Display panel for improving optical crosstalk and preparation method thereof

Abstract

The invention provides a display panel for improving optical crosstalk and a preparation method thereof, and belongs to the technical field of photoelectron manufacturing. The display panel comprises a light-emitting functional layer, a driving substrate, a shading conductive layer and a bridging conductive layer, the light-emitting functional layer is located on the driving substrate and electrically connected with the driving substrate, and the light-emitting functional layer comprises a plurality of light-emitting units arranged at intervals; the shading conductive layer is located on the driving substrate, fills gaps among the light emitting units and is insulated from the light emitting units; the bridging conducting layer is located on the surface, away from the driving substrate, of the shading conducting layer, and the bridging conducting layer is used for connecting the two adjacent light emitting units. According to the embodiment of the invention, the problem of light crosstalk between adjacent light-emitting units in the display panel can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of optoelectronic manufacturing technology, and in particular to a display panel with improved optical crosstalk and a method for its fabrication. Background Technology

[0002] Micro LED (Micro Light Emitting Diode) display panels are a display technology that uses micron-sized LED chips as self-emissive pixels. It integrates millions of Micro LED chips onto a driving substrate using mass transfer technology, enabling independent light control for each pixel.

[0003] In related technologies, the display panel includes a driving substrate and multiple Micro LED chips. The Micro LED chips are arranged in an array on the driving substrate and electrically connected and integrated with the driving substrate, so that the driving substrate can precisely control the light emission state of each Micro LED chip.

[0004] Because of the small size of Micro LED chips and the small spacing between adjacent Micro LED chips, light emitted from each Micro LED chip can easily hit adjacent Micro LED chips, resulting in problems such as light crosstalk and contrast loss. Summary of the Invention

[0005] This disclosure provides a display panel with improved optical crosstalk and a method for manufacturing the same, which can improve the optical crosstalk problem between adjacent light-emitting units in the display panel. The technical solution is as follows:

[0006] On one hand, this disclosure provides a display panel comprising: a light-emitting functional layer, a driving substrate, a light-shielding conductive layer, and a bridging conductive layer. The light-emitting functional layer is located on the driving substrate and electrically connected to the driving substrate, and includes a plurality of spaced-apart light-emitting units. The light-shielding conductive layer is located on the driving substrate, fills the gaps between the plurality of light-emitting units, and is insulated from each of the light-emitting units. The bridging conductive layer is located on the surface of the light-shielding conductive layer away from the driving substrate, and is used to connect two adjacent light-emitting units.

[0007] In one implementation of this disclosure, at least a portion of the orthographic projection of each light-emitting unit onto the surface of the driving substrate overlaps with the orthographic projection of the bridging conductive layer onto the surface of the driving substrate.

[0008] In another implementation of this disclosure, the bridging conductive layer includes a metal layer, and the peripheral edge of the orthographic projection of each light-emitting unit on the surface of the driving substrate overlaps with the orthographic projection of the metal layer on the surface of the driving substrate.

[0009] In another implementation of this disclosure, the metal layer has light-transmitting holes that correspond one-to-one with the light-emitting units, and the orthographic projection of the light-transmitting hole on the surface of the driving substrate is located within the orthographic projection of the corresponding light-emitting unit on the surface of the driving substrate.

[0010] In another implementation of this disclosure, the metal layer includes a plurality of first metal strips and a plurality of second metal strips. The plurality of first metal strips are spaced apart along a first direction, and the plurality of second metal strips are spaced apart along a second direction. The first direction and the second direction have a non-zero included angle. The plurality of first metal strips and the plurality of second metal strips are interlaced to form a mesh structure. Each intersection of the first metal strips and the second metal strips has a light-transmitting hole, and the light-transmitting hole corresponds one-to-one with the light-emitting unit. The orthographic projection of the light-transmitting hole on the surface of the driving substrate is located within the orthographic projection of the corresponding light-emitting unit on the surface of the driving substrate.

[0011] In another implementation of this disclosure, the bridging conductive layer includes a transparent conductive layer, and the orthographic projection of each light-emitting unit on the surface of the driving substrate is located within the orthographic projection of the transparent conductive layer on the surface of the driving substrate.

[0012] In another implementation of this disclosure, the display panel further includes an insulating layer, which is located at least on the surface of the driving substrate, in the gap between the light-emitting units, and on the sidewall of the light-emitting unit, and the light-shielding conductive layer is located on the surface of the insulating layer.

[0013] In another implementation of this disclosure, the surface of the light-shielding conductive layer away from the driving substrate is not lower than the top surface of the light-emitting unit.

[0014] In another implementation of this disclosure, the display panel further includes a light-collecting structure located on the surface of the bridging conductive layer. The light-collecting structure corresponds one-to-one with the light-emitting unit, and the orthographic projection of the light-emitting unit on the surface of the driving substrate is located within the orthographic projection of the corresponding light-collecting structure on the surface of the driving substrate.

[0015] Secondly, embodiments of this disclosure provide a method for fabricating a display panel, the method comprising: forming a light-emitting functional layer on a substrate; bonding the light-emitting functional layer to a driving substrate and removing the substrate to electrically connect the light-emitting functional layer to the driving substrate; patterning the light-emitting functional layer to form a plurality of spaced light-emitting units; forming a light-shielding conductive layer on the driving substrate, the light-shielding conductive layer filling the gaps between the plurality of light-emitting units and being insulated from each of the light-emitting units; and forming a bridging conductive layer on the surface of the light-shielding conductive layer away from the driving substrate, the bridging conductive layer being used to connect two adjacent light-emitting units.

