Processing method of local mixed pressing PCB, local mixed pressing PCB and electronic equipment

Abstract

The application discloses a processing method of a local mixed-press PCB, the local mixed-press PCB and electronic equipment, and the processing method comprises the following steps: processing a first through slot on at least two PCB mother boards respectively; bonding and fixing a fixing member between the adjacent two PCB mother boards, the fixing member is provided with a second through slot corresponding to the position of the first through slot, and the edge of the second through slot is provided with a sub-board fixing part; placing a PCB sub-board in the first through slot, so that the sub-board fixing part abuts against the bottom of the PCB sub-board; and pressing the at least two PCB mother boards and the PCB sub-board to obtain the local mixed-press PCB, in the pressing process of the PCB sub-board and the PCB mother board, the part, where the sub-board fixing part abuts against the bottom of the PCB sub-board, is filled between the side of the PCB sub-board and the inner layer of the PCB mother board through the downward force of the PCB sub-board, so that the PCB sub-board is prevented from sliding in the pressing process, the misalignment of the PCB sub-board and the PCB mother board in the pressing process is prevented, and the alignment accuracy between the PCB sub-board and the PCB mother board is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB technology, and in particular to a method for processing a partially mixed-pressure PCB, the partially mixed-pressure PCB, and electronic equipment. Background Technology

[0002] Currently, in order to meet the requirements of high-speed and high-frequency signal transmission, high-frequency PCBs (Printed Circuit Boards) are increasingly used in communication equipment. In order to achieve electromagnetic interference resistance and improve strength, under the premise of cost saving, boards made of different materials are mixed and pressed together in the PCB manufacturing process, which is called partial mixing and pressing process.

[0003] In the existing localized mixing and pressing process, during the pressing process, the prepreg between the PCB daughter board, PCB mother board and PCB mother board is prone to relative movement under high temperature and high pressure, which causes misalignment of the PCB daughter board and PCB mother board and affects the alignment accuracy of the PCB. Summary of the Invention

[0004] This invention provides a method for processing a partially mixed-pressed PCB, a partially mixed-pressed PCB, and an electronic device, to solve the problem that misalignment easily occurs between the PCB daughterboard and the PCB motherboard in existing partially mixed-pressing processes.

[0005] A method for manufacturing a partially mixed-voltage PCB, comprising:

[0006] The first through slot is processed on at least two PCB motherboards;

[0007] An adhesive fastener is attached between two adjacent PCB motherboards. The adhesive fastener is provided with a second through slot corresponding to the position of the first through slot. The edge of the second through slot is provided with a subboard fixing part.

[0008] Place the PCB sub-board in the first through slot, so that the sub-board fixing part abuts against the bottom of the PCB sub-board;

[0009] At least two layers of the PCB motherboard and the PCB daughterboard are laminated together to obtain a partially mixed-pressed PCB.

[0010] Further, before attaching the adhesive fastener between two adjacent PCB motherboard layers, the procedure includes:

[0011] Based on the dimensions of the first milled groove, the target through groove is machined on the prepreg;

[0012] Based on the second milling groove size and the preset milling groove path, the sub-plate fixing part is machined at the edge of the target through groove to obtain the bonding fastener.

[0013] Furthermore, the preset milling groove path is serrated.

[0014] Furthermore, before laminating at least two layers of the PCB motherboard and the PCB daughterboard to obtain a partially hybrid PCB, the processing method of the partially hybrid PCB further includes:

[0015] A first protrusion is machined at the edge of the first through groove;

[0016] A first groove is machined on the PCB sub-board, and the first groove matches the first protrusion.

[0017] The PCB sub-board is placed in the first through slot, and the first protrusion of the PCB motherboard is engaged with the first groove of the PCB sub-board, so that the sub-board fixing part abuts against the bottom of the PCB sub-board.

[0018] Furthermore, processing a first protrusion at the edge of the first through groove includes: processing at least one first protrusion on each side of the first through groove;

[0019] The process of machining the first groove on the PCB sub-board includes:

[0020] At least one of the first grooves is machined on each side of the PCB sub-board, and the position and number of the first grooves correspond to the position and number of the first protrusions.

[0021] Furthermore, the first protrusion is semi-circular or rectangular.

[0022] Furthermore, the size of the first through slot is less than or equal to the size of the second through slot.

