Automatic production method and equipment for height-limited preformed soldering lug

Abstract

The invention discloses an automatic production method and equipment for a height-limited preformed soldering lug, and relates to the technical field of welding. The automatic production method of the height-limited preformed soldering lug comprises the following steps: step 1, preparing a preformed soldering lug material; 2, automatically generating production parameters of the preformed soldering lug; 3, producing and processing the preformed soldering lug according to the automatically generated parameters; step 4, optimizing production parameters of the preformed soldering lug; 5, the production parameters of the preformed soldering lug are determined; and step 6, continuously and automatically producing preformed soldering lug products. According to the automatic production method of the height-limited preformed soldering lug, automatic generation of production parameters is achieved through the second step, a database is automatically inquired to call similar product parameters, or predictive parameters are generated based on a part family and a typical process template, it is ensured that the parameters are rapidly converged to the optimal value, nitrogen is continuously introduced, air is isolated, and the production efficiency is improved. And meanwhile, a pre-plating layer structure is adopted by the bonding wire, so that the oxidation risk is further reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of welding, in particular to an automatic production method and equipment for height-limited preformed soldering pieces. BACKGROUND

[0002] The preformed soldering piece is a precision formed soldering material with different shapes, sizes and surface morphologies according to requirements, which is suitable for various product manufacturing processes with small tolerances and is widely used in the fields of printed circuit board assembly, connectors and terminal equipment, chip connection, power module substrate attachment, filter connector and electronic component assembly, etc.

[0003] In traditional production, the key parameters such as processing temperature, pressure and time of the soldering piece substrate and solder wire need to be set by manual experience, and there is a lack of automatic generation mechanism. When producing new materials or new products, the parameter debugging period is long, and the soldering piece thickness may exceed the standard or the wire arrangement may be disordered due to parameter deviation. In addition, when the soldering piece substrate and solder wire are heated and pressed for welding, oxidation may occur if they are exposed to air, which may result in an oxidation layer at the welding interface and reduce the bonding strength of the solder wire and the substrate, thereby having certain defects. SUMMARY

[0004] In view of the deficiencies of the prior art, the present application provides an automatic production method and equipment for height-limited preformed soldering pieces, which solves the problems of the key parameters such as processing temperature, pressure and time of the soldering piece substrate and solder wire needing to be set by manual experience in traditional production, a lack of automatic generation mechanism, a long parameter debugging period when producing new materials or new products, and easy parameter deviation leading to soldering piece thickness exceeding the standard or wire arrangement disorder, and the soldering piece substrate and solder wire being easily oxidized when heated and pressed for welding, which may result in an oxidation layer at the welding interface and reduce the bonding strength of the solder wire and the substrate.

[0005] To achieve the above purpose, the present application is implemented by the following technical solution: an automatic production method for height-limited preformed soldering pieces, comprising the following specific steps: Step 1: Prepare preformed soldering piece materials to provide materials for automatic production of preformed soldering pieces; Step 2: Initialize the production equipment, input the performance parameters of the preformed soldering piece materials into the control terminal of the production equipment, and input the preset values of the preformed soldering piece products, automatically generate the production parameters of the preformed soldering pieces according to the input information, and establish a product production database; Step 3: Produce and process the preformed soldering pieces according to the automatically generated parameters, and detect the produced preformed soldering piece products to feed back the preformed soldering piece product detection data; Step 4: Compare the detected data with the preset values of the preformed soldering piece products, and optimize the production parameters of the preformed soldering pieces; Step five: repeat step three and step four until the production of preform solder product test parameters meet the preform solder product pre-set value, determine the production parameters of preform solder; Step six: according to the determined production parameters of preform solder, repeat the preform solder production processing steps, continuous automatic production of preform solder product.

[0006] Preferably, the preform solder material in step one includes solder substrate, solder wire, flux and nitrogen, the solder wire includes copper wire and pre-plating layer, the pre-plating layer is wrapped outside the copper wire, the pre-plating layer outside the copper wire includes nickel layer and solder layer covering the nickel layer, the pre-plating layer outside the copper wire is hot melt welded on the solder substrate by heating and pressing, and the nitrogen is used for anti-oxidation protection of the solder substrate and the solder wire.

