Heat dissipation power generation integrated device and preparation method thereof

Abstract

The application provides a heat dissipation and power generation integrated device and a preparation method thereof, a phase change heat dissipation module is constructed by sequentially stacking a manifold flow guide layer, a nano-porous layer and a capillary flow passage layer, the phase change heat dissipation module is designed with a liquid inlet, a liquid outlet and a steam outlet, and a flow guide manifold which is communicated with the liquid inlet and the liquid outlet, so as to realize efficient liquid flow and heat exchange. A flexible power generation module is constructed by sequentially stacking an anode layer, a proton exchange membrane, a cathode layer, a battery negative electrode and a battery positive electrode, and the flexible power generation module is sealed and fixed at the edge between an annular fixed base and an annular fixed top cover, and then the fixed base is bonded to the manifold flow guide layer of the phase change heat dissipation module, so as to form a device integrated with the functions of heat dissipation and power generation. Not only the heat dissipation efficiency of the integrated circuit is improved, but also the energy utilization efficiency is significantly improved by utilizing waste heat to generate power, and energy waste is reduced.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to an integrated heat dissipation and power generation device and its preparation method. Background Technology

[0002] In the field of integrated circuit technology, with the continuous evolution of Moore's Law and the constant improvement of chip performance, the integration density and computing speed of integrated circuits have significantly increased, resulting in a sharp increase in power consumption density. Currently, the power consumption of high-performance microprocessors, graphics processing units (GPUs), and application-specific integrated circuits (ASICs) has soared from tens of watts in the early days to hundreds of watts, with the heat density of some high-end chips even exceeding 1000W / cm². Heat dissipation has become a core bottleneck restricting the release of integrated circuit performance, the improvement of reliability, and the extension of lifespan.

[0003] In existing integrated circuit heat dissipation technologies, whether passive air cooling or active liquid cooling, the waste heat generated by high-performance chips is often directly discharged without effective utilization. As the heat flux density of high-performance chips continues to increase and the internal heat-generating area of ​​integrated circuits continues to expand, the amount of waste heat generated during the heat dissipation process is also constantly increasing. The generation of a large amount of waste heat not only affects the heat dissipation performance of integrated circuits but also leads to serious energy waste as the amount of waste heat increases. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an integrated heat dissipation and power generation device and its preparation method, so as to solve the problems of low heat dissipation efficiency of integrated circuits and ineffective utilization of waste heat in the prior art.

[0005] To achieve the above and other related objectives, the present invention provides a method for preparing an integrated heat dissipation and power generation device, the method comprising:

[0006] A phase change heat dissipation module is provided, comprising a manifold guide layer, a nanoporous layer, and a capillary channel layer stacked sequentially. The manifold guide layer includes an inlet and an outlet extending from its surface toward the nanoporous layer, and a steam outlet penetrating the center of the manifold guide layer. The nanoporous layer has a micro-perforation array at positions corresponding to the steam outlet, and a guide manifold extends from the surface of the nanoporous layer in contact with the capillary channel layer toward the manifold guide layer, forming a guide manifold connecting the inlet and the outlet. The capillary channel layer has several capillary microchannels at positions corresponding to the micro-perforation array of the nanoporous layer.

[0007] A flexible power generation module is provided, comprising an anode layer, a proton exchange membrane, and a cathode layer stacked sequentially, as well as a battery negative electrode in contact with the anode layer and a battery positive electrode in contact with the cathode layer;

[0008] A flexible hydrophobic layer is formed on the cathode layer of the flexible power generation module;

[0009] An annular fixed base and an annular fixed top cover are provided. The edge of the flexible power generation module on which the flexible hydrophobic layer is formed is sealed and fixed between the annular fixed base and the annular fixed top cover. The anode layer is close to the annular fixed base, the cathode layer is close to the annular fixed top cover, and an exhaust groove is provided on the surface of the annular fixed base that contacts the anode layer.

[0010] The annular fixing base is bonded to the manifold guide layer of the phase change heat dissipation module, and the annular openings of the annular fixing base and the annular fixing top cover correspond to the position of the steam outlet of the phase change heat dissipation module.

[0011] Optionally, the method for fabricating the phase change heat dissipation module includes:

[0012] A first wafer is provided, the first wafer having opposing first and second sides;

[0013] The micro-via array and the flow manifold are formed on the first surface of the first wafer, and the liquid inlet and the liquid outlet are formed on the second surface of the first wafer;

[0014] Provide a second wafer;

[0015] The second wafer is etched using a photolithography process to form a plurality of capillary microflow grooves on the second wafer;

[0016] The surface of the first wafer having the micro-via array is bonded to the surface of the second wafer having the capillary micro-flow grooves, wherein the capillary micro-flow grooves correspond to the positions of the micro-via arrays;

[0017] The first wafer is etched using a photolithography process to form the steam outlet, the steam outlet at least exposing the micro-via array;

[0018] Cut to form the phase change heat dissipation module.

[0019] Furthermore, the first wafer is an SOI wafer or a silicon wafer with SiO2 and polycrystalline silicon formed on its surface, and the second wafer is a silicon wafer; the surface of the first wafer with the micro-via array and the surface of the second wafer with the capillary microchannels are bonded by silicon fusion bonding.

[0020] Furthermore, after bonding the surface of the first wafer with the micro-via array to the surface of the second wafer with the capillary micro-flow grooves, the process further includes an annealing step.

[0021] Optionally, the method for manufacturing the flexible power generation module includes:

[0022] An untreated proton exchange membrane is provided. The untreated proton exchange membrane is placed in a water bath with deionized water, hydrogen peroxide solution, dilute sulfuric acid solution and deionized water in sequence and heated. Then it is repeatedly rinsed with deionized water. The above steps are repeated until the untreated proton exchange membrane changes from yellow to clean and transparent, thus obtaining the proton exchange membrane.

[0023] A uniformly dispersed platinum-ruthenium catalyst slurry and a platinum catalyst slurry are provided. The platinum-ruthenium catalyst slurry is sprayed onto a first carbon paper to form the anode layer. The platinum catalyst slurry is sprayed onto a second carbon paper to form the cathode layer.

