Printed circuit board with embedded power component and manufacturing method thereof

Abstract

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board embedded with a power component and a manufacturing method thereof, the manufacturing method of the printed circuit board embedded with the power component comprises the steps that a daughter board and a mother board are provided, the daughter board comprises an embedded layer and a first circuit layer, the embedded layer is internally provided with the power component, and the first circuit layer is arranged on the mother board; the power assembly comprises a heat dissipation base and an electronic element, the embedded layer is further provided with a first connecting hole, the first connecting hole is filled with a first conductive part, the mother board comprises a second circuit layer and a connecting layer, and the mother board is provided with a mounting groove; placing the daughter board into the mounting groove; connecting the daughter board with the mother board to obtain a substrate; a conducting layer is arranged on the substrate, the conducting layer covers the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically conducted through the conducting layer. The printed circuit board with the embedded power assembly and the manufacturing method thereof are used for solving the problem that the printed circuit board with the embedded power assembly is prone to warping in the manufacturing process.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of printed circuit boards, and in particular to a printed circuit board with embedded power components and a manufacturing method thereof. BACKGROUND

[0002] Current electronic products are evolving towards the trend of being light, thin, short and small, and the functional integration degree is continuously improving, but the available space of the printed circuit board (PCB) is compressed, resulting in increasingly dense arrangement of electronic components on the printed circuit board. This contradiction directly promotes the development of new products such as printed circuit boards with embedded power components.

[0003] For vehicle-mounted electronic products, the requirements for printed circuit boards are more stringent: not only is high-density circuit layout required to carry complex functions, but it must also adapt to the special working environment of large current during vehicle operation, and the dielectric layer between the power circuit must also use high-Tg (Glass Transition Temperature, glass transition temperature, which indicates the temperature point at which the printed circuit board changes from semi-cured state to cured state at high temperature) material.

[0004] In related technologies, the printed circuit board with embedded power components is made by stacking multiple high-Tg core boards and multiple high-Tg PP (PrePreg, semi-cured sheet) after windowing, then embedding the power components in the windowed openings of the core board and the PP, and then laminating high-Tg PP and copper foil on the chip side of the power components, drilling and electroplating the holes to make the chip conductive with the outer copper foil. The manufacturing process is prone to board warping problems, affecting the subsequent installation of other components, and is prone to damage to the heat dissipation base and chip of the power components. SUMMARY

[0005] The present application provides a printed circuit board with embedded power components and a manufacturing method thereof to improve the problem of board warping during the manufacturing process of the printed circuit board with embedded power components.

[0006] In a first aspect, the embodiments of the present application provide a manufacturing method of a printed circuit board with embedded power components, comprising:

[0007] The application provides a subboard and a motherboard, the subboard comprises a buried embedding layer and a first circuit layer which are arranged in a stack, the interior of the buried embedding layer is provided with a power component, the power component comprises a heat dissipation base and an electronic element arranged on the heat dissipation base, the buried embedding layer is further provided with a first connecting hole, the first connecting hole is filled with a first conductive part, the first circuit layer and the electronic element are connected with opposite ends of the first conductive part respectively, the motherboard comprises a second circuit layer and a connecting layer which are arranged in a stack, the motherboard is provided with a mounting groove which penetrates through the second circuit layer and the connecting layer.

[0008] The subboard is placed into the mounting groove.

[0009] The subboard and the motherboard are connected together to obtain a substrate.

[0010] A conductive layer is arranged on the substrate, the conductive layer covers the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically connected through the conductive layer.

[0011] In some embodiments, the subboard comprises a first medium layer, the motherboard comprises a second medium layer, and the Tg value of the first medium layer is greater than the Tg value of the second medium layer.

[0012] In some embodiments, the subboard is manufactured in the following manner:

[0013] A first core plate, a first adhesive layer and a first metal layer are provided, and a plurality of first windows are arranged on the first core plate.

[0014] A power component is arranged in one of the first windows, and the first core plate, the first adhesive layer and the first metal layer are sequentially and layerwisely arranged.

[0015] The first core plate, the first adhesive layer and the first metal layer are subjected to a pressing treatment to obtain a subboard.

[0016] A plurality of functional holes which penetrate through the first adhesive layer and the first metal layer are formed, one power component corresponds to at least one functional hole, and the electronic element defines a hole bottom surface of the functional hole.

[0017] A functional part is filled in the functional hole, and the electronic element and the first metal layer are connected with and electrically connected with the functional part.

[0018] The panel is divided into a plurality of sub-panels, the first core plate and the first adhesive layer corresponding to the sub-panels are the embedded layers, the first metal layer corresponding to the sub-panels is the first circuit layer, the functional holes formed in the first adhesive layer corresponding to the sub-panels are the first connecting holes, and the functional parts in the first adhesive layer corresponding to the sub-panels are the first conductive parts.

