Computer maintenance auxiliary equipment and method

Abstract

The invention belongs to the field of notebook computer maintenance, and discloses a computer maintenance auxiliary device and method.The computer comprises a mainboard, an upper shell and a lower shell, the mainboard is fixedly connected with the upper shell, the lower shell is detachably connected with the mainboard, the computer maintenance auxiliary device comprises a maintenance assembly and a computer shell, and an operation channel is formed in the inner side of a sealing piece in a penetrating mode; the maintenance assembly has two forms which are stored between the mainboard and the computer shell, when the maintenance assembly is in the unfolded form, the maintenance assembly is located at the opening of the mainboard and the upper shell, and physical isolation is formed between the mainboard and the lower shell, so that small-particle pollutants (sand grains) in the environment are prevented from entering the inner side of the mainboard to cause damage to the mainboard when the lower shell is disassembled and maintained; when the computer is in a normal use state, the maintenance assembly is rolled on one side of the mainboard in the storage state, and compared with an always-unfolded state, the maintenance assembly can reduce the shielding of the mainboard and increase the heat dissipation space of the mainboard.

Description

Technical Field

[0001] This disclosure pertains to the field of notebook computer repair, specifically relating to a computer repair auxiliary device and method. Background Technology

[0002] When performing maintenance tasks in harsh field environments, it is impossible to carry precision instruments such as multimeters and soldering stations. Maintenance work is usually limited to rough repairs at the connector level, such as reseating modular components like ribbon cables and memory modules, cleaning foreign objects from interfaces, or correcting minor physical deformations. However, even with such simple repairs, once the equipment casing is opened, the internal motherboard is completely exposed to wind, sand, and humidity, making it highly susceptible to secondary damage from contaminants.

[0003] When a computer malfunctions outdoors, repair personnel typically need to remove the casing, exposing the motherboard directly to the external environment. During this time, fine contaminants such as sand and dust can easily enter the device through openings in the casing, adhering to the surfaces of delicate components like the motherboard and connectors, leading to poor contact, short circuits, or physical wear. Outdoor sites lack specialized instruments like multimeters and soldering stations, so repairs are often limited to simple connector-level maintenance, such as reseating ribbon cables, cleaning interfaces, or straightening deformed pins. However, even with such basic repairs, the motherboard remains at risk of secondary contamination while exposed. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this disclosure is to provide a computer repair auxiliary device and method, which solves the problem that the lack of dynamic protection mechanism in the outdoor repair environment causes the motherboard to be directly exposed to pollutants such as sand and dust after the casing is removed, which is prone to secondary damage.

[0005] The objective of this disclosure can be achieved through the following technical solutions: A computer repair auxiliary device includes: a computer including a motherboard, an upper casing, and a lower casing, wherein the motherboard is fixedly connected to the upper casing, and the lower casing is detachably connected to the motherboard; and includes: repair components and a computer casing. The repair component is installed on the side of the motherboard near the lower housing. The repair components include seals and moving parts; The repair kit has two forms: a stowed form and an unfolded form. When the repair components are in the retracted form, the seals are stored inside the movable parts, and the motherboard is directly exposed at the opening of the casing to facilitate heat dissipation. When the repair component is in the unfolded state, the seal unfolds between the computer casing opening and the motherboard, forming a physical isolation between the motherboard and the casing opening; An operating channel is provided through the inner side of the seal.

[0006] In some disclosures, a support frame is provided through the inner side of the seal, and the support frame is a ring structure. The inner ring of the support frame is an operating channel, and an airflow channel is opened inside the support frame. The inner wall of the support frame is provided with an air inlet that connects the airflow channel with the operating channel, and the outer wall of the airflow channel is provided with an air outlet that connects with the internal cavity of the sealing element. A flow divider valve is provided between the air inlet and the air outlet, which is used to control the opening and closing of the air inlet and the air outlet.

[0007] In some disclosures, the support frame is described as a rigid structure.

[0008] In some disclosures, when negative pressure is generated in the airflow channel through the air inlet, the operating channel is transformed from a maintenance tool channel into a contaminant suction channel, thereby achieving active cleaning of contaminants that have entered the operating channel.

[0009] In some disclosures, a pressurization port is provided through the outer wall of the airflow channel, and a hollow hose is connected to the outside of the pressurization port. The end of the hollow hose extends to the outside of the outer shell. The hollow hose is used to connect to the pressure supply mechanism. The seal is a bladder made of flexible material with a cavity formed in its middle. After fluid is filled into the cavity, the seal expands to form a buffer air cushion.

