Manufacturing method of thick gold plate

Abstract

The invention discloses a manufacturing method of a thick gold plate, which comprises the following steps: preparing a plate, and pre-treating the plate; nickel plating is conducted on the plate, so that a nickel layer is formed on the surface of the plate; carrying out surface modification on the plate, so that a self-assembled single-layer film is formed on the surface of the nickel layer; sequentially performing primary vacuum resin hole plugging and secondary vacuum resin hole plugging on the plate through a vacuum hole plugging machine, wherein the pressure of the secondary vacuum resin hole plugging is smaller than that of the primary vacuum resin hole plugging; carrying out resin curing on the plate; gold plating is conducted on the plate, so that a gold-plated layer is formed on the plate; and the plate is subjected to post-treatment, and the thick gold plate is obtained. According to the manufacturing method of the thick gold plate, the corrosion resistance of the nickel layer can be improved, and the interface stability between the subsequent gold plating layer and the nickel layer is enhanced.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to a method for manufacturing a thick gold plate. Background Technology

[0002] In the manufacturing process of printed circuit boards (PCBs), thick gold plates (PCBs with a thicker gold plating layer) are widely used in high-end electronic devices due to their excellent conductivity and solderability. However, during long-term use, the nickel layer (which acts as a barrier layer between the gold and copper layers) of thick gold plates is susceptible to corrosion, leading to a decline in circuit performance or even circuit failure. Summary of the Invention

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a method for manufacturing a thick gold plate that can improve the corrosion resistance of the nickel layer, enhance the interfacial stability between the subsequent gold plating layer and the nickel layer, and simultaneously allow air bubbles in the resin to be fully expelled, enhancing the resin's penetration ability to better fill the pores and interfacial gaps in the nickel layer. This increases the contact area between the resin and the nickel layer, improves the interfacial bonding force between the resin and the nickel layer, forms a more effective physical isolation barrier, and further improves the corrosion resistance of the nickel layer.

[0004] The method for manufacturing a thick gold plate according to the embodiments of this application includes: Prepare the boards and perform pretreatment on them; The sheet metal is nickel-plated to form a nickel layer on its surface. The surface of the plate is modified so that a self-assembled monolayer film is formed on the surface of the nickel layer; The board is sequentially subjected to primary vacuum resin plugging and secondary vacuum resin plugging using a vacuum plugging machine. The pressure of the secondary vacuum resin plugging is less than that of the primary vacuum resin plugging. The board is then cured with resin. The sheet material is plated with gold to form a gold-plated layer. The sheet material undergoes post-processing to obtain a thick gold sheet; The vacuum plugging machine includes: The machine base is provided with a fixed seat, on which a plate is placed. A sealing strip is provided between the plate and the fixed seat to form a vacuum chamber. The plate is provided with a plugging hole, which communicates with the vacuum chamber. A vacuum mechanism includes a vacuum tube and a vacuum pump, wherein the vacuum tube is connected to the vacuum chamber, the vacuum pump is connected to the vacuum tube, and the vacuum tube is equipped with a pressure relief valve; The grease injection mechanism includes a grease injection assembly disposed above the fixed base. The grease injection assembly includes a mounting base, a lifting unit, and multiple nozzles of different diameters. The mounting base is rotatably mounted with a rotating disk, and the nozzles are circumferentially disposed on the rotating disk. A spring is disposed between the nozzles and the rotating disk. The mounting base is located below the rotating disk and has a through hole. The lifting unit is located above the nozzles and has a discharge pipe. The lifting unit descends to connect the discharge pipe to the nozzles and presses the nozzles extending out of the through hole. The nozzles are provided with an elastic connector that can be sealed to the plate.

[0005] The manufacturing method of the thick gold plate according to the embodiments of this application has at least the following beneficial effects: by surface modification of the plate, a self-assembled monolayer film can be formed on the surface of the nickel layer, thereby improving the corrosion resistance of the nickel layer and enhancing the interfacial stability between the subsequent gold plating layer and the nickel layer; at the same time, by sequentially performing primary vacuum resin plugging and secondary vacuum resin plugging on the plate, with the pressure of the secondary vacuum resin plugging being less than that of the primary vacuum resin plugging, air bubbles in the resin can be fully discharged, enhancing the resin's penetration ability to better fill the pores and interfacial gaps of the nickel layer, thereby increasing the contact area between the resin and the nickel layer, improving the interfacial bonding force between the resin and the nickel layer, forming a more effective physical isolation barrier, and further improving the corrosion resistance of the nickel layer.