[0007] Preferably, the performance parameters of the preform solder material in step two include the hot melt temperature of the solder substrate and the solder wire, and the input pre-set value of the preform solder product includes the thickness parameter of the preform solder product and the wire arrangement parameter of the preform solder product, the wire arrangement parameter includes the number of longitudinally and transversely arranged solder wires on the solder substrate, the spacing of the solder wires and the tension of the solder wires, the production parameters of the automatically generated preform solder include the temperature, pressure, time and position parameters of the solder substrate and the solder wire processing, the position parameters of the solder substrate and the solder wire processing are directly generated from the wire arrangement parameters of the preform solder product, and the temperature, pressure and time parameters of the solder substrate and the solder wire processing are generated by querying the database, querying the production parameters of similar products, when the database has the same product production parameters, taking the parameters as the standard type preform solder production parameters for production processing of the preform solder, when the database does not have the same product production parameters, taking the similar product production parameters as a part of the family, searching the typical process template, and adjusting the production temperature, pressure and time parameters as the estimated type preform solder production parameters.

[0008] Preferably, the solder production processing in step three is based on the preform solder production parameters automatically generated in step two to process the solder substrate and the solder wire, including the following steps: S3.1: using a vacuum chuck to suck a piece of solder substrate from a tray, moving and placing the solder substrate at the center of a heating platform, and making the heating platform powered and heated until the temperature reaches the automatically generated preform solder heating temperature value, keeping the heating platform heating temperature, and opening the nitrogen valve to introduce nitrogen; S3.2: arranging the solder wire according to the wire arrangement parameters of the preform solder product, i.e. pulling the solder wire from the spool, immersing the solder wire into the flux tank, straightening and positioning the solder wire above the heating platform, and pressing the solder wire to adhere to the surface of the solder substrate which has been heated and kept warm; S3.3: The pressure head part of the vacuum chuck is lowered to set the pressure to press the wire and the soldering pad substrate combination, and to maintain the set time, under this pressure and temperature, the soldering pad substrate melts, the soldering pad substrate wets the pre-plated layer of the wire under the action of the flux, the wire is pressed into the semi-molten soldering pad substrate, and a metallurgical bonding connection is formed; S3.4: After the wire and soldering pad substrate pressure time ends, the vacuum chuck pressure head remains in the pressed state to position and bind the wire and soldering pad substrate, and the cutter runs to cut off the wire located outside the pre-set position on both sides of the soldering pad substrate; S3.5: The cutter is reset, the vacuum chuck pressure head is lifted, and at the same time the vacuum suction is started to pick up the finished soldering pad product with the wire, and the vacuum chuck moves to place the soldering pad product on the conveying belt.

[0009] Preferably, the pre-formed soldering pad product in step three is detected, including the thickness, the number of wires, the spacing of the wires, and the oxidation degree of the wires of the pre-formed soldering pad product, the thickness of the pre-formed soldering pad product is measured by an electronic thickness gauge, the number of wires and the spacing of the wires of the pre-formed soldering pad product are detected and analyzed by a visual detector, the number of wires and the spacing of the wires of the pre-formed soldering pad product are detected to detect whether the wire on the soldering pad substrate is broken, thereby causing the broken wire to be incorrectly arranged, and the tension of the wire arrangement is reduced when the wire is broken.

[0010] Preferably, when the detected data in step four does not reach the preset value of the pre-formed soldering pad product, the automatically generated pre-formed soldering pad production parameters are optimized, and the same product initial adjustment standard value is formulated, and when the generated parameters are standard type pre-formed soldering pad production parameters, and the thickness of the pre-formed soldering pad product is greater than the preset value, the production temperature, pressure and time parameters of the pre-formed soldering pad are increased one by one by a same product initial adjustment standard value, otherwise, when the thickness of the pre-formed soldering pad product is less than the preset value, the production temperature, pressure and time parameters of the pre-formed soldering pad are reduced one by one by a same product initial adjustment standard value.

[0011] Preferably, when the generated parameters are estimated type pre-formed soldering pad production parameters, the thickness value detected by the pre-formed soldering pad product is compared with the thickness of the preset value of the pre-formed soldering pad product, and the percentage of the difference is calculated, which is set as K, when the thickness value detected by the pre-formed soldering pad product is greater than the thickness of the preset value of the pre-formed soldering pad product, K takes a positive value, otherwise, when the thickness value detected by the pre-formed soldering pad product is less than the thickness of the preset value of the pre-formed soldering pad product, K takes a negative value, when the estimated type pre-formed soldering pad production parameters are optimized, the estimated type pre-formed soldering pad production parameters are multiplied by (1+K) to obtain the optimized estimated type pre-formed soldering pad production parameters.

