Three-dimensional laminated three-dimensional packaging component tin coating device and process method

Abstract

The invention provides a three-dimensional laminated three-dimensional packaging component tin coating device and process method, and the method comprises the steps: obtaining a gold removal surface image of a gold removal pin, determining the gold removal color uniformity and the gold removal flatness so as to determine a gold removal characterization state, and determining whether secondary gold removal is needed or not according to the gold removal characterization state; obtaining a separation blade surface image of the gold-removed tin-coated separation blade and a tin-coated surface image of the tin-coated pin; and determining whether the height of the tinning pin is reduced or not according to the tin liquid area proportion of the surface image of the separation blade, determining a tinning characterization state according to the tinning flatness and the tinning flowing phenomenon of the tinning surface image, and adjusting the temperature of the alloy tin pot according to the tinning characterization state. According to the invention, the problem that the gold-removing and tin-coating quality of the device does not meet the standard requirement because the parameters are not adjusted according to the bottleneck that the gold-removing and tin-coating height of the device pin is difficult to control in the prior art is solved.

Description

Technical Field

[0001] This invention relates to the field of electronic assembly technology, and in particular to a tinning apparatus and process method for three-dimensional stacked stereoscopic packaged components. Background Technology

[0002] 3D stacked packaged components (such as 3D-PLUS components) are widely used in various high-tech industries, providing solutions for industrial, computer boards and embedded systems, defense and security, aviation, medical, scientific research and aerospace applications.

[0003] However, components with gold-plated leads are prone to "gold brittleness" during soldering assembly onto printed circuit boards, severely impacting product reliability and lifespan. Therefore, in electronic assembly processes requiring high reliability and long lifespan, it is essential to perform gold removal and soldering on the leads of these components. Compared to FP / QFP chips, the unique structure of three-dimensional stacked package components, where the leads emerge from the bottom of the component body (in an "L" shape), currently relies heavily on manual soldering with an electric soldering iron or solder pot for gold removal and soldering. This process is highly dependent on operator skill, making it difficult to control the soldering height, resulting in poor quality consistency, low efficiency, and risks such as lead bridging and overheating damage. If soldering extends to the root of the lead, the component may become unusable, causing significant economic losses to the organization. Summary of the Invention

[0004] The technical problem solved by this invention is that it provides a three-dimensional stacked stereoscopic packaged component tinning apparatus and process method to overcome the bottleneck in the prior art where parameters are not adjusted according to the difficulty in controlling the tinning height of component pins, resulting in the tinning quality of components not meeting the standard requirements.

[0005] The technical solution adopted in this invention is: a three-dimensional stacked stereoscopic packaging component tinning device, comprising:

[0006] A component flat tray includes a fixed tray and a detachable tray, wherein the detachable tray is mounted on the fixed tray;

[0007] One or more through slots a are located at the center of the disassembly tray, and the side of the through slot a near the fixed tray is used to place components;

[0008] The baffle is connected to the side of the through groove a away from the fixed support plate, and is used to allow the pins of the components to pass through the baffle.

[0009] Furthermore, the fixed tray includes a through groove b, the shape of which is similar to that of the disassembly tray, and the area of ​​the through groove b is smaller than that of the disassembly tray.

[0010] Furthermore, the baffle is made of polyimide with a thickness of less than 0.2 mm.

[0011] Furthermore, a hollow baffle is added to the outside of the baffle plate. The hollow baffle is connected to the disassembly tray, and the hollow area of ​​the hollow baffle is larger than the area of ​​all the pins of the component.