[0019] In some embodiments, the first core plate comprises a first process edge and a plurality of first forming parts, the part of the first core plate corresponding to each of the sub-panels is the first forming part, the first core plate is provided with a plurality of first cutting lines, the first cutting lines extend along the length or width direction of the first core plate, and the plurality of first cutting lines divide the first core plate into a plurality of first sub-units, each of the first sub-units comprises at least one of the first forming parts, and the first sub-units are connected to the first process edge; and / or, the first adhesive layer comprises a second process edge and a plurality of second forming parts, the part of the first adhesive layer corresponding to each of the sub-panels is the second forming part, the first adhesive layer is provided with a plurality of second cutting lines, the second cutting lines extend along the length or width direction of the first adhesive layer, and the plurality of second cutting lines divide the first adhesive layer into a plurality of second sub-units, each of the second sub-units comprises at least one of the second forming parts, and the second sub-units are connected to the second process edge.

[0020] In some embodiments, the thickness of the first circuit layer is equal to the thickness of the second circuit layer, and when the sub-panels and the mother panel are connected together to obtain a substrate, the first circuit layer and the second circuit layer are arranged flush.

[0021] In some embodiments, the thickness of the first circuit layer is 10 μm-20 μm.

[0022] In some embodiments, two first circuit layers are arranged, and the two first circuit layers are arranged on opposite sides of the embedded layer, respectively, and the electronic element is arranged on the side of the heat dissipation base facing one of the first circuit layers; two second circuit layers are arranged, and the second circuit layers and the first circuit layers are arranged one by one.

[0023] In some embodiments, two conductive layers are arranged, and the conductive layers and the first circuit layers are arranged one by one.

[0024] In a second aspect, the embodiments of the present application provide a printed circuit board with embedded power components, comprising a substrate, the substrate comprising a daughter board and a mother board, the daughter board comprising an embedded layer and a first circuit layer stacked, the embedded layer having a power component arranged inside, the power component comprising a heat dissipation base and an electronic element arranged on the heat dissipation base, the embedded layer further comprising a first connecting hole, the first connecting hole being filled with a first conductive part, the first circuit layer and the electronic element being connected to opposite ends of the first conductive part respectively, the mother board comprising a second circuit layer and a connecting layer stacked, the mother board being provided with a mounting groove, the mounting groove penetrating through the second circuit layer and the connecting layer, the daughter board being arranged in the mounting groove, the substrate being provided with a conductive layer, the conductive layer covering the first circuit layer and the second circuit layer, the first circuit layer and the second circuit layer being electrically connected through the conductive layer.

[0025] In a third aspect, the embodiments of the present application provide a printed circuit board with embedded power components, which is processed by the method for manufacturing the printed circuit board with embedded power components according to the first aspect.

[0026] The method for manufacturing the printed circuit board with embedded power components has the beneficial effect that the daughter board comprises an embedded layer and a first circuit layer stacked, the embedded layer having a power component arranged inside, the power component comprising a heat dissipation base and an electronic element arranged on the heat dissipation base, the embedded layer further comprising a first connecting hole, the first connecting hole being filled with a first conductive part, the first circuit layer and the electronic element being connected to opposite ends of the first conductive part respectively, the mother board comprising a second circuit layer and a connecting layer stacked, the mother board being provided with a mounting groove, the mounting groove penetrating through the second circuit layer and the connecting layer, the daughter board being arranged in the mounting groove first, then the daughter board and the mother board are connected together to obtain a substrate, and then a conductive layer is arranged on the substrate, the conductive layer covering the first circuit layer and the second circuit layer, the first circuit layer and the second circuit layer being electrically connected through the conductive layer, so that the volume of the daughter board can be small, and the daughter board is not easy to deform and bend, and the daughter board is stable after being processed, so that the substrate obtained after the daughter board and the mother board are connected together is not easy to deform and bend, thereby improving the problem that the substrate is easy to warp after the conductive layer is arranged on the substrate.

[0027] The printed circuit board with embedded power components provided by the present application has the beneficial effect compared with the prior art, which can be explained by referring to the beneficial effect of the method for manufacturing the printed circuit board with embedded power components provided by the present application, which will not be repeated here. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor based on these drawings.

[0029] Figure 1 is a flow chart of a manufacturing method of a printed circuit board embedding a power component in one of the embodiments of the present application;

[0030] Figure 2 is a structural schematic diagram of a daughter board and a mother board in one of the embodiments of the present application;

[0031] Figure 3 is a structural schematic diagram of a substrate composed of the daughter board and the mother board shown in Figure 2 ;

[0032] Figure 4 is a schematic diagram of manufacturing an outer layer circuit on the substrate and the conductive layer shown in Figure 3 ;

[0033] Figure 5 is a structural schematic diagram of a spliced board in one of the embodiments of the present application;

[0034] Figure 6 is a structural schematic diagram of a first core board corresponding to the spliced board shown in Figure 5 ;

[0035] Figure 7 is a structural schematic diagram of a daughter board and a mother board in another embodiment of the present application;

[0036] Figure 8 is a structural schematic diagram of a daughter board in still another embodiment of the present application.