[0012] Preferably, the repeated step three and step four in the step five is to continuously optimize the preform solder production parameters, when the generated parameters are standard preform solder production parameters, and when adjusted again, the production temperature, pressure and time parameters of the preform solder are adjusted one by one, and the value of each parameter is half of the previous value, until the difference between the detected value of the preform solder produced for more than three times and the preset value of the preform solder product is within the allowable error range, then the adjusted standard preform solder production parameters are saved as the parameters for continuous production of the preform solder, and when the generated parameters are estimated preform solder production parameters, the optimization is still carried out in the manner of multiplying the estimated preform solder production parameters by (1+K), until the difference between the detected value of the preform solder produced for more than three times and the preset value of the preform solder product is within the allowable error range, then the adjusted estimated preform solder production parameters are saved as the parameters for continuous production of the preform solder.

[0013] Preferably, the continuous automatic production of the preform solder product in the step six is to execute step three according to the adjusted and confirmed preform solder production parameters, and to perform the steps of preform solder substrate feeding, heating, nitrogen feeding, solder wire immersion in flux, wire arranging, wire pressing, wire cutting and discharging, and the produced preform solder is sampled and detected to realize real-time feedback of the production quality of the preform solder product.

[0014] Another purpose of the present application is to provide a high-limit preform solder automatic production equipment, which comprises a mounting shell, a heating platform is installed in the inside of the mounting shell, a nitrogen discharge pipe is arranged in the inside of the mounting shell and located at the side of the heating platform, a vacuum chuck is arranged on the heating platform, a cutting knife is installed at the side of the vacuum chuck, a preset cutting area corresponding to the cutting knife is arranged in the inside of the mounting shell, a wire spool is arranged at the side of the mounting shell, a guide rod and a guide rod are arranged between the wire spool and the mounting shell, a flux groove is arranged between the guide rod and the mounting shell, and a fixing rod is arranged at the other side of the mounting shell.

[0015] The present application discloses a high-limit preform solder automatic production method and equipment, which has the following beneficial effects: The high-limit preform solder automatic production method realizes automatic production parameter generation through step two, automatically queries the database to call the parameters of similar products, or generates estimated parameters based on part families and typical process templates, and through the closed-loop optimization of steps four and five, ensures that the parameters quickly converge to the optimal value, and the nitrogen is continuously fed to isolate the air, and the solder wire adopts a pre-plated layer structure of "copper wire + nickel layer + solder layer" to further reduce the oxidation risk. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0017] Fig. 1 Flow chart of the automatic production method of the height-limited preformed soldering sheet of the present application; Fig. 2 Schematic diagram of the bottom surface structure of the automatic production equipment of the present application.

[0018] In the figure: 1, mounting shell; 2, heating platform; 3, vacuum chuck; 4, cutter; 5, spool; 6, guide rod; 7, guide rod; 8, fixed rod; 9, flux groove. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application are described clearly and completely. Obviously, the described embodiments are some embodiments of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort belong to the protection scope of the present application.

[0020] The embodiments of the present application provide an automatic production method and equipment of a height-limited preformed soldering sheet. In the traditional production, the key parameters such as processing temperature, pressure and time of the soldering sheet substrate and solder wire need to be set by manual experience, lacking automatic generation mechanism. When producing new materials or new products, the parameter debugging period is long, and the soldering sheet thickness is easy to exceed the standard or the wire arrangement is disorderly due to parameter deviation. In addition, the soldering sheet substrate and solder wire are easy to be oxidized when heated and pressed, resulting in an oxidation layer on the welding interface and reducing the bonding strength of the solder wire and the substrate. The embodiments of the present application realize continuous automatic production of preformed soldering sheet products and ensure the production quality of the preformed soldering sheet products.

[0021] In order to better understand the above technical solutions, the above technical solutions will be described in detail in combination with the drawings in the specification and specific embodiments.

[0022] The embodiments of the present application disclose an automatic production method of a height-limited preformed soldering sheet.