[0012] A soldering process method using the aforementioned three-dimensional stacked packaged component soldering apparatus includes:

[0013] The components are assembled with the tinning device for the three-dimensional stacked packaged components into a three-dimensional stacked packaged component, and the height of the baffle is adjusted so that the baffle is located in a preset position; the preset position refers to the position where the distance between the baffle and the end of the pin is equal to the designed height of the tinned pin;

[0014] After dipping the component leads in flux, the packaged component is fixed on the vacuum chuck of the de-tinning equipment;

[0015] The positioning module of the moving gold-plating removal equipment is made so that the line connecting the center of the packaged component and the gold-plating removal pot is perpendicular to the ground;

[0016] The longitudinal sliding component of the moving gold-removing and soldering equipment is used to immerse the pins of the packaged components in the gold-removing pot for a standard time to obtain gold-removed pins; the standard time is a set value.

[0017] Obtain the gold removal surface image of the gold removal pin, and determine the gold removal color uniformity and gold removal flatness of the gold removal surface image to determine the gold removal characterization state.

[0018] Determine whether a second gold removal is needed based on the gold removal characterization status;

[0019] The lateral and longitudinal sliding components of the moving gold-removing and tinning equipment are used to immerse the gold-removing leads of the packaged components in the alloy tin pot for a standard time to obtain tinned leads;

[0020] Obtain an image of the baffle surface and an image of the tinned surface of the tinned pin;

[0021] The decision on whether to adjust the descent height of the longitudinal sliding component is based on the percentage of molten tin area in the baffle surface image.

[0022] The tinning surface smoothness and tinning flow phenomenon are determined to determine the tinning characterization state, and the alloy tin pot temperature is adjusted according to the tinning characterization state.

[0023] Remove the packaged components and, after the components have returned to room temperature, clean them with lint-free paper soaked in anhydrous ethanol.

[0024] Furthermore, determining the uniformity of gold removal color and the smoothness of gold removal on the gold-removed surface image to determine the gold removal characterization state includes:

[0025] If the uniformity of the gold removal color is greater than or equal to the preset uniformity and the flatness of the gold removal is greater than or equal to the preset flatness, then the gold removal characterization state is determined to be a good gold removal state.

[0026] If the uniformity of the gold removal color is less than a preset uniformity and / or the flatness of the gold removal is less than a preset flatness, then the gold removal characterization state is determined to be a poor gold removal state.

[0027] Furthermore, determining whether a second gold removal is needed based on the gold removal characterization status includes:

[0028] If the gold removal characterization state is a good gold removal state, then it is determined that no second gold removal is required;

[0029] If the gold removal characterization state is a state of no gold removal, then it is determined that a second gold removal is required.

[0030] Furthermore, determining whether to adjust the descent height of the longitudinal sliding component based on the proportion of molten solder area in the baffle surface image includes:

[0031] If the area ratio of the molten tin is greater than the preset area ratio range, then it is determined to reduce the descent height of the longitudinal sliding component;

[0032] If the area ratio of the molten tin is less than the preset area ratio range, it is determined that the descent height of the longitudinal sliding component will be increased.

[0033] If the area ratio of the molten tin is within the preset area ratio range, then it is determined to maintain the current descent height of the longitudinal sliding component.

[0034] Furthermore, a method for determining the tinning surface smoothness and tinning flow phenomenon of the tinned surface image to determine the tinning characterization state includes:

[0035] Determine the presence of tin-plating flow and the smoothness of the tin-plating surface based on the tin-plating surface image;

[0036] If there is solder flow or the solder smoothness is less than the preset smoothness, the solder smoothness is judged to be poor.

[0037] If there is no solder flow phenomenon and the solder smoothness is greater than or equal to the preset smoothness, the solder smoothness is judged to be a good solder smoothness.

[0038] Furthermore, the method for adjusting the temperature of the alloy tin pot according to the tinning characterization state includes:

[0039] The cause of the poor tinning condition is determined based on the judgment result; if the cause of the poor tinning condition is the presence of tinning flow, then the temperature of the alloy tin pot is reduced.

[0040] Determine the method to adjust the alloy tin pot temperature according to the cause of the poor tinning condition: If the cause of the poor tinning condition is that the tinning flatness is less than the preset flatness, then determine to increase the alloy tin pot temperature.

