Manufacturing equipment and manufacturing method of adhesive tape

By using a co-extrusion molding and stretching process for the base film and pressure-sensitive adhesive film, the problem of organic solvent recovery in traditional tape manufacturing is solved, simplifying the process and reducing costs.

CN121424643APending Publication Date: 2026-01-30DER YIING PLASTIC CORP
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Patent Information

Application Number
CN202411019799.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-07-29
Publication Date
2026-01-30

AI Technical Summary

Technical Problem

Traditional tape manufacturing processes use organic solvents, which makes recycling difficult, makes it hard to achieve zero emissions, and the processes are complex and costly.

Method used

The manufacturing equipment employs a base film forming section, an adhesive film forming section, a co-extrusion molding section, and a stretching section. The base film and pressure-sensitive adhesive film are formed by hot-melt substrate and adhesive material, and co-extrusion molding and stretching processes are performed, eliminating the need for organic solvents.

Benefits of technology

This eliminates the need for organic solvents, simplifies the process, reduces costs, and improves production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses manufacturing equipment and a manufacturing method of an adhesive tape. The manufacturing equipment comprises a base film forming section, a glue film forming section, a co-extrusion forming section and a stretching section. The base film forming section is adapted to hot melt the substrate and form a base film. The adhesive film forming section is suitable for hot melting of an adhesive material and forming of a pressure-sensitive adhesive film. The co-extrusion forming section is respectively connected with the base film forming section and the adhesive film forming section, and the base film and the pressure-sensitive adhesive film enter the co-extrusion forming section to execute a co-extrusion forming process, so that a co-extrusion film with the base film and the pressure-sensitive adhesive film is obtained. And the stretching section is used for stretching the co-extruded film.
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Description

Technical Field

[0001] This invention relates to a manufacturing apparatus and method for an adhesive tape. Background Technology

[0002] Traditional adhesive tapes, such as varnished tapes, use organic solvents in their manufacturing process. Although organic solvents can be recycled, the cost of setting up recycling equipment is quite high, and it is also quite difficult to achieve a 100% recycling rate. Therefore, it is difficult to achieve zero detection of organic solvents, which does not meet environmental protection requirements.

[0003] In addition, the traditional tape manufacturing process is complex, which can lead to energy waste and increased processing costs. Summary of the Invention

[0004] The purpose of this invention is to provide a manufacturing apparatus and method for adhesive tape that can save on process costs. This invention does not require the addition of organic solvents, thus eliminating the need for solvent removal steps, shortening the process, and saving costs.

[0005] To achieve the above objectives, this invention provides a tape manufacturing apparatus, comprising a base film forming section, an adhesive film forming section, a co-extrusion molding section, and a stretching section. The base film forming section is suitable for hot-melt substrates and forms a base film. The adhesive film forming section is suitable for hot-melt adhesive materials and forms a pressure-sensitive adhesive film. The co-extrusion molding section is connected to both the base film forming section and the adhesive film forming section. The base film and the pressure-sensitive adhesive film enter the co-extrusion molding section to perform a co-extrusion molding process, thereby obtaining a co-extruded film having both a base film and a pressure-sensitive adhesive film. The stretching section performs a stretching process on the co-extruded film.

[0006] In one embodiment, the substrate comprises isotactic polypropylene or atactic polypropylene.

[0007] In one embodiment, the adhesive material includes styrene-ethylene-butene-styrene block copolymer, styrene-isoprene-styrene block copolymer, resin, thermoplastic elastomer pressure-sensitive adhesive, or polyacrylate.

[0008] In one embodiment, the film forming section includes a hot melt adhesive delivery device.

[0009] In one embodiment, the co-extrusion molding section includes at least one calendering roller, the surface of which is coated with Teflon or anti-stick silicone.

[0010] In one embodiment, the co-extrusion molding section includes a T-type extrusion die, and the co-extruded film is co-extruded via the T-type extrusion die.

