Camera module and electronic device including the same

Abstract

According to an embodiment of the present disclosure, a camera module may be provided. The camera module may include: a camera housing; a lens assembly including at least one lens and a lens barrel; a reflecting and refracting member supported by the camera housing and changing an optical path through the lens assembly at least twice; an image sensor; a carrier assembly having a shape at least partially surrounding the reflective and refractive members; a driving member that moves the carrier assembly in a first direction and in a direction intersecting the first direction, or rotates the carrier assembly about the first direction; and a damper formed on at least one of a surface of the carrier assembly facing the reflective and refractive member or a surface of the reflective and refractive member facing the carrier assembly.

Description

Technical Field

[0001] Various embodiments of this disclosure relate to a camera module and an electronic device including the camera module. Background Technology

[0002] With advancements in digital camera manufacturing technology, electronic devices equipped with small, lightweight camera modules have become commercially available. Since camera modules are now included in electronic devices people carry with them (e.g., mobile communication terminals), users can easily utilize various functions such as taking photos and videos, making video calls, or using augmented reality. Typically, camera modules are configured to include a lens assembly and an image sensor.

[0003] The camera module can perform image stabilization functions to correct for external interference. When a user takes a photo or records video, external interference can be artifacts, such as image blur caused by slight hand tremors. Image stabilization functions (such as image stabilization (or hand tremor) correction functions) can compensate for limited movement of the electronics due to being held by a fixture or by the user by moving the lens assembly or image sensor included in the camera module in a plane perpendicular to the optical axis, thereby preventing or mitigating shake in the captured image or video. For this purpose, the camera module may include at least one coil and a magnet. When current is applied to the coil, the coil generates an electromagnetic force through electromagnetic interaction with the magnet, and the camera module can then use the generated electromagnetic force to perform image stabilization correction functions. Various methods can be applied to utilize electromagnetic forces to correct shake, such as lens shift for moving the lens assembly, image sensor shift for moving the image sensor, prism shift for moving the prism, and module tilt for tilting the camera module.

[0004] The above information is presented as background technology only to aid in understanding this disclosure. No determination or assertion is made regarding whether any of the above content can be used as prior art with respect to this disclosure. Summary of the Invention

[0005] Technical solution According to embodiments of this disclosure, a camera module may be provided. The camera module may include: a camera housing; a lens assembly including at least one lens and a lens barrel; a reflecting and refractive member supported by the camera housing and configured to alter the optical path passing through the lens assembly at least twice; an image sensor; a carrier assembly having a shape at least partially surrounding the reflecting and refractive member; a drive member configured to move the carrier assembly along a first direction or along a direction perpendicular to the first direction, or configured to rotate the carrier assembly about the first direction; and a shock absorber formed on at least one of the portion of the carrier assembly facing the reflecting and refractive member or the portion of the reflecting and refractive member facing the carrier assembly.

[0006] According to embodiments of this disclosure, a camera module may be provided. The camera module may include: a camera housing; a lens assembly including at least one lens and a lens barrel; a reflecting and refractive member supported by the camera housing and configured to alter the light path passing through the lens assembly at least twice; an image sensor including an imaging plane facing a first direction and converting light incident on the imaging plane into an electrical signal; a carrier assembly having a shape at least partially surrounding the reflecting and refractive member, and including a first carrier and a second carrier, the first carrier being configured to move horizontally in at least two intersecting directions in a plane perpendicular to the first direction, and the second carrier being configured to move vertically along the first direction; and a drive member including a magnet disposed on the carrier assembly and a coil disposed at a position corresponding to the magnet, and providing a driving force for the horizontal movement of the first carrier and the vertical movement of the second carrier. A shock absorber may be formed on at least one of the portion of the carrier assembly facing the reflecting and refractive member or the portion of the reflecting and refractive member facing the carrier assembly. Attached Figure Description

[0007] The above or other aspects, constructions and / or advantages of the various embodiments of this disclosure will be more readily understood through the following detailed description with reference to the accompanying drawings.

[0008] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0009] Figure 2 This is a front perspective view showing an electronic device according to an embodiment.

[0010] Figure 3 This is a rear perspective view showing an electronic device according to an embodiment.

[0011] Figure 4 This is a perspective view showing a camera module according to an embodiment.

[0012] Figure 5 This is a perspective view showing the interior of the camera module according to an embodiment being partially transparent.

[0013] Figure 6a This is a cross-sectional view showing the interior of a camera module including reflective and refractive components according to an embodiment.

[0014] Figure 6b This is a diagram showing the optical axis passing through the reflective and refractive components according to an embodiment.

[0015] Figure 6c This is a diagram showing the optical axis passing through the reflective and refractive components according to an embodiment.

[0016] Figure 6d This is a diagram showing the optical axis passing through the reflective and refractive components according to an embodiment.

[0017] Figure 6e This is a diagram showing the optical axis passing through the reflective and refractive components according to an embodiment.

[0018] Figure 7 This is a perspective view showing the positional relationships between components in a camera module including reflective and refractive elements according to an embodiment.

[0019] Figure 8 This is an exploded perspective view showing a camera module disposed inside a second carrier (e.g., AF carrier) according to an embodiment.

[0020] Figure 9 This is a perspective view showing a camera module disposed inside a second carrier (e.g., an AF carrier) according to an embodiment.

[0021] Figure 10 This is a cross-sectional view showing a camera module, according to an embodiment, in which a first carrier (e.g., an OIS carrier) is disposed inside a second carrier (e.g., an AF carrier).

[0022] Figure 11 This is a perspective view of a carrier assembly according to an embodiment, wherein the second carrier (e.g., AF carrier) is omitted.

[0023] Figure 12 This is an exploded perspective view showing a carrier assembly including a shock absorber according to an embodiment.

[0024] Figure 13 This is a perspective view showing a carrier assembly including a shock absorber according to an embodiment.

[0025] Figure 14This is a cross-sectional view showing a camera module, according to an embodiment, in which a first carrier (e.g., an OIS carrier) is disposed inside a second carrier (e.g., an AF carrier).

[0026] Figure 15 This is a perspective view showing a carrier assembly including a shock absorber according to an embodiment.

[0027] Figure 16 This is an exploded perspective view showing a camera module disposed inside a first carrier (e.g., an OIS carrier) according to an embodiment.

[0028] Figure 17 This is a cross-sectional view showing a camera module, according to an embodiment, in which a second carrier (e.g., an AF carrier) is disposed inside a first carrier (e.g., an OIS carrier).

[0029] Figure 18 This is a perspective view showing a carrier assembly according to an embodiment.

[0030] Figure 19 This is a perspective view showing a carrier assembly including a shock absorber according to an embodiment.

[0031] Figure 20 This is a perspective view showing a reflective and / or refractive component including a shock absorber according to an embodiment.

[0032] Figure 21 This is a perspective view showing a reflective and / or refractive component including a shock absorber according to an embodiment.

[0033] Throughout the accompanying drawings, similar reference numerals may be assigned to similar parts, components, and / or structures. Detailed Implementation

[0034] The camera module can move along three axes (e.g., the X, Y, and Z axes) by including components that reciprocate along two directions substantially perpendicular to the optical axis to perform optical image stabilization (OIS) and components that reciprocate along the optical axis to perform autofocus (AF). To achieve these movements, the camera module may include multiple carriers and drive members with guide balls utilizing, for example, ball bearings.

[0035] Because high-magnification camera modules (such as telephoto camera modules) have long back focal lengths (BFLs), the distance from the image sensor to the lens is also long. When such camera modules are installed in electronic devices, the thickness of the electronic devices can increase. Therefore, a folding camera has been developed to achieve a long focal length camera module within a limited space by using components such as prisms to bend the optical path at least once. In typical camera modules, the lens can protrude from the outside of the electronic device. When the drive components for performing AF or OIS functions use lens shifting to move the lens, the area surrounding the lens can also have a structure that protrudes from the outside of the electronic device. In contrast, using image sensor shifting, the drive components for performing AF or OIS functions do not protrude from the outside of the electronic device. This can be advantageous in terms of achieving a more streamlined design and improving space efficiency.

[0036] In foldable camera modules using image sensor shifting, one wall of the carrier assembly should remain open to accommodate reflective and refractive components. When viewed from above, the carrier assembly may thus have a roughly "U-shaped structure." Compared to an "U-shaped structure," this "U-shaped structure" is structurally more susceptible to deformation due to twisting. Furthermore, when subjected to external impacts such as drops or vibrations, the drive components may come into contact with the reflective and refractive components. This can potentially degrade the performance of the camera module.

[0037] This disclosure provides a camera module and an electronic device including the camera module that can prevent performance degradation caused by contact between the drive member and the reflective and refractive members even when external impacts such as drops or vibrations are applied to a foldable camera module using an image sensor shifting method.

[0038] The technical problems to be solved by this disclosure are not limited to those mentioned above. Other unmentioned technical problems will be clearly understood by those skilled in the art from the following description.

[0039] Figure 1 This is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0040] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160). Processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 in conjunction with processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or application processor (AP)) or a coprocessor 123 (e.g., a graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and a coprocessor 123, the coprocessor 123 may be adapted to consume less power than the main processor 121 or to be dedicated to a specific function. The coprocessor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0041] When the main processor 121 is inactive (e.g., in sleep) state, the coprocessor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the coprocessor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the coprocessor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the coprocessor 123. According to embodiments, the coprocessor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed by an electronic device 101 that performs artificial intelligence or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of these, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0042] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0043] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0044] Input module 150 can receive commands or data from outside electronic device 101 (e.g., a user) that will be used by other components of electronic device 101 (e.g., processor 120). Input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0045] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0047] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can acquire sound via the input module 150, or output sound via the sound output module 155 or via headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0048] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0049] Interface 177 may support one or more specific protocols used to enable electronic device 101 to be directly (e.g., wired) or wirelessly coupled to external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0050] Connection terminal 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0052] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0053] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0054] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0055] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify or verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0056] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0057] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiator formed of a conductor or conductive pattern formed on a base (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiator (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0058] According to an embodiment, antenna module 197 can form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board, an RFIC, and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on a first surface (e.g., the bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on a second surface (e.g., the top surface or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals in the specified high-frequency band.

[0059] At least some of the aforementioned components can be combined with each other and exchange signals (e.g., commands or data) between them via inter-peripheral communication schemes (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0060] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, 104, or 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0061] Figure 2 This is a front perspective view showing an electronic device according to an embodiment. Figure 3 This is a rear perspective view showing an electronic device according to an embodiment.

[0062] In the following detailed description, the length direction of electronic device 101 may be defined as the "Y-axis direction," the width direction may be defined as the "X-axis direction," and / or the height (or thickness) direction may be defined as the "Z-axis direction." The length direction, width direction, and / or height (or thickness) direction mentioned in the following detailed description may refer to the length direction, width direction, and / or height (or thickness) direction of the electronic device. In some embodiments, for the direction in which the component is oriented, in addition to the Cartesian coordinate system shown in the figures, "negative / positive (- / +)" may also be mentioned together. For example, refer to... Figure 2 The front surface of the electronic device 101 or housing 201 can be defined as a "surface facing the -Z-axis direction," and the rear surface can be defined as a "surface facing the +Z-axis direction." According to embodiments, the arrangement of components or another component in the height direction (i.e., the upper / lower standard) can follow the +Z-axis direction / -Z-axis direction. That is, a component being positioned on top of another component may mean that the component is positioned relative to the other component in the +Z-axis direction, and a component being positioned below another component may mean that the component is positioned relative to the other component in the -Z-axis direction. Furthermore, it should be noted that even if a component is positioned on or below another component, it does not mean that the entire component is completely positioned on or below the other component. For example, a portion of a component may be positioned on a portion of another component, and another portion of the component may be positioned below another portion of the other component. According to embodiments, when referring to "viewing the component from above," this may mean viewing the component from a position at a certain height along the -Z-axis direction. According to embodiments, the component "facing a specific direction" can be understood to include not only the component facing the same direction as the "specific direction," but also the component facing a direction parallel to the "specific direction." In the following description, it should be noted that when referring to the stacking (or overlapping) of one component with another, the description of the arrangement relationship in the height direction mentioned above applies. When describing directions, unless "negative / positive (- / +)" is stated, it can be interpreted as including both the + and - directions unless defined separately. For example, "Z-axis direction" can be interpreted as including both the +Z and -Z directions. Similarly, "X-axis direction" can be interpreted as including both the +X and -X directions, and "Y-axis direction" can be interpreted as including both the +Y and -Y directions. However, in the XYZ spatial coordinate system shown in the accompanying drawings, when "negative / positive (- / +)" is not indicated on the axis, the axis can be interpreted as pointing towards the + direction. When describing directions, one of the three axes of the Cartesian coordinate system can include a direction parallel to that axis. In the following description, "first direction" can refer to the Z-axis direction or a direction parallel to the Z-axis. It should be noted that, for the sake of simplicity, the above description is based on the Cartesian coordinate system described in the accompanying drawings, and the description of directions or components does not limit the various embodiments of this disclosure.

