Manufacturing process of high-precision fine pattern etching badge

Abstract

The invention discloses a manufacturing process of a high-precision fine pattern etching badge, and relates to the technical field of etching, and the manufacturing process comprises the following steps: S1, after the surface of the badge is cleaned up, putting the badge into a plasma etching machine body, adsorbing and fixing the badge by using a vacuum chuck, then closing and sealing the plasma etching machine body, and then sealing the plasma etching machine body; s2, driving an inner cross rotating cylinder, a cross anti-deviation sliding rod, a rotary supporting tray and the badge to rotate through a rotary driving motor during etching, the plasma etching machine is scientific and reasonable in structure and safe and convenient to use, a turn-over and vertical adjusting mechanism is arranged, the badge is conveniently clamped through two turn-over type clamping frames, and the working efficiency is improved; and then through cooperation of an overturning driving shaft, an overturning swing plate, an overturning traction plate, a hydraulic pushing pull rod and a positioning moving sliding block, a rotary mounting frame and a rotary splicing base plate are conveniently driven to rotate, an overturning type clamping frame is pushed to rotate by 90 degrees, and the clamped badge is overturned according to needs.

Description

Technical Field

[0001] This invention relates to the field of etching technology, specifically to a manufacturing process for high-precision micro-pattern etching badges. Background Technology

[0002] Etching, also known as photochemical etching, is a technique that removes materials using chemical reactions or physical impacts. It can be divided into wet etching and dry etching. Dry etching refers to removing some of the material from the exposed surface by exposing it to ion bombardment. For example, an etching device based on high-energy ion beam processing is disclosed, with application number 202222626609.2. This patent combines etching with ion beam processing, which can achieve etching of the workpiece first and then ion beam processing. However, in the current processing, it is not convenient to flip the badge inside the plasma etching machine, and it is not easy to adjust and change the orientation of the front, back and sides of the badge, which affects the subsequent etching effect. Therefore, in order to avoid the above-mentioned technical problems, it is indeed necessary to provide a manufacturing process for high-precision micro-pattern etching badges to overcome the defects in the existing technology. Summary of the Invention

[0003] This invention provides a manufacturing process for high-precision micro-pattern etching badges, which can effectively solve the problems mentioned in the background art, such as the inconvenience of flipping the badges inside the ion etching machine, the inability to easily adjust and change the orientation of the front, back and sides of the badges, and the impact on the subsequent etching effect.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a manufacturing process for high-precision micro-pattern etching badges, comprising the following steps: S1. After cleaning the surface of the badge, place it inside the plasma etching machine body and use a vacuum suction cup to fix it. Then, close and seal the plasma etching machine body and start the plasma etching machine body to etch the badge. S2. During etching, the inner cross drum, cross anti-slip rod, rotating support tray and badge are rotated by a rotary drive motor to adjust the etching position at a uniform speed. S3. After the front etching is completed, control the plasma etching head to rise and reset, and start the electric traction lever to pull the opening and closing push slider to slide, which drives the opening and closing rotating plate, the opening and closing adjustment plate and the flip-type clamping frame to rotate, and clamp and fix the badge. S4. Then, the hydraulic push rod is activated to move the positioning slider. Through the transmission of the flipping traction plate and the flipping swing plate, the flipping drive shaft and the rotating mounting frame are driven to rotate, thereby pushing the badge to rotate and adjusting the etching direction of the badge. S5. After etching is complete, reset the rotating mounting frame and flip-type clamp, remove the badge, and clean and dry it.

[0005] According to the above technical solution, an electric lifting rod is installed at the top of the inside of the plasma etching machine body, a lifting and pushing platform is engaged at the bottom of the electric lifting rod, a plasma etching head is installed at the bottom of the lifting and pushing platform, and a flipping and vertical adjustment mechanism is provided inside the plasma etching machine body, the flipping and vertical adjustment mechanism includes a flipping drive shaft. Both ends of the plasma etching machine body are rotatably connected to a flip drive shaft, and a flip swing plate is engaged at opposite ends of the two flip drive shafts. A flip traction plate is rotatably connected to one end of the flip swing plate. Hydraulic push rods are installed at both ends of the plasma etching machine body, and a positioning and moving slider is engaged at one end of the hydraulic push rod. An extension actuating plate is engaged at the bottom end of the positioning and moving slider. One end of the flip drive shaft is clamped to a rotating mounting frame, and the other end of the flip drive shaft is clamped to a rotating splicing pad. A rotating clamping shaft is equidistantly connected between the rotating mounting frame and the rotating splicing pad. A flip-type clamping frame is clamped to the outside of the rotating clamping shaft.

