Lossless grabbing and precise resetting system for artificial intelligence chip

Abstract

The invention discloses a lossless grabbing and precise resetting system for an artificial intelligence chip, and relates to the technical field of artificial intelligence chip assembly.The lossless grabbing and precise resetting system comprises an anti-static holding module, a holding handle containing a carbon fiber material and a supporting rod, and the surface resistance of the holding handle is 106-109 ohms; the precision adjusting module comprises a screw rod with the screw pitch of 0.1-0.5 mm and a knob with scales, and the sliding fit clearance is smaller than or equal to 0.002 mm; a chip adaptive grabbing module, a titanium-alloy-containing flexible arm and a conductive silica gel contact head are arranged, and 0.1-0.3 mm micro suction holes are formed in the surface of the chip adaptive grabbing module; the visual positioning module comprises a 1280 * 720 pixel camera and an annular light supplementing lamp; and the length adjusting module comprises a stainless steel sleeve, and the adjusting range is 200-400 mm. According to the invention, lossless grabbing and precise resetting of the chip are realized, the device is adaptive to chips of different sizes, the anti-static performance is excellent, the operation is convenient, the assembly and maintenance efficiency and the yield are improved, and the damage risk of the chip is reduced.

Description

Technical Field

[0001] This invention relates to the field of artificial intelligence chip assembly technology, and in particular to a non-destructive gripping and precise reset system for artificial intelligence chips. Background Technology

[0002] As a core component of smart devices, artificial intelligence (AI) chips are increasingly integrated, with pin pitch shrinking to the micrometer level and surface-mount packaging structures becoming more precise. This places extremely high demands on the accuracy and safety of gripping and resetting operations during production, testing, repair, and maintenance. Currently, most tools used for AI chip manipulation in the industry rely on traditional electronic component gripping equipment, which generally suffers from insufficient precision. Most tools employ millimeter-level adjustment mechanisms, failing to achieve nanometer-level displacement control. During chip-slot alignment, even minute deviations can easily lead to pin bending or poor connection. This is especially problematic for high-end chips with pin densities exceeding 1000 pins; even alignment errors of only tens of micrometers can cause irreversible circuit damage.

[0003] Static electricity hazards are another major concern. The transistors inside AI chips are extremely small, with very low breakdown voltages. Traditional gripping tools, often made of ordinary plastic or metal, can easily generate static electricity exceeding 1000V due to friction during handling, far exceeding the chip's 50V electrostatic discharge tolerance limit. This can instantly break down the chip's internal insulation layer, rendering the chip unusable. Even if some tools have simple anti-static treatments on their surfaces, these only reduce the probability of static electricity generation, not completely eliminate its accumulation, and lack a proper discharge channel, leaving a potential risk. Furthermore, the gripping structures of traditional tools are often rigid designs, with contact heads made of hard plastic or metal. The rigid collision with the chip surface during gripping can easily scratch the encapsulation layer. If the chip surface has flexible circuitry or a heat dissipation film, it is even more prone to physical damage, affecting chip performance.

[0004] Insufficient adaptability and ease of operation further constrain industry efficiency. Existing tools are mostly fixed-size designs, with each tool only compatible with one type of chip. However, AI chips vary widely in size, ranging from microchips with sides of 5mm to large computing chips with sides of 30mm. Companies need to stock multiple tools, increasing costs and reducing operational efficiency. Furthermore, the lack of effective positioning assistance during operation relies on operator visual observation and experience, which is not only time-consuming but also prone to errors due to visual biases. For example, during chip reset, failure to accurately align with the slot may damage the chip or the slot interface. These problems collectively result in low yield rates, poor operational efficiency, and high costs in AI chip assembly and repair, failing to meet the industry's demand for high-precision, high-safety, and highly versatile tools. Therefore, a non-destructive gripping and precise reset solution specifically designed for AI chips is urgently needed. Summary of the Invention

[0005] This invention proposes a non-destructive grasping and precise reset system for artificial intelligence chips to solve the problems mentioned in the prior art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a non-destructive grasping and precise reset system for an artificial intelligence chip, comprising the following modules:

[0007] An anti-static grip module includes an anti-static grip and a hollow support rod. The anti-static grip is made of carbon fiber composite material and coated with an anti-static coating. The hollow support rod is also made of carbon fiber composite material and has a transmission channel inside.

[0008] The precision adjustment module includes a fine-tuning knob, a precision lead screw, and a sliding seat. The precision lead screw is made of high-strength alloy material. The fine-tuning knob has an angle scale on its outer periphery and an anti-slip texture on its surface. The sliding seat is sleeved on the precision lead screw and forms a precision threaded fit.

[0009] The chip-adaptive gripping module includes a connecting frame and two symmetrically arranged flexible gripping arms. The connecting frame is made of aluminum alloy and is fixedly connected to the sliding seat by bolts. The flexible gripping arms are made of titanium alloy and are hinged to a fixed pivot in the middle. The end of the flexible gripping arm away from the connecting frame is provided with a chip contact head. The chip contact head is made of conductive silicone with a Shore hardness of 30-40HA and has micro-suction holes with a diameter of 0.1-0.3mm on its surface.

