass of 2-ethylhexyl acrylate, 10 parts by mass of cyclohexyl acrylate, 4 parts by mass of acrylic acid, 0.1 parts by mass of 4-hydroxybutyl acrylate, and 200 parts by mass of ethyl acetate were charged, and nitrogen bubbling was performed at 23°C for 1 hour under stirring to obtain a mixture.

[0298] Next, 2 parts by mass (1.0% by mass of solid content) of a 2,2'-azobis(2-methylbutyronitrile) solution previously dissolved in ethyl acetate was added to the mixture, and stirring was performed at 72°C for 4 hours and then at 75°C for 5 hours under stirring. Next, the resulting mixture was diluted with ethyl acetate, and filtration was performed using a 200-mesh metal net, thereby obtaining an acrylic acid copolymer solution (26% of solid content concentration) having a weight average molecular weight of 1,060,000 and an average number of carbon atoms of the saturated hydrocarbon group possessed by the alkyl acrylate monomers of 4.4.

[0299] In 100 parts by mass of the resulting acrylic acid copolymer solution, 1.0 parts by mass of toluene diisocyanate adduct with trimethylolpropane (BURNOCK D-40 manufactured by DIC Corporation, isocyanate-based crosslinking agent, 40% of solid content, hereinafter referred to as "D-40") was mixed as a crosslinking agent, thereby obtaining a composition (2).

[0300] The resulting composition (2) was applied to a release-treated surface of a release liner in such a manner that the dried thickness became about 2 mm, and a layer (2) was produced. The storage modulus G' and the loss modulus (G'') were measured using a viscoelastic tester (ARES-G2, manufactured by TA Instrument Japan Corporation) under conditions of a frequency of 1 Hz, a temperature range of -40°C to 200°C, and a temperature increase rate of 2°C / minute. In addition, tan ​ was measured at a frequency of 1 Hz. ​ was calculated by the following equation [tan

[0301] The melting point of the composition (2) was 150°C or higher, the storage modulus G 23 at 23°C was 7.5 x 10 4 Pa, the storage modulus G 120 at 120°C was 5.5 x 10 4 Pa, and the temperature at which tan ​ reached 0.8 was a temperature higher than 150°C (tan ​ reached 0.8 or more was a temperature range higher than 150°C. In addition, the maximum value of tan ​ in the temperature range of 100°C to 150°C was 0.4.

[0302] 1. Example of production of adhesive tape and article [Example 1] <Production of adhesive tape> (i) The composition (2) was applied to the release-treated surface of a release liner so as to have a dried thickness of 50 ​ m, and dried at 90°C for 3 minutes to obtain an adhesive layer al.

[0303] On the other hand, the resin composition (1-1) was applied to the release-treated surface of another release liner so as to have a dried thickness of 80 ​ m, and dried at 90°C for 3 minutes to obtain a melt-softened layer cl.

[0304] The adhesive layer al was attached to one face of the thermal insulation layer as a functional layer, and the melt-softened layer cl was attached to the other face of the thermal insulation layer, and lamination was performed from the upper surface of the release liner using a roll with a linear pressure of 5 kg / cm. This was aged for 48 hours in an environment at 40°C, whereby a laminate LI was obtained, which had a total thickness of 230 ​ m excluding the release liner, and the layers excluding the release liner were laminated in the order of melt-softened layer cl / thermal insulation layer / adhesive layer al. (ii) Next, the composition (2) was applied to the release-treated surface of the other release liner so as to have a dried thickness of 50 ​ m, and dried at 90°C for 3 minutes to obtain an adhesive layer a2.

[0305] The laminate LI was cut to an arbitrary width of 50 mm in length, and a nickel-chromium alloy foil of 100 mm in length was attached to the melt-softened layer cl of the laminate LI using a hand pressure roll, and positioned so that the nickel-chromium alloy foil protruded by 25 mm at both ends in the length direction.

[0306] Likewise, the adhesive layer a2 cut to an arbitrary width of 50 mm in length was attached to the opposite face of the nickel-chromium alloy foil to which the melt-softened layer cl was attached, and a shape was formed in which both ends of the nickel-chromium alloy foil protruded by 25 mm in the length direction of the nickel-chromium alloy foil from the outer periphery of the melt-softened layer cl and the adhesive layer a2.

[0307] Lamination was performed from the upper surface of the release liner using a roll with a linear pressure of 5 kg / cm, and aged for 48 hours in an environment at 40°C. Thus, a laminate L2 was produced, which had a total thickness of 290 ​ m excluding the release liner, and the layers excluding the release liner were laminated in the order of adhesive layer a2 / nickel-chromium alloy foil b / melt-softened layer cl / thermal insulation layer / adhesive layer al.