[0063] Reference Figure 2 and Figure 3 The electronic device 101 according to an embodiment may include a housing 201, the housing 201 including a front surface 201a, a rear surface 201b, and a side surface 201c surrounding the space between the front surface 201a and the rear surface 201b. In an embodiment (not shown), the housing 201 may refer to being formed Figure 2 Front surface 201a, Figure 3 The structure comprises a portion of the rear surface 201b and the side surface 201c. According to an embodiment, at least a portion of the front surface 201a may be formed of a front panel 202 (e.g., a glass or polymer panel including various coatings), at least a portion of which is substantially transparent. The rear surface 201b may be formed of a rear panel 211. The rear panel 211 may be formed using, for example, glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. The side surface 201c may be incorporated into the front panel 202 and the rear panel 211 and is formed of a side frame structure (or “side member”) 212 comprising metal and / or polymer. In some embodiments, the front panel 202 and the side frame structure 212 may be integrally formed as a single body and comprise the same material. Alternatively, the rear panel 211 and the side frame structure 212 may be integrally formed as a single body and comprise the same material (e.g., glass, a metallic material such as aluminum, or ceramic). In an embodiment, the front surface 201a and / or the front panel 202 may be interpreted as part of the display 210. According to an embodiment, the housing 201 may include the front panel 202 and the rear panel 211.

[0064] According to an embodiment, electronic device 101 may include a display 210, audio modules 203, 204, and 205 (e.g., Figure 1 The audio module 170), sensor module (e.g., Figure 1 Sensor module 176), camera modules 206 and 207 (e.g., Figure 1 The camera module 180), key input devices 216 and 217 (e.g., Figure 1 Input module 150) or connector holes 213 and 214 (e.g., Figure 1 At least one of the connection terminals 178). In some embodiments, the electronic device 101 may not be provided with at least one of these components (e.g., connector hole 214), or may additionally include other components.

[0065] According to an embodiment, the display 210 may be visually exposed, for example, through a large portion of the front panel 202. In some embodiments, at least a portion of the display 210 may be exposed through the front panel 202 forming the front surface 201a. According to an embodiment, the display 210 may be a flexible display or a foldable display.

[0066] According to an embodiment, the surface of the housing 201 (or the front panel 202) may include a screen display area formed by visual exposure through the display 210. For example, the screen display area may include the front surface 201a.

[0067] In one embodiment (not shown), a recess or opening may be formed in a portion of the screen display area (e.g., the front surface 201a) of the display 210, and at least one of an audio module 205, a sensor module (not shown), a light-emitting element (not shown), or a camera module 206 aligned with the recess or opening may be included. In another embodiment (not shown), at least one of the audio module 205, the sensor module (not shown), the camera module 206, the fingerprint sensor (not shown), or the light-emitting element (not shown) may be included on the rear surface of the screen display area of ​​the display 210.

[0068] In an embodiment (not shown), the display 210 may be combined with or configured adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-based pen input device 215 (e.g., a stylus).

[0069] In some embodiments, at least some of the key input devices 216 and 217 may be disposed on the side frame structure 212.

[0070] According to embodiments, audio modules 203, 204, and 205 may include, for example, a microphone hole 203 and speaker holes 204 and 205. A microphone for acquiring external sound may be disposed in the microphone hole 203, and in some embodiments, multiple microphones may be disposed to detect the direction of sound. Speaker holes 204 and 205 may include an external speaker hole 204 for calling and a receiver hole 205. In some embodiments, speaker holes 204 and 205 and microphone hole 203 may be implemented as a single hole, or may include a speaker (e.g., a piezoelectric speaker) without speaker holes 204 and 205. Audio modules 203, 204, and 205 are not limited to the above-described structures and may be subject to various design modifications depending on the structure of electronic device 101, such as installing only some audio modules or adding new audio modules.

[0071] According to embodiments, a sensor module (not shown) can generate electrical signals or data values ​​corresponding to the internal operating state or external environmental state of the electronic device 101. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on the front surface 201a of the housing 201, and / or a third sensor module (not shown) (e.g., an HRM sensor) and / or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on the rear surface 201b of the housing 201. In some embodiments (not shown), the fingerprint sensor may be disposed on both the rear surface 201b and the front surface 201a (e.g., the display 210) of the housing 201. The electronic device 101 may also include at least one of the following sensor modules (not shown): a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown). The sensor module (not shown) is not limited to the structure described above, and various design modifications can be made according to the structure of the electronic device 101, such as installing only some sensor modules or adding new sensor modules.

[0072] According to an embodiment, camera modules 206 and 207 may include a front-facing camera module 206 disposed on the front surface 201a of the electronic device 101 and a rear-facing camera module 207 disposed on the rear surface 201b of the electronic device 101, a flash 208, and / or an IR sensor 209. Camera modules 206 and 207 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 208 may include, for example, a light-emitting diode (LED) or a xenon lamp. Camera modules 206 and 207 are not limited to the above-described structure and may be subject to various design modifications depending on the structure of the electronic device 101, such as installing only some camera modules or adding new camera modules.

[0073] According to embodiments, electronic device 101 may include multiple camera modules (e.g., dual-camera or triple-camera), each camera module having different attributes (e.g., field of view) or functions. For example, rear camera module 207 may include multiple camera modules with lenses having different field of view. For example, the multiple camera modules may include at least one of a wide-angle camera, an ultra-wide-angle camera, a telephoto camera, or an IR camera (e.g., a time-of-flight (TOF) camera or a structured light camera). Furthermore, the multiple camera modules may include, for example, an optical zoom camera with adjustable magnification. According to embodiments, for multiple camera modules, electronic device 101 may be configured to cause a specified camera module or another camera module to operate based on user selection or a pre-specified environment. According to embodiments, an IR camera may operate as at least part of a sensor module. For example, a TOF camera may operate as at least part of a sensor module (not shown) for sensing the distance to an object.

[0074] According to embodiments, camera modules 206 and 207 of this disclosure may include direct-lit camera modules and / or folding camera modules. A direct-lit camera module may be a camera module in which the optical path entering the lens assembly and reaching the image sensor is formed in a straight line without bending. In contrast, a folding camera module may be a camera module in which the optical path from the lens assembly to the image sensor is bent at least once. Folding camera modules typically include reflective and refractive components that cause light to be reflected and refracted at least once (e.g., Figure 5 The reflecting and refractive elements 304 may include, for example, prisms or mirrors. When distinguishing between direct-lit and folding cameras, whether the optical path to the image sensor is bent may not be based on the bending caused by each lens in the lens assembly, but rather on the bending caused by the reflecting and refractive elements (e.g., Figure 5 The bending caused by the reflective and refractive components 304. According to an embodiment, the rear camera module 207 may include multiple camera modules (e.g., a dual-camera module or a triple-camera module), in which some cameras (e.g., a wide-angle camera module) may be implemented as direct-lit camera modules, while others (e.g., a telephoto camera module) may be implemented as folding camera modules. Additionally, according to an embodiment, the front camera module 206 may be implemented as an under-display camera (UDC) module.

[0075] According to an embodiment, key input devices 216 and 217 may be arranged on the side surface 201c of the housing 201. According to an embodiment, the electronic device 101 may not include some or any of the key input devices 216 and 217, and the un-included key input devices 216 and 217 may be implemented in other forms, such as soft keys located on the display 210. In some embodiments, key input devices 216 and 217 may include a sensor module (not shown) disposed on the rear surface 210B201b of the housing 210201.

[0076] According to an embodiment, a light-emitting element (not shown) may be disposed on, for example, the front surface 201a of the housing 201. The light-emitting element (not shown) may provide, for example, status information about the electronic device 101 in the form of light. In an embodiment, the light-emitting element (not shown) may provide a light source, for example, associated with the operation of the front-facing camera module 206. The light-emitting element (not shown) may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0077] According to an embodiment, connector holes 213 and 214 may include a first connector hole 213 and / or a second connector hole 214. The first connector hole 213 is capable of accommodating a connector (e.g., a USB connector) for sending power and / or data to and from an external electronic device, and the second connector hole 214 is capable of accommodating a storage device (e.g., a Subscriber Identity Module (SIM) card and a Secure Digital Storage (SD) card). According to an embodiment, the first connector hole 213 and / or the second connector hole 214 may be omitted. Connector holes 213 and 214 are not limited to the above-described structure and can be modified in various ways depending on the structure of the electronic device 101, such as installing only some connector holes or adding new connector holes.

[0078] The pen input device 215 (e.g., a stylus) can be guided into and removed from the interior of the housing 201 through holes formed on the side surface of the housing 201, and includes buttons for easy insertion and removal. The pen input device 215 may have a separate built-in resonant circuit and operate in association with an electromagnetic induction panel (e.g., a digitizer) included in the electronic device 101. The pen input device 215 may employ electromagnetic resonance (EMR), active stylus (AES), and electrocoupled resonance (ECR) methods.

[0079] According to an embodiment, camera modules 206 and 207 and / or sensor modules (not shown) may be disposed within the internal space of electronic device 101 such that they can interact with the external environment through designated areas of display 210 and front panel 202. For example, the designated area may be an area of ​​display 210 without pixels. In another example, the designated area may be an area of ​​display 210 with pixels. When viewed from above display 210, at least a portion of the designated area may be superimposed on camera modules 206 and 207 and / or sensor modules. In another example, some sensor modules may be disposed within the internal space of electronic device to perform their functions without being visually exposed through front panel 202.

[0080] Figure 2 and Figure 3 The electronic device 101 shown has a strip-shaped or plate-shaped appearance, but is not limited to a strip-shaped or plate-shaped appearance. For example, the electronic device shown may be part of a rollable electronic device or a foldable electronic device. "Rollable electronic device" may refer to an electronic device in which the display can be bent and deformed, thereby allowing at least a portion of it to be rolled or folded and stored in a housing (e.g., Figure 2 The interior of the housing 210). Depending on user needs, the rollable electronics can expand the screen display area by unfolding the display or exposing a larger area of ​​the display to the outside. "Foldable electronics" can refer to an electronics whose two different areas of the display can be folded to face each other or face opposite directions. Typically, in a portable state, the two different areas of the display in a foldable electronics face each other or face opposite directions. In actual use, the user can unfold the display so that the two different areas are substantially flat. In embodiments, the electronic device 101 according to the various embodiments of this disclosure can be interpreted as including not only portable electronic devices such as smartphones, but also various other electronic devices such as laptop computers or home appliances.

[0081] The electronic device 101 disclosed herein may include a camera module 300, 400, or 500, which will be described later.

[0082] Figure 4 This is a perspective view showing a camera module according to an embodiment. Figure 5 This is a perspective view showing the interior of the camera module according to an embodiment being partially transparent.

[0083] Figure 4 and Figure 5 The camera module 300 may include a camera housing 301, a lens assembly 302, an image sensor 303, a carrier assembly 305, and at least one substrate. The at least one substrate may include, for example, a first substrate 311, a second substrate 313, and a connector 312. Figure 4 and Figure 5 In the camera module 300, the carrier assembly 305 may refer to a stacked structure for moving the image sensor 303 through the operation of multiple drive components 360.

[0084] Camera module 300 may include a refractive optical system (folding optical system) configured to bend the direction of light travel at least twice. Camera module 300 including such a refractive optical system may be referred to as a "folding camera". To bend the direction of light travel at least twice, camera module 300 may include a reflecting and refractive member 304 that may reflect and / or refract the direction of light travel at least twice between a lens assembly 302 including at least one lens and an image sensor 303. In this disclosure, "reflection and refraction" or "reflection and / or refraction" may be interpreted as having substantially the same meaning. Light passing through a "reflecting and refraction member" in this disclosure may be reflected only, refracted only, or both reflected and refracted along its path. In embodiments, the "reflecting and refraction member" in this disclosure may be simply referred to as a "member". Alternatively, the "reflecting and refraction member" in this disclosure may be simply referred to as a "mirror", "prism", or "mirror and prism". In "reflection and refraction", light reflection and light refraction may not necessarily each occur once. When light is reflected by a reflective element (e.g., a mirror), the light can be interpreted as being refracted over its entire path. Conversely, when light is refracted by a refractive element (e.g., a prism), the light can be interpreted as being reflected at the surface of the refractive element.

[0085] The camera housing 301, which essentially forms the exterior of the camera module 300, may include a base member 301a and a cover member 301b. The base member 301a may correspond to a base of the camera housing 301. The cover member 301b may be a portion combined with the base member 301a to form a space within the camera housing 301 for mounting various components therein. According to an embodiment, when there are components that generate electromagnetic waves within the space formed by the camera housing 301, the camera housing 301 may provide a shielding structure for electromagnetic shielding. For example, when the drive member 360 includes a voice coil motor (VCM) that generates driving force using an electric or magnetic field, at least one of the base member 301a or the cover member 301b may include an electromagnetic shielding structure. The electromagnetic shielding structure prevents electric or magnetic fields from flowing into and interfering with the VCM from the outside of the camera housing 301, or prevents electric or magnetic fields from leaking from the VCM and interfering with other electronic components in the electronic device 101. (See also...) Figure 4 According to an embodiment, although the sidewalls may be formed to at least partially surround the components housed within the cover member 301b, additionally or alternatively, the sidewalls may also be formed on the base member 301a. Thus, the camera housing 301 is not limited to any particular shape and may have various shapes according to embodiments.

