Microsphere polishing simulation uniformity evaluation method and device, and electronic equipment

Abstract

The application relates to a microsphere polishing simulation uniformity evaluation method and device and electronic equipment, wherein the method comprises the following steps: performing projection coordinate surface division on at least one orthogonal coordinate surface of a target microsphere to obtain a rectangular grid area of a target area; performing full-cycle dynamic simulation on the target microsphere to extract and convert three-contact-point space trajectory coordinates, and generating a space spherical surface trajectory point coordinate surface projection according to the three-contact-point space trajectory coordinates and the rectangular grid area; calculating a distribution uniformity standard deviation value of the trajectory point coordinate surface projection, and generating a grinding trajectory uniformity result of the target microsphere according to the uniformity standard deviation value. Therefore, the problems in the related art that the evaluation result is significantly deviated from the actual grinding condition due to the fact that the coupling effect of the simultaneous orbit motion of multiple spheres in the actual grinding is not considered, the grid division precision of the spherical surface is uneven, the grid division lacks standardization, the efficiency of the physical experiment verification is low and the cost is high, and the working condition adaptability is poor are solved.

Description

Technical Field

[0001] This application relates to the field of microsphere grinding technology, and in particular to a method, apparatus and electronic equipment for evaluating the uniformity of microsphere polishing simulation. Background Technology

[0002] Currently, in major fields such as national energy strategy and aerospace, the precision grinding quality of high-performance microsphere components directly determines the performance and reliability of core equipment, serving as a crucial foundation for ensuring the implementation of major national strategies. For example, laser fusion, as a cutting-edge direction for solving the global energy crisis, requires its target pellets to possess extremely high spherical uniformity and density. Even minute surface quality deviations during the grinding process will directly affect the symmetry of the fusion reaction and energy output efficiency, impacting the progress of national fusion energy research and development. Similarly, the rolling spheres of ultra-high precision aerospace engine bearings, as core components for transmitting loads and ensuring high-speed operational precision, directly determine the bearing's service life and the engine's safety redundancy through surface grinding uniformity and material removal efficiency. This has irreplaceable strategic significance for enhancing my country's independent controllability of aerospace equipment. Therefore, achieving high-quality control and precise evaluation of the microsphere grinding process has become an urgent need supporting the development of major national strategic equipment.

[0003] In related technologies, the evaluation of microsphere grinding uniformity mainly adopts the standard deviation calculation method based on kinematic models. The evaluation is carried out by deriving simplified motion trajectories and using spherical mesh division as the basic step for uniformity evaluation. At the same time, the evaluation process relies heavily on physical experimental verification, requiring repeated adjustment of grinding parameters and physical testing.

[0004] However, in related technologies, the evaluation based on kinematic models does not take into account the coupling effect of multiple spheres moving simultaneously on track during actual grinding, resulting in significant deviations between the evaluation results and actual grinding conditions. The spherical mesh division accuracy is uneven and the boundary treatment is complex, making it difficult to form a standardized grinding quality evaluation system. Relying on physical experimental verification is inefficient and costly, and it is impossible to visualize the grinding trajectory on the microsphere surface. It is also difficult to adapt to the complex dynamic scenario of multiple microspheres colliding with each other on track, which urgently needs to be improved. Summary of the Invention

[0005] This application provides a method, apparatus, and electronic device for evaluating the uniformity of microsphere polishing simulation, in order to solve the problems in related technologies, such as: significant deviation between evaluation results and actual grinding conditions due to failure to consider the coupling effect of multiple spheres moving simultaneously on track during actual grinding; inconsistent spherical mesh division accuracy and complex boundary treatment, resulting in a lack of mesh division standardization; low efficiency and high cost of relying on physical experiments for verification; inability to achieve visualization of microsphere surface grinding trajectory; and poor adaptability to working conditions.

[0006] The first aspect of this application provides a method for evaluating the uniformity of microsphere polishing simulation, comprising the following steps: dividing at least one orthogonal coordinate surface of the target microsphere into a projected coordinate plane to obtain a rectangular grid region of the target area; performing a full-cycle dynamic simulation on the target microsphere to extract and transform the spatial trajectory coordinates of the three contact points, and generating a spatial spherical trajectory point coordinate plane projection based on the spatial trajectory coordinates of the three contact points and the rectangular grid region; calculating the distribution uniformity standard deviation of the trajectory point coordinate plane projection, and generating the grinding trajectory uniformity result of the target microsphere based on the uniformity standard deviation.

[0007] Through the above-mentioned technical means, the embodiments of this application can extract and transform the trajectory coordinates of the contact point by dividing the rectangular grid area of ​​the orthogonal coordinate plane of the target microsphere, carrying out full-cycle dynamic simulation, generating spatial spherical trajectory projection and calculating the uniformity standard deviation, thereby realizing a systematic simulation evaluation of the microsphere grinding trajectory. This method can take into account the coupled motion of multiple microspheres and dynamic collision effects, realize trajectory visualization and accurate evaluation, and reduce experimental costs, providing theoretical support for process optimization.

[0008] Optionally, in one embodiment of this application, the full-cycle dynamic simulation of the target microsphere includes: establishing a three-dimensional solid model of the microsphere grinding system based on preset three-dimensional modeling software; importing the three-dimensional solid model of the microsphere grinding system into preset multibody dynamics analysis software and setting up a simulation environment to perform dynamic simulation calculations on the microsphere grinding system.

[0009] Through the above-mentioned technical means, the embodiments of this application can completely restore the structural features of the grinding system through a three-dimensional solid model. Combined with the professional calculation capabilities of multibody dynamics software, it can accurately simulate dynamic working conditions such as ball collision and eccentricity error during the grinding process, overcome the limitations of traditional kinematic models, ensure the accuracy of evaluation results, and provide a more realistic theoretical basis for process optimization.

[0010] Optionally, in one embodiment of this application, the step of forming a spatial spherical trajectory point coordinate plane projection based on the spatial trajectory coordinates of the three contact points and the rectangular grid region includes: projecting the spatial trajectory coordinates of the three contact points onto different XY, XZ, and YZ coordinate planes respectively to obtain the projected trajectory of the contact points; and determining the projection grid region to which the projected trajectory of the contact points belongs based on the rectangular grid region to generate the spatial spherical trajectory point coordinate plane projection.

