Device for improving chip transmission alarm of process cavity
By setting inclined sections and blocking protrusions on the outer side of the wafer support fingers, the problem of wafer transfer alarm caused by wafer deformation at high temperatures is solved, realizing safe wafer transfer and reducing wafer slippage and breakage.
Patent Information
- Application Number
- CN202511587310.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-31
- Publication Date
- 2026-02-06
AI Technical Summary
In existing process cavities, wafers may deform under high temperatures, causing wafer misalignment during transport, generating automatic wafer calibration alarms and wafer transfer alarms, which in turn leads to problems such as wafer slippage and breakage.
A continuously inclined first section and a blocking boss are set on the outer side of the wafer support finger. The tilt angle design allows the wafer to slide down the inner side to the contact surface when it is offset, preventing the wafer from slipping. The movement of the support ring provides movement space and reduces wafer transfer alarms.
It effectively prevents wafer slippage during transport, reduces wafer transfer alarms, avoids wafer breakage, and improves transport safety.
Smart Images
Figure CN121487550A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor integrated circuit manufacturing, and in particular to a device for improving process cavity transfer alarm. Background Technology
[0002] In existing process cavities, such as degassing process cavities, high-temperature processes are required. The high temperature is achieved by heating the wafer support platform. This can cause the wafer to deform under high temperature conditions, which can trigger an automatic wafer calibration (AWC) alarm during the transfer process. In other words, it can cause wafer offset, which can lead to a wafer transfer alarm and eventually cause the wafer to slip.
[0003] The wafer sliding mechanism refers to the process where, when a product wafer is transferred into the process cavity, the wafer rests on the wafer support finger on the degas process cavity, preventing the wafer from landing on the heater corresponding to the wafer support platform, thus triggering a wafer transfer alarm.
[0004] like Figure 1 The figure shown is a perspective view of a wafer support finger in a conventional degassing process chamber; each of the wafer support fingers includes: a first mounting portion 101 and a second finger portion 102.
[0005] The outer side of the second finger portion 102 is fixedly mounted on the first mounting portion 101.
[0006] The second finger 102 has a strip-shaped structure, and a wafer support segment 103 is formed in the front end area near the inner side of the second finger 102; the top surface of the wafer support segment 103 serves as the wafer contact surface.
[0007] A blocking boss 104 is provided on the top surface of the second finger 102 outside the wafer support section 103.
[0008] The blocking boss 104 can block the wafer from shifting, preventing the wafer from shifting by a certain amount.
[0009] However, adopting Figure 1 AWC alarms are still prone to occur in the process cavity of the wafer support finger shown. Summary of the Invention
[0010] The technical problem to be solved by the present invention is to provide a device for improving the wafer transfer alarm in the process cavity, which can make the wafer slide to a safe transfer position when the wafer position is slightly offset during the wafer transfer process, thereby reducing wafer transfer alarms and preventing wafer slippage and wafer breakage caused by slippage.
[0011] To solve the above-mentioned technical problems, the present invention provides an improved alarm device for process cavity wafer transfer, comprising:
[0012] A wafer support platform with a circular top surface for supporting the wafer during processing.
[0013] Multiple wafer support fingers are disposed around the periphery of the wafer support platform; during wafer transfer, the multiple wafer support fingers form a support structure for the wafer.
[0014] Each of the wafer support fingers includes: a first mounting portion and a second finger portion.
[0015] The outer side of the second finger is fixedly mounted on the first mounting part.
[0016] The second finger has a strip-shaped structure, and a wafer support segment is formed in the front end area near the inner side of the second finger; the top surface of the wafer support segment serves as the wafer contact surface.
[0017] A blocking boss is provided on the top surface of the second finger on the outer side of the wafer support section.
[0018] The blocking protrusion has a first inner side surface, and the bottom edge of the first inner side surface is the outer edge of the wafer support segment.
[0019] The first inner side has a continuously inclined first region segment. During the wafer transfer process, when the wafer is shifted, the edge of the wafer will contact the first region segment located on the side of the wafer that is shifted outward. The tilt angle of the inclined structure of the first region segment ensures that the wafer slides down along the first inner side onto the wafer contact surface, thereby preventing the wafer from slipping.
[0020] A further improvement is that the bottom of the first region is located on the top surface of the second finger.
[0021] The top position of the first region segment is equal to or lower than the top surface of the blocking boss.
[0022] A further improvement is that the width of the projection of the first region segment onto the top surface of the second finger is greater than or equal to the maximum outward offset of the wafer.
[0023] A further improvement is that, when the top position of the first region segment is lower than the top surface of the blocking boss, a second region segment is also provided at the top position of the first region segment and the top surface of the blocking boss, the second region segment being used to realize a transition connection between the first region segment and the top surface of the blocking boss.