[0086] Lens assembly 302 may include along the optical axis OI (e.g., Figure 6a At least one lens aligned with the optical axis OI (which will be described later). In the drawings of the optical system including the camera module 300, the optical axis OI may be shown as a line (virtual line) connecting the centers of the lenses (or, when there are multiple lenses, connecting the centers of multiple lenses). For example, the optical axis may be shown as a line passing through the center of curvature of the surface facing the object-side O of the first lens (e.g., the first lens) from the object (or external object) side O and the center of curvature of the surface facing the image-side I of the last lens (e.g., the nth lens) from the object side. In another example, the optical axis may be shown as a line passing through the center of the image sensor and the centers of multiple lenses. According to embodiments, the optical axis may be understood as a “rotation center axis” about which the optical performance does not change when rotated. Furthermore, in this disclosure, the optical axis OI may not necessarily mean a straight line in the Z-axis direction or parallel to the Z-axis, but may also mean a virtual line that bends once or multiple times. In the following description, when referring to the movement of an assembly along the optical axis direction, “optical axis direction” may be understood as the direction in which light is incident on the image sensor 303. For example, as Figure 6a As shown, for a camera module 300 having an optical axis OI extending to a lens assembly 302, a reflective and refractive member 304, and an image sensor 303, the "optical axis direction" can be understood as the Z-axis direction on the optical axis OI or a direction parallel to the Z-axis.

[0087] Lens assembly 302 may be at least partially housed within camera housing 301. According to an embodiment, lens assembly 302 may be at least partially housed within camera housing 301 while being surrounded by a lens barrel structure. The lens included in lens assembly 302 may vary depending on camera module 300 or electronic device (e.g., ...). Figure 1 The electronic device 101 is arranged in an appropriate number to accommodate the required specifications of light incident from the outside. The number of lenses included in the lens assembly 302 is not limited to any particular embodiment. According to an embodiment, the lens assembly 302 may be configured to partially protrude outward from the camera housing 301 while being at least partially housed within the camera housing 301. According to an embodiment, the lens assembly 302 may be fixedly disposed within the camera housing 301. In this state, the lens assembly 302 can focus or guide light emitted from or reflected by an object into the camera housing 301.

[0088] Image sensor 303 can be configured to detect light incident on the imaging plane img after being reflected and / or refracted by reflective and refractive member 304. For example, light incident from outside camera module 300 can pass through lens assembly 302 and reflective and refractive member 304 and be detected by image sensor (IS), and electronic device 101 can acquire an image of an object based on the signal or information detected by image sensor (IS). According to embodiments, the optical performance of camera module 300 can be further enhanced when image sensor 303 is enlarged. Image sensor 303 may include sensors such as complementary metal-oxide semiconductor (CMOS) or charge-coupled device (CCD). Image sensor 303 is not limited to these and may include various devices, such as those that convert an image of an object into an electrical image signal. Image sensor 303 can acquire an image of an object by detecting brightness information, grayscale information, color information, etc., about the object from light passing through lens assembly 302.

[0089] Electronic device 101 may include camera module 300 equipped with AF function and / or OIS (hereinafter referred to as "shake stabilization or image correction") function. This can improve the quality of images acquired by camera module 300. The camera module 300 of this disclosure can perform AF operation and / or image correction operation by image sensor shifting. In lens-shift type camera modules, during AF operation and / or image correction operation, the lens barrel 302b is movable, while the position of the image sensor is fixed. In contrast, in image sensor-shift type camera module 300, the position of image sensor 303 can vary. When performing AF operation, image sensor-shift type camera module 300 can shift image sensor 303 along the height direction (e.g., Z-axis direction) of camera module 300. When performing image correction operation, image sensor-shift type camera module 300 can shift image sensor 303 along the length direction (e.g., Y-axis direction) or width direction (e.g., X-axis direction) of camera module 300.

[0090] According to an embodiment, the image sensor 303 may be disposed on one surface of the base member 301a. In this case, the base member 301a can be driven separately from the cover member 301b, which is another part of the camera housing 301. According to an embodiment, the base member 301a and the image sensor 303 may be configured to be spaced apart from each other by a specific distance. In this case, a configuration in which the position of the base member 301a is fixed and only the position of the image sensor 303 is variable can be applied. The image sensor 303 of this disclosure can be moved along the X-axis, Y-axis, and / or Z-axis directions by a drive member 360. As will be described in more detail later, the drive member 360 may include a first drive member 361, a second drive member 362, and a third drive member 363 to allow the image sensor 303 to move along... Figure 4 and Figure 5 The three axes (X-axis, Y-axis, and Z-axis) of the spatial coordinates shown move independently.

[0091] Image sensor 303 may be disposed on one surface of first substrate 311. According to an embodiment, first substrate 311 is a printed circuit board on at least one surface of which electronic components (e.g., image sensor 303) are disposed, and may have a common feature with respect to the components disposed on the first substrate 311. Figure 4 The first substrate 311 is a plate-shaped structure parallel to the plane formed by the X and Y axes in the spatial coordinate system shown (hereinafter referred to as the "XY plane"). According to an embodiment, the first substrate 311 may be spaced apart from the housing 301 (e.g., base member 301a). Electrical signals may be applied to the image sensor 303, or image-related data acquired from the image sensor 303 may be transmitted via the first substrate 311 to another component (e.g., an image signal processor). According to an embodiment, the surface of the first substrate 311 facing the -Z-axis direction may be formed facing the base member 301a, and the image sensor 303 may be disposed on the surface of the first substrate 311 facing the +Z-axis direction (first direction). The image sensor 303 and / or the first substrate 311 may be connected to a second substrate 313 for electrical connection to another component (e.g., an image signal processor). Although not shown in the accompanying drawings, at least one component (e.g., an image signal processor, memory, driver integrated circuit (IC) for VCM, etc.) may be disposed on the first substrate 311 and connected to other components (e.g., a processor) disposed outside the camera housing 301 via a connector 314 disposed on the second substrate 313. According to an embodiment, the position of the second substrate 313 may be fixed relative to the camera housing 301. The relative position between the first substrate 311 and the second substrate 313 may change when the first substrate 311 is moved while the second substrate 313 is fixed. A connector 312 may be disposed between the first substrate 311 and the second substrate 313 to form a substrate assembly 310. According to an embodiment, the connector 312 may be implemented as a flexible printed circuit board (FPCB). When the connector 312 is an FPCB, the electrical connection between the first substrate 311 and the second substrate 313 can be maintained more stably. According to an embodiment, a slit may be formed in the connector 312 to reduce and / or prevent damage.

[0092] The camera module 300 may include a carrier assembly 305 that causes the image sensor 303 and / or the first substrate 311 to reciprocate along a first direction (+Z-axis direction) and / or guides the image sensor 303 and / or the first substrate 311 along a direction perpendicular to the first direction (Y-axis direction or X-axis direction). The carrier assembly 305 may be at least partially integrated into the first substrate 311 within the camera housing 301. Through the carrier assembly 305, the image sensor 303 disposed on the first substrate 311 can move along the first direction (+Z-axis direction) and can also reciprocate along a direction perpendicular to the first direction (Y-axis direction or X-axis direction). Figure 7 The carrier assembly 305 is described in more detail in the embodiments shown in the accompanying drawings.

[0093] Figure 6a This is a cross-sectional view showing the interior of a camera module including reflective and refractive components according to an embodiment. Figure 6b This is a diagram showing the optical axis passing through the reflective and refractive components according to an embodiment. Figure 6c This is a diagram showing the optical axis passing through the reflective and refractive components according to an embodiment. Figure 6a , Figure 6b and Figure 6c This is intended to help understand the components included in the camera module, and it should be noted that components included in the camera module but not required for the description may be omitted.

[0094] The lens assembly 302 included in the camera module 300 may include a single lens or a combination of multiple lenses. The multiple lenses may be arranged to be aligned with the image sensor 303 on the optical axis OI. Figure 6a For example, a configuration of three lenses 302a is shown, but this disclosure is not limited thereto. (See reference later.) Figure 7 The described method allows for the arrangement of fewer lenses (e.g., two lenses) or more lenses (e.g., four or more lenses). Lens 302a arranged in lens assembly 302 may be surrounded by lens barrel 302b and integrated into one side of camera housing 301.

[0095] A reflective and refractive element 304 may be disposed between the lens assembly 302 and the image sensor 303. Light incident on the lens assembly 302 from the outside can pass through the reflective and refractive element 304, be reflected at least twice, and be focused or aligned to the image sensor 303. This allows for miniaturization of the optical system from the lens assembly 302 to the image sensor 303. A camera with this structure may be referred to as a "lens-guided camera". Figure 6aA camera module 300 is shown in which light incident on the lens assembly 302 is reflected and / or refracted twice as it passes through the reflecting and refractive member 304. However, the number of times light is reflected and / or refracted as it passes through the reflecting and refractive member 304 is not limited to this. For example, as will be described later... Figure 6a , Figure 6b and Figure 6d In one embodiment, light is reflected and / or refracted twice, while in the embodiment described later... Figure 6c and Figure 6e In some embodiments, light is reflected and / or refracted four times. Although not shown in the figures, embodiments with light reflected and / or refracted three times and / or five or more times may also be included within the scope of this disclosure.

[0096] The reflecting and refraction member 304 may include a prism, a reflecting mirror, and / or an opening for reflecting light. For example, the reflecting and refraction member 304 may have a prism on one side and a reflecting mirror on the other side, such that light incident on the reflecting and refraction member 304 is reflected and / or refracted as it passes through the prism and the reflecting mirror. In another example, the reflecting and refraction member 304 may be configured such that at least two surfaces are formed as prisms to reflect and / or refract light. According to an embodiment, the reflecting and refraction member 304 may be formed from a combination of multiple prisms and / or reflecting mirrors. According to an embodiment, the reflecting and refraction member 304 may be formed from a combination of multiple prism sheets and / or reflecting mirrors. For example, a single reflecting and refraction member 304 may be formed from a combination of prism sheets and / or reflecting mirrors having triangular and / or quadrilateral cross-sections.

[0097] Reference Figure 6a , Figure 6b and Figure 6c The reflecting and refraction member 304 may include: an incident surface 304a on which light passing through the lens assembly 302 is incident; a first reflecting surface 304b inclined relative to the incident surface 304a; and a second reflecting surface 304c inclined relative to the incident surface 304a and formed to be spaced apart from the first reflecting surface 304b.

[0098] The incident surface 304a can be the surface on which light passing through the lens assembly 302 first enters the reflecting and refractive member 304. According to an embodiment, the incident surface 304a can be formed with respect to the nth lens closest to the image side (e.g., ...). Figure 6aThe third lens is spaced a specific distance in the image-side direction. According to an embodiment, the incident surface 304a may be parallel to the front surface (e.g., the surface facing the -Z axis) and the rear surface (e.g., the surface facing the +Z axis) of the electronic device, respectively. The optical axis OI may be perpendicular to the incident surface 304a. According to an embodiment, an opening or a light-transmitting prism may be formed on at least a portion of the incident surface 304a to allow light to pass through. The first reflecting surface 304b may be the surface from which light incident on the incident surface 304a is first reflected and / or refracted. The reflecting and refraction member 304 may include a second reflecting surface 304c that is inclined relative to the incident surface 304a (or the exit surface 304d) and spaced apart from the first reflecting surface 304b.

[0099] The reflecting and refraction member 304 may include an exit surface 304d from which light passing through it exits. According to an embodiment, an opening or a light-transmitting prism may be formed on at least a portion of the exit surface 304d to allow light to pass through. The exit surface 304d may face the image sensor 303 parallel to it. According to an embodiment, at least a portion of the reflecting and refraction member 304 may be surrounded by a driving member 360, in which case the driving member 360 may be positioned adjacent to the exit surface 304d.

[0100] Light incident perpendicular to the incident surface 304a of the reflecting and refraction member 304 can pass through the internal space (e.g., a light guide) surrounded by the incident surface 304a, the first reflecting surface 304b, the second reflecting surface 304c, and the exit surface 304d of the reflecting and refraction member 304, and exit perpendicular to the exit surface 304d. According to an embodiment, light reflection can occur in portions of the incident surface 304a and the exit surface 304b other than the portions transmitting light (e.g., openings). According to an embodiment, the incident surface 304a of the reflecting and refraction member 304 can be referred to as the "first surface," the first reflecting surface 304b as the "second surface," the second reflecting surface 304c as the "third surface," and the exit surface 304d as the "fourth surface."