[0041] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0042] To ensure the quality of gold plating removal for 3D-PLUS devices, this invention addresses the two most critical factors affecting the quality of gold plating removal: pin height and solder pot temperature. These factors are adjusted in real-time based on the actual conditions of the gold plating process, improving the quality, stability, and efficiency of gold plating removal. This avoids waste of time, materials, and manpower, and can be applied to components in various operating environments. Attached Figure Description

[0043] Figure 1 This is a top view of the tin-plating device for three-dimensional stacked stereoscopic packaging components according to an embodiment of the present invention;

[0044] Figure 2 This is a step diagram of the tin-plating process for three-dimensional stacked stereoscopic packaged components according to an embodiment of the present invention;

[0045] Figure 3 This is a step diagram illustrating the process of determining the uniformity of gold removal color in an embodiment of the present invention;

[0046] Figure 4 This diagram illustrates the steps for determining the flatness of gold removal in an embodiment of the present invention.

[0047] In the diagram: 1, fixed support plate; 2, disassembled support plate; 3, baffle; 4, baffle plate; 5, screw hole. Detailed Implementation

[0048] To make the objectives and advantages of the present invention clearer, the present invention will be further described below with reference to embodiments; it should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0049] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0050] It should be noted that in the description of this invention, the terms "upper", "lower", "left", "right", "inner", "outer", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention.

[0051] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0052] Please see Figure 1 The image shown is a top view of a three-dimensional stacked stereoscopic packaged component soldering apparatus according to an embodiment of the present invention. The present invention provides a three-dimensional stacked stereoscopic packaged component soldering apparatus, comprising:

[0053] The component flat support plate includes a fixed support plate 1 and a disassembly support plate 2, wherein the disassembly support plate 2 is connected to the fixed support plate 1 by bolts; in the embodiment, the component flat support plate is connected to the component to maintain the relative position of the baffle 4 and the component so that the height of the baffle 4 is at a preset position after the component pin passes through the baffle 4.

[0054] It is understood that the fixed tray 1 also includes a through groove, the shape of which is similar to that of the disassembly tray 2, but its area is smaller than that of the disassembly tray 2; the edge of the disassembly tray 2 is usually provided with several (at least 4) screw holes 5, and the edge of the through groove of the fixed tray 1 is also provided with several (equal to the number of screw holes 5 of the disassembly tray 2) screw holes 5, and the screw holes 5 on the two trays correspond one-to-one so that the two trays can be connected by bolts;

[0055] A through slot is located at the center of the disassembly tray 2. The side of the through slot closest to the fixed tray 1 is used to place components of different sizes. It is understood that the disassembly tray 2 can have one or more through slots (usually 1 through slot, 2 through slots, 4 through slots, 6 through slots, etc.), which can be determined according to actual production needs. For example, when only one component is de-goldened and de-tinned each time, a disassembly tray 2 with only one through slot can be selected. If multiple components are de-goldened and de-tinned each time, a disassembly tray 2 with multiple through slots can be selected.

[0056] The baffle 4 is connected to the side of the through groove away from the fixed support plate 1, so that the pins of the component can pass through the baffle 4. In an embodiment, the baffle 4 can be connected to the disassembly support plate 2 in any way, and the baffle 4 is made of polyimide material with a thickness of less than 0.2 mm (preferably 0.15 mm). In one embodiment, since the polyimide baffle 4 is relatively thin and easy to bend, a hollow baffle 3 is added to the side of the baffle 4 away from the disassembly support plate 2. The hollow baffle 3 is connected to the disassembly support plate 2 by bolts, and the hollow area of ​​the hollow baffle 3 is larger than the area of ​​all the pins of the component. In an embodiment, the baffle 4 has several through holes for the pins of the component to pass through, and the area of ​​each through hole is slightly larger than the area through which the pins of the component pass.

[0057] In this embodiment, the materials for fixing the tray 1, removing the tray 2, and the baffle 3 can be various metal materials or alloy materials, as long as they are not easily bent.

