Industrial grade RS485 multi-protocol intelligent conversion system

Abstract

The invention relates to an industrial grade RS485 multi-protocol intelligent conversion system, which comprises a shell and a signal processing module arranged in the shell, and is characterized in that the signal processing module comprises N paths of RS485 input interfaces arranged independently and N paths of RS485 output interfaces arranged independently, N is greater than or equal to 2, and N is an integer; the RS485 input interfaces and the RS485 output interfaces are arranged in a one-to-one correspondence manner; a main control chip is arranged in the signal processing module, and the main control chip is respectively connected with each path of RS485 input interface and each path of RS485 input outlet. According to the system, multi-node expansion can be realized, stable communication of 256 nodes is supported, and the deployment of repeaters can be effectively reduced. Meanwhile, the real-time performance is greatly improved, and a real-time instruction is delayed and compressed to be within 10ms; and the protocol compatibility is good, five industrial protocols can be converted and the RS485 to CAN protocol can be converted, the assembly efficiency is high, and the operation is more reliable.

Description

Technical Field

[0001] This invention relates to the field of battery technology, and in particular to an industrial-grade RS485 multi-protocol intelligent conversion system. Background Technology

[0002] Traditional RS485 bus multi-node communication is inefficient and limited in the number of nodes: it is limited to 32 nodes (MAX485 chip), and even with expansion solutions (such as MAX1483 chip), it is difficult to stably support 256 nodes. When the number of nodes exceeds the threshold, the bus impedance drops, causing signal distortion. Moreover, its communication mode is rigid, forcing the use of a master-slave polling mechanism, resulting in poor real-time performance. The slave response delay can reach hundreds of milliseconds, which cannot meet the instantaneous transmission requirements of emergency braking commands.

[0003] Secondly, traditional RS485 only supports basic protocols such as MODBUS RTU and cannot directly connect to system protocols or CAN protocols, resulting in poor protocol compatibility and the potential for creating isolated industrial protocols. Furthermore, the transmission rate of traditional RS485 is inversely proportional to distance; when the baud rate increases to 115200bps, the transmission distance drops drastically from 1200 meters to 100 meters. Moreover, traditional RS485 only provides primary protection through TVS diodes, lacking multi-level protection and insufficient surge protection capabilities. It cannot cope with lightning surges of 10 / 700μs waveforms in industrial environments, easily causing losses. For example, one substation, lacking three-level protection, had to replace 30% of its communication modules annually, resulting in losses exceeding 500,000 yuan.

[0004] Furthermore, traditional RS485 lacks a standardized interface, resulting in differences in protocol frame formats. Interface standards such as DB9, RJ45, and terminal blocks are inconsistent, leading to a chaotic physical interface landscape. Different manufacturers' RS485 devices suffer from poor interoperability due to variations in start symbols and parity bit definitions. For example, a smart park project required the development of three separate driver programs after integrating devices from three different manufacturers, extending the project timeline by two months and incurring significant time and cost. Moreover, different manufacturers define A / B lines in opposite ways, resulting in inconsistent A / B line polarities and making it difficult to meet practical application needs. Summary of the Invention

[0005] Based on this, the present invention provides an industrial-grade RS485 multi-protocol intelligent conversion system, which aims to solve the problems of low multi-node communication efficiency, poor protocol compatibility, contradiction between transmission rate and distance, insufficient surge protection capability and lack of standardized interface in existing RS485 systems.

[0006] To achieve the above objectives, the present invention proposes the following technical solution: an industrial-grade RS485 multi-protocol intelligent conversion system, comprising a housing and a signal processing module disposed within the housing, the signal processing module comprising N independently configured RS485 input interfaces and N independently configured RS485 output interfaces, where N≥2 and N is an integer; the RS485 input interfaces and the RS485 output interfaces are configured in a one-to-one correspondence; a main control chip is disposed within the signal processing module, the main control chip being connected to each of the RS485 input interfaces and each of the RS485 input output interfaces respectively.

[0007] In a preferred embodiment, the signal processing module implements multi-node communication via the MODBUS industrial protocol or the PROFIBUS industrial protocol.

[0008] In a preferred embodiment, the signal processing module switches between master and slave modes via a DIP switch or software configuration.