[0101] The exit surface 304d of the light-emitting surface can be formed to be spaced apart from the incident surface 304a of the light-incident surface. According to... Figure 6a , Figure 6b and Figure 6c In the embodiment shown, the exit surface 304d can be formed parallel to the incident surface 304a, provided that it is spaced a specific distance from the incident surface 304a along the height direction (e.g., the Z-axis direction). In the embodiment, according to Figure 6a , Figure 6b and Figure 6cIn the embodiment shown, the incident surface 304a and the exit surface 304d may face opposite directions, and the first reflecting surface 304b and the second reflecting surface 304c may face opposite directions.

[0102] In such Figure 6a and Figure 6b In embodiments where the light is reflected twice within the reflecting and refraction member 304, the angle of inclination of the first reflecting surface 304b and the second reflecting surface 304c relative to the incident surface 304a and the exiting surface 304d can be greater than that in embodiments where the light is reflected twice within the reflecting and refraction member 304b. Figure 6c In an embodiment where the light is reflected four times within the reflecting and refractive member 304, the first reflecting surface 304b and the second reflecting surface 304c are tilted at angles relative to the incident surface 304a and the exiting surface 304d. For example, in Figure 6a and Figure 6b In the embodiments, the first reflecting surface 304b and the second reflecting surface 304c are tilted at an angle of 45 degrees relative to the incident surface 304a and the exiting surface 304d, and Figure 6c In the embodiments, the angle at which the first reflective surface 304b and the second reflective surface 304c are tilted relative to the incident surface 304a and the exit surface 304d may be less than 45 degrees (e.g., 30 degrees).

[0103] According to an embodiment, the reflecting and refraction member 304 may be a hexahedron with a parallelogram cross-sectional shape, wherein the incident surface 304a and the exit surface 304d are substantially parallel, and the first reflecting surface 304b and the second reflecting surface 304c are substantially parallel. According to an embodiment, the reflecting and refraction member 304 may also be referred to as a hexahedron with a rhombic or elongated rhombic cross-sectional shape. Furthermore, the shape of the reflecting and refraction member 304 may vary. For example, two or more prisms may be combined to form a reflecting and refraction member 304 that is essentially a single entity.

[0104] The reflecting and refractive element 304 may be supported by the camera housing 301. For example, the camera housing 301 may include a base member 301a and a cover member 301b, which provide space for accommodating the reflecting and refractive element 304. According to an embodiment, the camera housing 301 may also include an optical support 301c to support the lens assembly 302 and the reflecting and refractive element 304. For example, the optical support 301c may be configured such that it supports the lens assembly 302 on one side and the reflecting and refractive element 304 on the other side. Additionally or optionally, the camera housing 301 may include at least one auxiliary support member 301d and 301e. According to an embodiment, the auxiliary support members 301d and 301e may be integrally formed with the optical support 301c. For example, at least one auxiliary support member 301d and 301e may be disposed adjacent to the first reflective surface 304b and / or the second reflective surface 304c of the reflective and refractive member 304 to support the first reflective surface 304b and the second reflective surface 304c. The auxiliary support members 301d and 301e may include a first auxiliary support member 301d supporting the first reflective surface 304b and a second auxiliary support member 301e supporting the second reflective surface 304c. The reflective and refractive member 304 may remain in a fixed position while being supported by the optical bracket 301c and / or the auxiliary support members 301d and 301e. However, even if the reflective and refractive member 304 is supported in this way by the optical bracket 301c and / or the auxiliary support members 301d and 301e, a collision may still occur between the reflective and refractive member 304 and its surrounding components (e.g., carrier assembly 305) when a strong impact, such as a drop, is applied to the electronic device. This disclosure provides a camera module and an electronic device including the camera module that prevent performance degradation caused by contact between components (e.g., between carrier assembly 305 and reflective and refractive member 304) in the event of such a collision.

[0105] Figure 6d This is a diagram showing the optical axis passing through the reflective and refractive components according to an embodiment. Figure 6e This is a diagram showing the optical axis passing through the reflective and refractive components according to an embodiment.

[0106] Reference Figure 6d and Figure 6e Camera module (e.g.) Figure 6a The camera module 300 may also include a reflecting and refraction member 404 having a trapezoidal (e.g., isosceles trapezoidal) cross-sectional shape, wherein the incident surface and the exit surface are separate from each other but substantially lie on the same plane. The reflecting and refraction member 404 may include a prism, a mirror reflecting light, and / or an opening. The reflecting and refraction member 404 may be omitted from the above description. Figures 6a to 6c The description of the embodiments described herein is repeated.

[0107] The reflecting and refraction member 404 may include: an incident surface 404a on which light passing through the lens assembly 402 is incident; a first reflecting surface 404b inclined relative to the incident surface 404a; and a second reflecting surface 404c inclined relative to the incident surface 404a and spaced apart from the first reflecting surface 404b. Furthermore, the reflecting and refraction member 404 may include a third reflecting surface 404d.

[0108] The incident surface 404a can be the surface on which light passing through the lens assembly 402 first enters the reflecting and refraction member 404. According to an embodiment, the incident surface 404a can be formed with respect to the nth lens closest to the image side (e.g., ...). Figure 6a The third lens is spaced a specific distance in the image-side direction. According to an embodiment, the incident surface 404a may be parallel to the front surface (e.g., the surface facing the -Z axis) and the rear surface (e.g., the surface facing the +Z axis) of the electronic device, respectively. The optical axis OI may be perpendicular to the incident surface 404a. According to an embodiment, an opening or a light-transmitting prism may be formed on at least a portion of the incident surface 404a to allow light to pass through. Figure 6d and Figure 6e In this embodiment, light can not only be incident through the incident surface 404a, but also exit through the incident surface 404a. According to an embodiment, the incident surface 404a may include a first transmission portion 404aa for light incident and a second transmission portion 404ab for light exit. According to an embodiment, light reflection may occur in portions of the incident surface 404a other than the portions transmitting light (the first transmission portion 404aa and the second transmission portion 404ab). According to an embodiment, at least a portion of the reflecting and refraction member 404 may be driven by a member (e.g., Figure 6a The drive member 360 surrounds the second transmission portion 404ab, in which case the drive member 360 may be located at a position adjacent to the second transmission portion 404ab.

[0109] The first reflecting surface 404b may be the surface from which light incident on the incident surface 404a is first reflected and / or refracted. The second reflecting surface 404c may be the surface from which light is reflected and / or refracted just before it is emitted. For example, as... Figure 6e As shown, the third reflective surface 404d can be a surface on which light is reflected and / or refracted multiple times (e.g., four times).

[0110] According to an embodiment, the incident surface 404a of the reflecting and refraction member 404 may be referred to as the "first surface", the first reflecting surface 404b may be referred to as the "second surface", the second reflecting surface 404c may be referred to as the "third surface", and the third reflecting surface 404d may be referred to as the "fourth surface".

[0111] Figure 7 This is a perspective view showing the positional relationships between components in a camera module including reflective and refractive elements according to an embodiment.

[0112] exist Figure 7 In the embodiments described, it should be noted that components included in the camera module but not required for the description may be omitted.

[0113] Reference Figure 7 The camera module 300 may include a carrier assembly 305, which is a stacked structure of a first carrier 320, a second carrier 330, and a third carrier 340. According to an embodiment, the first carrier 320, the second carrier 330, and the third carrier 340 may be stacked with guide balls disposed between each pair of elements. Therefore, relative movement between the elements included in the carrier assembly 305 can be achieved. A drive member 360 may be disposed around the carrier assembly 305 to transmit driving forces to the reflecting and refractive members 304 in three directions. The drive member 360 may include a plurality of drive members 361, 362, and 363.

[0114] A first carrier 320 may be stacked on a first substrate 311 on which an image sensor 303 is disposed. According to an embodiment, the first carrier 320 may be configured to at least partially surround the image sensor 303 on a surface of the first substrate 311 facing a first direction (+Z-axis direction). However, this is not a limitation, and when a hole is provided in the first substrate 311, the image sensor 303 may also be disposed on a surface of the first substrate 311 facing a direction opposite to the first direction (-Z-axis direction). In this case, the first carrier 320 may not surround the image sensor 303. According to an embodiment, the first carrier 320 may be coupled to the first substrate 311 and move integrally. The first carrier 320 may be integrally formed as a plate parallel to the XY plane and configured to move in at least one of the three axes parallel to a Cartesian coordinate system when coupled to the first substrate 311.

[0115] According to an embodiment, the second carrier 330 may be configured to face a surface of the first carrier 320. According to an embodiment, the second carrier 330 may not be fixedly coupled to the first carrier 320, but may be coupled to the first carrier 320 such that their relative positions can be changed. According to an embodiment, the third carrier 340 may be configured to face a surface of the second carrier 330. According to an embodiment, the third carrier 340 may not be fixedly coupled to the second carrier 330, but may be coupled to the second carrier 330 such that their relative positions can be changed. The arrangement of the second carrier 330 relative to the first carrier 320, the arrangement of the third carrier 340 relative to the first carrier 320, and / or the arrangement of the third carrier 340 relative to the second carrier 330 may vary according to the embodiment. According to an embodiment, the third carrier 340 may be omitted (e.g., in the following...). Figures 16 to 19 (as in the embodiments). Refer to Figure 8 The arrangement of the first carrier 320, the second carrier 330 and the third carrier 340 is described in more detail in the accompanying drawings.

[0116] Reference Figure 6a , Figure 6b and Figure 7 The driving member 360 may include at least one coil and at least one magnet configured to at least partially face the at least one coil. The at least one magnet may be configured to face the at least one coil simultaneously in a direction intersecting a first direction (e.g., the Z-axis direction) (e.g., the X-axis direction and / or the Y-axis direction), or simultaneously in a direction towards an optical axis (e.g., the Z-axis direction). Multiple driving members 360 may be provided. According to an embodiment, the driving member 360 may include a first driving member 361, a second driving member 362, and a third driving member 363. The first driving member 361 may be an AF driving member for adjusting the focus of the camera module 300, and the second driving member 362 and the third driving member 363 may be OIS driving members for correcting camera module 300 shake (or camera shakiness).

[0117] Although carrier assembly 305 is Figure 7 The image is shown as a rectangular shape with approximately four sides, but this is a simplified representation for ease of description, and the corresponding shapes of the carrier assembly 305 and the first carrier 320, second carrier 330, and third carrier 340 forming the carrier assembly 305 may vary in various embodiments. Furthermore, although the reflective and refractive members 304, the first carrier 320, the third carrier 340, and the second carrier 330 are... Figure 7 The components are shown stacked in this order along the Z-axis, but the arrangement and / or shape of (one or more) components may vary depending on the embodiment. For example, as shown in the reference... Figure 8As described in the accompanying drawings, the camera module 300 may include a carrier assembly 305 that surrounds the reflective and refractive member 304 in an approximately "U" shape in at least three lateral directions. According to an embodiment, the first drive member 361, the second drive member 362, and the third drive member 363 may also be arranged in an approximately "U" shape corresponding to the arrangement and / or shape of the carrier assembly 305. The remaining side of the carrier assembly 305 may be formed as an open space. The reflective and refractive member 304 may be configured to lie above the open space, parallel to the XY plane, from above the carrier assembly 305.

[0118] The camera module 300 may include an autofocus carrier (referred to as the "AF carrier") for moving the image sensor 303 along a first direction, and an image stabilization carrier (referred to as the "OIS carrier") for moving the image sensor 303 along directions intersecting the first direction, which are components of the carrier assembly 305. According to an embodiment, the image stabilization carrier (OIS carrier) enables the image sensor 303 to perform horizontal movement in at least two intersecting directions in a plane perpendicular to the first direction. (See also...) Figure 6a and Figure 6b The first carrier 320 and the second carrier 330 can be OIS carrier and AF carrier, respectively.

[0119] According to an embodiment, the camera module 300 may further include an intermediate guide carrier (or intermediate carrier). According to an embodiment, the carrier assembly 305 may be configured to include an OIS carrier, an AF carrier, and an intermediate guide carrier. For example, an intermediate guide carrier may be provided to assist OIS operation of the OIS carrier. OIS operation of this disclosure may refer to horizontal movement in a plane perpendicular to a first direction along at least two intersecting directions, and when the OIS carrier moves horizontally along one direction perpendicular to the first direction, the intermediate guide carrier may be configured to move horizontally along another direction perpendicular to the first direction. According to an embodiment, the directions along which the OIS carrier and the intermediate guide carrier move may also be perpendicular to each other. The intermediate guide carrier may be stacked with the OIS carrier and a guide ball is located between them, and is configured to allow relative movement with the OIS carrier by operation of the drive member 360. (See also...) Figure 6a and Figure 6b The third carrier 340 can be an intermediate guiding carrier.

[0120] This disclosure may include embodiments in which a first carrier (e.g., an OIS carrier) is disposed within a second carrier 430 (e.g., an AF carrier) and embodiments in which a second carrier (e.g., an AF carrier) is disposed within a first carrier (e.g., an OIS carrier). This disclosure also discloses a structure in which a shock absorber is applied in each of these embodiments.