[0010] In some disclosures, the movable component includes a support rod and a storage box, with the support rod fixed to both ends of the seal and the seal wound around the outside of the support rod. The support rod and the wound seal are stored in the storage box.

[0011] In some disclosures, a groove is provided on one side of the housing, and a hollow sleeve is slidably connected to the outside of the groove, with the support rod passing through the hollow area in the middle of the hollow sleeve.

[0012] In some disclosures, the diverter valve includes a first sealing part and a second sealing part. The first sealing part is provided at one end of the airflow channel near the air inlet, and the first sealing part is used to control the gas in the airflow channel to pass through the air inlet and enter the operating channel. The second sealing part is slidably provided on the side of the diverter valve near the air outlet, and the second sealing part is used to control the connection between the airflow channel and the air outlet.

[0013] In some disclosures, the second sealing part includes a baffle and a return spring, and the first sealing part has a baffle parallel to the end face of the vent fixed on the side near the vent. The side wall of the baffle slides along the end face of the vent, and a return spring is fixed on one side of the baffle.

[0014] A computer repair method includes the following steps: S1. When repair is needed, first shut down the computer completely. Then, without removing the lower casing, move the movable parts to unfold the originally rolled-up seal and lay it flat between the motherboard and the lower casing. At this time, the seal forms the first physical isolation barrier between the motherboard and the external environment. S2. After removing the lower casing, use tweezers or pry bars or other repair equipment through the operating channel to re-plug the ribbon cables on the motherboard, clean foreign objects from the interfaces, or correct minor physical deformations. S3. After maintenance is completed, the pressure supply mechanism applies negative pressure to the airflow channel connected in parallel with the operating channel. At this time, the diversion valve responds to the negative pressure, automatically opens the air inlet and closes the air outlet, and generates an adsorption airflow in the operating channel that points towards the airflow channel. This airflow can actively remove trace amounts of dust, moisture and other pollutants that have entered or may enter the operating channel, turning the operating channel from a potential pollution inlet into a clean outlet. S4. When testing the buffer assembly, in order to reduce the damage of the buffer assembly to the motherboard, positive pressure is applied to the airflow channel through the pressure supply mechanism. At this time, the diversion valve responds to the positive pressure, automatically closes the air inlet and opens the air outlet. The positive pressure airflow enters the internal cavity of the seal, causing the seal to expand from a flexible film into a buffer cushion.

[0015] The explanations of the nouns, conjunctions, or adjectives used in the above technical solutions are as follows: A fixed connection refers to a connection in which parts or components are fixed in place and there is no relative movement between them; A rotating connection is a connection between parts that allows the parts to rotate relative to each other. Threaded connections are a type of detachable fixed connection with advantages such as simple structure, reliable connection, and convenient assembly and disassembly. They are widely used in mechanical engineering and connection structure fields. A sliding connection is a connection between parts that allows the parts to slide against each other.

[0016] The beneficial effects of this disclosure are: 1. The repair component has two forms stored between the motherboard and the computer casing. When the repair component is in the unfolded form, it is located at the opening between the motherboard and the upper casing and forms a physical barrier between the motherboard and the lower casing to prevent small particulate pollutants (sand) in the environment from entering the inside of the motherboard and causing damage to the motherboard when the lower casing is removed for repair. When the computer is in normal use, the repair components are rolled up on one side of the motherboard in a stowed state, which reduces obstruction to the motherboard and increases the motherboard's heat dissipation space compared to the always unfolded form. 2. By using the support frame surrounding the operating channel, the operating channel is combined with the built-in airflow channel, and by utilizing the automatic response mechanism of the diversion valve, dual intelligent protection is achieved under a single air path interface: when negative pressure is applied, the system automatically activates the cleaning mode of the operating channel, actively sucking out dust and sand particles in the operating channel, turning the operating channel from a contaminated inlet to a clean outlet. When positive pressure is applied, the diverter valve automatically switches to the inflation mode, directing airflow into the cavity of the seal to cause the seal to expand into a cushioning air pad. This achieves both active cleaning of the operating channel and dynamic buffering protection of the maintenance area without moving any parts. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this disclosure; Figure 2 This is a schematic diagram of the internal structure of the upper and lower housings according to an embodiment of the present disclosure; Figure 3 This is a schematic diagram of the overall structure of the repair component according to an embodiment of the present disclosure; Figure 4 This is an embodiment of the present disclosure. Figure 2 A schematic diagram of the overall structure after the storage box is hidden; Figure 5 This is a schematic diagram of the overall structure of the support frame and operating channel according to an embodiment of the present disclosure; Figure 6 This is an embodiment of the present disclosure. Figure 5 Another perspective on the overall structure; Figure 7 This is an embodiment of the present disclosure. Figure 6 Front view diagram; Figure 8 This is an embodiment of the present disclosure (when the airflow channel is under positive pressure). Figure 7 A schematic diagram of the AA cross-sectional structure; Figure 9 This is an embodiment of the present disclosure (when the airflow channel is under negative pressure). Figure 7 A schematic diagram of the AA cross-sectional structure; Figure 10 This is a schematic diagram of the overall structure of the seal in an expanded state according to an embodiment of this disclosure.

