High-flow wide-temperature-range adaptive thermal grease suitable for contact surface of heating body and heat dissipation equipment and preparation method of high-flow wide-temperature-range adaptive thermal grease

Abstract

The invention relates to the technical field of heat conduction materials, in particular to high-flow wide-temperature-range adaptive thermal grease suitable for a contact surface of a heating body and heat dissipation equipment and a preparation method of the high-flow wide-temperature-range adaptive thermal grease. The composition is prepared from the following raw materials in percentage by weight: 25-45% of organic silicone matrix; 50-65% of heat conduction powder; 3-10% of an activity promoter; the balance is an auxiliary agent; the active promoter is composed of diether fluorene, a flexible organic silicon matrix and an interface coupling agent in a weight ratio of 1: (1-3): (2-3); and the interface coupling agent is amino copolymerized oligomer siloxane and / or glycidyl ether oxypropyl organic silicon oligomer. The activity promoter is composed of diether fluorene, a flexible organic silicon matrix and an interface coupling agent, so that a better synergistic effect is achieved, and the high fluidity and wide temperature range adaptability of the thermal grease are further improved.

Description

Technical Field

[0001] This application relates to the field of thermal conductive materials technology, and more specifically, it relates to a high-flow, wide-temperature-range adaptable thermal paste suitable for the contact surface between a heat-generating element and a heat-dissipating device, and its preparation method. Background Technology

[0002] In today's era of rapid technological development, electronic information technology has made remarkable progress. Power amplifiers, transistors, vacuum tubes, CPUs, and other electronic components, as core components of modern electronic devices, are showing a continuous upward trend in power density. With the continuous improvement of the performance of electronic components, the heat they generate during operation is also increasing dramatically. These electronic components, as heat-generating bodies, play a crucial role in electrical equipment, and their stable operation directly affects the performance of the entire device. However, if the large amount of heat generated cannot be dissipated in a timely and effective manner, it will have a serious negative impact on the performance of electrical equipment.

[0003] With the continuous development of electronic technology, electrical equipment is constantly moving towards miniaturization and integration. This trend leads to a more compact layout of electronic components and a further increase in power density, resulting in increasingly prominent heat dissipation problems. Excessive heat dissipation not only reduces the performance stability of electrical equipment but may also cause a series of safety hazards and even shorten the equipment's lifespan. This problem is prevalent in various electronic devices, from everyday smartphones and computers to large-scale electrical equipment in industrial fields, all facing the severe challenge of heat dissipation. Therefore, solving the heat dissipation problem of heat dissipation is of paramount importance for ensuring the safe and reliable operation of electrical equipment.

[0004] To address the heat dissipation problem of heat-generating components, applying thermal paste between the heat-generating component and the heat dissipation facilities (such as heat sinks, heat exchange strips, and housings) has become a widely used heat dissipation solution. Thermal paste has a certain degree of thermal conductivity, which can fill the tiny gaps between the contact surfaces, reducing contact thermal resistance and thus improving the efficiency of heat transfer from the heat-generating component to the heat dissipation facilities to a certain extent. In practical applications, thermal paste has a wide range of uses, covering various types of electrical equipment. Different types of thermal paste may differ in composition and performance, but the overall goal is to improve heat dissipation.

[0005] Some thermal pastes may focus on increasing thermal conductivity to transfer heat more quickly, while others may prioritize stability in specific environments, ensuring good heat dissipation performance even under complex operating conditions. Furthermore, when choosing a thermal paste, its compatibility with heat-generating components and cooling systems, as well as its performance under different operating conditions, must be considered. For example, for equipment with high heat dissipation requirements, a thermal paste with high thermal conductivity may be necessary; while for equipment operating in harsh environments, a thermal paste with good stability and adaptability is required.