[0121] First, refer to Figures 8 to 15The camera module 400 shown (e.g., Figures 4 to 7 The camera module 300) is described in detail in an embodiment where the first carrier 420 is disposed inside the second carrier 430. Figures 8 to 15 In one embodiment, where the first carrier 420 is disposed inside the second carrier 430, the first carrier 420 may be configured to move in accordance with the movement of the second carrier 430.

[0122] Figure 8 This is an exploded perspective view showing a camera module disposed inside a second carrier (e.g., AF carrier) according to an embodiment. Figure 9 This is a perspective view showing a camera module disposed inside a second carrier (e.g., an AF carrier) according to an embodiment.

[0123] Reference Figure 8 The camera module 400 may include a camera housing 401, an image sensor 403, a first carrier 420, a second carrier 430, and / or a driving member 460. The camera module 400 may also include a third carrier 440. Additionally, the camera module 400 may include at least one substrate (e.g., Figure 4 and Figure 5 The first substrate 311 and the second substrate 313) and / or at least one FPCB (e.g., Figure 4 and Figure 5 Connector 312). When describing Figures 8 to 15 When implementing the embodiments, references can be applied. Figures 1 to 7 The following descriptions of the components are provided, and redundant descriptions of components (e.g., lens components) may be omitted below.

[0124] The camera housing 401 may include a base member 401a and a cover member 401b, and substantially forms the exterior of the camera module 400. The camera housing 401 is not limited to a particular shape and may have various shapes depending on the embodiment.

[0125] The image sensor shifting method can be applied to the camera module 400. The image sensor 403 of this disclosure can be disposed, for example, on a first substrate (e.g., ...). Figure 4 and Figure 5 In the case of the image sensor 403 (on the substrate 311), movement is achieved via the drive member 460 along the X-axis, Y-axis, and / or Z-axis directions. The drive member 460 provides a mechanism that allows the image sensor 403 and the first substrate (e.g., Figure 4 and Figure 5 substrate 311) along Figure 8 The driving force for independent motion in the three axes of the spatial coordinates shown.

[0126] Camera module 400 may include carrier assembly 405, which connects image sensor 403 and first substrate (e.g., Figure 4 and Figure 5 The substrate 311) reciprocates along a first direction (e.g., the Z-axis direction) and / or guides the image sensor 403 and the first substrate (e.g., the Y-axis direction or the X-axis direction) in a direction perpendicular to the first direction (e.g., the Y-axis direction or the X-axis direction). Figure 4 and Figure 5 The substrate 311). The carrier assembly 405 can be housed inside the camera housing 401. The image sensor 403 can be disposed on the first substrate (e.g., substrate 311). Figure 4 and Figure 5 The carrier assembly 405 is mounted on a substrate 311 and reciprocates along a first direction or a direction perpendicular to the first direction via a carrier assembly 405. The carrier assembly 405 may include a first carrier 420 and a second carrier 430, or may include a first carrier 420, a second carrier 430 and a third carrier 440.

[0127] The first carrier 420 can be stacked on the first substrate (e.g., Figure 4 and Figure 5 On substrate 311). (Refer to...) Figure 8 The first carrier 420 may be disposed on the surface of the first substrate facing the +Z axis direction to at least partially surround the image sensor 403. According to an embodiment, the first carrier 420 may be fixedly coupled to the first substrate (e.g., Figure 4 and Figure 5 The substrate 311 moves as a whole.

[0128] The first carrier 420 may be generally formed as a plate parallel to the XY plane and configured to be movable along at least one of the three axes of the illustrated Cartesian coordinate system. The first carrier 420 may have an opening formed at its center and include a plate 421 surrounding the opening. According to an embodiment, a filter (not shown) may be disposed in the opening. The filter may be, for example, an IR cutoff filter to block IR rays, and when the IR cutoff filter is disposed in the opening, it may be superimposed on the image sensor 403.

[0129] The first carrier 420 may include a first protruding guide portion 422 and a second protruding guide portion 423 extending from a surface 421a of the first plate 421 in the +Z axis direction. A second magnet 462b may be disposed on the first protruding guide portion 422, and a third magnet 463b may be disposed on the second protruding guide portion 423. The second magnet 462b and the third magnet 463b may be erected on the first protruding guide portion 422 and the second protruding guide portion 423, respectively, thereby forming a magnetic field in directions intersecting the first direction (e.g., the Z axis direction) (e.g., the Y axis direction and the X axis direction).

[0130] A third carrier 440 may be stacked on top of a first carrier 420. According to an embodiment, the third carrier 440 may be disposed on a surface of the first carrier 420 facing a first direction (e.g., the Z-axis direction). According to an embodiment, the third carrier 440 may not be fixedly coupled to the first carrier 420, but may be coupled such that their relative positions are changeable. According to an embodiment, the third carrier 440 may be formed as a "U"-shaped frame extending along a direction perpendicular to the first direction (X-axis direction and / or Y-axis direction). According to an embodiment, a third guide ball B3 may be disposed between the third carrier 440 and the first carrier 420. The third guide ball B3 may support the third carrier 440 while minimizing friction during changes in the relative position between the third carrier 440 and the first carrier 420. The third carrier 440, when disposed on the first carrier 420, may reciprocate linearly along a direction perpendicular to the first direction (X-axis direction and / or Y-axis direction) using the third guide ball B3.

[0131] A first carrier 420 and a third carrier 440 may be disposed inside a second carrier 430. The second carrier 430 may be stacked on top of the third carrier 440. According to an embodiment, the second carrier 430 may be disposed on a surface of the third carrier 440 facing a first direction (+Z-axis direction). According to an embodiment, the second carrier 430 may not be fixedly coupled to the third carrier 440, but may be coupled such that their relative positions are changeable. According to an embodiment, a second guide ball B2 may be disposed between the second carrier 430 and the third carrier 440. The second guide ball B2 may support the second carrier 430 while minimizing friction during changes in the relative positions between the second carrier 430 and the third carrier 440. The third carrier 440, when stacked below the second carrier 430, may reciprocate linearly along a direction perpendicular to the first direction (X-axis direction and / or Y-axis direction) using the second guide ball B2. The second carrier 430 may include a second plate 431 and a sidewall 432, the second plate 431 having a surface facing a first direction (e.g., the Z-axis direction), and the sidewall 432 extending from the second plate 431 along the first direction (e.g., the -Z-axis direction). A cover member 401b may be disposed on the second plate 431 of the second carrier 430, and the sidewall 432 of the second carrier 430 may be at least partially surrounded by the sidewalls extending from the base member 401a and / or the cover member 401b of the housing 401. First guide balls B1 may be disposed between the second carrier 430 and the cover member 401b. For example, a first recess 434 may be formed on the sidewall 432 of the second carrier 430, and a plurality of first guide balls B1 may roll in the first recess 434. Although not shown separately in the figures, a separate second recess (not shown) corresponding to the location of the first recess 434 may also be formed on the inner surface of the cover member 401b facing the second carrier 430. A first guide ball B1 may be disposed and / or accommodated between a first recess 434 and a second recess (not shown). The second carrier 430 may reciprocate linearly within the housing 401 along a first direction (e.g., the Z-axis direction) using the first guide ball B1. A first magnet 461b may be disposed on a surface of a sidewall 432 of the second carrier 430. The first magnet 461b may be disposed on the sidewall 432 of the second carrier 430 such that a magnetic field is formed in directions intersecting the first direction (e.g., the Z-axis direction) (e.g., the Y-axis and X-axis directions).

[0132] Refer to together Figure 8 and Figure 9 Multiple coils 461a, 462a, and 463a, including those in the drive member 460, may be arranged around the carrier assembly 405 at positions corresponding to multiple magnets 461b, 462b, and 463b. According to an embodiment, the multiple coils 461a, 462a, and 463a may be arranged in the cover member 401b, the optical support (e.g.,...). Figure 6a and Figure 6b301c) and / or auxiliary support components (e.g., Figure 6a and Figure 6b On the inner surfaces of coils 301d and 301e, the positions of multiple coils 461a, 462a, and 463a can vary depending on the embodiment. According to an embodiment, the first drive member 461 can be configured to move the first magnet 461b along a first direction (e.g., the Z-axis direction) when current flows through the first coil 461a. This allows the first drive member 461 to cause the second carrier 430 to linearly reciprocate along the first direction (e.g., the Z-axis direction). The first drive member 461 can be a Lorentz-type drive member, wherein Fleming's left-hand rule is applied between the first coil 461a and the first magnet 461b. In another embodiment, the second drive member 462 and the third drive member 463 can be configured to move the second magnet 462b and the third magnet 463b respectively along directions perpendicular to the first direction (e.g., the X-axis direction or the Y-axis direction) when current flows through the second coil 462a and the third coil 463a. The second drive member 462 and / or the third drive member 463 can cause the second carrier 430 to reciprocate linearly along a direction perpendicular to the first direction (e.g., the X-axis or Y-axis). The second drive member 462 and the third drive member 463 can be solenoid-type drive members, wherein Ampere's right-hand rule is applied between the second coil 462a and the second magnet 462b, and between the third coil 463a and the third magnet 463b, respectively. Whether the first drive member 461, the second drive member 462, and / or the third drive member 463 are Lorentz-type or solenoid-type can be determined based on the arrangement of the coils and magnets included in each drive member. For example, an embodiment may be adopted where the first drive member 461 is solenoid-type and the second drive member 462 and / or the third drive member 463 is Lorentz-type.

[0133] According to an embodiment, a first opening O1 may be formed on one side of the base member 401a, a second opening O2 may be formed on one side of the second carrier 430, a third opening O3 may be formed on one side of the third carrier 440, and a fourth opening O4 may be formed on one side of the cover member 401b. When the base member 401a, the first carrier 420, the third carrier 440, the second carrier 430, and the cover member 401b are stacked and assembled in sequence, the first opening O1, the second opening O2, the third opening O3, and the fourth opening O4 may be integrated into a single opening O. The reflection and refraction member 404 may be disposed at the location where the opening O is formed in the carrier assembly 405, and the driving member 460 may be disposed at the location where the opening O is not formed.

[0134] According to an embodiment, the camera module 400 may further include a frame 470. The frame 470 may be disposed inside the camera housing 401. According to an embodiment, it may be disposed on the rear surface of the first carrier 420. The frame 470 may include a horizontal frame 471 at least partially parallel to the camera housing 401 and a vertical frame 472 projecting from the horizontal frame 471. The frame 470 may be coupled to the second carrier 430 using the vertical frame 472. For example, a fastener 433 may be disposed on the sidewall 432 of the second carrier 430, and the vertical frame 472 may be fastened to the fastener 433, thereby securing the first carrier 420 to the second carrier 430 and preventing the first carrier 420 from detaching from the carrier assembly 405. The frame 470 may prevent the first carrier 420 from moving beyond a predetermined range. When the first carrier 420 moves beyond a preset range, the guide balls (e.g., the second guide ball B2 and / or the third guide ball B3) may disengage from the recesses (e.g., the third recess 444, the fourth recess (not shown), the fifth recess (not shown), and / or the sixth recess 424). However, by providing the frame 470, disengagement of the guide balls can also be prevented. In another embodiment, a stop (not shown) may be provided on the frame 470. Because the frame 470 includes the stop, it also provides the effect of absorbing and / or dispersing the impacts applied to the carrier assembly 405 and reducing noise when the carrier assembly 405 moves linearly along the first direction (+Z axis direction).

[0135] Figure 10 This is a cross-sectional view showing a camera module, according to an embodiment, in which a first carrier (e.g., an OIS carrier) is disposed inside a second carrier (e.g., an AF carrier). Figure 11 This is a perspective view of a carrier assembly according to an embodiment, wherein the second carrier (e.g., AF carrier) is omitted.

[0136] Figure 10 This is a simplified diagram showing the positional relationship between the carrier assembly 405 and the reflecting and refractive member 404, and for convenience, in Figure 10 The third carrier 440 can be omitted. The above is achieved through... Figure 8 and Figure 9 The third carrier 440 described in the embodiments may be, for example, an intermediate guide carrier provided to assist in the driving of the first carrier 420. According to the embodiments, the third carrier 440 may therefore be omitted or substantially integrated into the first carrier 420. Figure 11 This is a detailed diagram showing the first carrier 420 and the third carrier 440 in an embodiment that further includes a third carrier 440, and for convenience, the second carrier 430 may be omitted. When describing... Figure 10 and Figure 11 In the implementation of the embodiments, it can be applied Figures 1 to 9The description of the components is provided below, and redundant descriptions of components (e.g., lens components) may be omitted below.

[0137] The camera module 400 may include a second carrier 430 (e.g., an AF carrier) that moves linearly along a first direction (e.g., the Z-axis) to perform AF functions, and a first carrier 420 (e.g., an OIS carrier) that moves linearly along a direction perpendicular to the first direction (e.g., the X-axis and / or Y-axis) to perform image stabilization correction functions. Figure 10 In the illustrated embodiment, the first carrier 420 is shown as disposed on the second carrier 430. However, it should be noted that this is merely a conceptual representation of the first carrier 420 being housed within the second carrier 430, and does not necessarily mean that the first carrier 420 is disposed on top of the second carrier 430. (Refer to...) Figure 10 The first carrier 420 is an OIS carrier and can move together with the image sensor 403 along a direction intersecting the first direction. The second carrier 430 is an AF carrier and can move along the first direction, and when the second carrier 430 is driven, the first carrier 420 can also move accordingly.