[0024] The anode layer, the proton exchange membrane, and the cathode layer are sequentially stacked and hot-pressed to fix them;

[0025] A first silver foil is provided and adhered to the anode layer to form the negative electrode of the battery; a second silver foil is provided and adhered to the cathode layer to form the positive electrode of the battery.

[0026] Optionally, the flexible hydrophobic layer is formed on the cathode layer of the flexible power generation module using a low-temperature magnetron sputtering process.

[0027] The present invention also provides an integrated heat dissipation and power generation device, the integrated device comprising:

[0028] A phase change heat dissipation module includes a manifold guide layer, a nanoporous layer, and a capillary channel layer stacked sequentially. The manifold guide layer includes an inlet and an outlet extending from its surface toward the nanoporous layer, and a steam outlet penetrating the center of the manifold guide layer. The nanoporous layer has a micro-perforation array at positions corresponding to the steam outlet, and a guide manifold extends from the surface of the nanoporous layer in contact with the capillary channel layer toward the manifold guide layer, forming a guide manifold that connects the inlet and the outlet. The capillary channel layer has several capillary microchannels at positions corresponding to the micro-perforation array of the nanoporous layer.

[0029] A flexible power generation module includes an anode layer, a proton exchange membrane, a cathode layer stacked sequentially, a negative electrode of a battery in contact with the anode layer, and a positive electrode of a battery in contact with the cathode layer.

[0030] A flexible hydrophobic layer formed on the cathode layer of the flexible power generation module;

[0031] An annular fixed base and an annular fixed top cover are provided. The edge of the flexible power generation module, on which the flexible hydrophobic layer is formed, is sealed and fixed between the annular fixed base and the annular fixed top cover. The anode layer is close to the annular fixed base, and the cathode layer is close to the annular fixed top cover. An exhaust groove is provided on the surface of the annular fixed base that contacts the anode layer. The annular fixed base is bonded to the manifold guide layer of the phase change heat dissipation module. The annular openings of the annular fixed base and the annular fixed top cover correspond to the steam outlet position of the phase change heat dissipation module.

[0032] Optionally, the phase change heat dissipation module has a thickness of 500μm to 700μm; the manifold guide layer has a thickness of 300μm to 500μm; the inlet has a depth of 100μm to 300μm; the outlet has a depth of 100μm to 300μm; the nanoporous layer has a thickness of 400nm to 600nm; the micro-vias in the micro-via array have a width of 100nm to 300nm; the spacing between the micro-vias is 20nm to 200nm; the capillary microfluidic channels have a width of 2μm to 10μm; the spacing between the capillary microfluidic channels is 0.5μm to 1μm; and the depth of the capillary microfluidic channels is 1μm to 5μm.

[0033] Optionally, the manifold guiding layer and the nanoporous layer of the phase change heat dissipation module are fabricated on the same wafer substrate.

[0034] Optionally, a first sealing gasket is provided between the edge of the flexible power generation module and the annular fixed top cover, and a second sealing gasket is provided between the edge of the flexible power generation module and the annular fixed base.

[0035] Optionally, the thickness of the flexible power generation module is 400μm~500μm, the thickness of the anode layer is 150μm~200μm, the thickness of the cathode layer is 150μm~200μm, the thickness of the battery negative electrode is 150μm~200μm, the thickness of the battery positive electrode is 150μm~200μm, and the thickness of the flexible hydrophobic layer is 400nm~600nm.

[0036] Optionally, an external load, including a sensor, is connected between the negative terminal and the positive terminal of the battery.

[0037] As described above, the integrated heat dissipation and power generation device and its preparation method of the present invention have the following beneficial effects: a phase change heat dissipation module is constructed by sequentially stacking a manifold guide layer, a nanoporous layer, and a capillary channel layer. The phase change heat dissipation module is designed with a liquid inlet, a liquid outlet, and a steam outlet, as well as a guide manifold connecting the liquid inlet and the liquid outlet, so as to achieve efficient liquid flow and heat exchange. The capillary channel layer serves as a pressure transition layer between the manifold guide layer and the nanoporous layer, and is responsible for actively guiding the flow through capillary force to replenish the liquid working medium to the nanoporous layer. A flexible power generation module is constructed by sequentially stacking an anode layer, a proton exchange membrane, a cathode layer, and a battery negative electrode and a battery positive electrode that are in contact with the anode layer and are in contact with the cathode layer. The edge of the flexible power generation module is sealed and fixed between an annular fixed base and an annular fixed top cover. The fixed base is then bonded to the manifold guide layer of the phase change heat dissipation module to form a device integrating heat dissipation and power generation functions. After the liquid heat dissipation medium enters the phase change heat dissipation module, it absorbs heat and undergoes a phase change, transforming from a liquid to a vapor state, thereby dissipating the heat generated by the integrated circuit and completing the heat dissipation process. Next, the discharged vaporized medium is guided to the flexible power generation module, where it is converted into electrical energy through an electrochemical reaction, realizing the energy recovery and reuse of waste heat. This design not only improves the heat dissipation efficiency of the integrated circuit but also significantly enhances energy utilization efficiency and reduces energy waste by utilizing waste heat to generate electricity. It also provides strong support for improving the performance, reliability, and lifespan of the integrated circuit, achieving the beneficial effects of improved energy utilization efficiency, reduced heat dissipation costs, and enhanced device reliability. Attached Figure Description

[0038] Figure 1 The diagram shown is a flowchart illustrating the preparation method of the integrated heat dissipation and power generation device of the present invention.

[0039] Figure 2 The diagram shown is a cross-sectional structural schematic of the phase change heat dissipation module of the present invention.

[0040] Figures 3 to 9 The diagram shows a cross-sectional structure of each step in the preparation method of the phase change heat dissipation module of the present invention.

[0041] Figure 10 The diagram shown is a three-dimensional structural schematic of the flexible power generation module of the present invention.

[0042] Figure 11 The diagram shown is a cross-sectional structural schematic of the flexible power generation module of the present invention.

[0043] Figures 12 to 16 The diagram shows the cross-sectional structure of each step in the preparation method of the flexible power generation module of the present invention.

[0044] Figure 17The diagram shows a cross-sectional view of the sealing gasket of the present invention placed at the edge of the flexible power generation module.