[0010] The visual positioning module includes a miniature camera and an LED fill light, which are connected to an external display device via a data cable; the LED fill light has a ring structure, is arranged around the camera, has a brightness of 300-500 lux, and supports 3 levels of brightness adjustment;

[0011] The length adjustment module includes a sleeve and a locking knob. The sleeve is made of stainless steel, and its inner diameter is in clearance fit with the outer diameter of the hollow support rod, with a clearance of 0.1-0.2 mm. The locking knob is made of plastic and has an internal thread that mates with the external thread of the sleeve. Locking is achieved when the tightening torque is 5-10 N·m.

[0012] Furthermore, it also includes a negative pressure adsorption control module, which comprises a miniature vacuum valve, a vacuum sensor, and a negative pressure adjustment knob. The miniature vacuum valve is electromagnetic, with a response time ≤10ms and an operating voltage of 5-12VDC. The vacuum sensor has a measurement range of -100kPa to 0kPa. The negative pressure setpoint is determined by formula P. set = k×m calculation, where P set The negative pressure setting value is expressed in kPa, where k is the chip quality coefficient and m is the chip mass. The negative pressure adjustment knob is used for manual correction of P. set .

[0013] Furthermore, it also includes a force feedback module, which comprises a miniature pressure sensor and a vibration indicator. The miniature pressure sensor is installed inside the chip contact head; the vibration indicator is an eccentric wheel type with three vibration intensity levels; the contact force threshold is determined by formula F. th =s×σ calculation, where F th Here, s is the contact force threshold, σ is the chip contact area, and σ is the allowable contact stress on the chip surface; when the contact force exceeds F... th The vibration alert will activate at that time.

[0014] Furthermore, the precision adjustment module also includes a displacement scale, which is set along the axis of the precision lead screw, with a length of 50-100mm and a minimum scale value of 0.01mm; the sliding seat is equipped with a pointer, and the alignment accuracy between the pointer and the scale is ≤0.005mm.

[0015] Furthermore, the flexible gripping arm of the chip adapter gripping module is equipped with an angle adjustment bolt. The angle adjustment bolt is made of stainless steel and is threaded with the gripping arm. Rotating the angle adjustment bolt changes the initial angle between the gripping arm and the connecting frame. The adjustment range is 10°-30°, and the side length of the adapter chip is 5-30mm.

[0016] Furthermore, the visual positioning module also includes an image processing unit, which adopts a Cortex-M4 architecture processor with a main frequency of 80-120MHz and 64-128KB of memory. The image processing unit is used to perform edge detection and feature recognition on the images captured by the camera, automatically mark the chip pins and slot positions, and output positioning deviation data to an external display device.

[0017] Furthermore, the grip surface of the antistatic grip module is provided with anti-slip protrusions, the anti-slip protrusions are 1-2mm in diameter, 0.5-1mm in height, and 3-5mm apart; the anti-slip protrusions are made of antistatic rubber material with a Shore hardness of 50-60HA.

[0018] Furthermore, the sleeve surface of the length adjustment module is provided with length scale, with a scale range of 200-400mm and a minimum scale value of 1mm; the relative movement of the sleeve and the hollow support rod is guided by a ball linear guide, the ball linear guide has a rated dynamic load of 50-100N and a movement stability error of ≤0.02mm / 100mm.

[0019] Furthermore, the negative pressure adsorption control module also includes a negative pressure buffer tank with a volume of 10-20 mL and made of transparent acrylic; the negative pressure buffer tank is connected in series with a micro vacuum valve and a micro suction hole, and has a liquid level scale on its surface.

[0020] Furthermore, the pressure sensor and vibration indicator of the force feedback module are connected via a wireless module. The wireless module uses the Bluetooth 5.0 protocol, with a transmission distance of 10-20m and a transmission delay of ≤20ms. The operator wears a wireless vibration wristband to receive the indicator signal, and the vibration intensity of the wristband is positively correlated with the degree to which the contact force exceeds the threshold.

[0021] Compared with existing technologies, the beneficial effects of this invention are:

[0022] In terms of operational precision, the system achieves nanometer-level displacement control through a precision adjustment module, combined with real-time image assistance from a vision positioning module, completely solving the problem of inaccurate alignment in traditional tools. The combination design of a precision lead screw and a fine-tuning knob can accurately control the displacement of the gripping components, ensuring micrometer-level alignment accuracy between the chip and the slot, and avoiding pin bending or loose connections. The vision positioning module can clearly present the positional relationship between the chip and the slot, automatically marking key feature points, eliminating the need for operators to rely on experience judgment, significantly reducing alignment errors, and is especially suitable for high-end chips with dense pins, ensuring a high yield rate for assembly and repair.