[0023] According to the drawings Figs. 1-2 As shown in the drawings, the following specific steps are included: Step one: preparing preformed soldering sheet materials, providing materials for automatic production of preformed soldering sheet, so as to ensure the automatic production of preformed soldering sheet; Step two: the production equipment initialization, the performance parameters of the preform solder material are input into the control terminal of the production equipment, and the preset value of the preform solder product is input, and the production parameters of the preform solder are automatically generated according to the input information, so that the product production processing parameters can be automatically generated according to the product demand, without manual calibration of the production parameters, so as to improve the product production efficiency, and establish the product production database, the database is used to store the historical product production parameters, and the product production standard quality requirement is also stored; Step three: according to the automatically generated parameters, the preform solder is produced and processed, and the preform solder product is detected, and the preform solder product detection data is fed back, so as to adjust the product production processing parameters according to the quality of the product production; Step four: compare the detected data with the preset value of the preform solder product, and optimize the production parameters of the preform solder, so as to ensure the quality of the product production; Step five: repeat steps three and four until the preform solder product detection parameters meet the preset value of the preform solder product, determine the production parameters of the preform solder, so as to continuously produce and process the product according to the subsequent determined production parameters; Step six: according to the determined production parameters of the preform solder, repeat the preform solder production and processing steps, and continuously automatically produce the preform solder product.

[0024] Further, the preform solder material in step one includes solder substrate, solder wire, flux and nitrogen, the solder wire includes copper wire and pre-plating layer, the pre-plating layer is wrapped outside the copper wire, the pre-plating layer includes nickel layer and solder layer covering the nickel layer, the pre-plating layer outside the copper wire is hot melt welded on the solder substrate by heating and pressing, and the nitrogen is used for preventing oxidation protection of the solder substrate and the solder wire, and reducing the probability of oxidation of the solder substrate and the solder wire during hot pressing welding.

[0025] Further, the performance parameters of the preform solder material in step two include the hot melting temperature of the solder substrate and the wire, and the preset values input into the preform solder product include the thickness parameter of the preform solder product and the wire arrangement parameter of the preform solder product, the wire arrangement parameter including the number, spacing and tension of the wires arranged longitudinally and transversely on the solder substrate, the wire arrangement can be side-by-side straight line, grid or other predetermined geometric shape, the production parameters of the automatically generated preform solder include the temperature, pressure, time and position parameters of the solder substrate and wire processing, the position parameters of the solder substrate and wire processing are directly generated from the wire arrangement parameter of the preform solder product, and the temperature, pressure and time parameters of the solder substrate and wire processing are generated by querying the database, and the production parameters of the same product are queried, when the database has the same product production parameters, the parameters are taken as the standard type preform solder production parameters, and the preform solder is produced and processed, when the database does not have the same product production parameters, the similar product production parameters are taken as the part family, the typical process template is searched, and the production temperature, pressure and time parameters are adjusted downward as the estimated type preform solder production parameters.

[0026] In particular, the solder production and processing in step three is based on the preform solder production parameters automatically generated in step two to produce and process the solder substrate and the wire, including the following steps: S3.1: using the vacuum chuck 3 to suck a piece of solder substrate from the tray, moving and placing the solder substrate at the center of the heating platform 2, and making the heating platform 2 powered and heated until the temperature reaches the automatically generated preform solder heating temperature value, the heating temperature range is 220℃ - 350℃, and the heating platform 2 is kept at the heating temperature, the holding time range is 10s - 60s, and the nitrogen valve is opened to introduce nitrogen, thereby reducing the probability of oxidation when the solder substrate and the wire are hot pressure welded, ensuring the quality of the preform solder production; S3.2: arranging the wire according to the wire arrangement parameter of the preform solder product, i.e. pulling the wire from the spool 5, immersing the wire into the flux tank 9, staying for a few seconds, dropping the excess flux, straightening and positioning above the heating platform 2, and pressing the wire to make the wire adhere to the surface of the solder substrate which has been heated and kept warm; S3.3: using the pressure head part of the vacuum chuck 3 to move downward to set the pressure to the wire and solder substrate combination, and keep the set time, the pressure range is 1MPa - 5MPa, and the pressure time is 5s - 30s, the hard alloy column at the bottom of the pressure head contacts the heating platform 2 or the reference surface, ensuring that the total thickness of the pressure is equal to the preset height limit, thereby improving the quality of the preform solder forming, under this pressure and temperature, the solder substrate melts, the solder substrate wets the pre-plated layer of the wire under the action of the flux, the wire is pressed into the semi-molten solder substrate, and a metallurgical bonding connection is formed; S3.4: After the end of the pressing time of the wire and the solder lug substrate, the vacuum chuck 3 pressure head keeps the down state to position and bind the wire and the solder lug substrate, and the guillotine knife 4 cuts off the wire outside the preset position on both sides of the solder lug substrate; S3.5: The guillotine knife 4 is reset, the vacuum chuck 3 pressure head is lifted, and the vacuum adsorption is started at the same time to pick up the finished solder lug product with the wire, and the vacuum chuck 3 moves to place the solder lug product on the conveying belt.