[0058] In one embodiment, the fixed support plate 1 is a cuboid with a length, width, and height of 230cm, 125cm, and 8mm, respectively, and its central through slot is a cuboid with a length, width, and height of 115cm and 8mm, respectively; the through slot for disassembling the support plate 2 can be a cuboid with a length, width, and height of 110cm and 6mm, respectively; this cuboid has four through slots with a side length of 35cm; the thickness of the baffle plate 3 is 1mm.

[0059] Please see Figure 2 The diagram illustrates the steps of a three-dimensional stacked stereoscopic packaged component tinning process according to an embodiment of the present invention. The present invention also provides a three-dimensional stacked stereoscopic packaged component tinning device and a three-dimensional stacked stereoscopic packaged component tinning process method, comprising the following steps:

[0060] Step S1: Assemble the components and the three-dimensional stacked stereo encapsulation component tinning device into a three-dimensional stacked encapsulation component, and adjust the height of the baffle 4 to place it in a preset position.

[0061] Step S2: After applying an appropriate amount of flux to the component leads, fix the packaged component onto the vacuum chuck of the gold removal and tinning equipment.

[0062] Step S3: Move the positioning module of the gold plating removal equipment so that the line connecting the center of the packaged component and the gold plating removal pot is perpendicular to the ground;

[0063] Step S4: Move the longitudinal sliding component of the gold removal and soldering equipment so that the pins of the packaged components are immersed in the gold removal pot for a standard time to obtain gold-removed pins; in the embodiment, the standard time is typically 0.5 seconds to 1 second;

[0064] Step S5: Obtain the gold removal surface image of the gold removal pin, and determine the gold removal color uniformity and gold removal flatness of the gold removal surface image to determine the gold removal characterization state.

[0065] Step S6: Determine whether a second gold removal is needed based on the gold removal characterization status;

[0066] Step S7: Move the lateral sliding component and the longitudinal sliding component of the gold removal and tinning equipment so that the gold removal pins of the packaged component are immersed in the alloy tin pot for a standard time to obtain tinning pins; in the embodiment, the lateral sliding component is first used to move the packaged component above the alloy tin pot, and then the longitudinal sliding component is used to move the packaged component down to the point where the gold removal pins are immersed in the alloy tin pot.

[0067] Step S8: Obtain the surface image of the baffle 4 and the surface image of the tinned pin;

[0068] Step S9: Determine whether to adjust the descent height of the longitudinal sliding component based on the proportion of molten tin area in the baffle surface image;

[0069] Step S10: Determine the tinning flatness and tinning flow phenomenon of the tinning surface image to determine the tinning characterization state, and adjust the temperature of the alloy tin pot;

[0070] Step S11: Remove the packaged components and clean them with lint-free paper soaked in anhydrous ethanol after the components have returned to room temperature.

[0071] In the embodiments, the gold plating removal equipment is any of the prior art, including: (1) an automatic gold plating removal equipment for connectors, which realizes synchronous and fully automatic operation of gold plating and gold plating removal by installing a transmission component, a feeding module, a bearing module, a welding module, a desoldering module, etc. on the frame, which can effectively improve the efficiency of gold plating removal and is mainly used for gold plating removal of connectors; (2) a fully automatic gold plating removal machine, including a body and an outer frame, the outer frame is provided with a gold plating removal mechanism consisting of a chip solder pot, a plug-in solder pot, a hot air leveling, a device motion positioning, a camera, a flux working unit and a preheating device, which can be used for gold plating removal of through holes and SMT components; (3) a gold plating removal equipment for multi-pin devices, which is mainly used in the fields of ultra-high reliability products such as aviation, aerospace, and marine, to remove the gold plating layer on the pins of electronic components and replace it with a new tin-lead alloy plating layer. Each gold plating removal equipment has a longitudinal sliding component that drives the components to move vertically up and down, and a transverse sliding component that drives the components to move horizontally left and right.

[0072] It is understood that the three-dimensional stacked stereo encapsulation component tinning device provided by the present invention is an auxiliary device added to the component.