[0019] In the diagram: 1. Mainboard; 101. Upper housing; 102. Lower housing; 2. Maintenance components; 21. Seal; 22. Moving parts; 23. Pressurization interface; 24. Hollow hose; 25. Pressure supply mechanism; 211. Cavity; 221. Support rod; 222. Storage box; 251. Sealing cavity; 252. Piston rod; 2211. Hollow sleeve; 3. Operating channel; 4. Support frame; 41. Air inlet; 42. Air outlet; 5. Airflow channel; 6. Diverter valve; 61. First sealing part; 62. Second sealing part; 611. Valve seat; 612. Valve disc; 621. Baffle; 622. Return spring; 7. Slide groove. Detailed Implementation

[0020] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0021] Please refer to Figures 1 to 9 A computer repair auxiliary device and method, the computer includes a motherboard 1, an upper casing 101 and a lower casing 102, wherein the motherboard 1 is fixedly connected to the upper casing 101 and the lower casing 102 is detachably connected to the motherboard 1, including: repair components 2 and computer shell; Repair component 2 is installed on the side of the motherboard 1 near the lower housing 102; Repair component 2 includes a seal 21 and a moving part 22; Repair component 2 has two forms: a stowed form and an unfolded form; When the repair component 2 is in the storage state, the seal 21 is stored inside the movable part 22, and the motherboard 1 is directly exposed at the opening of the outer casing to facilitate heat dissipation of the motherboard 1. When the repair component 2 is in the unfolded state, the seal 21 unfolds between the computer casing opening and the motherboard 1, and forms a physical isolation between the motherboard 1 and the casing opening; An operating channel 3 is provided through the inner side of the seal 21.

[0022] When in use, before the computer is taken outdoors, the repair component 2 is installed in a retracted state on one side of the motherboard 1. At this time, the motherboard 1 is exposed between the upper shell 101 and the lower shell 102. The upper and lower shells 102 wrap around the outside of the motherboard 1 and provide rigid protection for the motherboard 1. When the repair component 2 is changed to a retracted state, the space between the motherboard 1 and the lower shell 102 is increased to increase the heat dissipation space of the motherboard 1. When maintenance is required, before removing the lower housing 102, completely shut down the computer and move the movable part 22 to unfold the seal 21 to one side. At this time, the motherboard 1 is parallel to the seal 21 and lies flat on the outside of the motherboard 1. After the seal 21 is laid flat, it forms a physical isolation between the motherboard 1 and the lower housing 102. When the lower housing 102 is removed during maintenance, sand particles in the environment are blocked by the seal 21 and will not directly contact the motherboard 1 over a large area. This reduces the contact between the motherboard 1 and external sand particles at the moment the lower housing 102 is removed, thus protecting the motherboard 1. During repair, the repair parts include tweezers or pry bars. The tweezers or pry bars are passed through the operating channel 3 through the seal 21 so that the repair parts can directly contact the motherboard 1. Damaged pins are repaired or the connectors are re-inserted, thus performing simple repairs. Since precision repair tools such as multimeters, constant temperature soldering stations and hot air guns, magnifying glasses and microscopes, and programmers are lacking outdoors, only some connector-level repairs such as re-insertion, cleaning interfaces, and correcting physical deformations can be performed. The supplies used at this time include tweezers, pry bars, etc.