[0027] Further, the detection of the preformed solder lug product in step three includes the thickness of the preformed solder lug product, the number of wires, the wire spacing, and the oxidation degree of the wire. The thickness of the preformed solder lug product is measured by an electronic thickness gauge. The electronic thickness gauge detects by ultrasonic wave and can be used to measure the thickness of metal and non-metal, especially suitable for thin solder lug. The electronic thickness gauge calculates the thickness by emitting sound waves and measuring the reflection time. The number of wires and the wire spacing of the preformed solder lug product are detected and analyzed by a visual detector. By detecting the number of wires and the wire spacing of the preformed solder lug product, it can be detected whether the solder lug substrate has a broken wire, which leads to a broken wire that is not correctly arranged. When there is a broken wire, the tension of the wire arrangement is reduced, thereby reducing the probability of breaking during the wire arrangement.

[0028] Preferably, when the detected data does not reach the preset value of the preformed solder lug product, the automatically generated preformed solder lug production parameters are optimized, and the same product initial adjustment standard value is formulated. When the generated parameters are standard preformed solder lug production parameters, and the thickness of the preformed solder lug product is greater than the preset value, the production temperature, pressure, and time parameters of the preformed solder lug are increased one by one by the same product initial adjustment standard value. Conversely, when the thickness of the preformed solder lug product is less than the preset value, the production temperature, pressure, and time parameters of the preformed solder lug are reduced one by one by the same product initial adjustment standard value. According to industry specifications, different thickness ranges of solder lug have clear tolerance requirements, and the basic range of the initial adjustment standard value should not exceed 50% of the thickness tolerance. According to the preformed solder lug production step in step three, the initial adjustment standard value of the temperature is 10℃, the initial adjustment standard value of the pressure is 0.2MPa, and the initial adjustment standard value of the time is 4s.

[0029] Further, when the generated parameter is the estimated preform solder production parameter, the percentage difference between the detected thickness value of the preform solder product and the preset thickness value of the preform solder product is calculated, and set as K. When the detected thickness value of the preform solder product is greater than the preset thickness value of the preform solder product, K is a positive number, that is, the temperature, pressure and time during the production of the preform solder are increased, thereby reducing the thickness of the produced preform solder. Conversely, when the detected thickness value of the preform solder product is less than the preset thickness value of the preform solder product, K is a negative number. When the estimated preform solder production parameter is optimized, the estimated preform solder production parameter is multiplied by (1+K), that is, the temperature, pressure and time during the production of the preform solder are reduced, thereby increasing the thickness of the produced preform solder. The calculation formula is as follows:

[0030] wherein is the optimized estimated preform solder production parameter, is the pre-optimized estimated preform solder production parameter, and the value of K is 0-1. Thus, the optimized estimated preform solder production parameter can be calculated by the above formula.

[0031] Further, the repeated steps three and four in step five are to continuously optimize the preform solder production parameter. When the generated parameter is the standard preform solder production parameter and is adjusted again, the production temperature, pressure and time parameters of the preform solder are adjusted by half of the previous value, that is, after each adjustment, the gap between the produced product parameter and the preset value is gradually reduced, thereby gradually reducing the adjustment value, which can improve the accuracy of the production parameter. Until the gap between the detected value of the preform solder produced by continuous three or more times and the preset value of the preform solder product is within the allowable error range, the adjusted standard preform solder production parameter is saved as the parameter for continuous production of the preform solder. When the generated parameter is the estimated preform solder production parameter, the estimated preform solder production parameter is still optimized by multiplying (1+K). Until the gap between the detected value of the preform solder produced by continuous three or more times and the preset value of the preform solder product is within the allowable error range, the adjusted estimated preform solder production parameter is saved as the parameter for continuous production of the preform solder.

[0032] Specifically, the continuous automatic production of the preform solder product in step six is performed according to the adjusted preform solder production parameter in step three, that is, the preform solder production parameter is adjusted to perform the steps of preform solder substrate feeding, heating, nitrogen feeding, solder wire immersion in flux, wire arranging, wire pressing, wire cutting and discharging. The produced preform solder is sampled and detected, and the production quality of the sampled preform solder product is fed back in real time to improve the production quality of the product.

