Miniature light emitting diode display unit and manufacturing method thereof

Abstract

The invention provides a micro light-emitting diode display unit and a manufacturing method thereof. The micro light-emitting diode display unit comprises a driving chip, at least one pixel and a conductive piece. The pixel comprises a plurality of micro light-emitting diodes which are arranged on the top of the driving chip, and orthographic projections of the micro light-emitting diodes are covered by orthographic projection of the driving chip. The conductive part is arranged on the outer side surface of the driving chip, extends from one side close to the top of the driving chip configured with the micro light-emitting diodes to one side far away from the micro light-emitting diodes, and is connected with an external circuit.

Description

TECHNICAL FIELD

[0001] The present application relates to a display unit and a manufacturing method thereof, and in particular, to a micro light emitting diode display unit and a manufacturing method thereof. BACKGROUND

[0002] With the progress of display technology, micro light emitting diode displays have been developed. In the manufacturing of micro light emitting diode displays, a semiconductor stack structure of micro light emitting diodes is first grown on a growth substrate, then the micro light emitting diodes are transferred to a transfer substrate, and finally the micro light emitting diodes on the transfer substrate are transferred and bonded to a circuit substrate to form a display panel.

[0003] However, in the existing manufacturing method of micro light emitting diode displays, the number of micro light emitting diodes transferred to the circuit substrate needs to be matched with the number of existing driving chips on the circuit substrate, and various display panels with different resolutions cannot be freely formed. In addition, when the micro light emitting diodes are transferred to the circuit substrate, they also need to be aligned with the driving chips, so the manufacturing speed is limited and difficult to improve. SUMMARY

[0004] The present application is directed to a micro light emitting diode display unit that is easy to be used to manufacture micro light emitting diode displays, can freely form various display panels with different resolutions, and can speed up the manufacturing speed of module segments.

[0005] The present application is directed to a manufacturing method of a micro light emitting diode display unit, which is easy to be used to manufacture micro light emitting diode displays, can freely form various display panels with different resolutions, and can speed up the manufacturing speed of module segments.

[0006] An embodiment of the present application proposes a micro light emitting diode display unit, which includes a driving chip, at least one pixel, and a conductive member. The pixel includes a plurality of micro light emitting diodes disposed on the top of the driving chip, wherein the orthographic projections of the micro light emitting diodes are all covered by the orthographic projection of the driving chip. The conductive member is disposed on the outer side of the driving chip, extends from the side close to the top of the driving chip where the micro light emitting diodes are arranged to the side away from the micro light emitting diodes, and is connected with an external circuit.

[0007] An embodiment of the present invention provides a method for manufacturing a micro light-emitting diode (LED) display unit, comprising: providing a first relay substrate and disposed thereon a circuit layer; transferring a plurality of micro LEDs to the first relay substrate and connecting the micro LEDs to the circuit layer; disposing a light-shielding layer between the micro LEDs; disposing an encapsulation material to cover the micro LEDs and the circuit layer, and disposing a second relay substrate on the encapsulation material; removing the first relay substrate; disposing a solder resist layer on the circuit layer; providing solder to the circuit layer; soldering a driver chip to the circuit layer; and fabricating a carrier board with a dry film, the carrier board covering the driver chip and carrying the micro LEDs.

[0008] In the miniature light-emitting diode display unit and its manufacturing method according to embodiments of the present invention, since a display unit is formed by combining a driver chip with a miniature light-emitting diode, when such a display unit is subsequently assembled into a display, only the required number of display units need to be assembled to freely form displays of various resolutions or aspect ratios. Furthermore, since such a display unit has its own driver chip, it does not need to consider the matching of the number of miniature light-emitting diodes with the number of driver chips on the circuit board, as is the case in the prior art. It also avoids the situation in the prior art where the display unit needs to be additionally aligned with the driver chips on the circuit board, thus effectively improving the manufacturing speed of the module segment. Attached Figure Description

[0009] Figure 1 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to an embodiment of the present invention;

[0010] Figure 2 This is a cross-sectional schematic diagram of a micro light-emitting diode display unit according to another embodiment of the present invention;

[0011] Figure 3 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention;

[0012] Figure 4 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention;

[0013] Figure 5 This is a cross-sectional schematic diagram of a micro light-emitting diode display unit according to another embodiment of the present invention;

[0014] Figure 6 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention;

[0015] Figure 7 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention;

[0016] Figure 8 This is a cross-sectional schematic diagram of a micro light-emitting diode display unit according to another embodiment of the present invention;