[0023] Furthermore, the size of the second through slot is larger than the size of the PCB sub-board.

[0024] A partially mixed-pressure PCB is obtained by processing the partially mixed-pressure PCB processing method described above.

[0025] An electronic device comprising the aforementioned partially mixed-voltage PCB.

[0026] The aforementioned method for processing partially laminated PCBs, the partially laminated PCB itself, and electronic devices involve processing first through slots on at least two PCB motherboards to provide a foundation for subsequent embedding of PCB daughterboards. Adhesive fasteners are bonded between adjacent PCB motherboards to bond and fix the PCB motherboards and PCB daughterboards after lamination. The adhesive fasteners have second through slots corresponding to the positions of the first through slots, and the edges of the second through slots have daughterboard fixing parts. These daughterboard fixing parts are used to fix the PCB daughterboards during the lamination process of the PCB motherboards and PCB daughterboards, preventing misalignment between the PCB daughterboards and PCB motherboards during lamination. The PCB sub-board is placed in the first through slot, so that the sub-board fixing part abuts against the bottom of the PCB sub-board. At least two layers of PCB motherboard and PCB sub-board are pressed together to obtain a partially mixed-pressed PCB. During the pressing process of the PCB sub-board and PCB motherboard, the downward force of the PCB sub-board causes the part of the sub-board fixing part that abuts against the bottom of the PCB sub-board to be filled between the side of the PCB sub-board and the inner layer of the PCB motherboard, thereby preventing the PCB sub-board from sliding during the pressing process, and thus preventing the PCB sub-board and PCB motherboard from misaligning during the pressing process, thereby improving the alignment accuracy between the PCB sub-board and PCB motherboard. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a flowchart of a partial mixed-pressure PCB processing method according to an embodiment of the present invention;

[0029] Figure 2 This is another flowchart of a partial mixed-pressure PCB processing method according to one embodiment of the present invention;

[0030] Figure 3 This is another flowchart of a partial mixed-pressure PCB processing method according to one embodiment of the present invention;

[0031] Figure 4 This is a top view of a partially mixed-pressure PCB before lamination in one embodiment of the present invention;

[0032] Figure 5 This is a top view of a partially mixed-pressure PCB before lamination in one embodiment of the present invention.

[0033] In the figure: 10, PCB motherboard; 11, first through slot; 12, first protrusion; 20, PCB daughterboard; 21, first groove; 30, adhesive fastener; 31, second through slot; 311, daughterboard fixing part. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be understood that the invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout.

[0036] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this invention, the first element, component, area, layer, or portion discussed below may be referred to as the second element, component, area, layer, or portion.

[0037] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below,” “under,” or “below” other elements or features will be oriented “above” other elements or features. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0038] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, identify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0039] To fully understand this invention, detailed structures and steps will be presented in the following description to illustrate the technical solution proposed by this invention. Preferred embodiments of the invention are described in detail below; however, in addition to these detailed descriptions, the invention may have other embodiments.

[0040] This embodiment provides a method for processing a partially mixed-pressure PCB, such as... Figure 1 As shown, it includes:

[0041] S101: First through slots 11 are machined on at least two PCB motherboards 10.

[0042] S102: A bonding fastener 30 is attached between two adjacent PCB motherboards 10. The bonding fastener 30 is provided with a second through groove 31 corresponding to the position of the first through groove 11. The edge of the second through groove 31 is provided with a subboard fixing part 311.

[0043] S103: Place the PCB sub-board 20 in the first through slot 11, so that the sub-board fixing part 311 abuts against the bottom of the PCB sub-board 20.

[0044] S104: Press at least two layers of PCB motherboard 10 and PCB daughterboard 20 together to obtain a partially mixed-pressed PCB.