[0023] Subsequently, the operator can use repair tools such as tweezers and pry bars to insert into the device through the operating channel 3 on the seal 21 to perform rough repairs on the motherboard 1. Specific repair operations include, but are not limited to: straightening bent pins, or re-inserting and securing loose ribbon cables, memory modules, and other modular components.

[0024] Please refer to Figures 3 to 9 A support frame 4 is provided through the inner side of the sealing element 21, and the support frame 4 is a ring structure. The inner ring of the support frame 4 is the operating channel 3, and an airflow channel 5 is provided inside the support frame 4. The inner wall of the support frame 4 is provided with an air inlet 41 that connects the airflow channel 5 with the operation channel 3, and the outer wall of the airflow channel 5 is provided with an air outlet 42 that connects with the internal cavity 211 of the sealing element 21. A flow divider valve 6 is provided between the air inlet 41 and the air outlet 42. The flow divider valve 6 is used to control the opening and closing of the air inlet 41 and the air outlet 42.

[0025] In use, the support frame 4 is arranged around the operating channel 3, and one end of the pressurization port 23 is connected to the airflow channel 5.

[0026] The diverter valve 6 on the airflow channel 5 controls the opening and closing of the air inlet 41 and the air outlet 42 respectively. The inner cavity of the operating channel 3 and the sealing element 21 are connected to the airflow channel 5 through the air inlet 41 and the air outlet 42 respectively. When the pressure supply mechanism 25 creates negative pressure on the airflow channel 5, the diverter valve 6 controls the air inlet 41 to be open. At this time, the fluid in the operating channel 3 passes through the air inlet 41 and enters the airflow channel 5, creating negative pressure in the operating channel 3. When the pressure supply mechanism 25 creates positive pressure on the airflow channel 5, the air inlet 41 is closed and the air outlet 42 is open. At this time, the airflow channel 5 and the inner cavity of the sealing element 21 are connected, and the airflow in the airflow channel 5 can smoothly enter the sealing element 21.

[0027] Support frame 4 is a rigid structure; The support frame 4 is made of materials including but not limited to plastic. Its rigid inner wall is not easily deformed, which provides stable support for the air inlet 41 and the air outlet 42. This is beneficial because the air inlet 41 and the air outlet 42 will not be blocked due to deformation during the extrusion process. Please refer to Figure 9 When negative pressure is generated in the airflow channel 5 through the air inlet 41, the operation channel 3 is transformed from a maintenance tool channel into a pollutant suction channel, thereby achieving active cleaning of pollutants that have entered the operation channel 3.

[0028] Through the negative pressure effect, the system automatically and proactively removes trace amounts of dust, moisture, and other contaminants that may enter through the operating channel 3 during the maintenance process. After maintenance is completed, the operating channel 3, which may have been contaminated, is actively cleaned, transforming it from a potential contamination inlet into a final clean outlet.

[0029] A closing plate can be installed on the outside of operating channel 3, such as... Figure 5 As shown, the operation channel 3 is used to turn on and off, so that the operation channel 3 can be turned on at the appropriate time, which helps to further reduce the intrusion of impurities into the motherboard 1.

[0030] Please refer to Figure 10 The outer wall of the airflow channel 5 is provided with a pressurization interface 23 for connecting the pressure supply mechanism 25. The sealing element 21 is a bladder made of flexible material, with a cavity 211 formed in its middle. After fluid is filled into the cavity 211, the sealing element 21 expands to form a buffer air cushion. The seal 21 is made of flexible rubber or thermoplastic polyurethane elastomer rubber material. Its flexibility allows it to deform after inflation. At the same time, the flexible material is easy to wrap around the outside of the support rod 221 for easy storage and unfolding. A cavity 211 is formed in the middle of the seal 211, and a stamping structure is connected through the outer wall of the cavity 211. After the external gas is injected into the cavity 211 in the middle of the seal 21, the seal 21 is filled with air and expands outward. The expanded seal 21 is still laid flat on the main board 1 in an unfolded form. Thus, without additional adjustment of its position, the seal 21 can form a buffer airbag between the main board 1 and the lower housing 102, which provides further protection for the main board 1. Please refer to Figures 5 to 9 A hollow hose 24 is connected to the outside of the pressurization port 23, and the end of the hollow hose 24 extends to the outside of the housing.