[0037] The meanings of the marks in the drawings are as follows:

[0038] 100, spliced board;

[0039] 110, first core board;

[0040] 1101, first subunit; 1102, first process edge; 1103, first cutting line;

[0041] 10, daughter board;

[0042] 101, embedding layer; 102, first circuit layer; 1011, first forming part; 1012, second forming part; 1013, third forming part; 1014, fourth forming part; 11, heat dissipation base; 12, electronic component; 13, first conductive part; 14, second conductive part;

[0043] 20, female board;

[0044] 201, second circuit layer; 202, connecting layer; 21, mounting groove;

[0045] 30, conductive layer. DETAILED DESCRIPTION

[0046] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not used to limit the present application.

[0047] It should be noted that when an element is referred to as being "fixed to" or "set to" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0048] In addition, the terms "first", "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0049] In the present application, the reference "one embodiment", "some embodiments" or "embodiments" described in the specification means that the specific features, structures or characteristics described in connection with the embodiment are included in one or more embodiments of the present application. Therefore, the statements "in one embodiment", "in some embodiments", "in other some embodiments", "in other some embodiments" and the like appearing in different places in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. In addition, in one or more embodiments, specific features, structures or characteristics can be combined in any suitable manner.

[0050] Current electronic products are evolving towards the trend of light, thin, short and small, and the functional integration is continuously improving, but the available space of the printed circuit board (PCB) is compressed, resulting in more and more dense arrangement of electronic components on the printed circuit board. This contradiction directly promotes the development of new products such as embedded power components printed circuit board.

[0051] For vehicle-mounted electronic products, the requirements for printed circuit boards are more stringent: not only do they need to achieve high-density circuit layout to carry complex functions, but they must also adapt to the special working environment of large currents during vehicle operation, and the dielectric layer between the power circuit lines also needs to use high-Tg materials.

[0052] In related technologies, the printed circuit board embedded with the power component is laminated after the windowing of multiple high-Tg core boards and multiple high-Tg PPs, then the power component is embedded in the windowed opening of the core board and the PP, and then high-Tg PP and copper foil are laminated on the chip side of the power component, drilled and electroplated to fill the holes, so that the chip is conductive with the outer copper foil. Since the core function of the power chip is to efficiently handle large currents / high voltages, the printed circuit board embedded with the power component needs to be produced with high-Tg materials throughout the board, and thick copper needs to be used on the chip side to meet the current-carrying requirements of the power chip. Both thick copper and high-Tg materials have the problem of high material cost. In addition, when the printed circuit board is semi-embedded, only the chip side is laminated and pressed, which is prone to board warping during the manufacturing process, affecting the installation of other components. For example, the bottom of the printed circuit board needs to install a heat sink, and the warping of the printed circuit board will cause the heat sink to not fit well with the printed circuit board, resulting in poor heat dissipation. In addition, the heat dissipation base of the power component and the chip are fragile and prone to breakage.

[0053] In view of this, the present application provides a printed circuit board embedded with a power component and a manufacturing method thereof. The sub-board includes a buried embedding layer and a first circuit layer stacked, the internal of the buried embedding layer is provided with a power component, the power component includes a heat dissipation base and an electronic element arranged on the heat dissipation base, the buried embedding layer is further provided with a first connecting hole, the first connecting hole is filled with a first conductive part, the first circuit layer and the electronic element are connected with opposite ends of the first conductive part respectively, the mother board includes a second circuit layer and a connecting layer stacked, the mother board is provided with a mounting slot, the mounting slot penetrates through the second circuit layer and the connecting layer, the sub-board is first placed in the mounting slot, then the sub-board and the mother board are connected together to obtain a base plate, and then a conductive layer is arranged on the base plate, the conductive layer covers the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically conductive through the conductive layer. Therefore, the volume of the sub-board can be small, so it is not easy to deform and bend, and the sub-board has been processed when it is connected with the mother board, so the structure of the sub-board is stable enough. Therefore, the base plate obtained by connecting the sub-board with the mother board is not easy to bend and deform, thereby improving the problem that the board is prone to warping after the conductive layer is arranged on the base plate.

[0054] In order to illustrate the technical solutions of the present application, the following will be described in conjunction with specific drawings and examples.