[0011] In one embodiment, the stretching process includes a uniaxial stretching process, wherein the elongation parameter of the uniaxial stretching process is 1.5, 2.0, 2.5, or 3.0 times.

[0012] In one embodiment, the stretching process includes a biaxial stretching process, wherein the elongation parameters of the biaxial stretching process are 1.5*1.5, 2.0*2.0, 2.5*2.5, or 3.0*3.0 times.

[0013] To achieve the above objectives, the present invention also proposes a method for manufacturing an adhesive tape, comprising at least the following steps: a hot-melt step: hot-melting a substrate and an adhesive material to form a base film and a pressure-sensitive adhesive film respectively; a co-extrusion molding step: performing a co-extrusion molding process on the base film and the pressure-sensitive adhesive film to obtain a co-extruded film having a base film and a pressure-sensitive adhesive film; and a stretching step: performing a stretching process on the co-extruded film.

[0014] In one embodiment, the hot-melt step involves using a hot-melt adhesive delivery device to heat-melt the adhesive material to form a pressure-sensitive adhesive film.

[0015] In one embodiment, the manufacturing method further includes a machine washing step.

[0016] In one embodiment, the co-extrusion molding process uses at least one calendering roller, the surface of which is coated with Teflon or anti-stick silicone.

[0017] In one embodiment, the co-extruded film is formed by co-extruded using a T-type extrusion die.

[0018] In summary, the tape manufacturing equipment and method of the present invention includes a hot-melt substrate and an adhesive material to form a base film and a pressure-sensitive adhesive film, respectively; a co-extrusion molding process is performed on the base film and the pressure-sensitive adhesive film to obtain a co-extruded film having the base film and the pressure-sensitive adhesive film; and a stretching process is performed on the co-extruded film. Therefore, the manufacturing equipment or method of the present invention produces tape through a co-extrusion molding process, thus saving process costs. Furthermore, the present invention does not require the addition of organic solvents, thus eliminating the need for solvent removal steps, and simultaneously shortening the process and saving costs. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a tape manufacturing apparatus according to an embodiment of the present invention.

[0020] Figure 2A This is a three-dimensional schematic diagram of an adhesive tape manufactured by a manufacturing apparatus according to an embodiment of the present invention.

[0021] Figure 2B This is a cross-sectional schematic diagram of an adhesive tape manufactured by a manufacturing apparatus according to an embodiment of the present invention.

[0022] Figure 3 This is a schematic flowchart illustrating a method for manufacturing adhesive tape according to an embodiment of the present invention.

[0023] Figure 4A and Figure 4B These are schematic diagrams illustrating the thermal analysis of adhesive materials according to an embodiment of the present invention.

[0024] Figure 5A and Figure 5B These are SEM morphology diagrams of substrate cross sections from different embodiments of the present invention.

[0025] Figure 6A and Figure 6B These are SEM morphology diagrams of the cross-sections of co-extruded tapes according to different embodiments of the present invention.

[0026] Figure 7A and Figure 7B These are schematic diagrams illustrating the peel test and yield strength test of an adhesive tape sample according to an embodiment of the present invention.

[0027] Figure 7C and Figure 7D These are schematic diagrams showing peel tests and strain percentage tests of tape samples from different embodiments of the present invention.

[0028] Figure 8A This is an image of a tape sample according to an embodiment of the present invention.

[0029] Figures 8B to 8E They are respectively Figure 8A Images of tape samples after being subjected to uniaxial stretching at different ratios.

[0030] Figures 9A to 9D These are SEM morphology diagrams of the cross sections of an adhesive tape sample after being subjected to uniaxial stretching at different ratios, representing an embodiment of the present invention.

[0031] Figures 10A to 10C These are schematic diagrams illustrating the stretching process of an adhesive tape sample according to an embodiment of the present invention.