[0073] Specifically, in step S1, the preset position is the position where the distance between the baffle 4 and the end of the pin is equal to the design height of the tinned pin.

[0074] In the embodiments, the height of the tinned pins is typically 0mm to 0.5mm, that is, the vertical distance between the baffle 4 and the end of the pin should be 0mm to 0.5mm.

[0075] In this embodiment, step S5, the method for determining the uniformity of gold removal color and the smoothness of gold removal on the gold-removed surface image, includes:

[0076] Step S51: Determine the uniformity of the gold color.

[0077] Step S52: Determine the flatness of the gold removal process;

[0078] Please see Figure 3 The diagram shown illustrates the steps for determining the uniformity of gold color removal according to an embodiment of the present invention. Step S51 includes:

[0079] Step S511: Determine the chromaticity value of each pixel in the gold-removed surface image (the chromaticity value of a single pixel is the sum of the red channel value, blue channel value, and green channel value of that pixel);

[0080] Step S512: Determine the average chromaticity value and standard deviation of the chromaticity value of the gold-removed surface image based on the chromaticity value of each pixel.

[0081] Step S513: Determine the range of chromaticity values ​​based on the average chromaticity value and the standard deviation of chromaticity values, i.e., the difference between the average chromaticity value and the standard deviation of chromaticity values ​​~ the sum of the average chromaticity value and the standard deviation of chromaticity values;

[0082] Step S514: Determine the number of pixels that exceed the chromaticity value range based on the chromaticity value and chromaticity value range of each pixel.

[0083] Step S515: Determine the gold removal color uniformity based on the ratio of the number of pixels exceeding the chroma value range to the total number of pixels. Gold removal color uniformity = 1 - (number of pixels exceeding the chroma value range ÷ total number of pixels).

[0084] Understandably, the smaller the uniformity of the gold removal color, the more uneven the metallic color should appear on the surface of the gold-removed pins, with obvious gold residue or discoloration, indicating a poorer gold removal effect.

[0085] Please see Figure 4 The diagram shown illustrates the steps for determining the gold removal smoothness in an embodiment of the present invention. Step S52 includes:

[0086] Step S521: Perform high-definition magnification processing on the gold-removed surface image;

[0087] Step S522: Identify the imperfections (i.e. defects, including pits and protrusions) on the gold-removed surface image after high-definition magnification.

[0088] Step S523: Determine the area of ​​each defect and the total defect area of ​​all defects;

[0089] Step S524: Determine the gold removal smoothness based on the ratio of the total defect area to the gold removal surface area. Gold removal smoothness = 1 - (total defect area ÷ gold removal surface area).

[0090] Understandably, the smaller the gold removal flatness, the more obvious the pits, bumps, and other defects should appear on the surface of the gold removal pins, indicating a poorer gold removal effect.

[0091] Step S5 also includes step S53, which is to determine the gold removal characterization state based on the gold removal color uniformity and gold removal flatness.

[0092] Specifically, in step S53, the gold removal characterization state is determined based on the gold removal color uniformity and gold removal smoothness, including:

[0093] If the uniformity of the gold removal color is greater than or equal to the preset uniformity and the flatness of the gold removal is greater than or equal to the preset flatness, then the gold removal characterization state is determined to be a good gold removal state.

[0094] If the uniformity of the gold removal color is less than a preset uniformity and / or the flatness of the gold removal is less than a preset flatness, then the gold removal characterization state is determined to be a poor gold removal state.

