Preparation method of dodging structure of flexible wearable phototherapy instrument

Abstract

The invention relates to the technical field of phototherapy instruments, in particular to a preparation method of a dodging structure of a flexible wearable phototherapy instrument, which comprises the following steps: in the technical scheme provided by the invention, ultrasonically cleaning a flexible FPC (Flexible Printed Circuit) conductive substrate for 10 minutes by adopting an isopropanol solution, and manufacturing a conductive circuit through a laser etching process, a honeycomb-shaped hollow-out light-transmitting film support with the thickness being 0.5 mm is prepared through 3D printing, a reflection device is embedded into a packaged LED chip circuit to be fixed, a flexible polycarbonate Fresnel diffraction film is adopted, a light protection film is prepared through solution casting, a microstructure is formed through nanoimprint, a dodging protection film is attached to the diffraction film through optical cement to form a five-layer structure, and the light-emitting device is manufactured. And obtaining a flexible wearable phototherapy instrument finished product. The problems that when the dodging structure of the flexible wearable phototherapy instrument is prepared, the distance between welding points of a conductive circuit is difficult to accurately control, the light emitting uniformity of light emitted by the LED chip is poor after the light is emitted through the light-transmitting film, and the illumination consistency of a treatment receptor is difficult to guarantee, so that the phototherapy effect is affected are solved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of phototherapy instruments, and particularly relates to a preparation method of a flexible wearable phototherapy instrument light uniformization structure. BACKGROUND

[0002] At present, in the technical field of phototherapy instruments, most of the light sources in the prior art are constructed by arranging LED lamp bead chips according to a certain size ratio. Although this arrangement can achieve the basic light emitting function, it has obvious defects. Since the lamp bead chips are arranged independently, the light emitting points of each lamp bead chip can be clearly seen by the naked eye, resulting in poor light emitting uniformity of the light source. In phototherapy applications, uneven light distribution may not be able to provide stable and consistent light intensity for the treatment site, thereby affecting the treatment effect, and even may cause adverse stimulation or damage to the skin due to local light being too strong or too weak. At the same time, the prior art has limited means for light uniformization processing of the light source of the phototherapy instrument treatment head. On the one hand, there is a lack of effective structure to uniformly diffuse and adjust the light emitted by the LED lamp bead chip, making it difficult to eliminate the unevenness caused by the light emitting points; on the other hand, in the preparation process, the manufacturing and assembly precision of the light source related components is not enough, and it is difficult to ensure the precise cooperation between the components to achieve good light uniformization effect. In addition, the existing phototherapy instrument treatment head also has deficiencies in flexibility and wearability. Most treatment head structures are relatively rigid, which is difficult to adapt to the bending and movement of different parts of the human body, and will bring inconvenience to the user during wearing, reducing the comfort and compliance of use. Moreover, in terms of meeting medical standards, the prior art is not perfect enough in testing and optimizing key indicators such as bending cycle performance and light intensity distribution of the phototherapy instrument treatment head, making it difficult to ensure the safety and effectiveness of the product in actual use, and limiting the wide application and development of phototherapy instruments.

[0003] In the preparation of the flexible wearable phototherapy instrument light uniformization structure of the prior art, the spacing of the conductive circuit welding points is not accurately controlled, and the light emitting uniformity of the light emitted by the LED chip through the light transmission film is poor, resulting in uneven light distribution on the treatment surface, making it difficult to ensure the consistency of the light received by the treatment recipient, and affecting the phototherapy effect. SUMMARY