[0055] Please refer to Figures 1 to 4 , in a first aspect, the embodiments of the present application provide a manufacturing method of a printed circuit board embedded with a power component, comprising:

[0056] S100: provide a daughter board 10 and a mother board 20, the daughter board 10 comprises a buried embedding layer 101 and a first circuit layer 102 which are stacked, the inside of the buried embedding layer 101 is provided with a power component, the power component comprises a heat dissipation base 11 and an electronic element 12 arranged on the heat dissipation base 11, the buried embedding layer 101 is further provided with a first connecting hole, the first connecting hole is filled with a first conductive part 13, the first circuit layer 102 and the electronic element 12 are connected with opposite ends of the first conductive part 13 respectively, the mother board 20 comprises a second circuit layer 201 and a connecting layer 202 which are stacked, the mother board 20 is provided with a mounting groove 21, the mounting groove 21 penetrates through the second circuit layer 201 and the connecting layer 202.

[0057] The buried embedding layer 101 can comprise a first forming part 1011, a second forming part 1012, a third forming part 1013 and a fourth forming part 1014, the first forming part 1011 and the fourth forming part 1014 can be obtained by laminating and cutting a core plate, the second forming part 1012 and the third forming part 1013 can be obtained by laminating and cutting a prepreg, and the second forming part 1012 and the third forming part 1013 are first dielectric layers. The material of the first circuit layer 102 can be copper, silver or aluminum, etc. The material of the first conductive part 13 can be copper, silver or aluminum, etc. The material of the first circuit layer 102 can be the same as that of the first conductive part 13. The first connecting hole and the first conductive part 13 can be provided with a plurality of and correspond to each other. The buried embedding layer 101 can be further provided with a second connecting hole, the second connecting hole is filled with a second conductive part 14, and the second circuit layer 201 and the heat dissipation base 11 are connected with opposite ends of the second conductive part 14 respectively.

[0058] The material of the heat dissipation base 11 can be metal (such as copper, aluminum and the like), metal composite ceramic material (such as ceramic upper and lower layers covered with metal copper or aluminum or ceramic only on one side of the chip with metal copper or aluminum layer) or pure ceramic, etc. The electronic element 12 can be a chip, etc.

[0059] The material of the second circuit layer 201 can be copper, silver or aluminum, etc. The connecting layer 202 can be a prepreg, etc.

[0060] S200: place the daughter board 10 into the mounting groove 21.

[0061] The high-temperature resistant glue can be pasted on the lower side of the mounting groove 21 to prevent the daughter board 10 from falling off and to prevent the problem of overflow during lamination, then the daughter board 10 is placed into the mounting groove 21, and the high-temperature resistant glue is pasted on the upper side of the mounting groove 21 to prevent the daughter board 10 from falling off and to prevent the problem of overflow during lamination.

[0062] S300: connect the daughter board 10 and the mother board 20 together to obtain a substrate.

[0063] Resin can be filled between the inner wall of the mounting groove 21 and the sub-plate 10 to connect the sub-plate 10 and the mother plate 20 together.

[0064] Alternatively, the sub-plate 10 and the mother plate 20 can be directly pressed together. After the connecting layer 202 melts, it fills the gap between the inner wall of the mounting groove 21 and the sub-plate 10. After curing, the sub-plate 10 and the mother plate 20 are connected together.

[0065] Understandably, due to the small size of the sub-plate 10, it is not easy to deform or bend. Since the sub-plate 10 has already been processed, for example, the second molding part 1012 and the third molding part 1013 formed by the semi-cured sheet inside the sub-plate 10 have been melted and solidified, the sub-plate 10 itself has a stable structure. Therefore, the substrate obtained after connecting the sub-plate 10 with the mother plate 20 is not easy to bend or deform.

[0066] S400: A conductive layer 30 is disposed on the substrate, the conductive layer 30 covers the first circuit layer 102 and the second circuit layer 201, and the first circuit layer 102 and the second circuit layer 201 are electrically connected through the conductive layer 30.

[0067] The conductive layer 30 can be formed on the substrate by copper electroplating. The material of the conductive layer 30 can be copper, silver, or aluminum. After the conductive layer 30 is formed on the substrate, the outer layer circuitry can be formed on the conductive layer 30, the first circuit layer 102, and the second circuit layer 201 by exposure, development, and etching. The outer layer circuitry is connected to the electronic component 12 and is electrically conductive. The subsequent processes can be completed according to conventional production methods.