[0308] The obtained laminate L2 was cut in a width of 2 mm to obtain an adhesive tape (T-1) in which the laminate L1 and the adhesive layer a2 were 2 mm in width and 50 mm in length, the nichrome foil was 2 mm in width and 100 mm in length, and the nichrome foil had one pair of protrusions extending from the outer periphery of the molten-softened layer cl and the adhesive layer a2. A schematic plan view of the adhesive tape (T-1) is shown in ​ A schematic cross-sectional view is shown in ​ .

[0309] <Manufacture of an article> The release liner on the adhesive layer al side of the adhesive tape (T-1) (indicated by reference numeral 10) of Example 1 was peeled off and attached to an adherend 50a (glass, 40 mm in width x 50 mm in length x 10 mm in thickness) in such a manner that the length of the adhesive tape 50 mm of the adhesive tape adhering surface (effective portion) was laid across the center of the adherend 50a in the width direction of the adherend 50a (see ​ ). ​

[0310] Next, the release liner on the adhesive layer a2 side was peeled off and attached in such a manner that the shape of the adhesive tape (T-1) was sandwiched with an adherend 50b (glass, 30 mm in width x 100 mm in length x 2.8 mm in thickness) (see ​ ) and pressed at 20 N / cm 2 for 10 seconds. The obtained attached article was left to stand in an atmosphere of 23°C and 50% RH for 24 hours or more, whereby an article of Example 1 was obtained.

[0311] [Examples 2 to 3] In Example 1, resin composition (1-2) or resin composition (1-3) was used instead of resin composition (1-1), and otherwise the same as in Example 1, to obtain adhesive tapes (T-2) to (T-3) and articles of Examples 2 to 3. In Example 1, resin composition (1-4) to resin composition (1-7) was used instead of resin composition (1-1), and otherwise the same as in Example 1, to obtain adhesive tapes (T-4) to (T-7) and articles of Comparative Examples 1 to 4.

[0312] 2. Evaluation For the articles obtained in each of the examples and comparative examples, the push strength was measured in the following manner using the device shown in ​ .

[0313] (1) Push strength before heating The articles obtained in each of the examples and comparative examples were used as test pieces, and the push strength was measured at a pressing position of 23°C in an environment using a ​ . ​ ​The probe 70 shown was pressed against the glass plate in the arrow direction at a speed of 10 mm / min, and the strength at which the adhesive tape was peeled off was measured [pushing strength (G1)].

[0314] 〔Evaluation criteria for initial adhesion〕 O: pushing strength (G1) was 45 N / 0.8 cm 2 or less ▲: pushing strength (G1) was 40 N / 0.8 cm 2 or less than 45 N / 0.8 cm 2 X: pushing strength (G1) was less than 40 N / 0.8 cm 2 (2) Pushing strength after heating for 10 seconds The article obtained in each of the examples and comparative examples was used as a test piece, and the protruding portion e of the nichrome foil (heating element) in the adhesive tape 10 of each test piece was held with the alligator clip 60, and a direct current stabilized power supply (manufactured by Kikusui Electronics Corp., trade name "PAS160-1") was used to pass a current of 0.5 A, 1.0 A, or 1.5 A. After 10 seconds from the start of the passage of the current, the passage of the current was continued while the temperature of the heating element was measured with a temperature sensor using a thermocouple. ​ The probe 70 shown was pressed against the glass plate in the arrow direction at a speed of 10 mm / min, and the strength at which the adhesive tape was peeled off was measured [pushing strength (G2)].

[0315] Note that the achieved temperature of the heating element at the time of the 0.5 A passage of the current (the disassembly temperature of the article) was about 100°C, the achieved temperature of the heating element at the time of the 1.0 A passage of the current (the disassembly temperature of the article) was about 160°C, and the achieved temperature of the heating element at the time of the 1.5 A passage of the current (the disassembly temperature of the article) was about 200°C.

[0316] The temperature of the heating element after the passage of the current was measured with a temperature sensor using a thermocouple.

[0317] (3) Residual adhesive force and pushing strength reduction rate The residual adhesive force and the pushing strength reduction rate were calculated using the following equation using the pushing strength (G1) and the pushing strength (G2), and the disassembly property was evaluated according to the following criteria.

[0318] Residual adhesive force (%) = 100 x G2 / G1 Pushing strength reduction rate (%) = 100 x [1-(G2 / G1)] 〔Evaluation criteria for disassembly property〕 O: residual adhesive force was less than 50% △: residual adhesive force was 50% or more (4) Presence or absence of volatile components The obtained each article was confirmed for generation of smoke and odor upon disassembly by electric heating, and the judgment was performed in the following manner.

[0319] O: Neither smoke nor odor was generated X: At least one of smoke or odor was generated The above results are summarized in Table 1.

