Automatic warehousing system and loading method for semiconductor materials

Abstract

The embodiment of the invention provides an automatic warehousing system and a loading method for semiconductor materials. The automatic warehousing system comprises a loading storage machine assembly and a crown block system. The loading storage machine assembly comprises a supporting seat frame, a loading mechanism and a plurality of wafer carriers, the loading mechanism is provided with a first connection position and a second connection position, the loading mechanism comprises a carrier stand, a wafer stand, an X-axis assembly, a Z-axis assembly and a carrying table, the carrying table is arranged on the X-axis assembly and has a convertible high-position state and a convertible low-position state, and the Z-axis assembly is arranged on the carrier stand. The crown block system comprises an elevated track and a conveying device, and the conveying device is movably arranged on the elevated track in the extending direction of the elevated track and in the Z direction. And the crown block system is arranged to be in butt joint with the loading storage machine assembly, so that the in-out warehouse operation of the wafer carrier can be automatically realized. Therefore, the semiconductor material automatic warehousing system has the advantages of improving the wafer transfer yield and the working efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to an automated semiconductor material storage system and a method for loading semiconductor materials. Background Technology

[0002] Semiconductor manufacturing plants currently rely on manual wafer handling. However, with the increasing number of large-scale semiconductor equipment integration production lines in my country, manual wafer handling is prone to damage, leading to issues such as wafer fragmentation and cracks. Furthermore, manual handling suffers from low efficiency and generates significant dust in the workshop, hindering clean wafer production. Summary of the Invention

[0003] In view of this, the present invention aims to provide an automated semiconductor material storage system to solve the problem of low handling efficiency in existing automated semiconductor material storage systems.

[0004] This invention provides an automated warehousing system for semiconductor materials.

[0005] Another aspect of the present invention provides a method for loading semiconductor materials.

[0006] The automated semiconductor material storage system of this invention includes a loading storage unit assembly, an overhead crane system, and a control system.

[0007] The loading storage assembly includes a support frame, a loading mechanism, and multiple wafer carriers. The loading mechanism has a first docking position and a second docking position. The wafer carriers are used to place wafer cassettes. The support frame includes multiple wafer storage stages for placing wafer cassettes. The loading mechanism includes a carrier platform, a wafer rack, an X-axis assembly, a Z-axis assembly, and a transport stage. The carrier platform is disposed on one side of the wafer rack in the X-direction. The X-axis assembly is disposed on the Z-axis assembly and can drive the wafer cassettes to move along the X-direction. The transport stage is disposed on the X-axis assembly. At the first docking position and the second docking position, the transport stage has a switchable high position and a low position, relying on the X-axis assembly and the Z-axis assembly. The shaft assembly transports the wafer cassette between the carrier platform and the wafer platform; the overhead crane system includes an overhead track and a conveying device, which is movably mounted on the overhead track along the extension direction of the overhead track and along the Z-axis. The conveying device can be correspondingly mounted to the carrier platform in the Z-axis to realize the entry and exit operations of the wafer carrier; the control system can cooperate with the loading and storage assembly and respond to the signals of the overhead crane system.

[0008] The automated semiconductor material warehousing system of this invention, through the docking of an overhead crane system with a loading and storage assembly, automates the entry and exit operations of wafer carriers, enabling automatic loading and unloading of wafer carriers, reducing manual intervention, and improving work efficiency. This avoids the low handling efficiency and contamination risks associated with manual wafer handling, as well as the problems of wafer fragmentation and cracking caused by manual handling. The overhead crane system helps improve wafer yield, increasing work efficiency and product quality while reducing worker fatigue. Therefore, the overhead crane system improves wafer carrier transportation efficiency, reduces wafer loss rate, lowers labor costs, and reduces contamination risks.

[0009] Meanwhile, the automated semiconductor material storage system of this invention divides the loading mechanism into a carrier rack, a wafer rack, an X-axis assembly, a Z-axis assembly, and a transport platform. Specifically, the Z-axis movement of the transport platform allows it to rise and fall, transitioning between high and low positions, thereby connecting the wafer cassettes located on the transport platform to the wafer rack and carrier rack. The X-axis movement of the transport platform enables the wafer cassettes to be transferred between the wafer rack and carrier rack, achieving wafer cassette loading, unloading, and transfer operations without human intervention. This transfer operation offers advantages such as high efficiency, good stability, and high repeatability, significantly improving the efficiency of wafer cassette transfer operations.