[0045] Figure 18 The diagram shown is a cross-sectional structural schematic of the fixed base of the present invention.

[0046] Figure 19 The diagram shows a cross-sectional view of the flexible power generation module of the present invention being sealed and fixed between the fixed base and the fixed top cover.

[0047] Figure 20 The diagram shows a cross-sectional structure of the fixed base of the flexible power generation module of the present invention bonded to the manifold guide layer of the phase change heat dissipation module.

[0048] Figure 21 The diagram shows a three-dimensional structure of the fixed base of the flexible power generation module of the present invention bonded to the manifold guide layer of the phase change heat dissipation module.

[0049] Figure 22 The diagram shown is a test diagram of the heat dissipation performance of the integrated heat dissipation and power generation device of the present invention.

[0050] Figure 23 The graph shown is a power generation characteristic curve of the integrated heat dissipation and power generation device of the present invention.

[0051] Component labeling: 1 Phase change heat dissipation module, 11 First wafer, 110 Nano porous layer, 111 Manifold flow guide layer, 12 Micro-via array, 13 Flow guide manifold, 131 Flow guide manifold shallow groove, 141 Liquid inlet, 142 Liquid outlet, 15 Second wafer, 150 Capillary channel layer, 16 Capillary microfluidic channel, 17 Steam outlet, 2 Flexible power generation module, 21 Proton exchange membrane, 22 Platinum-ruthenium catalyst slurry, 23 First carbon paper, 24 Anode layer, 25 Platinum catalyst slurry, 26 Second carbon paper, 27 Cathode layer, 28 Battery negative electrode, 29 Battery positive electrode, 30 Sealing gasket, 301 First sealing gasket, 302 Second sealing gasket, 31 Annular fixing base, 311 Exhaust groove, 312 Annular opening of the annular fixing base, 32 Annular fixing top cover, 33 Bolt, 34 Flexible hydrophobic layer, steps S1~S5. Detailed Implementation

[0052] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0053] Please see Figures 1 to 23 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0054] This embodiment provides a method for preparing an integrated heat dissipation and power generation device, such as... Figure 1 As shown, the preparation method includes:

[0055] S1, a phase change heat dissipation module is provided, the phase change heat dissipation module comprising a manifold guide layer, a nanoporous layer, and a capillary channel layer stacked sequentially; wherein, the manifold guide layer includes an inlet and an outlet extending from the surface of the manifold guide layer toward the nanoporous layer, and a steam outlet penetrating the center of the manifold guide layer; the nanoporous layer has a micro-perforation array at the position corresponding to the steam outlet, and a guide manifold is formed extending from the surface of the nanoporous layer in contact with the capillary channel layer toward the manifold guide layer, the guide manifold connecting the inlet and the outlet; the capillary channel layer has a plurality of capillary microchannels at the position corresponding to the micro-perforation array of the nanoporous layer.

[0056] S2, providing a flexible power generation module, the flexible power generation module including an anode layer, a proton exchange membrane, a cathode layer stacked in sequence, and a battery negative electrode and a battery positive electrode connected in contact with the anode layer;

[0057] S3, a flexible hydrophobic layer is formed on the cathode layer of the flexible power generation module;

[0058] S4, an annular fixed base and an annular fixed top cover are provided, and the edge of the flexible power generation module on which the flexible hydrophobic layer is formed is sealed and fixed between the annular fixed base and the annular fixed top cover. The anode layer is close to the annular fixed base, the cathode layer is close to the annular fixed top cover, and an exhaust groove is provided on the surface of the annular fixed base that contacts the anode layer.

[0059] S5, the annular fixing base is bonded to the manifold guide layer of the phase change heat dissipation module, and the annular openings of the annular fixing base and the annular fixing top cover correspond to the position of the steam outlet of the phase change heat dissipation module.

[0060] It should be noted that the execution order of the above steps is not limited to this embodiment. In other embodiments, steps S2-S4, S1, and S5 can be performed in that order, or steps S1 and S2-S4 can be performed simultaneously, with step S5 performed last. The actual execution steps are performed according to the process requirements.

[0061] The fabrication method of the integrated heat dissipation and power generation device in this embodiment constructs a phase change heat dissipation module by sequentially stacking a manifold guide layer, a nanoporous layer, and a capillary channel layer. The phase change heat dissipation module is designed with a liquid inlet, a liquid outlet, and a vapor outlet, as well as a guide manifold connecting the liquid inlet and outlet to achieve efficient liquid flow and heat exchange. The capillary channel layer serves as a pressure transition layer between the manifold guide layer and the nanoporous layer, responsible for actively guiding the liquid flow to replenish the liquid working medium to the nanoporous layer through capillary force. A flexible power generation module is constructed by sequentially stacking an anode layer, a proton exchange membrane, a cathode layer, and a battery negative electrode connected to the anode layer and a battery positive electrode connected to the cathode layer. The edge of the flexible power generation module is sealed and fixed between an annular fixed base and an annular fixed top cover. The fixed base is then bonded to the manifold guide layer of the phase change heat dissipation module, forming a device integrating heat dissipation and power generation functions. After the liquid heat dissipation working medium enters the phase change heat dissipation module, it absorbs heat and undergoes a phase change, transforming from a liquid to a vapor state, thereby dissipating the heat generated by the integrated circuit and completing the heat dissipation process. Next, the discharged gaseous working fluid is guided to the flexible power generation module, where it is converted into electrical energy through an electrochemical reaction, realizing the energy recovery and reuse of waste heat. This design not only improves the heat dissipation efficiency of integrated circuits, but also significantly improves energy utilization efficiency and reduces energy waste by utilizing waste heat to generate electricity. At the same time, it provides strong support for the performance release, reliability improvement and life extension of integrated circuits, achieving the beneficial effects of improving energy utilization efficiency, reducing heat dissipation costs and enhancing device reliability.

[0062] The preparation method of the integrated heat dissipation and power generation device of this embodiment will be described in detail below with reference to the specific accompanying drawings.

