Power conversion device

Abstract

The invention discloses power conversion equipment. The power conversion equipment comprises a box body, a power module and a heat dissipation device, the box body is provided with a first cavity and a second cavity which are adjacent to each other, the power module is mounted in the first cavity, and the second cavity is communicated with the external environment of the box body; the radiating device comprises a first radiator and a second radiator; the first radiator comprises a substrate and a first radiating fin arranged on the substrate, the substrate exchanges heat with a first power device of the power module, and at least part of the first radiating fin is located in the second cavity; the second radiator comprises an evaporation plate and a condensation part, and the condensation part and the evaporation plate are communicated and form a phase change loop; the evaporation plate exchanges heat with a second power device of the power module, and the condensation part is located in the second cavity. In the power conversion equipment, the heat dissipation device integrates the first heat dissipation device and the second heat dissipation device, so that the heat dissipation cost can be reduced while the heat dissipation requirement of the power module is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation of power conversion equipment, and more particularly to a power conversion equipment. BACKGROUND

[0002] In the power conversion equipment, the heat sink dissipates heat for the power module. The power conversion equipment has different power levels, and different requirements for the heat sink.

[0003] The higher the power level of the power conversion equipment, the higher the requirement for the heat dissipation efficiency of the heat sink. In the power conversion equipment, higher heat dissipation efficiency results in higher heat dissipation cost. SUMMARY

[0004] Therefore, the present application provides a power conversion equipment to reduce the heat dissipation cost of the power conversion equipment while ensuring the heat dissipation requirement of the power module.

[0005] To achieve the above purpose, the present application provides the following technical solutions:

[0006] A power conversion equipment, comprising: a box body, a power module and a heat dissipation device;

[0007] The box body has a first cavity and a second cavity, the first cavity and the second cavity are arranged adjacent to each other, the power module is installed in the first cavity, and the second cavity is in communication with the external environment of the box body;

[0008] The heat dissipation device comprises at least one first heat sink and at least one second heat sink;

[0009] The first heat sink comprises a substrate and a first heat dissipation fin arranged on the substrate, the substrate is in heat exchange with a first power device of the power module, and at least part of the first heat dissipation fin is located in the second cavity;

[0010] The second heat sink comprises an evaporation plate and a condensation part, the condensation part and the evaporation plate are in communication and form a phase change loop, the evaporation plate is in heat exchange with a second power device of the power module, and the condensation part is located in the second cavity.

[0011] The power conversion device provided in the application integrates the first radiator and the second radiator, the first radiator is used to dissipate heat of the first power device of the power module, and the second radiator is used to dissipate heat of the second power device of the power module; according to the structure of the first radiator and the second radiator, it is known that, in the case of occupying the same space, the heat dissipation efficiency of the first radiator is less than that of the second radiator, and the cost of the first radiator is less than that of the second radiator, so that the first radiator can dissipate heat of the first power device with small heat generation, and the second radiator dissipates heat of the second power device with large heat generation, so that the heat dissipation requirements of the first power device and the second power device can be guaranteed, so that the heat dissipation requirements of the power module can be guaranteed; meanwhile, the heat dissipation cost can be reduced. Therefore, the power conversion device provided in the application can reduce the heat dissipation cost of the power conversion device while guaranteeing the heat dissipation requirements of the power module. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of the provided drawings.

[0013] Figure 1 A structural schematic diagram of the power conversion device provided in the embodiments of the application is shown in the figure.

[0014] Figure 2 A top view of the power conversion device shown in the figure. Figure 1

[0015] Figure 3a An A-A sectional view of the figure. Figure 2

[0016] Figure 3b A structural schematic diagram of the first heat dissipation fin in the power conversion device provided in the embodiments of the application is located in the second cavity.

[0017] Figure 3c A structural schematic diagram of the first heat dissipation fin in the power conversion device provided in the embodiments of the application is located in the second cavity.

[0018] Figure 4 A structural schematic diagram of the first radiator in the power conversion device provided in the embodiments of the application is higher than the second radiator.

[0019] Figure 5a A structural schematic diagram of the power conversion device provided in the embodiments of the application is shown in the figure. ​​

[0020] Figure 5b A schematic diagram of the structure of the power conversion device provided in this application, wherein the air inlet is located on one side of the second cavity along the second direction and the air outlet is distributed on the side of the second cavity away from the first cavity along the first direction;

[0021] Figure 5c A schematic diagram of the structure of the power conversion device provided in this application, in which the air inlet is located on one side of the second cavity along the second direction and the air outlet is distributed on both sides of the second cavity along the third direction;

[0022] Figure 5d A schematic diagram of the structure of the power conversion device provided in this application, wherein the air inlet is disposed on one side of the second cavity along the second direction, at least one air outlet is distributed on the side of the second cavity away from the first cavity along the first direction, and at least one air outlet is distributed on the side of the second cavity away from the air inlet along the second direction.

[0023] Figure 6 A schematic diagram showing the distribution of power modules within the first cavity in a power conversion device provided in an embodiment of this application;

[0024] Figure 7 A schematic diagram of the structure of the power conversion device provided in the embodiments of this application, in which the evaporator plate and the condenser are an integral structure, and the first heat sink and the second heat sink are distributed along the second direction;

[0025] Figure 8 for Figure 7 Exploded view of the second radiator in the middle;

[0026] Figure 9 for Figure 7 A schematic diagram of the substrate of the first heat sink in the middle;

[0027] Figure 10 A schematic diagram showing the distribution of the heat dissipation device, the first fan, the first device, and the second device in the power conversion device provided in the embodiments of this application;

[0028] Figure 11 A schematic diagram of the structure of the power conversion device provided in the embodiments of this application, in which the evaporator plate and the condenser are an integral structure, and the first heat sink and the second heat sink are distributed along a third direction;

[0029] Figure 12 for Figure 11 The diagram shows the distribution of the heat dissipation device after it is applied to the power conversion equipment.

[0030] Figure 13 A schematic diagram of the structure of a power conversion device provided in this application, wherein a portion of the first heat sink and the second heat sink are distributed along a third third direction, and a portion of the first heat sink and the second heat sink are distributed along a second direction;

[0031] Figure 14 for Figure 13 A schematic diagram of the heat dissipation device from another direction;

[0032] Figure 15 A schematic diagram of the structure of the power conversion device provided in the embodiments of this application, in which a portion of the first heat sink is distributed on both sides of the second heat sink along a third direction and a portion of the first heat sink is distributed on one side of the second heat sink along a second direction;

[0033] Figure 16 A schematic diagram of a structure in which the evaporator plate and the condenser section of the heat dissipation device of the power conversion equipment provided in the embodiments of this application are of a separate structure;

[0034] Figure 17 A schematic diagram of the structure of the power conversion device provided in this application, wherein the air inlet is disposed on one side of the second cavity along the second direction, one air outlet is distributed on the side of the second cavity away from the air inlet along the second direction, one air outlet is distributed on the side of the second cavity away from the first cavity along the first direction, and one air outlet is distributed on the side of the second cavity along the third direction.

[0035] Figure 18 for Figure 17 Top view of the power conversion device shown;

[0036] Figure 19 for Figure 18 BB-direction sectional view;

[0037] Figure 20 A schematic diagram of the heat dissipation device of the power conversion equipment provided in the embodiments of this application, wherein the evaporator plate and the condenser are of a separate structure, and the first heat dissipation fins are distributed on both sides of the condenser along the second direction;

[0038] Figure 21 The heat dissipation device of the power conversion equipment provided in this application embodiment has a separate structure for the evaporator plate and the condenser section, and the condenser section is located at the end of the first heat dissipation fin away from the substrate along the first direction.

[0039] Figure 22 for Figure 21 A schematic diagram of the heat dissipation device from another direction;

[0040] Figure 23 The heat dissipation device in the power conversion device provided in the embodiment of this application includes a second heat dissipation fin, and the projection of the area where the second heat dissipation fin is located along the first direction and the projection of the area where the first heat dissipation fin is located along the first direction have overlapping parts along the second direction and the third direction.