[0023] In terms of anti-static and non-destructive protection, the system constructs a full-link anti-static and flexible contact system to effectively avoid the risks of static electricity and physical damage. The anti-static gripping module uses anti-static materials and coatings to reduce static electricity generation at the source, and works with conductive silicone contact heads to form a static discharge channel, completely eliminating the threat of static electricity to the chip. The combination of the flexible gripping arm and the conductive silicone contact head buffers the gripping force through elastic deformation, avoiding rigid collisions. It can stably grip the chip while protecting the chip's surface encapsulation layer, flexible circuits, and heat dissipation film, achieving truly non-destructive operation and solving the problem of traditional rigid tools easily damaging chips.

[0024] In terms of adaptability and flexibility, the system boasts broad compatibility and scenario adaptability, reducing costs and improving efficiency. By adjusting the opening and closing angle and initial angle of the flexible gripping arm, it can accommodate AI chips of different sizes, eliminating the need to stock multiple tools and significantly reducing enterprise costs. The length adjustment module can flexibly adjust the overall length of the tool according to the operating space, enabling convenient operation in both confined equipment interiors and open workbenches, thus enhancing usability.

[0025] In terms of ease of operation and intelligence, the system reduces operational difficulty and improves efficiency through multi-module collaboration. The image processing function of the vision positioning module can automatically identify the chip and slot positions and output positioning deviation data, allowing operators to quickly get started without professional experience. The force feedback module can monitor the contact force in real time and promptly alert when the threshold is exceeded to avoid excessive pressure on the chip. The intelligently adaptable negative pressure adsorption design ensures stable chip gripping and smooth release, reducing operation steps. Overall, the system effectively improves the efficiency and yield of chip assembly and repair, reduces industry costs, and has extremely high practical value. Attached Figure Description

[0026] Figure 1 This is a schematic block diagram of the non-destructive grasping and precise reset system for the artificial intelligence chip proposed in this invention;

[0027] Figure 2 A comparison chart showing the adjustment time of the system versus traditional tools under different chip sizes;

[0028] Figure 3 A comparison chart of chip adsorption stability under negative pressure fluctuations;

[0029] Figure 4 This chart compares the success rates of accurate chip reset in various scenarios. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; and they may refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The invention will now be described in further detail with reference to the accompanying drawings.

[0033] Reference Figures 1 to 4 A non-destructive grasping and precise reset system for an artificial intelligence chip, comprising the following modules:

[0034] The antistatic grip module includes an antistatic grip and a hollow support rod. The antistatic grip is made of carbon fiber composite material with an antistatic coating and a surface resistivity of 10⁶-10⁻¹⁰. 9 Ω, with a grip diameter of 30-40mm; the hollow support rod is made of carbon fiber composite material, with an internal transmission channel, and the overall weight is ≤300g;

[0035] The precision adjustment module includes a fine-tuning knob, a precision lead screw, and a sliding seat. The precision lead screw is made of high-strength alloy material with a pitch of 0.1-0.5mm and a straightness error of ≤0.005mm / m. The fine-tuning knob has an angle scale on its outer circumference with a minimum graduation of 1° and a diameter of 40-50mm. The surface has anti-slip texture. The sliding seat is fitted onto the precision lead screw to form a precision threaded fit with a fit clearance of ≤0.002mm. The straightness of the sliding seat moving along the lead screw axis is ≤0.01mm.

[0036] The chip-adaptive gripping module includes a connecting frame and two symmetrically arranged flexible gripping arms. The connecting frame is made of aluminum alloy and is fixedly connected to the sliding seat by bolts, with a coaxiality error of ≤0.02mm. The flexible gripping arms are made of titanium alloy with a thickness of 1-2mm and an elastic deformation of ≤5mm. They are hinged to a fixed pivot with a diameter of 3-5mm in the middle. A chip contact head is provided at the end of the flexible gripping arm away from the connecting frame. The chip contact head is made of conductive silicone with a Shore hardness of 30-40HA and has micro-suction holes with a diameter of 0.1-0.3mm on its surface.

[0037] The visual positioning module includes a miniature camera and an LED fill light. The miniature camera has a resolution of 1280×720 pixels, a frame rate of 30fps, and a field of view of 60°-90°. It is connected to an external display device via a data cable. The LED fill light has a ring structure, is set around the camera, has a brightness of 300-500 lux, and supports 3 levels of brightness adjustment.

[0038] The length adjustment module includes a sleeve and a locking knob. The sleeve is made of stainless steel, and its inner diameter is in clearance fit with the outer diameter of the hollow support rod, with a clearance of 0.1-0.2mm. The locking knob is made of plastic and has an internal thread that mates with the external thread of the sleeve. Locking is achieved when the tightening torque is 5-10 N·m. The overall length adjustment range of the system is 200-400mm.