[0033] As an implementation, when there are material batch differences, environmental humidity fluctuations or equipment state changes, if the solder pad substrate hot melt characteristics deviate due to supplier changes, such as only adjusting the parameters through the thickness deviation of the output solder pad, it is not possible to compensate for such changes in advance during the production process.

[0034] Therefore, in order to solve this problem, the present embodiment also includes an integrated multi-source sensor network and an adaptive control module. Specifically, a high-precision thermocouple array is embedded inside the heating platform 2 to monitor the temperature distribution of the platform surface in real time and feed back the data to the control terminal. A gas concentration sensor is deployed at the outlet of the nitrogen discharge pipe to dynamically detect the local oxygen content. Meanwhile, a strain gauge is added to the online shaft tension adjustment mechanism to track the solder wire tension state in real time. After preprocessing by the edge computing unit, these sensor data are input into the adaptive control module based on machine learning algorithms. This module can dynamically predict the optimal temperature, pressure and time parameter combination in each production cycle by establishing a nonlinear mapping model between material characteristics, environmental parameters and optimal production parameters. For example, when the edge temperature of the heating platform 2 is detected to be lower than the center area, the system automatically adjusts the holding time parameter of this area, rather than relying on subsequent thickness measurement results for lagging adjustment. The present embodiment upgrades the parameter optimization from the passive mode of "production-measurement-adjustment" to the active mode of "monitoring-prediction-compensation", significantly improving the adaptability to dynamic production environments.

[0035] As an implementation, when using a nitrogen discharge pipe to locally protect the heating area, the nitrogen gas flowing out of the fixed pipe outlet tends to form turbulent flow, resulting in insufficient nitrogen concentration at the edge of the solder pad substrate or in complex structural areas. At the same time, although the solder wire is immersed in flux and then treated by dripping, the uniformity of flux coating completely depends on the self-weight of the fluid, making it difficult to ensure complete coverage of the pre-plated layer surface.

[0036] Therefore, in order to optimize this defect, the single nitrogen discharge pipe is optimized as a porous nitrogen diffusion cover in this embodiment, which is integrated on the liftable frame 10mm above the heating platform 2, the surface of the diffusion cover is uniformly distributed with micron-sized pores, the nitrogen gas is ensured to cover the entire solder pad substrate surface in a laminar flow state through the air pressure adjusting device, the oxygen concentration is controlled below 10ppm, secondly, an ultrasonic oscillator is additionally arranged inside the flux tank 9, so that the flux forms uniform atomized particles, and a uniform coating can be obtained through ultrasonic adsorption effect when the solder wire passes, and most importantly, an instant sealing nozzle is additionally arranged on the cutter 4 module, and the nozzle sprays nanosilver anti-oxidation coating through an external feeding system, the nozzle spraying operation belongs to the prior art, and will not be described in detail here, and when the solder wire is cut off, the miniature mechanical arm immediately applies nanosilver anti-oxidation coating on the exposed end surface, and the infrared heating device rapidly solidifies in 0.5 seconds, the three protection mechanisms of "gas laminar flow coverage + flux ultrasonic atomization + end surface instant sealing" can reduce the oxidation risk blind area.

[0037] Another purpose of the present application is to provide an automatic production equipment for height-limited preformed solder pads, which comprises a mounting shell 1, a heating platform 2 is installed in the mounting shell 1, a nitrogen discharge pipe is arranged in the mounting shell 1, the nitrogen discharge pipe is located at the side of the heating platform 2, a vacuum chuck 3 is arranged on the heating platform 2, a pressure head for pressing the solder wire is installed at the bottom of the vacuum chuck 3, a hard alloy column is installed at the bottom of the pressure head, the hard alloy column contacts the heating platform 2 or the reference surface, so as to ensure the distance between the pressure head and the heating platform 2, and the hard alloy column can be disassembled and replaced, so that the distance between the pressure head and the heating platform 2 is the same as the thickness of the product, thereby improving the quality of product production, a cutter 4 is installed at the side of the vacuum chuck 3, the cutter 4 is driven by electricity, so that the cutter 4 moves up and down relative to the vacuum chuck 3, thereby cutting the wire, a preset cutting area corresponding to the cutter 4 is arranged in the mounting shell 1, a wire spool 5 is arranged at the side of the mounting shell 1, a guide rod 6 and a guide rod 7 are arranged between the wire spool 5 and the mounting shell 1, a flux tank 9 is arranged between the guide rod 6 and the mounting shell 1, a fixed rod 8 is arranged at the other side of the mounting shell 1, a wire clamp is installed on the fixed rod 8 and the guide rod 7, which is used for clamping the solder wire, and the vacuum chuck 3 and the guide rod 7 are installed and moved by mechanical arms, respectively, the flux tank 9, the fixed rod 8, the guide rod 6, the wire spool 5 and the mounting shell 1 are installed on the production site through the mounting of the rack, and the installation belongs to the prior art and will not be described in detail here, and a control terminal for controlling the operation of the heating platform 2, the vacuum chuck 3, the cutter 4, the wire spool 5, the guide rod 7 and the fixed rod 8 is installed outside the mounting shell 1.