[0032] Figures 11A to 11D The images show tape samples from one embodiment of the present invention after being subjected to biaxial stretching at different ratios. Detailed Implementation

[0033] The following description, with reference to the accompanying drawings, illustrates the manufacturing equipment and method for the adhesive tape according to embodiments of the present invention, wherein the same components will be described using the same reference numerals. The components appearing in the following embodiments are only for illustrating their relative relationships and do not represent the actual proportions or dimensions of the components.

[0034] Figure 1 This is a schematic diagram of a tape manufacturing apparatus according to an embodiment of the present invention. Figure 2A This is a three-dimensional schematic diagram of an adhesive tape manufactured by a manufacturing apparatus according to an embodiment of the present invention. Figure 2B This is a cross-sectional schematic diagram of an adhesive tape manufactured by a manufacturing apparatus according to an embodiment of the present invention. Figure 3 This is a schematic flowchart illustrating a method for manufacturing adhesive tape according to an embodiment of the present invention.

[0035] Please refer to this first. Figure 1 The manufacturing equipment (or manufacturing machine) 1 of the present invention can manufacture adhesive tapes, such as, but not limited to, varnished adhesive tapes. The manufacturing equipment 1 includes a base film forming section 11, an adhesive film forming section 12, a co-extrusion molding section 13, and a stretching section 14.

[0036] It should be noted that the manufacturing equipment 1 described herein can be a single machine or a combination of multiple machine units connected in series or parallel. When the manufacturing equipment 1 is a single machine, each section (11-16) can be a part of that single machine; when the manufacturing equipment 1 is composed of multiple machine units, each section (11-16) can correspond to a machine unit, or multiple sections can correspond to machine units. This invention does not limit the manufacturing equipment 1 to a single machine or a combination of multiple machine units. In one embodiment, the manufacturing equipment 1 may include a multi-axis (e.g., biaxial or triaxial) film co-extrusion device.

[0037] The base film forming section 11 is adapted to heat-melt the substrate and form a base film. In other words, for example, a granular substrate can be fed into the base film forming section 11 through the inlet, and after being heated and melted by the screw in the base film forming section 11, a base film is formed. In one embodiment, the substrate may include, but is not limited to, polypropylene (PP), such as isotactic polypropylene or atactic polypropylene. The isotactic polypropylene has a density of 0.903 g / cm³. 3 Its melting point is between 150 and 170°C. The density of atactic polypropylene is 0.900 g / cm³. 3 Its melting point is between 130 and 160°C. Random polypropylene has high strength, good heat resistance, good dimensional stability, excellent low-temperature toughness (good flexibility), good transparency, and good gloss, making it more suitable as a base film material.

[0038] In one embodiment, the melt index (MI) of isotactic or atactic polypropylene may be, for example, 25. In one embodiment, after a heat treatment at, for example, 280°C for 1 hour, the machine may be washed with polypropylene with an MI between 1 and 25 to enhance the stability of the base film formation. In one embodiment, the hot melt temperature of the substrate (PP material) at the screw is, for example, but not limited to, around 210°C.

[0039] The film forming section 12 is suitable for hot melt adhesive materials and forms a pressure-sensitive adhesive film. In other words, the adhesive material is fed into the film forming section 12 and heated and melted in the film forming section 12 to form a viscous pressure-sensitive adhesive film. In one embodiment, the adhesive material may include, for example but not limited to, styrene-ethylene-butene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), resin, thermoplastic elastomer pressure-sensitive adhesive, or polyacrylate. Among them, the thermoplastic elastomer pressure-sensitive adhesive is mainly made of SIS and C5 petroleum resin. The film forming section 12 of this embodiment may include a hot melt adhesive conveying device 121, which heats the adhesive material to make the formed pressure-sensitive adhesive film more uniform. In one embodiment, a washing machine (adhesive washing) may be used, for example, for 2 to 3 hours, to confirm that the adhesive material can form a film after extrusion and to confirm whether the adhesive viscosity is suitable. In one embodiment, the preheating temperature of the adhesive film forming section 12 may be, for example, 140°C, and the preheating time may be, for example, 120 seconds. In one embodiment, the hot melt temperature of the adhesive material may be, for example, but not limited to, around 170°C.