[0006] According to the above technical solution, the electric lifting rod and the hydraulic push rod are both powered by an external power source. One end of the positioning and moving slider is slidably connected to one end of the plasma etching machine body, and the other end of the flipping traction plate is rotatably connected to one end of the positioning and moving slider.

[0007] Both ends of the plasma etching machine body are fitted with limit thread seats. The limit thread seats are connected to a lifting adjustment rod through threads. The top of the lifting adjustment rod is fitted with a limit stop block, and an emergency stop touch switch is installed at one end of the limit stop block. The rotating mounting frame is equidistantly fitted with reciprocating sliding frames, and an electric traction rod is fitted inside the reciprocating sliding frames. One end of the electric traction rod is fitted with an opening and closing push slider at a position inside the reciprocating sliding frames. One end of the rotating clamping shaft is fitted with an opening and closing adjustment plate inside the rotating mounting frame. One end of the opening and closing adjustment plate and one end of the opening and closing push slider are rotatably connected to an opening and closing rotating plate. One end of the rotating mounting frame is fitted with a C-shaped parallel baffle between the two flip-type clamping frames.

[0008] According to the above technical solution, a knob is snapped onto the bottom end of the lifting adjustment rod, one end of the limit stop block is slidably connected to one end of the plasma etching machine body, the emergency stop touch switch and the electric traction rod are both powered by an external power source, and the signal output end of the emergency stop touch switch is connected to the input end of the hydraulic push rod.

[0009] According to the above technical solution, both ends of the opening and closing push slider are slidably connected to the inner wall of the reciprocating sliding frame, and the opening and closing rotating plates on the two opening and closing adjustment plates are symmetrically distributed. The adjacent ends of the two flip-type clamping frames are in contact with the two ends of the C-shaped parallel baffle.

[0010] According to the above technical solution, a positioning and anti-deviation and rotation mechanism is provided between the two flip-type clamping frames, and the positioning and anti-deviation and rotation mechanism includes an inner cross rotating cylinder; Both of the aforementioned flip-type clamping frames are movably connected to an inner cross rotating cylinder. A cross anti-slip rod is movably connected inside the inner cross rotating cylinder. Limiting extension sleeves are fixedly sleeved on the outer side of the cross anti-slip rod and the outer side of the inner cross rotating cylinder. A reset clamping spring is snapped between the two limiting extension sleeves. Each of the two cross anti-slip rods is attached to a rotating support tray at one of its adjacent ends. A vacuum suction cup is embedded inside the rotating support tray, and a vacuum extraction pipe is attached inside the cross anti-slip rod. A miniature vacuum pump is installed on the outside of the vacuum extraction pipe. Both of the two flip-type clamping frames are equipped with rotary drive motors at opposite ends. Power transmission wheels are fixedly sleeved on the outer side of the rotary drive motors and the outer side of the inner cross drum. The two power transmission wheels located on the same horizontal plane are sleeved with internal tooth transmission tracks. The two rotating support trays are equidistantly engaged with positioning movable frames at opposite ends. One end of each positioning movable frame is symmetrically and movably connected with an anti-deviation sliding rod, and one end of the anti-deviation sliding rod is engaged with a telescopic push plate at a position inside the positioning movable frame. One end of the telescopic push plate is symmetrically engaged with a telescopic clamping spring, and the other end of the anti-deviation sliding rod is engaged with a side moving block. One end of the side moving block is rotatably connected with a side limiting wheel.

[0011] According to the above technical solution, one end of the cross anti-slip rod passes through one end of the inner cross rotating cylinder, one end of the vacuum pumping pipe passes through one end of the cross anti-slip rod, and the miniature vacuum pumping pump is powered by an external power source.

[0012] According to the above technical solution, the rotary drive motor is powered by an external power source, and the power transmission wheel is provided with uniformly spaced tooth grooves on its outer side, and the power transmission wheel meshes with the inner tooth transmission track through the tooth grooves.

