Semiconductor component wetting and transporting device

Abstract

The invention relates to the technical field of semiconductor transportation, and discloses a semiconductor component wetting and transporting device which serves as a special transporting device for semiconductor parts, a transporting frame is provided with four supports, the four supports are fixed to the periphery of the transporting frame respectively, and the transporting frame can move on the ground; the transportation frame comprises a placing layer and a leakage-proof layer, the placing layer is used for placing vessels containing liquid and semiconductor parts submerged in the liquid, and the semiconductor parts can be transported in a wet state; the placement layer is located above the leakage-proof layer, the placement layer is provided with a placement groove, the leakage-proof layer is provided with a leakage-proof groove, the placement groove and the leakage-proof groove are stacked in the same direction, the groove bottom of the placement groove and the groove bottom of the leakage-proof groove are spaced by a preset distance, and the groove bottom of the placement groove is provided with a liquid flow hole. And temporary accumulation is carried out, so that the cleanliness of a transportation path is ensured, and the transportation quality and efficiency of the semiconductor parts are stably improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor transportation technology, and in particular to a wet transportation device for semiconductor components. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. Light, electric fields, magnetic fields, temperature gradients, and ambient atmosphere can all cause changes in the conductivity of semiconductors. With the advancement of technology, semiconductor-related components require extremely high precision and stringent appearance requirements; bumps and scratches during transportation can cause significant economic losses.

[0003] Currently, semiconductor products, primarily made of aluminum, cannot come into contact with materials like copper or silicon during transportation due to the material's unique properties; otherwise, they will become contaminated. Furthermore, exposing semiconductor products to air after cleaning during transport can cause them to oxidize and turn yellow. After drying, stains or corrosive substances may remain on the surface, making subsequent cleaning difficult. This oxide layer on the semiconductor product surface can also cause irreversible damage to customer devices, and may even lead to customer complaints regarding the product's appearance.

[0004] Therefore, semiconductor products need improvement in transportation. One way is to ensure that they are submerged in a liquid that can stably preserve the semiconductors. However, since a large amount of liquid may shake and spill during transportation, it causes great instability. After a period of time, the liquid splashed on the transportation path will lead to poor cleanliness, and workers or other transportation equipment will easily slip, reducing work efficiency and safety. Therefore, there is an urgent need for a semiconductor component wet transportation device to solve this problem. Summary of the Invention

[0005] The purpose of this invention is to provide a wet transport device for semiconductor components, which enables the semiconductor components to be transported in a wet state, preventing liquid leakage and spillage along the way during transport, ensuring the cleanliness of the transport path, protecting the safety of personnel, and steadily improving the transport quality and efficiency of semiconductor components.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A semiconductor component humidification transport device, comprising:

[0008] A transport frame includes a placement layer and a leak-proof layer. The placement layer is located above the leak-proof layer. The placement layer is provided with a placement groove, and the leak-proof layer is provided with a leak-proof groove. The placement groove and the leak-proof groove are stacked in the same direction, and the bottom of the placement groove and the bottom of the leak-proof groove are spaced apart by a preset distance. The bottom of the placement groove is provided with a liquid flow hole.

[0009] The transport frame is equipped with four supports, which are respectively fixed around the perimeter of the transport frame, and the transport frame can move on the ground.

[0010] As an optional technical solution for a semiconductor component humidification transport device, the leak-proof layer is provided with a drain pipe and a drain valve. The drain pipe is connected to the bottom of the leak-proof tank, and the drain valve selectively blocks the drain pipe.

[0011] As an optional technical solution for the wet transport device for semiconductor components, the drain valve is located at one end of the bottom of the leak-proof tank, and the bottom of the leak-proof tank is inclined downward at the end near the drain valve.

[0012] As an optional technical solution for a semiconductor component humidification transport device, the bracket is fixed to the outside of the leak-proof layer, and the placement layer and the leak-proof layer are detachably connected.

[0013] As an optional technical solution for a semiconductor component humidification transport device, the bracket is fixedly connected to the placement layer, and the placement layer and the leak-proof layer are detachably connected.

[0014] As an optional technical solution for a semiconductor component humidification transport device, the density of the liquid flow holes is greater than the density of the placement gaps of the semiconductor components.

[0015] As an optional technical solution for the humidification transport device for semiconductor components, a silicone pad is provided inside the side wall of the placement tank.