[0038] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A method for automated production of height-limited preformed soldering tabs, characterized in that, The method comprises the following specific steps: Step one: preparing preform solder material to provide material for automatic production of preform solder; Step two: initializing production equipment, inputting performance parameters of preform solder material into control terminal of production equipment, and inputting preset values of preform solder product, automatically generating production parameters of preform solder according to input information, and establishing product production database; Step three: producing and processing preform solder according to automatically generated parameters, and detecting produced preform solder product to feed back preform solder product detection data; Step four: comparing detection data with preset values of preform solder product, and optimizing production parameters of preform solder; Step five: repeating step three and step four until detection parameters of produced preform solder product meet preset values of preform solder product, and determining production parameters of preform solder; Step six: repeating preform solder production and processing step according to determined production parameters of preform solder to continuously and automatically produce preform solder product.

2. The automated production method of height-limited preformed soldering pieces according to claim 1, characterized in that, The preform solder material in step one comprises solder substrate, solder wire, flux and nitrogen, the solder wire comprises copper wire and pre-plating layer, the pre-plating layer is wrapped outside the copper wire, the pre-plating layer comprises nickel layer and solder layer covering the nickel layer, the pre-plating layer outside the copper wire is hot melt welded on the solder substrate by heating and pressing, and the nitrogen is used for preventing oxidation protection of the solder substrate and the solder wire.

3. The automated production method of height-limited preformed soldering pieces according to claim 2, characterized in that, The performance parameters of the preform solder material in step two comprise hot melt temperature of the solder substrate and the solder wire, the preset values of the preform solder product comprise thickness parameter of the preform solder product and wire arrangement parameter of the preform solder product, the wire arrangement parameter comprises quantity, spacing and tension of the solder wire arranged longitudinally and transversely on the solder substrate, the production parameters of the preform solder automatically generated comprise temperature, pressure, time and position parameters of processing of the solder substrate and the solder wire, the position parameters of processing of the solder substrate and the solder wire are directly generated from the wire arrangement parameter of the preform solder product, and the temperature, pressure and time parameters of processing of the solder substrate and the solder wire are generated by querying database to query production parameters of similar products, when the database has the same production parameters of products, the parameters are taken as standard type preform solder production parameters for processing of the preform solder, when the database does not have the same production parameters of products, the similar production parameters of products are classified as part family, a typical process template is searched, and production temperature, pressure and time parameters are lowered to be taken as estimated type preform solder production parameters.

4. The automated production method of height-limited preformed welding pieces according to claim 3, characterized in that, The solder production and processing in step three is based on the preform solder production parameters automatically generated in step two to produce and process the solder substrate and the solder wire, which comprises the following steps: S3.1: using a vacuum chuck (3) to suck a piece of solder substrate from a tray, moving and placing the solder substrate at the center of a heating platform (2), and making the heating platform (2) electrified to heat until the temperature reaches the automatically generated preform solder heating temperature value, keeping the heating temperature of the heating platform (2), and opening a nitrogen valve to input nitrogen; S3.2: According to the preformed solder product, the wire arrangement parameters are arranged, that is, the wire is pulled out from the wire spool (5), and the soldering flux tank (9) is immersed, straightened and positioned above the heating platform (2), and the wire is pressed down, so that the wire is attached to the surface of the heated solder substrate; S3.3: The pressure head part of the vacuum chuck (3) is lowered to set the pressure to the wire and solder substrate combination, and to maintain the set time, under this pressure and temperature, the solder substrate melts, the solder substrate wets the pre-plated layer of the wire under the action of the soldering flux, the wire is pressed into the semi-molten solder substrate, and a metallurgical bonding connection is formed; S3.4: After the wire and solder substrate pressure time is over, the vacuum chuck (3) pressure head keeps the wire and solder substrate in a position bound, and the guillotine knife (4) runs to cut off the wire outside the pre-set position on both sides of the solder substrate; S3.5: The guillotine knife (4) is reset, the vacuum chuck (3) pressure head is lifted, and the vacuum suction is started at the same time to pick up the completed solder product with wire, and the vacuum chuck (3) moves to place the solder product on the conveyor belt.