[0004] In view of the above status, the application provides a preparation method of a flexible wearable phototherapy instrument light uniformization structure, which can solve the problems of difficult accurate control of the spacing of the conductive circuit welding points in the preparation of the flexible wearable phototherapy instrument light uniformization structure, poor light emitting uniformity of the light emitted by the LED chip through the light transmission film, uneven light distribution on the treatment surface, difficult guarantee of the consistency of the light received by the treatment recipient, and influence on the phototherapy effect. To achieve the above purpose, the application adopts the following technical solutions: The preparation method of the uniform light structure of the flexible wearable phototherapy instrument comprises the following steps: ultrasonic cleaning of the flexible FPC conductive substrate with isopropyl alcohol solution for 10 minutes, drying with nitrogen, making conductive circuit by laser etching process, controlling the spacing of welding points, using plasma cleaning treatment, and obtaining the FPC conductive substrate; using flip-chip technology to precisely adhere the micro-LED lamp bead chip to the predetermined point of the FPC conductive substrate, aligning the electrodes, injecting transparent silicone and vacuum degassing, curing for 30 minutes at 80°C, obtaining the packaged LED chip circuit; using 3D printing to prepare a 0.5mm thick honeycomb-shaped hollow light transmission film support, spraying a high-reflectivity silver coating, ensuring uniform coating through the spin coating process, embedding the reflective device into the packaged LED chip circuit, obtaining the light transmission film support and LED reflective device; using a flexible polycarbonate Fresnel diffraction film, photoetching to customize the ring spacing, adhering to the light transmission film support through the hot pressing process, ensuring alignment, verifying the uniformity of the outgoing light, obtaining the composite diffraction film structure; using PMMA as the base material, adding nano-silicon dioxide particles, preparing a light protection film through solution casting, using nano-imprinting to form microstructures, adjusting parameters to optimize optical performance, obtaining a uniform light protection film; adhering the uniform light protection film to the diffraction film into a five-layer structure using optical glue, adjusting to meet medical standards through bending cycle test and light intensity distribution test, obtaining the finished product of the flexible wearable phototherapy instrument.

[0005] Further, the ultrasonic cleaning of the flexible FPC conductive substrate with isopropyl alcohol solution for 10 minutes, drying with nitrogen, making conductive circuit by laser etching process, controlling the spacing of welding points, using plasma cleaning treatment, and obtaining the FPC conductive substrate comprises the following steps: immersing the flexible FPC conductive substrate in isopropyl alcohol solution, oscillating for 10 minutes at a frequency of 40kHz by ultrasonic cleaning equipment to remove oil stains and particles on the surface of the substrate, and drying with nitrogen; making conductive circuit on the flexible FPC conductive substrate by laser etching process, keeping the LED lamp bead chip welding points at 2 to 3mm, and reserving the fixing area of the reflective device; using a plasma cleaning equipment with a power of 50W to perform surface activation treatment on the welding area for 3 minutes, obtaining the FPC conductive substrate.

[0006] Further, the micro-LED lamp bead chip is precisely attached to the FPC conductive substrate at the predetermined point by using flip-chip technology, the electrodes are aligned, transparent silicone is injected and vacuum degassing is performed, and the packaged LED chip circuit is obtained by curing at 80°C for 30 minutes, including the following steps: using flip-chip equipment, precisely positioning and attaching the small-sized LED lamp bead chip to the predetermined point of the FPC conductive substrate according to the designed circuit layout; calibrating the chip electrode and the substrate circuit through a high-precision visual recognition module to ensure accurate alignment; injecting transparent silicone into the small gap between the chip and the substrate, and placing it in a vacuum degassing device; removing the bubbles in the silicone by vacuumizing, placing the packaging structure on a 80°C hot table, and curing by constant temperature heating for 30 minutes to make the silicone fully solidify, and obtaining the packaged LED chip circuit.

[0007] Further, the 0.5mm thick honeycomb-shaped hollow light-transmitting film support is prepared by 3D printing, high-reflectivity silver coating is sprayed, the coating is uniformly distributed by spin coating process to ensure uniformity, and the reflective device is embedded in the packaged LED chip circuit to obtain the light-transmitting film support and LED reflective device, including the following steps: using a high-precision 3D printing device, a honeycomb-shaped hollow light-transmitting film support with a thickness of 0.5mm is prepared using transparent PC plastic; uniformly spray high-reflectivity silver coating on the inner wall of the support through a spray gun to ensure complete coverage; place the sprayed support on a spin coating machine, control the rotation speed and time, and use spin coating process to make the coating further uniformly distributed; precisely embed the assembled reflective device in the reserved area of the FPC conductive substrate, and fix it using an adhesive to obtain the light-transmitting film support and LED reflective device.

[0008] Further, the flexible polycarbonate Fresnel diffraction film is used, the ring spacing is customized by photolithography, the light-transmitting film support is attached by hot pressing process to ensure alignment, and the uniformity of the outgoing light is verified to obtain a composite diffraction film structure, including the following steps: using a flexible polycarbonate Fresnel diffraction film, using photolithography technology to customize periodic ring spacing on the film; place the customized diffraction film in a hot pressing device, accurately control the hot pressing temperature, pressure and time parameters, and tightly attach it to the light-transmitting film support; ensure the alignment of the diffraction ring and the key parts on the light-transmitting film support through a high-precision positioning device; use an integrating sphere test system to verify the uniformity of the outgoing light, optimize the parameters, and obtain a composite diffraction film structure with uniform light field distribution.