[0031] In some embodiments, the pressure supply mechanism 25 includes a sealing cavity 251 and a piston rod 252. A hollow hose 24 is connected to a piston tube on the side away from the pressurization port 23. The piston tube includes the sealing cavity 251 and the piston rod 252. This structure is like a needle tube, wherein the needle tube is connected to the hose. When the piston rod 252 is pulled outward, a negative pressure is formed in the sealing cavity 251, the hollow hose 24 and the airflow channel 5. When the piston rod 252 is pushed inward, a positive pressure is formed in the sealing cavity 251, the hollow hose 24 and the airflow channel 5.

[0032] The pressure supply mechanism 25 is located on the outside of the housing to inflate the seal 21 located on the inside of the housing. This facilitates the inflation of the seal 21 after the upper and lower housings are closed and creates negative pressure for cleaning the operating channel 3. Compared to cleaning the operating channel 3 when the housing is open or closed, this reduces the possibility of dirt and sand particles in the environment re-entering the operating channel 3.

[0033] Please refer to Figure 3 , Figure 4 and Figure 7 The movable part 22 includes a support rod 221 and a storage box 222. The two ends of the sealing part 21 are respectively fixed to the support rod 221, and the sealing part 21 is wound around the outside of the support rod 221. The support rod 221 and the wound sealing part 21 are stored in the storage box 222. The operating channel 3 is located between the two support rods 221. When maintenance is performed, the seal 21 is in the unfolded state. Due to the uncertainty of the damage point, if the position of the operating channel 3 is fixed, the maintenance range is limited. Therefore, in order to increase the coverage area of ​​the operating channel 3, the position of the operating channel 3 is changed by changing the wrapping length of the seal 21 on the two support rods 221, thereby improving the adaptability of a single operating channel 3 to multiple maintenance points. Please refer to Figure 1A groove 7 is provided on one side of the outer shell, and a hollow sleeve 2211 is slidably connected to the outside of the groove 7. The support rod 221 passes through the hollow area in the middle of the hollow sleeve 2211.

[0034] Meanwhile, when the seal 21 is in a flat state, it is wrapped around the outside of the support rod 221. The outer wall of the hollow sleeve 2211 is inserted into the slide groove 7. The movement path of the hollow sleeve 2211 is the same as that of the slide groove 7. The movement path of the hollow sleeve 2211 is restricted by the inner wall of the slide groove 7. When in use, the seals 21 on both sides of the operating channel 3 are wrapped around the outside of the support rod 221. During this period, one of the support rods 221 is pushed to move along the slide groove 7 to the side closer to the other support rod 221, thereby reducing the unfolded area of ​​the seal 21 between the two support rods 221. This reduces the coverage of the motherboard 1 when not in maintenance state, thereby reducing the impact on the heat dissipation of the motherboard 1.

[0035] Please refer to Figures 7 to 9 The diverter valve 6 includes a first sealing part 61 and a second sealing part 62. The first sealing part 61 is provided at one end of the airflow channel 5 near the air inlet 41, and the first sealing part 61 is used to control the gas in the airflow channel 5 to pass through the air inlet 41 and enter the operating channel 3. The second sealing part 62 is slidably provided on the side of the diverter valve 6 near the air outlet 42, and the second sealing part 62 is used to control the connection between the airflow channel 5 and the air outlet 42.

[0036] The first sealing part 61 is a one-way valve, wherein the one-way valve is configured to allow fluid in the operating channel 3 to flow unidirectionally into the airflow channel 5.

[0037] As a specific implementation, the one-way valve can adopt an umbrella valve structure. It includes a valve seat 611 and a valve disc 612 made of elastic material. Under positive pressure (inflation pressure), the valve disc 612, under its own elasticity, tightly fits against the valve seat 611, thereby closing the flow channel and preventing fluid from passing through. When the airflow channel 5 is under negative pressure, the suction force of the negative airflow drives the valve disc 612 to move towards the side of the valve seat 611, thereby forming a gap between the valve seat 611 and the valve disc 612, and thus opening the air inlet 41. At this time, the fluid in the operating channel 3 enters the airflow channel 5 through the gap between the valve seat 611 and the valve disc 612, thereby forming a negative pressure in the operating channel 3. When sand particles in the operating channel 3 enter the airflow channel 5 through this negative pressure airflow, the possibility of the main board 1 being damaged again due to sand particles is reduced.