[0138] When Figure 11 When the diagram also includes a third carrier 440, the third carrier 440 may have a frame shape extending along a direction intersecting the first direction (e.g., the Z-axis direction) (e.g., the X-axis direction and / or the Y-axis direction). The third carrier 440 may be positioned on the first carrier 420. The third carrier 440 may be formed as a "U"-shaped frame that does not interfere with the first protruding guide 422 and the second magnet 462b, as well as the second protruding guide 423 and the third magnet 463b of the first carrier 420. For example, the third carrier 440 may include a first arm 441, a second arm 442 extending from one end of the first arm 441, and a third arm 443 extending from the other end of the first arm 441.

[0139] A third recess 444 may be formed at each end of the first arm 441, the second arm 442, and the third arm 443 on the surface of the third carrier 440 facing a first direction (e.g., the +Z-axis direction), and a fourth recess (not shown) may be formed on the opposite surface (e.g., the -Z-axis direction). The third recess 444 and the fourth recess (not shown) may be formed at corresponding positions on the surfaces of the third carrier 440 facing opposite directions. The third recess 444 and the fourth recess (not shown) may be configured to allow the second guide ball B2 and the third guide ball B3 to roll when respectively disposed and / or accommodated therein. Although not shown separately in the figures, a separate fifth recess (not shown) may also be formed at a position corresponding to the third recess 444 on the surface of the second carrier 430 facing the third carrier 440 to accommodate and / or place the second guide ball B2 therein. Similarly, a sixth recess 424 may be formed at a position corresponding to the fourth recess (not shown) on the surface 421a of the first carrier 420 facing the third carrier 440. Multiple third recesses 444 and multiple fourth recesses (not shown) can be formed. According to an embodiment, the multiple third recesses 444 may all have the same shape, and the multiple fourth recesses (not shown) may also all have the same shape. For example, all of the multiple third recesses 444 may have V-shaped grooves formed in one direction (e.g., the X-axis direction). The fifth recess (not shown) of the second carrier 430 may have a groove formed in the same direction as the third recesses 444 of the third carrier 440. On the other hand, all of the multiple fourth recesses (not shown) may have V-shaped grooves formed in a different direction from the third recesses 444 (e.g., the Y-axis direction). The sixth recess 424 of the first carrier 420 may have a groove formed in the same direction as the fourth recesses (not shown) of the third carrier 440. However, this disclosure is not limited to the above embodiments. According to an embodiment, an embodiment in which the V-shaped grooves formed in the third recesses 444 and the fifth recesses (not shown) face the Y-axis direction, and the V-shaped grooves formed in the fourth recesses (not shown) and the sixth recess 424 face the X-axis direction, can also be applied. The above embodiments are for example Figure 11 The illustration shows the case where a third carrier 440 is provided. In embodiments where the third carrier 440 is not provided, such as... Figure 10 In this configuration, the third guide ball B3 and the recesses for accommodating the third guide ball B3 (e.g., the fourth and sixth recesses 424) can be omitted. When the third carrier 440 is not provided, as... Figure 10In this embodiment, the camera module 400 can be configured to perform OIS operation using the second guide ball B2. For example, when the third carrier 440 is not provided, the third recess 444 accommodating the second guide ball B2 can be formed as a circular groove with a diameter larger than that of the second guide ball B2, instead of a V-shaped groove. According to an embodiment, when the third recess 444 is formed as a circular groove with a diameter larger than that of the second guide ball B2, the first carrier 420 can not only perform OIS operation, but also be rotatable about a first direction (e.g., the Z-axis direction). During OIS operation, the first carrier 420 moves horizontally relative to the second carrier 430 along at least two directions intersecting the first direction (e.g., the X-axis direction and / or the Y-axis direction) via the second guide ball B2.

[0140] exist Figure 10 and Figure 11 The reflective and refractive element 404 (a hexahedron with a parallelogram cross-sectional shape) used in the structure shown can be configured so that its exit surface faces the image sensor 403. Therefore, when an external force is applied to the camera module 400, the exit surface of the reflective and refractive element 404, or the vertex portion between the exit surface and the second reflective surface 404c, may collide with the carrier assembly 405. For example, the "U"-shaped third carrier 440 may be structurally particularly prone to twisting. Therefore, the third carrier 440 and / or the reflective and refractive element 404 facing it are at risk of breakage or permanent deformation due to impact from external forces.

[0141] To prevent the camera module from breaking or permanently deforming due to impacts from external forces, this disclosure provides a camera module 400 with a shock absorber.

[0142] Figure 12 This is an exploded perspective view showing a carrier assembly including a shock absorber according to an embodiment. Figure 13 This is a perspective view showing a carrier assembly including a shock absorber according to an embodiment.

[0143] The shock absorber disclosed herein may be formed on at least one of the portion (or surface) of the carrier assembly facing the reflective and refractive member or the portion (or surface) of the reflective and refractive member facing the carrier assembly.

[0144] exist Figure 12 and Figure 13In the illustrated embodiment, the camera module 400 may include a shock absorber 445 formed on the surface of the carrier assembly facing the reflecting and refractive member 404. The shock absorber 445 of this disclosure may include various elastic materials. For example, the shock absorber 445 may include rubber, polyurethane, and / or various elastic synthetic resin materials. For example, methods for forming the shock absorber 445 on the carrier assembly may include producing the shock absorber 445 in the form of a clip and assembling it into a component (e.g., a third carrier 440) included in the carrier assembly, or applying a method of injection molding it using different materials when manufacturing a component (e.g., a recess) included in the carrier assembly. Various other manufacturing methods may also be applied.

[0145] The shape and arrangement of the reflective and refractive components 404 can be considered to set the surface of the carrier assembly facing the reflective and refractive components 404 and where the shock absorber 445 is mounted. Figure 12 and Figure 13 In the embodiment shown, the reflective and refractive member 404 is a hexahedron with a parallelogram cross-section, and its exit surface is configured to face the image sensor 403. Therefore, with this in mind, a shock absorber 445 can be disposed on the third carrier 440.

[0146] The shock absorber 445 may include multiple shock absorbers 445-1, 445-2, and 445-3, and the multiple shock absorbers 445-1, 445-2, and 445-3 may be arranged to take into account the movement direction of the first carrier 420 and / or the third carrier 440. According to an embodiment, the first shock absorber 445-1 may be disposed on the first arm 441 of the third carrier 440, the second shock absorber 445-2 may be disposed on the second arm 442, and the third shock absorber 445-3 may be disposed on the third arm 443. According to an embodiment, the second shock absorber 445-2 and the third shock absorber 445-3 may be disposed at the end of the second arm 442 and the end of the third arm 443, respectively. The first shock absorber 445-1 can be configured to absorb and / or reduce the impact when the third carrier 440 collides with the reflective and refractive member 404 on the X-axis, and the second shock absorber 445-2 and the third shock absorber 445-3 can be configured to absorb and / or reduce the impact when the third carrier 440 collides with the reflective and refractive member 404 on the Y-axis.

[0147] According to this disclosure, since the shock absorber 445 is provided as described above, breakage and / or deformation of the optical units (e.g., reflection and refraction members 404) and the carrier assembly 405 inside the camera module 400 can be prevented.

[0148] Figure 14 This is a cross-sectional view showing a camera module, according to an embodiment, in which a first carrier (e.g., an OIS carrier) is disposed inside a second carrier (e.g., an AF carrier). Figure 15This is a perspective view showing a carrier assembly including a shock absorber according to an embodiment.

[0149] exist Figure 14 and Figure 15 In the embodiment shown, the camera module 400 may include shock absorbers 435 and 445 formed on the surfaces of the carrier assembly facing the reflecting and refractive members 404. Figure 12 and Figure 13 The embodiments shown are different, according to Figure 14 and Figure 15 The reflecting and refraction member 404 in the illustrated embodiment can be a hexahedron with a trapezoidal cross-section, wherein the incident surface and the exit surface are substantially located on the same plane. For example, Figure 14 and Figure 15 The reflecting and refractive components shown can be hexahedrons with an isosceles trapezoidal cross section. According to... Figure 14 and Figure 15 In the carrier assembly 405 of the embodiment shown, shock absorbers 435 and 445 may be disposed on the second carrier 430 and the third carrier 440.

[0150] Shock absorbers 435 and 445 may include multiple shock absorbers 435, 445-2, and 445-3, and the multiple shock absorbers 435, 445-2, and 445-3 may be arranged to take into account the movement direction of the first carrier 420 and / or the third carrier 440. According to an embodiment, the first shock absorber 435 may be disposed on the portion of the second carrier 430 corresponding to the exit surface and the second reflective surface of the reflective and refractive member 404; the second shock absorber 445-2 may be disposed on the second arm 442 of the third carrier 440; and the third shock absorber 445-3 may be disposed on the third arm 443 of the third carrier 440. According to an embodiment, the second shock absorber 445-2 and the third shock absorber 445-3 may be disposed at the ends of the second arm 442 and the third arm 443, respectively. The first shock absorber 435 may be configured to absorb and / or reduce the impact when the second carrier 430 collides with the reflective and refractive member 404 on the X-axis, and the second shock absorber 445-2 and the third shock absorber 445-3 may be configured to absorb and / or reduce the impact when the third carrier 440 collides with the reflective and refractive member 404 on the Y-axis.

[0151] Figures 12 to 15 An embodiment of a camera module 400 in which dampers 435 and 445 are formed on a carrier assembly is shown. According to this disclosure, embodiments may also include dampers disposed on the surface of the reflective and refractive member 404 facing the carrier assembly 405, rather than on the carrier assembly itself. In the case where dampers are disposed on the surface of the reflective and refractive member 404 facing the carrier assembly 405, the carrier assembly 405 may not have separate dampers at its corresponding locations.

[0152] Next, we will refer to Figures 16 to 19 The camera module 500 shown (e.g., Figures 4 to 7 Camera module 300 and / or Figures 8 to 15 The camera module 400) is described in detail in an embodiment where the second carrier 430 is disposed inside the first carrier 520. Figures 16 to 19 In one embodiment, the second carrier 530 may be configured to move along with the first carrier 520 when disposed inside the first carrier 520.

[0153] Figure 16 This is an exploded perspective view showing a camera module disposed inside a first carrier (e.g., an OIS carrier) according to an embodiment.

[0154] Reference Figure 16 The camera module 500 may include a camera housing 501, an image sensor 503, a first carrier 520, a second carrier 530, and / or a driving member 560. Furthermore, the camera module 500 may include at least one substrate (e.g., Figure 4 and Figure 5 The first substrate 311 and the second substrate 313) and / or at least one FPCB (e.g., Figure 4 and Figure 5 Connector 312). When describing Figures 16 to 19 In the implementation of the embodiments, it can be applied Figures 1 to 15 The description of the components is provided below, and redundant descriptions of components (e.g., lens components) may be omitted below.

[0155] The camera housing 501 may include a base member 501a and a cover member 501b, and substantially forms the exterior of the camera module 500. The camera housing 501 is not limited to a particular shape and may have various shapes depending on the embodiment.

[0156] The image sensor shifting method can be applied to the camera module 500. The image sensor 503 of this disclosure can be disposed, for example, on a first substrate (e.g., ...). Figure 4 and Figure 5 In the case of the image sensor 503 (on the substrate 311), movement is achieved by the drive member 560 along the X-axis, Y-axis, and / or Z-axis directions. As will be described in detail later, the drive member 560 can provide a mechanism that allows the image sensor 503 and the first substrate (e.g., Figure 4 and Figure 5 The substrate 311 in the middle) along Figure 16 The driving force for independent motion in the three axes of the spatial coordinates shown.

[0157] Camera module 500 may include carrier assembly 505, which connects image sensor 503 and first substrate (e.g., Figure 4and Figure 5 The substrate 311) reciprocates linearly along a first direction (+Z-axis direction) or in a direction opposite to the first direction (-Z-axis direction), and / or guides the image sensor 503 and the first substrate (e.g.,) in a direction perpendicular to the first direction (-X-axis direction or +X-axis direction, and / or -Y-axis direction or +Y-axis direction). Figure 4 and Figure 5 The substrate 311). The carrier assembly 505 can be housed inside the camera housing 501. The image sensor 503 can be disposed on the first substrate (e.g., substrate 311). Figure 4 and Figure 5 The camera module 500 is mounted on a substrate 311 and reciprocates along a first direction (e.g., the Z-axis direction) via a carrier assembly 505, or additionally or optionally, reciprocates along a direction perpendicular to the first direction (e.g., the X-axis direction and / or the Y-axis direction). The carrier assembly 505 may include a first carrier 520 and a second carrier 530. According to an embodiment, the camera module 500 may include an intermediate guide carrier (e.g., ... Figure 8 The third carrier 440), but Figures 16 to 19 The embodiments shown may not include an intermediate guide carrier.

