Temperature sensor

Abstract

The invention provides a temperature sensor, which comprises a base used for being mounted on a measured component; the temperature-sensitive element is mounted on the base; the circuit board is installed on the base, and the temperature-sensitive element is electrically connected to the circuit board. According to the temperature sensor provided by the invention, the conventional structure that the temperature-sensitive element is mounted on a circuit board is abandoned, and the temperature-sensitive element is separated from the circuit board, so that the temperature-sensitive element is positioned at a position close to a measured part as much as possible.

Description

TECHNICAL FIELD

[0001] The present application relates to a temperature sensor. BACKGROUND

[0002] Temperature sensors are widely used in various devices to sense the temperature of measured components. With the advancement of technology and the increasing demand for measurement, some temperature sensors also need to transmit the sensing signal through the internal antenna to the receiving component, or even to the cloud platform, etc. for further processing. Therefore, higher requirements are put forward for the temperature sensing accuracy and signal transmission quality of the temperature sensor.

[0003] There are many factors that affect the temperature sensing accuracy and signal transmission quality of the temperature sensor. For example, more sensitive temperature sensitive elements, higher power transmission antennas, etc. can be used, but these solutions will significantly increase the cost and structural complexity of the temperature sensor.

[0004] Therefore, the field desires a solution that can improve the performance of the temperature sensor at a lower cost and simpler structure. SUMMARY

[0005] In view of the above-mentioned problems and needs, the present disclosure proposes a new technical solution, which solves the above-mentioned problems and brings other technical effects due to the adoption of the following technical features.

[0006] The present application provides a temperature sensor, comprising: a base for mounting to a measured component; a temperature sensitive element mounted to the base; a circuit board mounted to the base, and the temperature sensitive element is electrically connected to the circuit board.

[0007] The temperature sensor proposed by the present application discards the conventional structure of mounting the temperature sensitive element on the circuit board, and separates the temperature sensitive element from the circuit board, so that it is located as close as possible to the measured component. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is an exploded view of the temperature sensor according to the preferred embodiment of the present application;

[0009] Figure 2 is a view of the inside of the assembled temperature sensor group;

[0010] Figure 3 is a sectional view taken along the A-A line of Figure 2

[0011] Figure 4 is a perspective view of the temperature sensor of Figure 1 DETAILED DESCRIPTION

[0012] ​​In order to make the purpose, technical solutions and advantages of the technical solutions of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below in conjunction with the drawings of the embodiments of the present disclosure. The same reference signs in the drawings represent the same components. It should be noted that the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without any inventive effort fall within the scope of protection of the present disclosure.

[0013] Compared with the embodiments shown in the drawings, the feasible implementation solutions within the protection scope of the present disclosure can have fewer components, have other components not shown in the drawings, have different components, have differently arranged components or differently connected components, etc. In addition, two or more components in the drawings can be implemented in a single component, or a single component shown in the drawings can be implemented as multiple separate components.

[0014] Unless otherwise defined, technical terms or scientific terms used herein should be understood as having the common meaning in the field of the present disclosure to which they pertain. The terms "first", "second" and similar terms used in the description and the claims of the present disclosure do not denote any order, quantity or importance, but are used to distinguish different components. When the number of components is not specified, the number of components can be one or more; similarly, the terms "one", "said" and "the" do not necessarily mean a quantity limitation. The terms "comprise", "comprise" and similar terms mean that the components or objects before the terms encompass the components or objects listed after the terms and their equivalents, without excluding other components or objects. The terms "mount", "set", "connect" or "connected" and similar terms are not limited to physical or mechanical mounting, setting or connecting, but can include electrical mounting, setting or connecting, whether direct or indirect. The terms "upper", "lower", "left", "right" and the like only represent the relative positional relationship of the device in use or the positional relationship shown in the drawings, and when the absolute position of the described object changes, the relative positional relationship can also change accordingly.

[0015] As mentioned before, the problem faced by the field is that it is difficult to obtain a temperature sensor with better performance at lower cost and simpler construction. Through the research of the inventor, it is found that the layout of the internal elements of the temperature sensor can have a significant impact on the performance of the temperature sensor.

[0016] For example, a conventional temperature sensor is mounted to a measured element through its base, while a temperature sensitive element in the temperature sensor is usually directly mounted on a circuit board, which is in turn mounted to the base of the temperature sensor. However, because of the limitation of installation space, the thickness of the circuit board and the heat resistance of other components on the circuit board, etc., there is usually a certain distance between the circuit board and the base, which not only makes the temperature sensitive element farther away from the measured component, but also makes the temperature transfer to the temperature sensitive element through multiple media, so that the conventional layout makes the temperature sensor unable to obtain more accurate temperature data.