[0016] The beneficial effects of the technical solutions provided in this disclosure include at least the following:

[0017] The display panel provided in this embodiment of the present disclosure incorporates a light-shielding conductive layer that directly fills the gaps between the light-emitting units. Utilizing the physical blocking properties of the light-shielding conductive layer, it effectively absorbs or reflects the lateral light emitted from the light-emitting units, reducing light diffusion to adjacent units. Simultaneously, the light-shielding conductive layer remains insulated from the light-emitting units, ensuring electrical isolation to avoid short-circuit risks and blocking lateral light emission, thereby effectively suppressing the propagation path of crosstalk light.

[0018] Meanwhile, in this embodiment, the light-shielding conductive layer is a structure used for electrical connection with the driving circuit on the driving substrate. By connecting adjacent light-shielding conductive layers through bridging conductive layers, the electrical interconnection of the light-emitting units is indirectly realized. Using the bridging conductive layer as a conductive bridge, the electrical signal of the driving substrate is transmitted to each light-emitting unit through the light-shielding conductive layer, ensuring that the light-emitting state of each unit is controlled by the driving substrate. The combination of the bridging conductive layer and the light-shielding conductive layer can also enhance the mechanical stability of the overall structure, avoid stress concentration problems caused by gap filling, and improve the reliability of the display panel.

[0019] Furthermore, the shielding effect of the light-shielding conductive layer not only reduces stray light but also indirectly guides the light to be emitted more concentratedly forward, improving the collimation of the emitted light and making the image details clearer. The reduction of optical crosstalk directly reduces the light interference between adjacent pixels, making the light-emitting units that need to be turned off dimmer and the light-emitting units that need to be turned on brighter, thus improving the image contrast of the display panel. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this disclosure;

[0022] Figure 2 This is a top view of a display panel provided in an embodiment of this disclosure;

[0023] Figure 3 yes Figure 2 Provide a cross-sectional view of MM;

[0024] Figure 4 This is a top view of a display panel provided in an embodiment of this disclosure;

[0025] Figure 5 This is a top view of another display panel provided in an embodiment of this disclosure;

[0026] Figure 6 yes Figure 5 Provide an NN cross-sectional view;

[0027] Figure 7 This is a flowchart of a method for manufacturing a display panel according to an embodiment of this disclosure;

[0028] Figure 8 This is a manufacturing state diagram of a display panel provided in an embodiment of this disclosure;

[0029] Figure 9 This is a manufacturing state diagram of a display panel provided in an embodiment of this disclosure;

[0030] Figure 10 This is a manufacturing state diagram of a display panel provided in an embodiment of this disclosure.

[0031] The markings in the diagram are explained as follows:

[0032] 10. Light-emitting functional layer; 100. Light-emitting unit;

[0033] 11. First semiconductor layer; 12. Multiple quantum well layer; 13. Second semiconductor layer;

[0034] 20. Driving substrate;

[0035] 30. Light-shielding conductive layer;

[0036] 40. Bridging conductive layer; 41. Light-transmitting hole; 401. First metal strip; 402. Second metal strip; 403. Transparent conductive layer;

[0037] 50. Insulation layer;

[0038] 60. Light-collecting structure;

[0039] 70. Substrate; 71. Contact layer; 72. Bonding metal layer. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0041] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” “third,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an” or “a” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar terms mean that the elements or objects preceding “comprising” or “including” encompass the elements or objects listed following “comprising” or “including” and their equivalents, and do not exclude other elements or objects. The terms “connected” or “linked” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” “right,” “top,” and “bottom,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0042] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this disclosure. Figure 1 As shown, the display panel includes: a light-emitting functional layer 10, a driving substrate 20, a light-shielding conductive layer 30, and a bridging conductive layer 40. The light-emitting functional layer 10 is located on the driving substrate 20 and is electrically connected to the driving substrate 20. The light-emitting functional layer 10 includes a plurality of light-emitting units 100 arranged at intervals.

[0043] like Figure 1 As shown, the light-shielding conductive layer 30 is located on the driving substrate 20. The light-shielding conductive layer 30 fills the gaps between the multiple light-emitting units 100, and the light-shielding conductive layer 30 is insulated from each light-emitting unit 100.

[0044] like Figure 1 As shown, the bridging conductive layer 40 is located on the surface of the light-shielding conductive layer 30 away from the driving substrate 20, and the bridging conductive layer 40 is used to connect two adjacent light-emitting units 100.

[0045] The display panel provided in this embodiment of the present disclosure, by providing a light-shielding conductive layer 30 and directly filling the gaps between the light-emitting units 100, effectively absorbs or reflects the lateral light emitted by the light-emitting units 100 by utilizing the physical blocking properties of the light-shielding conductive layer 30, reducing the diffusion of light to adjacent light-emitting units 100. At the same time, the light-shielding conductive layer 30 remains insulated from the light-emitting units 100, ensuring electrical isolation, avoiding the risk of short circuits, and blocking lateral light emission, thereby effectively suppressing the propagation path of crosstalk light.

[0046] Meanwhile, in this embodiment, the light-shielding conductive layer 30 is a structure used for electrical connection with the driving circuit on the driving substrate 20. Adjacent light-shielding conductive layers 30 are connected by a bridging conductive layer 40, indirectly realizing the electrical interconnection of the light-emitting units 100. Using the bridging conductive layer 40 as a conductive bridge, the electrical signals of the driving substrate 20 are transmitted to each light-emitting unit 100 via the light-shielding conductive layer 30, ensuring that the light-emitting state of each unit is controlled by the driving substrate 20. The combination of the bridging conductive layer 40 and the light-shielding conductive layer 30 also enhances the mechanical stability of the overall structure, avoids stress concentration problems caused by gap filling, and improves the reliability of the display panel.