[0006] Existing thermal pastes face several insurmountable problems in practical applications. Firstly, they struggle to simultaneously meet the requirements of high fluidity and a wide temperature range. High fluidity is crucial for thermal pastes, enabling them to more evenly fill gaps in the contact surface during application, especially for complex surfaces where good fluidity is key to effective heat dissipation. Wide temperature range adaptability is essential for coping with varying operating temperatures; the thermal paste needs to maintain stable thermal conductivity over a broad temperature range. However, existing thermal pastes often fail to possess both characteristics simultaneously, significantly limiting their practical application.

[0007] Secondly, existing thermal pastes are prone to accelerated aging under prolonged exposure to extreme temperatures. This directly leads to a decline in the performance of the thermal paste, potentially causing problems such as peeling, cracking, hardening, thickening, or solidification. Once these problems occur, the thermal paste will struggle to fill the tiny gaps between the heat source and the heat dissipation device, failing to adapt to the thermal expansion and contraction caused by temperature changes, further increasing contact thermal resistance and significantly reducing heat dissipation effectiveness. Although existing technologies have improved the wide-temperature-range performance of thermal pastes to some extent by adding additives such as antioxidants and cold-resistant agents, their performance in terms of high fluidity and long-term adhesion stability remains unsatisfactory, failing to meet the increasingly stringent heat dissipation requirements of electronic devices. Summary of the Invention

[0008] The purpose of this application is to overcome the above-mentioned technical problems and provide a high-flow, wide-temperature-range adaptable heat dissipation paste suitable for the contact surface between a heating element and a heat dissipation device, as well as a preparation method thereof.

[0009] Firstly, a highly fluid, wide-temperature-range adaptable heat dissipation paste suitable for the contact surface between a heat-generating element and a heat dissipation device, comprising the following raw materials by weight percentage: 25-45% silicone matrix; Thermally conductive powder 50-65%; 3-10% of the activity promoter; The remainder is for additives; The active promoter is composed of diether fluorene, a flexible organosilicon matrix, and an interfacial coupling agent in a weight ratio of 1:(1-3):(2-3); the interfacial coupling agent is an amino copolymer oligomer siloxane and / or glycidyl etheroxypropyl organosilicon oligomer.

[0010] By adopting the above technical solutions, the thermal paste can maintain its paste state for a long time at temperatures ranging from -50℃ to 230℃, which is beneficial for heat conduction and heat dissipation between the heat source and the heat dissipation equipment, ensuring the stable performance of electrical equipment. It can improve fluidity by reducing frictional resistance between powders through interfacial coupling agents, and the steric hindrance and lubrication effect of diether fluorene prevent the formation of powder network structures, resulting in a significantly lower viscosity of the thermal paste at the same filler content compared to traditional products, with better flowability and smoother application. It can improve wide-temperature performance; the chemical bonds formed by the interfacial coupling agent at high temperatures prevent "heat oil separation," and the silicone matrix is ​​resistant to high temperatures. At low temperatures, the combination of diether fluorene and the flexible silicone matrix inhibits the hardening trend of the system, and the system has stronger resistance to thermal stress from thermal cycling, reducing the risk of cracking and aging. It can enhance adhesion stability; the interfacial coupling agent combines with the chip shell or heat sink substrate to reduce contact thermal resistance, and the strong cohesive force and fluidity allow the silicone grease to fully spread and fill micropores, forming a good thermal interface layer and avoiding performance degradation.

[0011] Preferably, the interface coupling agent is composed of amino copolymer oligomer siloxane and glycidyl etheroxypropyl organosilicon oligomer.

[0012] By adopting the above technical solution, the interfacial coupling agent composed of amino copolymer oligomer siloxane and glycidyl etheroxypropyl organosilicon oligomer can chemically bond or strongly adsorb to the hydroxyl groups on the surface of thermally conductive powder, and can be compatible with, entangled with or even cross-linked with the organosilicon matrix. This greatly improves the compatibility between the powder and the base oil, reduces the interfacial thermal resistance, and prevents the powder from agglomerating and settling after high temperature or long-term storage. It can also partially bond with the chip shell or heat sink substrate to reduce contact thermal resistance. The chemical bond formed can effectively prevent "heat oil separation" and enhance the high-temperature stability of the thermal paste. Combined with other raw materials in the thermal paste, it can also improve the fluidity, wide temperature range performance and adhesion stability of the thermal paste.