[0017] Figure 9 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention;

[0018] Figure 10 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention;

[0019] Figure 11 This is a cross-sectional schematic diagram of a micro light-emitting diode display unit according to another embodiment of the present invention;

[0020] Figure 12A for Figure 11 A cross-sectional schematic diagram of a group of miniature light-emitting diodes;

[0021] Figure 12B for Figure 11 A cross-sectional schematic diagram of another embodiment of a set of miniature light-emitting diodes;

[0022] Figure 13 For multiple Figure 3 A cross-sectional view of a miniature light-emitting diode display unit bonded to a circuit board;

[0023] Figures 14A to 14J This is a cross-sectional schematic diagram illustrating the process of manufacturing a miniature light-emitting diode display unit according to an embodiment of the present invention. Detailed Implementation

[0024] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element references are used in the drawings and description to denote the same or similar parts.

[0025] Figure 1 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to an embodiment of the present invention. Please refer to... Figure 1 The miniature light-emitting diode display unit 100 in this embodiment includes a driver chip 110 and at least one pixel 200. Figure 1 (The example uses a pixel of 200) and at least one conductive element 120. Figure 1 (Taking two conductive elements 120 as an example). Pixel 200 includes multiple miniature light-emitting diodes 210, disposed on the top 112 of the driver chip 110. Figure 1Of these miniature light-emitting diodes 210, miniature light-emitting diode 210r is, for example, a red miniature light-emitting diode chip, miniature light-emitting diode 210g is, for example, a green miniature light-emitting diode chip, and miniature light-emitting diode 210b is, for example, a blue miniature light-emitting diode chip, but the invention is not limited thereto. In other embodiments, these miniature light-emitting diodes 210 may also be miniature light-emitting diode chips with other color combinations. A light-shielding layer 350 is provided between these miniature light-emitting diodes 210 to avoid light crosstalk.

[0026] The orthographic projections of these miniature LEDs 210 are all covered by the orthographic projection of the driver chip 110. Specifically, the orthographic projections of these miniature LEDs 210 on a reference plane RP parallel to the driver chip 110 are all covered by the orthographic projection of the driver chip 110 on the reference plane RP. In one embodiment, the orthographic projections of multiple light-emitting surfaces 211 of these miniature LEDs 210 are all covered by the orthographic projection of the driver chip 110. A conductive element 120 is disposed on the outer surface of the driver chip 110, extending from the side near the top 112 where these miniature LEDs 210 are disposed to the side away from these miniature LEDs 210, and is connected to an external circuit, such as a circuit on a circuit board, while the conductive element 120 is electrically connected downward to the circuit board. In this embodiment, the conductive element 120 does not interfere with the light-emitting paths of these miniature LEDs 210.

[0027] In the micro LED display unit 100 of this embodiment, since a driver chip 110 and a micro LED 210 are used to form a micro LED display unit 100, which is a micro LED in package (MIP), when such a micro LED display unit 100 is subsequently assembled into a display, only the required number of micro LED display units 100 need to be assembled to freely form displays of various resolutions or aspect ratios. Furthermore, since such a micro LED display unit 100 has its own driver chip, it does not need to consider the matching of the number of micro LEDs 210 with the number of driver chips on the circuit board, as is the case in the prior art. It also avoids the situation in the prior art where the display unit needs to be additionally aligned with the driver chip on the circuit board, thus effectively improving the manufacturing speed of the module segment.

[0028] In this embodiment, the miniature LED display unit 100 further includes a carrier plate 140, wherein the driving chip 110 is disposed in the carrier plate 140. In this embodiment, the carrier plate 140 has at least one through hole 142. Figure 1(Taking two through holes 142 as an example), conductive elements 120 are provided in the through holes 142. The conductive elements 120 are, for example, copper pillars. However, in other embodiments, the conductive elements 120 can also be solder balls, solder paste, or other suitable conductive materials, which can be selectively coated in the back-end process to improve flexibility. In this embodiment, the micro LED display unit 100 also includes a circuit layer 150 disposed between these micro LEDs 210 and the driver chip 110, and connecting the conductive elements 120 and the driver chip 110.

[0029] In this embodiment, the miniature LED display unit 100 includes a redistribution layer (RDL) 130 disposed between the driver chip 110 and the miniature LEDs 210, and electrically connects the miniature LEDs 210 to the driver chip 110. In this embodiment, the circuit layer 150 may be part of the redistribution layer 130, or the circuit layer 150 may be the redistribution layer 130 itself. The conductive component 120 may be integrally formed with the redistribution layer 130 in a photolithography process to improve reliability.