[0009] Further, the light protection film is prepared by solution casting using PMMA as the base material and adding nano-silica particles, microstructure is formed by nano-imprinting, and parameters are adjusted to optimize the optical performance to obtain the light uniformity protection film, including the following steps: PMMA is used as the base material, nano-silica particles with uniform particle size are added in proportion, and the solution is fully stirred and mixed to form a solution; the solution is slowly poured into a flat mold by solution casting method, the casting speed and thickness are controlled, and the preliminary light protection film is obtained by drying and curing; a sinusoidal wave structure template is selected by nano-imprinting technology, and microstructure is imprinted on the film surface; by repeatedly adjusting the imprinting temperature, pressure and time parameters, the optical performance of the preliminary light protection film in the visible light band is tested and optimized, and the light uniformity protection film with excellent optical performance is obtained.

[0010] Further, the light protection film is prepared by solution casting using PMMA as the base material and adding nano-silica particles, microstructure is formed by nano-imprinting, and parameters are adjusted to optimize the optical performance to obtain the light uniformity protection film, including the following steps: PMMA is used as the base material, nano-silica particles with uniform particle size are added in proportion, and the solution is fully stirred and mixed to form a solution; the solution is slowly poured into a flat mold by solution casting method, the casting speed and thickness are controlled, and the preliminary light protection film is obtained by drying and curing; a sinusoidal wave structure template is selected by nano-imprinting technology, and microstructure is imprinted on the film surface; by repeatedly adjusting the imprinting temperature, pressure and time parameters, the optical performance of the preliminary light protection film in the visible light band is tested and optimized, and the light uniformity protection film with excellent optical performance is obtained.

[0011] Further, the light protection film is prepared by solution casting using PMMA as the base material and adding nano-silica particles, microstructure is formed by nano-imprinting, and parameters are adjusted to optimize the optical performance to obtain the light uniformity protection film, including the following steps: PMMA is used as the base material, nano-silica particles with uniform particle size are added in proportion, and the solution is fully stirred and mixed to form a solution; the solution is slowly poured into a flat mold by solution casting method, the casting speed and thickness are controlled, and the preliminary light protection film is obtained by drying and curing; a sinusoidal wave structure template is selected by nano-imprinting technology, and microstructure is imprinted on the film surface; by repeatedly adjusting the imprinting temperature, pressure and time parameters, the optical performance of the preliminary light protection film in the visible light band is tested and optimized, and the light uniformity protection film with excellent optical performance is obtained.

[0012] Further, the high-precision 3D printing equipment is used to prepare a honeycomb-shaped hollow structure light transmission film support with a thickness of 0.5 mm from transparent PC plastic, including the following steps: a 3D printing equipment with a resolution of 20 microns is used, and a transparent PC plastic wire with stable melting deposition rate is selected; a designed honeycomb-shaped hollow structure three-dimensional model is imported into a printing software, and the printing layer thickness is set to 0.05 mm, the filling density is set to 30%, and the printing speed is set to 40 mm / s; the nozzle temperature is controlled to 260 DEG C to make the PC plastic fully melt; the wire is accumulated layer by layer according to the set path, the ambient temperature in the printing process is set to 25 DEG C, and the printing is completed to obtain the honeycomb-shaped hollow structure light transmission film support with a thickness of 0.5 mm.