[0010] The automated semiconductor material storage system of this invention has the advantages of improving wafer transfer yield and work efficiency.

[0011] In one embodiment, the loading mechanism has a placement cavity, the Z-axis assembly includes a Z-axis drive and a lifting assembly, the lifting assembly being movably disposed in the placement cavity along the Z-axis via the Z-axis drive; the X-axis assembly includes a sliding stage and an X-axis drive, the sliding stage being disposed on the lifting assembly and movably disposed along the X-axis via the X-axis drive, and the transport platform being disposed on the sliding stage.

[0012] In one embodiment, the Z-axis drive includes a motor and a lead screw, the output end of the motor is connected to the lead screw, the lifting assembly includes a connecting plate and a mating component, the connecting plate has a connecting hole, the mating component is fixed in the connecting hole, the power end of the motor is disposed on the support frame, the lead screw is threadedly engaged with the mating component, and the sliding platform is slidably engaged on the upper end surface of the connecting plate, so as to enable the transport platform to switch between the high state and the low state in either the first docking position or the second docking position.

[0013] In one embodiment, the wafer carrier includes a housing and a base plate. The base plate is disposed at the lower end of the housing. At the first docking position, the base plate is movably disposed on the loading mechanism along the Z direction, so that the wafer cassette can be moved between the carrier stand and the transport stage by adjusting the height of the base plate and the height of the transport stage. At the second docking position, the wafer cassette can be moved between the transport stage and the wafer stand by adjusting the height of the transport stage.

[0014] In one embodiment, the automated semiconductor material storage system of the present invention further includes grippers disposed on the loading mechanism, the grippers being used to hold the wafer cassette in order to transfer the wafer cassette between the transport stage and the wafer rack.

[0015] In one embodiment, the loading mechanism further includes a carrier frame, which includes a base platform, a first support frame, and a second support frame. The first support frame, the second support frame, and the base platform form a mounting cavity. The first support frame and the second support frame are spaced apart on the base platform along the Y direction to form a loading port extending along the X direction in the region between the upper surfaces of the first support frame and the second support frame. The upper surfaces of the first support frame and the second support frame form the wafer rack. At the second docking position, the transport stage can extend or retract into the mounting cavity through the loading port to realize the conversion between the high position state and the low position state, so that the wafer cassette can be detached from or attached to the wafer rack.

[0016] In one embodiment, the support frame includes a frame body and a plurality of wafer storage stages arranged in layers on the frame body.

[0017] In one embodiment, the loading and storage assembly further includes an inbound / outbound robot, which includes a guide rail, a rotating arm, and a movable tray. The guide rail is movably mounted on the frame along the Z-axis, the rotating arm is rotatably mounted on the guide rail, and the movable tray is connected to the rotating arm. The movable tray can be inserted under the wafer rack and can connect the wafer cassette between the movable tray and the wafer rack to realize the inbound operation of the wafer cassette.

[0018] In one embodiment, the conveying device includes a connected transporter and a pick-and-place device. The transporter is movably mounted on the elevated track along its extension direction. When entering or leaving the warehouse, the transporter and the carrier platform are positioned correspondingly in the Z direction. The retractable end of the pick-and-place device is fixed to the transporter, and the other end of the pick-and-place device is detachably connected to the wafer carrier so that the wafer carrier can be picked up, placed, and transported by rewinding the pick-and-place device.

[0019] In one embodiment, the automated semiconductor material storage system further includes a fan filtration unit disposed on top of the support frame to purify the environment within the support frame.

[0020] The semiconductor material loading method of this invention, according to any one of the above-described automated semiconductor material storage systems, includes: S1 Along the extension direction of the elevated track, the conveying device moves to a predetermined position, and the conveying device lowers the wafer carrier onto the carrier platform, and the bottom support plate of the carrier platform moves down; S2 controls the transport platform to move along the X direction toward the carrier platform to the first docking position through the X-axis assembly, and then drives the transport platform to move upward through the Z-axis assembly to realize the transition from a low position to a high position, and makes the height of the transport platform higher than the height of the base plate to dock the wafer cassette from the base plate to the transport platform; S3 controls the carrier to move along the X direction toward the wafer rack to the second docking position via the X-axis assembly, and then drives the carrier to move downward via the Z-axis assembly to achieve a transition from a high position to a low position, and to make the height of the carrier lower than the height of the wafer rack, so as to dock the wafer cassette from the carrier to the wafer rack. S4 uses the inbound / outbound robotic arm to transfer the wafer cassette from the wafer rack to the wafer storage platform, and S1, S2, S3 and S4 repeat in sequence.