[0063] like Figure 2As shown, step S1 is performed first, providing a phase change heat dissipation module 1. The phase change heat dissipation module 1 includes a manifold guide layer 111, a nanoporous layer 110, and a capillary channel layer 150 stacked sequentially. The manifold guide layer 111 includes an inlet 141 and an outlet 142 extending from the surface of the manifold guide layer 111 towards the nanoporous layer 110, and a steam outlet 17 located at the center of the manifold guide layer 111. The nanoporous layer 110 and the... The steam outlet 17 has a micro-perforation array 12 at the corresponding position, and a flow manifold 13 is formed in the manifold flow guide layer 111 extending from the surface of the nanoporous layer 110 in contact with the capillary channel layer 150 towards the manifold flow guide layer 111. The flow manifold 13 connects the liquid inlet 141 and the liquid outlet 142. The capillary channel layer 150 and the micro-perforation array 12 of the nanoporous layer 110 have a plurality of capillary micro-flow grooves 16 at the corresponding positions.

[0064] As a specific example, see [reference] Figures 3 to 9 The method for preparing the phase change heat dissipation module 1 includes:

[0065] S11, such as Figure 3 As shown, a first wafer 11 is provided, the first wafer 11 having opposing first and second surfaces. Preferably, before proceeding to subsequent steps, the method further includes a step of ultrasonically cleaning the first wafer 11 sequentially with acetone, anhydrous ethanol, and deionized water to remove surface contaminants, and then drying it with nitrogen gas.

[0066] S12, as Figure 5 As shown, the micro-via array 12 and the flow manifold 13 are formed on the first surface of the first wafer 11 using photolithography and etching processes, wherein, as Figure 4 As shown, the microvia array 12 and the shallow manifold trench 131 are formed on the first surface of the first wafer 11 using a shallow silicon etching process, and then the manifold 13 is formed based on the shallow manifold trench 131. Figure 6As shown, the liquid inlet 141 and the liquid outlet 142 are formed on the second surface of the first wafer 11 using photolithography and etching processes. The photolithography process for forming the liquid inlet 141 and the liquid outlet 142 includes, for example, deep ultraviolet lithography and deep silicon etching. The actual process of step S12 may include multi-step etching of the SiO2 layer and the polysilicon layer. The positions of the liquid inlet 141 and the liquid outlet 142 are generally located at the edge of the phase change heat dissipation module 1 formed subsequently by cutting, and can be adjusted as needed. Preferably, before proceeding to the subsequent steps, a step is also included to form a first positioning mark on the surface of the first wafer 11 using a laser direct writing process. The laser wavelength used in this laser direct writing process is, for example, 405nm, the laser power is, for example, 300mW, the maximum accuracy is 0.3µm, and the maximum scanning speed is 13mm. 2 / min, capable of processing wafers ranging from 2 inches to 8 inches in size.

[0067] S13, as Figure 7 As shown, a second wafer 15 is provided. Preferably, before proceeding to subsequent steps, the second wafer 15 is further subjected to ultrasonic cleaning with acetone, anhydrous ethanol and deionized water in sequence to remove surface contaminants, and then dried with nitrogen gas.

[0068] S14, as Figure 7 As shown, the second wafer 15 is etched using a photolithography process to form a plurality of capillary micro-flow grooves 16 on the second wafer 15. All the capillary micro-flow grooves 16 are parallel to each other and periodically arranged. The capillary micro-flow grooves 16 are straight grooves or wavy grooves. The photolithography process includes, for example, deep ultraviolet lithography and deep silicon etching. Preferably, before performing subsequent steps, a step of forming a second positioning mark on the surface of the second wafer 15 using a laser direct writing process is also included. The laser wavelength used in this laser direct writing process is, for example, 405nm, the laser power is, for example, 300mW, the maximum accuracy is 0.3µm, and the maximum scanning speed is 13mm. 2 / min, capable of processing wafers ranging from 2 inches to 8 inches in size.

[0069] S15, perform surface pretreatment on the first wafer 11 obtained in step S12 and the second wafer 15 obtained in step S14, including but not limited to cleaning, drying, and surface activation steps, to meet the bonding conditions, such as... Figure 8 As shown, the first positioning mark and the first positioning mark are then aligned, and the surface of the first wafer 11 with the microvia array 12 is bonded to the surface of the second wafer 15 with the capillary microchannels 16 using a vacuum bonding machine, wherein the capillary microchannels 16 correspond in position to the microvia array 12. Specifically, the vacuum level of this vacuum bonding environment is, for example, no higher than 2*10⁻⁶. -6During the bonding process, the pressure applied to the first wafer 11 and the second wafer 15 is, for example, 500N~4000N. As an example, the first wafer 11 is a silicon-on-insulator (SOI) wafer or a silicon wafer (SOI-like wafer) with silicon dioxide (SiO2) and polycrystalline silicon formed on its surface. The second wafer 15 is a silicon wafer. The surface of the first wafer 11 with the microvia array 12 and the surface of the second wafer 15 with the capillary microflow grooves 16 are bonded by silicon fusion bonding. Next, the bonded structure can be annealed at 900°C for 4 hours in a tube furnace to eliminate internal stress. The process parameters for this annealing treatment can be set according to process requirements.

[0070] S16, as Figure 9 As shown, the first wafer 11 is etched using a photolithography process to form the steam outlet 17, which at least exposes the micro-via array 12.

[0071] S17, as shown Figure 9 As shown, the phase change heat dissipation module 1 is formed by dicing. Specifically, the portion of the first wafer 11 that forms the micro-via array 12 is formed as the nanoporous layer 110, and the remaining portion is formed as the manifold guiding layer 111. The second wafer becomes the capillary channel layer 150.

[0072] It should be noted that the execution order of the above steps is not limited to this embodiment. In other embodiments, steps S13, S14, S11, S12, S15, S16, and S17 can be performed in the order of S13, S14, S11, S12, S15, S16, and S17. Alternatively, relatively independent steps S13-S14 and steps S11-S12 can be performed simultaneously, with steps S15-S17 performed last. The actual execution steps are performed according to the process requirements.

[0073] like Figure 10 and Figure 11 As shown, step S2 is then performed to provide a flexible power generation module 2, which includes an anode layer 24, a proton exchange membrane 21, a cathode layer 27 stacked in sequence, as well as a battery negative electrode 28 that is in contact with the anode layer 24 and a battery positive electrode 29 that is in contact with the cathode layer 27.