[0011] Through the above-mentioned technical means, the embodiments of this application can clearly locate the distribution position of the trajectory on the sphere by projecting the three-dimensional spatial trajectory onto the orthogonal coordinate plane and combining it with rectangular grid for region matching, thereby realizing the visualization analysis of the grinding trajectory, providing an intuitive reference for process debugging, and laying a solid foundation for subsequent quantitative calculation of uniformity.

[0012] Optionally, in one embodiment of this application, the step of calculating the distribution uniformity standard deviation of the trajectory point coordinate plane projection and generating the grinding trajectory uniformity result of the target microsphere based on the uniformity standard deviation includes: counting the trajectory points contained in each grid based on the spherical trajectory point coordinate plane projection to obtain the number of sampled trajectory points in each grid area unit of the spherical surface; and calculating the uniformity standard deviation based on the number of sampled trajectory points in each grid area unit of the spherical surface to establish a uniformity quantitative evaluation table.

[0013] Through the above-mentioned technical means, the embodiments of this application can convert the trajectory distribution into quantitative data through grid counting, and then realize the quantitative characterization of uniformity through standard deviation calculation. This achieves accurate quantitative evaluation of grinding uniformity, provides a unified comparison standard for microsphere grinding quality under different working conditions, promotes the standardization of grinding quality evaluation system, and provides clear data guidance for process optimization.

[0014] Optionally, in one embodiment of this application, the formula for calculating the uniformity standard deviation is: , in, SD n The standard deviation of the uniformity is... N The total number of grid cells. Q i The number of sampling trajectory points in each grid cell on the sphere. Q z The total number of sampled trajectory points, This is the mean.

[0015] Through the above-mentioned technical means, the embodiments of this application can establish a precise mathematical model to achieve a standardized measurement of grinding uniformity, making the evaluation results repeatable and comparable, and providing a unified benchmark for comparing grinding quality under different process parameters.

[0016] A second aspect of this application provides a microsphere polishing simulation uniformity evaluation device, comprising: a partitioning module for partitioning at least one orthogonal coordinate surface of a target microsphere into a projected coordinate plane to obtain a rectangular grid region of the target area; a simulation module for performing a full-cycle dynamic simulation of the target microsphere to extract and convert the spatial trajectory coordinates of three contact points, and generate a spatial spherical trajectory point coordinate plane projection based on the spatial trajectory coordinates of the three contact points and the rectangular grid region; and an evaluation module for calculating the distribution uniformity standard deviation of the trajectory point coordinate plane projection, and generating a grinding trajectory uniformity result of the target microsphere based on the uniformity standard deviation.

[0017] Through the above-mentioned technical means, the embodiments of this application can extract and transform the trajectory coordinates of the contact point by dividing the rectangular grid area of ​​the orthogonal coordinate plane of the target microsphere, carrying out full-cycle dynamic simulation, generating spatial spherical trajectory projection and calculating the uniformity standard deviation, thereby realizing a systematic simulation evaluation of the microsphere grinding trajectory. This method can take into account the coupled motion of multiple microspheres and dynamic collision effects, realize trajectory visualization and accurate evaluation, and reduce experimental costs, providing theoretical support for process optimization.

[0018] Optionally, in one embodiment of this application, the simulation module includes: a modeling unit for building a three-dimensional solid model of the microsphere grinding system based on preset three-dimensional modeling software; and an analysis unit for importing the three-dimensional solid model of the microsphere grinding system into preset multibody dynamics analysis software and setting up a simulation environment to perform dynamic simulation calculations on the microsphere grinding system.

[0019] Through the above-mentioned technical means, the embodiments of this application can completely restore the structural features of the grinding system through a three-dimensional solid model. Combined with the professional calculation capabilities of multibody dynamics software, it can accurately simulate dynamic working conditions such as ball collision and eccentricity error during the grinding process, overcome the limitations of traditional kinematic models, ensure the accuracy of evaluation results, and provide a more realistic theoretical basis for process optimization.

[0020] Optionally, in one embodiment of this application, the simulation module includes: a projection unit, used to project the spatial trajectory coordinates of the three contact points onto different XY, XZ, and YZ coordinate planes respectively to obtain the projected trajectory of the contact points; and a generation unit, used to determine the projection grid region to which the projected trajectory of the contact points belongs based on the rectangular grid region, so as to generate the coordinate plane projection of the spatial spherical trajectory point.

[0021] Through the above-mentioned technical means, the embodiments of this application can clearly locate the distribution position of the trajectory on the sphere by projecting the three-dimensional spatial trajectory onto the orthogonal coordinate plane and combining it with rectangular grid for region matching, thereby realizing the visualization analysis of the grinding trajectory, providing an intuitive reference for process debugging, and laying a solid foundation for subsequent quantitative calculation of uniformity.

[0022] Optionally, in one embodiment of this application, the evaluation module includes: a counting unit, used to count the trajectory points contained in each grid based on the projection of the coordinate plane of the spherical trajectory points, to obtain the number of sampled trajectory points in each grid region unit of the spherical surface; and a calculation unit, used to calculate the uniformity standard deviation based on the number of sampled trajectory points in each grid region unit of the spherical surface, so as to establish a uniformity quantitative evaluation table.

[0023] Through the above-mentioned technical means, the embodiments of this application can convert the trajectory distribution into quantitative data through grid counting, and then realize the quantitative characterization of uniformity through standard deviation calculation. This achieves accurate quantitative evaluation of grinding uniformity, provides a unified comparison standard for microsphere grinding quality under different working conditions, promotes the standardization of grinding quality evaluation system, and provides clear data guidance for process optimization.

[0024] Optionally, in one embodiment of this application, the formula for calculating the uniformity standard deviation is: , in, SD n The standard deviation of the uniformity is... N The total number of grid cells. Q i The number of sampling trajectory points in each grid cell on the sphere. Q z The total number of sampled trajectory points, This is the mean.

[0025] Through the above-mentioned technical means, the embodiments of this application can establish a precise mathematical model to achieve a standardized measurement of grinding uniformity, making the evaluation results repeatable and comparable, and providing a unified benchmark for comparing grinding quality under different process parameters.

[0026] A third aspect of this application provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the microsphere polishing simulation uniformity evaluation method as described in the above embodiments.

[0027] A fourth aspect of this application provides a non-volatile computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described microsphere polishing simulation uniformity evaluation method.