[0047] Furthermore, the light-shielding conductive layer 30 not only reduces stray light but also indirectly guides the light to be emitted more concentratedly forward, improving the collimation of the emitted light and making the image details clearer. The reduction of light crosstalk directly reduces light interference between adjacent pixels, making the light-emitting units 100 that need to be turned off darker and the light-emitting units 100 that need to be turned on brighter, thus improving the image contrast of the display panel.

[0048] Optionally, the light-shielding conductive layer 30 can be a metal layer.

[0049] For example, the light-shielding conductive layer 30 may include at least one of the following: a Mo layer, a Cr layer, a Ni layer, an Al layer, a Cu layer, an Ag layer, and an Au layer.

[0050] Among them, metallic chromium has high hardness and good wear resistance, which can enhance structural stability, and it has high reflectivity to visible light, which helps to suppress stray light. Metallic nickel has strong oxidation resistance and good compatibility with a variety of materials, which can ensure reliable connection with the driving substrate 20, while providing good light shielding and conductivity.

[0051] Optionally, such as Figure 1 As shown, at least a portion of the orthographic projection of each light-emitting unit 100 on the surface of the driving substrate 20 overlaps with the orthographic projection of the bridging conductive layer 40 on the surface of the driving substrate 20.

[0052] In the above implementation, the bridging conductive layer 40 is used to connect adjacent light-emitting units 100. The overlapping of the orthographic projection makes the electrical connection between the light-emitting unit 100 and the bridging conductive layer 40 more direct, and the current can flow more efficiently between the light-emitting unit 100 and the bridging conductive layer 40, reducing resistance, reducing the loss of electrical energy in the transmission process, helping to improve the efficiency of electrical energy utilization, ensuring that the light-emitting unit 100 obtains a stable driving current, so that the light-emitting unit 100 can emit light more stably.

[0053] Meanwhile, within the limited area of ​​the driving substrate 20, by overlapping the projections of the light-emitting unit 100 and the bridging conductive layer 40, the structure of the entire display panel becomes more compact, which is beneficial for achieving miniaturization and integration of the display panel.

[0054] In one implementation of this disclosure, Figure 2 This is a top view of a display panel provided in an embodiment of this disclosure. Figure 3 yes Figure 2 Provide a cross-sectional view of MM. For example... Figure 2 , 3 As shown, the bridging conductive layer 40 includes a metal layer, and the peripheral edge of the orthographic projection of each light-emitting unit 100 on the surface of the driving substrate 20 overlaps with the orthographic projection of the metal layer on the surface of the driving substrate 20.

[0055] A metal layer is used as the bridging conductive layer 40. The high conductivity of the metal material effectively reduces the current transmission impedance, ensuring that the driving substrate 20 accurately transmits the electrical signal to each light-emitting unit 100, and avoiding uneven light emission or brightness decay caused by excessive local resistance. The overlapping design of the peripheral edge of the light-emitting unit 100 and the metal layer is equivalent to forming a ring-shaped conductive enclosure at the edge of the unit, which enables the electrical signal to be synchronously coupled to the light-emitting unit 100 from multiple directions, further balancing the electric field distribution inside the unit, reducing the risk of edge leakage or uneven potential, and improving the consistency of light emission.

[0056] Meanwhile, the metal layer itself has high reflectivity. Its overlap with the edge of the light-emitting unit 100 can not only block the light escaping obliquely from the adjacent unit through physical shielding, but also reflect the small amount of light that may leak back into the light-emitting unit 100 or in the forward light-emitting direction, reducing light energy waste while enhancing forward brightness and indirectly improving contrast.

[0057] Furthermore, the mechanical strength of the metal layer is higher than that of ordinary conductive materials, and its overlap with the edge of the light-emitting unit 100 can help fix the light-shielding conductive layer 30, preventing interlayer peeling caused by thermal expansion and contraction or external impact.

[0058] Optionally, such as Figure 2 , 3As shown, the metal layer has light-transmitting holes 41 that correspond one-to-one with the light-emitting units 100. The orthographic projection of the light-transmitting holes 41 on the surface of the driving substrate 20 is located within the orthographic projection of the corresponding light-emitting unit 100 on the surface of the driving substrate 20.

[0059] The light-transmitting hole 41 ensures smooth light emission from the light-emitting unit 100. Since the light-transmitting hole 41 is projected directly into the projection of the light-emitting unit 100, it does not block the effective light emitted by the light-emitting unit 100, allowing light to escape from the light-emitting unit 100 without obstruction. This minimizes light loss caused by the metal layer blocking the light, ensuring the luminous efficiency and brightness of the light-emitting unit 100, and making the display image brighter and clearer.

[0060] Furthermore, the precise positioning of the light-transmitting hole 41 avoids the influence of the metal layer on adjacent light-emitting units 100. Because the light-transmitting hole 41 is only within the range of the corresponding light-emitting unit 100, the metal layer will not extend into the area of ​​adjacent light-emitting units 100, further reducing the possibility of mutual light interference between adjacent light-emitting units 100 and enhancing the contrast of the display panel.

[0061] For example, the metal layer may include at least one of an Al layer, a Cu layer, an Ag layer, and an Au layer.

[0062] For example, the distance between the outer contour of the orthographic projection of the light-transmitting hole 41 and the outer contour of the orthographic projection of the corresponding light-emitting unit 100 is 0.1 μm to 1 μm.

[0063] If the distance between the outer contour of the orthographic projection of the light-transmitting hole 41 and the outer contour of the orthographic projection of the corresponding light-emitting unit 100 is too small, it will be difficult to ensure that the light-transmitting hole 41 accurately corresponds to the light-emitting unit 100 during the manufacturing process due to limitations in process precision. This can easily lead to the light-transmitting hole 41 shifting and blocking part of the light-emitting area, thus affecting the light emission efficiency. On the other hand, if the distance between the outer contour of the orthographic projection of the light-transmitting hole 41 and the outer contour of the orthographic projection of the corresponding light-emitting unit 100 is too large, it will increase the unnecessary light-blocking area, reduce the effective light emission ratio, and be detrimental to improving display brightness.