[0013] Preferably, the flexible organosilicon matrix is ​​a methacryloyloxyfunctionalized oligosiloxane and / or a methacryloyloxypropyl organosilicon oligomer.

[0014] By adopting the above technical solution, using methacryloyloxyfunctionalized oligosiloxane and / or methacryloyloxypropyl organosilicon oligomers as flexible organosilicon matrix, a robust yet flexible "middle layer structure" can be built on the anchored foundation. This reinforces the anchor points while providing a buffer and transition for the superstructure. A multifunctional, stable, and robust organic interface layer is constructed on the surface of each thermally conductive powder. This interface layer is firmly bonded to the powder and has excellent compatibility with the organosilicon matrix, giving the thermal paste low viscosity, high thermal conductivity, anti-settling, aging resistance, and excellent workability. This greatly enhances the technical content and effectiveness of the "activation promoter," transforming the formulation from a simple physical mixing system into a high-performance material platform with interfacial chemical design, rheological control, and potential chemical reaction capabilities. This helps solve the flowability problem under high filling volume and provides a key guarantee for the long-term wide-temperature-range reliability of the thermal paste.

[0015] Preferably, the organosilicone matrix includes polydimethylsiloxane, silicone resin, and modified silicone oil.

[0016] By adopting the above technical solutions, polydimethylsiloxane, as the base carrier, can provide fluidity, wide temperature range and insulation, giving the thermal paste high fluidity and basic stability; silicone resin can thicken, prevent sedimentation, resist pumping out and improve adhesion, giving the thermal paste high stability, low oil separation degree and paste skeleton; modified silicone oil can improve interfacial compatibility, reduce viscosity, enhance wetting and resist extreme low temperature, giving the thermal paste high thermal conductivity potential, low viscosity and excellent interfacial stability.

[0017] Furthermore, by weight percentage, polydimethylsiloxane (PDMS) is used as the base carrier at 80-95%; silicone resin at 3-18%; and modified silicone oil at 1-10%.

[0018] Preferably, the modified silicone oil is one or a combination of more than one of phenyl silicone oil, polyether modified silicone oil, epoxy modified silicone oil, and amino modified silicone oil.

[0019] By adopting the above technical solution, a thermal paste is prepared using an organosilicone matrix, thermally conductive powder, active promoter, and additives as raw materials. The active promoter is composed of diether fluorene, a flexible organosilicone matrix, and an interface coupling agent. The interface coupling agent can reduce the frictional resistance between powders, prevent thermal oil separation, and reduce contact thermal resistance by bonding with the chip shell or heat sink substrate. Diether fluorene can prevent the formation of powder network structure and inhibit the low-temperature hardening trend. The flexible organosilicone matrix can inhibit the low-temperature hardening trend of the system and buffer thermal stress. On this basis, one or more of phenyl silicone oil, polyether modified silicone oil, epoxy modified silicone oil, and amino modified silicone oil are used as modified silicone oils, which can improve interfacial compatibility, reduce viscosity, enhance wetting, and resist extreme low temperatures, giving the thermal paste high thermal conductivity potential, low viscosity, and excellent interfacial stability.

[0020] Preferably, the thermally conductive powder is one or more of the following: thermally conductive oxides, thermally conductive nitrides, metal powders, and thermally conductive nanomaterial powders.