[0028] A fifth aspect of this application provides a computer program product that stores a computer program that, when executed by a processor, implements the above-described microsphere polishing simulation uniformity evaluation method.

[0029] This application embodiment can extract and transform the trajectory coordinates of the contact points by dividing the orthogonal coordinate plane of the target microsphere into a rectangular grid region, conducting full-cycle dynamic simulation, generating a spatial spherical trajectory projection, and calculating the uniformity standard deviation. This enables a systematic simulation evaluation of the microsphere grinding trajectory, taking into account the coupled motion of multiple microspheres and dynamic collision effects, achieving trajectory visualization and accurate evaluation, while reducing experimental costs and providing theoretical support for process optimization. This microsphere polishing simulation uniformity evaluation method solves the problems in related technologies, such as significant deviations between evaluation results and actual grinding conditions due to the failure to consider the coupling effect of multiple spheres moving simultaneously in orbit during actual grinding, inconsistent spherical grid division accuracy, complex boundary treatment leading to a lack of grid division standardization, low efficiency and high cost of relying on physical experimental verification, inability to achieve visualization of the microsphere surface grinding trajectory, and poor adaptability to working conditions.

[0030] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0031] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein: Figure 1 This is a flowchart of a microsphere polishing simulation uniformity evaluation method provided according to an embodiment of this application; Figure 2 This is a schematic diagram of the spherical trajectory of a microsphere according to an embodiment of this application; Figure 3 This is a schematic diagram of a grinding mechanism model provided according to an embodiment of this application; Figure 4 This is a schematic diagram of the trajectory coordinates of a spherical contact point according to an embodiment of this application; Figure 5 This is a schematic diagram of a uniformity quantitative evaluation table provided according to an embodiment of this application; Figure 6 This is a flowchart of a microsphere polishing simulation uniformity evaluation method according to an embodiment of this application; Figure 7 This is a schematic diagram of a microsphere polishing simulation uniformity evaluation device provided according to an embodiment of this application; Figure 8 This is a schematic diagram of the structure of an electronic device provided according to an embodiment of this application.

[0032] Figure label: 10-Microsphere polishing simulation uniformity evaluation device; 100-Division module, 200-Simulation module, 300-Evaluation module; 801-Memory, 802-Processor, 803-Communication interface. Detailed Implementation

[0033] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0034] The following description, with reference to the accompanying drawings, outlines a method, apparatus, and electronic device for evaluating the uniformity of microsphere polishing simulation according to embodiments of this application. Addressing the issues raised in the background section regarding related technologies, such as the failure to consider the coupling effect of multiple spheres moving simultaneously in orbit during actual grinding, leading to significant deviations between evaluation results and actual grinding conditions, inconsistent spherical mesh division accuracy, complex boundary processing, lack of mesh division standardization, low efficiency and high cost in relying on physical experiments for verification, inability to visualize the microsphere surface grinding trajectory, and poor adaptability to working conditions, this application provides a method for evaluating the uniformity of microsphere polishing simulation. This method involves dividing the target microsphere's orthogonal coordinate plane into rectangular mesh regions, conducting full-cycle dynamic simulation to extract and transform the contact point trajectory coordinates, generating a spatial spherical trajectory projection, and calculating the uniformity standard deviation. This achieves a systematic simulation evaluation of the microsphere grinding trajectory, taking into account the coupled motion and dynamic collision effects of multiple microspheres, realizing trajectory visualization and accurate evaluation, reducing experimental costs, and providing theoretical support for process optimization. This solves the problems in related technologies, such as the significant deviation between evaluation results and actual grinding conditions due to the failure to consider the coupling effect of multiple spheres moving simultaneously on the track during actual grinding, inconsistent spherical mesh division accuracy, complex boundary treatment leading to a lack of mesh division standardization, low efficiency and high cost of relying on physical experiments for verification, inability to achieve visualization of microsphere surface grinding trajectory, and poor adaptability to working conditions.

[0035] Specifically, Figure 1 This is a schematic flowchart of a microsphere polishing simulation uniformity evaluation method provided in an embodiment of this application.

[0036] like Figure 1As shown, the method for evaluating the uniformity of microsphere polishing simulation includes the following steps: In step S101, at least one orthogonal coordinate surface of the target microsphere is divided into projected coordinate planes to obtain a rectangular grid region of the target area.

[0037] It is understood that the orthogonal coordinate surface in the embodiments of this application can be a three-dimensional coordinate plane that is perpendicular to each other, such as the XY plane, XZ plane, and YZ plane, which can be the reference for converting the spherical trajectory of the microsphere into a planar projection.

[0038] In actual implementation, the embodiments of this application can divide any orthogonal coordinate surface into a projected coordinate plane based on the principle of equal-area rectangular grid division, and divide it into rectangular grids of equal area. The diagonal coordinate points of the grid area are recorded in the uniformity quantitative evaluation table for use in subsequent processes to retrieve the grid to which the trajectory point belongs.

[0039] For example, such as Figure 2 As shown, the spatial orthogonal coordinate plane is divided into three coordinate planes: XY plane, XZ plane, and YZ plane. Based on the principle of equal-area rectangular grid division, the effective projected area of ​​any orthogonal coordinate plane is divided into projected coordinate planes and then into equal-area rectangular grids. The specific division method is as follows.

[0040] Set the increment values ​​of the horizontal and vertical coordinates on any coordinate plane; set the horizontal coordinate of any plane, starting from the coordinates. a 0, ending coordinates are a 1, the increment is δ x Set the ordinate of any plane's vertical axis, starting at coordinate . b 0, ending coordinates are b 1. The increment is δy; that is, the number of grid cells is: , , The horizontal axis grid points are a 0+ nδ x ,in n It is a non-negative integer, and its value ranges from 0 to 1. n ≤ N ;in N x =( a 1- a 0) / δ x (Total number of grid points on the horizontal axis); Number of grid points on the vertical axis b 0+ mδ y , m It is a non-negative integer, and its value ranges from 0 to 1. m ≤ M ;inN y =( b 1- b 0) / δ y (Total number of grid points on the vertical axis); that is, the coordinates of any grid point are ( a 0+ nδ x , b 0+ mδ y ). a 0, a 0+ nδ x )→[ b 0, b 0+ mδ y This is a grid area.