[0030] In this embodiment, the thickness T1 of the redistribution layer 130 is less than 50% of the thickness T2 of the carrier board 140. Furthermore, in this embodiment, the thickness T3 of the driver chip 110 is greater than 70% of the thickness T2 of the carrier board 140.

[0031] Figure 2 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 2 The miniature light-emitting diode display unit 100a in this embodiment and Figure 1 Similar to the micro LED display unit 100, the main differences between the two are described below. The micro LED display unit 100a of this embodiment also includes an encapsulation material 160 disposed above these micro LEDs 210. The encapsulation material 160 may be a transparent material; in this embodiment, the encapsulation material 160 is, for example, epoxy resin.

[0032] In one embodiment, the thickness T1 of the redistribution layer 130 is, for example, about 10 to 30 micrometers, the thickness T2 of the carrier 140 is, for example, 80 to 100 micrometers, the thickness T3 of the driver chip 110 is, for example, about 60 to 80 micrometers, the thickness T5 of the encapsulation material 160 is, for example, 80 to 100 micrometers, the height T4 of the conductive element 120 is, for example, 80 to 100 micrometers, the width W1 of the driver chip 110 is, for example, about 200 to 250 micrometers, and the width W2 of the conductive element 120 is, for example, 80 to 100 micrometers. Figure 3 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 3The miniature light-emitting diode display unit 100b in this embodiment and Figure 2 Similar to the micro LED display unit 100a, the main difference between the two is that in the micro LED display unit 100b of this embodiment, the conductive element 120b is a solder ball or solder paste, which can be selectively coated in the back-end process to improve flexibility.

[0033] Figure 4 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 4 The miniature light-emitting diode display unit 100c in this embodiment and Figure 2 Similar to the micro LED display unit 100a, the main differences between the two are described below. The micro LED display unit 100c of this embodiment also includes at least one pad 170 (… Figure 4 The example uses two pads (170) and the conductive element is at least one metal wire (180). Figure 4 (Taking two metal wires 180 as an example), the pad 170 is located on the lower surface 141 of the carrier board 140, and the metal wires 180 connect the top 112 of the driver chip 110 to the pad 170.

[0034] In this embodiment, the carrier board 140 can be disposed on the substrate 190, and the driver chip 110 can be attached to the substrate 190 by means of thermally conductive tape 310. The substrate 190 may be provided with conductive vias 192, and the pad 170 is connected to the pin 320 located on the lower surface 191 of the substrate 190 through the conductive vias 192. The pin 320 can be electrically connected to an external circuit (i.e., the circuit of the circuit board).

[0035] Furthermore, in this embodiment, these miniature light-emitting diodes 210 can be electrically connected to the driver chip 110 via multiple bumps 330.

[0036] In one embodiment, the thickness T5 of the encapsulation material 160 is, for example, about 10 to 30 micrometers, the thickness T2 of the carrier 140 is, for example, about 130 to 150 micrometers, the thickness T6 of the substrate 190 is, for example, about 80 to 100 micrometers, and the width W3 of the pin 320 is, for example, 100 micrometers.

[0037] Figure 5 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 5 In this embodiment, the miniature light-emitting diode display unit 100d and Figure 4Similar to the micro LED display unit 100c, the main differences between the two are as follows. The micro LED display unit 100d of this embodiment also includes a redistribution layer 130 disposed between the driver chip 110 and these micro LEDs 210, and electrically connecting these micro LEDs 210 to the driver chip 110. In this embodiment, the redistribution layer 130 also electrically connects the metal lines 180 to the driver chip 110. In one embodiment, the thickness T1 of the redistribution layer 130 is approximately 10–20 micrometers.

[0038] Figure 6 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 6 The miniature light-emitting diode display unit 100e in this embodiment and Figure 4 Similar to the micro LED display unit 100c, the main differences between the two are as follows. The micro LED display unit 100e of this embodiment further includes a thin-film conductive layer 340 connecting the top 112 of the driving chip 110 and the top 122 of the conductive element 120, wherein the ratio of the height T4 of the conductive element 120 to the height (i.e., thickness T3) of the driving chip 110 falls within the range of 0.9 to 1.1. In this embodiment, the orthographic projection of the thin-film conductive layer 340 onto the driving chip 110 is far from the orthographic projection of these micro LEDs 210 onto the driving chip 110. Additionally, in this embodiment, the encapsulation material 160e is, for example, glass, which provides better protection. In this embodiment, the material of the conductive element 120 is, for example, copper and tin.