[0041] Figure 24 for Figure 23A distribution diagram of the heat dissipation device in the first cavity;

[0042] Figure 25 A structural diagram of the heat dissipation device in the power conversion device provided by the embodiment of the present application, which includes second heat dissipation fins and three second heat sinks;

[0043] Figure 26a A structural diagram of the heat dissipation device in the power conversion device provided by the embodiment of the present application, which includes second heat dissipation fins, and the projection of the area where the second heat dissipation fins are located along the first direction and the projection of the area where the first heat dissipation fins are located along the first direction are distributed along the third direction;

[0044] Figure 26b A structural diagram of the heat dissipation device in the power conversion device provided by the embodiment of the present application, which includes second heat dissipation fins, and the projection of the area where the second heat dissipation fins are located along the first direction and the projection of the area where the first heat dissipation fins are located along the first direction are distributed along the second direction;

[0045] Figure 27 A structural diagram of the heat dissipation device in the power conversion device provided by the embodiment of the present application, which includes an evaporation part;

[0046] Figure 28 A Figure 27 A distribution diagram of the heat dissipation device in the first cavity;

[0047] Figure 29 A Figure 28 A top view of the structure shown;

[0048] Figure 30 A Figure 29 A C-C sectional view of the structure shown;

[0049] Figure 31 A structural diagram of the power conversion device provided by the embodiment of the present application, in which the air inlet is arranged on one side of the second cavity along the third direction, and the air outlets are distributed on both sides of the air inlet along the second direction.

[0050] Explanation of reference signs:

[0051] 100 - power conversion device;

[0052] 1 - heat sink; 101 - first heat sink, 1011 - base plate, 1012 - first heat dissipation fin, 1012a - top fin, 10121 - bevel, 1013 - second heat dissipation fin, 1014 - heat pipe; 102 - second heat sink, 1021 - evaporation plate, 1022 - condensation part, 1022a - condensation plate, 10221 - condensation pipe, 10222 - condensation fin, 10223 - condensation bus, 1023 - evaporation part, 10231 - evaporation pipe, 10232 - evaporation fin, 10233 - evaporation bus, 1024 - pipe assembly, 10241 - first connecting pipe, 10242 - second connecting pipe; 103 - first power device mounting area; 104 - recess; 105 - protrusion; 106 - second power device mounting area;

[0053] 2 - box; 21 - first box, 22 - second box; 201 - first cavity; 202 - second cavity, 2021 - air inlet, 2022 - air outlet face, 203 - back plate;

[0054] 3 - power module; 301 - circuit board; 302 - first power device, 303 - second power device, 304 - electronic component;

[0055] 4 - first fan;

[0056] 5 - first device;

[0057] 6 - second device;

[0058] 7 - second fan;

[0059] 01 - first air duct, 02 - second air duct. DETAILED DESCRIPTION

[0060] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0061] The terminology used in the following description merely for the purpose of describing particular embodiments and is not intended to limit the application. As used in this description and the accompanying claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be understood that the terms "comprising," "including," "containing," and "having," are used inclusively and that terms such as "one or more" or "at least one" are used in the same manner. Similarly, it will be understood that terms such as "one of" are used to indicate that the referenced object is either the only object or one of more than one object. The terms "and / or" and "and / or / also" are used to indicate that the referenced objects can be present or absent, one or more of the referenced objects can be present, or any combination of the referenced objects can be present.

[0062] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. Thus, the appearances of the phrases "in one embodiment" or "in some embodiments" in various places throughout this specification are not necessarily all referring to the same embodiment, unless otherwise specified. The terms "including," "containing," "comprising," "having," and variations thereof are meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless otherwise specified, the terms "comprise", "comprising", "include", "including", "contain", "containing", "have", "having" or variants thereof are used synonymously if not states otherwise.

[0063] The plural of a term means one or more than one. For example, reference to "a member" includes one or more members. The terms "plurality" and "a plurality" mean "more than one" or "two or more". For example, a plurality of items includes more than one item, and can include two or more items. The terms "plurality" and "a plurality" are used interchangeably with "multiple". The term "plurality" is used to indicate that a feature can be duplicated, or that a feature can be one of a number of similar features. For example, a plurality of members means one or more members.

[0064] "Parallel" and "perpendicular" as used herein mean "substantially parallel" and "substantially perpendicular". Substantially parallel can mean parallel with some error, and substantially perpendicular can mean perpendicular with some error.

[0065] "Plane" as used herein means a "plane substantially parallel to a horizontal plane".

[0066] The power conversion device provided by the embodiments of the present application can reduce the heat dissipation cost of the power conversion device while ensuring the heat dissipation requirement of the power module.

[0067] Please refer to Figure 1 and Figure 2 The power conversion device 100 provided by the embodiments of the present application comprises a heat dissipation device 1, a box body 2, a power module (Figure 1 and Figure 2 is not shown in FIG. 1).

[0068] Please refer to Figure 3a The cabinet 2 has a first cavity 201 and a second cavity 202, and the second cavity 202 is adjacent to the first cavity 201.

[0069] For example, the second cavity 202 and the first cavity 201 can be distributed along a first direction, and the first direction can be a horizontal direction; or the second cavity 202 and the first cavity 201 can be distributed along a second direction, and the second direction can be a vertical direction, and the second cavity 202 is higher than the first cavity 201.

[0070] The first cavity 201 and the second cavity 202 can be isolated, which can be understood as: the first cavity 201 and the second cavity 202 are not connected.

[0071] For example, the cabinet 2 is provided with a back plate 203, and the inner cavity of the cabinet 2 is divided into the second cavity 202 and the first cavity 201 by the back plate 203; or the cabinet 2 includes a first cabinet 21 and a second cabinet 22, the first cavity 201 is arranged in the first cabinet 21, the second cabinet 22 is connected with the first cabinet 21 and is distributed along the first direction, and the back plate 203 of the first cabinet 21 and the second cabinet 22 enclose the second cavity 202.

[0072] The second cavity 202 is in communication with the external environment of the cabinet 2. Specifically, the second cavity 202 has an air inlet 2021 and an air outlet 2022, and the air inlet 2021 and the air outlet 2022 are in communication with the external environment of the cabinet 2.

[0073] In some embodiments, in order to facilitate the air of the external environment of the cabinet 2 to flow through the second cavity 202, the power conversion device 100 further includes a first fan 4, and the first fan 4 is installed in the second cavity 202. The first fan 4 drives the air of the external environment of the cabinet 2 to flow through the second cavity 202.

[0074] The power module 3 is installed in the first cavity 201. The power module 3 includes a circuit board 301, a first power device 302 and a second power device 303. The first power device 302 and the second power device 303 can be IGBT (Insulated Gate Bipolar Transistor) or other power devices.

[0075] The first power device 302 and the second power device 303 have different heat generation amounts per unit time, and the heat generation amount per unit time of the first power device 302 is less than that of the second power device 303. For example, the first power device 302 can include a power device in a boost circuit, and the second power device 303 can include a power device in an inverter circuit; or the first power device 302 can include an inverter device, and the second power device 303 can include a boost device.

[0076] The first power device 302 and the second power device 303 can be arranged on one side of the circuit board 301. The side of the circuit board 301 away from the first power device 302 and the second power device 303 can also be provided with electronic components 304 or others, and the electronic components 304 are located in the first cavity 201. The electronic components 304 can be capacitors or others. For the distribution of the electronic components 304, the actual situation is selected, Figure 6 An example of the distribution of the electronic components 304 is shown.

[0077] The heat dissipation device 1 is used to dissipate heat of the first power device 302 and the second power device 303. Specifically, the airflow flowing through the second cavity 202 flows through the heat dissipation device 1 to dissipate heat of the heat dissipation device 1, thereby dissipating heat of the first power device 302 and the second power device 303.

[0078] The specific structure of the heat dissipation device 1 will be described below.

[0079] As Figure 7 shown, the heat dissipation device 1 includes at least one first heat sink 101 and at least one second heat sink 102.

[0080] The first heat sink 101 includes a substrate 1011 and first heat dissipation fins 1012, and the first heat dissipation fins 1012 can be arranged on one side of the substrate 1011 along a first direction. At least part of the first heat dissipation fins 1012 is located in the second cavity 202.

[0081] In the first heat sink 101, the first heat dissipation fins 1012 can be one or more than two. In order to improve the heat dissipation efficiency, the first heat dissipation fins 1012 are at least two and are distributed at intervals, and adjacent two first heat dissipation fins 1012 form a first air duct 01. In combination Figure 3a and Figure 7 In the airflow direction in the second cavity 202, the first air duct 01 is located between the air inlet 2021 and the air outlet 2022.