[0039] This invention also includes a negative pressure adsorption control module, which comprises a miniature vacuum valve, a vacuum sensor, and a negative pressure adjustment knob. The miniature vacuum valve is electromagnetic, with a response time ≤10ms and an operating voltage of 5-12VDC. The vacuum sensor has a measurement range of -100kPa to 0kPa and an accuracy of ±1kPa. The negative pressure setpoint is determined by formula P. set = k×m calculation, where P set The negative pressure setting value is in kPa (a negative value indicates negative pressure), k is the chip quality coefficient, ranging from 0.5 to 1.2 kPa / g, and m is the chip mass in g; the negative pressure adjustment knob is used for manual correction of P. set The correction range is ±2 kPa.

[0040] This invention also includes a force feedback module, which comprises a miniature pressure sensor and a vibration indicator. The miniature pressure sensor is installed inside the chip contact head, with a measurement range of 0-5N and an accuracy of ±0.01N. The vibration indicator is an eccentric wheel type, with a vibration frequency of 100-200Hz and three vibration intensity levels. The contact force threshold is determined by formula F. th =s×σ calculation, where F th The contact force threshold is expressed in N, and s represents the chip contact area in cm². 2 σ represents the allowable contact stress on the chip surface, ranging from 0.1 to 0.3 N / cm. 2 When the contact force exceeds F th The vibration alert will activate at that time.

[0041] In this invention, the precision adjustment module further includes a displacement scale, which is set along the axis of the precision lead screw, with a length of 50-100mm and a minimum scale value of 0.01mm; the sliding seat is provided with a pointer, and the alignment accuracy between the pointer and the scale is ≤0.005mm.

[0042] In this invention, the flexible gripping arm of the chip adapter gripping module is provided with an angle adjustment bolt. The angle adjustment bolt is made of stainless steel, has a diameter of 3-4 mm, and is threaded with the gripping arm. Rotating the angle adjustment bolt can change the initial angle between the gripping arm and the connecting frame, with an adjustment range of 10°-30° and a chip side length range of 5-30 mm.

[0043] In this invention, the visual positioning module further includes an image processing unit, which adopts a Cortex-M4 architecture processor with a main frequency of 80-120MHz and 64-128KB of memory. The image processing unit is used to perform edge detection and feature recognition on the images captured by the camera, automatically mark the chip pins and slot positions, with a recognition accuracy of ≤0.05mm, a processing delay of ≤50ms, and output positioning deviation data to an external display device.

[0044] In this invention, the grip surface of the antistatic grip module is provided with anti-slip protrusions, the anti-slip protrusions are 1-2mm in diameter, 0.5-1mm in height, and 3-5mm apart; the anti-slip protrusions are made of antistatic rubber material with a Shore hardness of 50-60HA.

[0045] In this invention, the sleeve surface of the length adjustment module is provided with length scale, the scale range is 200-400mm, and the minimum scale value is 1mm; the relative movement of the sleeve and the hollow support rod is guided by a ball linear guide, the ball linear guide has a rated dynamic load of 50-100N, and the movement stability error is ≤0.02mm / 100mm.

[0046] In this invention, the negative pressure adsorption control module further includes a negative pressure buffer tank with a volume of 10-20 mL and made of transparent acrylic; the negative pressure buffer tank is connected in series with a micro vacuum valve and a micro suction hole, and has a liquid level scale on its surface.

[0047] In this invention, the pressure sensor and vibration indicator of the force feedback module are connected via a wireless module. The wireless module uses the Bluetooth 5.0 protocol, with a transmission distance of 10-20m and a transmission delay of ≤20ms. Operators can wear a wireless vibration bracelet to receive the indicator signal. The vibration intensity of the bracelet is positively correlated with the degree to which the contact force exceeds the threshold.

[0048] The following two examples further illustrate the specific implementation of this system:

[0049] Example 1: Non-destructive gripping and precise reset system for assembling high-end AI computing chips (30mm side length, 1200pin pin density)

[0050] I. System Module Deployment and Parameter Refinement

[0051] 1. Implementation of anti-static grip module

[0052] The anti-static grip is molded from carbon fiber composite material, with an overall arc-shaped structure and a 35mm diameter at the grip area, conforming to ergonomic design and ensuring fatigue-free use even after prolonged use. The surface is coated with an epoxy-based anti-static coating with a thickness of 80μm, and testing shows a surface resistivity stable at 5×10⁷Ω (within the range of 10). 6 -10 9 Within the Ω range, the triboelectric voltage is ≤50V. The hollow support rod is 250mm long, 28mm in outer diameter, and 22mm in inner diameter. The smoothness of the inner wall of the internal transmission channel Ra is ≤0.8μm, ensuring smooth movement of the precision adjustment module. The two ends of the support rod are connected to the handle and length adjustment module via M5 threads, with a coaxiality error of ≤0.03mm. The overall weight is 280g (≤300g), balancing lightweight design and structural strength.

[0053] 2. The precision adjustment module and the vision positioning module work together.