[0039] Figure 7 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 7 In this embodiment, the miniature light-emitting diode display unit 100f and Figure 6 Similar to the micro LED display unit 100e, the main differences between the two are as follows. The micro LED display unit 100f of this embodiment also includes a redistribution layer 130 disposed between the driver chip 110 and these micro LEDs 210, and electrically connecting these micro LEDs 210 to the driver chip 110. In this embodiment, the redistribution layer 130 also electrically connects the thin-film conductive layer 340 to the driver chip 110. In one embodiment, the thickness T1 of the redistribution layer 130 is approximately 40 micrometers.

[0040] Figure 8 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 8 The miniature LED display unit 100g in this embodiment and Figure 1Similar to the micro LED display unit 100a, the main differences are as follows. In the micro LED display unit 100g of this embodiment, the carrier plate 140g has a recess 144, and the driver chip 110 is embedded in the recess 144, which facilitates alignment and reduces tolerances. Furthermore, in this embodiment, the light-emitting surfaces 211 of these micro LEDs 210 are flush with the upper surface 143 of the carrier plate 140g. In other embodiments, the light-emitting surfaces 211 of these micro LEDs 210 may also be lower than the upper surface 143 of the carrier plate 140g.

[0041] In this embodiment, the top 122 of the conductive element 120 is flush with the upper surface 143 of the carrier plate 140g, and the micro LED display unit 100g also includes a metal wire 180 connecting the top 112 of the driver chip 110 and the conductive element 120.

[0042] Figure 9 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 9 The miniature LED display unit 100h in this embodiment and Figure 1 Similar to the micro LED display unit 100, the main differences between the two are as follows. The micro LED display unit 100h of this embodiment includes a plurality of pixels 200 (…). Figure 9 Taking two pixels 200 as an example, each pixel is located on a single driver chip 110, and can be arranged in a matrix of N×M pixels 200 (N and M are positive integers). In this embodiment, these pixels 200 are electrically connected to the driver chip 110, and the driver chip 110 is used to control and drive these pixels 200.

[0043] Figure 10 This is a cross-sectional schematic diagram of a miniature light-emitting diode display unit according to another embodiment of the present invention. Please refer to... Figure 10 The miniature light-emitting diode display unit 100i in this embodiment and Figure 1 The micro LED display unit 100i is similar to the micro LED display unit 100i, but the main differences between the two are described below. The micro LED display unit 100i of this embodiment includes a plurality of pixels 200 (… Figure 10 Taking two pixels (200) as an example, they are set on multiple driver chips (110). Figure 10 (The example uses two driver chips 110). In this embodiment, these driver chips 110 control and drive these pixels 200 respectively.

[0044] In other embodiments, Figures 2 to 8 The correspondence between the pixels 200 and the driver chip 110 of the miniature light-emitting diode display units 100a to 100g in each embodiment can also be changed as follows: Figure 9The multiple pixels 200 are located on a single driver chip 110, or can be changed to... Figure 10 Multiple pixels 200 are located on multiple driver chips 110.

[0045] Figure 11 This is a cross-sectional schematic diagram of a micro light-emitting diode display unit according to another embodiment of the present invention. Figure 12A for Figure 11 A cross-sectional schematic diagram of a set of miniature light-emitting diodes, and Figure 12B for Figure 11 A cross-sectional schematic diagram of another embodiment of a set of miniature light-emitting diodes. Please refer to... Figure 11 , Figure 12A and Figure 12B The miniature light-emitting diode display unit 100j in this embodiment and Figure 1 Similar to the micro-LED display unit 100j, the main differences are as follows. In the micro-LED display unit 100j of this embodiment, the micro-LEDs 210 of the pixels 200 include multiple groups of micro-LEDs 210, each group of micro-LEDs 210 including two side-by-side micro-LEDs 210, and the two side-by-side micro-LEDs 210 are electrically connected in series. For example, as Figure 11 As shown, these miniature light-emitting diodes 210 include a set of miniature light-emitting electrodes 210r, a set of miniature light-emitting diodes 210g, and a set of miniature light-emitting diodes 210b. The set of miniature light-emitting diodes 210r includes two miniature light-emitting diodes 210r side by side, the set of miniature light-emitting diodes 210g includes two miniature light-emitting diodes 210g side by side, and the set of miniature light-emitting diodes 210b includes two miniature light-emitting diodes 210b side by side.