[0068] As can be seen from the above, the method for manufacturing a printed circuit board with an embedded power component provided in this application embodiment includes a daughter board 10 comprising a stacked embedded layer 101 and a first circuit layer 102. The embedded layer 101 contains a power component, which includes a heat sink 11 and an electronic component 12 mounted on the heat sink 11. The embedded layer 101 also has a first connection hole filled with a first conductive portion 13. The first circuit layer 102 and the electronic component 12 are respectively connected to opposite ends of the first conductive portion 13. The mother board 20 comprises a stacked second circuit layer 201 and a connection layer 202. The mother board 20 has a mounting groove 21 that penetrates the second circuit layer 201 and the connection layer 202. First, the sub-board 10 is placed into the mounting slot 21, and then the sub-board 10 is connected to the mother board 20 to obtain a substrate. Then, a conductive layer 30 is set on the substrate. The conductive layer 30 covers the first circuit layer 102 and the second circuit layer 201. The first circuit layer 102 and the second circuit layer 201 are electrically connected through the conductive layer 30. Therefore, the sub-board 10 can be made smaller in size, so it is not easy to deform or bend. Moreover, the sub-board 10 has already been processed when it is connected to the mother board 20. The structure of the sub-board 10 itself is stable enough. Therefore, the substrate obtained after connecting the sub-board 10 to the mother board 20 is not easy to bend or deform, thereby improving the problem of board warping that is easy to occur after setting the conductive layer 30 on the substrate.

[0069] Please refer to Figures 2 to 4 In some embodiments, the daughter board 10 includes a first dielectric layer and the mother board 20 includes a second dielectric layer, wherein the Tg value of the first dielectric layer is greater than the Tg value of the second dielectric layer.

[0070] By adopting the above scheme, a second dielectric layer material with a lower Tg value can be used when manufacturing the motherboard 20, while a first dielectric layer material with a higher Tg value is used only when manufacturing the daughterboard 10, thereby reducing production costs.

[0071] It should be noted that both the first and second dielectric layers can be obtained by pressing and curing prepregs.

[0072] For example, the Tg value of the first dielectric layer of the daughter board 10 is above 170, and the Tg value of the second dielectric layer of the mother board 20 is below 170. In this embodiment, the Tg value of the first dielectric layer of the daughter board 10 is 230. In other embodiments, its Tg value can be adjusted according to the power of the chip.

[0073] Understandably, the first dielectric layer may be located between the embedded layer 101 and the first circuit layer 102 and / or inside the embedded layer 101.

[0074] Please refer to Figures 2 to 6 In some embodiments, the daughterboard 10 is fabricated in the following manner:

[0075] First, a first core board 110, a first adhesive layer, and a first metal layer are provided, and the first core board 110 is provided with a plurality of first openings.

[0076] The first adhesive layer can be a prepreg, etc. The first metal layer can be made of copper, silver, or aluminum, etc.

[0077] Next, a power component is placed in a first window, and the first core board 110, the first adhesive layer and the first metal layer are placed sequentially and stacked.

[0078] A layer of high-temperature resistant adhesive can be applied to the side of the heat sink 11 away from the electronic component 12 to prevent the power component from falling out after it is embedded.

[0079] Next, the first core board 110, the first adhesive layer and the first metal layer are pressed together to obtain the panel 100.

[0080] Then, multiple functional holes are machined through the first adhesive layer and the first metal layer, with a power component corresponding to at least one functional hole, and electronic component 12 defining the bottom surface of the functional hole.

[0081] Functional holes can be created through machining or laser ablation.

[0082] Then, the functional part is filled into the functional hole, and the electronic component 12 and the first metal layer are connected to the functional part and electrically conductive.

[0083] Functional parts can be filled into the functional holes through electroplating. The material of the functional parts can be copper, silver, or aluminum, etc.

[0084] Next, the panel 100 is divided into multiple sub-panels 10. The first core board 110 and the first adhesive layer corresponding to the sub-panel 10 are embedded layers 101, the first metal layer corresponding to the sub-panel 10 is the first circuit layer 102, the functional holes formed in the first adhesive layer corresponding to the sub-panel 10 are the first connection holes, and the functional part located in the first adhesive layer corresponding to the sub-panel 10 is the first conductive part 13.

[0085] By adopting the above solution, multiple sub-boards 10 can be produced at once, improving production efficiency.

[0086] It is understood that the first core board 110 corresponding to the sub-board 10 is the first molding part 1011, the first adhesive layer corresponding to the sub-board 10 is the second molding part 1012, and the second molding part 1012 forms the first dielectric layer.

[0087] It should be noted that before laminating the first core board 110, the first adhesive layer, and the first metal layer, a second adhesive layer and a second core board can be stacked on the underside of the first core board 110. Both the second adhesive layer and the second core board are provided with openings for accommodating the heat dissipation base 11. After dividing the panel 100 into multiple sub-boards 10, the second adhesive layer corresponding to the sub-board 10 becomes the third molding part 1013, the third molding part 1013 forms the first dielectric layer, and the second core board corresponding to the sub-board 10 becomes the fourth molding part 1014.