[0320] Note that, regarding the push strength after 1.5 A electric heating for 10 seconds, in the articles of Examples 1 to 3 and Comparative Examples 1 and 4, the adhesive tape peeled off due to the weight of the article within 10 seconds after starting 1.5 A electric heating, and thus the push strength could not be measured by the above method.

[0321] Therefore, the push strength of the articles of Examples 1 to 3 and Comparative Examples 1 and 4 after 1.5 A electric heating for 10 seconds was judged to be less than the value in Comparative Example 2 having the lowest push strength.

[0322] [Table 1]

[0323] Industrial applicability The adhesive tape of the present application can be peeled off in a short time, can prevent thermal damage of the adherend, and the operation of peeling off is easy. Therefore, the adhesive tape of the present application can be suitably used as an adhesive tape which is required to be peeled off when separating components for the purpose of recycling or reusing, for example, in industrial applications such as electronic devices, automobiles, building materials, OA, and home electric appliances, and can improve the work efficiency when separating components, peeling off labels, and the like.

[0324] Explanation of reference numerals a, a1, a2: adhesive layer b: heat generating body c: fusion softening layer d: thermal insulation layer e: protruding portion (of the heat generating body) 10, 20, 30: adhesive tape 50, 50a, 50b: adherend 100: article 60: crocodile clip 70: probe P: pressed position.

Claims

1. An adhesive tape, characterized by at least in order, an adhesive layer, a heat generating body, and a fusion softening layer adjacent to the heat generating body, the fusion softening layer contains: a thermoplastic resin having a weight average molecular weight of 80000 to 150000, and a tackifying resin having a mass reduction rate of 3% or less when raised from 25°C to 200°C at a temperature rise of 10°C / minute under a nitrogen atmosphere.

2. The adhesive tape according to claim 1, wherein the thermoplastic resin constituting the fusion softening layer contains a block copolymer or a hydrogenated product thereof, the block copolymer contains: a polymer block containing a structural unit derived from an aromatic vinyl compound, and a polymer block containing a structural unit derived from a conjugated diene compound.

3. The adhesive tape according to claim 1, wherein The storage modulus of the melt-softened layer at 150°C is in the range of 1.0 x 10 3 ~ 1.0 x 10 5 Pa.

4. The adhesive tape according to claim 1, wherein The melt flow rate MFR of the thermoplastic resin constituting the fusion softening layer is 9 g / 10 minutes or more under conditions of 190°C and a load of 21.6 kg.

5. The adhesive tape according to claim 1, wherein The content of the thermoplastic resin constituting the fusion softening layer is in the range of 30 mass% to 80 mass% relative to the entire composition constituting the fusion softening layer.

6. The adhesive tape according to claim 1, wherein The content of the tackifying resin constituting the fusion softening layer is in the range of 20 mass parts to 100 mass parts relative to 100 mass parts of the thermoplastic resin constituting the fusion softening layer.

7. The adhesive tape according to claim 1, wherein The mass reduction rate of the adhesive tape after heating is 0.5% or less relative to the mass of the adhesive tape before heating when the adhesive tape is heated at 150°C for 30 seconds under a nitrogen atmosphere.

8. The adhesive tape according to claim 1, wherein The volumetric resistivity of the heat generating body at 20°C is 30 μ Ω·cm or more.

9. The adhesive tape according to claim 1, wherein In a plan view, the heat generating body has one pair of protrusions protruding from the outer periphery of the adhesive layer and the fusion softening layer.

10. The adhesive tape according to claim 1, wherein The adhesive layer is further provided on the side of the surface of the fusion softening layer opposite to the surface adjacent to the heat generating body.

11. The adhesive tape according to claim 1, wherein The fusion softening layer is peelable by heating.

12. The adhesive tape according to claim 1, wherein The heat generating body is an electrically conductive body that generates heat by electric conduction, and the adhesive tape is peeled by the heat generation of the electrically conductive body.

13. An article, characterized by, comprises: at least 2 adherends; and the adhesive tape according to any one of claims 1 to 12 between the 2 adherends, The 2 adherends are adhered via the adhesive tape.

14. The article of claim 13, wherein, In a plan view, the heat generating body constituting the adhesive tape has one pair of protrusions protruding from the outer periphery of the adherend.

15. The method of claim 13, wherein the article is a package. The fusion softening layer is melted and / or softened by the heating of the heat generating body, thereby separating the 2 adherends.

16. The method of disassembly of an article according to claim 15, wherein, The heating of the heat generating body is resistance heating, the heat generating body is electrically connected to a power source, the heat generating body is electrically conducted from the power source, the fusion softening layer is melted and / or softened by resistance heating, thereby separating the 2 adherends. The heating of the heat generating body is resistance heating, the heat generating body is electrically connected to a power source, the heat generating body is electrically conducted from the power source, the fusion softening layer is melted and / or softened by resistance heating, thereby separating the 2 adherends.

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