[0064] In another implementation of this disclosure, Figure 4 This is a top view of a display panel provided in an embodiment of this disclosure. Wherein, Figure 4 A schematic cross-sectional view of the display panel and Figure 3 Similar. For example... Figure 4 As shown, the metal layer includes a plurality of first metal strips 401 and a plurality of second metal strips 402. The plurality of first metal strips 401 are arranged at intervals along a first direction, and the plurality of second metal strips 402 are arranged at intervals along a second direction. The first direction and the second direction have a non-zero included angle, and the plurality of first metal strips 401 and the plurality of second metal strips 402 are interlaced to form a mesh structure.

[0065] like Figure 4 As shown, each intersection of the first metal strip 401 and the second metal strip 402 has a light-transmitting hole 41, and the light-transmitting hole 41 corresponds one-to-one with the light-emitting unit 100. The orthographic projection of the light-transmitting hole 41 on the surface of the driving substrate 20 is located within the orthographic projection of the corresponding light-emitting unit 100 on the surface of the driving substrate 20.

[0066] In the above implementation, the metal layer is designed as crisscrossing metal strips to form a continuous conductive mesh layer. This ensures that the driving signal is uniformly transmitted to each light-emitting unit 100, and also achieves precise point-to-point light transmission through the light-transmitting holes 41 at the intersections. Each light-transmitting hole 41 strictly corresponds to a single light-emitting unit 100, ensuring that the emitted light is not blocked, and effectively suppressing stray light interference between adjacent units through the physical barrier of the metal mesh, thus meeting the dual requirements of electrical connectivity and optical isolation.

[0067] Furthermore, the crisscrossing metal strips support each other, resisting deformation caused by thermal expansion and contraction or external forces, and preventing interlayer delamination caused by stress concentration. Compared to a full-surface metal mesh structure, it also reduces metal coverage, decreases the amount of metal material used, and lowers manufacturing costs.

[0068] Meanwhile, by adjusting the spacing of the metal strips and the size of the light-transmitting hole 41, the light-emitting area boundary of each light-emitting unit 100 can be flexibly controlled. The precise positioning of the light-transmitting hole 41 ensures that the light only shines from the center of the target unit. Combined with the lateral blocking effect of the metal mesh, it not only enhances the concentration of the forward light emission, but also further blocks the propagation path of the oblique stray light, achieving higher contrast and clearer display details.

[0069] For example, the metal layer may include at least one of an Al layer, a Cu layer, an Ag layer, and an Au layer.

[0070] For example, the distance between the outer contour of the orthographic projection of the light-transmitting hole 41 and the outer contour of the orthographic projection of the corresponding light-emitting unit 100 is 0.1 μm to 1 μm.

[0071] If the distance between the outer contour of the orthographic projection of the light-transmitting hole 41 and the outer contour of the orthographic projection of the corresponding light-emitting unit 100 is too small, it will be difficult to ensure that the light-transmitting hole 41 accurately corresponds to the light-emitting unit 100 during the manufacturing process due to limitations in process precision. This can easily lead to the light-transmitting hole 41 shifting and blocking part of the light-emitting area, thus affecting the light emission efficiency. On the other hand, if the distance between the outer contour of the orthographic projection of the light-transmitting hole 41 and the outer contour of the orthographic projection of the corresponding light-emitting unit 100 is too large, it will increase the unnecessary light-blocking area, reduce the effective light emission ratio, and be detrimental to improving display brightness.

[0072] In some other display panels, Figure 5This is a top view of another display panel provided in an embodiment of this disclosure. Figure 6 yes Figure 5 Provides an NN cross-sectional view. For example... Figure 5 , 6 As shown, the bridging conductive layer 40 includes a transparent conductive layer 403, and the orthographic projection of each light-emitting unit 100 on the surface of the driving substrate 20 is located within the orthographic projection of the transparent conductive layer 403 on the surface of the driving substrate 20.

[0073] The transparent conductive layer 403 has high light transmittance and completely covers the orthographic projection of the light-emitting unit 100. This means that the light emitted by the light-emitting unit 100 does not need to pass through the obstruction of opaque materials such as metal and can be emitted directly outward. This avoids light loss caused by reflection or absorption by the metal layer and maximizes the effective light output of the light-emitting unit 100, thereby improving the overall brightness and display uniformity.

[0074] Meanwhile, the transparent conductive layer 403 possesses excellent conductivity, reliably transmitting electrical signals from the driving substrate 20 to each light-emitting unit 100, ensuring that the light-emitting state of each unit is controlled. Furthermore, its design, covering the orthographic projection of all light-emitting units 100, provides more comprehensive coverage of the electrical connection path, reducing the risk of open circuits due to poor local contact and improving the reliability of the circuit connection. Moreover, the flexible nature of the transparent conductive layer 403 better adapts to the minute deformations of the driving substrate 20, preventing interlayer cracking caused by thermal or mechanical stress.

[0075] For example, the transparent conductive layer 403 may be an ITO layer or an IZO layer.

[0076] As an example, the thickness of the transparent conductive layer 403 can be greater than or equal to 2000 angstroms. This thickness range ensures good conductivity for effective transmission of electrical signals while also providing high transparency to reduce obstruction of the light emitted by the light-emitting unit 100.