[0013] According to the above technical solution, both ends of the telescopic push plate are slidably connected to the inner wall of the positioning active frame, and the distance between the two opposite side limiting wheels is less than the distance between the two opposite rotating support trays.

[0014] Compared with the prior art, the beneficial effects of the present invention are: the present invention has a scientific and reasonable structure and is safe and convenient to use. 1. A flipping and upright adjustment mechanism is set up. Two flipping clamps are used to easily hold the badges. The flipping drive shaft, flipping swing plate, flipping traction plate, hydraulic push rod and positioning slider are used to drive the rotating mounting frame and rotating splicing pad to rotate, and push the flipping clamps to rotate 180 degrees. The clamped badges can be flipped as needed, changing the orientation of the badges and providing convenience for subsequent etching. The reciprocating sliding frame, electric traction rod, opening and closing push slider, opening and closing adjustment plate and opening and closing rotating plate work together to easily drive the flip-type clamping frame to rotate and open, which facilitates the clamping and fixing of the badge, improves the stability of the badge between the two flip-type clamping frames, ensures the stability of subsequent flipping, and prevents the badge from falling off. In addition, by rotating the lifting adjustment rod, the limit stop block and emergency stop touch switch are pushed up, and in conjunction with the extension toggle plate, the movement distance of the positioning slider is limited, which drives the flip-type clamp to rotate 90 degrees, so that the badge stands up, making it easier to etch the side of the badge, improving adaptability and making it convenient to etch different positions of the badge.

[0015] 2. A positioning and anti-deviation mechanism is set up. Through the cooperation of a miniature vacuum pump, vacuum suction cup and vacuum suction pipe, the gas between the vacuum suction cup and the badge is easily extracted to form a negative pressure, which improves the adsorption effect, ensures the stability of the badge on the rotating support tray, improves the stability during etching, and reduces shaking. At the same time, the outer side of the badge is clamped and limited by the movement of the telescopic clamping spring, the pulling telescopic push plate, the anti-deviation sliding rod, the side moving block and the side limiting wheel, further positioning the badge. This allows badges of different diameters to be fixed in the center position of the rotating support tray, improving the accuracy of subsequent etching. The combination of a rotary drive motor, power transmission wheel, and internal gear transmission track facilitates the rotation of the inner cross drum, cross anti-slip rod, rotating support tray, and badge. During front, back, and side etching, the badge can be rotated at a constant speed to adjust the etching position, improving accuracy and adaptability. In addition, when the badge is held by the two flip-type clamping frames, the return clamping spring moves the cross anti-slip rod, limit extension, and rotating support tray, changing the distance between the two rotating support trays. This facilitates the clamping of badges of different thicknesses, improves stability during flipping, and prevents badges from falling off.

[0016] In summary, by combining the flipping and upright adjustment mechanism with the positioning and anti-deviation rotation mechanism, badges of different sizes can be positioned, ensuring stability during etching, preventing badge displacement, and guaranteeing etching accuracy. At the same time, the badge can be rotated to adjust its orientation as needed, thereby etching the front, back, and sides of the badge, achieving multi-angle etching, further improving adaptability, and meeting the manufacturing needs of different badges. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0018] In the attached diagram: Figure 1 This is a flowchart of the etching process for the badge of this invention; Figure 2 This is a schematic diagram of the installation structure of the lifting and adjusting rod of the present invention; Figure 3 This is a schematic diagram of the installation structure of the hydraulic push rod of the present invention; Figure 4 This is a schematic diagram of the mounting structure of the rotating clamping shaft of the present invention; Figure 5 This is a schematic diagram of the flipping and uprighting adjustment mechanism of the present invention; Figure 6 This is a schematic diagram of the installation structure of the opening and closing adjustment disc of the present invention; Figure 7 This is a schematic diagram of the positioning, anti-deviation, and rotation mechanism of the present invention; Figure 8 This is a schematic diagram of the installation structure of the side limiting wheel of the present invention.