[0158] A first carrier 520 may be stacked on a base member 501a. According to an embodiment, the first carrier 520 may be disposed on a surface of the base member 501a facing a first direction (+Z-axis direction). According to an embodiment, the first carrier 520 may not be fixedly coupled to the base member 501a, but may be coupled such that their relative positions are changeable. According to an embodiment, the first carrier 520 may be formed as a "U"-shaped frame extending along a direction perpendicular to the first direction (e.g., the X-axis direction and / or the Y-axis direction). According to an embodiment, a second guide ball B2 may be disposed between the first carrier 520 and the base member 501a. The second guide ball B2 may support the first carrier 520 while minimizing friction during changes in the relative position between the first carrier 520 and the base member 501a. The first carrier 520, disposed on the base member 501a, may reciprocate linearly along a direction perpendicular to the first direction (e.g., the X-axis direction and / or the Y-axis direction) using the second guide ball B2. A recess (e.g., a third recess) that accommodates and supports the rolling of the second guide ball B2 may be formed in the base member 501a. For example, as Figure 16As shown, in an embodiment where the camera module 500 does not include an intermediate guide carrier, the recess accommodating the second guide ball B2 can be formed as a circular groove with a diameter larger than the diameter of the second guide ball B2. In this case, the first carrier 420 can not only perform OIS operation but also rotate about a first direction (e.g., the Z-axis direction). During OIS operation, the first carrier 420 moves horizontally relative to the camera housing 501 along at least two directions (e.g., the X-axis direction and / or the Y-axis direction) intersecting the first direction via the second guide ball B2. When the camera module 500 includes an intermediate guide carrier, the above-described method can be applied... Figure 11 The embodiments shown describe embodiments having a V-groove in the X-axis direction and a recessed portion of a V-groove in the Y-axis direction.

[0159] The second carrier 530 may be configured to be surrounded by the first carrier 520. According to an embodiment, the second carrier 530 may not be fixedly coupled to the first carrier 520, but may be coupled such that their relative positions are changeable. According to an embodiment, a first guide ball B1 may be disposed between the second carrier 530 and the first carrier 520. The first guide ball B1 may support the second carrier 530 while minimizing friction during changes in the relative positions between the second carrier 530 and the first carrier 520. The second carrier 530 may be linearly reciprocated relative to the first carrier 520 along a first direction (Z-axis direction) using the first guide ball B1. The second carrier 530 may include a second plate 531 and a sidewall 532, the second plate 531 having a surface facing the first direction (+Z-axis direction), and the sidewall 532 extending from the second plate 531 along the first direction (e.g., -Z-axis direction). A reflective and refractive member 504 may be disposed on the second plate 531 of the second carrier 530. The sidewall 532 of the second carrier 530 may be at least partially surrounded by sidewalls extending from the base member 501a and / or cover member 501b of the housing 501. The second carrier 530 may reciprocate linearly within the housing 501 along a first direction (e.g., the Z-axis direction) using first guide balls B1. For example, a first recess 534 may be formed on the sidewall 532 of the second carrier 530, and a plurality of first guide balls B1 may roll in the first recess 534. According to an embodiment, a second recess for receiving the first guide balls B1 may also be formed on the sidewall of the first carrier 520.

[0160] exist Figures 16 to 19 In one embodiment, the coils 561a, 562a, and 563a of the driving member 560 may be disposed on the second carrier 530 and the base member 501a, and the magnets 561b, 562b, and 563b may be disposed on the first carrier 520. (Refer to...) Figure 16Magnets 561b, 562b, and 563b disposed on the first carrier 520 can be erected (e.g., 561b) to face the X-axis-oriented surface of the second carrier 530, or laid flat (e.g., 562b and 563b) to face the Z-axis-oriented surface of the base member 501a. Correspondingly, coil 561a disposed on the second carrier 530 can be erected to face the X-axis-oriented surface of the first carrier 520, or coils 562a and 563a disposed on the base member 501a can be laid flat to face the rear surface of the first carrier 520. Figure 16 In the embodiment shown, the first drive member 561 may be a solenoid-type drive member, wherein Ampere's right-hand rule is applied between the first coil 561a and the first magnet 561b. The first drive member 561 enables the first carrier 520 to reciprocate linearly along a first direction (e.g., the Z-axis direction). The second drive member 562 and the third drive member 563 may be Lorentz-type drive members, wherein Fleming's left-hand rule is applied between the second coil 562a and the second magnet 562b, and between the third coil 563a and the third magnet 563b, respectively. The second drive member 562 and / or the third drive member 563 enables the second carrier 530 to reciprocate linearly along a direction perpendicular to the first direction (e.g., the X-axis direction or the Y-axis direction). Figures 8 to 15 Similarly, the first drive member 561, the second drive member 562, and / or the third drive member 563 can also be either Lorentz type or solenoid type, depending on the implementation. Figures 16 to 19 The arrangement of the coils and magnets included in the various driving components in the embodiments varies. For example, embodiments in which the first driving component 561 is Lorentz type and the second driving component 562 and / or the third driving component 563 is solenoid type may also be adopted.

[0161] According to an embodiment, a first opening O1 may be formed on one side of the base member 501a, a second opening O2 may be formed on one side of the second carrier 530, a third opening O3 may be formed on one side of the first carrier 520, and a fourth opening O4 may be formed on one side of the cover member 501b. When the base member 501a, the first carrier 520, the second carrier 530, and the cover member 501b are stacked and assembled in sequence, the first opening O1, the second opening O2, the third opening O3, and the fourth opening O4 can be integrated into a single opening O. The reflection and refraction member 504 may be disposed at the location where the opening O is formed, and the driving member 560 may be disposed at the location where the opening O is not formed.

[0162] Figure 17 This is a cross-sectional view showing a camera module according to an embodiment, wherein the AF carrier is disposed inside the OIS carrier. Figure 18 This is a perspective view showing a carrier assembly according to an embodiment.

[0163] Figure 17 and Figure 18 This is a simplified diagram showing the arrangement between the carrier assembly 505 and the reflecting and refractive components 504. (When describing...) Figure 17 and Figure 18 In the implementation of the embodiments, it can be applied Figure 10 and Figure 11 The description of the components is provided below, and redundant descriptions of the components can be omitted.

[0164] The camera module 500 may include a second carrier 530 (e.g., an AF carrier) that moves linearly along a first direction (e.g., the Z-axis) to perform an AF function, and a first carrier 520 (e.g., an OIS carrier) that moves linearly along a direction perpendicular to the first direction (e.g., the X-axis and / or Y-axis) to perform an image stabilization correction function. According to... Figures 16 to 18 In the camera module 500 of the embodiment shown, the second carrier 530 can be housed inside the first carrier 520.

[0165] Refer to together Figure 17 and Figure 18 The first carrier 520 may have a frame shape extending along a direction intersecting a first direction (e.g., the X-axis and / or Y-axis). The first carrier 520 may be laid flat on the base member 501a. Figure 17 and Figure 18 In the structure shown, the second carrier 530 can move relative to the camera housing 501 along a first direction (e.g., the Z-axis direction), and the first carrier 520 can move relative to the second carrier 530 along a direction perpendicular to the first direction (e.g., the X-axis direction and / or the Y-axis direction).

[0166] exist Figure 17 and Figure 18 The reflective and refractive element 504 (a hexahedron with a parallelogram cross-sectional shape) used in the structure shown can be configured such that its exit surface faces the image sensor 503. Therefore, when an external force is applied to the camera module 500, the exit surface of the reflective and refractive element 504, or the vertex portion between the exit surface and the second reflective surface 504c, may collide with the carrier assembly 505. Figures 16 to 19 In the embodiments, with Figure 14 and Figure 15 Similarly, the reflecting and refraction member 504 can also be a hexahedron having a trapezoidal cross-section in which the incident surface and the exit surface are substantially in the same plane.

[0167] Because the second carrier 530 with the opening has a roughly "U" shape when viewed from above, it is at risk of breakage or permanent deformation due to impact from external forces. The reflective and refractive members 504 facing the second carrier 530 are also at risk of breakage or permanent deformation due to impact from external forces.

[0168] To prevent the camera module from breaking or permanently deforming due to impacts from external forces, this disclosure provides a camera module 500 with a shock absorber.

[0169] Figure 19 This is a perspective view showing a carrier assembly including a shock absorber according to an embodiment.

[0170] The shock absorber disclosed herein may be formed on at least one of the surfaces of the carrier assembly facing the reflective and refractive elements or the surfaces of the reflective and refractive elements facing the carrier assembly.

[0171] exist Figure 19 In the illustrated embodiment, the camera module 500 may include a shock absorber 535 formed on the surface of the carrier assembly facing the reflective and refractive member 504. The shock absorber 535 of this disclosure may include various elastic materials. For example, the shock absorber 535 may include rubber, polyurethane, and / or various elastic synthetic resin materials. For example, methods for forming the shock absorber 535 on the carrier assembly may include producing the shock absorber 535 in the form of a small clip and assembling it into a component (e.g., a second carrier 530) included in the carrier assembly, or applying a method of injection molding it using different materials when manufacturing a component (e.g., a recess) included in the carrier assembly. Various other manufacturing methods may also be applied.

[0172] The shape and arrangement of the reflective and refractive elements 504 can be considered to set the surface of the carrier assembly facing the reflective and refractive elements 504 and where the shock absorber 535 is mounted. Figure 19 In the embodiment shown, the reflective and refractive member 504 is a hexahedron with a parallelogram cross-section, and its exit surface is configured to face the image sensor 403. Therefore, with this in mind, a shock absorber 535 can be disposed on the second carrier 530.

[0173] For example, the shock absorber 535 may include multiple shock absorbers 535-1, 535-2, 535-3, and 535-4, and the multiple shock absorbers 535-1, 535-2, 535-3, and 535-4 may be arranged considering the direction of movement of the second carrier 530. A first shock absorber 535-1 may be provided to absorb and / or reduce the impact when the second carrier 530 collides with the reflective and refractive member 504 on the X-axis, and a second shock absorber 535-2 and a third shock absorber 535-3 may be provided to absorb and / or reduce the impact when the second carrier 530 collides with the reflective and refractive member 504 on the Y-axis. In addition, a fourth shock absorber 535-4 may be provided to absorb and / or reduce the impact when the second carrier 530 collides with the reflective and refractive member 504 on the Z-axis.

[0174] According to this disclosure, since the shock absorber 535 is provided as described above, breakage and / or deformation of the optical units (e.g., reflection and refraction members 504) and the carrier assembly 505 inside the camera module 500 can be prevented.

[0175] Figure 20 This is a perspective view showing a reflective and / or refractive component including a shock absorber according to an embodiment. Figure 21 This is a perspective view showing a reflective and / or refractive component including a shock absorber according to an embodiment. Figure 20 Optical supports and auxiliary support components combined with reflective and / or refractive elements may be shown. Figure 21 Only auxiliary support members integrated into the reflective and / or refractive components may be shown, without including the optical support.

[0176] exist Figures 8 to 15 In the embodiment shown, shock absorbers 435 and 445 are disposed on the carrier assembly 405 of the camera module 400, and... Figures 16 to 19 In the embodiment shown, the shock absorber 535 is disposed on the carrier assembly 505 of the camera module 500. (Refer to...) Figures 8 to 15 Multiple shock absorbers 435 and 445 may be disposed on the portion of the carrier assembly 405 facing the reflecting and refractive member 404, and refer to Figures 16 to 19 Multiple shock absorbers 535 may be disposed on the portion of the carrier assembly 505 facing the reflecting and refractive member 504. Figures 8 to 15 or Figures 16 to 19 As an addition or alternative to the embodiments, shock absorbers may also be provided on the reflective and refractive components.

[0177] Reference Figure 20 and Figure 21 The shock absorber 605 may be disposed in the reflective and refractive member 604 (e.g., Figures 4 to 7 Reflective and refractive components 304 Figures 8 to 15 Reflective and refractive components 404 and / or Figures 16 to 19The reflective and refractive components 504) facing the carrier assembly (e.g., Figures 4 to 7 Carrier assembly 305, Figures 8 to 15 Carrier assembly 405 and / or Figures 16 to 19 The carrier assembly 505) is located on the carrier assembly. However, it should be noted that in this disclosure, "the damper is disposed on the reflective and refractive member" includes "the damper is disposed on the surrounding assembly attached to the reflective and refractive member" and "the damper is disposed directly on the reflective and refractive member".