[0041] Record the diagonal coordinates of the grid region in the uniformity quantitative evaluation table for later use in retrieving the grid to which the trajectory point belongs. A schematic diagram of the established microspherical grid is shown below. Figure 2 As shown.

[0042] Furthermore, the area of ​​the mesh can be determined by the user based on the volume of the microsphere being analyzed, as well as the parameters of the operating conditions and simulation time. For example, a large mesh area is suitable for simulation evaluations with short simulation times, large sphere volumes, and large surface areas; a small mesh area is suitable for simulation evaluations with slightly longer simulation times, or small microsphere volumes and small surface areas. Of course, the mesh area can be adjusted multiple times until the uniformity evaluation value can be significantly distinguished by changing different simulation conditions and structural parameters.

[0043] This application embodiment can establish standardized trajectory distribution statistical units by dividing the orthogonal coordinate surface of the target microsphere into equal-area rectangular grid regions, ensuring the consistency of spatial units under different evaluation scenarios, laying the foundation for the comparability of subsequent trajectory projection and uniformity calculations, and avoiding evaluation deviations caused by inconsistent grid standards.

[0044] In step S102, a full-cycle dynamic simulation is performed on the target microsphere to extract and transform the spatial trajectory coordinates of the three contact points, and a spatial spherical trajectory point coordinate plane projection is generated based on the spatial trajectory coordinates of the three contact points and the rectangular grid area.

[0045] It is understood that the three contact points in the embodiments of this application can be the three main contact points formed between the microsphere and the grinding disc during the grinding process; the full-cycle dynamic simulation can be the simulation of the complete motion process of the microsphere throughout the entire grinding cycle.

[0046] In actual implementation, the embodiments of this application can determine and model the working conditions and structural parameters of simulated and experimental microsphere grinding. The physical working condition parameters required for the microsphere grinding system simulation are set, including rotational speed, applied load, and rotation direction, as well as key structural parameters, including: grinding disc size, relative position, groove shape, microsphere geometric features, and initial distribution pose. Corresponding parameter benchmarks for the actual grinding equipment are simultaneously set. Based on 3D modeling software, dynamic simulation calculations are performed, and a full-cycle dynamic simulation of the target microsphere is conducted to extract and convert the spatial trajectory coordinates of the three contact points. Based on the spatial trajectory coordinates of the three contact points and the rectangular grid region, a spatial spherical trajectory point coordinate plane projection is generated.

[0047] The embodiments of this application can collaboratively construct a simulation environment through 3D modeling and multibody dynamics software to achieve full-cycle dynamic simulation, accurately simulate complex working conditions, reduce costs and time, and at the same time output trajectory data with higher accuracy, providing a reliable basis for subsequent evaluation.

[0048] Optionally, in one embodiment of this application, performing full-cycle dynamic simulation of the target microspheres includes: establishing a three-dimensional solid model of the microsphere grinding system based on preset three-dimensional modeling software; importing the three-dimensional solid model of the microsphere grinding system into preset multibody dynamics analysis software and setting up a simulation environment to perform dynamic simulation calculations on the microsphere grinding system.

[0049] It is understood that the preset 3D modeling software in the embodiments of this application can be SolidWorks. The preset 3D modeling software can be set by those skilled in the art according to the actual situation, and no specific restrictions are made here. The preset multibody dynamics analysis software can be ADAMS. The preset multibody dynamics analysis software can be set by those skilled in the art according to the actual situation, and no specific restrictions are made here.

[0050] For example, in the embodiments of this application, the basic condition information required for the construction of the entire simulation model and the actual experiment can be set first, such as... Figure 3 As shown, a high-precision 3D solid model of the grinding system is built using the 3D modeling software SolidWorks. Both the upper and lower grinding disks are horizontally parallel to their axes, either eccentrically or non-eccentrically placed (with eccentricity in the V-shaped grooves). The upper grinding disk contains V-shaped grooves, and the microspheres are positioned within these grooves and in contact with the surface of the lower grinding disk. This is one embodiment; in practice, the positions of the upper and lower grinding disks can be interchanged, as long as there is axial or groove eccentricity between the two disks. This method can be applied to any grinding condition. The focus is on constructing core components such as the grinding disks and the microsphere group. This step clarifies the basic conditions required for the entire simulation model construction and simulation.

[0051] Furthermore, the model is imported into ADAMS, and the simulation environment is set up. The model is imported into the multibody dynamics simulation software ADAMS, and relevant constraints, contact, and material property parameters are set for each component in the ADAMS multibody dynamics analysis software to complete the preprocessing of the model for simulation calculation.

[0052] In the simulation environment, the dynamic physical properties of each model entity are defined: the mass and centroid position of components such as the grinding disc, microspheres, and cage are calculated and assigned; material properties such as density and elastic modulus are configured. In the dynamics simulation software, a revolute joint is set for the grinding disc, and a reverse drive is applied. Specifically, this includes: setting the required kinematic pairs for the relevant entities and applying necessary constraints; defining and applying a time-varying drive velocity function for the grinding disc drive (if required). In the dynamics simulation software, other forces are set to simulate actual grinding conditions, simulating the actual grinding environment and adding physical effects, including but not limited to contact force models. Simultaneously, spatial marker points are defined for key locations such as contact points to capture the microsphere's orbital trajectory, angular velocity, and collision force vector in real time, laying the groundwork for outputting parameters characterizing the uniformity and quality of microsphere grinding later.

[0053] A spatial marker point is defined, and the orbital trajectory, angular velocity, and collision force vector of the microspheres are captured in real time. High-precision transient dynamic simulation is run to obtain the kinematic and dynamic data of the microsphere swarm. The trajectory coordinates of the three contact points are extracted and transformed. This step has been described in other patent documents of this team and can be considered as known technology, not the inventive point of this paper.

[0054] The time-varying displacement data recorded at the three contact MARKER points on the spherical surface are extracted using the post-processing module of the ADAMS simulation software. The extracted points need to be converted, following the principles and procedures below, to convert the spatial trajectory coordinates of the three contact points into spherical point coordinates, thereby generating a grinding simulation contact point cloud map of the revolution motion. Figure 4 As shown.

[0055] The coordinates of the Marker point in the spherical coordinate system are calculated as: Marker point global coordinates - Sphere center global coordinates. Export the Sphere center global coordinates and Marker point global coordinates from Adams software, and then calculate the Marker point's coordinates relative to the Sphere center. .