[0082] The second heat sink 102 includes an evaporation plate 1021 and a condensation part 1022 located in the second cavity 202. The second heat sink 102 can be referred to as a phase change heat sink. The condensation part 1022 and the evaporation plate 1021 are in communication and form a phase change loop. It can be understood that the liquid medium in the evaporation plate 1021 can evaporate into gaseous medium, and the gaseous medium in the condensation part 1022 can condense into liquid medium. The condensation part 1022 can have a second air duct 02, which is in communication with the first air duct 01. Figure 3a and Figure 7 In the airflow direction in the second cavity 202, the second air duct 02 is located between the air inlet 2021 and the air outlet 2022.

[0083] Please refer to Figure 3a and Figure 7 The heat exchange arrangement between the substrate 1011 and the first power device 302 of the power module 3 can be understood as follows: the substrate 1011 is arranged in heat exchange with the first power device 302 on the side of the substrate 1011 facing away from the first heat dissipation fin 1012 in the first direction; the evaporation plate 1021 is arranged in heat exchange with the second power device 303 of the power module 3 on the side of the evaporation plate 1021 facing away from the condensation part 1022 in the first direction.

[0084] As shown in Figure 7 , the substrate 1011 has a first power device mounting area 103 abutting the first power device 302, and the evaporation plate 1021 has a second power device mounting area 106 abutting the second power device 303.

[0085] It should be noted that the first direction is the distribution direction of the first power device 302, the substrate 1011 and the first heat dissipation fin 1012, and the first direction is also the distribution direction of the second power device 303, the evaporation plate 1021 and the condensation part 1022.

[0086] In order to facilitate the heat exchange arrangement between the substrate 1011 and the first power device 302, and the heat exchange arrangement between the evaporation plate 1021 and the second power device 303, the first power device 302 and the second power device 303 are both located on one side of the circuit board 301 in the first direction.

[0087] As described above, the first cavity 201 and the second cavity 202 are separated by the back plate 203, as Figure 3aAs shown, in order to facilitate heat exchange between the substrate 1011 and the first power device 302, and heat exchange between the evaporation plate 1021 and the second power device 303, the substrate 1011 and the evaporation plate 1021 are both located in the second cavity 202, the substrate 1011 is attached to the back plate 203, and the evaporation plate 1021 is attached to the back plate 203. The back plate 203 is provided with a first through hole (not shown in the figure) and a second through hole (not shown in the figure), the first power device 302 is located in the first through hole and is attached to the substrate 1011 for heat exchange, and the second power device 303 is located in the second through hole and is attached to the evaporation plate 1021 for heat exchange. In this embodiment, the substrate 1011 is attached to the back plate 203 and closes the first through hole, and the evaporation plate 1021 is attached to the back plate 203 and closes the second through hole, so as to realize the isolation arrangement of the first cavity 201 and the second cavity 202. In this embodiment, the substrate 1011 and the evaporation plate 1021 can be arranged on the side of the back plate 203 facing the second cavity 202 in the first direction, which facilitates the installation of the heat dissipation device 1. In this embodiment, the condensation part 1022 is located in the second cavity 202, and the first heat dissipation fin 1012 is located in the second cavity 202.

[0088] As shown in some other embodiments, Figure 3b the first power device 302 and the second power device 303 are located in the first cavity 201, the back plate 203 is provided with a third through hole (not shown in the figure), part of the substrate 1011 and part of the evaporation plate 1021 are located in the third through hole, and the part of the substrate 1011 located in the third through hole is attached to the first power device 302 for heat exchange, and the part of the evaporation plate 1021 located in the third through hole is attached to the second power device 303 for heat exchange. In this embodiment, the evaporation plate 1021 and the substrate 1011 are both attached to the back plate 203 and close the third through hole, so as to realize the isolation arrangement of the first cavity 201 and the second cavity 202. In this embodiment, the first heat dissipation fin 1012 is located in the second cavity 202, and the condensation part 1022 is located in the second cavity 202.

[0089] As shown in some other embodiments, Figure 3cAs shown, in some other embodiments, the first power device 302 and the second power device 303 are located in the first cavity 201, the back plate 203 is provided with a third through hole (not shown in the figure). The substrate 1011 is located in the first cavity 201, the substrate 1011 and the first power device 302 are in thermal contact, and the first heat dissipation fin 1012 extends into the second cavity 202 through the third through hole. Part of the evaporation plate 1021 is located in the first cavity 201, part of the evaporation plate 1021 is located in the third through hole, and the evaporation plate 1021 and the second power device 303 are in thermal contact. In this embodiment, the evaporation plate 1021 and the substrate 1011 are both in contact with the back plate 203 and seal the third through hole, so as to realize the isolation of the first cavity 201 and the second cavity 202. In this embodiment, part of the first heat dissipation fin 1012 is located in the second cavity 202, and the condensing part 1022 is located in the second cavity 202.

[0090] In the power conversion device 100 provided by the embodiments of the present application, the heat of the first power device 302 is transferred to the substrate 1011 of the heat dissipation device 1, the heat of the substrate 1011 is transferred to the first heat dissipation fin 1012, at least part of the first heat dissipation fin 1012 is located in the second cavity 202, and the airflow flowing through the second cavity 202 flows through at least part of the first heat dissipation fin 1012 and dissipates heat of the first heat dissipation fin 1012, so as to realize the heat dissipation of the first power device 302; the liquid medium flowing through the evaporation plate 1021 absorbs the heat of the second power device 303 and evaporates into gaseous medium, the gaseous medium enters the condensing part 1022, the condensing part 1022 is located in the second cavity 202, the airflow flowing through the second cavity 202 flows through the condensing part 1022, so that the gaseous medium in the condensing part 1022 condenses into liquid medium, and the liquid cooling medium returns to the evaporation plate 1021 to realize circulation, so as to realize the heat dissipation of the second power device 303.

[0091] In the power conversion device 100 provided by the embodiments of the present application, according to the structures of the first heat sink 101 and the second heat sink 102, it can be known that, in the case of occupying the same space, the heat dissipation efficiency of the first heat sink 101 is less than that of the second heat sink 102, and the cost of the first heat sink 101 is less than that of the second heat sink 102, so that the first heat sink 101 can dissipate heat for the first power device 302 with a smaller heat generation amount, and the second heat sink 102 can dissipate heat for the second power device 303 with a larger heat generation amount, so that the heat dissipation requirements of the first power device 302 and the second power device 303 can be guaranteed, and thus the heat dissipation requirements of the power module 3 can be guaranteed; since the cost of the first heat sink 101 is lower than that of the second heat sink 102, the heat dissipation cost of the entire heat dissipation device 1 can be reduced, and thus the heat dissipation cost of the power conversion device 100 can be reduced. Therefore, in the heat dissipation device 1 described above, different heat sinks are used to dissipate heat for different power devices, and the heat sinks are reasonably equipped, so that the heat dissipation requirements of the power module 3 can be guaranteed while the heat dissipation cost of the power conversion device 100 can be reduced.

[0092] In the embodiments of the present application, in order to facilitate heat exchange and evaporation between the substrate 1011 and the first power device 302 and between the evaporation plate 1021 and the second power device 303, the substrate 1011 and the evaporation plate 1021 can be arranged in parallel. For example, the substrate 1011 and the evaporation plate 1021 can be arranged coplanarly or non-coplanarly.

[0093] In other embodiments, the substrate 1011 and the evaporation plate 1021 can also have a certain included angle, and the heat exchange between the substrate 1011 and the first power device 302 and the heat exchange between the evaporation plate 1021 and the second power device 303 can be guaranteed by the heat conduction layer.

[0094] In the embodiments of the present application, the first heat sink 101 and the second heat sink 102 can be relatively independent, and the two are separately installed in the box 2; or the first heat sink 101 and the second heat sink 102 are fixedly connected, and the whole formed by the first heat sink 101 and the second heat sink 102 (the heat dissipation device 1) is installed in the box 2.

[0095] In order to facilitate the installation of the heat dissipation device 1, the first heat sink 101 and the second heat sink 102 are fixedly connected. In some embodiments, the substrate 1011 and the evaporation plate 1021 are fixedly connected. In this way, the first heat sink 101 and the second heat sink 102 are fixedly connected, and the first heat sink 101 and the second heat sink 102 form a whole, and the whole formed by the first heat sink 101 and the second heat sink 102 is assembled in the box 2, which facilitates the installation of the entire heat dissipation device 1 and is conducive to improving the installation efficiency of the heat dissipation device 1.

[0096] Exemplarily, the substrate 1011 and the evaporation plate 1021 can be fixedly connected by welding or riveting; or, the substrate 1011 and the evaporation plate 1021 can be fixedly connected by fasteners; or, the substrate 1011 and the evaporation plate 1021 can be fixedly connected by fasteners and the substrate 1011 and the evaporation plate 1021 are further fixedly connected by welding, so as to improve the reliability of the fixed connection of the substrate 1011 and the evaporation plate 1021.