[0054] The precision lead screw is made of 40CrNiMoA high-strength alloy, heat-treated (hardness HRC30-35), with a diameter of 8mm, a pitch of 0.2mm, a thread accuracy grade of 5h, and a straightness error of 0.004mm / m (≤0.005mm / m). The two ends of the lead screw are fixed by deep groove ball bearings (model 625ZZ), and the rotational resistance torque is ≤0.01N·m. The fine-tuning knob is made of ABS plastic injection molding with a knurled surface (texture depth 0.5mm). The outer periphery is laser-engraved with angle scales, with a minimum graduation of 1°. Each 1° rotation corresponds to a lead screw axial displacement of 0.00055mm (nanometer-level adjustment). The sliding seat is made of 6061-T6 aluminum alloy, with an inner hole tapped to fit the lead screw with a clearance of 0.0015mm (≤0.002mm). The pointer is fixed on the side of the sliding seat by a countersunk screw, and the alignment accuracy between the pointer tip and the displacement scale (length 80mm, minimum graduation 0.01mm) is 0.004mm (≤0.005mm).

[0055] The miniature camera (model OV2710) of the visual positioning module is fixed to the front of the sliding base. The lens has a focal length of 3.6mm and a field of view of 75°. It is connected to an external 10.1-inch touch screen (1920×1200 resolution) via a USB 2.0 data cable, and transmits 1280×720 pixel images in real time with a stable frame rate of 30fps. A ring LED fill light (12 0603 specification LEDs) surrounds the camera, with three brightness levels (300 / 400 / 500 lux), which can be switched with one key on the touch screen. The fill light uniformity is ≥85%, and it can clearly present the details of the chip pins (pin spacing 0.1mm). The image processing unit uses an STM32F407 microprocessor (168MHz) and runs an edge detection algorithm (Canny operator). It completes the marking of chip pin and slot positions within 100ms with a recognition accuracy of 0.04mm (≤0.05mm) and displays the positioning deviation on the touch screen (e.g., "X-axis deviation +0.03mm, Y-axis deviation -0.02mm").

[0056] 3. Implementation of chip adaptation gripping module and negative pressure adsorption control module

[0057] The connecting frame is made of 5052 aluminum alloy, 5mm thick, and is fixed to the sliding seat by four M3 hex bolts. The bolt tightening torque is 2.5 N·m, and the coaxiality error is 0.015mm (≤0.02mm). The flexible gripping arm is made of TC4 titanium alloy sheet (1.5mm thick), laser-cut, with an elastic deformation of 4mm (≤5mm). It is hinged to a brass fixed pivot (4mm diameter) in the middle, with a pivot clearance of 0.01mm to ensure smooth opening and closing. The chip contact head is made of conductive silicone (with added carbon black conductive particles), with a Shore hardness of 35HA (30-40HA), dimensions of 10mm×5mm×2mm, and laser-drilled holes (0.2mm diameter, 1mm hole spacing). Each contact head has 8 micro-suction holes.

[0058] The micro vacuum valve (model VQ100U) of the negative pressure adsorption control module is connected to the micro-suction port via a Φ4mm air tube, operates at 12VDC, and has a response time of 8ms (≤10ms). The vacuum sensor (model MPX5700) has a range of -100kPa to 0kPa, an accuracy of ±0.8kPa, and collects negative pressure values ​​in real time, displaying them on the touchscreen. This AI computing chip weighs 20g, and according to formula P... set = k×m calculation, take k = 0.8kPa / g, get P set =0.8×20=-16kPa (negative value indicates negative pressure); the actual negative pressure is corrected to -15kPa (correction range ±2kPa) by adjusting the negative pressure knob to ensure stable chip adsorption without damaging the encapsulation layer.

[0059] 4. Implementation of the length adjustment module and force feedback module

[0060] The sleeve is made of 304 stainless steel, 150mm in length, 32mm in outer diameter, and 28mm in inner diameter, with a clearance fit (0.15mm, 0.1-0.2mm) to the hollow support rod. The sleeve surface is laser-engraved with length markings (range 200-400mm, minimum 1mm). A Φ6mm locking hole with an M5 thread is located on the side. The locking knob is made of PA66 plastic and contains an M5 copper nut. When the tightening torque is 8N·m (5-10N·m), the support rod is pressed against the rubber washer for reliable locking. The relative movement between the sleeve and the support rod is achieved using a ball linear guide (model MGN9C), with a rated dynamic load of 80N (50-100N) and a movement smoothness error of 0.015mm / 100mm (≤0.02mm / 100mm).

[0061] The force feedback module's miniature pressure sensor (model FSS1500NS) is embedded inside the chip contact head, with a range of 0-5N and an accuracy of ±0.008N (≤0.01N). The vibration indicator (model PRD-2730) is installed inside the grip, with a vibration frequency of 150Hz and three intensity levels. The chip has a contact area of ​​20cm².2 (10mm×20mm), according to formula F th =s×σ, take σ=0.2N / cm 2 , get F th =20×0.2=4N; When the contact force reaches 4.1N, the vibration indicator starts medium vibration to remind the operator to reduce the gripping force and avoid damage to the chip.