[0040] In this embodiment, the tape process uses a hot melt adhesive delivery device 121, which can significantly improve the problems of poor co-extrusion flowability and dispersibility during the process of uniformly melting the adhesive material. The hot melt adhesive delivery device 121 heats the adhesive material to above its melting point and applies it uniformly to the substrate at a certain rate, ensuring that the adhesive material is uniformly dispersed and adheres to the surface of the substrate.

[0041] Regarding temperature control, the hot melt adhesive delivery device 121 is equipped with a precise temperature control system to ensure that the adhesive melts and coats at the most suitable temperature. Temperature control capability is crucial for uniform coating and the stability of adhesive properties. In terms of improved flowability, the operation of the hot melt adhesive delivery device 121 enhances the flowability of the adhesive, making it easier to form a uniform coating on the substrate surface. These improvements are essential for ensuring material uniformity and consistency in co-extrusion molding processes.

[0042] It should be noted that the base film forming section 11 for forming the base film and the adhesive film forming section 12 for forming the pressure-sensitive adhesive film can be performed at the same time; or, the base film forming section 11 and the adhesive film forming section 12 can be performed at different times, and the present invention is not limited thereto.

[0043] The co-extrusion molding section 13 is connected to the base film forming section 11 and the adhesive film forming section 12 respectively. After the base film formed by the base film forming section 11 and the pressure-sensitive adhesive film formed by the adhesive film forming section 12 enter the co-extrusion molding section 13, the co-extrusion molding process can be performed. The co-extrusion molding process can be called the co-extrusion process, thereby obtaining a co-extruded film with a base film and a pressure-sensitive adhesive film.

[0044] In one embodiment, one shaft may be a screw that pours the melted adhesive material into the co-extrusion molding section 13 after being melted by the hot melt adhesive conveying device 121, while the other shaft may be a random or isotactic polypropylene that is fed into the screw in granular form, thereby producing a co-extruded film by the co-extrusion molding process.

[0045] The co-extrusion molding section 13 of this embodiment may include a T-die, through which the co-extruded film is co-extruded. In one embodiment, the co-extrusion molding section 13 may include at least one calendering roller, the number of which is not limited. The surface of the calendering roller may be coated (e.g., coated or covered) with Teflon or anti-stick silicone to avoid roller sticking. Here, the co-extruded tape is drawn into a film using a casting method, and the speed difference of the cooling rollers is adjusted to achieve the desired thickness. Finally, the finished product is wound up and subjected to uniaxial or biaxial stretching as required in the following stretching section 14 to thin the product and achieve a thin and transparent effect.

[0046] The stretching section 14 performs a stretching process on the co-extruded film. Here, the co-extruded film formed in the co-extruded molding section 13 can enter the stretching section 14 for a stretching process. In one embodiment, the stretching process may include a uniaxial stretching process, and the stretching parameters of the uniaxial stretching process may be, for example, but not limited to, 1.5, 2.0, 2.5, or 3.0 times, or other multiples. In one embodiment, the stretching process may include a biaxial stretching process, and the stretching parameters of the biaxial stretching process may be, for example, but not limited to, 1.5*1.5, 2.0*2.0, 2.5*2.5, or 3.0*3.0 times, or other multiples; the present invention is not limited to these. Here, uniaxial stretching may, for example, be along the stretching direction (X-axis) of the co-extruded film, i.e., the longitudinal (MD) direction of the film; while biaxial stretching may, for example, be along the stretching direction (X-axis) of the co-extruded film and another direction perpendicular to the stretching direction (Y-axis), i.e., simultaneously stretching the longitudinal (MD) and transverse (TD) directions of the film, with the stretching parameters depending on the required finished product specifications or design parameter requirements. In one embodiment, the stretching process temperature range may be, for example, 140°C, and the stretching time may be, for example, 8 seconds. The heat setting temperature may be, for example, 140°C.