[0046] like Figure 12A and Figure 12B As shown, each group of miniature LEDs 210 further includes a conductive connection layer 220, electrically connecting the anode of one of the two side-by-side miniature LEDs 210 to the cathode of the other. For example, each miniature LED 210 includes a first-type semiconductor layer 212, a light-emitting layer 214, and a second-type semiconductor layer 216, while the conductive connection layer 220 electrically connects the first-type semiconductor layer 212 of one of the two side-by-side miniature LEDs 210 to the second-type semiconductor layer 216 of the other. One of the first and second types is N-type, and the other is P-type. Figure 12BAs shown, each group of miniature light-emitting diodes 210 also includes a filling structure 230, which fills the space between the sidewalls 213 of the two side-by-side miniature light-emitting diodes 210. In this embodiment, the filling structure 230 is made of, for example, an insulating material.

[0047] Figure 13 For multiple Figure 3 A cross-sectional view showing the miniature LED display unit bonded to the circuit board. Please refer to... Figure 13 The conductive elements 120b of the aforementioned plurality of micro LED display units 100b can be electrically connected to the circuit board 60 via conductive bumps 50, and arranged in an array on the circuit board 60 to form a micro LED display panel. In the other embodiments described above, the conductive elements 120 or pins 320 of the plurality of micro LED display units 100, 100a, 100c to 100j can also be electrically connected to the circuit board 60 via conductive bumps 50 to form a micro LED display panel. The circuit board 60 is, for example, a circuit board, a glass substrate or plastic substrate with circuitry, a silicon substrate with circuitry, or other suitable circuit board.

[0048] Figures 14A to 14J This is a cross-sectional schematic diagram illustrating a method for manufacturing a miniature light-emitting diode display unit according to an embodiment of the present invention. Please refer to... Figures 14A to 14J The manufacturing method of the miniature light-emitting diode display unit in this embodiment can be used to manufacture... Figure 3 The miniature light-emitting diode display unit 100b of this embodiment. The manufacturing method of the miniature light-emitting diode display unit includes the following steps. First, please refer to... Figure 14A A first relay substrate 410 is provided, and a circuit layer (e.g., a redistribution layer 130) is disposed thereon. Next, as... Figure 14B As shown, multiple miniature light-emitting diodes 210 are transferred to the first relay substrate 410, and these miniature light-emitting diodes 210 are connected to a circuit layer (e.g., a redistribution layer 130). Then, as... Figure 14C As shown, a light-shielding layer 350 is disposed between these miniature light-emitting diodes 210, wherein the light-shielding layer 350 is, for example, a black matrix. Then, as... Figure 14D As shown, an encapsulation material 160 is provided to cover these miniature light-emitting diodes 210 and the circuit layer (e.g., redistribution layer 130), and a second relay substrate 420 is provided on the encapsulation material 160 via an adhesive layer 460. Furthermore, as... Figure 14E As shown, the first relay substrate 410 is removed. Then, a solder resist layer 360 is formed on a circuit layer (e.g., redistribution layer 130). Afterward, solder 370 is applied to the circuit layer (e.g., redistribution layer 130). Then, as... Figure 14FAs shown, the driver chip 110 is soldered to a circuit layer (e.g., a redistribution layer 130). Afterward, a carrier board 140 is fabricated using a dry film, which covers the driver chip 110 and carries the miniature light-emitting diodes 210.

[0049] Following this, the manufacturing method of the miniature light-emitting diode display unit in this embodiment may further include the following steps. First, please refer to... Figure 14G On the side of the driver chip 110, an opening is made in the carrier board 140 to form a through-hole 142, exposing a portion of the circuit layer (e.g., the redistribution layer 130). Then, as... Figure 14H As shown, a conductive element 120 is provided in the through-hole 142, which is connected to a circuit layer (e.g., a redistribution layer 130). Then, as... Figure 14I As shown, a dicing film 450 is disposed on the surface of the encapsulation material 160, wherein the dicing film 450 connects a plurality of horizontally arranged micro light-emitting diode display units 100b (see reference). Figure 3 (The miniature light-emitting diode display unit 100b). Furthermore, such as... Figure 14J As shown, these horizontally arranged micro LED display units 100b are cut and separated. This completes the manufacturing of the micro LED display unit 100b.