[0021] In one embodiment, the loading and storage assembly further includes an inbound / outbound robot, which includes a guide rail base, a rotating arm, and a movable pallet. The guide rail base is movably mounted on the support frame along the Z-axis, and the rotating arm is rotatably mounted on the guide rail base. During warehousing, the rotating arm is rotated to insert the movable pallet under the wafer rack, the guide rail is raised to a predetermined height, and the angle of the rotating arm is rotated to place the wafer box on the wafer storage platform to realize the warehousing of the wafer box. During the outbound process, the moving pallet is inserted into the wafer storage stage by rotating the rotating arm, the guide rail is lowered, and the angle of the rotating arm is rotated to place the wafer box on the wafer rack to realize the outbound process of the wafer box. Attached Figure Description

[0022] Figure 1 This is a perspective view of an automated semiconductor material storage system according to an embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of the structure of the crane system, loading mechanism and wafer carrier in an embodiment of the present invention.

[0024] Figure 3 This is a side view of an automated semiconductor material storage system according to an embodiment of the present invention.

[0025] Figure 4 This is a perspective view of the loading mechanism according to an embodiment of the present invention.

[0026] Figure 5 This is a perspective view of the loading mechanism according to an embodiment of the present invention, with the bottom support plate moving down and the transport platform moving to the first docking position.

[0027] Figure 6 This is a perspective view of the loading mechanism according to an embodiment of the present invention, with the bottom support plate moving down and the transport platform moving to the second docking position.

[0028] Figure 7 This is a perspective view of the loading mechanism and wafer carrier according to an embodiment of the present invention, with the transport platform moving to the second docking position.

[0029] Figure 8 This is a perspective view of the loading mechanism and wafer carrier according to an embodiment of the present invention. At the second docking position, the transport platform moves downward.

[0030] Figures 9-18 This is a perspective view of an automated semiconductor material storage system according to an embodiment of the present invention, showing the process of a robotic arm moving to a wafer rack to pick up and place wafer boxes.

[0031] Figure 19 This is a perspective view of the loading mechanism according to an embodiment of the present invention, with some parts omitted.

[0032] Explanation of reference numerals in the attached figures: Loading storage unit assembly 1; Support frame 11; frame body 111; wafer storage stage 112; Loading mechanism 12; carrier platform 121; wafer platform 122; X-axis assembly 123; Z-axis assembly 124; Z-axis drive component 1241; lead screw 12411; motor 12412; Lifting component 1242; 125; 126; 127; 128; 129; 125; 126; 127; 128; 129; 13 wafer carrier; 131 housing; 132 base plate; Wafer box 14; 2. Overhead crane system; 21. Elevated track; 22. Conveying device; 221. Handling device; 222. 3. Inbound / outbound robotic arm; 31. Guide rail base; 32. Rotating arm; 33. Moving pallet. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0034] The following is for reference. Figures 1-19 The following describes, by way of example, the automated semiconductor material storage system and the semiconductor material loading method of the present invention.

[0035] The automated semiconductor material storage system of this invention includes a loading storage unit assembly 1, an overhead crane system 2, and a control system.

[0036] The loading storage assembly 1 includes a support frame 11, a loading mechanism 12, and multiple wafer carriers 13. The loading mechanism 12 has a first docking position and a second docking position. The wafer carriers 13 are used to place wafer cassettes 14. The support frame 11 includes multiple wafer storage stages 112 for placing wafer cassettes 14. The loading mechanism 12 includes a carrier platform 121, a wafer platform 122, an X-axis assembly 123, a Z-axis assembly 124, and a transport stage 125. The carrier platform 121 is positioned on the wafer platform 122 in the X-axis direction (e.g., ...). Figure 1 and Figure 6 On one side of the front-to-back direction shown in the diagram, the X-axis assembly 123 is mounted on the Z-axis assembly 124. The X-axis assembly 123 can drive the wafer cassette 14 to move along the X-direction. The transport stage 125 is mounted on the X-axis assembly 123, at the first docking position (located as shown in the diagram). Figure 1 and Figure 6 The rear end area shown) and the second connection point (located as shown) Figure 1 and Figure 6The front-end area shown in the figure) and the transport platform 125 have convertible high and low states. The wafer cassette 14 is transported between the carrier platform 121 and the wafer platform 122 by means of the X-axis assembly 123 and the Z-axis assembly 124. The overhead crane system 2 includes an overhead track 21 and a conveying device 22. The conveying device 22 is movably set on the overhead track 21 along the extension direction of the overhead track 21 and along the Z direction. The conveying device 22 can be set to correspond with the carrier platform 121 in the Z direction to realize the entry and exit operation of the wafer carrier 13. The control system can cooperate with the loading storage assembly 1 and the overhead crane system 2 to respond to the signals.