[0019] The diagram shows: 1. Plasma etching machine body; 2. Electric lifting rod; 3. Lifting and pushing platform; 4. Plasma etching head; 5. Flipping and standing adjustment mechanism; 501. Flipping drive shaft; 502. Flipping swing plate; 503. Flipping traction plate; 504. Hydraulic push rod; 505. Positioning and moving slider; 506. Extension actuating plate; 507. Rotary mounting frame; 508. Rotary splicing pad; 509. Rotary clamping shaft; 510. Flipping clamping frame; 511. Limit threaded seat; 512. Lifting adjustment rod; 513. Limit stop block; 514. Emergency stop touch switch; 515. Reciprocating sliding frame; 516. Electric traction rod; 517. Opening and closing push slider; 518. Opening and closing adjustment plate; 519. Opening and closing rotating plate; 520. C-type parallel baffle; 6. Positioning and anti-deviation mechanism; 601. Inner cross-shaped rotating cylinder; 602. Cross-shaped anti-deviation sliding rod; 603. Limiting extension sleeve; 604. Reset clamping spring; 605. Rotating support tray; 606. Vacuum suction cup; 607. Vacuum extraction pipe; 608. Miniature vacuum pump; 609. Rotary drive motor; 610. Power transmission wheel; 611. Internal toothed transmission track; 612. Positioning movable frame; 613. Anti-deviation sliding rod; 614. Telescopic push plate; 615. Telescopic clamping spring; 616. Side moving block; 617. Side limiting wheel. Detailed Implementation