[0077] Optionally, such as Figure 1 As shown, the display panel also includes an insulating layer 50, which is located at least on the surface of the driving substrate 20, in the gap between the light-emitting units 100, and on the sidewall of the light-emitting unit 100. The light-shielding conductive layer 30 is located on the surface of the insulating layer 50.

[0078] The insulating layer 50 prevents the light-emitting unit 100 from directly conducting with the light-shielding conductive layer 30, avoiding short circuits or leakage, and ensuring that the current drives the light-emitting unit 100 only through a preset path, thus improving circuit safety and stability. The insulating layer 50 fills the gaps and uneven surfaces of the light-emitting unit 100 and its sidewalls, providing a flat substrate for the light-shielding conductive layer 30, allowing it to uniformly fill the gaps and fit tightly, avoiding breakage or poor contact of the light-shielding layer due to uneven surfaces.

[0079] For example, the insulating layer 50 may include a distributed Bragg reflector (DBR) layer.

[0080] The DBR layer may include multiple alternating layers of first material and multiple layers of second material, with different refractive indices for the first and second material layers.

[0081] For example, one of the first material layer and the second material layer is a TiO2 layer, and the other of the first material layer and the second material layer is a SiO2 layer.

[0082] The DBR's reflection band is wavelength selective, allowing for precise reflection while allowing other stray wavelengths to pass through, thus enhancing the directional output of effective light. The insulating layer 50, together with the light-shielding conductive layer 30, reflects lateral light, further suppressing stray light interference between adjacent units.

[0083] For example, the thickness of the insulating layer 50 is 0.5 μm to 2 μm.

[0084] Optionally, such as Figure 1 As shown, the surface of the light-shielding conductive layer 30 that is away from the driving substrate 20 is not lower than the top surface of the light-emitting unit 100.

[0085] When the surface of the light-shielding layer is higher than or flush with the top surface of the light-emitting unit 100, it can not only block stray light escaping from the side of the light-emitting unit 100, but also directly block the top edge area of ​​the light-emitting unit 100, further suppressing the oblique diffusion of light to adjacent units, especially the lateral light leakage near the top of the light-emitting unit 100, thus achieving multi-dimensional cutting off of the light crosstalk path.

[0086] For example, the surface of the light-shielding conductive layer 30 away from the driving substrate 20 may be within 0.5 μm higher than the top surface of the light-emitting unit 100.

[0087] If the light-shielding conductive layer 30 is too high, it will result in an excessively thick light-shielding conductive layer 30, increasing the difficulty of subsequent encapsulation or electrode lead-out steps, and may even cause film warping due to stress concentration.

[0088] Optionally, the display panel also includes a light-collecting structure 60, which is located on the surface of the bridging conductive layer 40. The light-collecting structure 60 corresponds one-to-one with the light-emitting unit 100. The orthographic projection of the light-emitting unit 100 on the surface of the driving substrate 20 is located within the orthographic projection of the corresponding light-collecting structure 60 on the surface of the driving substrate 20.

[0089] In the above implementation, a light-collecting structure 60 is set up to correspond one-to-one with the light-emitting unit 100. The light-collecting structure 60 can accurately collect the light emitted by the light-emitting unit 100, gather the light energy, enhance the intensity of the emitted light, and make the display screen brighter and clearer.

[0090] Optionally, such as Figure 1 As shown, the surface of the light-collecting structure 60 that is away from the driving substrate 20 is an arc surface.

[0091] In the above implementation, by setting the surface of the light-collecting structure 60 as a convex arc surface, the obliquely escaping light can be guided to redirect to the effective light-emitting area, further reducing light crosstalk between adjacent pixels and improving contrast in conjunction with the collimation layer.

[0092] For example, the surface of the light-collecting structure 60 is spherical. The spherical structure has a universal light-gathering effect, which is especially suitable for omnidirectional Micro LED chips. The hemispherical arc surface can symmetrically refract light incident from all angles, uniformly enhancing the overall brightness.

[0093] In this embodiment of the disclosure, the curvature of the arc surface can be precisely designed to compensate for the differences in light output brightness at different positions of the light-emitting unit 100.

[0094] Because the light emission from different positions of the light-emitting unit 100 may vary—for example, the center of the light-emitting unit 100 may emit strong light while the edges may emit weak light—the curvature of the arc surface in that area can be designed to be relatively small to allow the light to diffuse appropriately and avoid excessive concentration that could lead to localized overbrightness. Conversely, for areas where the light emission from the edges of the light-emitting unit 100 is weak, the curvature can be increased to enhance the refraction and focusing of light, directing more edge light towards the effective emission direction and improving edge brightness. This differentiated curvature design ensures that the light emitted from different positions is more uniform overall, preventing localized overbrightness or underbrightness and resulting in a more uniform brightness of the displayed image.

[0095] Alternatively, the light-collecting structure 60 can be made of PDMS, PMMA, or silicon dioxide.

[0096] Polydimethylsiloxane (PDMS) is a flexible and bendable material; its light transmittance exceeds 90%, which reduces total reflection and makes it suitable for flexible Micro LED panels.

[0097] Among them, polymethyl methacrylate (PMMA) has a light transmittance of over 92%, good optical uniformity, moderate mechanical strength, good weather resistance, and is easy to mold, making it suitable for preparing light-collecting structures for large-area planar displays 60.

[0098] Among them, silicon dioxide has a light transmittance of over 95% and excellent thermal stability, and can be precisely processed into microstructures through etching, making it suitable for high-temperature processes and high-precision display requirements.

[0099] Optionally, such as Figure 1 As shown, each light-emitting unit 100 includes a first semiconductor layer 11, a multiple quantum well layer 12, and a second semiconductor layer 13 stacked sequentially.