[0045] As an example, in step S101, first through slots 11 are processed on at least two PCB motherboards 10, that is, in at least two PCB motherboards 10, first through slots 11 are processed at corresponding positions on each PCB motherboard 10 to provide a foundation for the subsequent embedding of the PCB daughterboard 20. The PCB motherboard 10 is a copper-clad laminate made of a first insulating material. The PCB daughterboard 20 is a copper-clad laminate made of a second insulating material. The first and second insulating materials are different insulating materials. For example, the first insulating material is a non-high-frequency insulating material. For example, the first insulating material can be FR4 (epoxy fiberglass board). The second insulating material is a high-frequency insulating material. For example, the second insulating material can be a semi-ceramic material or PTFE (Polytetrafluoroethylene). Understandably, the size of the first through slot 11 is larger than the size of the PCB daughterboard 20 to ensure that the PCB daughterboard 20 can be properly embedded. It should be noted that the number of layers of the PCB motherboard 10 into which the PCB daughterboard 20 needs to be embedded can be selected according to actual needs, as long as there are at least two layers of PCB motherboard 10. In this example, the existing milling process can be used to process the first through slot 11 on at least two layers of PCB motherboard 10 respectively, and there is no restriction here.

[0046] As an example, in step S102, an adhesive fastener 30 is attached between two adjacent PCB motherboards 10. This adhesive fastener 30 is used to bond and fix the PCB motherboard 10 and the PCB daughterboard 20 after the lamination process. Specifically, the adhesive fastener 30 has a second through-slot 31 corresponding to the position of the first through-slot 11. The edge of the second through-slot 31 has a daughterboard fixing portion 311, which is used to fix the PCB daughterboard 20 during the lamination process of the PCB motherboard 10 and the PCB daughterboard 20, preventing misalignment between the PCB daughterboard 20 and the PCB motherboard 10 during lamination and improving the alignment accuracy between the PCB daughterboard 20 and the PCB motherboard 10. It should be noted that the slot size of the second through-slot 31 is larger than the slot size of the first through-slot 11, and the daughterboard fixing portion 311 on the edge of the second through-slot 31 extends at least partially into the first through-slot 11.

[0047] As an example, in step S103, such as Figure 4As shown, the PCB sub-board 20 is placed in the first through slot 11, so that the sub-board fixing part 311 abuts against the bottom of the PCB sub-board 20. In this example, by placing the PCB sub-board 20 in the first through slot 11 and making the sub-board fixing part 311 abut against the bottom of the PCB sub-board 20, during the pressing process of the PCB sub-board 20 and the PCB motherboard 10, due to the downward force of the PCB sub-board 20, the portion of the sub-board fixing part 311 abutting against the bottom of the PCB sub-board 20 is filled between the side of the PCB sub-board 20 and the inner layer of the PCB motherboard 10, thereby preventing the PCB sub-board 20 from sliding during the pressing process, and thus preventing the PCB sub-board 20 and the PCB motherboard 10 from misaligning during the pressing process, improving the alignment accuracy between the PCB sub-board 20 and the PCB motherboard 10.

[0048] As an example, in step S104, at least two layers of PCB motherboard 10 and PCB daughterboard 20 are laminated to obtain a partially mixed-laminated PCB. In this example, the PCB daughterboard 20 is placed in the first through slot 11, with the daughterboard fixing part 311 abutting against the bottom of the PCB daughterboard 20. By laminating at least two layers of PCB motherboard 10 and PCB daughterboard 20, a partially mixed-laminated PCB can be obtained. During the lamination process of the PCB daughterboard 20 and PCB motherboard 10, the downward force of the PCB daughterboard 20 causes the portion of the daughterboard fixing part 311 abutting against the bottom of the PCB daughterboard 20 to be filled between the side of the PCB daughterboard 20 and the inner layer of the PCB motherboard 10. This prevents the PCB daughterboard 20 from sliding during lamination, thereby preventing misalignment between the PCB daughterboard 20 and the PCB motherboard 10 and improving the alignment accuracy between the PCB daughterboard 20 and the PCB motherboard 10. In this example, existing PCB lamination technology can be used, and will not be elaborated further.