[0021] By adopting the above technical solution, using one or more of thermally conductive oxides, thermally conductive nitrides, metal powders, and thermally conductive nanomaterial powders as thermally conductive powders, the thermal paste can have a good thermal conductivity. At the same time, combined with the raw material composition and active promoter formulation of the thermal paste in claim 1, the thermal paste can maintain a grease state for a long time at a temperature of -50℃ to 230℃, and has high fluidity, wide temperature range adaptability, good thermal conductivity, anti-settling, aging resistance and excellent workability. It can enhance the wettability and contact stability with the surface of the heat sink / chip and reduce the contact thermal resistance.

[0022] Preferably, the thermally conductive oxide is one or more of aluminum oxide, zinc oxide, and magnesium oxide; the thermally conductive nitride is aluminum nitride and / or boron nitride; the metal powder is silver powder and / or aluminum powder; and the thermally conductive nanomaterial powder is nanodiamond and / or carbon nanotubes.

[0023] By adopting the above technical solution, using one or more of alumina, zinc oxide, and magnesium oxide as thermally conductive oxides, aluminum nitride and / or boron nitride as thermally conductive nitrides, silver powder and / or aluminum powder as metal powders, and nanodiamond and / or carbon nanotubes as thermally conductive nanomaterial powders, the combination of these different types of thermally conductive powders helps to improve the thermal conductivity of the thermal paste, enabling it to more effectively transfer the heat generated by the heat source and meet the heat dissipation requirements of electronic devices. Simultaneously, combined with the basic structure of the thermal paste consisting of an organosilicone matrix, thermally conductive powders, active promoters, and additives, where the active promoters consist of diether fluorene, a flexible organosilicone matrix, and an interfacial coupling agent, it can maintain a grease-like state for a long time at temperatures ranging from -50℃ to 230℃. It exhibits high fluidity, wide temperature range adaptability, and good thermal conductivity, improving the heat dissipation efficiency between the heat source and the heat dissipation equipment, ensuring the stability of electrical equipment performance, and enhancing the adhesion stability of the thermal paste, preventing problems such as peeling and cracking due to long-term use that could lead to a decrease in heat dissipation performance.

[0024] Preferably, the thermally conductive powder is obtained by uniformly mixing aluminum oxide, zinc oxide, boron nitride, silver powder, nanodiamond, and carbon nanotubes; the thermally conductive powder is composed of the following raw materials in parts by weight: aluminum oxide 1.5-5.7 parts; zinc oxide 1.3-2.7 parts; boron nitride 2.2-3.5 parts; silver powder 0.1-0.7 parts; nanodiamond 0.1-0.5 parts; carbon nanotubes 0.2-0.5 parts.

[0025] By adopting the above technical solution, the thermally conductive powder of the thermal paste is composed of a specific weight proportion of alumina, zinc oxide, boron nitride, silver powder, nanodiamond, and carbon nanotubes, which can give the thermal paste a better thermal conductivity. At the same time, combined with the raw material composition of the thermal paste and the formulation of the active promoter, the fluidity of the thermal paste can be significantly improved, the performance over a wide temperature range (including high temperature stability, low temperature performance, and thermal cycling stability) can be improved, and the adhesion stability can be enhanced. A multifunctional, stable, and firm organic interface layer is constructed on the surface of each thermally conductive powder, so that the interface layer is firmly bonded to the powder and has excellent compatibility with the organosilicon matrix. It also endows the thermal paste with low viscosity, high thermal conductivity, anti-settling, aging resistance, and excellent workability.

[0026] Preferably, the additive is one or more of antioxidants, pigments, thixotropic agents, and solvents.

[0027] By adopting the above technical solution, one or more of the following additives—antioxidants, pigments, thixotropic agents, and solvents—are selected. Antioxidants prevent the thermal paste from oxidizing, extending its service life; pigments can change the color of the thermal paste to meet different usage or labeling requirements; thixotropic agents can adjust the rheological properties of the thermal paste, giving it good flowability during application and allowing it to maintain its shape after application; solvents can improve the processing and application properties of the thermal paste, facilitating its preparation and use. Overall, these additives optimize the performance of the thermal paste, enabling it to better meet practical application needs.