[0016] As an optional technical solution for the humidification transport device for semiconductor components, both the transport frame and the transport rack are made of stainless steel.

[0017] As an optional technical solution for a semiconductor component humidification transport device, the transport rack is also provided with a handle, which is connected to the support.

[0018] As an optional technical solution for the humidification transport device for semiconductor components, the transport frame is also equipped with casters, which are located at the bottom of the frame.

[0019] The beneficial effects of this invention are:

[0020] The semiconductor component humidification transport device provided by this invention includes a transport frame and a transport rack. As a dedicated transport device for semiconductor components, the transport rack is equipped with four supports, which are fixed around the perimeter of the transport frame, allowing the transport rack to move on the ground. The transport frame includes a placement layer and a leak-proof layer. The placement layer is located above the leak-proof layer and has a placement groove. The leak-proof layer has a leak-proof groove, which is stacked in the same direction, with a predetermined distance between the bottom of the placement groove and the bottom of the leak-proof groove. A liquid flow hole is provided at the bottom of the placement groove. The placement layer is used to place containers filled with liquid and the semiconductor components submerged in the liquid, allowing the semiconductor components to be transported in a humid state. This effectively forms a water film on the product surface, preventing material instability or residue caused by drying. The transport frame is designed with a double-layer processing method. If liquid leaks accidentally during transport, it can flow from the liquid flow hole to the leak-proof groove below for temporary accumulation, preventing spillage along the way, ensuring the cleanliness of the transport path, protecting the safety of personnel, and consistently improving the transport quality and efficiency of semiconductor components. Attached Figure Description

[0021] Figure 1 This is a cross-sectional structural diagram of the semiconductor component wetting transport device provided in a specific embodiment of the present invention.

[0022] In the picture:

[0023] 100. Transport frame; 110. Placement layer; 111. Liquid flow hole; 112. Silicone gasket; 120. Leak-proof layer; 121. Drain pipe; 122. Drain valve;

[0024] 200. Transport rack; 210. Support frame; 220. Handle assembly; 230. Casters; 240. Spare parts layer. Detailed Implementation

[0025] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0026] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0027] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0029] like Figure 1 As shown, this invention discloses a semiconductor component humidification transport device, a dedicated transport device for semiconductor components, comprising a transport frame 100 and a transport rack 200. The transport rack 200 is provided with four supports 210, which are respectively fixed around the perimeter of the transport frame 100, allowing the transport rack 200 to move on the ground. The transport frame 100 includes a placement layer 110 and a leak-proof layer 120. The placement layer 110 is located above the leak-proof layer 120 and has a placement groove. The leak-proof layer 120 has a leak-proof groove, which are stacked in the same direction, with a predetermined distance between the bottom of the placement groove and the bottom of the leak-proof groove. The bottom of the placement groove has a liquid flow hole 111. The placement layer 110 is used to place containers filled with liquid and semiconductor components submerged in the liquid, enabling the semiconductor components to be transported in a humid state. This effectively forms a water film on the product surface, preventing material instability or residue caused by drying. The transport frame 100 is designed with a double-layer processing method. If liquid is accidentally leaked during transportation, it can flow from the liquid outlet 111 to the lower leak-proof tank for temporary accumulation, preventing spillage along the way, ensuring the cleanliness of the transportation path, protecting the safety of personnel, and consistently improving the transportation quality and efficiency of semiconductor components. For example, both the transport frame 100 and the transport rack 200 are made of 304 stainless steel, which not only provides a robust structure and good durability but also prevents reactions or rusting upon contact with semiconductor components, improving customer satisfaction with using semiconductor components.

[0030] Specifically, a drain pipe 121 and a drain valve 122 are provided in the leak-proof layer 120. The drain pipe 121 is connected to the bottom of the leak-proof tank. The drain valve 122 selectively blocks the drain pipe 121. When the drain valve 122 is closed, the spilled liquid can be temporarily stored in the leak-proof tank. When the stored liquid is too much or after a semiconductor component is transported, the drain pipe 121 can be connected to the collection device and the drain valve 122 can be opened to promptly drain the stored liquid from the transport frame 100.

[0031] Furthermore, the drain valve 122 is located at one end of the bottom of the leak-proof tank, and the bottom of the leak-proof tank near the drain valve 122 is inclined downward to facilitate the collection and discharge of liquid. It can be understood that the density of the liquid flow holes 111 is greater than the spacing density of the containers containing semiconductor components, to ensure that spilled liquid can quickly flow into the leak-proof layer 120 and avoid accumulation on the placement layer 110, which would cause the containers to slip and become unstable.