[0062] Table 1: Comparison of Operational Accuracy between the System of Example 1 and Traditional Tools

[0063] Evaluation Project Traditional tools This system Improvement effect Displacement adjustment accuracy 0.01mm 0.00055mm 18 times increase Chip alignment error 0.1-0.2mm ≤0.05mm Significantly reduced Static electricity generates voltage ≥500V ≤50V Significant improvement Chip contact force control No feedback (based on feel) Precise monitoring (±0.01N) Achieve controllability Operation time (per unit) 5-8 minutes 1-2 minutes Efficiency increased by 75%

[0064] Table 1 clearly demonstrates the advantages of this system in high-end AI computing chip assembly scenarios. Traditional tools have a displacement accuracy of only 0.01mm, which cannot meet the alignment requirements of chips with a pin pitch of 0.1mm. The alignment error often exceeds 0.1mm, easily leading to pin damage. This system, through nanometer-level adjustment and visual positioning, achieves an alignment error of ≤0.05mm, fully adapting to high-precision assembly. In terms of electrostatic control, traditional tools generate over 500V of static electricity through friction, far exceeding the chip's tolerance limit. This system, through a full-link anti-static design, achieves an electrostatic voltage of ≤50V, completely eliminating the risk of electrostatic discharge. Operation time is reduced from 5-8 minutes to 1-2 minutes. Due to automatic position marking by visual positioning and force feedback avoiding repeated adjustments, efficiency is greatly improved, while precise control of contact force ensures no chip damage.

[0065] Example 2: Non-destructive gripping and precise reset system for repair scenarios of miniature AI sensor chip (5mm side length, leadless package)

[0066] I. System Module Adaptation and Detailed Implementation

[0067] 1. Optimization and implementation of the chip adaptation and capture module

[0068] The initial angle of the flexible gripper arm is adjusted to 15° (10°-30°) using an angle adjustment bolt (304 stainless steel, 3mm diameter, 0.5mm pitch), accommodating chips with a 5mm side length. An arc-shaped notch (2.5mm radius) is cut at the end of the gripper arm to ensure a close fit with the chip edge. The chip contact head measures 3mm × 3mm × 1mm, with a Shore hardness of 32HA and surface micro-suction holes with a diameter of 0.1mm (0.1-0.3mm). Each contact head has four micro-suction holes, connected to a negative pressure system via a Φ2mm air tube. Each rotation of the angle adjustment bolt changes the initial angle of the gripper arm by 2°, precisely adapting to microchips with side lengths of 5-8mm without requiring replacement of the gripping assembly.

[0069] 2. Implementation of negative pressure adsorption control module and wireless force feedback

[0070] The microchip weighs 1g, according to formula Pset = k×m calculation, take k = 0.6kPa / g, get P set =0.6×1=-0.6kPa; The negative pressure buffer tank (volume 15mL, transparent acrylic material) is connected in series between the vacuum valve and the micro-suction hole. The negative pressure fluctuation inside the tank is ≤0.1kPa to avoid sudden changes in negative pressure that could cause the chip to fall off; the minimum graduation value of the liquid level scale on the surface of the buffer tank is 0.5mL, which allows for real-time observation of the internal condensate (it needs to be drained when ≤1mL) to prevent clogging of the micro-suction hole.

[0071] The force feedback module's pressure sensor (model FSR402) has a range of 0-2N and an accuracy of ±0.005N. It communicates with a wireless vibration bracelet (8-hour battery life) via a Bluetooth 5.0 module (model HC-08), with a transmission distance of 15m (10-20m) and a latency of 15ms (≤20ms). The chip contact area is 1cm². 2 (5mm×5mm), according to formula F th =s×σ, take σ=0.15N / cm 2 , get F th =1×0.15=0.15N; When the contact force exceeds 0.15N, the vibration intensity of the wristband increases with the degree of exceeding the threshold (over 0.05N is weak vibration, over 0.1N is strong vibration). The operator can sense the contact force without staring at the screen, which is suitable for the "eye-focused chip" operation requirements when repairing microchips.

[0072] 3. Implementation of the adaptation between the visual positioning module and the length adjustment module

[0073] The miniature camera uses the OV7725 model (640×480 resolution, 30fps), with a lens focal length of 2.8mm and a field of view of 90°, capable of capturing a 5mm side-length chip in its entirety. The LED fill light brightness is adjusted to 300 lux (lowest setting) to avoid strong light reflection affecting observation. The image processing unit optimizes the algorithm, automatically identifying the chip edge contour for leadless packaged chips, with a positioning deviation ≤0.03mm and a processing latency of 40ms (≤50ms).

[0074] The length adjustment module shortens the sleeve length to 100mm, and the overall system adjustment range is 200-300mm (suitable for narrow spaces during maintenance). The gap between the sleeve and the support rod is 0.1mm (0.1-0.2mm), and the movement stability error is 0.01mm / 100mm (≤0.02mm / 100mm), ensuring precise operation inside the device (such as the motherboard of a smartwatch).