[0088] Optionally, the first core board 110 includes a first process edge 1102 and a plurality of first forming portions 1011. The portion of the first core board 110 corresponding to each sub-board 10 is the first forming portion 1011. The first core board 110 is provided with a plurality of first cutting lines 1103. The first cutting lines 1103 extend along the length or width direction of the first core board 110, and the plurality of first cutting lines 1103 divide the first core board 110 into a plurality of first sub-units 1101. Each first sub-unit 1101 includes at least one first forming portion 1011, and the first sub-unit 1101 is connected to the first process edge 1102.

[0089] With this configuration, the first core board 110 can be divided into multiple first sub-units 1101 by multiple first cutting lines 1103, thereby avoiding the need to press the first core board 110, the first adhesive layer and the first metal layer together. After obtaining the panel 100, the panel 100 will be bent and deformed.

[0090] It should be noted that the first cutting line 1103 is a complete cut, while the first process edge 1102 is left uncut, so that the entire first core board 110 remains a whole.

[0091] The first adhesive layer includes a second process edge and a plurality of second forming portions 1012. The portion of the first adhesive layer corresponding to each sub-board 10 is a second forming portion 1012. The first adhesive layer is provided with a plurality of second cutting lines. The second cutting lines extend along the length or width direction of the first adhesive layer, and the plurality of second cutting lines divide the first adhesive layer into a plurality of second sub-units. Each second sub-unit includes at least one second forming portion 1012, and the second sub-unit is connected to the second process edge.

[0092] This configuration allows the first adhesive layer to be divided into multiple second sub-units by multiple second cutting lines, and it also allows the glass fiber of the first adhesive layer to be cut, thereby avoiding the need for pressing the first core board 110, the first adhesive layer and the first metal layer. After obtaining the panel 100, the panel 100 will be bent and deformed.

[0093] It should be noted that the second cutting line is a complete cut, while the second process edge is left uncut, so that the entire first adhesive layer remains a single unit.

[0094] It is understandable that the second core board and the second adhesive layer can be treated in the same way as described above.

[0095] Please refer to Figures 2 to 4 In some embodiments, the thickness of the first circuit layer 102 is equal to the thickness of the second circuit layer 201, and the sub-board 10 is connected to the mother board 20. When the substrate is obtained, the first circuit layer 102 and the second circuit layer 201 are flush.

[0096] By adopting the above scheme, a conductive layer 30 can be formed on the substrate. After the conductive layer 30 covers the first circuit layer 102 and the second circuit layer 201, the thickness of the outer circuit formed by the conductive layer 30 and the first circuit layer 102 is consistent with that of the outer circuit formed by the conductive layer 30 and the second circuit layer 201, so as to ensure the quality of etching when the outer circuit is subsequently fabricated.

[0097] Optionally, the thickness of the first circuit layer 102 is 10μm-20μm, such as 10μm, 15μm or 20μm.

[0098] This design avoids board warping caused by excessive stress from an overly thick first circuit layer 102, and also ensures that the connection between the daughter board 10 and the mother board 20 has a sufficiently thick first circuit layer 102 for conduction when electroplating with the mother board 20, thus meeting current carrying requirements.

[0099] Understandably, the thickness of the second circuit layer 201 is 10μm-20μm, which can increase the wiring density. The thickness of the conductive layer 30 can be 100μm-150μm, which can meet the current carrying requirements of the electronic component 12.

[0100] Please refer to Figures 2 to 4 In some embodiments, two first circuit layers 102 are provided and the two first circuit layers 102 are respectively provided on opposite sides of the embedded layer 101, and the electronic component 12 is provided on the side of the heat sink 11 facing one of the first circuit layers 102; two second circuit layers 201 are provided and the second circuit layers 201 are provided in a one-to-one correspondence with the first circuit layers 102.

[0101] By adopting the above scheme, the structure of the substrate obtained after connecting the sub-board 10 and the mother board 20 can be more symmetrical and less prone to bending deformation.

[0102] It should be noted that the second circuit layer 201 and the connecting layer 202 can be pressed together before the mounting groove 21 is made, or the openings can be processed on the second circuit layer 201 and the connecting layer 202 respectively, and then the second circuit layer 201 and the connecting layer 202 can be pressed together. The openings on the second circuit layer 201 and the openings on the connecting layer 202 form the mounting groove 21.

[0103] Optionally, two conductive layers 30 are provided, and each conductive layer 30 corresponds to one of the first circuit layers 102.

[0104] This configuration ensures that the structure of the substrate and the conductive layer 30 is relatively symmetrical after the conductive layer 30 is placed on the substrate, making them less prone to bending and deformation.

[0105] It should be noted that in the above embodiment, the heat sink 11 is provided with a groove, and the electronic component 12 is disposed in the groove. The motherboard 20 includes a connection layer 202 and a second circuit layer 201 disposed on opposite sides of the connection layer 202.