[0095] Understandably, preset uniformity and preset flatness are determined based on the design / usage precision of the components. The gold-removal and tinning process of components typically affects soldering performance, oxidation prevention, mechanical strength, and electrical performance. During soldering, a stronger intermetallic compound bonding layer forms between the solder and the gold-removed and tinned leads. This bonding layer not only has good conductivity but also provides high mechanical strength, making the connection between the leads and the solder joint more robust. When components are subjected to external forces such as vibration and impact, they can better resist external forces, reducing the occurrence of problems such as lead loosening and desoldering, and improving the stability of components on the circuit board. Good gold removal treatment ensures a low-resistance connection between the leads and the solder. Reduced contact resistance helps reduce energy loss during current flow, reduces heat generation, and improves the efficiency and performance of electronic devices. Especially in circuits with high electrical performance requirements, such as high-frequency circuits and high-current circuits, low contact resistance is crucial for ensuring the integrity and stability of signal transmission.

[0096] Therefore, in the embodiments, the preset uniformity and preset flatness should be set to a large value, typically greater than 90%. Preferably, for high-precision components, the preset uniformity = preset flatness = 95%.

[0097] Specifically, in step S6, determining whether a second gold removal is needed based on the gold removal characterization status includes,

[0098] If the gold removal characterization state is a good gold removal state, then it is determined that no second gold removal is required;

[0099] If the gold removal characterization state is a poor gold removal state, then it is determined that a second gold removal is required until the gold removal characterization state is a good gold removal state.

[0100] Specifically, in step S9, determining whether to adjust the descent height of the longitudinal sliding component based on the proportion of molten solder area in the baffle surface image includes:

[0101] If the solder liquid area ratio is greater than the preset area ratio range, it is determined to reduce the descent height of the longitudinal sliding component. In the embodiment, this means that at the current descent height of the longitudinal sliding component, the component pin is immersed in the solder liquid to an excessive depth. This may cause too much solder liquid to adhere to the component pin, increasing the risk of short circuit between the pins. By reducing the descent height of the longitudinal sliding component, the descent depth of the component pin can be reduced, thereby reducing the amount of solder liquid adhering to the pin, bringing the solder liquid area ratio back to the preset range, ensuring soldering quality and controlling costs.

[0102] If the solder molten area ratio is less than a preset range, the descent height of the vertical sliding component is increased. It is understood that at the current descent height of the vertical sliding component, the component leads are immersed too shallowly in the solder molten material, potentially leading to insufficient contact between the leads and the solder, resulting in incomplete soldering and cold solder joints (cold solder joints cause unstable electrical connections between components and the circuit board, affecting the performance and reliability of the entire circuit, and may even cause intermittent faults during equipment operation, making troubleshooting and repair difficult). Increasing the descent height of the vertical sliding component allows the component leads to be immersed deeper in the solder molten material, increasing the contact area with the solder molten material, ensuring soldering quality, and ensuring the solder molten area ratio reaches the preset appropriate range.

[0103] If the area ratio of the molten solder is within a preset area ratio range, it is determined to maintain the current descent height of the vertical sliding component. It can be understood that the current descent height of the vertical sliding component is appropriate, that is, the depth to which the component pins are immersed in the molten solder is just right, which can ensure that the pins are in full contact with the molten solder to achieve a good soldering effect, and will not allow too much molten solder to adhere to the pins, avoiding problems such as short circuits. Therefore, it is determined to maintain the current descent height of the vertical sliding component to maintain stable soldering quality and process parameters.

[0104] Therefore, in the embodiments, the setting of the preset area ratio affects the determination of the height of the tinned pins. Generally, the preset area ratio is 5% to 10%; preferably, for high-precision components, the preset area ratio is set to 5% to 8%.

[0105] Specifically, in step S10, the method for determining the tinning surface smoothness and tinning flow phenomenon using a machine learning model to determine the tinning characterization state includes:

[0106] Step S101: The image of the tin-plated surface is used as input;

[0107] Step S102: Determine whether there is solder flow phenomenon and solder smoothness; it is understood that there will be a relatively straight solder flow path, and the trained machine learning model can easily identify whether there is solder flow phenomenon; the method for determining solder smoothness is the same as that for determining gold removal smoothness, so it will not be described again.

[0108] Step S103: Determine the tinning characterization method based on the presence of tinning flow and tinning smoothness, wherein...