[0009] In a preferred embodiment, the signal processing module integrates a differential signal conversion unit for completely isolating the ground potential of the input signal of the RS485 input interface or the ground potential of the output signal of the RS485 output interface; the differential signal conversion unit is at least one of an optical transceiver isolator (single-mode fiber optic transceiver) or a digital isolation chip.

[0010] In a preferred embodiment, the signal processing module integrates a protocol conversion engine.

[0011] In a preferred embodiment, the signal processing module integrates a multi-level surge protection system, which is a three-level surge protection unit.

[0012] In a preferred embodiment, the three-stage surge protection unit includes a surge protection chip, an electronic current limiter (TBU-CA065), a ceramic gas discharge tube, and a transient voltage suppressor diode (TVS diode). The surge protection chip is connected to the electronic current limiter, the ceramic gas discharge tube, and the transient voltage suppressor diode, respectively. The electronic current limiter is connected in parallel with the ceramic gas discharge tube and the transient voltage suppressor diode, respectively.

[0013] In a preferred embodiment, the industrial-grade RS485 multi-protocol intelligent conversion system adopts a wide-voltage input circuit and supports DC9V-60V power supply; the output voltage of the digital isolation chip is DC5V / 3.3V.

[0014] In a preferred embodiment, an LED indicator is provided on the end face of the housing for real-time display of the power module status, data transmission and reception, and fault alarm information. The LED indicator is connected to the power module and the signal processing module, respectively, and the power module is disposed inside the housing.

[0015] In a preferred embodiment, the signal processing module is a hot-swappable module; the protocol conversion engine is a hot-swappable engine; and both the signal processing module and the protocol conversion engine are independently packaged using a potting method.

[0016] In a preferred embodiment, the hot-swappable module is fixed by a self-locking slot structure; the self-locking slot structure includes spiral distribution receiving slots disposed at both ends of the hot-swappable module and magnetic beads embedded in the spiral distribution receiving slots; the magnetic beads are adapted to the spiral distribution receiving slots.

[0017] In a preferred embodiment, the hot-swappable module is provided with elastic metal clips on both sides.

[0018] As a preferred embodiment, the filling method is achieved by the following: a two-component silicone potting compound is mixed evenly at a mass ratio of 1:1 and then potted onto the surface of the hot-swappable module, followed by vacuum degassing and curing to obtain an independently packaged module.

[0019] As a preferred embodiment, the vacuum degassing condition is to maintain a vacuum of -0.1 MPa for 30 minutes; the curing condition is to cure at room temperature for 24 hours or at 80°C for 2 hours.

[0020] In a preferred embodiment, the industrial-grade RS485 multi-protocol intelligent conversion system further includes a BMS bus management system and a circuit board disposed within the housing. The BMS bus management system is connected to the BMS and multiple sensors respectively; the signal processing module is integrated within the circuit board.

[0021] In a preferred embodiment, the back of the housing is provided with several heat dissipation fins, the spacing between the heat dissipation fins is 3mm, and the height of each heat dissipation fin is 15mm.

[0022] In a preferred embodiment, the circuit board is fixed to the end face inside the housing by a silicone pad; the silicone pad is fixedly connected to the circuit board by double-sided adhesive (3M 467MP); the silicone pad has a hardness of Shore A 50 and a thickness of 2mm.

[0023] In a preferred embodiment, the industrial-grade RS485 multi-protocol intelligent conversion system is a 19-inch standard size system; both the RS485 input interface and the RS485 output interface are RJ45 standard interfaces.

[0024] Compared with the prior art, the beneficial effects achieved by the present invention are as follows:

[0025] (1) The system of this application greatly improves communication efficiency: The system of this application can realize multi-node expansion and support stable communication of 256 nodes (the traditional solution only has 32 nodes), which can effectively reduce the deployment of repeaters (a smart grid project reduced the deployment of repeaters by 30% as a result). At the same time, the real-time performance is greatly improved, and the real-time command delay is compressed to less than 10ms; the protocol compatibility is good, and it can convert 5 industrial RS485 protocols and RS485 to CAN protocol.