[0038] Please refer to Figures 7 to 9 The second sealing part 62 includes a baffle 621 and a return spring 622. The first sealing part 61 has a baffle 621 that is parallel to the end face of the vent 42 fixed on the side near the vent 42. The side wall of the baffle 621 slides along the end face of the vent 42. A return spring 622 is fixed on one side of the baffle 621.

[0039] When the return spring 622 is in its original length state, the side of the baffle 621 near the vent 42 is in contact with the end face of the vent 42. At this time, the vent 42 is in a closed state. The baffle 621 separates the airflow channel 5 from the cavity inside the seal 21, thereby restricting the gas inside the seal 21 from flowing out. When the airflow channel 5 is under negative pressure (i.e., the fluid in the airflow channel 5 is drawn out), the baffle 621 blocks the air outlet 42. After the one-way valve is opened, the operating channel 3 is under negative pressure. When the airflow channel 5 is under positive pressure (i.e., the fluid is injected from the outside into the airflow channel 5), the one-way valve is closed. The positive pressure airflow in the airflow channel 5 pushes the one-way valve and the baffle 621 to slide along the inner wall of the airflow channel 5, causing the return spring 622 to undergo elastic deformation and stretch outward until the baffle 621 is misaligned with the air outlet 42. At this time, the positive pressure fluid in the airflow channel 5 passes through the air outlet 42 and enters the cavity 211 in the seal 21.

[0040] A computer repair method includes the following steps: S1. When repair is required, first completely shut down the computer. Then, without removing the lower casing 102, move the movable part 22 to unfold the originally rolled-up sealing component 21, allowing it to lie flat between the motherboard 1 and the lower casing 102. At this time, the sealing component 21 forms the first physical isolation barrier between the motherboard 1 and the external environment. S2. After removing the lower housing 102, use tweezers or pry bar or other maintenance equipment through the operation channel 3 to re-plug the ribbon cable on the motherboard 1, clean foreign objects from the interface, or correct minor physical deformation. S3. After maintenance, the pressure supply mechanism 25 applies negative pressure to the airflow channel 5 connected in parallel with the operation channel 3. At this time, the diversion valve 6 responds to the negative pressure, automatically opens the air inlet 41 and closes the air outlet 42, generating an adsorption airflow in the operation channel 3 that points towards the airflow channel 5. This airflow can actively remove trace amounts of dust, moisture and other pollutants that have entered or may enter the operation channel 3, turning the operation channel 3 from a potential pollution inlet into a clean outlet. S4. During the testing of the buffer assembly, in order to reduce the damage of the buffer assembly to the motherboard 1, positive pressure is applied to the airflow channel 5 through the pressure supply mechanism 25. At this time, the diversion valve 6 responds to the positive pressure, automatically closes the air inlet 41 and opens the air outlet 42, and the positive pressure airflow enters the internal cavity 211 of the seal 21, causing the seal 21 to expand from a flexible film into a buffer air cushion.

[0041] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0042] The foregoing has shown and described the basic principles, main features, and advantages of this disclosure. Those skilled in the art should understand that this disclosure is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this disclosure. Various changes and modifications can be made to this disclosure without departing from its spirit and scope, and all such changes and modifications fall within the scope of this disclosure as claimed.

Claims

1. A computer repair auxiliary device, comprising: The computer includes a motherboard (1), an upper casing (101), and a lower casing (102), wherein the motherboard (1) is fixedly connected to the upper casing (101), and the lower casing (102) is detachably connected to the motherboard (1), characterized in that it includes a repair component (2) and a computer shell; Repair component (2) is installed on the side of the motherboard (1) near the lower housing (102); The maintenance component (2) includes a seal (21) and a moving part (22); The repair component (2) has two forms: a storage form and an unfolded form. When the repair component (2) is in the storage form, the seal (21) is stored inside the movable part (22), and the motherboard (1) is directly exposed at the opening of the casing to facilitate heat dissipation of the motherboard (1); When the repair component (2) is in the unfolded state, the seal (21) unfolds between the computer casing opening and the motherboard (1), and forms a physical isolation between the motherboard (1) and the casing opening; An operating channel (3) is provided through the inner side of the seal (21).

2. The computer repair auxiliary equipment according to claim 1, characterized in that, The inner side of the sealing element (21) is provided with a support frame (4), and the support frame (4) is a ring structure. The inner ring of the support frame (4) is an operating channel (3), and the airflow channel (5) is opened inside the support frame (4). The inner wall of the support frame (4) is provided with an air inlet (41) that connects the airflow channel (5) with the operation channel (3), and the outer wall of the airflow channel (5) is provided with an air outlet (42) that connects with the internal cavity (211) of the sealing element (21). A flow divider valve (6) is provided between the air inlet (41) and the air outlet (42), and the flow divider valve (6) is used to control the opening and closing of the air inlet (41) and the air outlet (42).