[0074] As a specific example, see [reference] Figures 12 to 16 The method for preparing the flexible power generation module 2 includes:

[0075] S21, providing an untreated proton exchange membrane, placing the untreated proton exchange membrane sequentially in a water bath of deionized water, hydrogen peroxide solution, dilute sulfuric acid solution, and then heating it in deionized water, followed by repeated rinsing with deionized water. This process is repeated until the untreated proton exchange membrane changes from yellowish to clean and transparent, yielding the proton exchange membrane 21 (as shown in the image). Figure 12 (As shown).

[0076] As a further specific example, the steps include: first, placing the untreated proton exchange membrane, cut to a preset size, into a clean beaker, adding 200 ml of deionized water to the beaker, and then heating the beaker in an 80°C water bath for 1 hour; next, pouring the deionized water from the beaker into a waste liquid tank, adding 200 ml of a 3 wt% hydrogen peroxide solution, and then heating the beaker in an 80°C water bath for 1 hour, stirring continuously to remove gas; next, pouring the hydrogen peroxide solution from the beaker into the waste liquid tank, adding 200 ml of a 0.5 mol / L dilute sulfuric acid solution, and then heating the beaker in an 80°C water bath for 1 hour; next, pouring the dilute sulfuric acid solution from the beaker into the waste liquid tank, adding 200 ml of deionized water, and then heating the beaker in an 80°C water bath for half an hour, and then rinsing repeatedly with deionized water, repeating the above steps until a clean and transparent proton exchange membrane 21 is obtained, and then immersing it in a petri dish containing deionized water for storage and later use.

[0077] S22 provides uniformly dispersed platinum-ruthenium catalyst slurry 22 and platinum catalyst slurry 25, such as Figure 13 As shown, the platinum-ruthenium catalyst slurry 22 is sprayed onto the first carbon paper 23 to form the anode layer 24; as Figure 14 As shown, the platinum catalyst slurry 25 is sprayed onto the second carbon paper 26 to form the cathode layer 27.

[0078] As a further specific example, the steps for forming the cathode layer 27 include: first, taking 100 mg of platinum / carbon (Pt / C) and placing it in a centrifuge tube, adding 10 ml of deionized water and isopropanol, and 0.93 mL of a 5% (w / w) perfluorosulfonic acid resin (Nafion) solution; then, dispersing the platinum catalyst evenly by crushing with a crusher and ultrasonic oscillation; obtaining a platinum catalyst slurry with a Nafion mass fraction of 30%; then, calculating its theoretical weight gain according to the catalyst layer loading, and weighing the cut SGL carbon paper with a microporous structure (specifically the second carbon paper 26) on a balance; then, placing the second carbon paper 26 on a 60°C heating stage, and evenly spraying it onto the second carbon paper 26 with a spray gun containing the evenly dispersed platinum catalyst slurry 25, and weighing it after the slurry dries; then, repeating the step of spraying the platinum catalyst slurry 25 with a spray gun until the actual weight gain of the platinum catalyst slurry 25 film layer reaches the theoretically calculated value, thus completing the preparation of the cathode layer 27 of the flexible power generation module 2. The anode layer 24 is prepared using similar steps. The thickness of the first carbon paper 23 is, for example, 0.3 mm to 0.5 mm, and the thickness of the second carbon paper 26 is, for example, 0.3 mm to 0.5 mm. The mass fraction and volume of the solution used, the thickness of the first carbon paper 23, and the thickness of the second carbon paper 26 are not limited to this embodiment. During operation, the platinum-ruthenium catalyst of the anode layer 24 is in direct contact with the gaseous heat dissipation medium, generating carbon dioxide (CO2), hydrogen ions, and electrons through the catalytic action of the platinum-ruthenium catalyst. The proton exchange membrane 21 allows hydrogen ions to pass through unidirectionally while isolating the movement of other ions. The cathode layer 27 is coated with a platinum catalyst and comes into contact with oxygen in the air, causing hydrogen ions and electrons to undergo a reduction reaction with oxygen in the environment at the cathode layer 27 to generate water.

[0079] S23, as Figure 15 As shown, the anode layer 24, the proton exchange membrane 21, and the cathode layer 27 are sequentially stacked and hot-pressed for fixation. Example, the hot-pressing pressure is 15 MPa, the hot-pressing temperature is 135°C, and the hot-pressing time is 5 min.

[0080] S24, as shown Figure 16 As shown, a first silver foil cut to a preset size is provided and pasted onto the anode layer 24 to form the negative electrode 28 of the battery; a second silver foil cut to a preset size is provided and pasted onto the cathode layer 27 to form the positive electrode 29 of the battery.

[0081] Next, step S3 is performed, where a flexible hydrophobic layer 34 is formed on the cathode layer 27 of the flexible power generation module 2 (see reference). Figure 21 ).

[0082] As an example, the flexible hydrophobic layer 34 can be formed on the cathode layer 27 of the flexible power generation module 2 using a low-temperature magnetron sputtering process. The thickness of the flexible hydrophobic layer 34 is, for example, 400 nm to 600 nm. Utilizing the adaptive liquid replenishment structure of the flexible hydrophobic layer 34, the humidity of the proton exchange membrane 21 can be maintained at 60% to 80%.

[0083] like Figure 17 and Figure 19 As shown, next step S4 is performed, providing an annular fixing base 31 and an annular fixing top cover 32. For example, the edge of the flexible power generation module 2, on which the flexible hydrophobic layer 34 is formed, is sealed and fixed between the annular fixing base 31 and the annular fixing top cover 32 by bolts 33 and sealing gaskets 30. The anode layer 24 is close to the annular fixing base 31, and the cathode layer 27 is close to the annular fixing top cover 32. Figure 18 As shown, the shape of the annular fixing base 31 includes, but is not limited to, square rings, circular rings, and irregular rings. An exhaust groove 311 is provided on the surface of the annular fixing base 31 that contacts the anode layer 24 to discharge excess carbon dioxide during power generation. Specifically, a first sealing gasket 301 is provided between the edge of the flexible power generation module 2 and the annular fixing top cover 32, and a second sealing gasket 302 is provided between the edge of the flexible power generation module 2 and the annular fixing base 31.