[0026] (2) The system of this application adopts three-level surge protection, which has good reliability and can withstand a peak current of 1kA, making it more reliable in operation. The functional modules adopt independent packaging and hot-swappable connection, which effectively simplifies the assembly process, makes disassembly and assembly convenient, and allows for tool-free module replacement in 5 minutes, resulting in high assembly efficiency.

[0027] (3) The system of this application can realize intelligent diagnosis, locate the fault point in 30 seconds (the troubleshooting time for a fiber optic interruption in a certain data center is about 4 hours), and can upload 12 monitoring indicators in real time. The modular integration setting effectively optimizes the system size, reducing the size of the 1U chassis by 60% and the power consumption by 40%. Moreover, the batch firmware update efficiency is improved by 90%, which can effectively reduce the annual downtime of the equipment. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the overall structure of an industrial-grade RS485 multi-protocol intelligent conversion system according to an embodiment of the present invention;

[0030] Figure 2 for Figure 1 A schematic diagram of the internal structure of an industrial-grade RS485 multi-protocol intelligent conversion system;

[0031] Figure 3 This is a front view structural diagram of the signal processing module of this application;

[0032] Figure 4 This is a schematic diagram of the three-stage surge protection unit of this application;

[0033] Figure 5 This is a schematic diagram of the heat dissipation fins of the casing in this application.

[0034] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0036] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, top, bottom, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0037] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0038] It should be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0039] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0040] Specifically, such as Figures 1 to 5 As shown, the present invention proposes the following technical solution: an industrial-grade RS485 multi-protocol intelligent conversion system, comprising a housing 10 and a signal processing module 20 disposed within the housing 10. The signal processing module 20 includes N independently configured RS485 input interfaces 21 and N independently configured RS485 output interfaces 22, where N ≥ 2 and N is an integer; the RS485 input interfaces 21 and the RS485 output interfaces 22 are configured in a one-to-one correspondence; a main control chip (not marked in the figure) is disposed within the signal processing module 20, and the main control chip is connected to each of the RS485 input interfaces 21 and each of the RS485 input output interfaces 22 respectively.

[0041] By setting up N RS485 input interfaces 21 and N RS485 output interfaces 22 on the signal processing module 20, a 1-to-N channel expansion (N≥2) is formed, which helps to increase the number of nodes stably supported by this system to 256 (the traditional RS485 bus is limited to 32 nodes (MAX485 chip)). The main control chip of this application adopts Renesas Electronics RZ / G2H, which supports real-time operating system (RTOS) and edge computing functions, meets industrial-grade reliability requirements, and integrates 64MB QuadSPI NOR flash memory, which can realize firmware storage and data caching.

[0042] In a preferred embodiment, the signal processing module 20 implements multi-node communication via the MODBUS industrial protocol or the PROFIBUS industrial protocol.

[0043] In a preferred embodiment, the signal processing module 20 switches between master and slave modes via a DIP switch (not shown in the figure) or software configuration. This allows the system to support rapid switching between master and slave modes, effectively compressing the real-time command transmission delay to less than 10ms.

[0044] In a preferred embodiment, the signal processing module 20 integrates a differential signal conversion unit (not shown in the figure) for completely isolating the ground potential of the input signal of the RS485 input interface 21 or the ground potential of the output signal of the RS485 output interface 22; the differential signal conversion unit is at least one of an optocoupler transceiver isolator (single-mode fiber optic transceiver) or a digital isolation chip. The differential signal conversion unit achieves signal isolation and anti-interference, with a transmission distance ≥20km, isolation voltage ≥3kV, support for SC / APC interfaces, complete elimination of ground loop interference, and suitability for strong electromagnetic environments such as chemical workshops.

[0045] In one embodiment of this application, the differential signal conversion unit uses an optocoupler transceiver isolator (TLP2186 optocoupler) + digital isolation chip (74LVC2G04 logic chip), and the single-channel differential signal conversion error is ≤±0.5%.