[0100] In this embodiment of the present disclosure, one of the first semiconductor layer 11 and the second semiconductor layer 13 is a p-type layer, and the other of the first semiconductor layer 11 and the second semiconductor layer 13 is an n-type layer.

[0101] As an example, the first semiconductor layer 11 is an n-type layer and the second semiconductor layer 13 is a p-type layer.

[0102] Optionally, the first semiconductor layer 11 is an n-type GaN layer. The thickness of the n-type GaN layer can be from 0.5 μm to 1 μm.

[0103] Optionally, the multiple quantum well layer 12 includes alternating InGaN quantum well layers and GaN quantum barrier layers. Specifically, the multiple quantum well layer 12 may include 3 to 8 alternating stacked InGaN quantum well layers and GaN quantum barrier layers.

[0104] As an example, in an embodiment of this disclosure, the multi-quantum-well layer 12 includes five alternating stacked InGaN quantum-well layers and GaN quantum-barrier layers.

[0105] Optionally, the thickness of the multiple quantum well layer 12 can be from 150 nm to 200 nm.

[0106] Optionally, the second semiconductor layer 13 is a p-type GaN layer. The thickness of the p-type GaN layer can be from 0.5 μm to 1 μm.

[0107] Optionally, such as Figure 1 As shown, the display panel also includes a bonding metal layer 72 and a contact layer 71. The bonding metal layer 72 is located on the driving substrate 20, and the contact layer 71 is located on the surface of the light-emitting unit 100 near the driving substrate 20. The contact layer 71 of each light-emitting unit 100 is connected to the bonding metal layer 72.

[0108] For example, the contact layer 71 may be at least one of a metal layer and a transparent conductive layer 403.

[0109] For example, contact layer 71 can be an ITO layer or an IZO layer.

[0110] Optionally, the driving substrate 20 may be a complementary metal-oxide-semiconductor (CMOS) integrated circuit board.

[0111] like Figure 1As shown, an electrode block corresponding to each light-emitting unit 100 is provided on the driving substrate 20. Each light-emitting unit 100 has a bonding metal layer 72 on the side close to the driving substrate 20. The bonding metal layer 72 of each light-emitting diode is electrically connected to the corresponding electrode block, so as to realize the purpose of the driving substrate 20 controlling the operation of each light-emitting diode.

[0112] For example, the bonding metal layer 72 may include at least one of the following: AuBe layer, Au layer, Ti layer, Ni layer and Pt layer.

[0113] Figure 7 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of this disclosure. Figure 7 As shown, the preparation method includes:

[0114] S11: A light-emitting functional layer 10 is formed on the substrate 70.

[0115] For example, the substrate 70 is a sapphire substrate 70. The sapphire substrate 70 has high light transmittance, that is, the substrate 70 is a transparent substrate 70. In addition, sapphire material is relatively hard and has relatively stable chemical properties, which enables the light-emitting diode to have good light-emitting effect and stability.

[0116] For example, such as Figure 8 As shown, the light-emitting functional layer 10 may include a first semiconductor layer 11, a multiple quantum well layer 12, and a second semiconductor layer 13 sequentially stacked on the substrate 70.

[0117] The first semiconductor layer 11 has a first conductivity type, the second semiconductor layer 13 has a second conductivity type different from the first conductivity type, and the multi-quantum well layer 12 is used to generate light through electron-hole recombination.

[0118] Among them, one of the first semiconductor layer 11 and the second semiconductor layer 13 is a p-type layer, and the other of the first semiconductor layer 11 and the second semiconductor layer 13 is an n-type layer.

[0119] As an example, the first semiconductor layer 11 is an n-type layer and the second semiconductor layer 13 is a p-type layer.

[0120] Optionally, the first semiconductor layer 11 is an n-type GaN layer. The thickness of the n-type GaN layer can be from 0.5 μm to 1 μm.

[0121] Optionally, the multiple quantum well layer 12 includes alternating InGaN quantum well layers and GaN quantum barrier layers. Specifically, the multiple quantum well layer 12 may include 3 to 8 alternating stacked InGaN quantum well layers and GaN quantum barrier layers.

[0122] As an example, in an embodiment of this disclosure, the multi-quantum-well layer 12 includes five alternating stacked InGaN quantum-well layers and GaN quantum-barrier layers.

[0123] Optionally, the thickness of the multiple quantum well layer 12 can be from 150 nm to 200 nm.

[0124] Optionally, the second semiconductor layer 13 is a p-type GaN layer. The thickness of the p-type GaN layer can be from 0.5 μm to 1 μm.

[0125] After growing the light-emitting functional layer 10 in step S11, the process may further include growing a contact layer 71 on the surface of the light-emitting functional layer 10.

[0126] For example, the contact layer 71 may be at least one of a metal layer and a transparent conductive layer 403.

[0127] For example, contact layer 71 can be an ITO layer or an IZO layer.

[0128] S12: Bond the light-emitting functional layer 10 to the driving substrate 20 and remove the substrate 70 to make the light-emitting functional layer 10 electrically connected to the driving substrate 20.

[0129] like Figure 8 As shown, step S12 may include: forming a bonding metal layer 72 on the surface of both the driving substrate 20 and the contact layer 71, and bonding the contact layer 71 and the driving substrate 20 together.

[0130] The bonding metal layer 72 may include at least one of a titanium layer, a platinum layer, a gold layer, an aluminum layer, and a tin layer.

[0131] Next, as Figure 8 As shown, the substrate 70 is removed, and part of the surface light-emitting functional layer 10 is removed by etching and other methods. The final thickness of the remaining light-emitting functional layer 10 is between 0.9 μm and 1.4 μm.

[0132] S13: Graphical processing of the light-emitting functional layer 10 to form multiple spaced light-emitting units 100.