3. The computer repair auxiliary equipment according to claim 2, characterized in that, The support frame (4) is a rigid structure.

4. The computer repair auxiliary equipment according to claim 3, characterized in that, When negative pressure is generated in the airflow channel (5) through the air inlet (41), the operation channel (3) is transformed from a maintenance tool channel into a pollutant suction channel, thereby realizing the active cleaning of pollutants that have entered the operation channel (3).

5. A computer repair auxiliary device according to claim 2, characterized in that, The outer wall of the airflow channel (5) is provided with a pressurization port (23). A hollow hose (24) is connected to the outside of the pressurization port (23), and the end of the hollow hose (24) extends to the outside of the shell. The hollow hose (24) is used to connect the pressure supply mechanism (25). The sealing element (21) is a bladder made of flexible material, with a cavity (211) formed in its middle. After fluid is filled into the cavity (211), the sealing element (21) expands to form a buffer air cushion.

6. The computer repair auxiliary equipment according to claim 5, characterized in that, The movable part (22) includes a support rod (221) and a storage box (222). The two ends of the sealing member (21) are respectively fixed to the support rod (221), and the sealing member (21) is wrapped around the outside of the support rod (221). The support rod (221) and the wrapped sealing member (21) are stored in the storage box (222).

7. A computer repair auxiliary device according to claim 6, characterized in that, A groove (7) is provided on one side of the outer shell, and a hollow sleeve (2211) is slidably connected to the outside of the groove (7). The support rod (221) passes through the hollow area in the middle of the hollow sleeve (2211).

8. A computer repair auxiliary device according to claim 5, characterized in that, The diverter valve (6) includes a first sealing part (61) and a second sealing part (62). The first sealing part (61) is provided at one end of the airflow channel (5) near the air inlet (41), and the first sealing part (61) is used to control the gas in the airflow channel (5) to pass through the air inlet (41) and enter the operating channel (3). The second sealing part (62) is slidably provided on the side of the diverter valve (6) near the air outlet (42), and the second sealing part (62) is used to control the connection between the airflow channel (5) and the air outlet (42).

9. A computer repair auxiliary device according to claim 8, characterized in that, The second sealing part (62) includes a baffle (621) and a return spring (622). The first sealing part (61) has a baffle (621) that is parallel to the end face of the vent (42) fixed on the side near the vent (42). The side wall of the baffle (621) slides along the end face of the vent (42). A return spring (622) is fixed on one side of the baffle (621).

10. A computer repair method, based on the computer repair auxiliary equipment according to claim 9, characterized in that, Includes the following steps: S1. When repair is needed, first shut down the computer completely. Then, without removing the lower casing (102), move the movable part (22) to unfold the originally rolled-up sealing part (21) and lay it flat between the motherboard (1) and the lower casing (102). At this time, the sealing part (21) forms a physical isolation barrier between the motherboard (1) and the external environment. S2. After removing the lower housing (102), use tweezers or pry bar and other maintenance equipment through the operation channel (3) to re-plug the ribbon cable on the motherboard (1), clean foreign objects from the interface, or correct minor physical deformation. S3. After maintenance, the pressure supply mechanism (25) applies negative pressure to the airflow channel (5) connected in parallel with the operation channel (3). At this time, the diversion valve (6) responds to the negative pressure, automatically opens the air inlet (41) and closes the air outlet (42), and generates an adsorption airflow pointing towards the airflow channel (5) in the operation channel (3). This airflow can actively remove the trace dust, moisture and other pollutants that have entered or may enter the operation channel (3), and transform the operation channel (3) from a potential pollution inlet into a clean outlet. S4. When testing the buffer assembly, in order to reduce the damage of the buffer assembly to the motherboard (1), positive pressure is applied to the airflow channel (5) through the pressure supply mechanism (25). At this time, the diversion valve (6) responds to the positive pressure, automatically closes the air inlet (41) and opens the air outlet (42). The positive pressure airflow enters the internal cavity (211) of the seal (21), causing the seal (21) to expand from a flexible film into a buffer air cushion.

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