[0006] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the plate is nickel-plated to form a nickel layer on the surface of the plate, including: The sheet material is nickel-plated to form a nanocrystalline nickel layer on its surface.

[0007] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the plate is subjected to resin curing, including: The board material undergoes its first curing process; The board is then cured a second time.

[0008] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the plate is prepared and pre-treated, including: Prepare the boards; The board material is drilled, deburred, degreased, and micro-etched. Pre-treat the hole walls of the plate; Chemical copper plating and full-board copper plating are performed on the board.

[0009] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the plate is post-processed to obtain the thick gold plate, which includes: The thick gold plate is obtained by surface polishing and heat treatment of the sheet material.

[0010] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the plate is provided with a pad, the side of the pad that contacts the plate is provided with a sealing layer, the pad is provided with an air guide hole, the air guide hole corresponds to the plugged hole, and the vacuum chamber is formed between the pad, the sealing strip and the fixing seat.

[0011] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the air guide hole includes a depth control hole and an air guide needle hole. The depth control hole and the air guide needle hole are coaxially arranged. The diameter of the depth control hole is the same as the diameter of the plugged hole, and the diameter of the air guide needle hole is smaller than the diameter of the depth control hole.

[0012] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the grease injection mechanism further includes a motion component. The motion component includes a first horizontal movement unit, a second horizontal movement unit, and a vertical movement unit. The first horizontal movement unit is disposed on the left and right sides of the fixed base. The two ends of the second horizontal movement unit are respectively connected to the first horizontal movement unit. The vertical movement unit is disposed on the second horizontal movement unit. The grease injection component is disposed on the vertical movement unit.

[0013] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the grease injection assembly further includes a liquid storage tank and a liquid delivery pipe. The liquid storage tank is disposed on the top of the machine base. One end of the liquid delivery pipe is connected to the liquid storage tank, and the other end of the liquid delivery pipe extends into the mounting chamber to be connected to the discharge pipe. The discharge pipe is provided with a discharge valve.

[0014] According to the manufacturing method of the thick gold plate described in the embodiments of this application, the discharge pipe is provided with a connector, the connector is configured as an elastic hemispherical connector, the top of the nozzle is provided with a hemispherical groove, and the connector is connected to the hemispherical groove.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 A flowchart illustrating a method for manufacturing a thick gold plate according to some embodiments of this application; Figure 2 This is a schematic diagram of the structure of the vacuum plugging machine in the manufacturing method of thick gold plates according to some embodiments of this application; Figure 3 This is a schematic diagram of the grease injection assembly in the manufacturing method of a thick gold plate according to some embodiments of this application; Figure 4This is a schematic diagram of the grease injection assembly in operation during the manufacturing method of a thick gold plate according to some embodiments of this application; Figure 5 This is a schematic diagram of the mounting structure of the fixing seat in the manufacturing method of the thick gold plate according to some embodiments of this application.

[0017] Figure label: Base 100; Fixed base 110; Plate 120; Plug hole 121; Sealing strip 130; Vacuum chamber 140; Pad 150; Air guide hole 160; Depth control hole 161; Air guide pin hole 162; Vacuum mechanism 200; Vacuum tube 210; Vacuum pump 220; Pressure relief valve 230; Grease injection assembly 300; Mounting base 310; Perforation 311; Lifting unit 320; Discharge pipe 321; Connector 322; Nozzle 330; Elastic connector 331; Rotary disc 340; Spring 350; Liquid storage tank 360; Infusion pipe 370; First transverse movement unit 410; Second transverse movement unit 420; Vertical movement unit 430. Detailed Implementation

[0018] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0019] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] In the description of this application, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0021] In the description of this application, unless otherwise expressly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly. Those skilled in the art can reasonably determine the specific meaning of these terms in this application based on the specific content of the technical solution. In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples. In the description of this specification, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0022] Reference Figure 1 This application provides a method for manufacturing a thick gold plate, including but not limited to steps S101, S102, S103, S104, S105, S106 and S107.

[0023] Step S110: Prepare the board material and perform pretreatment on the board material.

[0024] Step S110 includes: Prepare the boards; The board material is drilled, deburred, degreased, and micro-etched. Pre-treat the hole walls of the plate; Chemical copper plating and full-board copper plating are performed on the board.