[0046] In a preferred embodiment, the signal processing module 20 integrates a protocol conversion engine (not shown in the figure). This engine supports MODBUS RTU to RS485 / CAN protocol conversion, allowing traditional basic protocols such as MODBUS RTU (including Modbus RTU / TCP, PROFINET, EtherCAT, OPC UA, MQTT, etc.) to be directly connected to the system protocol or CAN protocol, achieving seamless switching between multiple protocols. It also supports dynamic mapping of Modbus registers to OPC UA nodes, ensuring good protocol compatibility.

[0047] In a preferred embodiment, the signal processing module 20 integrates a multi-level surge protection system 23, which is a three-level surge protection unit.

[0048] As a preferred embodiment, such as Figure 4 As shown, the three-stage surge protection unit includes a surge protection chip 231, an electronic current limiter 232 (TBU-CA065), a ceramic gas discharge tube 233, and a transient voltage suppressor diode 234 (TVS diode). The surge protection chip 231 is connected to the electronic current limiter 232, the ceramic gas discharge tube 233, and the transient voltage suppressor diode 234, respectively. The electronic current limiter 232 is connected in parallel with the ceramic gas discharge tube 233 and the transient voltage suppressor diode 234, respectively. This multi-stage surge protection system can achieve overvoltage and overcurrent protection, improving the electrical protection and reliability of the system. It has good surge protection capability, effectively coping with 10 / 700μs waveform lightning surges in industrial environments, effectively extending the service life of system components, and effectively reducing system maintenance costs.

[0049] In this embodiment, an electronic current limiter (Littelfuse) serves as the first level of protection, capable of quickly interrupting abnormal current (response time ≤ 1ns) and withstanding a peak current of 1kA (8 / 20μs waveform). A combination of a ceramic gas discharge tube and a TVS diode is used as the second level of protection, with a 600W surge protection TVS per line. Combined with a common-mode choke (1mH inductance), this effectively absorbs 10 / 700μs waveform surges, suppressing the common-mode voltage within ±7V, achieving a common-mode rejection ratio (CMRR) of over 100dB, meeting the GB / T17626.5 standard. Furthermore, an ESD surge protection chip is used as the third level of protection, achieving ±15kV contact discharge protection, meeting the IEC 61000-4-2 standard.

[0050] In a preferred embodiment, the industrial-grade RS485 multi-protocol intelligent conversion system employs a wide-voltage input circuit, supporting DC 9V-60V power supply; the digital isolation chip outputs a DC 5V / 3.3V voltage. That is, the system of this application can achieve power management and wide voltage support.

[0051] In a preferred embodiment, an LED indicator 11 is provided on the end face of the housing 10 for real-time display of the power module (not shown in the figure) status, data transmission and reception, and fault alarm information. The LED indicator 11 is connected to the power module and the signal processing module 20, respectively, and the power module is disposed inside the housing 10. The status of the industrial-grade RS485 multi-protocol intelligent conversion system can be monitored in real time through the LED indicator, and its power status, data transmission and reception, fault alarm, and other information can be displayed in real time. The power module can be equipped with a power isolation module, so that the input and output isolation voltage is 5kV and the ripple is ≤50mV. The power module uses an aluminum substrate (thickness 1.6mm, thermal resistance ≤0.5K / W), and the power devices are soldered by reflow soldering process (peak temperature 235℃).

[0052] In a preferred embodiment, the signal processing module 20 is a hot-swappable module; the protocol conversion engine is a hot-swappable engine; both the signal processing module 20 and the protocol conversion engine are independently packaged using potting. In this embodiment, the functional modules are independently packaged and hot-swapped, which effectively simplifies the assembly process, makes disassembly and assembly convenient, and improves assembly efficiency.

[0053] In a preferred embodiment, the hot-swappable module is fixed via a self-locking slot structure (not shown in the figure). The self-locking slot structure includes spiral distribution receiving slots at both ends of the hot-swappable module and magnetic beads embedded within these spiral distribution receiving slots. The magnetic beads are adapted to the spiral distribution receiving slots. In this embodiment, the pitch of the spiral distribution receiving slot matches a standard thread, and after insertion, the magnetic beads are embedded in the thread to achieve tool-less locking, with an axial tensile strength ≥50N. In other embodiments, the signal processing module 20 may not use a hot-swappable mode; the signal processing module 20 can be adapted to various installation cabinets of communication base stations via a 19-inch standard rack.