[0037] The automated semiconductor material warehousing system of this invention, through the docking of the overhead crane system 2 with the loading and unloading storage assembly 1, can automatically realize the inbound and outbound operations of the wafer carrier 13, achieving automatic loading and unloading of the wafer carrier 13, reducing manual intervention, and improving work efficiency. This avoids the low handling efficiency and contamination risk caused by manual wafer handling, and also avoids the problems of wafer fragmentation and cracking that are easily caused by manual handling. Using the overhead crane system 2 helps to improve wafer yield, increasing work efficiency and product quality while reducing the workload of workers. Therefore, the overhead crane system 2 improves the transportation efficiency of the wafer carrier 13, reduces wafer loss rate, reduces labor costs, and reduces contamination risk.

[0038] Meanwhile, the automated semiconductor material storage system of this embodiment divides the loading mechanism 12 into a carrier rack 121, a wafer rack 122, an X-axis assembly 123, a Z-axis assembly 124, and a transport platform 125. Specifically, the Z-axis movement of the transport platform 125 can drive the platform to rise and fall, enabling it to switch between high and low positions, thereby connecting the wafer cassette 14 located on the transport platform 125 to the wafer rack 122 and the carrier rack 121. The X-axis movement of the transport platform 125 allows the wafer cassette 14 to be transferred between the wafer rack 122 and the carrier rack 121. The entire process of loading, unloading, and transferring the wafer cassette 14 can be completed without human intervention. This transfer operation offers advantages such as high efficiency, good stability, and high repeatability, thus significantly improving the efficiency of the wafer cassette 14 transfer operation.

[0039] The automated semiconductor material storage system of this invention has the advantages of improving wafer transfer yield and work efficiency.

[0040] Specifically, the overhead crane system 2 can be arranged with elevated tracks 21 according to the process flow. The control system has a built-in programmable controller, which can be set with variable frequency speed control. It adopts an automatic identification and signal transmission system and communicates with the management layer equipment. This enables the elevated tracks 21 to function as a three-dimensional network conveyor for transporting wafer carriers 13 on the production line. This allows for the rapid and accurate docking of wafer carriers 13 with target process equipment and process equipment, meeting the needs of modern mass production. The semiconductor processing system can easily communicate with the overhead crane system 2 to transmit information about the wafer carriers 13 and to reload the wafer carriers 13 back into the original wafer storage stage 112 after the process is completed. The loading and storage assembly 1 itself has multiple storage spaces, designed for automated storage, retrieval, and transfer management of wafer carriers 13 of various specifications, enabling the transfer of wafer carriers 13 between different processes. It should be noted that the control system can coordinate with the loading and storage assembly and the overhead crane system to achieve docking operations at each step.

[0041] like Figure 1 and Figure 19 As shown, the loading mechanism 12 has a mounting cavity. The Z-axis assembly 124 includes a Z-axis drive member 1241 and a lifting assembly 1242. The lifting assembly 1242 is movably disposed within the mounting cavity along the Z-axis via the Z-axis drive member 1241. The X-axis assembly 123 includes a sliding stage and an X-axis drive member. The sliding stage is disposed on the lifting assembly 1242 and is movably disposed along the X-axis via the X-axis drive member. The transport platform 125 is disposed on the sliding stage. This structure exhibits high rigidity and stability.

[0042] like Figure 19 As shown, the Z-axis drive component 1241 includes a motor 12412 and a lead screw 12411. The output end of the motor 12412 is connected to the lead screw 12411. The lifting assembly 1242 includes a connecting plate, a base, and a mating component. The connecting plate has a connecting hole, and the mating component is fixed in the connecting hole. The power end of the motor 12412 is set on the support frame 11. The output end of the motor 12412 is connected to the lead screw 12411. The lead screw 12411 is threadedly engaged with the mating component, and the sliding table is slidably engaged on the upper end surface of the connecting plate, so as to switch the high and low states of the transport platform 125 in either the first docking position or the second docking position.