[0013] In the technical scheme provided by the application, the flexible FPC conductive substrate is ultrasonically cleaned with isopropanol solution for 10 minutes, dried with nitrogen, and the conductive circuit is made by laser etching process, the welding point spacing is controlled, and the FPC conductive substrate is obtained by plasma cleaning treatment; the micro-LED lamp bead chip is precisely attached to the predetermined point of the FPC conductive substrate by flip-chip technology, the electrodes are aligned, the transparent silicone is injected and vacuum defoaming, and the packaged LED chip circuit is obtained by curing at 80 DEG C for 30 minutes; a 0.5 mm thick honeycomb-shaped hollow light transmission film support is prepared by 3D printing, a high-reflective silver coating is sprayed, the coating is uniformly ensured by spin coating process, the reflective device is embedded into the packaged LED chip circuit to fix, and the light transmission film support and LED reflective device are obtained; the flexible polycarbonate Fresnel diffraction film is used, the ring spacing is customized by photolithography, the light transmission film support is attached by hot pressing process to ensure alignment, the uniformity of the outgoing light is verified, and the composite diffraction film structure is obtained; the PMMA is used as a base material, the nano-silicon dioxide particles are added, the light protection film is prepared by solution casting, the nano-imprinting is used to form a microstructure, the optical performance is optimized by adjusting parameters, and the light uniformity protection film is obtained; the light uniformity protection film is attached to the diffraction film to form a five-layer structure by using optical glue, the bending cycle test and light intensity distribution test are carried out, the medical standard is met by adjustment, and the flexible wearable phototherapy instrument product is obtained. The application solves the problems that the welding point spacing of the conductive circuit is difficult to accurately control during the preparation of the light uniformity structure of the flexible wearable phototherapy instrument, the outgoing light emitted by the LED chip is not uniform through the light transmission film, the light distribution on the treatment surface is uneven, the light consistency of the treatment receptor is difficult to guarantee, and the phototherapy effect is affected. BRIEF DESCRIPTION OF DRAWINGS

[0014] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are included only to illustrate preferred embodiments and are not to be considered as limiting of the application.

[0015] Figure 1 It is a first embodiment schematic diagram of a preparation method of a light uniformity structure of a flexible wearable phototherapy instrument in the embodiments of the application.

[0016] Figure 2 A second embodiment diagram of a preparation method of a light uniform structure of a flexible wearable phototherapy instrument in an embodiment of the present application.

[0017] Figure 3 A third embodiment diagram of a preparation method of a light uniform structure of a flexible wearable phototherapy instrument in an embodiment of the present application.

[0018] Figure 4 A light uniform structure diagram of a preparation method of a light uniform structure of a flexible wearable phototherapy instrument in an embodiment of the present application.

[0019] Figure 5 A flexible Fresnel reflection film diagram of a preparation method of a light uniform structure of a flexible wearable phototherapy instrument in an embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0021] Those skilled in the art can understand that, unless specifically stated otherwise, the singular forms "a", "an" and "the" used herein also include the plural forms. It should be further understood that the use of the term "comprising" in the specification of the present application means that the features, integers, steps, operations, elements and / or components described exist, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0022] A preparation method of a light uniform structure of a flexible wearable phototherapy instrument, such as Figure 1The process includes the following steps: The flexible FPC conductive substrate is ultrasonically cleaned with isopropanol solution for 10 minutes, dried with nitrogen, conductive lines are fabricated using laser etching, the spacing of the solder points is controlled, and plasma cleaning is performed to obtain the FPC conductive substrate. Micro LED chips are precisely bonded to predetermined points on the FPC conductive substrate using flip-chip bonding technology, electrodes are aligned, transparent silicone is injected and vacuum degassed, and the substrate is cured at 80℃ for 30 minutes to obtain the encapsulated LED chip circuit. A 0.5mm thick honeycomb-shaped perforated light-transmitting film support is fabricated using 3D printing, a high-reflectivity silver coating is sprayed on, and a spin coating process is used to ensure uniform coating. The reflective device is then embedded. The encapsulated LED chip circuit is fixed to obtain a light-transmitting film support and an LED reflector. A flexible polycarbonate Fresnel diffraction film is used, with photolithography to customize the ring spacing. It is then bonded to the light-transmitting film support through a hot-pressing process to ensure alignment and verify the uniformity of emitted light, resulting in a composite diffraction film structure. A photoprotective film is prepared by solution casting using PMMA as the substrate and adding nano-silica particles. A microstructure is formed by nanoimprinting, and parameters are adjusted to optimize optical performance, resulting in a uniform light protective film. The uniform light protective film is then bonded to the diffraction film with optical adhesive to form a five-layer structure. Through bending cycle testing and light intensity distribution testing, it is adjusted to meet medical standards, resulting in a finished flexible wearable phototherapy device.

[0023] like Figure 2 As shown, in this embodiment, the flexible FPC conductive substrate is immersed in an isopropanol solution, and then ultrasonically cleaned at a frequency of 40kHz for 10 minutes to remove oil and particles from the substrate surface. It is then dried with nitrogen. Conductive lines are fabricated on the flexible FPC conductive substrate using laser etching, ensuring that the LED chip solder joints are maintained at 2 to 3 millimeters, and reserving a fixing area for the reflector. The soldering area is then surface-activated for 3 minutes using a 50W plasma cleaning device to obtain the FPC conductive substrate.