[0133] like Figure 9 As shown, step S13 may include: forming a contact conductive layer on the surface of the light-emitting functional layer 10, and then performing array etching of the light-emitting units 100 to remove the light-emitting functional layer 10 and the bonding metal layer 72 in the non-patterned area.

[0134] For example, such as Figure 9 As shown, the graphically processed light-emitting functional layer 10 includes multiple trapezoidal light-emitting units 100.

[0135] The following steps may also be included before step S14:

[0136] like Figure 10 As shown, an insulating layer 50 is formed on the surface of the driving substrate 20, such that the insulating layer 50 covers the light-emitting unit 100.

[0137] For example, the insulating layer 50 may be at least one of a silicon oxide layer, a titanium oxide layer, and an epoxy resin layer.

[0138] For example, the insulating layer 50 may be a plurality of alternating silicon oxide layers and a plurality of titanium oxide layers to form a DBR layer.

[0139] For example, the thickness of the insulating layer 50 is 0.5 μm to 2 μm.

[0140] S14: A light-shielding conductive layer 30 is formed on the driving substrate 20, and the insulating layer 50 on the top surface of the light-emitting unit 100 is etched away.

[0141] like Figure 10 As shown, the light-shielding conductive layer 30 fills the gaps between the multiple light-emitting units 100, and the light-shielding conductive layer 30 is insulated from each light-emitting unit 100.

[0142] Optionally, the light-shielding conductive layer 30 can be a metal layer.

[0143] For example, the light-shielding conductive layer 30 may include at least one of the following: a Mo layer, a Cr layer, a Ni layer, an Al layer, a Cu layer, an Ag layer, and an Au layer.

[0144] S15: A bridging conductive layer 40 is formed on the surface of the light-shielding conductive layer 30 away from the driving substrate 20.

[0145] The bridging conductive layer 40 is used to connect two adjacent light-emitting units 100.

[0146] In one implementation of this disclosure, such as Figure 2 , 3 As shown, the bridging conductive layer 40 includes a metal layer, and the peripheral edge of the orthographic projection of each light-emitting unit 100 on the surface of the driving substrate 20 overlaps with the orthographic projection of the metal layer on the surface of the driving substrate 20.

[0147] For example, such as Figure 2 , 3 As shown, the metal layer has light-transmitting holes 41 that correspond one-to-one with the light-emitting units 100. The orthographic projection of the light-transmitting holes 41 on the surface of the driving substrate 20 is located within the orthographic projection of the corresponding light-emitting unit 100 on the surface of the driving substrate 20.

[0148] For example, the metal layer may include at least one of an Al layer, a Cu layer, an Ag layer, and an Au layer.

[0149] For example, the distance between the outer contour of the orthographic projection of the light-transmitting hole 41 and the outer contour of the orthographic projection of the corresponding light-emitting unit 100 is 0.1 μm to 1 μm.

[0150] In another implementation of this disclosure, such as Figure 4 As shown, the metal layer includes a plurality of first metal strips 401 and a plurality of second metal strips 402. The plurality of first metal strips 401 are arranged at intervals along a first direction, and the plurality of second metal strips 402 are arranged at intervals along a second direction. The first direction and the second direction have a non-zero included angle, and the plurality of first metal strips 401 and the plurality of second metal strips 402 are interlaced to form a mesh structure.

[0151] like Figure 4 As shown, each intersection of the first metal strip 401 and the second metal strip 402 has a light-transmitting hole 41, and the light-transmitting hole 41 corresponds one-to-one with the light-emitting unit 100. The orthographic projection of the light-transmitting hole 41 on the surface of the driving substrate 20 is located within the orthographic projection of the corresponding light-emitting unit 100 on the surface of the driving substrate 20.

[0152] For example, the metal layer may include at least one of an Al layer, a Cu layer, an Ag layer, and an Au layer.

[0153] For example, the distance between the outer contour of the orthographic projection of the light-transmitting hole 41 and the outer contour of the orthographic projection of the corresponding light-emitting unit 100 is 0.1 μm to 1 μm.

[0154] In some other implementations, the bridging conductive layer 40 includes a transparent conductive layer 403, and the orthographic projection of each light-emitting unit 100 on the surface of the driving substrate 20 is located within the orthographic projection of the transparent conductive layer 403 on the surface of the driving substrate 20.

[0155] For example, the transparent conductive layer 403 may be an ITO layer or an IZO layer.

[0156] As an example, the thickness of the transparent conductive layer 403 can be greater than or equal to 2000 angstroms.

[0157] After step S15, a light-collecting structure 60 is formed above the bridging conductive layer 40 and the light-emitting unit 100.

[0158] Optionally, such as Figure 1 As shown, the surface of the light-collecting structure 60 that is away from the driving substrate 20 is an arc surface.

[0159] For example, the surface of the light-collecting structure 60 is spherical. The spherical structure has a universal light-gathering effect, which is especially suitable for omnidirectional Micro LED chips. The hemispherical arc surface can symmetrically refract light incident from all angles, uniformly enhancing the overall brightness.

[0160] Alternatively, the light-collecting structure 60 can be made of PDMS, PMMA, or silicon dioxide.

[0161] The display panel prepared by the method provided in this embodiment has a light-shielding conductive layer 30 that is directly filled into the gaps between the light-emitting units 100. The physical blocking properties of the light-shielding conductive layer 30 effectively absorb or reflect the lateral light emitted from the light-emitting units 100, reducing light diffusion to adjacent light-emitting units 100. Simultaneously, the light-shielding conductive layer 30 remains insulated from the light-emitting units 100, ensuring electrical isolation to avoid short-circuit risks and blocking lateral light emission, thereby effectively suppressing the propagation path of crosstalk light.