[0075] Table 2: Comparison of Microchip Repair Effects between Example 2 System and Traditional Tools

[0076]

[0077]

[0078] Table 2 highlights the advantages of this system in the repair of micro AI sensor chips. Traditional tools have poor adaptability, can only operate on chips of a single size, and are ineffective in confined spaces, easily slipping when grasping microchips. This system adapts to 5-8mm chips through angle adjustment bolts, shortening the tool length to fit in confined spaces. Negative pressure adsorption combined with flexible contact achieves a grasping success rate of ≥98%. The chip damage rate is reduced from 15%-20% to ≤1% because the force feedback module precisely controls the contact force, avoiding the packaging damage caused by "excessive force" of traditional tools. The wireless wristband prompts eliminate the need for line-of-sight, allowing operators to focus on the details of chip repair, especially suitable for the delicate handling of leadless packaged chips, solving the core problems of "difficult adaptation, easy damage, and limited operation" of traditional tools in microchip repair.

[0079] Reference Figure 2 This figure highlights the efficiency advantages brought by the synergy between the precision adjustment module and the visual positioning module of this invention. Traditional tools rely on manual positioning and coarse adjustments, and the adjustment time increases significantly with the size of the chip: 10 seconds for a 5mm microchip and 40 seconds for a 30mm chip. The larger the size, the more difficult manual alignment becomes, requiring repeated adjustments. This invention achieves precise displacement through a nanometer-level precision lead screw, and the visual positioning module automatically marks the chip and slot positions. Operators no longer need to repeatedly try and fail, and the adjustment time is only about 50% of that of traditional tools: 5 seconds for a 5mm chip and 20 seconds for a 30mm chip, with an efficiency improvement consistently between 50% and 57%. This high efficiency stems from the low adjustment error of the precision mechanical structure and also benefits from the real-time deviation feedback of the image processing unit, significantly improving the efficiency of batch operations.

[0080] Reference Figure 3 This figure verifies the core function of the negative pressure buffer tank in the negative pressure adsorption control module of this invention. Traditional fixed negative pressure tools lack a buffer structure, and even slight fluctuations in negative pressure cause a sharp increase in the shedding rate. The shedding rate is 5% when the fluctuation is 0.5 kPa, and reaches 25% when the fluctuation is 4 kPa, far exceeding the industrial-grade stability standard and failing to meet the requirements of high-precision operation. This invention uses a 10-20 mL transparent acrylic negative pressure buffer tank connected in series between the vacuum valve and the micro-suction hole to balance negative pressure fluctuations in real time. Even with fluctuations of up to 4 kPa, the shedding rate is still controlled within 2.0%, fully meeting the stability standard. The buffer tank stores a portion of the negative pressure gas. When the system negative pressure suddenly increases or decreases, the gas in the tank can be quickly replenished or released, avoiding the impact of sudden changes in negative pressure on the chip's adsorption force. At the same time, the transparent material facilitates observation of internal condensation, preventing blockage of the micro-suction hole and ensuring adsorption stability under different negative pressure environments.

[0081] Reference Figure 4This diagram comprehensively demonstrates the adaptability and reliability of this invention in different application scenarios. Traditional tools, lacking precise positioning and environmental adaptability, experience a significant decrease in success rate as scenario complexity increases, reaching only 70% in stable laboratory environments and 60% in on-site repairs. Manual operation is also susceptible to environmental influences, leading to large alignment errors. This invention, through multi-module collaboration, adapts to different scenarios: in laboratory settings, the visual positioning module's high-definition imaging ensures high-precision alignment with a 98% success rate; in factory settings, the force feedback module avoids excessive compression during batch operations, achieving a 97% success rate; in on-site repair scenarios, the length adjustment module adapts to confined spaces, and in conjunction with a wireless force feedback wristband, the success rate still reaches 96%, all meeting high reliability standards. This scenario adaptability stems from the system's modular design, allowing each module to dynamically adjust parameters according to environmental characteristics.