[0049] In this embodiment, first through slots 11 are respectively processed on at least two PCB motherboards 10 to provide a foundation for the subsequent embedding of PCB daughterboards 20. Adhesive fasteners 30 are bonded between adjacent PCB motherboards 10 to bond and fix the PCB motherboards 10 and PCB daughterboards 20 after the lamination process. The adhesive fasteners 30 are provided with second through slots 31 corresponding to the positions of the first through slots 11. A daughterboard fixing part 311 is provided at the edge of the second through slot 31. This daughterboard fixing part 311 is used to fix the PCB daughterboard 20 during the lamination process of the PCB motherboards 10 and PCB daughterboards 20, preventing misalignment between the PCB daughterboard 20 and the PCB motherboards 10 during lamination, and placing the PCB daughterboard 20 on the first through slot. In a through slot 11, the sub-board fixing part 311 abuts against the bottom of the PCB sub-board 20, pressing at least two layers of PCB motherboard 10 and PCB sub-board 20 together to obtain a partially mixed-pressed PCB. During the pressing process of the PCB sub-board 20 and the PCB motherboard 10, the downward force of the PCB sub-board 20 causes the part of the sub-board fixing part 311 that abuts against the bottom of the PCB sub-board 20 to be filled between the side of the PCB sub-board 20 and the inner layer of the PCB motherboard 10, thereby preventing the PCB sub-board 20 from sliding during the pressing process, and further preventing the PCB sub-board 20 and the PCB motherboard 10 from misaligning during the pressing process, thus improving the alignment accuracy between the PCB sub-board 20 and the PCB motherboard 10.

[0050] In one embodiment, such as Figure 2 As shown, before step S102, that is, before attaching the adhesive fastener 30 between two adjacent PCB motherboards 10, the process includes:

[0051] S201: Based on the first milling groove dimensions, machine the target through groove on the prepreg.

[0052] S202: Based on the second milling groove size and the preset milling groove path, process the sub-plate fixing part 311 at the edge of the target through groove to obtain the bonding fastener 30.

[0053] The size of the first milled groove is smaller than that of the second milled groove.

[0054] As an example, in step S201, a target through groove is machined on the prepreg based on the first milling groove size, so that in a subsequent step, a second through groove 31 having a subplate fixing portion 311 is machined based on the target through groove.

[0055] As an example, in step S202, based on the second milling groove size and the preset milling groove path, a sub-plate fixing part 311 is machined at the edge of the target through groove to obtain the adhesive fastener 30. In this example, the preset milling groove path refers to the path used to machine the sub-plate fixing part 311. The second milling groove size refers to the size used to machine the second milling groove. After constructing the target through groove on the prepreg, the target through groove is further processed based on the second milling groove size and the preset milling groove path, that is, the sub-plate fixing part 311 is machined at the edge of the target through groove to obtain the adhesive fastener 30, thereby making the adhesive fastener 30 have a second through groove 31, and the edge of the second through groove 31 has a sub-plate fixing part 311.

[0056] In this embodiment, a target through groove is machined on the prepreg based on the first milling groove size, and a sub-board fixing part 311 is machined on the edge of the target through groove based on the second milling groove size and the preset milling groove path to obtain an adhesive fastener 30. The adhesive fastener 30 has a second through groove 31, and the edge of the second through groove 31 has a sub-board fixing part 311. In subsequent processes, the sub-board fixing part 311 is used to fix the PCB sub-board 20 during the pressing process of the PCB motherboard 10 and the PCB sub-board 20, preventing the PCB sub-board 20 from being misaligned with the PCB motherboard 10 during the pressing process.

[0057] Optionally, the preset milling path can be sawtooth, wavy, or rectangular pulse-shaped. It should be noted that the preset milling path can also be other shapes, as long as the sub-board 20 is placed in the first through slot 11, the sub-board fixing part 311 can abut against the bottom of the sub-board 20, and during the pressing process of the sub-board 20 and the PCB motherboard 10, the part of the sub-board fixing part 311 that abuts against the bottom of the sub-board 20 is filled between the side of the sub-board 20 and the inner layer of the PCB motherboard 10.

[0058] In one embodiment, the preset milling path is serrated.

[0059] In this embodiment, the preset milling path is sawtooth-shaped, so that the sub-board fixing part 311 is sawtooth-shaped. When the sawtooth part in the sub-board fixing part 311 abuts against the bottom of the PCB sub-board 20, during the pressing process of the PCB sub-board 20 and the PCB motherboard 10, the downward force of the PCB sub-board 20 causes the sawtooth part of the sub-board fixing part 311 that abuts against the bottom of the PCB sub-board 20 to be filled between the side of the PCB sub-board 20 and the inner layer of the PCB motherboard 10, thereby preventing the PCB sub-board 20 from sliding during the pressing process, and further preventing the PCB sub-board 20 and the PCB motherboard 10 from misaligning during the pressing process, thereby improving the alignment accuracy between the PCB sub-board 20 and the PCB motherboard 10.