[0043] The automated semiconductor material storage system of this invention comprises a first driving component consisting of a motor 12412 and a lead screw 12411, and a lifting assembly 1242 consisting of a connecting plate, a base, and a mating component. The lead screw 12411 is threadedly engaged with the mating component. This means that the engagement of the lead screw 12411 and the mating component provides highly precise linear motion control. Because the rolling friction coefficient is much lower than the sliding friction coefficient, the system operation of the lead screw 12411 is smoother and quieter. Compared to traditional sliding screw drives, the lead screw 12411 significantly improves efficiency and reduces energy loss and heat generation. Therefore, the automated semiconductor material storage system of this invention has the advantages of high transmission efficiency and high precision.

[0044] like Figures 1 to 8 As shown, the wafer carrier 13 includes a housing 131 and a base plate 132. The base plate 132 is disposed at the lower end of the housing 131. At the first docking position, the base plate 132 is movably disposed on the loading mechanism 12 along the Z direction, so that the wafer cassette 14 can be moved between the carrier stand 121 and the transport stage 125 by adjusting the height of the base plate 132 and the height of the transport stage 125. At the second docking position, the wafer cassette 14 can be moved between the transport stage 125 and the wafer rack 122 by adjusting the height of the transport stage 125.

[0045] The automated semiconductor material storage system of this invention, in the first connection position, uses a base plate 132 in conjunction with a transport platform 125 to realize the transfer of wafer cassette 14 between the transport platform 125 and the wafer rack 122. The automated semiconductor material storage system of this invention has the advantages of high automation and good compactness.

[0046] like Figures 1 to 8 , Figure 19 As shown, the loading mechanism 12 also includes a support frame 11, which includes a base platform 126, a first support frame 127, and a second support frame 128. The first support frame 127, the second support frame 128, and the base platform 126 enclose the mounting cavity. The first support frame 127 and the second support frame 128 are spaced apart on the base platform 126 along the Y direction to form a loading port 129 extending along the X direction in the area between the upper surfaces of the first support frame 127 and the second support frame 128. The upper surfaces of the first support frame 127 and the second support frame 128 form a wafer stand 122. At the second docking position, the transport stage 125 can extend or retract into the mounting cavity through the loading port 129 to realize the conversion between the high position and the low position, so that the wafer cassette 14 can be detached from or attached to the wafer stand 122.

[0047] The automated semiconductor material storage system of this invention divides the support frame 11 into a base platform 126, a first support frame 127, and a second support frame 128, and connects the first support frame 127 and the second support frame 128 along the Y direction (e.g., Figure 6 The wafer cassette 14 is positioned spaced apart on the base platform 126 (as shown in the left-right direction), thereby forming a loading port 129 in the area between the first support frame 127 and the second support frame 128. The loading port 129 can accommodate the movement of the sliding stage. Furthermore, the structure of the first support frame 127 and the second support frame 128 not only encloses the loading mechanism 12 internally, preventing the transmission mechanism from being exposed, but also forms a mounting surface on the upper end surface of the first support frame 127 and the second support frame 128 to support the placed wafer cassette 14. This structural design has the advantage of simple structure.

[0048] like Figures 9 to 18 As shown, the loading storage assembly 1 includes a frame body 111 and multiple loading stages arranged in layers on the frame body 111, with multiple wafer storage stages 112 correspondingly formed on each loading stage.

[0049] The automated semiconductor material storage system of this invention stores multiple wafer carriers 13 by dividing the loading storage assembly 1 into a frame body 111 and multiple loading platforms arranged in layers on the frame body 111.

[0050] Specifically, the loading stage has multiple rows, and each row also has multiple loading stages. The loading storage assembly 1 itself has multi-layer storage space and is designed for semiconductor process equipment (e.g., vertical furnace) to automate the storage, retrieval, and transfer management of wafer carriers 13 of various sizes, enabling the transfer of wafer carriers 13 between different processes. For example, as Figures 9 to 18 As shown, the wafer storage stage 112 has three rows, with seven wafer storage stages 112 in each row.

[0051] like Figures 9 to 18 As shown, the loading and storage assembly 1 also includes an inbound / outbound robot 3. The inbound / outbound robot 3 includes a guide rail 31, a rotating arm 32, and a movable pallet 33. The guide rail 31 is movably mounted on the frame 111 along the Z-axis, and the rotating arm 32 is rotatably mounted on the guide rail 31. The movable pallet 33 and the rotating arm 32 are used to clamp the wafer cassette 14, realizing the inbound operation of the wafer cassette 14. Therefore, it has the advantage of high automation.