[0056] Establish a moving coordinate system S1 at the center of the sphere, with the y-axis pointing in the same direction as the global coordinate system S, the x-axis parallel to the upper and lower disks pointing outwards, and the z-axis tangent to the groove (right-hand rule). Assume the microsphere diameter is 2r = 0.9 mm, and the coordinates of contact point 3 are... At this point, contact point 3 is fixed on coordinate system S1, and point MARKER moves within coordinate system S1. Then, coordinate system S2 is established at the center of the sphere, and point MARKER is fixed within coordinate system S2. Contact point 3 then moves within coordinate system S2, with coordinates... Then we have: , , , , , in, This is the transformation matrix from the moving coordinate system S1 to S2.

[0057] Given the coordinates of point MARKER relative to the center of the sphere, at each moment, point MARKER rotates in space. Then S2 also rotates in space relative to S1. .

[0058] Calculate based on the coordinates of the Marker point relative to the center of the sphere. Then we can find And thus obtain That is, using MATLAB to calculate each time step. , , Calculate each time step Loop algorithm, import data Finally obtained Similarly, we can obtain , .

[0059] Let θ be the azimuth (longitude) of the spherical contact point, φ be the elevation (latitude) of the spherical contact point, and r be the radial distance. Any point P(xM, yM, zM) on the sphere needs to be converted to spherical coordinates (r, θ, φ). Then: , (Value range [-180°, 180°] or [0, 360°]) (Value range [-180°, 180°] or [0, 360°]) Export the data results table and plot the envelope trajectory cloud map of the three contact points on the microsphere grinding surface based on the dynamic calculation process.

[0060] The embodiments of this application can completely restore the structural features of the grinding system through a three-dimensional solid model. Combined with the professional calculation capabilities of multibody dynamics software, it can accurately simulate dynamic working conditions such as ball collision and eccentricity error during the grinding process, overcome the limitations of traditional kinematic models, ensure the accuracy of evaluation results, and provide a more realistic theoretical basis for process optimization.

[0061] Optionally, in one embodiment of this application, forming a spatial spherical trajectory point coordinate plane projection based on the spatial trajectory coordinates of the three contact points and the rectangular grid area includes: projecting the spatial trajectory coordinates of the three contact points onto different XY, XZ, and YZ coordinate planes respectively to obtain the projected trajectory of the contact points; and determining the projection grid area to which the projected trajectory of the contact points belongs based on the rectangular grid area to generate the spatial spherical trajectory point coordinate plane projection.

[0062] It is understood that in the embodiments of this application, the projection trajectory of the contact point can be a two-dimensional trajectory line formed after projection; the projection grid area can be a mapping of the divided rectangular grid on the corresponding coordinate plane, used to locate the spatial ownership of the projection trajectory point.

[0063] For example, in the embodiments of this application, the trajectory coordinates of the three contact points in the spherical space can be projected onto different XY, XZ, and YZ coordinate planes to form a "projected trajectory circle" composed of the trajectory points of the three planes, and each point is assigned to a grid in different XY, XZ, and YZ coordinate planes.

[0064] Specifically, such as P The coordinates of 1 are ( x n , y n , z n If ), then the projection onto the XY coordinate plane is . P 1xy ( x n , y n The same applies to the other two planes.

[0065] judge P The grid to which point 1 belongs on the coordinate plane, if P 1xy ( x n , y n )∈[ a 0, a 0+ nδ x )→[ b 0, b 0+ mδ y If a point is within a given area, its count is 1; similar methods are used to determine the grid to which more trajectory points belong.

[0066] This application embodiment can clearly locate the distribution position of the trajectory on the sphere by projecting the three-dimensional spatial trajectory onto an orthogonal coordinate plane and combining it with rectangular grid for region matching, thereby realizing the visualization analysis of the grinding trajectory, providing an intuitive reference for process debugging, and laying a solid foundation for subsequent quantitative calculation of uniformity.

[0067] In step S103, the standard deviation of the uniformity of the projection of the trajectory point coordinate plane is calculated, and the uniformity result of the grinding trajectory of the target microsphere is generated based on the uniformity standard deviation.

[0068] It is understood that the standard deviation of distribution uniformity in the embodiments of this application can be a quantitative indicator reflecting the degree of dispersion of trajectory points in each grid. The smaller the value, the more uniform the distribution.

[0069] In actual implementation, the embodiments of this application can determine the projection grid region to which any contact trajectory point belongs, count the trajectory points contained in each grid, calculate the distribution uniformity standard deviation of the contact points on the three projection surfaces, and generate the grinding trajectory uniformity result of the target microsphere based on the uniformity standard deviation.

[0070] The standard deviation of the number of contact points characterizes the grinding quality of microspheres. By varying different process parameters, such as operating conditions and structural parameters, and repeating the process, the standard deviation of the number of contact points can be compared and analyzed to evaluate the influence weight of each process parameter on the grinding quality of microspheres, or to evaluate the grinding effect under certain operating conditions and structural parameters.

[0071] The embodiments of this application can generate microsphere grinding uniformity results by calculating the uniformity standard deviation of the trajectory point distribution, converting uniformity into a quantifiable standard deviation value, making the evaluation results more objective and accurate. The grade classification based on standard deviation provides a clear quality judgment standard, solves the problem of incomparability of indicators in different evaluation systems, and provides a direct basis for process optimization.

[0072] Optionally, in one embodiment of this application, calculating the distribution uniformity standard deviation of the trajectory point coordinate plane projection and generating the grinding trajectory uniformity result of the target microsphere based on the uniformity standard deviation includes: counting the trajectory points contained in each grid based on the spherical trajectory point coordinate plane projection to obtain the number of sampled trajectory points in each grid area unit of the sphere; calculating the uniformity standard deviation based on the number of sampled trajectory points in each grid area unit of the sphere to establish a uniformity quantitative evaluation table.

[0073] It is understood that in the embodiments of this application, the number of sampling trajectory points in each grid area unit of the sphere can be the number of trajectory points contained in each rectangular grid, which is the basic data for calculating the standard deviation; the uniformity quantitative evaluation table can be a standardized output result that presents the grinding uniformity in numerical form through systematic data statistics.