[0109] If there is solder flow or the solder smoothness is less than the preset smoothness, the solder smoothness is judged to be poor.

[0110] If there is no solder flow phenomenon and the solder smoothness is greater than or equal to the preset smoothness, the solder smoothness is judged to be a good solder smoothness.

[0111] Specifically, in step S103, the method for adjusting the temperature of the alloy tin pot according to the tinning characterization state includes,

[0112] The cause of the poor soldering condition is determined based on the judgment result.

[0113] Determine the appropriate method for adjusting the temperature of the alloy tin pot based on the cause of the poor tinning condition.

[0114] Specifically, methods for adjusting the temperature of the alloy solder pot based on the causes of poor tinning include:

[0115] If the poor tinning condition is due to tinning run-through, then the temperature of the alloy tin pot should be reduced.

[0116] Understandably, excessively high temperatures in the alloy solder pot can cause the molten solder to become too fluid (the fluidity of molten solder increases with temperature). Molten solder with excessive fluidity is difficult to form a uniform and stable solder layer on the pin surface, which can easily lead to solder run-through, excessively thin solder layer, and other phenomena, affecting the appearance and quality of the soldering. Therefore, when solder run-through occurs, the temperature of the alloy solder pot needs to be reduced.

[0117] Specifically, in step S103, the method for adjusting the temperature of the alloy tin pot according to the cause of poor tinning includes,

[0118] If the poor tinning condition is due to the tinning flatness being less than the preset flatness, then it is determined that the temperature of the alloy tin pot should be increased.

[0119] Understandably, if the temperature of the alloy solder pot is too low, the viscosity of the molten solder will increase, the fluidity will decrease, and it will be difficult to spread and wet the lead surface quickly. This will result in uneven and rough solder layer, as well as defects such as solder piles and solder nodules, which will affect the quality and appearance of the soldering. Therefore, when the soldering flatness is too small (less than the preset flatness), the temperature of the solder pot needs to be increased.

[0120] In the embodiment, the temperature of the tin pot is adjusted by a small amount (1° to 3°) each time it is lowered or raised.

[0121] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

[0122] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

[0123] Within.

[0124] The parts of this invention not described in detail are well-known to those skilled in the art.

Claims

1. A three-dimensional stacked stereolithographic encapsulation component tinning device, characterized in that, The utility model relates to a kind of three-dimensional laminated encapsulated component and its three-dimensional laminated encapsulated component tin soldering device, and the utility model discloses the following technical scheme: Including: Component plane pallet, including a fixed pallet (1) and a dismounting pallet (2), the dismounting pallet (2) is installed on the fixed pallet (1); One or several through grooves a are located at the center of the dismounting pallet (2), and the through grooves a are used for placing components near the side of the fixed pallet (1); 2. The apparatus according to claim 1, wherein the apparatus is characterized by: The baffle (4) is connected with the side of the through groove a away from the fixed pallet (1), so that the pin of component passes through the baffle (4).

3. The apparatus according to claim 1, wherein the apparatus is characterized by: The fixed pallet (1) includes a through groove b, the shape of the through groove b is similar to the shape of the dismounting pallet (2), and the area of the through groove b is less than the area of the dismounting pallet (2).

4. The apparatus according to claim 1, wherein the apparatus is characterized by: The material of the baffle (4) is polyimide material, and the thickness is less than 0.2mm.