[0052] like Figures 9 to 18As shown, the conveying device 22 includes a connected transporter 221 and a pick-and-place device 222. The transporter 221 is movably mounted on the elevated track 21 along the extension direction of the elevated track 21. When entering or leaving the warehouse, the transporter 221 and the carrier platform 121 are positioned corresponding to each other in the Z direction. The retractable end of the pick-and-place device 222 is fixed to the transporter 221, and the other end of the pick-and-place device 222 is detachably connected to the wafer carrier 13 so that the wafer carrier 13 can be picked up, placed, and transported by the rewinding of the pick-and-place device 222.

[0053] The automated semiconductor material storage system of this invention achieves storage of wafer storage stages 112 at different orientations by movably arranging the conveyor 221 of the conveying device 22 on the elevated track 21 along the extension direction of the elevated track 21, and movably arranging the pick-and-place device 222 of the conveying device 22 on the conveyor 221 along the Z-direction. Therefore, this structure has the advantages of simple structure and high ease of use.

[0054] Optionally, the pick-and-place device 222 can be connected to the transporter 221 via a sprocket assembly. The sprockets work together to pick up and place the wafer carrier 13.

[0055] The automated semiconductor material storage system of this invention also includes a fan filter unit, which is installed on the top of the frame 111 to purify the environment inside the frame 111 and maintain the cleanliness of the semiconductor processing system.

[0056] Combination Figures 1 to 18 As shown, the semiconductor material loading method of this invention, based on any one of the above-described automated semiconductor material storage systems, includes: S1, as Figure 1 Combination Figures 4 to 6 As shown, along the extension direction of the elevated track 21, the conveying device 22 moves to a predetermined position, and the conveying device 22 moves the wafer carrier 13 down onto the carrier platform 121, and the bottom support plate 132 of the carrier platform 121 moves down.

[0057] S2, as Figures 4 to 5 and combined Figure 19 As shown, after the X-axis assembly 123 controls the transport platform 125 to move along the X direction toward the carrier frame 121 to the first docking position, the Z-axis assembly 124 drives the transport platform 125 to move upward to realize the transition from a low position to a high position, and makes the height of the transport platform 125 higher than the height of the base plate 132 so that the wafer cassette 14 is docked from the base plate 132 onto the transport platform 125.

[0058] S3, as Figures 7 to 8 and combined Figure 19As shown, after the X-axis assembly 123 controls the transport stage 125 to move along the X direction toward the wafer stand 122 to the second docking position, the Z-axis assembly 124 drives the transport stage 125 to move downward to achieve a transition from a high state to a low state, so that the height of the transport stage 125 is lower than the height of the wafer stand 122, and the wafer cassette 14 is clamped by the grippers, and the wafer cassette 14 is docked from the transport stage 125 to the wafer stand 122.

[0059] S4, Figures 9 to 18 As shown, and refer to Figures 9 to 18 The operation is carried out by the inbound / outbound robot 3, which transfers the wafer box 14 from the wafer rack 122 to the wafer storage stage 112. S1, S2, S3 and S4 repeat in sequence.

[0060] During outbound operations, the wafer cassette 14 can be transferred from the wafer storage stage 112 to the wafer rack 122 using the inbound / outbound robot 3. The Z-axis assembly 124 drives the transport stage 125 upwards to transition from a low to a high position, transferring the wafer cassette 14 onto the transport stage 125. The X-axis assembly 123 controls the transport stage 125 to move along the X-axis towards the rack 121. After reaching the first docking position, the grippers hold the wafer cassette, and the X-axis assembly 123 drives the transport stage 125 to move along the X-axis, causing the base plate 132 to move upwards, connecting the wafer cassette 14 from the transport stage 125 to the base plate 132. The base plate 132 continues to move upwards until it locks with the housing 131, after which it can be transferred to the predetermined working position via the overhead crane system 2.

[0061] The semiconductor material loading method of this invention has the advantages of improving wafer transfer yield and working efficiency.