[0024] A further improvement is that the second region segment is an inclined surface or a circular arc surface with an inclination angle smaller than that of the first region segment.
[0025] A further improvement is that each of the first mounting parts is fixedly mounted on the support ring, which can move up and down and drive the wafer support fingers to move up and down.
[0026] A further improvement is that the wafer support platform is provided with a plurality of first grooves corresponding to the wafer support fingers, the first mounting part is located outside the outer diameter of the wafer support platform, the second finger extends into the first groove, and the first groove is used to provide movement space for the second finger when the wafer support finger moves up and down.
[0027] A further improvement is that the wafer support segment includes a second groove, which is used to reduce the area of the wafer contact surface.
[0028] A further improvement is that the second groove extends from the inner side of the second finger towards the outer side and is U-shaped.
[0029] A further improvement is that a heater is provided on the wafer support platform.
[0030] A further improvement is that the height of the top position of the first region segment ensures that during the wafer transfer process, the wafer's position is within a set first offset range, and the edge of the wafer will contact the first region segment located on the outward offset side of the wafer, so as to prevent the wafer from sliding onto the top surface of the corresponding blocking protrusion.
[0031] A further improvement is that the first offset range is greater than the maximum offset value caused by the deformation of the wafer due to the process temperature.
[0032] A further improvement is that the process includes a degassing process.
[0033] A further improvement is that each of the wafer support fingers is positioned at an equal angle around the periphery of the wafer support platform.
[0034] A further improvement is that the number of wafer support fingers includes three.
[0035] This invention features a special design for the structure of the wafer support fingers within the process cavity. Specifically, it addresses the structure of the first inner side of the blocking protrusion on the outer side of the wafer support section of the second finger. A continuously inclined first region segment is formed on this first inner side. During wafer transfer, when the wafer's position shifts, and it reaches the corresponding first region segment, the tilt angle of this inclined structure ensures that the wafer slides down the first inner side onto the wafer contact surface, thus preventing wafer slippage. Therefore, this invention allows the wafer to slide safely to its transfer position even with slight positional shifts during wafer transfer, thereby reducing transfer alarms and preventing wafer slippage and breakage caused by slippage. Attached Figure Description
[0036] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:
[0037] Figure 1 This is a 3D view of the wafer support fingers in the existing degassing process cavity;
[0038] Figure 2 This is a top view inside the process cavity of the device for improving the alarm of the process cavity wafer transfer according to an embodiment of the present invention;
[0039] Figure 3A This is a top view of the wafer support finger of the device for improving the process cavity wafer transfer alarm according to an embodiment of the present invention;
[0040] Figure 3B This is a side view of the wafer support finger of the device for improving the process cavity wafer transfer alarm according to an embodiment of the present invention;
[0041] Figure 3C This is a perspective view of the wafer support finger of the device for improving the process cavity transfer alarm according to an embodiment of the present invention. Detailed Implementation
[0042] like Figure 2 The image shown is a top view of the process cavity of the device for improving the alarm function of the process cavity wafer transfer according to an embodiment of the present invention; as shown... Figure 3A The image shown is a top view of the wafer support finger of the device for improving process cavity wafer transfer alarm according to an embodiment of the present invention; as shown... Figure 3B The image shown is a side view of the wafer support finger of the device for improving process cavity wafer transfer alarm according to an embodiment of the present invention; as shown Figure 3C The image shown is a perspective view of the wafer support finger of the device for improving wafer transfer alarm in process cavities according to an embodiment of the present invention; the device for improving wafer transfer alarm in process cavities according to an embodiment of the present invention includes:
[0043] Wafer support platform 301 has a circular top surface for supporting the wafer during processing.
[0044] Multiple wafer support fingers are disposed around the wafer support platform 301; during wafer transfer, the multiple wafer support fingers form a support structure for the wafer.
[0045] Each of the wafer support fingers includes: a first mounting portion 201 and a second finger portion 202.
[0046] The outer side of the second finger portion 202 is fixedly mounted on the first mounting portion 201.
[0047] The second finger 202 has a strip-shaped structure, and a wafer support segment 203 is formed in the front end area near the inner side of the second finger 202; the top surface of the wafer support segment 203 serves as the wafer contact surface.
[0048] A blocking boss 204 is provided on the top surface of the second finger 202 outside the wafer support section 203.
[0049] The blocking protrusion 204 has a first inner side surface, and the bottom edge of the first inner side surface is the outer edge of the wafer support segment 203.