[0097] Please refer to Figure 7 , in order to facilitate the assembly of the first radiator 101 and the second radiator 102, the substrate 1011 and the evaporation plate 1021 are positioned and fitted along the first direction, and the substrate 1011 and the evaporation plate 1021 are positioned and fitted along the second direction and / or the third direction. In this way, in the embodiment of the fixed connection of the first radiator 101 and the second radiator 102, the probability of deviation of the first radiator 101 and the second radiator 102 can be reduced during the process of fixing the first radiator 101 and the second radiator 102, facilitating the assembly of the first radiator 101 and the second radiator 102; in the embodiment of the relative independence of the first radiator 101 and the second radiator 102, one of the first radiator 101 and the second radiator 102 is fixed to the cabinet first, and then the other of the first radiator 101 and the second radiator 102 is fixed, and the probability of deviation of the other can be reduced during the process of fixing the other, facilitating the fixing of the heat dissipation device 1.

[0098] Exemplarily, as shown in Figure 7 , the substrate 1011 and the evaporation plate 1021 are distributed along the second direction, and the substrate 1011 and the evaporation plate 1021 can be positioned and fitted along the first direction and the second direction. The second direction is perpendicular to the first direction, and the second direction can be a vertical direction.

[0099] Exemplarily, as shown in Figure 11 , the substrate 1011 and the evaporation plate 1021 are distributed along the third direction, and the substrate 1011 and the evaporation plate 1021 can be positioned and fitted along the first direction and the third direction. Figure 11 The positioning structure is not shown. The third direction, the first direction and the second direction are perpendicular to each other.

[0100] Exemplarily, as shown in Figure 13 , part of the substrate 1011 and the evaporation plate 1021 are distributed along the second direction, and part of the substrate 1011 and the evaporation plate 1021 are distributed along the third direction, and the substrate 1011 and the evaporation plate 1021 can be positioned and fitted along the first direction, the second direction and the third direction. Figure 13 The positioning structure is not shown.

[0101] In some other embodiments, the substrate 1011 and the evaporation plate 1021 can be positioned and fitted in the first direction, the second direction or the third direction, and are not limited to the above embodiments.

[0102] Please refer to Figure 7- Figure 9 , one of the substrate 1011 and the evaporation plate 1021 is provided with the convex part 105, and the other is provided with the concave part 104, and the concave part 104 and the convex part 105 are positioned and fitted. It can be understood that the concave part 104 and the convex part 105 are positioned and fitted in the first direction, and the concave part 104 and the convex part 105 are positioned and fitted in the second direction and / or the third direction.

[0103] For example, as shown in Figure 8 , the evaporation plate 1021 is provided with the concave part 104; as shown in Figure 9 , the substrate 1011 is provided with the convex part 105; as shown in Figure 7 , the concave part 104 and the convex part 105 are positioned and fitted in the first direction and the second direction.

[0104] For example, as shown in Figure 13 , the substrate 1011 and the evaporation plate 1021 are distributed in the second direction, the substrate 1011 and the evaporation plate 1021 are distributed in the third direction, and the substrate 1011 and the evaporation plate 1021 can be positioned and fitted in the first direction, the second direction and the third direction. In this case, the evaporation plate 1021 is provided with two concave parts 104, the substrate 1011 is provided with two convex parts 105, one concave part 104 and one convex part 105 are positioned and fitted in the first direction and the second direction, and the other concave part 104 and the other convex part 105 are positioned and fitted in the first direction and the third direction.

[0105] The specific shape and number of the convex part 105 and the concave part 104 are selected according to the actual situation, and the embodiments of the present application do not limit them.

[0106] In some embodiments, the substrate 1011 and the evaporation plate 1021 can also be positioned and fitted by other structures, for example, the substrate 1011 is provided with a groove accommodating the evaporation plate 1021, or the evaporation plate 1021 is provided with a groove accommodating the substrate 1011, and are not limited to the above embodiments.

[0107] In the embodiments of the present application, the first heat sink 101 can be one or more than two, and the second heat sink 102 can be one or more than two.

[0108] For example, as shown in Figure 7 , the first heat sink 101 is one, and the second heat sink 102 is one; or the first heat sink 101 is one, and the second heat sink 102 is at least two; or, as shown in Figure 13 and Figure 14As shown, there are at least two first heat sinks 101 and one second heat sink 102; or, as... Figure 25 As shown, there are at least two first heat sinks 101 and at least two second heat sinks 102.

[0109] The number of the first heat sink 101 and the second heat sink 102 is designed according to the actual heat dissipation requirements, and this application embodiment does not limit this.

[0110] In the case where there are at least two first heat sinks 101, such as Figure 11 As shown, in order to simplify the structure, the base plate 1011 of all the first heat sinks 101 is a one-piece structure, which also simplifies the installation of the first heat sinks 101.

[0111] In the case where there are at least two second heat sinks 102, such as Figure 11 As shown, in order to simplify the structure, the evaporation plates 1021 of all second heat sinks 102 are integrated structures, which also simplifies the installation of the second heat sinks 102.

[0112] In this embodiment, the distribution direction of the first heat sink 101 and the second heat sink 102 is set according to the distribution of the first power device 302 and the second power device 303 and the heat dissipation requirements.

[0113] like Figure 7 As shown, in some embodiments, the first heat sink 101 and the second heat sink 102 are distributed along a second direction; or, as... Figure 11 As shown, the first radiator 101 and the second radiator 102 are distributed along a third direction; or, as... Figure 13 and Figure 14 As shown, a portion of the first radiator 101 is located on at least one side of the second radiator 102 along a second direction, and a portion of the first radiator 101 is located on at least one side of the second radiator 102 along a third direction.

[0114] For example, such as Figure 3a As shown, the second direction is vertical, and the first radiator 101 and the second radiator 102 are distributed along the second direction, with the first radiator 101 located on the bottom side of the second radiator 102; as Figure 4 As shown, the second direction is the vertical direction, the first heat sink 101 and the second heat sink 102 are distributed along the second direction, and the first heat sink 101 is located on the top side of the second heat sink 102.

[0115] For example, such as Figure 13 and Figure 14 As shown, a portion of the first radiator 101 is located on one side of the second radiator 102 along the second direction, and a portion of the first radiator 101 is located on one side of the second radiator 102 along the third direction; asFigure 15 As shown, the part of the first heat sink 101 is located on one side of the second heat sink 102 along the second direction, and the part of the first heat sink 101 is located on both sides of the second heat sink 102 along the third direction.

[0116] It can be understood that, Figure 15 In some embodiments, the part of the first heat sink 101 is distributed on both sides of the second heat sink 102 along the third direction, and the part of the first heat sink 101 is distributed on one side of the second heat sink 102 along the second direction.

[0117] It should be noted that, Figure 16 As shown, the part of the first heat sink 101 is located on one side of the second heat sink 102 along the second direction, and the part of the first heat sink 101 is located on both sides of the second heat sink 102 along the third direction. Figure 20

[0118] In the embodiments of the present application, the distribution structure of the first heat sink 101 and the second heat sink 102 can be flexibly adjusted, and the distribution of the first heat sink 101 and the second heat sink 102 can be adjusted according to different heat dissipation requirements, which improves the adaptability of the heat dissipation device 1 to different heat dissipation requirements, and can meet the complex and diverse layout of the power module 3 in the power conversion device 100, thereby meeting the demand for diversified layout of the power module 3 in the power conversion device 100.

[0119] As Figure 23 As shown, in some embodiments, the first heat sink 101 further comprises a second heat fin 1013, which is arranged on the side of the substrate 1011 away from the first heat fin 1012 along the first direction. Please refer to Figure 24 The second heat fin 1013 can extend into the first cavity 201 of the box 2. In this way, the second heat fin 1013 can transfer the heat in the first cavity 201 to the substrate 1011, increase the heat exchange area of the airflow in the first cavity 201 and the first heat sink 101, and improve the heat dissipation effect and efficiency of the first heat sink 101 on the first cavity 201.

[0120] As Figure 25 As shown, the projection of the area where the second heat fin 1013 is located along the first direction, and the projection of the area where the first heat fin 1012 is located along the first direction have overlapping parts along the second direction and the third direction. In this way, the heat transfer efficiency of the second heat fin 1013 to the first heat fin 1012 can be accelerated, which is beneficial to improve the heat dissipation efficiency of the first cavity 201.