[0062] The loading and storage assembly 1 also includes an inbound / outbound robot 3, which includes a guide rail base 31, a rotating arm 32, and a movable pallet 33. The guide rail base 31 is movably mounted on the support frame 11 along the Z-direction, and the rotating arm 32 is rotatably mounted on the guide rail base 31. During the warehousing process, the moving pallet 33 is inserted under the wafer rack 122 by rotating the rotating arm 32. After the guide rail 31 is raised to a predetermined height, the angle of the rotating arm 32 is rotated to place the wafer box 14 on the wafer storage stage 112 to realize the warehousing of the wafer box 14. When the wafer is being retrieved, the moving pallet 33 is inserted into the wafer storage stage 112 by rotating the rotating arm 32, the guide rail 31 is lowered, and the angle of the rotating arm 32 is rotated to place the wafer box 14 on the wafer rack 122 to realize the retrieval of the wafer box 14.

[0063] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications or equivalent substitutions made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0064] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0066] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0067] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0068] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0069] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An automated semiconductor material storage system, characterized in that, include: The loading storage assembly (1) includes a support frame (11), a loading mechanism (12), and multiple wafer carriers (13). The loading mechanism (12) has a first docking position and a second docking position. The wafer carriers (13) are used to place wafer cassettes (14). The support frame (11) includes multiple wafer storage stages (112) for placing the wafer cassettes (14). The loading mechanism (12) includes a carrier stand (121), a wafer stand (122), an X-axis assembly (123), a Z-axis assembly (124), and a transport stage (125). The carrier stand (121) is located on one side of the wafer stand (122) in the X direction, and the X-axis assembly (123) is located on the Z-axis assembly (125). On the axis assembly (124), the X-axis assembly (123) can drive the wafer cassette (14) to move along the X direction. The transport stage (125) is disposed on the X-axis assembly (123). At the first docking position and the second docking position, the transport stage (125) has a convertible high position and a low position. The wafer cassette (14) is transported between the carrier frame (121) and the wafer frame (122) by means of the X-axis assembly (123) and the Z-axis assembly (124). The overhead crane system (2) includes an elevated track (21) and a conveying device (22). The conveying device (22) is movably mounted on the elevated track (21) along the extension direction of the elevated track (21) and along the Z direction. The conveying device (22) can be correspondingly mounted with the carrier platform (121) in the Z direction to realize the entry and exit operations of the wafer carrier (13). The control system is able to coordinate with the loading storage assembly (1) and the crane system (2) to respond to signals.

2. The automated semiconductor material storage system according to claim 1, characterized in that, The loading mechanism (12) has a placement cavity, and the Z-axis assembly (124) includes a Z-direction drive (1241) and a lifting assembly (1242), wherein the lifting assembly (1242) is movably disposed in the placement cavity along the Z-direction via the Z-direction drive (1241); The X-axis assembly (123) includes a sliding stage and an X-axis drive member. The sliding stage is disposed on the lifting assembly (1242) and is movably disposed along the X-axis by the X-axis drive member. The transport platform (125) is disposed on the sliding stage.

3. The automated semiconductor material storage system according to claim 2, characterized in that, The Z-axis drive component (1241) includes a motor (12412) and a lead screw (12411). The output end of the motor (12412) is connected to the lead screw (12411). The lifting assembly (1242) includes a connecting plate and a mating component. The connecting plate is provided with a connecting hole, and the mating component is fixed in the connecting hole. The power end of the motor (12412) is set on the support frame (11). The lead screw (12411) is threadedly engaged with the mating component, and the sliding table is slidably engaged on the upper end surface of the connecting plate, so that the transport platform (125) can switch between the high state and the low state in either the first docking position or the second docking position.

4. The automated semiconductor material storage system according to claim 2, characterized in that, The wafer carrier (13) includes a housing (131) and a base plate (132). The base plate (132) is disposed at the lower end of the housing (131). At the first docking position, the base plate (132) is movably disposed on the loading mechanism (12) along the Z direction, so that the wafer cassette (14) can be moved between the carrier stand (121) and the carrier stand (125) by adjusting the height of the base plate (132) and the height of the transport platform (125). At the second docking position, the wafer cassette (14) can be moved between the transport platform (125) and the wafer stand (122) by adjusting the height of the transport platform (125). And / or, also includes grippers disposed on the loading mechanism (12) for gripping the wafer cassette (14) in order to transfer the wafer cassette (14) between the transport stage (125) and the wafer rack (122).