[0025] In this embodiment, a sheet material is prepared, and then drilled with a drilling machine to create through holes, enabling double-sided or multi-layer interconnection during subsequent electroplating. Deburring the sheet material removes burrs or flash generated during drilling or cutting, ensuring smooth hole walls and preventing impurities from remaining in subsequent processes. Degreasing the sheet material removes grease, fingerprints, dust, and other contaminants from its surface, improving the adhesion of subsequent plating layers. Micro-etching the sheet material increases its surface roughness, further enhancing the adhesion of subsequent plating layers; it also removes oxides and other contaminants, ensuring a clean surface.

[0026] In this embodiment, the plate undergoes pretreatment of the hole walls, including chemical cleaning and plasma activation treatment. Specifically, chemical cleaning further removes any potentially residual contaminants, ensuring a completely clean surface and providing optimal conditions for subsequent processing. Plasma activation treatment increases surface energy and improves the adhesion of subsequent electroplating.

[0027] In this embodiment, chemical copper plating is performed on the substrate to deposit a thin copper layer on the non-conductive material, while simultaneously making the walls of the vias conductive, thereby achieving double-sided or multi-layer interconnection. Full-board copper plating further thickens the copper layer, ensuring sufficient thickness of the via walls to support subsequent nickel and gold plating operations, and enhancing the overall mechanical strength and conductivity of the substrate.

[0028] Step S102: Plate the sheet metal with nickel to form a nickel layer on the surface of the sheet metal.

[0029] Specifically, by plating the sheet metal with nickel, a nickel layer is formed on the surface of the sheet. This nickel layer acts as a barrier between the copper and the gold layer to be deposited, preventing copper from diffusing into the gold and enhancing weldability. In this embodiment, ultrasonic-assisted electroplating technology is introduced. Ultrasonic waves with a frequency of 20-40 kHz are applied during the electroplating process. The cavitation effect of the ultrasonic waves refines the nickel grains, further improving the density and uniformity of the nickel layer and enhancing its corrosion resistance.

[0030] In some embodiments of this application, step S102 includes: plating the plate with nickel to form a nanocrystalline nickel layer on the surface of the plate.

[0031] Specifically, by adding nano-alumina particles to the electroplating solution and using a pulsed reverse electroplating process, a nano-grain nickel layer with a grain size ≤500 nm is formed on the surface of the plate. This strengthens the bond between the nickel layer and the subsequent gold plating layer, improves the overall structural stability, and enhances the corrosion resistance of the nickel layer.

[0032] Step S103: Perform surface finishing on the plate to form a self-assembled monolayer film on the surface of the nickel layer.

[0033] Specifically, by modifying the surface of the plate, a self-assembled monolayer film is formed on the surface of the nickel layer, which can improve the corrosion resistance of the nickel layer, enhance the interface stability between the gold plating layer and the nickel layer, improve the interface adhesion in the subsequent gold plating process, and reduce the risk of corrosion caused by interface defects.

[0034] In some embodiments of this application, after completion Figure 1After step S102 and before step S103, the process also includes: performing nanostructuring treatment on the board material.

[0035] In this embodiment, the plate is subjected to nanostructural treatment to give it a high surface area of ​​nanoscale texture, thereby enhancing the interfacial bonding between the nickel layer and the subsequent gold plating layer and improving the overall corrosion resistance.

[0036] Furthermore, since it is performed before step S103, the self-assembled monolayer membrane molecules can be more fully adsorbed and arranged into a dense and ordered protective layer on the nanostructure surface with a high specific surface area, thereby further enhancing corrosion resistance and interface stability.

[0037] By performing nanostructuring on the substrate, the nanostructured nickel layer can maintain its structural integrity after the primary vacuum resin plugging is completed, and will not be covered or damaged by resin penetration, thus ensuring good adhesion between the subsequent gold plating layer and the underlying metal.

[0038] It should be understood that nanostructuring is not a necessary feature of this invention; it can be selectively introduced according to actual product requirements as one of the technical means to further optimize performance. Furthermore, different types of nanostructures and their combinations can be flexibly adjusted according to application scenarios, all of which fall within the scope of protection of this application.

[0039] Step S104: The board is sequentially subjected to primary vacuum resin plugging and secondary vacuum resin plugging using a vacuum plugging machine. The pressure of the secondary vacuum resin plugging is less than that of the primary vacuum resin plugging.