[0024] Immersing the flexible FPC conductive substrate in isopropanol solution followed by ultrasonic cleaning effectively removes surface oil and particles, ensuring substrate cleanliness and laying a solid foundation for subsequent processes. Laser etching is used to fabricate conductive circuits, precisely controlling the spacing between LED chip solder joints to 2-3 millimeters, and reserving areas for reflective device fixing to ensure a rational circuit layout and facilitate device installation. Plasma cleaning equipment then performs surface activation treatment on the soldered areas, enhancing the adhesion of subsequent chip bonding, significantly improving the performance and reliability of the FPC conductive substrate, and ensuring the stable operation of the phototherapy device.

[0025] like Figure 3As shown, in this embodiment, flip-chip welding equipment is used to accurately position and attach the tiny LED lamp bead chip to the predetermined point on the FPC conductive substrate according to the designed circuit layout; through the high-precision visual recognition module, the chip electrode and the substrate circuit are calibrated to ensure accurate alignment; transparent silicone is injected into the tiny gap between the chip and the substrate, and placed in a vacuum degassing device; by vacuuming to remove bubbles in the silicone, the packaged structure is placed on a 80°C hot table and heated at a constant temperature for 30 minutes to fully solidify the silicone, obtaining the packaged LED chip circuit.

[0026] The flip-chip welding equipment accurately positions and attaches the tiny LED lamp bead chip, ensuring the accuracy of chip installation and providing a foundation for stable circuit operation. The high-precision visual recognition module calibrates the electrode and substrate circuit to achieve accurate alignment, greatly reducing the risk of poor contact and improving signal transmission quality. Injecting transparent silicone and vacuum degassing effectively fills the gap and removes bubbles, avoiding the impact of bubbles on optical performance and circuit stability. Finally, 80°C constant temperature heating and curing for 30 minutes allows the silicone to fully solidify, forming a reliable package to protect the chip and ensure the stability of the LED chip circuit.

[0027] In this embodiment, a high-precision 3D printing device is used to prepare a honeycomb-shaped hollow structure light transmission film support with a thickness of 0.5mm using transparent PC plastic; a high-reflectivity silver coating is uniformly sprayed on the inner wall of the support to ensure complete coverage; the sprayed support is placed on a spin coater, and the coating is further uniformly distributed by controlling the rotation speed and time; the assembled reflective device is accurately embedded in the reserved area of the FPC conductive substrate, and fixed using an adhesive to obtain the light transmission film support and LED reflective device.

[0028] Using a high-precision 3D printing device, a specific thickness honeycomb-shaped hollow structure light transmission film support is prepared using transparent PC plastic, which not only ensures the structural strength but also meets the light transmission requirements. Uniformly spraying a high-reflectivity silver coating and optimizing the distribution with a spin coating process greatly improves the reflection effect and enhances the utilization of light. Precisely embedding the reflective device in the reserved area of the FPC conductive substrate and fixing it realizes the integration of the structure, making the internal layout of the phototherapy instrument more compact and reasonable.

[0029] In this embodiment, a flexible polycarbonate material Fresnel diffraction film is used, and a periodic ring spacing is customized on the film using photolithography technology; the customized diffraction film is placed in a hot pressing device, and by accurately controlling the hot pressing temperature, pressure and time parameters, it is tightly attached to the light transmission film support; the high-precision positioning device ensures that the diffraction ring and the key parts on the light transmission film support are aligned; the integrating sphere test system verifies the uniformity of the outgoing light, optimizes the parameters, and obtains a composite diffraction film structure with uniform light field distribution.

[0030] The flexible polycarbonate material Fresnel diffraction film is selected, the periodic ring spacing is customized by using the photolithography technology, the light propagation path can be accurately controlled. The heat pressing equipment is used and the parameters are accurately controlled, so that the Fresnel diffraction film is tightly attached to the light transmission film support, and the structural stability is ensured. The high-precision positioning device ensures the accurate alignment of the diffraction ring, and avoids the light deviation. The integral sphere test system verifies the uniformity of the outgoing light and optimizes the parameters, which can effectively improve the light field distribution. The finally obtained composite diffraction film structure can significantly improve the uniformity of the outgoing light of the phototherapy instrument, make the light of the treatment area more balanced, and enhance the phototherapy effect.