[0121] ​It should be noted that the second heat dissipation fins 1013 are arranged in the projection along the first direction, and the first heat dissipation fins 1012 are arranged in the projection along the first direction, and the projections along the second direction and the third direction of the second heat dissipation fins 1013 and the first heat dissipation fins 1012 are arranged in the same plane, and the projections along the second direction and the third direction of the second heat dissipation fins 1013 and the first heat dissipation fins 1012 are arranged in the same plane. The plane is perpendicular to the first direction.

[0122] As shown in FIG. 1, the second heat dissipation fins 1013 are arranged in the projection along the first direction, and the first heat dissipation fins 1012 are arranged in the projection along the first direction. The second heat dissipation fins 1013 and the first heat dissipation fins 1012 are arranged in the third direction. Figure 26a As shown in FIG. 1, the second heat dissipation fins 1013 are arranged in the projection along the first direction, and the first heat dissipation fins 1012 are arranged in the projection along the first direction. The second heat dissipation fins 1013 and the first heat dissipation fins 1012 are arranged in the third direction. Figure 26b As shown in FIG. 1, the second heat dissipation fins 1013 are arranged in the projection along the first direction, and the first heat dissipation fins 1012 are arranged in the projection along the first direction. The second heat dissipation fins 1013 and the first heat dissipation fins 1012 are arranged in the third direction.

[0123] It should be noted that the second heat dissipation fins 1013 are arranged in the projection along the first direction, and the first heat dissipation fins 1012 are arranged in the projection along the first direction, and the projections along the second direction and the third direction of the second heat dissipation fins 1013 and the first heat dissipation fins 1012 are arranged in the same plane, and the projections along the second direction and the third direction of the second heat dissipation fins 1013 and the first heat dissipation fins 1012 are arranged in the same plane. The plane is perpendicular to the first direction.

[0124] In the above embodiment, the first heat dissipation fins 1012 and the second heat dissipation fins 1013 can be arranged reasonably according to the space in the first cavity 201 and the second cavity 202, and the setting flexibility of the first heat dissipation fins 1012 and the second heat dissipation fins 1013 can be improved.

[0125] In the embodiment of the present application, the first heat dissipation device 101 can be combined with other heat dissipation structures. In some embodiments, as shown in FIG. 1, the substrate 1011 can be embedded with a heat pipe 1014, so that the first heat dissipation device 101 can be referred to as a heat pipe heat dissipation device. The heat pipe 1014 and the substrate 1011 are arranged in heat exchange with the first power device 302. Figure 7

[0126] ​The heat pipe 1014 includes a vacuum metal tube with a capillary structure and a small amount of working fluid (e.g., water) inside. Heat from the first power device 302 is transferred to the evaporation end of the heat pipe 1014. The liquid working fluid inside the heat pipe 1014 absorbs heat and rapidly evaporates into steam. Due to the increased pressure at the evaporation end and the lower pressure at the condensation end of the heat pipe 1014, the steam flows instantaneously from the evaporation end to the condensation end. This speed is close to the speed of sound with extremely low delay. After reaching the condensation end, the steam transfers heat to the first heat dissipation fins 1012. The steam, having lost heat, condenses back into a liquid state, and the condensed liquid working fluid returns to the evaporation end, thus completing the cycle.

[0127] The first radiator 101 described above effectively improves its heat dissipation efficiency and effect by adding heat pipe 1014.

[0128] In some other embodiments, the substrate 1011 can be a VC (Vapor Chamber). The heat dissipation principle of the vacuum chamber can be referred to the heat pipe 1014, and will not be repeated here.

[0129] The first radiator 101 mentioned above improves the heat dissipation efficiency and effect through the vacuum heat exchange plate.

[0130] In some other embodiments, a vacuum heat exchange plate may be embedded in the substrate 1011. Both the vacuum heat exchange plate and the substrate 1011 may be configured to exchange heat with the first power device 302. This also improves the heat dissipation efficiency and effect of the first heat sink 101 through the vacuum heat exchange plate.

[0131] When the first heat dissipation fin 1012 is serrated, the first heat sink 101 can be referred to as a serrated heat sink. In the embodiment where the heat pipe 1014 is embedded in the substrate 1011, the first heat sink 101 can be referred to as a heat pipe serrated heat sink; in the embodiment where the substrate 1011 is a vacuum heat exchange plate, or where the substrate 1011 is embedded in a vacuum heat exchange plate, the first heat sink 101 can be referred to as a heat exchange plate serrated heat sink.

[0132] In some embodiments, the first heat dissipation fin 1012 may also be of other types, such as brazed fins, and is not limited to the type of shovel teeth.

[0133] like Figure 27 As shown, in some embodiments, the second radiator 102 further includes an evaporation section 1023, which is connected to the evaporation plate 1021, and the evaporation section 1023, the evaporation plate 1021, and the condensation section 1022 form a phase change circuit; the evaporation section 1023 is located on the side of the evaporation plate 1021 away from the condensation section 1022 along a first direction; combined with Figure 28As shown, the evaporation part 1023 can extend into the first cavity 201. In this way, the second heat sink 102 improves the heat exchange efficiency between the second heat sink 102 and the first cavity 201 by increasing the evaporation part 1023, thereby improving the heat dissipation effect of the first cavity 201.

[0134] Please refer to Figure 27 In some embodiments, the evaporation part 1023 can include: an evaporation pipe 10231, an evaporation fin 10232, and an evaporation bus 10233, one end of the evaporation pipe 10231 being in communication with the evaporation plate 1021, and the other end of the evaporation pipe 10231 being in communication with the evaporation bus 10233; the evaporation pipe 10231 is at least two, and the evaporation fin 10232 is arranged between the two adjacent evaporation pipes 10231; the evaporation part 1023 and the evaporation plate 1021 are located on one side of the condensation part 1022 along the second direction. It can be understood that the second direction is a vertical direction, the condensation part 1022 is higher than the evaporation part 1023, and the condensation part 1022 is higher than the evaporation plate 1021; each evaporation pipe 10231 is in communication with the evaporation bus 10233, and each evaporation pipe 10231 is in communication with the evaporation plate 1021.

[0135] In the above embodiments, the liquid medium flowing out of the condensation part 1022 enters a part of the evaporation pipe 10231 through the evaporation plate 1021, and the liquid medium absorbs heat in the first cavity 201 to form gaseous medium during flowing through the evaporation pipe 10231, and then flows back to the evaporation plate 1021 through another part of the evaporation pipe 10231.

[0136] In order to facilitate the flow of medium in the evaporation pipe 10231, the evaporation pipe 10231 is arranged inclined to the second direction, and one end of the evaporation pipe 10231 connected to the evaporation plate 1021 is higher than the other end of the evaporation pipe 10231 connected to the evaporation bus 10233.

[0137] In the above embodiments, the evaporation fin 10232 can accelerate the heat exchange between the air in the first cavity 201 and the evaporation part 1023, which is conducive to improving the heat dissipation efficiency and effect of the first cavity 201. In other embodiments, the evaporation part 1023 can also have other structures, for example, the evaporation part 1023 does not include the evaporation fin 10232.

[0138] In some embodiments, as shown in Figure 7 and Figure 8 As shown, the evaporation plate 1021 and the condensation part 1022 are an integrated structure. In this way, the volume of the entire second heat sink 102 can be reduced.

[0139] Please refer to Figure 7 and Figure 8The condenser section 1022 includes condenser tubes 10221, condenser fins 10222, and a condenser manifold 10223. One end of the condenser tube 10221 is connected to the evaporator plate 1021, and the other end of the condenser tube 10221 is connected to the condenser manifold 10223. There are at least two condenser tubes 10221, and the condenser fins 10222 are arranged between two adjacent condenser tubes 10221. It can be understood that each condenser tube 10221 is connected to the condenser manifold 10223, and each condenser tube 10221 is connected to the evaporator plate 1021.

[0140] In embodiments where the evaporator plate 1021 and the condenser section 1022 are an integral structure, the condenser tube 10221 and the evaporator plate 1021 can be vertically or obliquely distributed. To facilitate the flow of the medium within the condenser tube 10221, the end of the condenser tube 10221 connected to the evaporator plate 1021 is lower than the end of the condenser tube 10221 connected to the condenser manifold 10223.