[0047] In one embodiment, the manufacturing apparatus 1 may further include a cooling and shaping section 15 for cooling and shaping the co-extruded film after the stretching process. In another embodiment, the manufacturing apparatus 1 may further include a winding section 16 for winding the co-extruded film, which, after appropriate cutting, yields an adhesive tape. Here, the surfaces of the cooling rollers used in the cooling and shaping section 15 and the winding rollers (e.g., wooden cylinders) used in the winding section 16 may also be respectively coated (e.g., coated or covered) with Teflon or anti-stick silicone to prevent the rollers from sticking.

[0048] Please refer to Figure 2A and Figure 2B In one embodiment of the present invention, the tape 2 produced by the manufacturing apparatus 1 may include a base layer 21 and a pressure-sensitive adhesive layer 22, the pressure-sensitive adhesive layer 22 being disposed on the upper surface 211 of the base layer 21. In one embodiment, the tape produced by the manufacturing apparatus 1 can be cut to obtain tape 2 of the required specifications. In some embodiments, the thickness of the tape 2 may be, for example, 40 micrometers (μm), the width may be, for example, 5 to 100 centimeters (cm), and the length may be, for example, 90 meters, depending on actual needs. In some embodiments, the tape 2 may be a transparent, varnished tape.

[0049] In addition, such as Figure 3 As shown, the present invention also proposes a method for manufacturing an adhesive tape, which may include at least a hot-melt step S01 to a winding step S05.

[0050] First, the hot-melt step S01 involves hot-melting the substrate and adhesive material to form a base film and a pressure-sensitive adhesive film, respectively. In one embodiment, the hot-melt step uses a hot-melt adhesive delivery device to hot-melt the adhesive material to form the pressure-sensitive adhesive film. Additionally, the hot-melt step S01 may include a washing step, for example, washing the machine for 2-3 hours to confirm that film can be formed after extrusion and to confirm the stability of the base film and whether the adhesion of the pressure-sensitive adhesive film is suitable.

[0051] Next, the co-extrusion molding step S02 involves co-extruding the base film and the pressure-sensitive adhesive film to obtain a co-extruded film containing both the base film and the pressure-sensitive adhesive film. The co-extruded film is formed using a T-shaped extrusion die. Furthermore, the co-extrusion molding process can utilize at least one calendering roller, the surface of which is coated with Teflon or anti-stick silicone to prevent roller adhesion.

[0052] Next, the stretching step S03 is to perform a stretching process on the co-extruded film. The stretching process may include a uniaxial stretching process or a biaxial stretching process. The stretching parameters for the uniaxial stretching process may be, for example, but not limited to, 1.5, 2.0, 2.5, or 3.0 times, while the stretching parameters for the biaxial stretching process may be, for example, but not limited to, 1.5*1.5, 2.0*2.0, 2.5*2.5, or 3.0*3.0 times.

[0053] Next, the cooling and shaping step S04 involves cooling and shaping the co-extruded film after the stretching process. The cooling rollers used in this step may also be coated with Teflon or anti-stick silicone to prevent roller sticking.

[0054] Finally, the winding step S05 is to wind up the co-extruded film to obtain the tape.

[0055] Furthermore, other technical features of the method for manufacturing the tape of the present invention have been described in detail in the above-described manufacturing equipment, and will not be described further here.