[0020] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0021] Example: Figure 1-8 As shown, the present invention provides a technical solution, a manufacturing process for high-precision micro-pattern etching badges, comprising the following steps: S1. After cleaning the surface of the badge, place it inside the plasma etching machine body 1 and fix it with vacuum suction cup 606. Then close and seal the plasma etching machine body 1 and start the plasma etching machine body 1 to etch the badge. S2. During etching, the inner cross drum 601, cross anti-slip rod 602, rotating support tray 605 and badge are rotated by the rotary drive motor 609 to adjust the etching position at a uniform speed. S3. After the front etching is completed, control the plasma etching head 4 to rise and reset, and start the electric traction lever 516 to pull the opening and closing push slider 517 to slide, which drives the opening and closing rotating plate 519, the opening and closing adjustment plate 518 and the flip-type clamping frame 510 to rotate, and clamp and fix the badge. S4. Then, the hydraulic push rod 504 is activated to move the positioning slider 505. Through the transmission of the flipping traction plate 503 and the flipping swing plate 502, the flipping drive shaft 501 and the rotating mounting frame 507 are driven to rotate, thereby pushing the badge to rotate and adjusting the etching direction of the badge. S5. After etching is completed, reset the rotating mounting frame 507 and the flip-type clamp 510, remove the badge, and clean and dry it. An electric lifting rod 2 is installed at the top of the plasma etching machine body 1. A lifting and pushing platform 3 is attached to the bottom of the electric lifting rod 2. A plasma etching head 4 is installed at the bottom of the lifting and pushing platform 3. A flipping and vertical adjustment mechanism 5 is provided inside the plasma etching machine body 1. The flipping and vertical adjustment mechanism 5 includes a flipping drive shaft 501. The plasma etching machine body 1 has a flip drive shaft 501 rotatably connected to both ends. The two flip drive shafts 501 are each clamped to a flip swing plate 502 at opposite ends. One end of the flip swing plate 502 is rotatably connected to a flip traction plate 503. Hydraulic push rods 504 are installed at both ends of the plasma etching machine body 1, and a positioning and moving slider 505 is attached to one end of the hydraulic push rod 504. An extension actuating plate 506 is attached to the bottom end of the positioning and moving slider 505. One end of a flip drive shaft 501 is clamped to a rotating mounting frame 507, and the other end of a flip drive shaft 501 is clamped to a rotating splicing pad 508. A rotating clamping shaft 509 is equidistantly connected between the rotating mounting frame 507 and the rotating splicing pad 508. A flip-type clamping frame 510 is clamped to the outside of the rotating clamping shaft 509. In order to facilitate the adjustment of the height of the plasma etching head 4, the electric lifting rod 2 and the hydraulic push rod 504 are both powered by an external power source. One end of the positioning moving slider 505 is slidably connected to one end of the plasma etching machine body 1, and the other end of the flipping traction plate 503 is rotatably connected to one end of the positioning moving slider 505. Both ends of the plasma etching machine body 1 are fitted with limit thread seats 511. The limit thread seats 511 are connected to the lifting adjustment rod 512 by threads. The top of the lifting adjustment rod 512 is fitted with a limit stop block 513, and an emergency stop touch switch 514 is installed at one end of the limit stop block 513. The rotating mounting frame 507 has reciprocating sliding frames 515 that are equidistantly engaged inside. The reciprocating sliding frames 515 have electric traction rods 516 engaged inside. One end of the electric traction rod 516 is engaged with an opening and closing push slider 517 at a position inside the reciprocating sliding frames 515. In order to adjust the angle of the two flip-type clamping frames 510, a knob is engaged at the bottom of the lifting adjustment rod 512. One end of the limit stop block 513 is slidably connected to one end of the plasma etching machine body 1. The emergency stop touch switch 514 and the electric traction rod 516 are both powered by an external power source, and the signal output end of the emergency stop touch switch 514 is connected to the input end of the hydraulic push rod 504. One end of the rotating clamping shaft 509 is fitted with an opening and closing adjustment plate 518 inside the rotating mounting frame 507. One end of the opening and closing adjustment plate 518 and one end of the opening and closing push slider 517 are rotatably connected to an opening and closing rotating plate 519. One end of the rotating mounting frame 507 is fitted with a C-shaped parallel baffle 520 between two flip-type clamping frames 510. In order to facilitate the rotation of the flip-type clamping frame 510, both ends of the opening and closing push slider 517 are slidably connected to the inner wall of the reciprocating sliding frame 515. The opening and closing rotating plates 519 on the two opening and closing adjustment plates 518 are symmetrically distributed. The adjacent ends of the two flip-type clamping frames 510 are in contact with the two ends of the C-shaped parallel baffle 520. A positioning and anti-deviation and rotation mechanism 6 is provided between the two flip-type clamping frames 510. The positioning and anti-deviation and rotation mechanism 6 includes an inner cross rotating cylinder 601. Both flip-type clamping frames 510 are internally connected to an inner cross cylinder 601. The inner cross cylinder 601 is internally connected to a cross anti-slip rod 602. The outer side of the cross anti-slip rod 602 and the outer side of the inner cross cylinder 601 are fixedly sleeved with a limit extension sleeve 603. A reset clamping spring 604 is snapped between the two limit extension sleeves 603. Two cross anti-slip rods 602 are each clamped to a rotating support tray 605 at one of their adjacent ends. A vacuum suction cup 606 is embedded inside the rotating support tray 605, and a vacuum extraction pipe 607 is clamped inside the cross anti-slip rod 602. A miniature vacuum pump 608 is installed on the outside of the vacuum extraction pipe 607. To improve the stability of clamping, one end of the cross anti-slip rod 602 passes through one end of the inner cross rotating cylinder 601, and one end of the vacuum extraction pipe 607 passes through one end of the cross anti-slip rod 602. The miniature vacuum pump 608 is powered by an external power source. Two flip-type clamping frames 510 are each equipped with a rotary drive motor 609 at opposite ends. Power transmission wheels 610 are fixedly sleeved on the outer side of the rotary drive motor 609 and the outer side of the inner cross drum 601. The two power transmission wheels 610 located on the same horizontal plane are each sleeved with an inner tooth transmission track 611. In order to facilitate the rotation of the badge, the rotary drive motor 609 is powered by an external power source. The outer side of the power transmission wheel 610 is evenly provided with tooth grooves, and the power transmission wheel 610 meshes with the inner tooth transmission track 611 through the tooth grooves. Two rotating support trays 605 are equidistantly engaged with positioning movable frames 612 at opposite ends. One end of each positioning movable frame 612 is symmetrically connected to an anti-deviation sliding rod 613. One end of the anti-deviation sliding rod 613 is engaged with a telescopic push plate 614 at a position inside the positioning movable frame 612. One end of the telescopic push plate 614 is symmetrically engaged with a telescopic clamping spring 615. The other end of the anti-deviation sliding rod 613 is engaged with a side moving block 616. One end of the side moving block 616 is rotatably connected to a side limiting wheel 617. To facilitate the positioning of the badge, both ends of the telescopic push plate 614 are slidably connected to the inner wall of the positioning movable frame 612. The distance between the two opposite side limiting wheels 617 is less than the distance between the two opposite rotating support trays 605.