[0141] In other embodiments, such as Figure 16 As shown, the evaporator plate 1021 and the condenser section 1022 are separate structures, connected by a pipe assembly 1024 to form a phase change circuit. The condenser section 1022 is located on one side of the evaporator plate 1021 along a second direction, which is understood to be a vertical direction, and the condenser section 1022 is higher than the evaporator plate 1021.

[0142] In the above embodiments, such as Figure 16 As shown, the condenser section 1022 is inclined relative to the second direction; or, as... Figure 21 and Figure 22 As shown, the condenser 1022 can also be arranged parallel to the substrate 1011, and the condenser 1022 is located on one side of the evaporator 1021 along the second direction. It can be understood that the second direction is a vertical direction, and the condenser 1022 is higher than the evaporator 1021. In this way, it can be ensured that the medium in the condenser 1022 can flow from top to bottom, thereby ensuring that the medium circulates in the phase change circuit.

[0143] In the above embodiments, the evaporator plate 1021 and the condenser section 1022 are separate structures. The position of the condenser section 1022 can be flexibly adjusted through the pipe assembly 1024, which is beneficial to improving the adaptability of the heat dissipation device 1.

[0144] In embodiments where the evaporator plate 1021 and the condenser section 1022 are of a separate structure, such as... Figure 16As shown, the condensing part 1022 can include condensing tubes 10221, condensing fins 10222, and two condensing junctions 10223, one end of the condensing tube 10221 communicates with one condensing junction 10223, and the other end of the condensing tube 10221 communicates with the other condensing junction 10223; the condensing tube 10221 is at least two, and the condensing fins 10222 are arranged between the adjacent two condensing tubes 10221. It can be understood that each condensing tube 10221 communicates with the condensing junction 10223, and each condensing tube 10221 communicates with the evaporating plate 1021.

[0145] In the above embodiment, the pipe assembly 1024 includes a first connecting pipe 10241 and a second connecting pipe 10242, the first connecting pipe 10241 connects the gas outlet of the evaporating plate 1021 and the gas inlet of one condensing junction 10223, and the second connecting pipe 10242 connects the liquid inlet of the evaporating plate 1021 and the liquid outlet of the other condensing junction 10223.

[0146] In the case of the condensing part 1022 being arranged obliquely relative to the second direction, the condensing tube 10221 is arranged obliquely relative to the second direction, the second direction is the vertical direction, and one end of the condensing tube 10221 is higher than the other end. In the case of the condensing part 1022 being parallel to the second direction, the condensing tube 10221 is parallel to the second direction.

[0147] In the embodiment of the evaporating plate 1021 and the condensing part 1022 being in a split structure, as shown in Figure 21 and Figure 22 As shown, the condensing part 1022 can also be a condensing plate 1022a. In the case of the condensing part 1022 being arranged obliquely relative to the second direction, the condensing plate 1022a is arranged obliquely relative to the second direction, the second direction is the vertical direction, and one end of the condensing plate 1022a is higher than the other end. In the case of the condensing part 1022 being parallel to the base plate 1011, the condensing plate 1022a is parallel to the base plate 1011, and the condensing plate 1022a is located on one side of the evaporating plate 1021 along the second direction. It can be understood that the second direction is the vertical direction, and the condensing plate 1022a is higher than the evaporating plate 1021.

[0148] In some embodiments, as shown in Figure 16As shown, the condensing part 1022 is arranged obliquely relative to the second direction, the plurality of first heat dissipation fins 1012 includes a top fin 1012a located on a side of the condensing part 1022 away from the evaporating plate 1021 along the second direction, and an oblique edge 10121 of the top fin 1012a located on a side of the condensing part 1022 close to the evaporating plate 1021 along the second direction is arranged obliquely relative to the second direction, and the oblique direction of the oblique edge 10121 is the same as the oblique direction of the condensing part 1022. In this way, the distance between the top fin 1012a and the condensing part 1022 in the second direction can be shortened, the compactness of the first heat sink 101 and the second heat sink 102 is improved, and the space occupied by the entire heat dissipation device 1 in the second direction is reduced.

[0149] As shown in the examples, Figure 16 all the first heat dissipation fins 1012 are top fins 1012a; or, as shown in the examples, Figure 20 part of the first heat dissipation fins 1012 are top fins 1012a, and the other part of the first heat dissipation fins 1012 are located on a side of the condensing part 1022 close to the evaporating plate 1021 along the second direction and on both sides of the condensing part 1022 along the third direction. Of course, the other part of the first heat dissipation fins 1012 can also be located on one side of the condensing part 1022 along the third direction.

[0150] In some embodiments, as shown in the examples, Figure 21 and Figure 22 the evaporating plate 1021 and the condensing part 1022 are in a split structure, the condensing part 1022 is located at an end of the first heat dissipation fin 1012 away from the substrate 1011 along the first direction, and the condensing part 1022 is located on a side of the evaporating plate 1021 along the second direction. It can be understood that the second direction is a vertical direction, and the condensing part 1022 is higher than the evaporating plate 1021. In this way, the area occupied by the heat dissipation device 1 in a plane parallel to the second direction and the third direction can be reduced, and other devices in the second cavity 202 can be arranged.

[0151] In the above embodiments, the condensing plate 1022a can be parallel to the substrate 1011, the distance between the condensing plate 1022a and the first heat dissipation fin 1012 along the first direction can be shortened, the structural compactness of the heat dissipation device 1 is improved, and the space occupied by the entire heat dissipation device 1 in the first direction is reduced. Or, the condensing plate 1022a can be arranged obliquely relative to the substrate 1011, and is not limited to the above structure.

[0152] As shown in the examples, Figure 3aAs shown, the power conversion device 100 can further include a first device 5 and a second device 6, both of which are mounted in the second cavity 202; along the direction of the air flow in the second cavity 202, the first device 5 is located between the first heat sink 101 and the air outlet 2022, and the second device 6 is located between the second heat sink 102 and the air outlet 2022. In this way, the air flow in the second cavity 202 can also flow through the first device 5 and the second device 6, and the first device 5 and the second device 6 can be cooled, so that the cooling of the cooling device 1, the cooling of the first device 5 and the cooling of the second device 6 are combined, the cooling structure of the power conversion device 100 is simplified, and the cooling cost of the power conversion device 100 is reduced.

[0153] In some embodiments, the power conversion device 100 can further include the first device 5 or the second device 6. By arranging other devices in the power conversion device 100 in the air flow passage, the cooling structure of the power conversion device 100 can be simplified, and the cooling cost of the power conversion device 100 can be reduced.

[0154] The first device 5 and the second device 6 can both be reactors or other devices, and the embodiments of the present application do not limit them.

[0155] In the embodiments of the present application, as shown in Figure 24 The power conversion device 100 can further include a second fan 7, which is mounted in the first cavity 201, so that the second fan 7 can drive the air in the first cavity 201 to flow, accelerate the cooling of the first cavity 201, and thus improve the cooling efficiency and cooling effect of the first cavity 201.

[0156] As described above, the cooling device 1 can include second heat dissipation fins 1013, as shown in Figure 24 The second fan 7 drives the air to flow through the second heat dissipation fins 1013, which strengthens the heat exchange between the air flow in the first cavity 201 and the second heat dissipation fins 1013, and the effect of the second fan 7 is more obvious, which is more conducive to improving the cooling efficiency and cooling effect of the first cavity 201.

[0157] Two adjacent second heat dissipation fins 1013 form an air duct, and the second fan 7 can be located at the inlet or outlet of the air duct, and the embodiments of the present application do not limit it.

[0158] As described above, the cooling device 1 can include an evaporation part 1023, as shown in Figure 28 The second fan 7 drives the air to flow through the evaporation part 1023, which strengthens the heat exchange between the air flow in the first cavity 201 and the evaporation part 1023, and the effect of the second fan 7 is more obvious, which is more conducive to improving the cooling efficiency and cooling effect of the first cavity 201.

[0159] In the evaporation part 1023, two adjacent evaporation fins 10232 form an air duct, and the second air fan 7 can be located at the inlet or outlet of the air duct, which is not limited in the embodiments of the present application.

[0160] As described above, the power conversion device 100 can also include the first air fan 4, and the embodiments of the power conversion device 100 including the first air fan 4 and the embodiments of the power conversion device 100 including the second air fan 7 can be implemented independently or in combination.

[0161] In the embodiments of the present application, the specific distribution of the air inlet 2021 and the air outlet 2022 of the second cavity 202 is selected according to the actual situation.