5. A process for applying the three-dimensional laminated stereoscopic packaging device and component of any one of claims 1 to 4 to tin-plating, characterized in that, A hollow baffle (3) is installed outside the baffle (4), the hollow baffle (3) is connected with the dismounting pallet (2), and the hollow area of the hollow baffle (3) is greater than the area of all pins of component. Including: Assemble component and three-dimensional laminated encapsulated component tin soldering device into three-dimensional laminated encapsulated component, and adjust the height of baffle (4) to make baffle (4) be located at preset position;The preset position refers to the distance between the baffle (4) and the end of pin is equal to the design height of tin soldering pin position; After the pin of component is dipped with flux, the encapsulated component is fixed on vacuum chuck of gold removing tin soldering equipment; Move the positioning module of gold removing tin soldering equipment to make the center line of the encapsulated component and gold removing tin pot be perpendicular to ground; Move the longitudinal sliding assembly of gold removing tin soldering equipment to make the pin of encapsulated component be immersed in gold removing tin pot for standard time, and obtain gold removing pin;Standard time is set value; Obtain the gold removing surface image of gold removing pin, and determine the gold removing color uniformity and gold removing flatness of the gold removing surface image to determine gold removing characterization state; Determine whether secondary gold removing is needed according to the gold removing characterization state; Move the horizontal sliding assembly and longitudinal sliding assembly of gold removing tin soldering equipment to make the gold removing pin of encapsulated component be immersed in alloy tin pot for standard time, and obtain tin soldering pin; Obtain the baffle surface image of baffle (4) and the tin soldering surface image of tin soldering pin; Determine whether the descending height of longitudinal sliding assembly is adjusted according to the tin liquid area ratio of baffle surface image; Determine the tin soldering flatness and tin soldering tin flow phenomenon of tin soldering surface image to determine tin soldering characterization state, and adjust the temperature of alloy tin pot according to tin soldering characterization state; 6. The process for tin soldering according to claim 5, wherein Remove the encapsulated component, and after the component returns to room temperature, use dust-free paper dipped with anhydrous ethanol to clean the component. Determine the gold removing color uniformity and gold removing flatness of the gold removing surface image to determine gold removing characterization state, including: If the gold removing color uniformity is greater than or equal to preset uniformity and the gold removing flatness is greater than or equal to preset flatness, it is judged that the gold removing characterization state is good gold removing state; If the gold removing color uniformity is less than preset uniformity and / or the gold removing flatness is less than preset flatness, it is judged that the gold removing characterization state is poor gold removing state.

7. The process for tin soldering according to claim 6, wherein According to the gold removal characterization state, it is determined whether secondary gold removal is needed, comprising: If the gold removal characterization state is a good gold removal state, it is determined that secondary gold removal is not needed; If the gold removal characterization state is a poor gold removal state, it is determined that secondary gold removal is needed.

8. The process for tin soldering according to claim 7, wherein According to the tin liquid area proportion of the baffle surface image, it is determined whether to adjust the lowering height of the longitudinal sliding assembly, comprising: If the tin liquid area proportion is greater than a preset area proportion range, it is determined to decrease the lowering height of the longitudinal sliding assembly; If the tin liquid area proportion is less than the preset area proportion range, it is determined to increase the lowering height of the longitudinal sliding assembly; If the tin liquid area proportion is in the preset area proportion range, it is determined to keep the current lowering height of the longitudinal sliding assembly.

9. The process for tin soldering according to claim 8, wherein A method for determining the tin coating flatness and tin coating flow phenomenon of the tin coating surface image to determine a tin coating characterization state, comprising: According to the tin coating surface image, it is determined whether there is a tin coating flow phenomenon and a tin coating flatness; If there is a tin coating flow phenomenon or the tin coating flatness is less than a preset flatness, it is determined that the tin coating characterization state is a poor tin coating state; If there is no tin coating flow phenomenon and the tin coating flatness is greater than or equal to the preset flatness, it is determined that the tin coating characterization state is a good tin coating state.

10. The process for tin soldering according to claim 9, wherein A method for adjusting the alloy tin pot temperature according to the tin coating characterization state, comprising: According to the determination result of the poor tin coating state, the cause of the poor tin coating state is obtained; if the cause of the poor tin coating state is the existence of the tin coating flow phenomenon, it is determined to lower the alloy tin pot temperature; According to the cause of the poor tin coating state, a corresponding method for adjusting the alloy tin pot temperature is determined; if the cause of the poor tin coating state is that the tin coating flatness is less than the preset flatness, it is determined to increase the alloy tin pot temperature.

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