5. The automated semiconductor material storage system according to claim 4, characterized in that, The loading mechanism (12) further includes a support frame, which includes a base platform (126), a first support frame (127), and a second support frame (128). The first support frame (127), the second support frame (128), and the base platform (126) form a mounting cavity. The first support frame (127) and the second support frame (128) are spaced apart along the Y direction on the base platform (126) to accommodate the first support frame (127) and the second support frame (128). A loading port (129) extending along the X direction is formed between the upper surfaces of the first support frame (127) and the second support frame (128), and the upper surfaces of the first support frame (127) and the second support frame (128) form the wafer stage (122). At the second docking position, the transport stage (125) can extend or retract into the placement cavity through the loading port (129) to realize the conversion between the high position state and the low position state, so that the wafer cassette (14) can be detached from or attached to the wafer stage (122).

6. The automated semiconductor material storage system according to claim 1, characterized in that, The support frame (11) includes a frame body (111) and a plurality of wafer storage stages (112) arranged in layers on the frame body (111).

7. The automated semiconductor material storage system according to claim 6, characterized in that, The loading and storage assembly (1) also includes an inbound / outbound robot (3), which includes a guide rail (31), a rotating arm (32), and a movable pallet (33). The guide rail (31) is movably mounted on the frame (111) along the Z direction. The rotating arm (32) is rotatably mounted on the guide rail (31). The movable pallet (33) is connected to the rotating arm (32). The movable pallet (33) can be inserted under the wafer rack (122) and can connect the wafer box (14) between the movable pallet (33) and the wafer rack (122) to realize the inbound operation of the wafer box (14).

8. The automated semiconductor material storage system according to claim 1, characterized in that, The conveying device (22) includes a connected transporter (221) and a pick-and-place device (222). The transporter (221) is movably mounted on the elevated track (21) along the extension direction of the elevated track (21). When entering or leaving the warehouse, the transporter (221) and the carrier platform (121) are correspondingly mounted in the Z direction. The retractable end of the pick-and-place device (222) is fixed on the transporter (221), and the other end of the pick-and-place device (222) is detachably connected to the wafer carrier (13) so that the wafer carrier (13) can be picked up, placed and transported by the rewinding of the pick-and-place device (222). And / or, it also includes a fan filter unit disposed on the top of the support frame (11) to purify the environment within the support frame (11).

9. A method for loading semiconductor materials, characterized in that, The semiconductor material automated storage system according to any one of claims 1-8, wherein the loading method of the semiconductor material comprises: S1 Along the extension direction of the elevated track (21), the conveying device (22) moves to a predetermined position, the conveying device (22) lowers the wafer carrier (13) onto the carrier platform (121), and the bottom support plate (132) of the carrier platform (121) moves down; S2 controls the transport platform (125) to move along the X direction toward the carrier frame (121) to the first docking position via the X-axis assembly (123), and then drives the transport platform (125) to move upward via the Z-axis assembly (124) to realize the transition from a low position to a high position, and make the height of the transport platform (125) higher than the height of the base plate (132) to dock the wafer cassette (14) from the base plate (132) onto the transport platform (125); S3 controls the transport stage (125) to move along the X direction toward the wafer rack (122) to the second docking position via the X-axis assembly (123), and then drives the transport stage (125) to move downward via the Z-axis assembly (124) to achieve a transition from a high state to a low state, and to make the height of the transport stage (125) lower than the height of the wafer rack (122), so as to dock the wafer cassette (14) from the transport stage (125) to the wafer rack (122); S4 uses a robotic arm (3) to transfer the wafer box (14) from the wafer rack (122) to the wafer storage platform (112), and S1, S2, S3 and S4 repeat in sequence.

10. The method for loading semiconductor materials according to claim 9, characterized in that, The loading and storage assembly (1) further includes an inbound / outbound robot (3), which includes a guide rail base (31), a rotating arm (32), and a movable pallet (33). The guide rail base (31) is movably mounted on the support frame (11) along the Z-direction, and the rotating arm (32) is rotatably mounted on the guide rail base (31). When the wafer is stored, the moving pallet (33) is inserted under the wafer rack (122) by rotating the rotating arm (32), and the guide rail (31) is raised to a predetermined height. Then, the angle of the rotating arm (32) is rotated to place the wafer box (14) on the wafer storage platform (112) to realize the storage of the wafer box (14). When the wafer is being taken out of the warehouse, the moving pallet (33) is inserted into the wafer storage stage (112) by rotating the rotating arm (32), the guide rail (31) is lowered, and the angle of the rotating arm (32) is rotated to place the wafer box (14) on the wafer rack (122) to realize the taking out of the wafer box (14).

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