5. The method of claim 4, wherein the method further comprises: The preformed solder product in step three is detected, including the thickness, wire arrangement quantity, wire arrangement spacing and wire oxidation degree of the preformed solder product. The thickness of the preformed solder product is measured by an electronic thickness gauge. The wire arrangement quantity and wire arrangement spacing of the preformed solder product are detected and analyzed by a visual detector. The wire arrangement quantity and wire arrangement spacing of the preformed solder product are detected to detect whether the wire on the solder substrate is broken, so that the broken wire is not correctly arranged. When the wire is broken, the tension of the wire arrangement is reduced.

6. The automated production method of height-limited preformed soldering pieces according to claim 5, characterized in that, When the detected data in step four does not reach the preset value of the preformed solder product, the automatically generated preformed solder production parameters are optimized, and the same product initial adjustment standard value is developed. When the generated parameters are standard preformed solder production parameters, and the thickness of the preformed solder product is greater than the preset value, the production temperature, pressure and time parameters of the preformed solder are increased by one same product initial adjustment standard value one by one. Conversely, when the thickness of the preformed solder product is less than the preset value, the production temperature, pressure and time parameters of the preformed solder are reduced by one same product initial adjustment standard value one by one.

7. The automated production method of height-limited preformed welding pieces according to claim 6, characterized in that, When the generated parameters are pre-estimated preformed solder production parameters, the thickness value detected by the preformed solder product and the thickness of the preformed solder product are compared, and the percentage of the difference is calculated, which is set as K. When the thickness value detected by the preformed solder product is greater than the thickness of the preformed solder product, K takes a positive value. Conversely, when the thickness value detected by the preformed solder product is less than the thickness of the preformed solder product, K takes a negative value. When the pre-estimated preformed solder production parameters are optimized, the pre-estimated preformed solder production parameters are multiplied by (1+K) to obtain the optimized pre-estimated preformed solder production parameters.

8. The automated production method of height-limited preformed welding pieces according to claim 7, characterized in that, The repeated step three and step four in the fifth step is to continuously optimize the preform solder production parameters, when the generated parameters are standard preform solder production parameters, and when adjusting again, the production temperature, pressure and time parameters of the preform solder are adjusted one by one, and the value is half of the previous value, until the difference between the detected value of the preform solder produced for more than three times and the preset value of the preform solder product is within the allowable error range, then save the adjusted standard preform solder production parameters as the continuous production parameters of the preform solder, when the generated parameters are estimated preform solder production parameters, still according to the way of multiplying (1+K) to optimize, until the difference between the detected value of the preform solder produced for more than three times and the preset value of the preform solder product is within the allowable error range, then save the adjusted preform solder production parameters as the continuous production parameters of the preform solder.

9. The automated production method of height-limited preformed soldering pieces according to claim 8, characterized in that, The continuous automatic production of preform solder product in the sixth step is to execute step three according to the adjusted preform solder production parameters, perform the steps of preform solder substrate feeding, heating, nitrogen injection, solder wire immersion in flux, wire arranging, wire pressing, wire cutting and discharging, and the produced preform solder is sampled and detected to feedback the production quality of the preform solder product in real time.

10. An automated production equipment of height-limited preformed soldering piece, which implements the automated production method of height-limited preformed soldering piece according to any one of claims 1-9, characterized in that, Including installation shell (1), the inside of installation shell (1) is installed heating platform (2), the inside of installation shell (1) is provided with nitrogen discharge pipe, nitrogen discharge pipe is located in the side of heating platform (2), the heating platform (2) is provided with vacuum chuck (3), the side of vacuum chuck (3) is installed with cutter (4), the inside of installation shell (1) is provided with the preset cutting area corresponding with cutter (4), the side of installation shell (1) is provided with spool (5), the between spool (5) and installation shell (1) is provided with guide rod (6) and guide rod (7), the between guide rod (6) and installation shell (1) is provided with flux groove (9), the other side of installation shell (1) is provided with fixed rod (8).

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