[0074] In practical implementation, the embodiments of this application can count the trajectory points contained in each grid based on the projection of the spherical trajectory point coordinate plane to obtain the number of sampled trajectory points in each grid region cell on the sphere. Then, the standard deviation of distribution uniformity is calculated based on relevant formulas to establish a quantitative evaluation table of uniformity, such as... Figure 5 As shown.

[0075] Since the points within each plane edge grid reflect the two-dimensional projection of the trajectory points of the spatial sphere edge, some trajectory points will have overlapping projections. Therefore, the grid count of "several rings" outside the quantitative evaluation table can be removed as needed to avoid an excessive number of contact points on the outer grid. Thus, it can be excluded from the standard deviation calculation. However, this operation can also be omitted. If the results obtained by the same counting evaluation calculation method are consistent with the evaluation scale of the table counting results obtained under the same simulation time, number of steps, and step size for other different working conditions and structural parameters, the standard deviation values ​​under the same scale can still be compared, and the evaluation results will still be accurate.

[0076] The embodiments of this application can convert the trajectory distribution into quantitative data through grid counting, and then realize the quantitative characterization of uniformity through standard deviation calculation. This achieves accurate quantitative evaluation of grinding uniformity, provides a unified comparison standard for microsphere grinding quality under different working conditions, promotes the standardization of grinding quality evaluation system, and provides clear data guidance for process optimization.

[0077] Optionally, in one embodiment of this application, the formula for calculating the uniformity standard deviation is: , in, SD n The standard deviation of uniformity. N The total number of grid cells. Q i This represents the number of sampling trajectory points within each grid cell on the sphere. Q z The total number of sampled trajectory points, This is the mean.

[0078] For example, embodiments of this application can quantitatively evaluate the uniformity of the grinding trajectory, defining the standard deviation of the number of contact points in the uniformity quantitative evaluation table. SD n This index is used to evaluate the uniformity of microsphere grinding; the smaller the value, the better the uniformity; the larger the value, the worse the uniformity. The table shows the number of contact points per grid in the uniformity quantitative evaluation table. Q i The standard deviation is calculated using the uniformity standard deviation evaluation formula to obtain the standard deviation value.

[0079] The embodiments of this application can establish a precise mathematical model to achieve a standardized measurement of grinding uniformity, making the evaluation results repeatable and comparable, and providing a unified benchmark for comparing grinding quality under different process parameters.

[0080] In some embodiments, by visualizing the entire grinding trajectory points on the surface of the microspheres throughout the process, the trajectory point situation of each projection surface can be intuitively obtained. In addition, the uniformity of the grinding trajectory can be initially evaluated simply and intuitively by observing the distribution of trajectory points on the projection surface using drawing software such as Origin.

[0081] Specifically, it can be combined with Figure 6 As shown, the working principle of the microsphere polishing simulation uniformity evaluation method in this application is explained in detail with a specific embodiment.

[0082] like Figure 6 As shown, embodiments of this application may include the following steps: Step S601: Define the projection grid region of the spatial orthogonal coordinate system.

[0083] In this embodiment, based on the principle of equal-area rectangular grid division, any orthogonal coordinate surface can be divided into projected coordinate planes into equal-area rectangular grids. The diagonal coordinate points of the grid regions are recorded in a uniformity quantitative evaluation table for subsequent retrieval of the grid to which the trajectory points belong. The area of ​​the grid can be determined by the user based on the volume of the microsphere being analyzed, as well as parameters such as the working conditions and simulation time. For example, a large grid area is suitable for simulation evaluations with short simulation times, large sphere volumes, and large surface areas; a small grid area is suitable for simulation evaluations with slightly longer simulation times, or small microsphere volumes and small surface areas.

[0084] Step S602: Complete the pre-processing for simulation and perform full-cycle dynamic simulation.

[0085] The embodiments of this application may include modeling based on 3D modeling software, importing into ADAMS, setting up a simulation environment, and performing dynamic simulation calculations.

[0086] Specifically, the core components such as the grinding disc and microsphere group were constructed using 3D modeling software such as SolidWorks, clarifying the basic entity conditions required for the entire simulation model construction and simulation. The model was then imported into the multibody dynamics simulation software ADAMS. In ADAMS, relevant constraints, contact parameters, and material properties were set for each component, completing the preprocessing for simulation calculations. Dynamic simulation calculations were performed, defining spatial MARKER points, capturing the microsphere's orbital trajectory, angular velocity, and collision force vectors in real time, and running high-precision transient dynamic simulations to obtain the kinematic and dynamic data of the microsphere group.

[0087] Step S603: Extract and convert the spatial trajectory coordinates of the three contact points.

[0088] In this embodiment, the post-processing module of the ADAMS simulation software can extract the time-varying displacement data recorded by the three contact MARKER points on the spherical surface. The extracted points need to be converted, and the spatial trajectory coordinates of the three contact points are converted into spherical point coordinates according to relevant principles and processes to generate a three-dimensional trajectory cloud map of the revolution motion.

[0089] Step S604: Form the coordinate plane projection of the spatial spherical trajectory point.

[0090] In this embodiment, the trajectory coordinates of the three contact points in the spherical space can be projected onto different XY, XZ, and YZ coordinate planes to form a "projected trajectory circle" composed of the trajectory points of the three planes. Each point also belongs to a grid in different XY, XZ, and YZ coordinate planes.

[0091] Step S605: Calculate the standard deviation of the uniformity of the distribution of the contact points on the three projection surfaces.

[0092] In this embodiment, a uniformity quantitative evaluation table can be established to determine the projected grid region to which any contact trajectory point belongs, and the trajectory points contained in each grid can be counted. The distribution uniformity standard deviation value can be calculated based on relevant formulas.

[0093] Step S606: Quantitatively evaluate the uniformity of the grinding trajectory.

[0094] In this embodiment of the application, the standard deviation of the number of contact points in the uniformity evaluation table can be defined as an index for evaluating the uniformity of microsphere grinding. The smaller the value, the better the uniformity; the larger the value, the worse the uniformity of microsphere grinding. Based on the number of contact points in each grid in the quantitative evaluation table, the standard deviation is calculated using the uniformity standard deviation evaluation formula to obtain the standard deviation value.