[0031] In this embodiment, PMMA is used as a substrate, nano-silica particles with uniform particle size are added in proportion, stirred thoroughly to form a solution; the solution casting method is used, the solution is slowly poured into a flat mold, the casting speed and thickness are controlled, and a preliminary light protection film is obtained through drying and curing; a nano-imprint technology is used, a sine wave structure template is selected, and a microstructure is imprinted on the film surface; by repeatedly adjusting the imprinting temperature, pressure and time parameters, the optical properties of the preliminary light protection film in the visible light band, such as transmittance and haze, are tested and optimized, and a light protection film with excellent optical properties is obtained.

[0032] PMMA is used as a substrate and nano-silica particles are added to form a solution, which lays a good foundation for the light protection film. The solution casting method controls the casting conditions, and a preliminary light protection film with uniform thickness can be obtained. The nano-imprint technology uses a specific template to imprint a microstructure, which can effectively control light. By repeatedly adjusting the imprinting parameters and testing and optimization, the light protection film in the visible light band can be accurately improved in terms of transmittance, haze reduction and optical performance. The finally obtained light protection film can optimize the light emitted by the phototherapy instrument, making the outgoing light more uniform and soft, and reducing the irritation to the skin.

[0033] In this embodiment, an optical glue with matched refractive index is used to attach the light protection film and the diffraction film through a coating process; a vacuum laminating machine is used to attach the FPC conductive substrate, the LED chip circuit, the light transmission film support, the LED reflection device, the composite diffraction film structure and the light protection film, to obtain a five-layer structure; through bending cycle test, the curvature radius is set and 1000 bending operations are completed, to check whether there is peeling or cracking between the layers; a standard skin model is used to carry out light intensity distribution test, according to the test data, the structure parameters are adjusted, and after optimization, the indicators meet the medical standards, to obtain a flexible wearable phototherapy instrument product.

[0034] In this embodiment, high-precision laser etching equipment is used to accurately position the flexible FPC conductive substrate according to the circuit paper; by setting the power, frequency and scanning speed parameters of the laser, a conductive circuit is etched on the surface of the substrate; during the etching process, the visual detection module is used for real-time monitoring, so that the LED lamp bead chip welding point is kept at 2 to 3 millimeters; a reflection device fixing area is reserved at a specific position of the substrate, and special marking is performed.

[0035] The high-precision laser etching equipment accurately positions the flexible FPC conductive substrate according to the circuit paper, ensuring the accuracy of the etching position and laying a foundation for subsequent circuit connection. Reasonably setting the laser parameters can etch clear and accurate conductive circuits on the surface of the substrate, ensuring stable current transmission. During etching, the visual detection module is used for real-time monitoring, and the spacing between the LED lamp bead chip welding points is strictly controlled at 2 to 3 millimeters, improving the welding quality and circuit reliability. The reflection device fixing area is reserved and specially marked, which facilitates subsequent assembly and makes the internal structure layout of the phototherapy instrument more reasonable.

[0036] In this embodiment, a 3D printing equipment with a resolution of 20 microns is used, and a transparent PC plastic wire with stable melting deposition rate is selected; the designed honeycomb-shaped hollow structure three-dimensional model is imported into the printing software, and the printing layer thickness is set to 0.05mm, the filling density is set to 30%, and the printing speed is set to 40mm / s; the nozzle temperature is controlled to 260℃, so that the PC plastic is fully melted; the wire is stacked layer by layer according to the set path, and the ambient temperature during printing is set to 25℃, and after waiting for printing to complete, a honeycomb-shaped hollow structure light transmission film support with a thickness of 0.5mm is obtained.