[0028] Preferably, it is prepared by the following method: weigh the thermally conductive powder and the active promoter according to the weight percentage, mix them evenly to obtain mixture A; add the silicone matrix and additives to mixture A, mix evenly to obtain the heat dissipation paste.

[0029] By adopting the above technical solution, the thermally conductive powder and the active promoter are first mixed evenly to obtain mixture A, and then an organosilicone matrix and additives are added and mixed evenly to obtain a heat dissipation paste. This preparation method ensures that the raw materials are fully mixed, which can ensure that the active promoter builds a multifunctional, stable and firm organic interface layer on the surface of the thermally conductive powder. This gives the heat dissipation paste low viscosity, high thermal conductivity, anti-settling, aging resistance and excellent workability, and ensures that the heat dissipation paste has high fluidity, wide temperature range adaptability and good thermal conductivity and adhesion stability.

[0030] In summary, this application includes at least one of the following beneficial technical effects: 1. Improved flowability: The interfacial coupling agent reduces frictional resistance between powder particles, while the steric hindrance and lubrication of the diether fluorene prevent the formation of a powder network structure, resulting in a lower viscosity of the thermal paste at the same filler content compared to traditional products, and better flowability and smoothness of application; 2. Improved performance over a wide temperature range: The chemical bonds formed by the interfacial coupling agent at high temperatures prevent "heat oil separation," and the silicone matrix has good high-temperature resistance. At low temperatures, the combination of diether fluorene and the flexible silicone matrix inhibits the hardening trend of the system, and the system has strong resistance to thermal stress from thermal cycling, reducing the risk of cracking and aging; 3. Enhanced adhesion stability: The interface coupling agent combines with the chip shell or heat sink substrate to reduce contact thermal resistance. The strong cohesive force and fluidity allow the silicone grease to fully spread and fill the micropores, forming a thermal interface layer, improving contact stability and reliability, and avoiding performance degradation. Detailed Implementation

[0031] The present application will be further described in detail below with reference to the embodiments.

[0032] The molecular structure of dietherfluorene is as follows: The viscosity-average molecular weight of polydimethylsiloxane is 100,000-120,000; Silicone resin, Shandong Shouhua Chemical Co., Ltd. SH-25XY5-8; Phenyl silicone oil, Shin-Etsu KF56A; Amino-co-oligomeric siloxane, brand: Aikepu, model: Crosile-5203; Glycidyl etheroxypropyl organosilicon oligomers, EP904; Methacryloxyfunctionalized oligosiloxane, brand Aikop, model Crosile-7270; Methacryloxypropyl organosilicon oligomer, Ecotion MA903; Alumina and zinc oxide are both sieved through an 800-mesh sieve; boron nitride and silver powder are both sieved through a 1200-mesh sieve; the particle size of nanodiamond, carbon nanotubes, and nano silica is less than 100nm; the above particle size specifications can be interlocked to form a stable thermally conductive heat dissipation paste. Example

[0033] Example 1 A method for preparing a high-flow, wide-temperature-range adaptable heat dissipation paste suitable for the contact surface between a heating element and a heat dissipation device, comprising the following steps: According to the weight percentage, diether fluorene was dissolved in ethyl acetate to obtain a diether fluorene dispersion; 65 parts of thermally conductive powder and interfacial coupling agent were weighed and placed in a planetary mixer and mixed for 2 hours at a revolution speed of 61 r / min and a rotation speed of 122 r / min to ensure thorough mixing; then the diether fluorene dispersion was added and the mixture was stirred for another hour to ensure thorough mixing; then the flexible organosilicon matrix was added and the mixture was stirred for another hour; the mixture was heated to 100°C to remove all the ethyl acetate, resulting in activated thermally conductive powder; Weigh 25 parts of silicone matrix and 2 parts of additives and add them to the activated thermally conductive powder. Continue stirring for 1 hour to ensure thorough mixing. Then place the mixture in a degassing machine to remove bubbles and obtain the thermal paste.