[0040] The pressure for primary vacuum resin plugging is 0.5-1 kPa, and the pressure for secondary vacuum resin plugging is 0.1-0.3 kPa. Specifically, the board is placed under primary vacuum conditions, and resin is injected into the pores to achieve initial resin filling in the primary vacuum environment, ensuring that there are no air bubbles and that the resin is fully filled. After completing the primary vacuum resin plugging, the system is then switched to a secondary vacuum environment to achieve deep resin filling in the secondary vacuum environment. This further eliminates residual air bubbles, allowing more resin to penetrate into the deepest part of the pores, ensuring that there are no air bubbles and that the pores are completely filled. This improves the uniformity and integrity of the resin filling and reduces potential defects caused by air bubbles.

[0041] By sequentially performing primary and secondary vacuum resin plugging on the plate, with the pressure of the secondary vacuum resin plugging being lower than that of the primary vacuum resin plugging, air bubbles in the resin can be fully expelled, enhancing the resin's permeability to better fill the pores and interfacial gaps in the nickel layer. This increases the contact area between the resin and the nickel layer, improves the interfacial bonding force between the resin and the nickel layer, forms a more effective physical isolation barrier, and further enhances the corrosion resistance of the nickel layer.

[0042] Reference Figures 2 to 5 The vacuum plugging machine includes: a base 100 with a fixed seat 110 on which a plate 120 is placed; a sealing strip 130 is provided between the plate 120 and the fixed seat 110 to form a vacuum chamber 140; the plate 120 has plugged holes 121 that communicate with the vacuum chamber 140; a vacuum mechanism 200 including a vacuum tube 210 and a vacuum pump 220; the vacuum tube 210 communicates with the vacuum chamber 140, the vacuum pump 220 is connected to the vacuum tube 210, and the vacuum tube 210 is equipped with a pressure relief valve 230; and a grease injection mechanism including a grease injection assembly 300, which is positioned above the fixed seat 110. The device includes a mounting base 310, a lifting unit 320, and multiple nozzles 330 of different diameters. The mounting base 310 is rotatably mounted on a rotating disk 340. The nozzles 330 are circumferentially mounted on the rotating disk 340. A spring 350 is provided between the nozzles 330 and the rotating disk 340. The mounting base 310 is located below the rotating disk and has a through hole 311. The lifting unit 320 is located above the nozzles 330. The lifting unit 320 is provided with a discharge pipe 321. When the lifting unit 320 descends, the discharge pipe 321 connects with the nozzles 330 and presses the nozzles 330 out of the through hole 311. The nozzles 330 are provided with an elastic connector 331, which can be sealed to the plate 120.

[0043] During operation, the plate 120 is placed on the fixed base 110. Based on the diameter of the plugged hole 121, the rotating disk 340 drives the nozzle 330 to rotate, positioning the nozzle 330, which matches the diameter of the plugged hole 121, above the through hole 311. Then, the lifting unit 320 descends, connecting the discharge pipe 321 to the nozzle 330. Simultaneously, the lifting unit 320 presses the nozzle 330 out of the through hole 311, allowing the nozzle 330 to extend into the plugged hole 121. Because the nozzle 330 is equipped with an elastic connector 331, a sealed connection is achieved between the nozzle 330 and the plate 120 via the elastic connector 331. At this time, the spring 350 is compressed. Next, the vacuum pump 220 starts and evacuates the vacuum chamber 140 through the vacuum pipe 210, bringing the pressure inside the vacuum chamber 140 to 0.5-1 liters per second. At this point, since the plugged hole 121 is connected to the vacuum chamber 140 and the top of the plugged hole 121 is connected to the nozzle 330, the plugged hole 121 is also in a vacuum environment. Subsequently, the discharge pipe 321 outputs liquid resin, which is injected into the plugged hole 121 through the nozzle 330 to perform the first-stage vacuum resin plugging. After the first-stage vacuum resin plugging is completed, the discharge pipe 321 stops discharging, and the pressure relief valve 230 opens, so that the pressure in the vacuum chamber 140 is 0.1-0.3 kPa. At this time, the discharge pipe 321 discharges again to perform the second-stage vacuum resin plugging. After the second-stage vacuum resin plugging is completed, the pressure relief valve 230 is fully opened, so that the vacuum chamber 140 returns to atmospheric pressure. At the same time, the lifting unit 320 rises, and the nozzle 330 returns to its original position under the action of the spring 350.