[0022] The working principle and usage process of this invention are as follows: First, the badge to be etched is placed inside the rotating support tray 605. At the same time, the micro vacuum pump 608 is started to discharge the gas between the vacuum suction cup 606 and the badge through the vacuum suction pipe 607, thereby improving the adsorption effect of the vacuum suction cup 606 and improving the stability of the badge on the rotating support tray 605. At the same time, by utilizing the retraction characteristic of the telescopic clamping spring 615, the telescopic push plate 614, the anti-deviation sliding rod 613, the side moving block 616 and the side limiting wheel 617 are pulled to move, clamping and limiting the outer side of the badge, further positioning the badge, so that the badge can be fixed in the center position of the rotating support tray 605, improving the accuracy of subsequent etching. Next, the plasma etching machine body 1 is sealed, and the air pressure inside the plasma etching machine body 1 is changed. Then, through the cooperation of the electric lifting rod 2 and the lifting push platform 3, the plasma etching head 4 is pushed down to contact the badge on the rotating support tray 605, so that the plasma etching head 4 can etch the badge. In addition, the rotary drive motor 609 is started, and through the cooperation of the power transmission wheel 610 and the internal tooth transmission track 611, the power is transmitted to drive the inner cross drum 601, the cross anti-slip rod 602 and the rotating support tray 605 to rotate, adjust the angle of the badge, and further improve the etching accuracy. Once one side of the badge is etched, an electric traction lever 516 retracts, pulling the opening / closing push slider 517 to slide inside the reciprocating sliding frame 515. Through the cooperation of the opening / closing rotating plate 519, it pulls the opening / closing adjusting disc 518 to rotate, thereby driving the rotating clamping shaft 509 and the flip-type clamping frame 510 to rotate, aligning the two flip-type clamping frames 510. Simultaneously, utilizing the retraction characteristic of the return clamping spring 604, the rotating support tray 605 and the cross anti-deviation sliding rod 602 slide along the inside of the inner cross rotating cylinder 601, facilitating the contact of the two rotating support trays 605 to clamp the badge and improve its stability. Next, the hydraulic push rod 504 is activated, pushing the positioning and moving slider 505 to slide along one end of the plasma etching machine body 1. Through the cooperation of the flipping traction plate 503, the flipping swing plate 502 and the flipping drive shaft 501, the rotating mounting frame 507 is pushed to rotate, thereby driving the flipping clamping frame 510 and the badge to rotate 180 degrees, flipping the badge. After flipping the badge, turn off the miniature vacuum pump 608 above the badge to stop the vacuum suction cup 606 from adsorbing the badge. Then, start the miniature vacuum pump 608 below the badge to force the vacuum suction cup 606 below to adsorb the badge. Then, start the electric traction rod 516 above the badge to extend and push the opening and closing push slider 517 to slide along the reciprocating sliding frame 515. With the cooperation of the opening and closing rotating plate 519, push the opening and closing adjustment plate 518, the rotating clamping shaft 509 and the flip-type clamping frame 510 to rotate, so that the flip-type clamping frame 510 above the badge rotates and opens, releasing the clamp on the badge, so that the ground of the badge is exposed, which is convenient for subsequent etching by the plasma etching head 4. This improves adaptability and makes it easier to etch the front and back of the badge, thus improving convenience. Next, rotate the lifting adjustment rod 512 inside the limit thread seat 511 to push the limit stop block 513 to slide up along one end of the plasma etching machine body 1, so that the position of the limit stop block 513 corresponds to the position of the extension toggle plate 506. Thus, when the hydraulic push rod 504 pulls the positioning moving slider 505 to slide, one end of the extension toggle plate 506 contacts the emergency stop touch switch 514 on the limit stop block 513. When the flip swing plate 502 rotates 90 degrees, the pulling of the hydraulic push rod 504 is stopped in time, forcing the flip clamp 510 to rotate 90 degrees with the badge, so that the side of the badge faces upward, which is convenient for etching the side of the badge. Furthermore, through the cooperation of the rotary drive motor 609, the power transmission wheel 610 and the internal tooth transmission track 611, the inner cross drum 601, the cross anti-slip rod 602 and the rotary support tray 605 are driven to rotate, forcing the two rotary support trays 605 to hold the badge and rotate at a constant speed, etching exquisite patterns on the side of the badge. During rotation, the side limit wheel 617 can be used to limit the badge and prevent it from falling off. Finally, after the side etching is completed, the lifting adjustment rod 512 is rotated to lower the limit stop block 513, releasing the limit on the extension toggle plate 506. At the same time, the hydraulic push rod 504 extends and resets, pushing the flip swing plate 502, the flip drive shaft 501 and the rotating mounting frame 507 to rotate and reset, making the badge parallel. Then, using the cooperation of the electric traction rod 516, the opening and closing push slider 517, the opening and closing adjustment plate 518 and the opening and closing rotating plate 519, the rotating clamping shaft 509 and the flip clamping frame 510 rotate and open, releasing the clamp on the badge, making it easy to remove the etched badge.