[0162] In some embodiments, as shown in Figure 3a , the air inlet 2021 is arranged on the side of the second cavity 202 away from the first cavity 201 along the first direction, and the air outlets 2022 are distributed on both sides of the air inlet 2021 along the second direction. In this way, air can be drawn in at the middle position of the second cavity 202 along the second direction, and air can be exhausted on both sides of the air inlet 2021 along the second direction, which can shorten the airflow path and be conducive to improving the heat dissipation effect and efficiency.

[0163] As shown in Figure 3a , the distribution of the above-mentioned air inlet 2021 and air outlet 2022 can be applicable to the embodiment in which the evaporation plate 1021 and the condensation part 1022 are integrated; as shown in Figure 29 and Figure 30 , the distribution of the above-mentioned air inlet 2021 and air outlet 2022 can be applicable to the embodiment in which the evaporation plate 1021 and the condensation part 1022 are separate.

[0164] Exemplarily, as shown in Figure 3a , the air outlets 2022 can be located on both sides of the second cavity 202 along the second direction, which can be understood as Figure 3a the upper side and the lower side of the second cavity 202; or the air outlets 2022 can also be arranged on the side of the second cavity 202 away from the first cavity 201 along the first direction, which can be understood as: Figure 3a the right side of the second cavity 202; or the air outlets 2022 can be arranged on both sides of the second cavity 202 along the third direction.

[0165] Exemplarily, as shown in Figure 3a , the first heat dissipation fins 1012 and the condensation part 1022 are distributed along the second direction, and at least part of the projection of the air inlet 2021 along the first direction can be located between the first heat dissipation fins 1012 and the condensation part 1022, so that the air entering from the air inlet 2021 can flow through the first heat dissipation fins 1012 and the condensation part 1022 respectively, which is conducive to reducing air resistance and improving heat dissipation efficiency.

[0166] For example, such as Figure 12 As shown, the first heat dissipation fins 1012 and the condenser section 1022 are distributed along a third direction, the two condenser sections 1022 are distributed along a second direction, the first heat dissipation fins 1012 are spaced apart along a third direction, and the air inlet ( Figure 12 (Not shown) The portion projected along the first direction can be located between the two condenser sections 1022, the air inlet ( Figure 12 (Not shown) The portion projected along the first direction can be located in the first air duct formed by two adjacent first heat dissipation fins 1012. This facilitates airflow through the condenser section 1022 and the first heat dissipation fins 1012.

[0167] In the above embodiments, the first fan 4 can be located at the air inlet 2021 or the air outlet 2022. There can be one or more first fans 4. For example, as shown... Figure 10 As shown, there are five first fans (4).

[0168] In other embodiments, such as Figure 31 As shown, the air inlet 2021 can also be located on at least one side of the second cavity 202 along a third direction, and the air outlets 2022 are distributed on both sides of the air inlet 2021 along the second direction. In this way, air can be drawn in at the middle position of the second cavity 202 along the second direction and discharged on both sides of the air inlet 2021 along the second direction, which can shorten the airflow path and improve the heat dissipation effect and efficiency.

[0169] In the above embodiments, the number and distribution of the first fans 4 are selected according to the actual situation, and this application embodiment does not limit this.

[0170] In some other embodiments, such as Figure 5a As shown, the air inlet 2021 is located on one side of the second cavity 202 along the second direction, and the air outlet 2022 is distributed on the side of the second cavity 202 away from the air inlet 2021 along the second direction. This increases the distance between the air inlet 2021 and the air outlet 2022, reduces the probability of hot air recirculation, and helps to improve the heat dissipation effect and efficiency.

[0171] like Figure 5a As shown, the distribution of the air inlet 2021 and air outlet 2022 can be applied to embodiments where the evaporator plate 1021 and condenser section 1022 are an integral structure; or, the distribution of the air inlet 2021 and air outlet 2022 can be applied to embodiments where the evaporator plate 1021 and condenser section 1022 are separate structures.

[0172] To facilitate the airflow to flow through the second cavity 202, the air inlet 2021 is located at the bottom side of the second cavity 202 along the second direction, and the air outlet 2022 is higher than the air inlet 2021.

[0173] In some other embodiments, as shown in FIG. 2B, the air inlet 2021 is arranged at one side of the second cavity 202 along the second direction, and the air outlets 2022 are distributed at the two sides of the second cavity 202 along the third direction; or, the air inlet 2021 is arranged at one side of the second cavity 202 along the second direction, and the air outlets 2022 are distributed at one side of the second cavity 202 along the third direction. Figure 5b To reduce the backflow of the heat, the air inlet 2021 is located at the bottom side of the second cavity 202 along the second direction, and the air outlet 2022 is higher than the air inlet 2021, for example, the air outlet 2022 is located at the top of the side of the second cavity 202 along the third direction.

[0174] Figure 5c In some other embodiments, as shown in FIG. 2B, the air inlet 2021 is arranged at one side of the second cavity 202 along the second direction, and the air outlets 2022 are distributed at the two sides of the second cavity 202 along the third direction; or, the air inlet 2021 is arranged at one side of the second cavity 202 along the second direction, and the air outlets 2022 are distributed at one side of the second cavity 202 along the third direction.

[0175] To reduce the backflow of the heat, the air inlet 2021 is located at the bottom side of the second cavity 202 along the second direction, and the air outlet 2022 is higher than the air inlet 2021, for example, the air outlet 2022 is located at the top of the side of the second cavity 202 along the third direction.

[0176] In the case that the air inlet 2021 is arranged at one side of the second cavity 202 along the second direction, the air outlets 2022 can be distributed at multiple positions.

[0177] As shown in FIG. 2B, there are at least two air outlets 2022, at least one air outlet 2022 is distributed at the side of the second cavity 202 away from the air inlet 2021 along the second direction, and at least one air outlet 2022 is distributed at the side of the second cavity 202 away from the first cavity 201 along the first direction. Figure 5d Alternatively, as shown in FIG. 2B, there are at least two air outlets 2022, at least one air outlet 2022 is distributed at the side of the second cavity 202 away from the air inlet 2021 along the second direction, and at least one air outlet 2022 is distributed at the side of the second cavity 202 away from the first cavity 201 along the first direction.

[0178] Figure 17 ​​As shown, the air outlets 2022 are at least three, at least one air outlet 2022 is distributed on the side of the second cavity 202 away from the air inlet 2021 along the second direction, at least one air outlet 2022 is distributed on the side of the second cavity 202 away from the first cavity 201 along the first direction, and at least one air outlet 2022 is distributed on the side of the second cavity 202 along the third direction. Alternatively, the air outlets 2022 are at least four, at least one air outlet 2022 is distributed on the side of the second cavity 202 away from the air inlet 2021 along the second direction, at least one air outlet 2022 is distributed on the side of the second cavity 202 away from the first cavity 201 along the first direction, and at least two air outlets 2022 are respectively distributed on the two sides of the second cavity 202 along the third direction.

[0179] Alternatively, the air outlets 2022 are at least two, at least one air outlet 2022 is distributed on the side of the second cavity 202 away from the air inlet 2021 along the second direction, and at least one air outlet 2022 is distributed on the side of the second cavity 202 along the third direction. Alternatively, the air outlets 2022 are at least three, at least one air outlet 2022 is distributed on the side of the second cavity 202 away from the air inlet 2021 along the second direction, and at least two air outlets 2022 are respectively distributed on the two sides of the second cavity 202 along the third direction.

[0180] Alternatively, the air outlets 2022 are at least two, at least one air outlet 2022 is distributed on the side of the second cavity 202 away from the air inlet 2021 along the second direction, and at least one air outlet 2022 is distributed on the side of the second cavity 202 along the third direction. Alternatively, the air outlets 2022 are at least three, at least one air outlet 2022 is distributed on the side of the second cavity 202 away from the air inlet 2021 along the second direction, and at least two air outlets 2022 are respectively distributed on the two sides of the second cavity 202 along the third direction.

[0181] In the above embodiments, the first fan 4 can be distributed on one side or both sides of the heat dissipation device 1 along the second direction. In combination with Figure 18 and Figure 19 As shown, in the case where the condensing part 1022 of the second heat sink 102 is arranged to be inclined with respect to the second direction, the first fan 4 can be distributed on the bottom side of the condensing part 1022 along the second direction, and the space on the bottom side of the condensing part 1022 can be fully utilized, thereby improving the compactness of the overall structure.