[0044] In this embodiment, the grease injection mechanism further includes a motion component, which comprises a first transverse unit 410, a second transverse unit 420, and a vertical unit 430. The first transverse unit 410 is disposed on the left and right sides of the fixed base 110. The two ends of the second transverse unit 420 are respectively connected to the first transverse unit 410. The vertical unit 430 is disposed on the second transverse unit 420, and the grease injection component 300 is disposed on the vertical unit 430. By adopting the above structure, the grease injection component 300 can automatically fill each plugged hole 121 with resin under the action of the motion component, thereby improving the degree of automation.

[0045] Reference Figures 2 to 5Furthermore, the grease injection assembly 300 also includes a reservoir 360 and a delivery pipe 370. The reservoir 360 is located on the top of the base 100. One end of the delivery pipe 370 is connected to the reservoir 360, and the other end extends into the mounting chamber to connect with the discharge pipe 321. The discharge pipe 321 is equipped with a discharge valve. The discharge pipe 321 is equipped with a connector 322, which is a flexible hemispherical connector. The top of the nozzle 330 is provided with a hemispherical groove, and the connector 322 mates with the hemispherical groove. By adopting the above structure, an adaptive sealing connection between the discharge pipe 321 and the nozzle 330 can be achieved, improving stability and durability. Optionally, the nozzle 330's spray port is tilted. When the liquid resin flows out of the nozzle 330's spray port, it flows down the side of the plugged hole 121, thereby allowing the liquid resin to better adhere to the inner wall and improving the quality of resin plugging of the hole.

[0046] Reference Figure 4 and Figure 5 It is conceivable that the plate 120 is provided with a pad 150, and the side of the pad 150 in contact with the plate 120 is provided with a sealing layer. The pad 150 is provided with a vent hole 160, which corresponds to the plugged hole 121. A vacuum chamber 140 is formed between the pad 150, the sealing strip 130, and the fixing seat 110. The vent hole 160 includes a depth control hole 161 and a vent needle hole 162, which are coaxially arranged. The diameter of the depth control hole 161 is the same as the diameter of the plugged hole 121, while the diameter of the vent needle hole 162 is smaller than the diameter of the depth control hole 161. By adopting the above structure, an upward force can be provided to the resin during the resin plugging process, thereby reducing the occurrence of resin clogging of the vent hole 160 or resin flowing into the fixing seat 110 and causing resin contamination.

[0047] Step S105: Curing the board with resin.

[0048] Specifically, step S105 includes: The board material undergoes its first curing process; The board is then cured a second time.

[0049] The first curing temperature is 80-120℃, and the second curing temperature is 150-200℃. The board is first pre-cured at 100℃ for 1 hour to allow the resin to initially cross-link; then the temperature is raised to 180℃ for a high-temperature complete curing of 3 hours to ensure the resin is fully hardened and forms a stable insulating layer. This staged curing of the resin eliminates air bubbles that may be generated during resin filling, ensuring that the resin filling the pores of the board fully hardens and forms a stable and reliable insulating layer, protecting the internal metal layer from external environmental factors.

[0050] Alternatively, ultraviolet light can be used to assist in the curing process of the resin, thereby further improving the crosslinking density and thermal stability of the resin.

[0051] Step S106: Gold plating is applied to the board to form a gold plating layer.

[0052] Specifically, by plating the sheet with gold, a gold-plated layer is formed on the sheet. Since the surface decoration has been completed previously, the gold can be directly deposited on a surface with better adhesion and flatness, thereby improving the quality of the finished product.

[0053] Furthermore, after the gold plating is completed, the plate is washed with water to remove any residual plating solution from the surface, and then dried.

[0054] Step S107: Post-process the sheet material to obtain a thick gold sheet.

[0055] Specifically, step S107 includes: surface polishing and heat treatment of the plate to obtain the thick gold plate.

[0056] In this embodiment, the surface of the sheet metal is polished to remove minor irregularities on the gold layer surface, thereby improving flatness. Heat treatment of the sheet metal further enhances the bonding strength between the layers.

[0057] The manufacturing method of the thick gold plate described in this application improves the corrosion resistance of the nickel layer and enhances the interfacial stability between the subsequent gold plating layer and the nickel layer by surface modification of the plate. Simultaneously, by sequentially performing primary and secondary vacuum resin plugging on the plate, with the pressure of the secondary vacuum resin plugging being lower than that of the primary vacuum resin plugging, air bubbles in the resin can be fully expelled, enhancing the resin's penetration ability to better fill the pores and interfacial gaps in the nickel layer. This increases the contact area between the resin and the nickel layer, improves the interfacial bonding force between them, forms a more effective physical barrier, and further enhances the corrosion resistance of the nickel layer.