[0037] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and are not intended to limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A method for preparing a light uniformity structure of a flexible wearable phototherapy device, characterized in that, The preparation method of the uniform light structure of the flexible wearable phototherapy instrument comprises the following steps: The flexible FPC conductive substrate is ultrasonically cleaned with isopropanol solution for 10 minutes, dried with nitrogen, conductive circuits are made by laser etching process, the spacing of welding points is controlled, and the FPC conductive substrate is obtained by plasma cleaning treatment; Mini LED lamp bead chips are precisely attached to the predetermined point of the FPC conductive substrate by flip-chip welding technology, the electrodes are aligned, transparent silicone is injected and vacuum degassing is performed, and the packaged LED chip circuit is obtained by curing at 80 DEG C for 30 minutes; A 0.5mm thick honeycomb-shaped hollow light transmission film support is prepared by 3D printing, a high-reflectivity silver coating is sprayed, the coating is ensured to be uniform by spin coating process, the reflection device is embedded and fixed in the packaged LED chip circuit, and the light transmission film support and LED reflection device are obtained; A flexible polycarbonate Fresnel diffraction film is used, the ring spacing is customized by photolithography, the light transmission film support is attached by hot pressing process, alignment is ensured, and the uniformity of outgoing light is verified, and the composite diffraction film structure is obtained; PMMA is used as a base material, nano-silicon dioxide particles are added, a light protection film is prepared by solution casting, a microstructure is formed by nano-imprinting, the optical performance is optimized by adjusting parameters, and the uniform light protection film is obtained; The uniform light protection film is attached to the diffraction film to form a five-layer structure by using optical glue, the product is obtained by adjusting the bending cycle test and light intensity distribution test to meet the medical standards.

2. The preparation method of the uniform light structure of the flexible wearable phototherapy instrument according to claim 1, characterized in that, The FPC conductive substrate is ultrasonically cleaned with isopropanol solution for 10 minutes, dried with nitrogen, conductive circuits are made by laser etching process, the spacing of welding points is controlled, and the FPC conductive substrate is obtained by plasma cleaning treatment, comprising the following steps: The flexible FPC conductive substrate is immersed in isopropanol solution, and the surface of the substrate is cleaned by ultrasonic cleaning equipment at a frequency of 40 kHz for 10 minutes to remove oil stains and particles, and the substrate is dried with nitrogen; Conductive circuits are made on the flexible FPC conductive substrate by laser etching process, the welding points of the LED lamp bead chips are kept at 2 to 3 mm, and a fixed area for the reflection device is reserved; The welding area is treated by a 50W plasma cleaning device for 3 minutes to activate the surface, and the FPC conductive substrate is obtained.

3. The preparation method of the uniform light structure of the flexible wearable phototherapy instrument according to claim 1, characterized in that, The FPC conductive substrate is ultrasonically cleaned with isopropanol solution for 10 minutes, dried with nitrogen, conductive circuits are made by laser etching process, the spacing of welding points is controlled, and the FPC conductive substrate is obtained by plasma cleaning treatment, comprising the following steps: The FPC conductive substrate is ultrasonically cleaned with isopropanol solution for 10 minutes, dried with nitrogen, conductive circuits are made by laser etching process, the spacing of welding points is controlled, and the FPC conductive substrate is obtained by plasma cleaning treatment, comprising the following steps: The FPC conductive substrate is ultrasonically cleaned with isopropanol solution for 10 minutes, dried with nitrogen, conductive circuits are made by laser etching process, the spacing of welding points is controlled, and the FPC conductive substrate is obtained by plasma cleaning treatment, comprising the following steps: The FPC conductive substrate is ultrasonically cleaned with isopropanol solution for 10 minutes, dried with nitrogen, conductive circuits are made by laser etching process, the spacing of welding points is controlled, and the FPC conductive substrate is obtained by plasma cleaning treatment, comprising the following steps: ​ 4. The preparation method of the uniform light structure of the flexible wearable phototherapy instrument according to claim 1, characterized in that, The 0.5mm thick honeycomb hollow light transmission film support is prepared by 3D printing, a high-reflectivity silver coating is sprayed, the coating is uniformly distributed by spin coating process, the reflective device is embedded and fixed in the packaged LED chip circuit, and a light transmission film support and LED reflective device are obtained, including the following steps: A honeycomb hollow structure light transmission film support with a thickness of 0.5mm is prepared by using a high-precision 3D printing equipment and transparent PC plastic; A high-reflectivity silver coating is uniformly sprayed on the inner wall of the support by a spray gun to ensure comprehensive coverage; The sprayed support is placed on a spin coating machine, the rotation speed and time are controlled, and the spin coating process is used to further uniformly distribute the coating; The assembled reflective device is precisely embedded in the reserved area of the FPC conductive substrate, and is fixed by using an adhesive to obtain a light transmission film support and LED reflective device.