[0084] like Figure 20 and Figure 21 As shown, step S5 is then performed, whereby the annular fixing base 31 is bonded to the manifold guide layer 111 of the phase change heat dissipation module 1, and the annular openings of the annular fixing base 31 and the annular fixing top cover 32 correspond to the position of the steam outlet 17 of the phase change heat dissipation module 1.

[0085] Specifically, the annular fixing base 31 can be bonded to the manifold guide layer 111 of the phase change heat dissipation module 1 using a soft adhesive bonding method.

[0086] During operation, the liquid heat dissipation medium enters the phase change heat dissipation module 1 through the inlet 141, and flows through the manifold guide layer 111 and the capillary channel layer 150 in sequence, before reaching the nanoporous layer 110. The liquid heat dissipation medium absorbs a large amount of heat from the heat source at the nanoporous layer 110 and undergoes a phase change reaction to transform into a vapor heat dissipation medium. The vapor heat dissipation medium is discharged from the phase change heat dissipation module 1 through the steam outlet 17, thus completing the heat dissipation function of the integrated heat dissipation and power generation device in this embodiment. Next, the gaseous heat dissipation medium is discharged through the steam outlet 17, contacts the flexible power generation module 2, and passes through the anode layer 24. The platinum-ruthenium catalyst in the anode layer 24 catalyzes the generation of carbon dioxide (CO2), hydrogen ions, and electrons. The carbon dioxide is discharged through the exhaust channel 311, and the hydrogen ions are transferred from the anode layer 24 to the cathode layer 27 via the proton exchange membrane 21. Electrons flow from the anode layer 24 through the negative electrode 28 of the battery, through the external load, and finally through the positive electrode 29 of the battery to the cathode layer 27. At the cathode layer 27, the hydrogen ions and electrons undergo a reduction reaction with oxygen in the environment to generate water. The power generation function of the integrated heat dissipation and power generation device of this embodiment is completed when electrons flow through the external load. The liquid heat dissipation medium can, exemplarily, be a mixture of deionized water and methanol in a mixing ratio of 5.25:1 to 4:1.

[0087] This embodiment also provides an integrated heat dissipation and power generation device, see reference. Figures 2 to 21 The integrated device includes:

[0088] Phase change heat dissipation module 1; comprising a manifold guide layer 111, a nanoporous layer 110, and a capillary channel layer 150 stacked sequentially; wherein, the manifold guide layer 111 includes an inlet 141 and an outlet 142 extending from the surface of the manifold guide layer 111 toward the nanoporous layer 110, and a steam outlet 17 penetrating the center of the manifold guide layer 111; the nanoporous layer 110 has micro-perforations at positions corresponding to the steam outlet 17. The micro-perforated array 12 is provided, and a flow manifold 13 is formed in the manifold flow guide layer 111 from the surface of the nanoporous layer 110 that contacts the capillary channel layer 150. The flow manifold 13 connects the liquid inlet 141 and the liquid outlet 142. The capillary channel layer 150 and the micro-perforated array 12 of the nanoporous layer 110 have a plurality of capillary microchannels 16 at the corresponding positions.

[0089] The flexible power generation module 2 includes an anode layer 24, a proton exchange membrane 21, a cathode layer 27 stacked in sequence, a battery negative electrode 28 connected in contact with the anode layer 24, and a battery positive electrode 29 connected in contact with the cathode layer 27.

[0090] A flexible hydrophobic layer 34 is formed on the cathode layer 27 of the flexible power generation module 2;

[0091] An annular fixed base 31 and an annular fixed top cover 32 are used to seal and fix the edge of the flexible power generation module 2, on which the flexible hydrophobic layer 34 is formed, between the annular fixed base 31 and the annular fixed top cover 32. The anode layer 24 is close to the annular fixed base 31, and the cathode layer 27 is close to the annular fixed top cover 32. An exhaust groove 311 is provided on the surface of the annular fixed base 31 that contacts the anode layer 24. The annular fixed base 31 is bonded to the manifold guide layer 111 of the phase change heat dissipation module 1. The annular openings of the annular fixed base 31 and the annular fixed top cover 32 correspond to the position of the steam outlet 17 of the phase change heat dissipation module 1.

[0092] The integrated heat dissipation and power generation device can be prepared using the above-described preparation method, but it is not limited to this method. Other suitable preparation methods are also possible, and the beneficial effects they can achieve can be found in the specific description of the preparation method, which will not be repeated here.

[0093] As an example, the phase change heat dissipation module 1 has a thickness of 500μm to 700μm; the manifold flow guiding layer 111 has a thickness of 300μm to 500μm; the liquid inlet 141 has a depth of 100μm to 300μm; the liquid outlet 142 has a depth of 100μm to 300μm; the nanoporous layer 110 has a thickness of 400nm to 600nm; the micro-via array 12 has a width of 100nm to 300nm and a spacing of 20nm to 200nm; the capillary microfluidic channel 16 has a width of 2μm to 10μm; the capillary microfluidic channel 16 has a spacing of 0.5μm to 1μm and a depth of 1μm to 5μm.

[0094] As an example, the thickness of the flexible power generation module 2 is 400μm~500μm, the thickness of the anode layer 24 is 150μm~200μm, the thickness of the cathode layer 27 is 150μm~200μm, the thickness of the battery negative electrode 28 is 150μm~200μm, the thickness of the battery positive electrode 29 is 150μm~200μm, and the thickness of the flexible hydrophobic layer 34 is 400nm~600nm.

[0095] Since the structural strength of the nanoporous layer 110 is low, as a preferred example, the manifold guiding layer 111 and the nanoporous layer 110 of the phase change heat dissipation module 1 are formed on the same wafer substrate, which includes, but is not limited to, SOI wafers or silicon wafers with SiO2 and polycrystalline silicon formed on their surface.

[0096] As an example, the edge of the flexible power generation module 2, on which the flexible hydrophobic layer 34 is formed, is sealed and fixed between the annular fixed base 31 and the annular fixed top cover 32 by a sealing gasket 30. A first sealing gasket 301 is provided between the edge of the flexible power generation module 2 and the annular fixed top cover 32, and a second sealing gasket 302 is provided between the edge of the flexible power generation module 2 and the annular fixed base 31.