[0050] In summary, in the miniature light-emitting diode display unit and its manufacturing method according to the embodiments of the present invention, since a display unit is formed by combining a driver chip with a miniature light-emitting diode, when such a display unit is subsequently assembled into a display, only the required number of display units need to be assembled to freely form displays of various resolutions or aspect ratios. Furthermore, since such a display unit has its own driver chip, it does not need to consider the matching of the number of miniature light-emitting diodes with the number of driver chips on the circuit board as in the prior art, and it avoids the situation in the prior art where the display unit needs to be additionally aligned with the driver chips on the circuit board. Therefore, it can effectively improve the manufacturing speed of the module segment.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A miniature light-emitting diode display unit, characterized in that, include: Driver chip; At least one pixel, including multiple micro light-emitting diodes, is disposed on the top of the driver chip, wherein the orthographic projections of the multiple micro light-emitting diodes are all covered by the orthographic projection of the driver chip; as well as A conductive element is disposed on the outer surface of the driver chip, extending from the side near the top where the plurality of micro LEDs are configured to the side away from the plurality of micro LEDs, and is connected to an external circuit.

2. The miniature light-emitting diode display unit according to claim 1, characterized in that, It also includes a carrier board, wherein the driver chip is disposed in the carrier board.

3. The miniature light-emitting diode display unit according to claim 2, characterized in that, The carrier plate has through holes, and the conductive element is disposed in the through holes. The micro LED display unit also includes a circuit layer disposed between the plurality of micro LEDs and the driving chip, and connects the plurality of micro LEDs, the conductive element and the driving chip.

4. The miniature light-emitting diode display unit according to claim 2, characterized in that, It also includes a thin-film conductive layer connecting the top of the driver chip to the top of the conductive element, wherein the ratio of the height of the conductive element to the height of the driver chip falls within the range of 0.9 to 1.

1.

5. The miniature light-emitting diode display unit according to claim 4, characterized in that, The orthogonal projection of the thin-film conductive layer onto the driver chip is away from the orthogonal projection of the plurality of micro LEDs onto the driver chip.

6. The miniature light-emitting diode display unit according to claim 2, characterized in that, The carrier board has a groove, and the driver chip is embedded in the groove.

7. The miniature light-emitting diode display unit according to claim 6, characterized in that, The multiple light-emitting surfaces of the plurality of micro LEDs are flush with or lower than the upper surface of the carrier plate.

8. The miniature light-emitting diode display unit according to claim 6, characterized in that, The top of the conductive element is flush with the upper surface of the carrier plate, and the micro LED display unit further includes a metal wire connecting the top of the driver chip to the conductive element.

9. The miniature light-emitting diode display unit according to claim 2, characterized in that, The circuit layer is a redistribution layer, and the thickness of the redistribution layer is less than 50% of the thickness of the carrier board.

10. The miniature light-emitting diode display unit according to claim 2, characterized in that, The thickness of the driver chip is greater than 70% of the thickness of the carrier board.

11. The miniature light-emitting diode display unit according to claim 1, characterized in that, The at least one pixel may be multiple pixels, and the multiple pixels are respectively disposed on a single driver chip.

12. The miniature light-emitting diode display unit according to claim 1, characterized in that, The pixel comprises multiple sets of micro LEDs, each set of which includes two micro LEDs arranged side by side, and the two micro LEDs arranged side by side are connected in series electrically.

13. A method for manufacturing a miniature light-emitting diode display unit, characterized in that, include: A first relay substrate is provided, and a circuit layer is disposed thereon; Transfer multiple micro LEDs to the first relay substrate and connect the multiple micro LEDs to the circuit layer; A light-shielding layer is disposed between the plurality of miniature light-emitting diodes; An encapsulation material is provided to cover the plurality of micro light-emitting diodes and the circuit layer, and a second relay substrate is provided on the encapsulation material; Remove the first relay substrate; A solder resist layer is provided on the circuit layer; Solder is applied to the circuit layer; The driver chip is soldered to the circuit layer; as well as A carrier plate is made using a dry film, which covers the driver chip and carries the plurality of micro light-emitting diodes.

14. The method for manufacturing a micro light-emitting diode display unit according to claim 13, characterized in that, Also includes: On the side of the driver chip, holes are made in the carrier board to form through holes and expose a portion of the circuit layer; A conductive element is disposed in the through hole and is connected to the circuit layer; A dicing film is disposed on the surface of the encapsulation material, wherein the dicing film is connected to a plurality of horizontally arranged micro light-emitting diode display units; as well as Cut and separate the plurality of horizontally arranged micro LED display units.

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