[0182] The technical features mentioned above, and the technical features shown in the drawings alone, can be arbitrarily combined with each other, as long as the technical features to be combined are not contradictory to each other. All possible combinations of features are explicitly described herein. Any one of the technical features among the multiple technical features contained in the same sentence can be independently applied, and does not have to be applied together with other technical features.

[0183] The foregoing description of the disclosed embodiments enables a person skilled in the art to make or use the application. Modifications of these embodiments will occur to those skilled in the art and are within the scope of the application as defined by the appended claims, the general principles defined herein can be applied to other embodiments without departing from the spirit or essential characteristics of the application. Thus, the present application is not to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power conversion device, characterized by, The utility model relates to a power module cooling device, including: Box (2), power module (3) and heat dissipation device (1); The box (2) has first cavity (201) and second cavity (202), first cavity (201) and second cavity (202) are adjacent arrangement, power module (3) is installed in first cavity (201), and second cavity (202) is communicated with the outside environment of box (2); The heat dissipation device (1) includes at least one first radiator (101) and at least one second radiator (102); The first radiator (101) includes a substrate (1011) and a first heat dissipation fin (1012) disposed on the substrate (1011), the substrate (1011) and the first power device (302) of the power module (3) are in heat exchange arrangement, and at least part of the first heat dissipation fin (1012) is located in the second cavity (202); The second radiator (102) includes an evaporative plate (1021) and a condensing portion (1022), the condensing portion (1022) and the evaporative plate (1021) are communicated and form a phase change loop, the evaporative plate (1021) and the second power device (303) of the power module (3) are in heat exchange arrangement, and the condensing portion (1022) is located in the second cavity (202).

2. The power conversion device of claim 1, wherein, The substrate (1011) and the evaporative plate (1021) are fixedly connected.

3. The power conversion device of claim 1, wherein, The substrate (1011) and the evaporative plate (1021) are positioned and fitted along a first direction, and the substrate (1011) and the evaporative plate (1021) are positioned and fitted along a second direction and / or a third direction. The first direction is the distribution direction of the first power device (302), the substrate (1011) and the first heat dissipation fin (1012), and the first direction, the second direction and the third direction are perpendicular to each other.

4. The power conversion device of claim 3, wherein, One of the substrate (1011) and the evaporative plate (1021) is provided with a convex portion (105), and the other is provided with a concave portion (104), and the concave portion (104) and the convex portion (105) are positioned and fitted.

5. The power conversion device of claim 1, wherein, The first radiator (101) is at least two, and the substrates (1011) of all the first radiators (101) are integrated structures. And / or, the second radiator (102) is at least two, and the evaporative plates (1021) of all the second radiators (102) are integrated structures.

6. The power conversion device of claim 1, wherein, The first radiator (101) and the second radiator (102) are distributed along a second direction. Alternatively, the first radiator (101) and the second radiator (102) are distributed along a third direction. Alternatively, part of the first radiator (101) is located on at least one side of the second radiator (102) along the second direction, and part of the first radiator (101) is located on at least one side of the second radiator (102) along the third direction. The second direction, the third direction and the first direction are perpendicular to each other, and the first direction is a distribution direction of the first power device (302), the substrate (1011) and the first heat dissipation fin (1012).

7. The power conversion device of claim 1, wherein, The first heat sink (101) further comprises a second heat dissipation fin (1013) arranged on a side of the substrate (1011) away from the first heat dissipation fin (1012) along a first direction, and the second heat dissipation fin (1013) extends into the first cavity (201), and the first direction is a distribution direction of the first power device (302), the substrate (1011) and the first heat dissipation fin (1012).

8. The power conversion device of claim 7, wherein, The projection of the area where the second heat dissipation fin (1013) is located along the first direction and the projection of the area where the first heat dissipation fin (1012) is located along the first direction are spaced apart along the second direction and / or the third direction. Alternatively, the projection of the area where the second heat dissipation fin (1013) is located along the first direction and the projection of the area where the first heat dissipation fin (1012) is located along the first direction have an overlapping portion along the second direction and the third direction.

9. The power conversion device of claim 1, wherein, The substrate (1011) is embedded with a heat pipe (1014), or the substrate (1011) is a vacuum heat plate, or the substrate (1011) is embedded with a vacuum heat plate.

10. The power conversion device of claim 1, wherein, The second heat sink (102) further comprises an evaporation part (1023) in communication with the evaporation plate (1021), and the evaporation part (1023), the evaporation plate (1021) and the condensation part (1022) form a phase change loop. The evaporation part (1023) is located on a side of the evaporation plate (1021) away from the condensation part (1022) along a first direction, and the evaporation part (1023) extends into the first cavity (201); the first direction is a distribution direction of the first power device (302), the substrate (1011) and the first heat dissipation fin (1012).

11. The power conversion device of claim 10, wherein, The evaporation part (1023) comprises an evaporation pipe (10231), an evaporation fin (10232) and an evaporation busbar (10233), one end of the evaporation pipe (10231) is in communication with the evaporation plate (1021), and the other end of the evaporation pipe (10231) is in communication with the evaporation busbar (10233); the evaporation pipe (10231) is at least two, the evaporation fin (10232) is arranged between two adjacent evaporation pipes (10231); the evaporation part (1023) and the evaporation plate (1021) are located on a side of the condensation part (1022) along a second direction, and the second direction is perpendicular to the first direction.

12. The power conversion device of any one of claims 1-11, wherein, The evaporation plate (1021) and the condensation part (1022) are of an integrated structure. Alternatively, the evaporation plate (1021) and the condensation part (1022) are in a split structure, the evaporation plate (1021) and the condensation part (1022) are communicated through a pipe assembly (1024) and form a phase change loop, the condensation part (1022) is located on one side of the evaporation plate (1021) along a second direction, the second direction is perpendicular to a first direction, the first direction is the distribution direction of the first power device (302), the substrate (1011) and the first heat dissipation fin (1012).

13. The power conversion device of claim 12, wherein, The condensation part (1022) is arranged obliquely relative to the second direction, a plurality of the first heat dissipation fins (1012) include a top fin (1012a), the top fin (1012a) is located on a side of the condensation part (1022) away from the evaporation plate (1021) along the second direction, an edge of the top fin (1012a) close to the condensation part (1022) along the second direction is a hypotenuse (10121), the hypotenuse (10121) is arranged obliquely relative to the second direction, and the oblique direction of the hypotenuse (10121) is the same as the oblique direction of the condensation part (1022).

14. The power conversion device of claim 12, wherein, The evaporation plate (1021) and the condensation part (1022) are in a split structure, the condensation part (1022) is located on an end of the first heat dissipation fin (1012) away from the substrate (1011) along the first direction.

15. The power conversion device of any one of claims 1-11, wherein, The power conversion device (100) further comprises at least one of a first device (5) and a second device (6); The second cavity (202) has an air inlet (2021) and an air outlet (2022), both of which are communicated with the external environment of the box body (2); The first device (5) is installed in the second cavity (202); along the air flow direction in the second cavity (202), the first device (5) is located between the first heat sink (101) and the air outlet (2022); The second device (6) is installed in the second cavity (202); along the air flow direction in the second cavity (202), the second device (6) is located between the second heat sink (102) and the air outlet (2022).

16. The power conversion device of any one of claims 1-11, wherein, The second cavity (202) has an air inlet (2021) and an air outlet (2022), both of which are communicated with the external environment of the box body (2); The air inlet (2021) is arranged on one side of the second cavity (202) away from the first cavity (201) along a first direction, or the air inlet (2021) is arranged on at least one side of the second cavity (202) along a third direction; the air outlets (2022) are distributed on both sides of the air inlet (2021) along a second direction, the first direction, the second direction and the third direction are perpendicular to each other; the first direction is the distribution direction of the first power device (302), the substrate (1011) and the first heat dissipation fin (1012); Alternatively, the air inlet (2021) is arranged on one side of the second cavity (202) along a second direction, and the air outlets (2022) are distributed on one side of the second cavity (202) away from the air inlet (2021) along the second direction, and / or the air outlets (2022) are distributed on one side of the second cavity (202) away from the first cavity (201) along a first direction, and / or the air outlets (2022) are distributed on at least one side of the second cavity (202) along a third direction, the first direction, the second direction and the third direction are perpendicular to each other; the first direction is the distribution direction of the first power device (302), the substrate (1011) and the first heat dissipation fin (1012).

17. The power conversion device of any one of claims 1-11, wherein, The power conversion device (100) further comprises at least one of a first fan (4) and a second fan (7), the first fan (4) is installed in the second cavity (202), and the second fan (7) is installed in the first cavity (201).

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