[0056] The characteristics of the tape according to some embodiments of the present invention will be described below with reference to the accompanying drawings. Figure 4A and Figure 4B These are schematic diagrams illustrating the thermal analysis of an adhesive material according to an embodiment of the present invention. Figure 5A and Figure 5B These are SEM morphology diagrams of substrate cross-sections from different embodiments of the present invention. Figure 6A and Figure 6B These are SEM morphology diagrams of the cross-sections of co-extruded tapes according to different embodiments of the present invention. Figure 7A and Figure 7B These are schematic diagrams illustrating peel tests and yield strength tests of tape samples from different embodiments of the present invention. Figure 7C and Figure 7D These are schematic diagrams illustrating peel tests and strain percentage (Strain%) tests on tape samples from different embodiments of the present invention. Figure 8A This is an image of a tape sample according to an embodiment of the present invention. Figures 8B to 8E They are respectively Figure 8A Images of tape samples after uniaxial stretching at different ratios. Figures 9A to 9D These are SEM images of the cross-sections of an adhesive tape sample from one embodiment of the present invention after being subjected to uniaxial stretching at different ratios. Figures 10A to 10C These are schematic diagrams illustrating the stretching process of an adhesive tape sample according to an embodiment of the present invention. Figures 11A to 11D The images show tape samples from one embodiment of the present invention after being subjected to biaxial stretching at different ratios.

[0057] First of all, Figure 5A The base material is isotactic polypropylene (IPP). Figure 5B The substrate is random polypropylene (APP); Figure 6A This is a schematic SEM cross-section of a co-extruded tape made of isotactic polypropylene (IPP) with a flow rate of 16 and an adhesive material with a flow rate of 16. Figure 6B This is a schematic SEM cross-section of a co-extruded tape containing atactic polypropylene (APP) at a flow rate of 16 and an adhesive material at a flow rate of 16; Furthermore, Figures 4A to 4B , Figures 6A to 9D and Figures 11A to 11D The adhesives used in the embodiments are all thermoplastic elastomer pressure-sensitive adhesives.

[0058] Please refer to Figure 4A and Figure 4B In the thermal analysis of the adhesive material (thermoplastic elastomer pressure-sensitive adhesive) in this embodiment, Figure 4A The 95% pyrolysis point temperature (T0) measured using a thermogravimetric analyzer (TGA) d 95% The temperature was 404.2℃, while Figure 4BThe melting point (T) is measured using a thermal scanning analyzer (DSC). m The temperature was 59.3℃.

[0059] Measurements showed that Figure 5A The substrate (isotactic polypropylene) shown has a thickness of 178 μm, while Figure 5B The thickness of the substrate (random polypropylene) shown is 190 μm. Additionally, measurements revealed that... Figure 6A The thickness of the substrate (isotactic polypropylene) of the co-extruded tape shown is 85 μm, while the thickness of the adhesive material is 101 μm. Figure 6B The co-extruded tape shown has a substrate (random polypropylene) thickness of 84 μm and an adhesive thickness of 87 μm. Figure 6A and Figure 6B It is clearly visible that there is a distinct interface between the substrate and the adhesive, indicating that the two are well bonded.

[0060] Please refer to Figure 7A , Figure 7A The 180-degree peel test was performed on the tape sample attached to polypropylene (PP). The 180-degree peel test was conducted according to the ASTM D3330 standard, with a peel speed of 300 mm / min. The dimensions of the tape sample were 25 mm * 305 mm. Figure 7A The processing conditions for the substrate and adhesive materials of the three different tape samples shown are as follows: isotactic polypropylene with a flow rate of 16 and an adhesive material with a flow rate of 16 (IPP 16 / adhesive material 16); atactic polypropylene with a flow rate of 26 and an adhesive material with a flow rate of 16 (APP 26 / adhesive material 16); and atactic polypropylene with a flow rate of 16 and an adhesive material with a flow rate of 16 (APP 16 / adhesive material 16). Figure 7A It is evident that the higher the flow rate of atactic polypropylene (APP), the worse the viscosity. Specifically, APP 26 / adhesive 16 has the worst viscosity, while APP 16 / adhesive 16 has the best viscosity.