[0017] Therefore, the present application proposes a temperature sensor, as shown in Figure 1 and 2 which comprises a base 1 for mounting to a measured component, a temperature sensitive element 2 mounted to the base 1, and a circuit board 3 mounted to the base 1 and electrically connected to the temperature sensitive element 2. Through this structure, the temperature sensitive element 2 is not only separated from the circuit board but also directly mounted to the base 1, so that the temperature sensitive element 2 is closer to the measured component and can obtain temperature data closer to the real temperature of the measured component through heat transfer of the base 1 only. The base 1 is preferably made of a metal material with high thermal conductivity, etc., to provide better heat conduction.

[0018] Further preferably, the base 1 can have a recess 10 in which the temperature sensitive element 2 is arranged. By arranging the temperature sensitive element 2 in the recess 10, the temperature sensitive element 2 is closer to the measured component, and the recess 10 also makes the bottom wall of the base 1 thinner, which is more conducive to heat transfer. Therefore, while meeting the rigidity of the base 1, the recess 10 can be made as deep as possible, so that the temperature sensitive element 2 is as close as possible to the measured component. More preferably, a thermally conductive glue can be used to fill the gap between the temperature sensitive element 2 and the recess 10. The thermally conductive glue not only has good heat conduction effect, but also can be used to firmly fix the temperature sensitive element 2 in the recess 10.

[0019] In addition, according to the research of the present inventor, the antenna for transmitting temperature sensing signals is also affected by other components in the temperature sensor. For example, the antenna is very susceptible to metal components, especially in conventional temperature sensors, the antenna is usually also mounted on the circuit board, so that when the circuit board is close to the metal base, the antenna will be significantly affected by the metal base. In addition, the battery mounted to the circuit board also has a great impact on the antenna.

[0020] Therefore, according to a preferred embodiment of the present application, the circuit board 3 is spaced apart from the base 1. Thus, even if the antenna 4 (such as a Bluetooth antenna) of the temperature sensor is directly mounted on the circuit board 3, the influence of the base 1 on the antenna 4 can be reduced due to the spacing between the circuit board 3 and the base 1.

[0021] Further preferably, the temperature sensor can further comprise a support 8. As shown inFigure 1 and Figure 3 As shown in Figs. 1 and 2, the temperature sensor further comprises a plurality of pillars 8, which are connected to the base 1 at one end and to the circuit board 3 at the other end, in order to fix the circuit board 3 to the base 1. Preferably, the pillars 8 are three or more. Preferably, one end of the pillars 8 comprises a threaded column 81, which is screwed into a corresponding threaded hole in the base 1, and the other end comprises a threaded hole 82, so that a screw 9, which passes through a through hole 33 in the circuit board 3, can be screwed into the threaded hole 82, in order to fix the circuit board 3 to the base 1. It should be understood that the one end 81 of the pillars 8 can also be connected to the base 1 by other means, for example by interference fit or welding, etc. It should also be understood that the fixing of the pillars 8 to the circuit board 3 can also be achieved by any other means. For example, in another embodiment not shown, the other end of the pillars 8 is also provided as a threaded column, which passes through the through hole 33 of the circuit board 3, and a nut is used to fasten the circuit board 3.

[0022] Further preferably, in order to further reduce the interference suffered by the antenna 4, the antenna 4 can be mounted to the side 31 of the circuit board 3 facing away from the base 1, and there is a second spacing between the antenna 4 and the circuit board 3, as shown in Figs. 1 and 2. It is also preferable that the temperature sensor further comprises an antenna platform 7, which has legs 71 connected to the circuit board 3, as shown in Figs. 1 and 2. There can be three or more legs 71, for example. In turn, the antenna 4 can be mounted to the antenna platform 7 or formed integrally with the antenna platform 7. Figure 2 and 3 It is also preferable that the temperature sensor further comprises an antenna platform 7, which has legs 71 connected to the circuit board 3, as shown in Figs. 1 and 2. There can be three or more legs 71, for example. In turn, the antenna 4 can be mounted to the antenna platform 7 or formed integrally with the antenna platform 7. Figure 2

[0023] Therefore, the second spacing can be made as large as possible, under the condition of meeting the installation and size requirements. By this arrangement, due to the existence of the first spacing between the circuit board 3 and the base 1 and the second spacing between the antenna 4 and the circuit board 3, as mentioned above, the antenna 4 is further away from the base 1, so that the influence from the base 1 and other components on the circuit board 3 is minimized.