[0082] The above are merely preferred embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A non-destructive grasping and precise resetting system for an artificial intelligence chip, characterized in that, Includes the following modules: An antistatic grip module includes an antistatic grip and a hollow support rod. The antistatic grip is made of carbon fiber composite material and coated with an antistatic coating. The hollow support rod is made of carbon fiber composite material and has an internal transmission channel; The precision adjustment module includes a fine-tuning knob, a precision lead screw, and a sliding seat. The precision lead screw is made of high-strength alloy material. The fine-tuning knob has an angle scale on its outer periphery and an anti-slip texture on its surface. The sliding seat is sleeved on the precision lead screw and forms a precision threaded fit. The chip-adaptive gripping module includes a connecting frame and two symmetrically arranged flexible gripping arms. The connecting frame is made of aluminum alloy and is fixedly connected to the sliding seat by bolts. The flexible gripping arms are made of titanium alloy and are hinged to a fixed pivot in the middle. The end of the flexible gripping arm away from the connecting frame is provided with a chip contact head. The chip contact head is made of conductive silicone with a Shore hardness of 30-40HA and has micro-suction holes with a diameter of 0.1-0.3mm on its surface. The visual positioning module includes a miniature camera and an LED fill light, which are connected to an external display device via a data cable; the LED fill light has a ring structure, is arranged around the camera, has a brightness of 300-500 lux, and supports 3 levels of brightness adjustment; The length adjustment module includes a sleeve and a locking knob. The sleeve is made of stainless steel, and its inner diameter is in clearance fit with the outer diameter of the hollow support rod, with a clearance of 0.1-0.2 mm. The locking knob is made of plastic and has an internal thread that mates with the external thread of the sleeve. Locking is achieved when the tightening torque is 5-10 N·m.

2. The non-destructive grasping and precise reset system for an artificial intelligence chip according to claim 1, characterized in that, It also includes a negative pressure adsorption control module, which comprises a miniature vacuum valve, a vacuum sensor, and a negative pressure adjustment knob. The miniature vacuum valve is electromagnetic, with a response time ≤10ms and an operating voltage of 5-12VDC. The vacuum sensor has a measurement range of -100kPa to 0kPa. The negative pressure setpoint is determined by formula P. set = k×m calculation, where P set The negative pressure setting value is expressed in kPa, where k is the chip quality coefficient and m is the chip mass. The negative pressure adjustment knob is used for manual correction of P. set .

3. The non-destructive grasping and precise reset system for an artificial intelligence chip according to claim 1, characterized in that, It also includes a force feedback module, which comprises a miniature pressure sensor and a vibration indicator. The miniature pressure sensor is installed inside the chip contact head; the vibration indicator is an eccentric wheel type with three vibration intensity levels; the contact force threshold is determined by formula F. th =s×σ calculation, where F th Here, s is the contact force threshold, σ is the chip contact area, and σ is the allowable contact stress on the chip surface; when the contact force exceeds F... th The vibration alert will activate at that time.

4. The non-destructive grasping and precise reset system for an artificial intelligence chip according to claim 1, characterized in that, The precision adjustment module also includes a displacement scale, which is set along the axis of the precision lead screw, with a length of 50-100mm and a minimum scale value of 0.01mm; the sliding seat is equipped with a pointer, and the alignment accuracy between the pointer and the scale is ≤0.005mm.

5. The non-destructive grasping and precise reset system for an artificial intelligence chip according to claim 1, characterized in that, The flexible gripping arm of the chip adapter gripping module is equipped with an angle adjustment bolt. The angle adjustment bolt is made of stainless steel and is threaded with the gripping arm. Rotating the angle adjustment bolt changes the initial angle between the gripping arm and the connecting frame. The adjustment range is 10°-30°, and the side length of the adapter chip is 5-30mm.

6. The non-destructive grasping and precise reset system for an artificial intelligence chip according to claim 1, characterized in that, The visual positioning module also includes an image processing unit, which uses a Cortex-M4 architecture processor with a main frequency of 80-120MHz and 64-128KB of memory. The image processing unit is used to perform edge detection and feature recognition on the images captured by the camera, automatically mark the positions of chip pins and slots, and output positioning deviation data to an external display device.

7. The non-destructive grasping and precise reset system for an artificial intelligence chip according to claim 1, characterized in that, The grip surface of the antistatic grip module is provided with anti-slip protrusions, the anti-slip protrusions are 1-2mm in diameter, 0.5-1mm in height, and 3-5mm apart; the anti-slip protrusions are made of antistatic rubber material with a Shore hardness of 50-60HA.

8. The non-destructive grasping and precise reset system for an artificial intelligence chip according to claim 1, characterized in that, The sleeve surface of the length adjustment module is provided with length scale, with a scale range of 200-400mm and a minimum scale value of 1mm; the relative movement of the sleeve and the hollow support rod is guided by a ball linear guide, the ball linear guide has a rated dynamic load of 50-100N and a movement stability error of ≤0.02mm / 100mm.

9. A non-destructive grasping and precise reset system for an artificial intelligence chip according to claim 2, characterized in that, The negative pressure adsorption control module also includes a negative pressure buffer tank with a volume of 10-20mL and made of transparent acrylic. The negative pressure buffer tank is connected in series with a micro vacuum valve and a micro suction hole, and has a liquid level scale on its surface.

10. A non-destructive grasping and precise resetting system for an artificial intelligence chip according to claim 3, characterized in that, The pressure sensor and vibration indicator of the force feedback module are connected via a wireless module. The wireless module uses the Bluetooth 5.0 protocol, with a transmission distance of 10-20m and a transmission delay of ≤20ms. The operator wears a wireless vibration wristband to receive the indicator signal. The vibration intensity of the wristband is positively correlated with the degree to which the contact force exceeds the threshold.

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