[0034] The thermally conductive powder, by weight, is obtained by uniformly mixing 5 parts alumina, 2 parts zinc oxide, and 3 parts boron nitride. The amount of the activity promoter is 8 parts by weight, and the weight ratio of diether fluorene, flexible organosilicon matrix, and interfacial coupling agent in the activity promoter is 1:1:3. The organosilicon matrix is ​​composed of polydimethylsiloxane, silicone resin, and modified silicone oil in a weight ratio of 8.5:1:0.5. The modified silicone oil is phenyl silicone oil. The additives are composed of antioxidant 1010 and nano-silica in a weight ratio of 1:3.

[0035] Example 2 The difference between Examples 2-3 and Example 1 lies in the source of the raw materials; as shown in Table 1. Table 1. Amounts of raw materials used in Examples 1-3 Example 4 The difference between Example 4 and Example 2 is that the interface coupling agent is a glycidyl etheroxypropyl organosilicon oligomer.

[0036] Example 5 The difference between Example 5 and Example 2 is that the interface coupling agent is composed of amino copolymer oligomer siloxane and glycidyl etheroxypropyl organosilicon oligomer.

[0037] Example 6 The difference between Example 6 and Example 5 is that, by weight, the thermally conductive powder is obtained by uniformly mixing 3 parts of aluminum oxide, 3 parts of zinc oxide, 2.5 parts of boron nitride, 0.5 parts of silver powder, 0.5 parts of nanodiamond, and 0.5 parts of carbon nanotubes.

[0038] Example 7 The difference between Example 7 and Example 6 is that the flexible organosilicon matrix is ​​composed of methacryloyloxyfunctionalized oligosiloxane and methacryloyloxypropyl organosilicon oligomer in a weight ratio of 3:1.

[0039] Comparative Example 1 The difference between Comparative Example 1 and Example 2 is that the active promoter was replaced with an equal amount of silane coupling agent KH550.

[0040] Comparative Example 2 The difference between Comparative Example 2 and Example 2 is that the diether fluorene was replaced in equal amounts with a flexible organosilicon matrix.

[0041] Comparative Example 3 The difference between Comparative Example 3 and Example 2 is that the flexible organosilicon substrate is replaced with an interfacial coupling agent in equal amounts.

[0042] Performance test The thermal pastes obtained in Examples 1-7 and Comparative Examples 1-3 were used for the following performance tests.

[0043] Detection methods / test methods Sample 1: Thermal paste obtained from Examples 1-7 and Comparative Examples 1-3.

[0044] Experimental Sample 1: The heat dissipation paste obtained from Examples 1-7 and Comparative Examples 1-3 was applied to the surface of an aluminum plate with a coating thickness of 2 mm to obtain Experimental Sample 1.

[0045] Sample 2 and Experimental Sample 2: The thermal pastes obtained from Examples 1-7 and Comparative Examples 1-3 and Experimental Sample 1 (placed at a 45-degree angle) were placed in an oven at 230°C for 7 days. After being taken out, they were placed at 25°C and 60% relative humidity for 2 hours to obtain the corresponding Sample 2 and Experimental Sample 2.

[0046] Sample 3 and Experimental Sample 3: The thermal pastes obtained from Examples 1-7 and Comparative Examples 1-3 and Experimental Sample 1 (placed at a 45-degree angle) were placed in an experimental chamber at -50°C for 7 days. After being taken out, they were placed at 25°C and 60% relative humidity for 2 hours to obtain the corresponding Sample 3 and Experimental Sample 3.