[0097] As an example, an external load, including a sensor, is connected between the negative electrode 28 and the positive electrode 29 of the battery. During operation, the liquid heat dissipation medium enters the phase change heat dissipation module 1 through the inlet 141, flows through the manifold guide layer 111 and the capillary channel layer 150, and then flows to the nanoporous layer 110. The liquid heat dissipation medium absorbs a large amount of heat from the heat source at the nanoporous layer 110 and undergoes a phase change reaction to transform into a vapor heat dissipation medium. The vapor heat dissipation medium is discharged from the phase change heat dissipation module 1 through the outlet 17, thus completing the heat dissipation function of the integrated heat dissipation and power generation device of this embodiment. Next, the gaseous heat dissipation medium is discharged through the steam outlet 17, contacts the flexible power generation module 2, and passes through the anode layer 24. The platinum-ruthenium catalyst in the anode layer 24 catalyzes the generation of carbon dioxide (CO2), hydrogen ions, and electrons. The carbon dioxide is discharged through the exhaust channel 311. Hydrogen ions are transferred from the anode layer 24 to the cathode layer 27 via the proton exchange membrane 21. Electrons flow from the anode layer 24 through the negative electrode 28 of the battery, through the external load, and finally through the positive electrode 29 of the battery to the cathode layer 27. Hydrogen ions and electrons undergo a reduction reaction with oxygen in the environment at the cathode layer 27 to generate water. The power generation function of the integrated heat dissipation and power generation device of this embodiment is completed when electrons flow through the external load. The liquid heat dissipation medium can, exemplarily, be a mixture of deionized water and methanol in a mixing ratio of 5.25:1 to 4:1.

[0098] To test the performance of the integrated heat dissipation and power generation device of this embodiment, its heat dissipation performance and power generation performance were tested separately. Using a 4 mol / L methanol solution as the liquid heat dissipation medium within the platform, the heat dissipation performance of the integrated heat dissipation and power generation device was tested under different liquid heat dissipation medium flow rates. Figure 22 This indicates that the highest heat flux density of the phase change heat dissipation microchannel can reach 3300 W / cm². 2 The higher the flow rate of the liquid heat dissipation medium, the slower the temperature rise of the device, and the better the heat dissipation performance of the integrated heat dissipation and power generation device. Furthermore, the integrated heat dissipation and power generation device in this embodiment still exhibits good heat dissipation performance even at low fluid flow rates. (Using 12*21mm...) 2 Taking the heat dissipation structure as an example, its corresponding power generation structure adopts a 7*14 mm... 2The rectangular design (i.e., the fixed base 31 is 7*14 mm) 2 The power generation characteristic curve of the integrated heat dissipation and power generation device using 4 mol / L methanol aqueous solution as the working fluid is shown in the figure below, under the conditions of a liquid inlet flow rate of 3 ml / min and a stable temperature of the device under test at 65℃. Figure 23 As shown, the open-circuit voltage of the integrated heat dissipation and power generation device is 0.2852V, and the maximum output power is 1.414mW when the current density is 10mA.

[0099] In summary, the integrated heat dissipation and power generation device and its preparation method of the present invention construct a phase change heat dissipation module by sequentially stacking a manifold guide layer, a nanoporous layer, and a capillary channel layer. The phase change heat dissipation module is designed with a liquid inlet, a liquid outlet, and a steam outlet, as well as a guide manifold connecting the liquid inlet and the liquid outlet to achieve efficient liquid flow and heat exchange. The capillary channel layer serves as a pressure transition layer between the manifold guide layer and the nanoporous layer, and is responsible for actively guiding the liquid flow through capillary force to replenish the liquid working fluid to the nanoporous layer. A flexible power generation module is constructed by sequentially stacking an anode layer, a proton exchange membrane, a cathode layer, and a battery negative electrode and a battery positive electrode that are in contact with the anode layer and are in contact with the cathode layer. The edge of the flexible power generation module is sealed and fixed between an annular fixed base and an annular fixed top cover. The fixed base is then bonded to the manifold guide layer of the phase change heat dissipation module to form a device integrating heat dissipation and power generation functions. After the liquid heat dissipation medium enters the phase change heat dissipation module, it absorbs heat and undergoes a phase change, transforming from a liquid to a vapor state, thereby dissipating the heat generated by the integrated circuit and completing the heat dissipation process. Next, the discharged vaporized medium is guided to the flexible power generation module, where it is converted into electrical energy through an electrochemical reaction, realizing the energy recovery and reuse of waste heat. This design not only improves the heat dissipation efficiency of the integrated circuit but also significantly enhances energy utilization efficiency and reduces energy waste by utilizing waste heat to generate electricity. It also provides strong support for improving the performance, reliability, and lifespan of the integrated circuit, achieving the beneficial effects of improved energy utilization efficiency, reduced heat dissipation costs, and enhanced device reliability. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0100] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A method for preparing an integrated heat dissipation and power generation device, characterized in that, The preparation method includes: A phase change heat dissipation module is provided, comprising a manifold guide layer, a nanoporous layer, and a capillary channel layer stacked sequentially. The manifold guide layer includes an inlet and an outlet extending from its surface toward the nanoporous layer, and a steam outlet penetrating the center of the manifold guide layer. The nanoporous layer has a micro-perforation array at positions corresponding to the steam outlet, and a guide manifold extends from the surface of the nanoporous layer in contact with the capillary channel layer toward the manifold guide layer, forming a guide manifold connecting the inlet and the outlet. The capillary channel layer has several capillary microchannels at positions corresponding to the micro-perforation array of the nanoporous layer. A flexible power generation module is provided, comprising an anode layer, a proton exchange membrane, and a cathode layer stacked sequentially, as well as a battery negative electrode in contact with the anode layer and a battery positive electrode in contact with the cathode layer; A flexible hydrophobic layer is formed on the cathode layer of the flexible power generation module; An annular fixed base and an annular fixed top cover are provided. The edge of the flexible power generation module on which the flexible hydrophobic layer is formed is sealed and fixed between the annular fixed base and the annular fixed top cover. The anode layer is close to the annular fixed base, the cathode layer is close to the annular fixed top cover, and an exhaust groove is provided on the surface of the annular fixed base that contacts the anode layer. The annular fixing base is bonded to the manifold guide layer of the phase change heat dissipation module, and the annular openings of the annular fixing base and the annular fixing top cover correspond to the position of the steam outlet of the phase change heat dissipation module.