[0061] Please refer to Figure 7B , Figure 7B The yield strength test was conducted according to ASTM D3759 standard, with a tensile speed of 50 mm / min and a sample size of 12 mm * 150 mm for the tape. Figure 7B The substrate and adhesive conditions of the three tape samples are as follows: Figure 7A Same. By Figure 7B It is evident from the data that atactic polypropylene (APP) has a higher yield strength, proving that atactic polypropylene (APP) is more suitable as a base film material.

[0062] like Figure 7C As shown, Figure 7C A 180-degree peel test was performed on the tape sample attached to a stainless steel plate. Figure 7CThe substrate and adhesive conditions of three different tape samples and Figure 7A Same. By Figure 7C It is clear from the results that APP 26 / adhesive material 16 has the worst adhesion, while APP 16 / adhesive material 16 has the best adhesion.

[0063] like Figure 7D As shown, Figure 7D The substrate and adhesive conditions of three different tape samples and Figure 7A The results are similar. Among them, APP 26 and APP 16 have higher strain percentages and better mechanical strength, further demonstrating that atactic polypropylene (APP) is suitable as a base film material.

[0064] Figure 8A This is an image of a sample of adhesive tape from one embodiment. Figure 8B The extension parameter is 1.5 times (Ratio). Figure 8C The extension parameter is 2.0 times. Figure 8D The extension parameter is 2.5 times, while Figure 8E The extension parameter is 3.0 times.

[0065] exist Figures 9A to 9D In the SEM morphology of the cross-section after uniaxial tension, Figure 9A The extension parameter is 1.5 times. Figure 9B The extension parameter is 2.0 times. Figure 9C The extension parameter is 2.5 times, while Figure 9D The extension parameter is 3.0 times.

[0066] Figure 10A This is a schematic diagram of the tape sample before it was stretched. Figure 10B This is a schematic diagram of uniaxial (Y-axis) stretching of the tape sample. Figure 10C This is a schematic diagram of biaxial (X-axis, Y-axis) stretching of the tape sample.

[0067] also, Figure 11A The extension parameter is 1.5 * 1.5 times. Figure 11B The extension parameter is 2.0 * 2.0 times. Figure 11C The extension parameter is 2.5 * 2.5 times, while Figure 11D The extension parameter is 3.0 * 3.0 times.

[0068] Please refer to Tables 1 through 4 below. Tables 1 through 3 show the haze of the tape after uniaxial stretching according to different embodiments of the present invention, while Table 4 shows the haze of the tape after biaxial stretching according to one embodiment of the present invention. Here, the base layer material in Tables 1 and 4 is isotactic polypropylene, the base layer material in Tables 2 and 3 is atactic polypropylene, and the pressure-sensitive adhesive layer material used in Tables 1 through 4 is thermoplastic elastomer pressure-sensitive adhesive. Furthermore, MD direction refers to the longitudinal direction of the film, TD direction refers to the transverse direction of the film, and T... t For penetration, T d T is the flux of the scattered light. p Transmittance of parallel light.

[0069] Table 1:

[0070]

[0071] Table 2:

[0072]

[0073] Table 3:

[0074]

[0075] Table 4:

[0076]

[0077]

[0078] In summary, the tape manufacturing equipment and method of the present invention includes a hot-melt substrate and an adhesive material to form a base film and a pressure-sensitive adhesive film, respectively; a co-extrusion molding process is performed on the base film and the pressure-sensitive adhesive film to obtain a co-extruded film having the base film and the pressure-sensitive adhesive film; and a stretching process is performed on the co-extruded film. Therefore, the manufacturing equipment or method of the present invention produces tape through a co-extrusion molding process, thus saving process costs. Furthermore, the present invention does not require the addition of organic solvents, thus eliminating the need for solvent removal steps, and simultaneously shortening the process and saving costs.

[0079] The above description is merely illustrative and not restrictive. Any equivalent modifications or alterations made without departing from the spirit and scope of this invention should be included in the claims.