[0095] Since the points within each plane edge grid reflect the two-dimensional projection of the trajectory points of the spatial sphere edge, some trajectory points will have overlapping projections. Therefore, the grid count of "several rings" outside the quantitative evaluation table can be removed as needed to avoid an excessive number of contact points on the outer grid. Thus, it can be excluded from the standard deviation calculation. However, this operation can also be omitted. If the results obtained by the same counting evaluation calculation method are consistent with the evaluation scale of the table counting results obtained under the same simulation time, number of steps, and step size for other different working conditions and structural parameters, the standard deviation values ​​under the same scale can still be compared, and the evaluation results will still be accurate.

[0096] The standard deviation of the number of contact points characterizes the grinding quality of microspheres. By varying different process parameters, such as operating conditions and structural parameters, and repeating the above steps, the standard deviation of the number of contact points can be compared and analyzed to evaluate the influence weight of each process parameter on the grinding quality of microspheres, or to evaluate the grinding effect under certain operating conditions and structural parameters.

[0097] The microsphere polishing simulation uniformity evaluation method proposed in this application can extract and transform the trajectory coordinates of the contact points by dividing the target microsphere's orthogonal coordinate plane into a rectangular grid region, conducting full-cycle dynamic simulation, generating a spatial spherical trajectory projection, and calculating the uniformity standard deviation. This achieves a systematic simulation evaluation of the microsphere grinding trajectory, taking into account the coupled motion and dynamic collision effects of multiple microspheres, realizing trajectory visualization and accurate evaluation, reducing experimental costs, and providing theoretical support for process optimization. This solves the problems in related technologies, such as significant deviations between evaluation results and actual grinding conditions due to the failure to consider the coupling effect of multiple spheres moving simultaneously in orbit during actual grinding, inconsistent spherical grid division accuracy, complex boundary treatment leading to a lack of grid division standardization, low efficiency and high cost of relying on physical experimental verification, inability to achieve visualization of the microsphere surface grinding trajectory, and poor adaptability to working conditions.

[0098] Next, referring to the accompanying drawings, the microsphere polishing simulation uniformity evaluation device proposed according to the embodiments of this application is described.

[0099] Figure 7 This is a schematic diagram of the microsphere polishing simulation uniformity evaluation device according to an embodiment of this application.

[0100] like Figure 7 As shown, the microsphere polishing simulation uniformity evaluation device 10 includes: a division module 100, a simulation module 200, and an evaluation module 300.

[0101] The partitioning module 100 is used to partition at least one orthogonal coordinate surface of the target microsphere by projected coordinate plane to obtain a rectangular grid region of the target area.

[0102] The simulation module 200 is used to perform full-cycle dynamic simulation of the target microsphere to extract and transform the spatial trajectory coordinates of the three contact points, and generate the coordinate plane projection of the spatial spherical trajectory points based on the spatial trajectory coordinates of the three contact points and the rectangular grid area.

[0103] Evaluation module 300 is used to calculate the standard deviation of the distribution uniformity of the trajectory point coordinate plane projection, and to generate the grinding trajectory uniformity result of the target microsphere based on the uniformity standard deviation.

[0104] Optionally, in one embodiment of this application, the simulation module 200 includes: a setup unit and an analysis unit.

[0105] The establishment unit is used to establish a three-dimensional solid model of the microsphere grinding system based on a preset three-dimensional modeling software.

[0106] The analysis unit is used to import the three-dimensional solid model of the microsphere grinding system into a preset multibody dynamics analysis software and set up the simulation environment to perform dynamic simulation calculations on the microsphere grinding system.

[0107] Optionally, in one embodiment of this application, the simulation module 200 includes a projection unit and a generation unit.

[0108] The projection unit is used to project the spatial trajectory coordinates of the three contact points onto different XY, XZ, and YZ coordinate planes to obtain the projected trajectory of the contact points.

[0109] The generation unit is used to determine the projection grid region to which the projection trajectory of the contact point belongs based on the rectangular grid region, so as to generate the coordinate plane projection of the spatial spherical trajectory point.

[0110] Optionally, in one embodiment of this application, the evaluation module 300 includes a counting unit and a calculation unit.

[0111] The counting unit is used to count the trajectory points contained in each grid based on the projection of the coordinate plane of the spherical trajectory points, so as to obtain the number of sampled trajectory points in each grid area unit of the spherical surface.

[0112] The calculation unit is used to calculate the uniformity standard deviation based on the number of sampling trajectory points in each grid region cell on the sphere, so as to establish a quantitative evaluation table of uniformity.

[0113] Optionally, in one embodiment of this application, the formula for calculating the uniformity standard deviation is: , in, SD n The standard deviation of uniformity. N The total number of grid cells. Q i This represents the number of sampling trajectory points within each grid cell on the sphere. Q z The total number of sampled trajectory points, This is the mean.

[0114] It should be noted that the foregoing explanation of the embodiment of the microsphere polishing simulation uniformity evaluation method also applies to the microsphere polishing simulation uniformity evaluation device of this embodiment, and will not be repeated here.

[0115] The microsphere polishing simulation uniformity evaluation device proposed in this application can extract and transform the trajectory coordinates of the contact points by dividing the target microsphere's orthogonal coordinate plane into a rectangular grid region, conducting full-cycle dynamic simulation, generating a spatial spherical trajectory projection, and calculating the uniformity standard deviation. This enables a systematic simulation evaluation of the microsphere grinding trajectory, taking into account the coupled motion and dynamic collision effects of multiple microspheres, achieving trajectory visualization and accurate evaluation, reducing experimental costs, and providing theoretical support for process optimization. This solves the problems in related technologies, such as significant deviations between evaluation results and actual grinding conditions due to the failure to consider the coupling effect of multiple spheres moving simultaneously in orbit during actual grinding, inconsistent spherical grid division accuracy, complex boundary processing leading to a lack of grid division standardization, low efficiency and high cost of relying on physical experimental verification, inability to achieve visualization of the microsphere surface grinding trajectory, and poor adaptability to working conditions.

[0116] Figure 8 A schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device may include: The memory 801, the processor 802, and the computer program stored on the memory 801 and capable of running on the processor 802.

[0117] When the processor 802 executes the program, it implements the microsphere polishing simulation uniformity evaluation method provided in the above embodiments.

[0118] Furthermore, electronic devices also include: Communication interface 803 is used for communication between memory 801 and processor 802.

[0119] The memory 801 is used to store computer programs that can run on the processor 802.