[0050] like Figure 3B As shown, the first inner side has a continuously inclined first region segment 206. During the wafer transfer process, when the wafer is shifted, the edge of the wafer will contact the first region segment 206 located on the side of the wafer that is shifted outward. The tilt angle of the inclined structure of the first region segment 206 ensures that the wafer slides down along the first inner side onto the wafer contact surface, thereby preventing the wafer from slipping.
[0051] In this embodiment of the invention, the bottom of the first region segment 206 is located on the top surface of the second finger portion 202.
[0052] In this embodiment of the invention, the top position of the first region segment 206 is lower than the top surface of the blocking protrusion 204. A second region segment 207 is also provided at the top position of the first region segment 206 and the top surface of the blocking protrusion 204, the second region segment 207 serving as a transition connection between the first region segment 206 and the top surface of the blocking protrusion 204. The second region segment 207 is an inclined surface or an arc surface with an inclination angle smaller than that of the first region segment 206. In other embodiments, the top position of the first region segment 206 may also be equal to the top surface of the blocking protrusion 204.
[0053] The width of the projection of the first region segment 206 onto the top surface of the second finger 202 is greater than or equal to the maximum outward offset of the wafer.
[0054] The height of the top position of the first region segment 206 ensures that during wafer transfer, the wafer's position is within a predetermined first offset range, and the edge of the wafer contacts the first region segment 206 located on the outwardly offset side of the wafer, thus preventing the wafer from sliding onto the top surface of the corresponding blocking protrusion 204. In some embodiments, the first offset range is greater than the maximum offset value caused by the deformation of the wafer due to process temperature.
[0055] Therefore, in this embodiment of the invention, by setting the tilt angle of the tilted structure of the first region segment 206, it can be ensured that the wafer can slide down when it contacts the first region segment 206. With the tilt angle determined, by increasing the height of the top position of the first region segment 206, the width of the projection of the first region segment 206 onto the top surface of the second finger 202 can be increased. Finally, it can be ensured that the wafer contacts the first region segment 206 when it is offset within a set first offset range, thereby ensuring that it slides down to the safe area, i.e., the wafer contact surface.
[0056] like Figure 3A As shown, the wafer support segment 203 includes a second groove 205, which is used to reduce the area of the wafer contact surface. The second groove 205 extends from the inner side of the second finger 202 in a U-shape towards the outer side. In other embodiments, the second groove 205 can also adopt other morphological structures, as long as it can ensure the reduction of the wafer contact area.
[0057] In this embodiment of the invention, each of the first mounting parts 201 is fixedly mounted on the support ring, and the support ring can move up and down and drive the wafer support finger to move up and down.
[0058] like Figure 2 As shown, the wafer support platform 301 is provided with a plurality of first grooves 302 corresponding to the wafer support fingers. The first mounting part 201 is located outside the outer diameter of the wafer support platform 301. The second finger 202 extends into the first groove 302 and the first groove 302 is used to provide the second finger 202 with movement space when the wafer support fingers move up and down.
[0059] Each of the aforementioned wafer support fingers is arranged at an equal angle around the periphery of the wafer support platform 301. For example... Figure 2 As shown in the embodiment of the present invention, the number of wafer support fingers includes three.
[0060] In this embodiment of the invention, a heater is provided on the wafer support platform 301.
[0061] The process includes degassing.
[0062] This invention embodiment features a special design for the structure of the wafer support fingers within the process cavity. Specifically, it addresses the structure of the first inner side of the blocking protrusion 204 on the outer side of the wafer support section 203 of the second finger portion 202. A continuously inclined first region segment 206 is provided on this first inner side. During wafer transfer, when the wafer's position shifts, and it lands on the corresponding first region segment 206, the tilt angle of the first region segment 206 ensures that the wafer slides down the first inner side onto the wafer contact surface, thus preventing wafer slippage. Therefore, this invention embodiment can ensure a safe wafer transfer position even when the wafer position slightly shifts during transfer, thereby reducing transfer alarms, preventing wafer slippage, and preventing wafer breakage caused by slippage.
[0063] and Figure 1 As can be seen from the structures shown, Figure 3C The first inner side of the blocking boss 204 in the corresponding embodiment of the present invention has been improved, the tilt angle of the first region segment 206 has been increased, the height of the entire first region segment 206 has also been set, and the height of the entire blocking boss 204 has been increased. These improvements make the structure of the embodiment of the present invention improve AWC alarm defects and reduce or prevent slippage.
[0064] This invention implements a method to reduce AWC alarms in process cavities such as Degas cavities by changing the shape of the finger. Improvements to the finger include: increasing the inclination of the finger's slope to correct the wafer's slippage in cases of significant offset; adding a contact recess (i.e., adding a second groove) to the finger contact surface to reduce the contact area with the wafer; and optimizing the height of the outer boss on the finger to prevent excessive wafer offset.