[0054] In a preferred embodiment, the hot-swappable module is provided with elastic metal clips on both sides (not shown in the figure). Generally, the elastic metal clips are made of beryllium bronze with an elastic coefficient of 200 N / mm to ensure the connection stability of the module under vibration.

[0055] In a preferred embodiment, the filling method is achieved as follows: a two-component silicone potting compound is mixed evenly at a mass ratio of 1:1 and then potted onto the surface of the hot-swappable module. The mixture is then vacuum degassed and cured to obtain an independently packaged module. After curing, the potting compound has a hardness of Shore A 40 and a temperature resistance range of -50℃ to 200℃.

[0056] As a preferred embodiment, the vacuum degassing condition is to maintain a vacuum of -0.1 MPa for 30 minutes; the curing condition is to cure at room temperature for 24 hours or at 80°C for 2 hours.

[0057] In a preferred embodiment, the industrial-grade RS485 multi-protocol intelligent conversion system further includes a BMS bus management system (not shown in the figure) and a circuit board 40 disposed within the housing 10. The BMS bus management system is connected to a BMS (not shown in the figure) and multiple sensors (not shown in the figure); the signal processing module 20 is integrated within the circuit board 40. Thus, the BMS bus management system monitors the multiple connected sensors in real time, collects various data such as temperature, humidity, and pressure, and transmits the data to the BMS.

[0058] In a preferred embodiment, the back of the housing 10 is provided with a plurality of heat dissipation fins 12, the spacing between the plurality of heat dissipation fins 12 being 3 mm; the height of each heat dissipation fin 12 being 15 mm. The heat dissipation fins 12 can be obtained by extrusion molding process (aluminum alloy 6063-T5). The heat dissipation fins can facilitate heat dissipation of the housing, so that the temperature rise of the housing is controlled within 30 K.

[0059] In a preferred embodiment, the circuit board 40 is fixed to the end face 13 inside the housing 10 by a silicone pad (not shown in the figure); the silicone pad is fixedly connected to the circuit board 40 by double-sided adhesive (3M 467MP); the silicone pad has a hardness of Shore A 50 and a thickness of 2mm. Through the elastic cushioning effect of the silicone pad, the circuit board can withstand 5g vibration (10-2000Hz).

[0060] In a preferred embodiment, the industrial-grade RS485 multi-protocol intelligent conversion system is a 19-inch standard-size system; both the RS485 input interface 21 and the RS485 output interface 22 are RJ45 standard interfaces. Through the standard interface, it can be connected to a standard network cable, achieving size and interface standardization. It supports the ISO6722 standard charging gun interface (anti-misinsertion design), with pin gold plating thickness ≥3μm and contact resistance ≤50mΩ. This avoids the problem of poor interoperability between RS485 devices from different manufacturers due to differences in protocol frame formats, greatly improving the interoperability and convenience of RS485 devices from different manufacturers, and also significantly improving work efficiency.

[0061] The system of this application was tested and verified, and the specific testing methods are described below:

[0062] (a) Protection level test

[0063] 1. IP67 test

[0064] 1.1 Dustproof test: Place the equipment in a sand and dust test chamber (compliant with IEC60529), draw a negative pressure to -2kPa, and continue for 8 hours. After the test, no dust should enter the interior.

[0065] 1.2 Waterproof test: The equipment is immersed in 1 meter of water (compliant with IEC60529) for 30 minutes, and the cover is opened to check that no water droplets have entered.

[0066] 2. Surge test

[0067] 2.1 Using a HAEFELY TR6000 surge generator, apply a 10 / 700μs waveform 6kV surge (common mode / differential mode) 10 times, and the communication interruption rate is 0.

[0068] (II) Performance Verification

[0069] 1. Multi-node communication test

[0070] 1.1 Build a 256-node RS485 network and monitor signal integrity using a Tektronix MSO6B series oscilloscope, with a bit error rate ≤10⁻ 9 The delay is ≤10ms.

[0071] 2. Protocol Conversion Test

[0072] 2.1 The mapping function was verified using Modbus Slave simulation software (Modbus Slave RTU) and OPC UA client (Unified Automation UaExpert), and the data consistency reached 99.99%.