[0060] In one embodiment, such as Figure 3As shown, before step S104, that is, before laminating at least two layers of PCB motherboard 10 and PCB daughterboard 20 to obtain a partially mixed-lamination PCB, the processing method of the partially mixed-lamination PCB further includes:

[0061] S301: The first protrusion 12 is machined at the edge of the first through groove 11.

[0062] S302: A first groove 21 is machined on the PCB daughterboard 20, and the first groove 21 matches the first protrusion 12.

[0063] S303: Place the PCB daughter board 20 in the first through slot 11, and snap the first protrusion 12 of the PCB mother board 10 onto the first groove 21 of the PCB daughter board 20, so that the daughter board fixing part 311 abuts against the bottom of the PCB daughter board 20.

[0064] As an example, in step S301, a first protrusion 12 is machined at the edge of the first through slot 11. The first protrusion 12 is used to fix the PCB sub-board 20 during the pressing process. Exemplarily, firstly, an initial through slot is machined on the PCB motherboard 10. The size of the initial through slot is smaller than the size of the first through slot 11. Then, according to the milling groove size corresponding to the first through slot 11 and the milling groove path corresponding to the first protrusion 12, a second through slot 31 is machined on the initial through slot. At the same time, a first protrusion 12 is machined at the edge of the second through slot 31 according to the milling groove path corresponding to the first protrusion 12, thereby machining the first protrusion 12 at the edge of the first through slot 11.

[0065] As an example, in step S302, a first groove 21 is machined on the PCB daughter board 20, and the first groove 21 matches the first protrusion 12. In this example, by machining the first groove 21 on the PCB daughter board 20 and matching the first protrusion 12, the first protrusion 12 of the PCB mother board 10 can be engaged with the first groove 21 of the PCB daughter board 20, thereby fixing the PCB daughter board 20 during the pressing process.

[0066] As an example, in step S303, such as Figure 5As shown, the PCB sub-board 20 is placed in the first through slot 11, and the first protrusion 12 of the PCB motherboard 10 is snapped onto the first groove 21 of the PCB sub-board 20, so that the sub-board fixing part 311 abuts against the bottom of the PCB sub-board 20. In this example, by placing the PCB sub-board 20 in the first through slot 11, the first protrusion 12 of the PCB motherboard 10 is engaged with the first groove 21 of the PCB sub-board 20, thereby preventing the PCB sub-board 20 from sliding during the pressing process. At the same time, since the sub-board fixing part 311 abuts against the bottom of the PCB sub-board 20, during the pressing process of the PCB sub-board 20 and the PCB motherboard 10, the downward force of the PCB sub-board 20 causes the serrated part of the sub-board fixing part 311 abutting against the bottom of the PCB sub-board 20 to be filled between the side of the PCB sub-board 20 and the inner layer of the PCB motherboard 10, thereby further preventing the PCB sub-board 20 from sliding during the pressing process. The PCB sub-board 20 is doubly fixed, improving the alignment accuracy between the PCB sub-board 20 and the PCB motherboard 10.

[0067] In one embodiment, processing a first protrusion 12 at the edge of the first through groove 11 includes processing at least one first protrusion 12 on each side of the first through groove 11; processing a first groove 21 on the PCB sub-board 20 includes processing at least one first groove 21 on each side of the PCB sub-board 20, wherein the position and number of the first grooves 21 correspond to the position and number of the first protrusions 12.

[0068] As an example, the first through slot 11 is a rectangular slot, and at least one first protrusion 12 is processed on each side of the first through slot 11. At the same time, at least one first groove 21 is processed on each side of the PCB sub-board 20, ensuring that the position and number of the first groove 21 correspond to the position and number of the first protrusion 12. Since the first groove 21 on each side of the PCB sub-board 20 is engaged with the first protrusion 12, it can fix the PCB sub-board 20 and prevent the PCB sub-board 20 from sliding during the pressing process, thereby improving the alignment accuracy between the PCB sub-board 20 and the PCB motherboard 10.

[0069] In one embodiment, the first protrusion 12 is semi-circular or rectangular.