[0178] Reference Figure 20 The reflective and refractive element 604 can be integrated with the optical support 601c and auxiliary support elements 601d, 601e, and 601f. That is, the optical support 601c and auxiliary support elements 601d, 601e, and 601f can be disposed around the reflective and refractive element 604. The reflective and refractive element 604 can remain in a fixed position while being supported by the optical support 601c and auxiliary support elements 601d, 601e, and 601f. According to an embodiment, the auxiliary support elements 601d, 601e, and 601f may include a first reflective surface (e.g., ...) supporting the reflective and refractive element. Figures 4 to 7 The first auxiliary support member 601d of the first reflective surface 304b and the second reflective surface (e.g., supporting the reflection and refraction members) Figures 4 to 7 The second auxiliary support member 601e is the second reflective surface 304c. The auxiliary support members 601d, 601e, and 601f may include a third auxiliary support member 601f supporting the side surface of the reflective and refractive member 604. However, the auxiliary support members 601d, 601e, and 601f of this disclosure are not limited thereto. According to embodiments, the third auxiliary support member 601f may be omitted, or another fourth auxiliary support member may be added. According to embodiments, the reflective and refractive member 604 may include a support member disposed in the auxiliary support members 601d, 601e, and 601f facing the carrier assembly (e.g., ...). Figures 4 to 7 Carrier assembly 305, Figures 8 to 15 Carrier assembly 405 and / or Figures 16 to 19 The shock absorber 605 is located on a portion of the carrier assembly 505 (e.g., the second auxiliary support member 601e). For example, a shock absorber 605 may be provided. Figure 20 The shock absorber 605 shown is used to absorb and / or reduce the impact when the carrier assembly collides with the reflective and refractive member 604 on the X-axis.

[0179] According to an embodiment, the reflective and refractive member 604 may include a component disposed facing the carrier assembly (e.g., Figures 4 to 7 Carrier assembly 305, Figures 8 to 15 Carrier assembly 405 and / or Figures 16 to 19Multiple shock absorbers 605 on multiple parts of the carrier assembly 505. (Refer to...) Figure 21 The plurality of dampers 605 may include, for example, a first damper 605-1 disposed on one surface of the second auxiliary support member 601e, and a second damper 605-2 and a third damper 605-3 disposed on one and another surface of the third auxiliary support member 601f. The first damper 605-1 may be configured to absorb and / or reduce the impact when the carrier assembly collides with the reflective and refractive member 604 on the X-axis, and the second damper 605-2 and the third damper 605-3 may be configured to absorb and / or reduce the impact when the carrier assembly collides with the reflective and refractive member 604 on the Y-axis. Although not shown in the figures, the reflective and refractive member 604 may also include a fourth damper to absorb and / or reduce the impact when the carrier assembly collides with the reflective and refractive member 604 on the Y-axis. When the reflective and refractive member 604 faces the carrier assembly, the fourth damper may, for example, be disposed on a portion of the carrier assembly facing the Z-axis.

[0180] Reference Figure 20 and Figure 21 Carrier assembly (e.g., Figures 4 to 7 Carrier assembly 305, Figures 8 to 15 Carrier assembly 405 and / or Figures 16 to 19 The portion of the carrier assembly 505 facing the reflective and refractive member 604 that is provided with the damper 605 may not include a separate damper. Furthermore, the carrier assembly (e.g., Figures 4 to 7 Carrier assembly 305, Figures 8 to 15 Carrier assembly 405 and / or Figures 16 to 19 The portion of the carrier assembly 505 facing the reflective and refractive component 604 that is not equipped with a shock absorber 605 may be equipped with a separate shock absorber.

[0181] For example, refer to Figure 20 Individual dampers can be installed on the portion of the carrier assembly facing the reflective and refractive member 604 where the damper 605 is not located (e.g., Figure 15 The second shock absorber 445-2 and the third shock absorber 445-3, or Figure 19 The second shock absorber 535-2 and the third shock absorber 535-3). In another example, refer together. Figure 20 and Figure 21 Another shock absorber can also be installed (e.g., Figure 19The fourth shock absorber 535-4). The electronic device according to the various embodiments can be one of a variety of types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to embodiments of this disclosure, the electronic device is not limited to the electronic devices described above.

[0182] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions for the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to an item may include one or more things. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one or all possible combinations of the items listed together in the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used only to distinguish the respective component from another component and do not limit the component in other respects (e.g., importance or order). It will be understood that if, when the terms “operational location” or “communication location” are used, or when the terms “operational location” or “communication location” are not used, an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element),” it means that the first element can be directly (e.g., wiredly) combined with the second element, wirelessly combined with the second element, or combined with the second element via a third element.

[0183] As used herein, the term "module" can include units implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0184] The various embodiments set forth herein can be implemented as software (e.g., a program) including one or more instructions readable by a machine (e.g., an electronic device) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, with or without one or more other components, the processor of the machine (e.g., an electronic device) can invoke and execute at least one of the one or more instructions stored in the storage medium. This enables the machine to be operated to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media can be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0185] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be distributed online (e.g., downloaded or uploaded), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). If it is distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a relay server).

[0186] According to various embodiments, each of the above components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0187] According to embodiments of this disclosure, a camera module 300, 400, or 500 may be provided. The camera module 300, 400, or 500 may include: a camera housing 301, 401, or 501; a lens assembly 302 including at least one lens 302a and a lens barrel 302b; a reflecting and refractive member 304, 404, 504, or 604 supported by the camera housing and configured to alter the optical path passing through the lens assembly at least twice; an image sensor 303, 403, or 403; a carrier assembly 305, 405, or 505 having a shape at least partially surrounding the reflecting and refractive member; a drive member 360, 460, or 560 configured to move the carrier assembly along a first direction or along a direction perpendicular to the first direction, or configured to rotate the carrier assembly about the first direction; and a shock absorber 435, 445, 535, or 605 formed on at least one of the portion of the carrier assembly facing the reflecting and refractive member or the portion of the reflecting and refractive member facing the carrier assembly.

[0188] According to an embodiment, carrier assembly 305, 405, or 505 may include: an AF carrier configured to move an image sensor along a first direction; and an OIS carrier configured to move an image sensor along a direction perpendicular to the first direction.

[0189] According to an embodiment, the OIS carrier can be housed inside the AF carrier.

[0190] According to an embodiment, the first guide ball can be disposed between the AF carrier and the camera housing, and the second guide ball can be disposed between the AF carrier and the OIS carrier.

[0191] According to an embodiment, the OIS carrier may at least partially face the reflective and refractive member, and the shock absorber may be formed on at least one of the surface of the OIS carrier facing the reflective and refractive member or the surface of the reflective and refractive member facing the OIS carrier.

[0192] According to an embodiment, carrier assembly 305, 405 or 505 may further include intermediate guide carrier 340 or 440.

[0193] According to an embodiment, the intermediate guide carrier may at least partially face the reflective and refractive member, and the shock absorber may be formed on at least one of the surface of the intermediate guide carrier facing the reflective and refractive member or the surface of the reflective and refractive member facing the intermediate guide carrier.

[0194] According to an embodiment, the AF carrier can be housed inside the OIS carrier.

[0195] According to an embodiment, the first guide ball can be disposed between the AF carrier and the OIS carrier, and the second guide ball can be disposed between the OIS carrier and the camera housing.

[0196] According to an embodiment, the AF carrier may at least partially face the reflective and refractive member, and the shock absorber may be formed on at least one of the surface of the AF carrier facing the reflective and refractive member or the surface of the reflective and refractive member facing the AF carrier.

[0197] According to an embodiment, carrier assembly 305, 405 or 505 may further include intermediate guide carrier 340 or 440.

[0198] According to an embodiment, the carrier assembly may have a shape surrounding the reflective and refractive elements in at least three directions.

[0199] According to an embodiment, the shock absorber may be formed on at least one of three surfaces of the carrier assembly facing the reflective and refractive elements in different directions, or on at least one of three surfaces of the reflective and refractive elements facing the carrier assembly.

[0200] According to an embodiment, the reflecting and refracting components can be hexahedrons with an overall parallelogram or trapezoidal cross section.

[0201] According to an embodiment, the reflecting and refracting components may include at least two prisms.

[0202] According to embodiments of this disclosure, camera modules 300, 400, and 500 may be provided. Camera module 300, 400, or 500 may include: a camera housing 301, 401, or 501; a lens assembly 302 including at least one lens 302a and a lens barrel 302b; a reflecting and refractive member 304, 404, 504, or 604 supported by the camera housing and configured to alter the light path passing through the lens assembly at least twice; an image sensor 303, 403, or 403 including an imaging plane facing a first direction and converting light incident on the imaging plane into an electrical signal; and a carrier assembly 305, 405, or 505 having a shape at least partially surrounding the reflecting and refractive member and including a first carrier 320, 420, or 520 and a second carrier 330, 405, or 505. 30 or 530, the first carrier 320, 420 or 520 is configured to move horizontally in at least two intersecting directions on a plane perpendicular to the first direction, the second carrier 330, 430 or 530 is configured to move vertically along the first direction; the drive member 360, 460 or 560 includes a magnet disposed on the carrier assembly and a coil disposed at a position corresponding to the magnet, and provides a driving force for the horizontal movement of the first carrier and the vertical movement of the second carrier; and the shock absorber 435, 445, 535 or 605 is formed on at least one of the portion of the carrier assembly facing the reflective and refractive member or the portion of the reflective and refractive member facing the carrier assembly.

[0203] According to an embodiment, the OIS carrier 320 can be housed inside the AF carrier 330.

[0204] The AF carrier 330 can be housed inside the OIS carrier 320.

[0205] According to an embodiment, carrier assembly 305, 405 or 505 may further include intermediate guide carrier 340 or 440.

[0206] According to an embodiment, the reflecting and refracting components can be hexahedrons with an overall parallelogram or trapezoidal cross section.

[0207] According to embodiments of this disclosure, an electronic device comprising various camera modules according to the above embodiments may be provided.

[0208] This disclosure has been described with reference to various embodiments; however, it should be understood that these embodiments are not intended to limit the scope of this disclosure, but are provided for illustrative purposes. It will be readily understood by those skilled in the art that various changes can be made to the form and detailed construction of the embodiments, including the appended claims and their equivalents, without departing from the overall perspective of this disclosure.

Claims

1. A camera module (300, 400, 500), comprising: Camera housings (301, 401, 501); The lens assembly (302) includes at least one lens (302a) and a lens barrel (302b). Reflective and refractive components (304, 404, 504, 604) are supported by the camera housing and configured to alter the optical path passing through the lens assembly at least twice; Image sensors (303, 403, 403); The carrier assembly (305, 405, 505) has a shape that at least partially surrounds the reflective and refractive member; The drive member (360, 460, 560) is configured to move the carrier assembly along a first direction or along a direction perpendicular to the first direction, or is configured to rotate the carrier assembly about the first direction. as well as Shock absorbers (435, 445, 535, 605) are formed on at least one of the portion of the carrier assembly facing the reflective and refractive member or the portion of the reflective and refractive member facing the carrier assembly.

2. The camera module according to claim 1, wherein, The carrier assembly (305, 405, 505) includes: An autofocus (AF) carrier is configured to move the image sensor along the first direction; and An optical image stabilization (OIS) carrier is configured to move the image sensor along the direction perpendicular to the first direction.

3. The camera module according to claim 1 or 2, wherein, The OIS carrier is housed inside the AF carrier.

4. The camera module according to claim 3, wherein, The first guide ball is disposed between the AF carrier and the camera housing, and The second guide ball is disposed between the AF carrier and the OIS carrier.

5. The camera module according to any one of claims 1 to 4, wherein, The OIS carrier faces at least partially the reflective and refractive member, and the damper is formed on at least one of the surface of the OIS carrier facing the reflective and refractive member or the surface of the reflective and refractive member facing the OIS carrier.

6. The camera module according to any one of claims 1 to 4, wherein, The carrier assembly (305, 405, 505) also includes an intermediate guide carrier (340, 440).

7. The camera module according to claim 6, wherein, The intermediate guide carrier faces at least partially the reflective and refractive member, and the shock absorber is formed on at least one of the surface of the intermediate guide carrier facing the reflective and refractive member or the surface of the reflective and refractive member facing the intermediate guide carrier.

8. The camera module according to claim 1 or 2, wherein, The AF carrier is housed inside the OIS carrier.

9. The camera module according to claim 8, wherein, The first guide ball is disposed between the AF carrier and the OIS carrier, and The second guide ball is disposed between the OIS carrier and the camera housing.

10. The camera module according to claim 8 or 9, wherein, The AF carrier faces at least partially the reflective and refractive member, and the shock absorber is formed on at least one of the surface of the AF carrier facing the reflective and refractive member or the surface of the reflective and refractive member facing the AF carrier.

11. The camera module according to any one of claims 8 to 10, wherein, The carrier assembly (305, 405, 505) also includes an intermediate guide carrier (340, 440).

12. The camera module according to any one of claims 1 to 11, wherein, The carrier assembly has a shape surrounding the reflective and refractive member in at least three directions.

13. The camera module according to claim 12, wherein, The shock absorber is formed on at least one of three surfaces of the carrier assembly facing the reflective and refractive member in different directions, or on at least one of three surfaces of the reflective and refractive member facing the carrier assembly.

14. The camera module according to any one of claims 1 to 13, wherein, The reflecting and refracting components are hexahedrons with an overall parallelogram or trapezoidal cross-section.

15. The camera module according to any one of claims 1 to 14, wherein, The reflective and refractive components include at least two prisms.

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