[0106] Please refer to Figure 7 In another embodiment, the motherboard 20 includes multiple second circuit layers 201 and multiple connection layers 202. The second circuit layers 201 are provided with dense wiring, and the lines between each second circuit layer 201 are connected through blind vias or through-holes.

[0107] Please refer to Figure 8 In another embodiment, the heat sink 11 does not have a groove, and the electronic component 12 is directly disposed on the surface of the heat sink 11.

[0108] Secondly, embodiments of this application provide a printed circuit board for embedding power components, including a substrate. The substrate includes a sub-board 10 and a motherboard 20. The sub-board 10 includes a stacked embedded layer 101 and a first circuit layer 102. A power component is disposed inside the embedded layer 101. The power component includes a heat sink 11 and an electronic component 12 disposed on the heat sink 11. The embedded layer 101 also has a first connection hole, which is filled with a first conductive part 13. The first circuit layer 102 and the electronic component 12 are respectively connected to opposite ends of the first conductive part 13. The motherboard 20 includes a stacked second circuit layer 201 and a connection layer 202. The motherboard 20 has a mounting groove 21 that penetrates the second circuit layer 201 and the connection layer 202. The sub-board 10 is located in the mounting groove 21. A conductive layer 30 is disposed on the substrate. The conductive layer 30 covers the first circuit layer 102 and the second circuit layer 201. The first circuit layer 102 and the second circuit layer 201 are electrically connected through the conductive layer 30.

[0109] The printed circuit board for the embedded power component provided in this application embodiment includes a daughter board 10 comprising a stacked embedded layer 101 and a first circuit layer 102. The embedded layer 101 houses the power component, which includes a heat sink 11 and an electronic component 12 mounted on the heat sink 11. The embedded layer 101 also has a first connection hole filled with a first conductive portion 13. The first circuit layer 102 and the electronic component 12 are respectively connected to opposite ends of the first conductive portion 13. The mother board 20 includes a stacked second circuit layer 201 and a connection layer 202. The mother board 20 has a mounting groove 21 that penetrates the second circuit layer 201. The substrate has a connecting layer 202, and the sub-board 10 is located in the mounting groove 21. A conductive layer 30 is provided on the substrate, which covers the first circuit layer 102 and the second circuit layer 201. The first circuit layer 102 and the second circuit layer 201 are electrically connected through the conductive layer 30. Therefore, the sub-board 10 can be made smaller in size, so it is not easy to deform or bend. When the sub-board 10 is connected to the mother board 20, the sub-board 10 has already been processed. The structure of the sub-board 10 itself is stable enough. Therefore, the substrate obtained after connecting the sub-board 10 to the mother board 20 is not easy to bend or deform, thereby improving the problem of board warping that is easy to occur after the conductive layer 30 is provided on the substrate.

[0110] Thirdly, embodiments of this application provide a printed circuit board for embedding power components, which is manufactured by the method for manufacturing a printed circuit board for embedding power components as described in the first aspect.

[0111] The printed circuit board for the embedded power component provided in this application embodiment includes a daughter board 10 comprising a stacked embedded layer 101 and a first circuit layer 102. A power component is disposed within the embedded layer 101, comprising a heat sink 11 and an electronic component 12 disposed on the heat sink 11. The embedded layer 101 also has a first connection hole filled with a first conductive portion 13. The first circuit layer 102 and the electronic component 12 are respectively connected to opposite ends of the first conductive portion 13. The mother board 20 comprises a stacked second circuit layer 201 and a connection layer 202. The mother board 20 has a mounting groove 21 that penetrates the second circuit layer 201 and the connection layer 202. The daughter board is first placed... 10 is placed into the mounting slot 21, and then the sub-board 10 is connected to the motherboard 20 to obtain a substrate. A conductive layer 30 is then set on the substrate. The conductive layer 30 covers the first circuit layer 102 and the second circuit layer 201. The first circuit layer 102 and the second circuit layer 201 are electrically connected through the conductive layer 30. Therefore, the sub-board 10 can be made smaller in size, so it is not easy to deform or bend. Moreover, the sub-board 10 has already been processed when it is connected to the motherboard 20. The structure of the sub-board 10 itself is stable enough. Therefore, the substrate obtained after connecting the sub-board 10 to the motherboard 20 is not easy to bend or deform, thereby improving the problem of board warping that is easy to occur after setting the conductive layer 30 on the substrate.