[0023] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A manufacturing process for high-precision micro-pattern etching badges, characterized in that: Includes the following steps: S1. After cleaning the surface of the badge, place it inside the plasma etching machine body (1) and fix it with vacuum suction cup (606). Then close and seal the plasma etching machine body (1) and start the plasma etching machine body (1) to etch the badge. S2. During etching, the inner cross drum (601), cross anti-slip rod (602), rotating support tray (605) and badge are rotated by the rotary drive motor (609) to adjust the etching position at a uniform speed. S3. After the front etching is completed, control the plasma etching head (4) to rise and reset, and start the electric traction rod (516) to pull the opening and closing push slider (517) to slide, drive the opening and closing rotating plate (519), drive the opening and closing adjustment plate (518) and the flip-type clamping frame (510) to rotate, and clamp and fix the badge. S4. Then, the hydraulic push rod (504) is activated to move the positioning slider (505), and through the transmission of the flipping traction plate (503) and the flipping swing plate (502), the flipping drive shaft (501) and the rotating mounting frame (507) are driven to rotate, thereby pushing the badge to rotate and adjusting the etching direction of the badge. S5. After etching is completed, reset the rotating mounting frame (507) and the flip-type clamp (510), remove the badge, and clean and dry it.

2. The manufacturing process for a high-precision micro-pattern etching badge according to claim 1, characterized in that: An electric lifting rod (2) is installed at the top of the plasma etching machine body (1). A lifting and pushing platform (3) is attached to the bottom of the electric lifting rod (2). A plasma etching head (4) is installed at the bottom of the lifting and pushing platform (3). A flipping and vertical adjustment mechanism (5) is provided inside the plasma etching machine body (1). The flipping and vertical adjustment mechanism (5) includes a flipping drive shaft (501). The plasma etching machine body (1) is rotatably connected to two ends of a flip drive shaft (501), and a flip swing plate (502) is engaged at opposite ends of the two flip drive shafts (501). A flip traction plate (503) is rotatably connected to one end of the flip swing plate (502). Hydraulic push rods (504) are installed at both ends of the plasma etching machine body (1), and a positioning moving slider (505) is engaged at one end of the hydraulic push rod (504), and an extension toggle plate (506) is engaged at the bottom end of the positioning moving slider (505). One end of the flip drive shaft (501) is snapped with a rotating mounting frame (507), and the other end of the flip drive shaft (501) is snapped with a rotating splicing pad (508). A rotating clamping shaft (509) is equidistantly connected between the rotating mounting frame (507) and the rotating splicing pad (508). A flip-type clamping frame (510) is snapped with the outside of the rotating clamping shaft (509).

3. The manufacturing process for a high-precision micro-pattern etching badge according to claim 2, characterized in that: The electric lifting rod (2) and the hydraulic push rod (504) are both powered by an external power source. One end of the positioning moving slider (505) is slidably connected to one end of the plasma etching machine body (1), and the other end of the flipping traction plate (503) is rotatably connected to one end of the positioning moving slider (505).

4. The manufacturing process for a high-precision micro-pattern etching badge according to claim 2, characterized in that: Both ends of the plasma etching machine body (1) are fitted with limit thread seats (511). The limit thread seats (511) are connected to a lifting adjustment rod (512) by threads. The top of the lifting adjustment rod (512) is fitted with a limit stop block (513), and an emergency stop touch switch (514) is installed at one end of the limit stop block (513). The rotating mounting frame (507) is equidistantly fitted with a reciprocating sliding frame (515), and an electric traction rod (516) is fitted inside the reciprocating sliding frame (515). One end of the electric traction rod (516) is fitted with an opening and closing push slider (517) at a position inside the reciprocating sliding frame (515). One end of the rotating clamping shaft (509) is fitted with an opening and closing adjustment plate (518) inside the rotating mounting frame (507). One end of the opening and closing adjustment plate (518) and one end of the opening and closing push slider (517) are rotatably connected to an opening and closing rotating plate (519). One end of the rotating mounting frame (507) is fitted with a C-shaped parallel baffle (520) between two flip-type clamping frames (510).