[0047] Stability: Observe whether sample 2-3 shows phenomena such as stratification or precipitation, and observe whether experimental sample 2-3 shows phenomena such as dripping, peeling, cracking, or flaking. If any of the above phenomena occur, they are considered unqualified.

[0048] Cone penetration: The cone penetration of samples 1-3 (25℃) is tested according to GB / T 269-2023, which is 0.1mm. The heat resistance change rate 1 is equal to 1-{(|cone penetration of sample 1-cone penetration of sample 2| / cone penetration of sample 1)*100%}, and the temperature change rate 1 is equal to 1-{(|cone penetration of sample 1-cone penetration of sample 3| / cone penetration of sample 1)*100%.

[0049] Thermal conductivity: The thermal conductivity of samples 1-3 was tested according to ASTM D5470; the thermal resistance change rate 2 is equal to 1-{(|cone penetration of sample 1-cone penetration of sample 2| / cone penetration of sample 1)*100%}, and the temperature change rate 2 is equal to 1-{(|cone penetration of sample 1-cone penetration of sample 3| / cone penetration of sample 1)*100%}.

[0050] When both the heat resistance change rate 1-2 and the temperature resistance change rate 1-2 are within 1%, it is recorded as wide temperature range grade A; 1% ≤ change rate < 5%, it is recorded as wide temperature range grade B; and change rate ≥ 5%, it is recorded as wide temperature range grade C.

[0051] Oil separation degree: The oil separation degree is tested according to HG-T-2502-1993 (200℃, 24h). When the oil separation degree is less than 1%, it is considered qualified.

[0052] The experimental data are detailed in Table 2. Table 2. Experimental data of Examples 1-7 and Comparative Examples 1-3 Explanation of the rate of change grades: Taking the rate of change grades of Example 1 as an example, BBBA represent the rate of change grades of heat resistance rate of change 1, heat resistance rate of change 2, temperature resistance rate of change 1, and temperature resistance rate of change 2, respectively.

[0053] Analysis was conducted in conjunction with Example 2 and Comparative Examples 1-3, and with reference to Table 2: In Comparative Example 1, the active promoter was replaced with an equal amount of silane coupling agent KH550; in Comparative Example 2, the diether fluorene was replaced with an equal amount of flexible organosilicon matrix; and in Comparative Example 3, the flexible organosilicon matrix was replaced with an equal amount of interfacial coupling agent. Compared with Example 2, all three examples showed unsatisfactory stability, and the rate of change in grade also decreased to grade C. Furthermore, the thermal conductivity and cone penetration were reduced. This indicates that the active promoter obtained by combining diether fluorene, flexible organosilicon matrix, and interfacial coupling agent in this application, when used in the thermal paste system, achieves better overall performance, obtains better heat and cold resistance stability, and maintains its effectiveness.

[0054] Analysis is conducted by combining Examples 2 and 5 with Table 2: The thermal conductivity and cone penetration of Example 5 are both greater than those of Example 2, and the rate of change of Example 5 is in Grade A. This indicates that Example 5 is better than Example 2 in terms of fluidity and wide temperature range stability. This further shows that the use of an interfacial coupling agent composed of amino copolymer oligomer siloxane and glycidyl ether oxypropyl organosilicon oligomer has a synergistic effect and further improves the overall performance.

[0055] Analysis is conducted by combining Examples 2 and 5 with Table 2: The thermal conductivity and cone penetration of Example 7 are greater than those of Example 5, indicating that the thermally conductive powder is uniformly mixed from alumina, zinc oxide, boron nitride, silver powder, nanodiamond, and carbon nanotubes. Combined with the sex promoter of this application, which is composed of diether fluorene, flexible organosilicon matrix, and interfacial coupling agent, it has a better synergistic effect, thereby achieving better thermal conductivity and flow performance.

[0056] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of this application.