2. The method for preparing the integrated heat dissipation and power generation device according to claim 1, characterized in that, The method for preparing the phase change heat dissipation module includes: A first wafer is provided, the first wafer having opposing first and second sides; The micro-via array and the flow manifold are formed on the first surface of the first wafer, and the liquid inlet and the liquid outlet are formed on the second surface of the first wafer; Provide a second wafer; The second wafer is etched using a photolithography process to form a plurality of capillary microflow grooves on the second wafer; The surface of the first wafer having the micro-via array is bonded to the surface of the second wafer having the capillary micro-flow grooves, wherein the capillary micro-flow grooves correspond to the positions of the micro-via arrays; The first wafer is etched using a photolithography process to form the steam outlet, the steam outlet at least exposing the micro-via array; Cut to form the phase change heat dissipation module.

3. The method for preparing the integrated heat dissipation and power generation device according to claim 2, characterized in that: The first wafer is an SOI wafer or a silicon wafer with SiO2 and polycrystalline silicon formed on its surface, and the second wafer is a silicon wafer; the surface of the first wafer with the micro-via array and the surface of the second wafer with the capillary microchannels are bonded by silicon fusion bonding.

4. The method for preparing the integrated heat dissipation and power generation device according to claim 2, characterized in that: After bonding the surface of the first wafer with the micro-via array to the surface of the second wafer with the capillary micro-flow grooves, the process further includes an annealing step.

5. The method for preparing the integrated heat dissipation and power generation device according to claim 1, characterized in that, The method for preparing the flexible power generation module includes: An untreated proton exchange membrane is provided. The untreated proton exchange membrane is placed in a water bath with deionized water, hydrogen peroxide solution, dilute sulfuric acid solution and deionized water in sequence and heated. Then it is repeatedly rinsed with deionized water. The above steps are repeated until the untreated proton exchange membrane changes from yellow to clean and transparent, thus obtaining the proton exchange membrane. A uniformly dispersed platinum-ruthenium catalyst slurry and a platinum catalyst slurry are provided. The platinum-ruthenium catalyst slurry is sprayed onto a first carbon paper to form the anode layer. The platinum catalyst slurry is sprayed onto a second carbon paper to form the cathode layer. The anode layer, the proton exchange membrane, and the cathode layer are sequentially stacked and hot-pressed to fix them; A first silver foil is provided and adhered to the anode layer to form the negative electrode of the battery; a second silver foil is provided and adhered to the cathode layer to form the positive electrode of the battery.

6. The method for preparing the integrated heat dissipation and power generation device according to claim 1, characterized in that: The flexible hydrophobic layer is formed on the cathode layer of the flexible power generation module using a low-temperature magnetron sputtering process.

7. A heat dissipation and power generation integrated device, characterized in that, The integrated device includes: A phase change heat dissipation module includes a manifold guide layer, a nanoporous layer, and a capillary channel layer stacked sequentially. The manifold guide layer includes an inlet and an outlet extending from its surface toward the nanoporous layer, and a steam outlet penetrating the center of the manifold guide layer. The nanoporous layer has a micro-perforation array at positions corresponding to the steam outlet, and a guide manifold extends from the surface of the nanoporous layer in contact with the capillary channel layer toward the manifold guide layer, forming a guide manifold that connects the inlet and the outlet. The capillary channel layer has several capillary microchannels at positions corresponding to the micro-perforation array of the nanoporous layer. A flexible power generation module includes an anode layer, a proton exchange membrane, a cathode layer stacked sequentially, a negative electrode of a battery in contact with the anode layer, and a positive electrode of a battery in contact with the cathode layer. A flexible hydrophobic layer formed on the cathode layer of the flexible power generation module; An annular fixed base and an annular fixed top cover are provided. The edge of the flexible power generation module, on which the flexible hydrophobic layer is formed, is sealed and fixed between the annular fixed base and the annular fixed top cover. The anode layer is close to the annular fixed base, and the cathode layer is close to the annular fixed top cover. An exhaust groove is provided on the surface of the annular fixed base that contacts the anode layer. The annular fixed base is bonded to the manifold guide layer of the phase change heat dissipation module. The annular openings of the annular fixed base and the annular fixed top cover correspond to the steam outlet position of the phase change heat dissipation module.

8. The integrated heat dissipation and power generation device according to claim 7, characterized in that: The phase change heat dissipation module has a thickness of 500μm to 700μm; the manifold flow guiding layer has a thickness of 300μm to 500μm; the inlet has a depth of 100μm to 300μm; the outlet has a depth of 100μm to 300μm; the nanoporous layer has a thickness of 400nm to 600nm; the micro-vias in the micro-via array have a width of 100nm to 300nm; the spacing between the micro-vias is 20nm to 200nm; the capillary microfluidic channels have a width of 2μm to 10μm; the spacing between the capillary microfluidic channels is 0.5μm to 1μm; and the depth of the capillary microfluidic channels is 1μm to 5μm.

9. The integrated heat dissipation and power generation device according to claim 7, characterized in that: The manifold guiding layer and the nanoporous layer of the phase change heat dissipation module are fabricated on the same wafer substrate.

10. The integrated heat dissipation and power generation device according to claim 7, characterized in that: A first sealing gasket is provided between the edge of the flexible power generation module and the annular fixed top cover, and a second sealing gasket is provided between the edge of the flexible power generation module and the annular fixed base.

11. The integrated heat dissipation and power generation device according to claim 7, characterized in that: The thickness of the flexible power generation module is 400μm~500μm, the thickness of the anode layer is 150μm~200μm, the thickness of the cathode layer is 150μm~200μm, the thickness of the battery negative electrode is 150μm~200μm, the thickness of the battery positive electrode is 150μm~200μm, and the thickness of the flexible hydrophobic layer is 400nm~600nm.

12. The integrated heat dissipation and power generation device according to claim 7, characterized in that: An external load, including a sensor, is connected between the negative terminal and the positive terminal of the battery.

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