5. The manufacturing process of a high-precision micro-pattern etching badge according to claim 4, characterized in that: The bottom end of the lifting adjustment rod (512) is fitted with a knob, one end of the limit stop block (513) is slidably connected to one end of the plasma etching machine body (1), the emergency stop touch switch (514) and the electric traction rod (516) are both powered by an external power source, and the signal output end of the emergency stop touch switch (514) is connected to the input end of the hydraulic push rod (504).

6. The manufacturing process for a high-precision micro-pattern etching badge according to claim 4, characterized in that: Both ends of the opening and closing push slider (517) are slidably connected to the inner wall of the reciprocating sliding frame (515), and the opening and closing rotating plates (519) on the two opening and closing adjustment plates (518) are symmetrically distributed. The adjacent ends of the two flip-type clamping frames (510) are in contact with the two ends of the C-shaped parallel baffle (520).

7. The manufacturing process for a high-precision micro-pattern etching badge according to claim 2, characterized in that: A positioning and anti-deviation and rotation mechanism (6) is provided between the two flip-type clamps (510), and the positioning and anti-deviation and rotation mechanism (6) includes an inner cross cylinder (601). Both of the flip-type clamping frames (510) are movably connected to an inner cross cylinder (601). The inner cross cylinder (601) is movably connected to a cross anti-slip rod (602). The outer side of the cross anti-slip rod (602) and the outer side of the inner cross cylinder (601) are both fixedly sleeved with a limit extension sleeve (603). A reset clamping spring (604) is snapped between the two limit extension sleeves (603). Each of the two cross anti-slip rods (602) is attached to a rotating support tray (605) at one of its adjacent ends. A vacuum suction cup (606) is embedded inside the rotating support tray (605), and a vacuum extraction pipe (607) is attached inside the cross anti-slip rod (602). A miniature vacuum pump (608) is installed on the outside of the vacuum extraction pipe (607). A rotary drive motor (609) is installed on the opposite end of each of the two flip-type clamping frames (510). A power transmission wheel (610) is fixedly sleeved on the outer side of the rotary drive motor (609) and the outer side of the inner cross drum (601). An internal tooth transmission track (611) is sleeved on the outer side of the two power transmission wheels (610) located on the same horizontal plane. Two rotating support trays (605) are equidistantly fitted with positioning movable frames (612) at opposite ends. One end of the positioning movable frame (612) is symmetrically connected to an anti-deviation sliding rod (613), and one end of the anti-deviation sliding rod (613) is fitted with a telescopic push plate (614) at a position inside the positioning movable frame (612). One end of the telescopic push plate (614) is symmetrically fitted with a telescopic clamping spring (615), and the other end of the anti-deviation sliding rod (613) is fitted with a side moving block (616). One end of the side moving block (616) is rotatably connected to a side limiting wheel (617).

8. The manufacturing process for a high-precision micro-pattern etching badge according to claim 7, characterized in that: One end of the cross anti-slip rod (602) passes through one end of the inner cross rotating cylinder (601), one end of the vacuum pumping pipe (607) passes through one end of the cross anti-slip rod (602), and the miniature vacuum pump (608) is powered by an external power source.

9. The manufacturing process for a high-precision micro-pattern etching badge according to claim 7, characterized in that: The rotary drive motor (609) is powered by an external power source. The power transmission wheel (610) has evenly spaced toothed grooves on its outer side, and the power transmission wheel (610) meshes with the inner toothed transmission track (611) through the toothed grooves.

10. The manufacturing process for a high-precision micro-pattern etching badge according to claim 7, characterized in that: Both ends of the telescopic push plate (614) are slidably connected to the inner wall of the positioning active frame (612), and the distance between the two opposite side limiting wheels (617) is less than the distance between the two opposite rotating support trays (605).

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