[0065] This invention, through modification of the degas finger, increases the sliding angle, allowing the wafer to slide to a safe transport position even with slight offset, thus preventing wafer slippage. Therefore, this invention achieves: 1. Reduced AWC alarms during transport; 2. Prevention of wafer slippage and breakage during wafer transport.
[0066] The present invention has been described in detail above through specific embodiments, but these are not intended to limit the invention. Many modifications and improvements can be made by those skilled in the art without departing from the principles of the invention, and these should also be considered within the scope of protection of the present invention.
Claims
1. A device for improving alarm functions in process cavity transfer, characterized in that, include: A wafer support platform with a circular top surface for supporting the wafer during processing; Multiple wafer support fingers are disposed around the periphery of the wafer support platform; During the transfer of the wafer, multiple wafer support fingers form a support structure for the wafer; Each of the aforementioned wafer support fingers includes: a first mounting portion and a second finger portion; The outer side of the second finger is fixedly mounted on the first mounting part; The second finger has a strip-shaped structure, and a wafer support segment is formed in the front end area near the inner side of the second finger; the top surface of the wafer support segment serves as the wafer contact surface; A blocking protrusion is provided on the top surface of the second finger on the outer side of the wafer support section. The blocking protrusion has a first inner side surface, and the bottom edge of the first inner side surface is the outer edge of the wafer support segment. The first inner side has a continuously inclined first region segment. During the wafer transfer process, when the wafer is shifted, the edge of the wafer will contact the first region segment located on the side of the wafer that is shifted outward. The tilt angle of the inclined structure of the first region segment ensures that the wafer slides down along the first inner side onto the wafer contact surface, thereby preventing the wafer from slipping.
2. The device for improving the alarm function of the process cavity transfer plate as described in claim 1, characterized in that: The bottom of the first region is located on the top surface of the second finger; The top position of the first region segment is equal to or lower than the top surface of the blocking boss.
3. The device for improving the alarm function of the process cavity transfer plate as described in claim 2, characterized in that: The width of the projection of the first region segment onto the top surface of the second finger is greater than or equal to the maximum outward offset of the wafer.
4. The device for improving the alarm function of the process cavity transfer plate as described in claim 2, characterized in that: When the top position of the first region segment is lower than the top surface of the blocking boss, a second region segment is also provided at the top position of the first region segment and the top surface of the blocking boss. The second region segment is used to realize the transition connection between the first region segment and the top surface of the blocking boss.
5. The device for improving the alarm function of the process cavity transfer plate as described in claim 4, characterized in that: The second region is an inclined surface or a circular arc surface with an inclination angle smaller than that of the first region.
6. The device for improving the alarm function of the process cavity transfer plate as described in claim 1, characterized in that: Each of the first mounting parts is fixedly mounted on the support ring, which can move up and down and drive the wafer support fingers to move up and down.
7. The device for improving the alarm function of the process cavity transfer plate as described in claim 6, characterized in that: The wafer support platform is provided with a plurality of first grooves corresponding to the wafer support fingers. The first mounting part is located outside the outer diameter of the wafer support platform. The second finger extends into the first groove, and the first groove is used to provide movement space for the second finger when the wafer support finger moves up and down.
8. The device for improving the alarm function of the process cavity transfer plate as described in claim 1, characterized in that: The wafer support section includes a second groove, which is used to reduce the area of the wafer contact surface.
9. The device for improving the alarm function of the process cavity transfer plate as described in claim 8, characterized in that: The second groove extends from the inner side of the second finger towards the outer side and is U-shaped.
10. The device for improving the alarm function of the process cavity transfer plate as described in claim 1, characterized in that: A heater is provided on the wafer support platform.
11. The device for improving the alarm function of the process cavity transfer plate as described in claim 3, characterized in that: The height of the top position of the first region segment ensures that during the wafer transfer process, the position of the wafer is within a set first offset range, and the edge of the wafer will contact the first region segment located on the outward offset side of the wafer, so as to prevent the wafer from sliding onto the top surface of the corresponding blocking protrusion.
12. The device for improving the alarm of the process cavity transfer plate as described in claim 11, characterized in that: The first offset range is greater than the maximum offset value caused by the deformation of the wafer due to the process temperature.
13. The device for improving the alarm function of the process cavity transfer plate as described in claim 1, characterized in that: The process includes degassing.
14. The device for improving the alarm function of the process cavity transfer plate as described in claim 1, characterized in that: Each of the wafer support fingers is arranged at an equal angle around the periphery of the wafer support platform.
15. The device for improving the alarm function of the process cavity transfer plate as described in claim 13, characterized in that: The number of wafer support fingers includes three.