[0032] In this embodiment, a silicone pad 112 is provided inside the side wall of the placement slot, and a silicone pad 112 is used around the perimeter to prevent the semiconductor components from being bumped during transportation and to protect the safety of the semiconductor components.

[0033] For example, the transport rack 200 is also provided with a handle 220, which is connected to the support 210. The handle 220 is used to facilitate the operation of the semiconductor component humidification transport device by the operator. The support 210 can be made telescopic to adapt to different transport scenarios and expand its applicability.

[0034] Optionally, the semiconductor component humidification transport device also includes a spare parts layer 240, which is fixed on the bracket 210 and spaced apart below the transport frame 100. The spare parts layer 240 is used to store and place other accessories, thereby improving the transport efficiency and applicability of the semiconductor component humidification transport device.

[0035] In this embodiment, the transport rack 200 is also equipped with four casters 230, which are respectively installed at the bottom of the four supports 210, allowing the semiconductor component humidification transport device to move freely. A parking mechanism is provided on one of the casters 230, allowing the semiconductor component humidification transport device to be parked at a fixed location at any time, facilitating handling and transfer by staff.

[0036] Optionally, the bracket 210 is fixed to the outside of the leak-proof layer 120, and the placement layer 110 and the leak-proof layer 120 are detachably connected by screws. The placement layer 110 can be removed separately from the semiconductor component wet transport device for easy cleaning of the interior of the transport frame 100. Alternatively, the bracket 210 and the placement layer 110 can be fixedly connected. Similarly, the placement layer 110 and the leak-proof layer 120 are detachably connected, and the leak-proof layer 120 can be removed separately from the semiconductor component wet transport device. By selecting one of these assembly methods to produce the semiconductor component wet transport device, it is possible to independently specify that the frequently replaced layer can be removed separately, extending the overall service life of the semiconductor component wet transport device and reducing maintenance and replacement costs.

[0037] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A semiconductor component humidification transport device, characterized in that, include: A transport frame (100) includes a placement layer (110) and a leak-proof layer (120). The placement layer (110) is located above the leak-proof layer (120). The placement layer (110) is provided with a placement groove, and the leak-proof layer (120) is provided with a leak-proof groove. The placement groove and the leak-proof groove are stacked in the same direction, and the bottom of the placement groove and the bottom of the leak-proof groove are spaced apart by a preset distance. A liquid flow hole (111) is opened at the bottom of the placement groove. The transport frame (200) is provided with four supports (210), which are respectively fixed around the transport frame (100). The transport frame (200) can move on the ground.

2. The semiconductor component wetting transport device according to claim 1, characterized in that, The leak-proof layer (120) is provided with a drain pipe (121) and a drain valve (122). The drain pipe (121) is connected to the bottom of the leak-proof tank, and the drain valve (122) selectively blocks the drain pipe (121).

3. The semiconductor component wetting and transporting device according to claim 2, characterized in that, The drain valve (122) is located at one end of the bottom of the leak-proof tank, and the bottom of the leak-proof tank is inclined downward at the end near the drain valve (122).

4. The semiconductor component wetting and transport device according to claim 1, characterized in that, The bracket (210) is fixed to the outside of the leak-proof layer (120), and the placement layer (110) and the leak-proof layer (120) are detachably connected.

5. The semiconductor component wetting transport device according to claim 1, characterized in that, The bracket (210) is fixedly connected to the placement layer (110), and the placement layer (110) and the leak-proof layer (120) are detachably connected.

6. The semiconductor component wetting transport device according to claim 1, characterized in that, The density of the fluid flow holes (111) is greater than the density of the placement gaps of the semiconductor components.

7. The semiconductor component wetting transport device according to claim 1, characterized in that, A silicone pad (112) is provided inside the side wall of the placement slot.

8. The semiconductor component wetting transport device according to claim 1, characterized in that, Both the transport frame (100) and the transport rack (200) are made of stainless steel.

9. The semiconductor component wetting transport device according to claim 1, characterized in that, The transport rack (200) is also provided with a handle (220), which is connected to the support (210).

10. The semiconductor component wetting transport device according to any one of claims 1-9, characterized in that, The transport frame (200) is also provided with casters (230), which are located at the bottom of the support (210).

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