[0080] Figure 1: Manufacturing equipment

[0081] 11: Basement membrane formation segment

[0082] 12: Film Formation Section

[0083] 121: Hot melt adhesive conveying device

[0084] 13: Co-extrusion molding section

[0085] 14: Tensioning section

[0086] 15: Cooling and Shaping Section

[0087] 16: Rewinding Section

[0088] 2: Adhesive tape

[0089] 21: Basal layer

[0090] 211: Upper surface

[0091] 22: Pressure-sensitive adhesive layer

[0092] S01~S05: Steps

Claims

1. An apparatus for manufacturing an adhesive tape, comprising: a base film forming section adapted to heat melt a base material and form a base film; an adhesive film forming section adapted to heat melt an adhesive material and form a pressure sensitive adhesive film; a co-extrusion molding section connected to the base film forming section and the adhesive film forming section, respectively, the base film and the pressure sensitive adhesive film entering the co-extrusion molding section to perform a co-extrusion molding process to obtain a co-extruded film having the base film and the pressure sensitive adhesive film; and a stretching section performing a stretching process on the co-extruded film.

2. The apparatus of claim 1, wherein the base material comprises isotactic polypropylene or atactic polypropylene.

3. The apparatus of claim 1, wherein the adhesive material comprises styrene-ethylene-butylene-styrene block copolymer, styrene-isoprene-styrene block copolymer, resin, thermoplastic elastomer pressure sensitive adhesive, or polyacrylate.

4. The apparatus of claim 1, wherein the adhesive film forming section comprises a hot melt adhesive delivery device.

5. The apparatus of claim 1, wherein the co-extrusion molding section comprises at least one calender roller, a surface of the calender roller coated with Teflon or anti-stick silicone.

6. The apparatus of claim 1, wherein the co-extrusion molding section comprises a T-shaped extrusion die, the co-extruded film being co-extruded via the T-shaped extrusion die.

7. The apparatus of claim 1, wherein the stretching process comprises a uniaxial stretching process, an extension parameter of the uniaxial stretching process being 1.5, 2.0, 2.5, or 3.0 times.

8. The apparatus of claim 1, wherein the stretching process comprises a biaxial stretching process, an extension parameter of the biaxial stretching process being 1.5*1.5, 2.0*2.0, 2.5*2.5, or 3.0*3.0 times.

9. A method for manufacturing an adhesive tape, comprising at least the following steps: a hot melting step: heat melting a base material and an adhesive material to form a base film and a pressure sensitive adhesive film, respectively; a co-extrusion molding step: performing a co-extrusion molding process on the base film and the pressure sensitive adhesive film to obtain a co-extruded film having the base film and the pressure sensitive adhesive film; and a stretching step: performing a stretching process on the co-extruded film.

10. The method of claim 9, wherein the base material comprises isotactic polypropylene or atactic polypropylene.

11. The method of claim 9, wherein the adhesive material comprises styrene-ethylene-butylene-styrene block copolymer, styrene-isoprene-styrene block copolymer, resin, thermoplastic elastomer pressure sensitive adhesive, or polyacrylate.

12. The method of claim 9, wherein the hot melting step is performed using a hot melt adhesive delivery device to heat melt the adhesive material to form the pressure sensitive adhesive film.

13. The manufacturing method of claim 9, further comprising: a washing step.

14. The method of claim 9, wherein the co-extrusion molding process uses at least one calender roller, a surface of the calender roller coated with Teflon or anti-stick silicone.

15. The manufacturing method of claim 9, wherein the co-extruded film is co-extrusion molded through a T-die.

16. The manufacturing method of claim 9, wherein the stretching process comprises a uniaxial stretching process having an extension parameter of 1.5, 2.0, 2.5, or 3.0 times.

17. The manufacturing method of claim 9, wherein the stretching process comprises a biaxial stretching process having an extension parameter of 1.5*1.5, 2.0*2.0, 2.5*2.5, or 3.0*3.0 times.