[0024] Further, the temperature sensor further comprises a battery 5, which is mounted to the side 32 of the circuit board 3 facing the base 1. That is, the battery 5 and the antenna 4 are respectively located on the two sides of the circuit board 3, further reducing the influence of the battery 5 on the antenna 4. According to a further preferred embodiment not shown, there can be a third spacing between the battery 5 and the circuit board 3 (for example, the battery 5 can be soldered to the circuit board 3 by longer pins, so that the battery 5 does not tightly adhere to the circuit board 3), so as to further increase the distance between the antenna 4 and the battery 5. Further preferably, the third spacing is filled with fixing glue, which is preferably silicone glue or epoxy glue. Thus, by filling the fixing glue in the third spacing, the battery 5 and the circuit board 3 can be further fixed and play a role in anti-vibration, especially in the case where the temperature sensor is used in a strong vibration environment.

[0025] ​Further preferably, the temperature sensor further comprises a cushion 6 disposed between the battery 5 and the base 1. Since the temperature sensor can be applied to a vibrating component, the cushion 6 can reduce the vibration transmitted to the battery 5, preventing the soldering between the pins of the battery 5 and the circuit board 3 from loosening. The cushion 6 can be made of any suitable material, such as foam, rubber, resin, etc., and can be connected to the battery 5 and the base 1 by means of adhesion or the like. According to a more preferred embodiment, the cushion 6 can be silica gel foam, which has better cushioning, insulation and high-temperature resistance.

[0026] In addition, the temperature sensor further comprises a housing 100 which cooperates with the base 1 (e.g. by threaded connection) to encapsulate the components of the temperature sensor. Preferably, the surface of the housing 100 has a surface resistivity less than 10 10 Ω and greater than 10 6 Ω. Thus, the thus-designed housing does not accumulate too much charge during operation, meeting the explosion-proof requirements in some working scenarios. The base 1 can comprise a bottom connecting hole 101 to facilitate the installation of the temperature sensor to the measured component. The bottom edge of the base 1 can further comprise a plurality of straight edges 102 to facilitate the engagement of installation tools (e.g. wrenches).

[0027] In summary, the present application proposes a temperature sensor which abandons the conventional configuration of mounting the temperature-sensitive element on the circuit board, but separates the temperature-sensitive element from the circuit board and locates it as close as possible to the measured component. Further, the antenna is also mounted at a distance from the base and the circuit board, minimizing the interference from other components, especially metal components.

[0028] The exemplary embodiments of the present disclosure are described in detail above with reference to the preferred embodiments. However, those skilled in the art can understand that various modifications and changes can be made to the above-described specific embodiments without departing from the concept of the present disclosure, and various technical features and structures proposed by the present disclosure can be combined in various ways without exceeding the scope of the present disclosure, which is determined by the appended claims.

Claims

1. A temperature sensor, comprising: Base (1), used for mounting to the component under test; Thermosensitive element (2) is installed on base (1); The circuit board (3) is mounted to the base (1), and the temperature-sensitive element (2) is electrically connected to the circuit board (3).

2. The temperature sensor as described in claim 1, wherein, The base (1) has a groove (10) in which the temperature-sensitive element (2) is disposed.

3. The temperature sensor as described in claim 2, wherein, Use thermally conductive adhesive to fill the gap between the temperature-sensitive element (2) and the groove (10).

4. The temperature sensor as described in claim 1, wherein, There is a first gap between the circuit board (3) and the base (1); Preferably, the temperature sensor further includes a support (8), one end of which is connected to the base (1) and the other end of which is connected to the circuit board (3) to fix the circuit board (3) to the base (1).

5. The temperature sensor as claimed in claim 1 or 4 further includes an antenna (4) mounted to a side (31) of the circuit board (3) opposite to the base (1), and the antenna (4) has a second gap with the circuit board (3).

6. The temperature sensor of claim 5 further includes an antenna platform (7) having legs (71) connected to the circuit board (3).

7. The temperature sensor as claimed in claim 6, wherein, The antenna (4) is installed on the antenna platform (7) or is integrally formed with the antenna platform (7).

8. The temperature sensor as claimed in claim 1 or 4, further comprising a battery (5) mounted to the side (32) of the circuit board (3) facing the base (1); preferably, the temperature sensor further comprising a housing (100) having a surface resistivity of less than 10. 10 Ω and greater than 10 6 Ω.

9. The temperature sensor as claimed in claim 8, wherein, There is a third gap between the battery (5) and the circuit board (3); preferably, the third gap is filled with a fixing adhesive, which is preferably silicone or epoxy.

10. The temperature sensor as claimed in claim 8 further includes a buffer pad (6) disposed between the battery (5) and the base (1); preferably, the buffer pad (6) is silicone foam.

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