Claims

1. A high-flow, wide-temperature-range adaptable heat dissipation paste suitable for the contact surface between a heating element and a heat dissipation device, characterized in that, Raw materials by weight percentage composition: 25-45% silicone matrix; Thermally conductive powder 50-65%; Activity promoters 3-10%; The remainder is for additives; The active promoter is composed of diether fluorene, a flexible organosilicon matrix, and an interfacial coupling agent in a weight ratio of 1:(1-3):(2-3); the interfacial coupling agent is an amino copolymer oligomer siloxane and / or glycidyl etheroxypropyl organosilicon oligomer.

2. The high-flow, wide-temperature-range adaptable heat dissipation paste according to claim 1, suitable for the contact surface between a heating element and a heat dissipation device, is characterized in that: The interface coupling agent is composed of amino copolymer oligomer siloxane and glycidyl etheroxypropyl organosilicon oligomer.

3. The high-flow, wide-temperature-range adaptable heat dissipation paste according to claim 1, suitable for the contact surface between a heating element and a heat dissipation device, is characterized in that: The flexible organosilicon matrix is ​​a methacryloyloxyfunctionalized oligosiloxane and / or a methacryloyloxypropyl organosilicon oligomer.

4. The high-flow, wide-temperature-range adaptable heat dissipation paste according to claim 1, suitable for the contact surface between a heating element and a heat dissipation device, is characterized in that: The organosilicone matrix includes polydimethylsiloxane, silicone resin, and modified silicone oil.

5. The high-flow, wide-temperature-range adaptable heat dissipation paste according to claim 1, suitable for the contact surface between a heating element and a heat dissipation device, is characterized in that: The modified silicone oil is one or a combination of multiple of phenyl silicone oil, polyether modified silicone oil, epoxy modified silicone oil, and amino modified silicone oil.

6. The high-flow, wide-temperature-range adaptable heat dissipation paste according to claim 1, suitable for the contact surface between a heating element and a heat dissipation device, is characterized in that: The thermally conductive powder is one or more of the following: thermally conductive oxides, thermally conductive nitrides, metal powders, and thermally conductive nanomaterial powders.

7. The high-flow, wide-temperature-range adaptable heat dissipation paste according to claim 6, suitable for the contact surface between a heating element and a heat dissipation device, is characterized in that: The thermally conductive oxide is one or more of aluminum oxide, zinc oxide, and magnesium oxide; the thermally conductive nitride is aluminum nitride and / or boron nitride; the metal powder is silver powder and / or aluminum powder; and the thermally conductive nanomaterial powder is nanodiamond and / or carbon nanotubes.

8. The high-flow, wide-temperature-range adaptable heat dissipation paste according to claim 7, suitable for the contact surface between a heating element and a heat dissipation device, characterized in that: The thermally conductive powder is obtained by uniformly mixing aluminum oxide, zinc oxide, boron nitride, silver powder, nanodiamond, and carbon nanotubes.

9. The high-flow, wide-temperature-range adaptable heat dissipation paste according to claim 1, suitable for the contact surface between a heating element and a heat dissipation device, is characterized in that: The additive is one or more of antioxidants, pigments, thixotropic agents, and solvents.

10. A method for preparing a high-flow, wide-temperature-range adaptable heat dissipation paste suitable for the contact surface between a heating element and a heat dissipation device, as described in any one of claims 1-9, characterized in that, It is prepared by the following method: According to the weight percentage, diether fluorene was dissolved in ethyl acetate to obtain a diether fluorene dispersion; thermally conductive powder and interfacial coupling agent were weighed and mixed evenly in a planetary mixer, then the diether fluorene dispersion was added and the mixture was stirred evenly again, then the flexible organosilicon matrix was added and the mixture was stirred evenly again, and the ethyl acetate was removed by heating to obtain activated thermally conductive powder; Weigh out the silicone matrix and additives and add them to the activated thermally conductive powder in sequence. Continue stirring to mix them thoroughly and evenly. Then put them into a degassing machine to degas and obtain the heat dissipation paste.

Images