5. The preparation method of the uniform light structure of the flexible wearable phototherapy instrument according to claim 1, characterized in that, The flexible polycarbonate Fresnel diffraction film is used, the ring spacing is customized by photolithography, the film is attached to the light transmission film support by hot pressing process to ensure alignment, and the uniformity of the outgoing light is verified to obtain a composite diffraction film structure, including the following steps: A flexible polycarbonate Fresnel diffraction film is used, and periodic ring spacing is customized on the film using photolithography technology; The customized diffraction film is placed in a hot pressing equipment, and the hot pressing temperature, pressure and time parameters are accurately controlled to tightly attach the diffraction film to the light transmission film support; A high-precision positioning device is used to ensure that the diffraction ring and the key parts on the light transmission film support are aligned; An integrating sphere test system is used to verify the uniformity of the outgoing light, and the parameters are optimized to obtain a composite diffraction film structure with uniform light field distribution.

6. The preparation method of the uniform light structure of the flexible wearable phototherapy instrument according to claim 1, characterized in that, The PMMA is used as a base material, nano-silicon dioxide particles are added, a light protection film is prepared by solution casting, a nano-imprint is used to form a microstructure, and the parameters are adjusted to optimize the optical performance to obtain a light uniformity protection film, including the following steps: PMMA is used as a base material, nano-silicon dioxide particles with uniform particle size are added in proportion, and the solution is fully stirred to be uniform; A solution casting method is used, the solution is slowly poured into a flat mold, the casting speed and thickness are controlled, and a preliminary light protection film is obtained by drying and curing; A nano-imprint technology is used, a sinusoidal corrugated structure template is selected, and a microstructure is imprinted on the film surface; The imprinted temperature, pressure and time parameters are repeatedly adjusted, the optical performance of the preliminary light protection film in the visible light band is tested and optimized, and a light uniformity protection film with excellent optical performance is obtained.

7. The preparation method of the uniform light structure of the flexible wearable phototherapy instrument according to claim 1, characterized in that, The light uniformity protection film is attached to the diffraction film to form a five-layer structure by using optical glue, the bending cycle test and light intensity distribution test are performed, and the flexible wearable phototherapy instrument product is obtained by adjusting to meet the medical standards, including the following steps: Optical glue with matching refractive index is used to attach the light uniformity protection film to the diffraction film by coating process; An FPC conductive substrate, LED chip circuit, light transmission film support and LED reflective device, composite diffraction film structure, and light uniformity protection film are attached by a vacuum attaching machine to obtain a five-layer structure; A bending cycle test is performed, a curvature radius is set, and 1000 bending operations are completed, and it is checked whether there is peeling or cracking between the layers. The flexible wearable phototherapy instrument product is obtained by adopting a standard skin model to carry out light intensity distribution test, adjusting structure parameters according to test data, and optimizing until each index meets medical standards.

8. The preparation method of the uniform light structure of the flexible wearable phototherapy instrument according to claim 2, characterized in that, The laser etching process is used to manufacture the conductive circuit on the flexible FPC conductive substrate, so that the LED lamp bead chip welding point is kept at 2-3 mm, and the fixing area of the reflecting device is reserved, including the following steps: The high-precision laser etching equipment is used to accurately position the flexible FPC conductive substrate according to the circuit diagram paper; The power, frequency and scanning speed parameters of the laser are set to etch the conductive circuit on the substrate surface; During the etching process, the visual detection module is used for real-time monitoring, so that the LED lamp bead chip welding point is kept at 2-3 mm; The fixing area of the reflecting device is reserved at a specific position of the substrate, and special marks are made.

9. The preparation method of the uniform light structure of the flexible wearable phototherapy instrument according to claim 4, characterized in that, The high-precision 3D printing equipment is used to prepare the honeycomb-shaped hollow structure light transmission film support with a thickness of 0.5 mm by using transparent PC plastic, including the following steps: The 3D printing equipment with a resolution of 20 microns is used to select a transparent PC plastic wire with stable melting deposition rate; The designed honeycomb-shaped hollow structure three-dimensional model is imported into the printing software, and the printing layer thickness is set to 0.05 mm, the filling density is set to 30%, and the printing speed is set to 40 mm / s; The nozzle temperature is controlled to 260℃ to make the PC plastic fully melt; The wire is stacked layer by layer according to the set path, the environmental temperature during the printing process is set to 25℃, and after the printing is completed, the honeycomb-shaped hollow structure light transmission film support with a thickness of 0.5 mm is obtained.

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