[0120] The memory 801 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0121] If the memory 801, processor 802, and communication interface 803 are implemented independently, then the communication interface 803, memory 801, and processor 802 can be interconnected via a bus to complete communication between them. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized into address buses, data buses, control buses, etc. For ease of representation, Figure 8 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0122] Optionally, in a specific implementation, if the memory 801, processor 802, and communication interface 803 are integrated on a single chip, then the memory 801, processor 802, and communication interface 803 can communicate with each other through an internal interface.

[0123] The processor 802 may be a central processing unit (CPU), an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of this application.

[0124] This application also provides a non-volatile computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the above-described microsphere polishing simulation uniformity evaluation method.

[0125] This application also provides a computer program product storing a computer program that, when executed by a processor, implements the above-described microsphere polishing simulation uniformity evaluation method.

[0126] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0127] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0128] Any process or method described in the flowchart or otherwise herein can be understood as representing a module, segment, or portion of code comprising one or N executable instructions for implementing custom logic functions or processes, and the scope of the preferred embodiments of this application includes additional implementations in which functions may be performed not in the order shown or discussed, including substantially simultaneously or in reverse order depending on the functions involved, as should be understood by those skilled in the art to which embodiments of this application pertain.

[0129] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-included system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of computer-readable media include: an electrical connection having one or more wires (electronic device), a portable computer disk drive (magnetic device), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Alternatively, the computer-readable medium may be paper or other suitable media on which the program can be printed, since the program can be obtained electronically by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in a computer memory.

[0130] It should be understood that the various parts of this application can be implemented using hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented using software or firmware stored in memory and executed by a suitable instruction execution system. If implemented in hardware, as in another embodiment, it can be implemented using any one or more of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0131] Those skilled in the art will understand that all or part of the steps of the methods in the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, the program includes one or a combination of the steps of the method embodiments.

[0132] Furthermore, the functional units in the various embodiments of this application can be integrated into a processing module, or each unit can exist physically separately, or two or more units can be integrated into a module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0133] The storage medium mentioned above can be a read-only memory, a disk, or an optical disk, etc. Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of this application.

Claims

1. A method for evaluating the uniformity of microsphere polishing simulation, characterized in that, Includes the following steps: At least one orthogonal coordinate surface of the target microsphere is divided into projected coordinate planes to obtain a rectangular grid region of the target area; A full-cycle dynamic simulation is performed on the target microsphere to extract and transform the spatial trajectory coordinates of the three contact points, and a spatial spherical trajectory point coordinate plane projection is generated based on the spatial trajectory coordinates of the three contact points and the rectangular grid region. Calculate the standard deviation of the uniformity of the projection of the coordinate plane of the trajectory points, and generate the uniformity result of the grinding trajectory of the target microspheres based on the uniformity standard deviation. The calculation of the standard deviation of the distribution uniformity of the trajectory point coordinate plane projection, and the generation of the grinding trajectory uniformity result of the target microspheres based on the uniformity standard deviation, includes: Based on the projection of the coordinate plane of the spherical trajectory points, the trajectory points contained in each grid are counted to obtain the number of sampled trajectory points in each grid region cell of the sphere. The uniformity standard deviation is calculated based on the number of sampling trajectory points in each grid region cell of the sphere to establish a quantitative evaluation table for uniformity.

2. The method according to claim 1, characterized in that, The full-cycle dynamic simulation of the target microsphere includes: A three-dimensional solid model of the microsphere grinding system was established based on a pre-set 3D modeling software. The three-dimensional solid model of the microsphere grinding system is imported into a preset multibody dynamics analysis software, and a simulation environment is set up to perform dynamic simulation calculations on the microsphere grinding system.

3. The method according to claim 1, characterized in that, The step of forming a spatial spherical trajectory point coordinate plane projection based on the spatial trajectory coordinates of the three contact points and the rectangular grid region includes: The spatial trajectory coordinates of the three contact points are projected onto different XY, XZ, and YZ coordinate planes to obtain the projected trajectory of the contact points. Based on the rectangular grid region, determine the projection grid region to which the projection trajectory of the contact point belongs, so as to generate the coordinate plane projection of the spatial spherical trajectory point.

4. The method according to claim 1, characterized in that, The formula for calculating the uniformity standard deviation is: ， in, SD n The standard deviation of the uniformity is... N The total number of grid cells. Q i The number of sampling trajectory points in each grid cell on the sphere. Q z The total number of sampled trajectory points, This is the mean.

5. A device for evaluating the uniformity of microsphere polishing simulation, characterized in that, include: The partitioning module is used to partition at least one orthogonal coordinate surface of the target microsphere by projected coordinate plane to obtain a rectangular grid region of the target area; The simulation module is used to perform full-cycle dynamic simulation of the target microsphere to extract and transform the spatial trajectory coordinates of the three contact points, and generate the spatial spherical trajectory point coordinate plane projection based on the spatial trajectory coordinates of the three contact points and the rectangular grid area. The evaluation module is used to calculate the standard deviation of the distribution uniformity of the trajectory point coordinate plane projection, and generate the grinding trajectory uniformity result of the target microsphere based on the uniformity standard deviation. The evaluation module includes a counting unit, used to count the trajectory points contained in each grid based on the projection of the coordinate plane of the spherical trajectory points, to obtain the number of sampled trajectory points in each grid area unit of the spherical surface; The calculation unit is used to calculate the uniformity standard deviation based on the number of sampling trajectory points in each grid region cell of the sphere, so as to establish a quantitative evaluation table of uniformity.

6. The apparatus according to claim 5, characterized in that, The simulation module includes: The unit is used to create a three-dimensional solid model of the microsphere grinding system based on a preset three-dimensional modeling software. The analysis unit is used to import the three-dimensional solid model of the microsphere grinding system into a preset multibody dynamics analysis software and set up a simulation environment to perform dynamic simulation calculations on the microsphere grinding system.

7. An electronic device, characterized in that, include: The memory, the processor, and the computer program stored in the memory and executable on the processor, the processor executing the program to implement the microsphere polishing simulation uniformity evaluation method as described in any one of claims 1-4.

8. A non-volatile computer-readable storage medium having a computer program stored thereon, characterized in that, The program is executed by the processor to implement the microsphere polishing simulation uniformity evaluation method as described in any one of claims 1-4.

9. A computer program product, comprising a computer program, characterized in that, The computer program is executed to implement the microsphere polishing simulation uniformity evaluation method as described in any one of claims 1-4.

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