[0070] In this embodiment, the first protrusion 12 can be semi-circular or rectangular, ensuring that the PCB sub-board 20 has a corresponding first groove 21 that engages with it, thus fixing the PCB sub-board 20 and preventing it from sliding during the pressing process, thereby improving the alignment accuracy between the PCB sub-board 20 and the PCB motherboard 10.

[0071] In one embodiment, the size of the first through slot 11 is less than or equal to the size of the second through slot 31.

[0072] In this embodiment, the size of the first through slot 11 is less than or equal to the size of the second through slot 31, so that the sub-board fixing part 311 on the second through slot 31 abuts against the bottom of the PCB sub-board 20. During the pressing process of the PCB sub-board 20 and the PCB motherboard 10, the part of the sub-board fixing part 311 that abuts against the bottom of the PCB sub-board 20 is filled between the side of the PCB sub-board 20 and the inner layer of the PCB motherboard 10, preventing the PCB sub-board 20 from sliding during the pressing process.

[0073] In one embodiment, the size of the second through slot 31 is larger than the size of the PCB subboard 20.

[0074] In this embodiment, the size of the second through slot 31 is larger than the size of the PCB sub-board 20, ensuring that the sub-board fixing part 311 on the edge of the second through slot 31 can abut against the bottom of the PCB sub-board 20. During the pressing process of the PCB sub-board 20 and the PCB motherboard 10, the part of the sub-board fixing part 311 that abuts against the bottom of the PCB sub-board 20 is filled between the side of the PCB sub-board 20 and the inner layer of the PCB motherboard 10, preventing the PCB sub-board 20 from sliding during the pressing process.

[0075] This embodiment provides a partially mixed-pressure PCB, which is processed using the aforementioned partially mixed-pressure PCB processing method.

[0076] This embodiment provides an electronic device, including the aforementioned partially mixed-voltage PCB.

[0077] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for processing a partially mixed-pressure PCB, characterized in that, include: The first through slot is processed on at least two PCB motherboards; An adhesive fastener is attached between two adjacent PCB motherboards. The adhesive fastener is provided with a second through slot corresponding to the position of the first through slot. The edge of the second through slot is provided with a subboard fixing part. Place the PCB sub-board in the first through slot, so that the sub-board fixing part abuts against the bottom of the PCB sub-board; At least two layers of the PCB motherboard and the PCB daughterboard are laminated together to obtain a partially mixed-pressed PCB. The process includes, prior to attaching the bonding fastener between two adjacent PCB motherboard layers, the following: Based on the dimensions of the first milled groove, the target through groove is machined on the prepreg; Based on the second milling groove size and the preset milling groove path, a sub-plate fixing part is machined at the edge of the target through groove to obtain the bonding fastener; the preset milling groove path is serrated.

2. The processing method for a partially mixed-pressure PCB as described in claim 1, characterized in that, Before laminating at least two layers of the PCB motherboard and the PCB daughterboard to obtain a partially hybrid PCB, the processing method of the partially hybrid PCB further includes: A first protrusion is machined at the edge of the first through groove; A first groove is machined on the PCB sub-board, and the first groove matches the first protrusion. The PCB sub-board is placed in the first through slot, and the first protrusion of the PCB motherboard is engaged with the first groove of the PCB sub-board, so that the sub-board fixing part abuts against the bottom of the PCB sub-board.

3. The processing method for a partially mixed-pressure PCB as described in claim 2, characterized in that, Processing a first protrusion at the edge of the first through groove includes: processing at least one first protrusion on each side of the first through groove; The process of machining the first groove on the PCB sub-board includes: At least one of the first grooves is machined on each side of the PCB sub-board, and the position and number of the first grooves correspond to the position and number of the first protrusions.

4. The processing method for a partially mixed-pressure PCB as described in claim 2, characterized in that, The first protrusion is semi-circular or rectangular.

5. The processing method for a partially mixed-pressure PCB as described in claim 1, characterized in that, The size of the first through slot is less than or equal to the size of the second through slot.

6. The processing method for a partially mixed-pressure PCB as described in claim 1, characterized in that, The size of the second through slot is larger than the size of the PCB sub-board.

7. A partially mixed-voltage PCB, characterized in that, It is manufactured using the partial mixed-pressure PCB manufacturing method as described in any one of claims 1 to 6.

8. An electronic device, characterized in that, Including the partially mixed-pressure PCB as described in claim 7.

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