[0073] (II) Verification of on-site maintenance plan:

[0074] 1. Hot-swap operation specifications

[0075] (1) Module replacement steps:

[0076] (1.1) Press the release button (mechanical life ≥ 100,000 times) to unlock the latch;

[0077] (1.2) Pull out the module along the guide rail (insertion and extraction force ≤ 15N);

[0078] (1.3) Insert the new module into the card slot locking position;

[0079] (1.4) Confirm that the OLED screen display is normal.

[0080] 2. OTA upgrade implementation: Batch upgrades use Bluetooth Mesh network (Nordic nRF52840 chip), single device upgrade time ≤30 seconds, OTA upgrade is implemented through Python script.

[0081] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0082] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0083] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An industrial-grade RS485 multi-protocol intelligent conversion system, characterized in that, The system includes a housing and a signal processing module disposed within the housing. The signal processing module includes N independently configured RS485 input interfaces and N independently configured RS485 output interfaces, where N ≥ 2 and N is an integer. The RS485 input interfaces and the RS485 output interfaces are configured in a one-to-one correspondence. A main control chip is disposed within the signal processing module, and the main control chip is connected to each of the RS485 input interfaces and each of the RS485 input output interfaces.

2. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 1, characterized in that, The signal processing module switches between master and slave modes via a DIP switch or software configuration. The signal processing module integrates a differential signal conversion unit for completely isolating the ground potential of the input signal of the RS485 input interface or the ground potential of the output signal of the RS485 output interface; the differential signal conversion unit is at least one of an optocoupler transceiver isolator or a digital isolation chip.

3. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 1, characterized in that, The signal processing module integrates a protocol conversion engine.

4. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 1, characterized in that, The signal processing module integrates a multi-level surge protection system, which is a three-level surge protection unit.

5. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 4, characterized in that, The three-level surge protection unit includes a surge protection chip, an electronic current limiter, a ceramic gas discharge tube, and a transient suppression diode. The surge protection chip is connected to the electronic current limiter, the ceramic gas discharge tube, and the transient suppression diode, respectively. The electronic current limiter is connected in parallel with the ceramic gas discharge tube and the transient suppression diode, respectively.

6. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 1, characterized in that, The industrial-grade RS485 multi-protocol intelligent conversion system adopts a wide-voltage input circuit and supports DC9V-60V power supply; the digital isolation chip outputs a DC5V / 3.3V voltage. The end face of the housing is provided with LED indicator lights for real-time display of power module status, data transmission and reception, and fault alarm information. The LED indicator lights are connected to the power module and the signal processing module respectively. The power module is disposed inside the housing.

7. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 6, characterized in that, The signal processing module is a hot-swappable module; the protocol conversion engine is a hot-swappable engine; both the signal processing module and the protocol conversion engine are independently packaged using a potting method.

8. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 7, characterized in that, The filling method is achieved by the following steps: a two-component silicone potting compound is mixed evenly at a mass ratio of 1:1 and then potted onto the surface of the hot-swappable module. After vacuum degassing and curing, an independently packaged module is obtained.

9. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 8, characterized in that, The vacuum degassing conditions are to maintain a vacuum of -0.1 MPa for 30 minutes; the curing conditions are to cure at room temperature for 24 hours or at 80°C for 2 hours.

10. The industrial-grade RS485 multi-protocol intelligent conversion system according to claim 1, characterized in that, The industrial-grade RS485 multi-protocol intelligent conversion system also includes a BMS bus management system and a circuit board disposed within the housing. The BMS bus management system is connected to the BMS and multiple sensors respectively. The signal processing module is integrated into the circuit board. The back of the housing is provided with several heat dissipation fins, the spacing between the heat dissipation fins is 3mm; the height of each heat dissipation fin is 15mm. The circuit board is fixed to the end face inside the housing by a silicone pad; the silicone pad is fixedly connected to the circuit board by double-sided adhesive; the silicone pad has a hardness of Shore A 50 and a thickness of 2mm; The industrial-grade RS485 multi-protocol intelligent conversion system is a 19-inch standard size system; both the RS485 input interface and the RS485 output interface are RJ45 standard interfaces.

Images