[0162] Meanwhile, in this embodiment, the light-shielding conductive layer 30 is a structure used for electrical connection with the driving circuit on the driving substrate 20. Adjacent light-shielding conductive layers 30 are connected by a bridging conductive layer 40, indirectly realizing the electrical interconnection of the light-emitting units 100. Using the bridging conductive layer 40 as a conductive bridge, the electrical signals of the driving substrate 20 are transmitted to each light-emitting unit 100 via the light-shielding conductive layer 30, ensuring that the light-emitting state of each unit is controlled by the driving substrate 20. The combination of the bridging conductive layer 40 and the light-shielding conductive layer 30 also enhances the mechanical stability of the overall structure, avoids stress concentration problems caused by gap filling, and improves the reliability of the display panel.

[0163] Furthermore, the light-shielding conductive layer 30 not only reduces stray light but also indirectly guides the light to be emitted more concentratedly forward, improving the collimation of the emitted light and making the image details clearer. The reduction of light crosstalk directly reduces light interference between adjacent pixels, making the light-emitting units 100 that need to be turned off darker and the light-emitting units 100 that need to be turned on brighter, thus improving the image contrast of the display panel.

[0164] The above description is merely an optional embodiment of this disclosure and is not intended to limit this disclosure. The data therein represents only illustrative examples. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A display panel, characterized in that, The display panel includes: a light-emitting functional layer (10), a driving substrate (20), a light-shielding conductive layer (30), and a bridging conductive layer (40). The light-emitting functional layer (10) is located on the driving substrate (20) and is electrically connected to the driving substrate (20). The light-emitting functional layer (10) includes a plurality of light-emitting units (100) arranged at intervals. The light-shielding conductive layer (30) is located on the driving substrate (20), and the light-shielding conductive layer (30) fills the gaps between the plurality of light-emitting units (100) and is insulated from each of the light-emitting units (100); The bridging conductive layer (40) is located on the surface of the light-shielding conductive layer (30) away from the driving substrate (20), and the bridging conductive layer (40) is used to connect two adjacent light-emitting units (100).

2. The display panel according to claim 1, characterized in that, At least a portion of the orthographic projection of each of the light-emitting units (100) onto the surface of the driving substrate (20) overlaps with the orthographic projection of the bridging conductive layer (40) onto the surface of the driving substrate (20).

3. The display panel according to claim 2, characterized in that, The bridging conductive layer (40) includes a metal layer, and the peripheral edge of the orthographic projection of each light-emitting unit (100) on the surface of the driving substrate (20) overlaps with the orthographic projection of the metal layer on the surface of the driving substrate (20).

4. The display panel according to claim 3, characterized in that, The metal layer has light-transmitting holes (41) that correspond one-to-one with the light-emitting units (100). The orthographic projection of the light-transmitting holes (41) on the surface of the driving substrate (20) is located within the orthographic projection of the corresponding light-emitting units (100) on the surface of the driving substrate (20).

5. The display panel according to claim 3, characterized in that, The metal layer includes a plurality of first metal strips (401) and a plurality of second metal strips (402). The plurality of first metal strips (401) are spaced apart along a first direction, and the plurality of second metal strips (402) are spaced apart along a second direction. The first direction and the second direction have a non-zero included angle. The plurality of first metal strips (401) and the plurality of second metal strips (402) are interlaced to form a mesh structure. Each intersection of the first metal strip (401) and the second metal strip (402) has a light-transmitting hole (41), and the light-transmitting hole (41) corresponds one-to-one with the light-emitting unit (100). The orthographic projection of the light-transmitting hole (41) on the surface of the driving substrate (20) is located within the orthographic projection of the corresponding light-emitting unit (100) on the surface of the driving substrate (20).

6. The display panel according to claim 2, characterized in that, The bridging conductive layer (40) includes a transparent conductive layer (403), and the orthographic projection of each light-emitting unit (100) on the surface of the driving substrate (20) is located within the orthographic projection of the transparent conductive layer (403) on the surface of the driving substrate (20).

7. The display panel according to any one of claims 1 to 6, characterized in that, The display panel further includes an insulating layer (50), which is located at least on the surface of the driving substrate (20), in the gap between the light-emitting units (100), and on the sidewall of the light-emitting unit (100), and the light-shielding conductive layer (30) is located on the surface of the insulating layer (50).

8. The display panel according to any one of claims 1 to 6, characterized in that, The surface of the light-shielding conductive layer (30) away from the driving substrate (20) is not lower than the top surface of the light-emitting unit (100).

9. The display panel according to any one of claims 1 to 6, characterized in that, The display panel further includes a light-collecting structure (60), which is located on the surface of the bridging conductive layer (40). The light-collecting structure (60) corresponds one-to-one with the light-emitting unit (100). The orthographic projection of the light-emitting unit (100) on the surface of the driving substrate (20) is located within the orthographic projection of the corresponding light-collecting structure (60) on the surface of the driving substrate (20).

10. A method for manufacturing a display panel, characterized in that, The preparation method includes: A light-emitting functional layer (10) is formed on the substrate (70); The light-emitting functional layer (10) is bonded to the driving substrate (20), and the substrate (70) is removed, so that the light-emitting functional layer (10) is electrically connected to the driving substrate (20); The light-emitting functional layer (10) is graphically processed to form multiple light-emitting units (100) arranged at intervals; A light-shielding conductive layer (30) is formed on the driving substrate (20). The light-shielding conductive layer (30) fills the gaps between the plurality of light-emitting units (100) and is insulated from each of the light-emitting units (100). A bridging conductive layer (40) is formed on the surface of the light-shielding conductive layer (30) away from the driving substrate (20), the bridging conductive layer (40) being used to connect two adjacent light-emitting units (100).

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