[0112] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for manufacturing a printed circuit board with embedded power components, characterized in that, The application relates to a substrate manufacturing method. The application provides a substrate and a mother substrate, the substrate comprises a buried embedding layer and a first circuit layer which are arranged in a stack mode, an inner part of the buried embedding layer is provided with a power assembly, the power assembly comprises a heat dissipation base and an electronic element arranged on the heat dissipation base, the buried embedding layer is further provided with a first connecting hole, the first connecting hole is filled with a first conductive part, the first circuit layer and the electronic element are connected with opposite ends of the first conductive part respectively, the mother substrate comprises a second circuit layer and a connecting layer which are arranged in a stack mode, and the mother substrate is provided with a mounting groove which penetrates through the second circuit layer and the connecting layer. The substrate is placed into the mounting groove. The substrate and the mother substrate are connected together to obtain a substrate. An electrically conductive layer is arranged on the substrate, the electrically conductive layer covers the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically connected through the electrically conductive layer.

2. The method of claim 1, wherein: The substrate comprises a first dielectric layer, and the mother substrate comprises a second dielectric layer, the Tg value of the first dielectric layer is greater than the Tg value of the second dielectric layer.

3. The method of claim 1, wherein: The substrate is manufactured in the following manner. A first core plate, a first adhesive layer and a first metal layer are provided, and a plurality of first windows are arranged on the first core plate. One power assembly is placed in one first window, and the first core plate, the first adhesive layer and the first metal layer are sequentially and layerwisely arranged. The first core plate, the first adhesive layer and the first metal layer are subjected to pressing treatment to obtain a spliced plate. A plurality of functional holes penetrating through the first adhesive layer and the first metal layer are processed, one power assembly corresponds to at least one functional hole, and the electronic element defines a hole bottom surface of the functional hole. A functional part is filled in the functional hole, and the electronic element and the first metal layer are connected with the functional part and are electrically connected. The spliced plate is divided into a plurality of substrates, the first core plate and the first adhesive layer corresponding to the substrate are the buried embedding layer, the first metal layer corresponding to the substrate is the first circuit layer, the functional hole formed in the first adhesive layer corresponding to the substrate is the first connecting hole, and the functional part in the first adhesive layer corresponding to the substrate is the first conductive part.

4. The method of claim 3, wherein: The first core plate comprises a first process edge and a plurality of first forming parts, the part of the first core plate corresponding to each substrate is the first forming part, the first core plate is provided with a plurality of first cutting lines which extend along the length or width direction of the first core plate, and the first core plate is divided into a plurality of first sub-units by the first cutting lines, each first sub-unit comprises at least one first forming part, and the first sub-unit is connected with the first process edge. And / or, the first bonding layer comprises a second process edge and a plurality of second forming portions, the first bonding layer corresponding to a portion of each of the sub-panels is the second forming portion, the first bonding layer is provided with a plurality of second cutting lines, the second cutting lines extend along the length or width direction of the first bonding layer, and the plurality of second cutting lines separate the first bonding layer into a plurality of second sub-units, each of the second sub-units comprises at least one of the second forming portions, and the second sub-units are connected with the second process edge.

5. The method of claim 1, wherein: The thickness of the first circuit layer and the thickness of the second circuit layer are equal, and the sub-panels and the master panel are connected together to obtain a substrate, and the first circuit layer and the second circuit layer are flushly arranged.

6. The method of claim 5, wherein: The thickness of the first circuit layer is 10-20 μm.

7. The method of claim 1 to 6, wherein The first circuit layer is provided with two, and the two first circuit layers are respectively arranged on the opposite sides of the embedded layer, and the electronic element is arranged on the side of the heat dissipation base facing one of the first circuit layers; the second circuit layer is provided with two, and the second circuit layer is arranged one by one with the first circuit layer.

8. The method of claim 7, wherein: The conductive layer is provided with two, and the conductive layer is arranged one by one with the first circuit layer.

9. A printed circuit board for embedding a power component, characterized by The substrate comprises a sub-panel and a master panel, the sub-panel comprises an embedded layer and a first circuit layer arranged in layers, the inside of the embedded layer is provided with a power component, the power component comprises a heat dissipation base and an electronic element arranged on the heat dissipation base, the embedded layer is also provided with a first connecting hole, the first connecting hole is filled with a first conductive portion, the first circuit layer and the electronic element are respectively connected with the opposite ends of the first conductive portion, the master panel comprises a second circuit layer and a connecting layer arranged in layers, the master panel is provided with a mounting groove, the mounting groove penetrates the second circuit layer and the connecting layer, the sub-panel is located in the mounting groove, the substrate is provided with a conductive layer, the conductive layer covers the first circuit layer and the second circuit layer, and the first circuit layer and the second circuit layer are electrically connected through the conductive layer.

10. A printed circuit board for embedding a power component, characterized by The printed circuit board is processed by the manufacturing method of the printed circuit board with the embedded power component as claimed in any one of claims 1-8. The printed circuit board is processed by the manufacturing method of the printed circuit board with the embedded power component as claimed in any one of claims 1-8.

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