[0058] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A method of manufacturing a thick gold plate, characterized by, The method comprises the following steps: preparing a plate and pretreating the plate; plating nickel on the plate to form a nickel layer on the surface of the plate; surface modification of the plate to form a self-assembled monolayer film on the surface of the nickel layer; vacuum hole plugging of the plate in sequence by a vacuum hole plugging machine, including first-stage vacuum resin hole plugging and second-stage vacuum resin hole plugging, the pressure of the second-stage vacuum resin hole plugging being less than that of the first-stage vacuum resin hole plugging; resin curing of the plate; gold plating of the plate to form a gold plating layer on the plate; post-treatment of the plate to obtain a thick gold plate; The vacuum hole plugging machine comprises: a machine base provided with a fixing seat, the fixing seat being placed with the plate, a sealing strip being arranged between the plate and the fixing seat to form a vacuum chamber, the plate being provided with a hole to be plugged, the hole to be plugged being in communication with the vacuum chamber; a vacuum mechanism comprising a vacuum pipe and a vacuum pump, the vacuum pipe being in communication with the vacuum chamber, the vacuum pump being connected with the vacuum pipe, the vacuum pipe being provided with a pressure relief valve; a grease injection mechanism comprising a grease injection assembly, the grease injection assembly being arranged above the fixing seat, the grease injection assembly comprising a mounting seat, a lifting unit and a plurality of nozzles with different diameters, the mounting seat being rotationally provided with a rotating disc, the nozzles being circumferentially arranged on the rotating disc, springs being arranged between the nozzles and the rotating disc, the mounting seat being provided with a through hole below the rotating disc, the lifting unit being above the nozzles, the lifting unit being provided with a discharge pipe, the lifting unit being lowered to connect the discharge pipe with the nozzles and press the nozzles to extend out of the through hole, the nozzles being provided with elastic connectors, the elastic connectors being capable of sealingly connecting with the plate.

2. The method of producing a thick gold plate according to claim 1, characterized by The method for plating nickel on the plate to form a nickel layer on the surface of the plate comprises: plating nickel on the plate to form a nanocrystalline nickel layer on the surface of the plate.

3. The method of producing a thick gold plate according to claim 1, wherein The method for resin curing of the plate comprises: first curing of the plate; second curing of the plate.

4. The method of producing a thick gold plate according to claim 1, wherein The method for preparing the plate and pretreating the plate comprises: preparing the plate; drilling, deburring, degreasing and micro-etching of the plate; hole wall pretreatment of the plate; chemical copper plating and full-plate copper plating of the plate.

5. The method of producing a thick gold plate according to claim 1, wherein The method for post-treatment of the plate to obtain a thick gold plate comprises: surface polishing and heat treatment of the plate to obtain a thick gold plate.

6. The method of producing a thick gold plate according to claim 1, wherein The plate is provided with a backing plate, one side of the backing plate in contact with the plate being provided with a sealing layer, the backing plate being provided with air guide holes corresponding to the holes to be plugged, the vacuum chamber being formed between the backing plate, the sealing strip and the fixing seat.

7. The method of producing a thick gold plate according to claim 6, wherein The air guide holes comprise depth control holes and air guide needle holes, the depth control holes and the air guide needle holes being coaxially arranged, the depth control holes having the same diameter as the holes to be plugged, the air guide needle holes having a smaller diameter than the depth control holes.

8. The method of producing a thick gold plate according to claim 1, wherein The grease injection mechanism further comprises a movement assembly, the movement assembly comprising a first horizontal movement unit, a second horizontal movement unit and a vertical movement unit, the first horizontal movement unit being arranged on the left and right sides of the fixing seat, the second horizontal movement unit being connected with the first horizontal movement unit at both ends, the vertical movement unit being arranged on the second horizontal movement unit, the grease injection assembly being arranged on the vertical movement unit.

9. The method of producing a thick gold plate according to claim 8, wherein The grease injection assembly further comprises a liquid storage tank and a liquid delivery pipe, the liquid storage tank is arranged on the top of the base, one end of the liquid delivery pipe is connected with the liquid storage tank, the other end of the liquid delivery pipe extends into the installation chamber to be connected with the discharge pipe, and the discharge pipe is provided with a discharge valve.

10. The method of producing a thick gold plate according to claim 9, wherein The discharge pipe is provided with a docking head, the docking head is arranged in an elastic semispherical shape, the top of the spray head is provided with a semispherical groove, and the docking head is connected with the semispherical groove in a matched mode.

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