Grid stitching method for multi-board and bus bar joint simulation, simulation method and product

Abstract

The embodiment of the invention discloses a grid stitching method for multi-board and bus bar joint simulation, a simulation method, electronic equipment, a computer readable storage medium and a computer program product, and belongs to the technical field of simulation. The grid stitching method for multi-board and bus bar joint simulation comprises the steps that after two-dimensional layouts of a plurality of boards and three-dimensional models of bus bars are subjected to simulation assembly in simulation software, the contact positions of the boards and the bus bars are obtained, and coordinates of the contact positions of the boards are obtained; determining a conformal area of the board and the bus bar based on the board contact position coordinates; subdividing the conformal area according to the obtained points and carrying out two-dimensional subdivision on the non-conformal area; and transmitting the subdivided layout and bus bar information to a solver, so that the solver stitches the plurality of boards and bus bars. The conformal area of the board and the bus bar is determined by obtaining the contact position of the board and the bus bar, so that the two-dimensional layout and the three-dimensional model form a whole, and fusion among different dimensions is achieved.

Description

Technical Field

[0001] This application relates to the field of simulation technology, and more specifically, to a mesh stitching method, simulation method, and product for joint simulation of multiple plates and busbars. Background Technology

[0002] Traditional 2D simulation targets PCB layouts, treating the PCB's laminated structure as an infinitely large parallel plane, meshing only in the XY plane and stacking in the Z direction. Traditional 3D simulation techniques target busbars and systems. Traditional 2D and 3D simulation techniques are fragmented. Each is effective within its applicable scope, but cannot handle the precise electrothermal co-simulation of systems like "multi-board + busbar" systems. All these problems stem from dimensional gaps, algorithmic barriers, and lack of coupling. Therefore, the industry urgently needs a new method and device that can seamlessly integrate 2D and 3D modeling to achieve efficient and accurate bidirectional electrothermal coupling simulation. Summary of the Invention

[0003] This application provides a mesh stitching method, simulation method, and product for joint simulation of multiple plates and busbars, so as to at least solve the technical problem of seamlessly integrating 2D and 3D modeling.

[0004] According to a first aspect of the embodiments of this application, a mesh stitching method for joint simulation of multiple plates and busbars is provided, the method comprising: After simulating the assembly of multiple 2D layouts of boards and 3D models of busbars in simulation software, the contact positions between the boards and busbars are obtained, and the contact position coordinates of the boards and busbars are obtained. The conformal region between the plate and the busbar is determined based on the contact position coordinates of the slats; The conformal region is partitioned according to the acquisition point, and the non-conformal region is partitioned in two dimensions. The partitioned layout and busbar information are transmitted to the solver so that the solver can stitch together multiple boards and busbars.

[0005] In this embodiment, the conformal region between the board and the busbar is determined by obtaining the contact position between the board and the busbar, so that the two-dimensional layout and the three-dimensional model form a whole and realize the fusion between different dimensions.

[0006] In conjunction with the first aspect, in an optional implementation of this application embodiment, determining the conformal region between the plate and the busbar based on the contact position coordinates of the slats includes: The intersecting area of ​​the slats is determined based on the coordinates of the slat contact positions. The solder and busbar are constructed into a new body and tetrahedral meshed, wherein the solder is used to fill the contact positions between boards and between boards and busbars; Calculate the grid points at the contact surface between the busbar and the plate after the tetrahedral mesh is applied, and obtain the coordinates of the grid points on the busbar. The conformal region is determined based on the intersection area of ​​the slats and the coordinates of the slat grid points.

[0007] In this implementation, when determining the conformal region between the board and the busbar, the intersection area of ​​the board and the busbar is first determined based on the coordinates of the contact position of the board and the busbar. Then, the solder and the busbar are combined into a new body. Tetrahedral meshing is performed on the new body to obtain the mesh points of the contact surface between the busbar and the board. Finally, the conformal region is determined by the intersection area of ​​the board and the coordinates of the mesh points of the board and the busbar, so that the accuracy and precision of the conformal region can be guaranteed.

[0008] In conjunction with the first aspect, in an optional implementation of this application embodiment, determining the conformal region based on the intersection region of the slats and the coordinates of the slat grid points includes: If there are no holes in the intersection area between the board and the busbar, the area where the surfaces intersect is determined based on the coordinates of the points on the board grid at the boundary and is taken as the conformal area. If there are holes in the board and no holes in the busbar, the location of the hole is determined based on the coordinates of the points on the board grid, and the external intersection area outside the hole is taken as the conformal area. If there are holes in the board at the contact point of the busbar and no holes in the busbar, the location of the hole is determined based on the coordinates of the points on the board grid, and the common area outside the hole is taken as the conformal area.

[0009] This implementation method helps to save computing resources and improve computing efficiency.

[0010] In conjunction with the first aspect, in one optional implementation of the embodiments of this application, the simulation assembly of the two-dimensional layout of multiple boards and the three-dimensional model of the busbar in simulation software includes: Obtain the two-dimensional layout and the three-dimensional model; Obtain the electrical connection points that need to be connected to the busbar, wherein the electrical connection points include at least one of connection points on the board and connection points on the busbar; Integrate the coordinates of the electrical connection points into the same coordinate system; Solder is applied to the electrical connection points at the locations where contact is required between the board and the busbar, as well as between the boards, to complete the assembly.

[0011] By adopting this implementation method, the assembly precision and accuracy are improved through electrical connection points and integrated coordinate system.

[0012] In conjunction with the first aspect, in an optional implementation of the embodiments of this application, integrating the coordinates of the electrical connection points into the same coordinate system includes: Select a board as the substrate; Perform coordinate transformation on all boards and busbars relative to the base plate's coordinate system.

[0013] This implementation method can reduce the computational resource consumption of the integrated coordinate system and improve its efficiency.

[0014] In conjunction with the first aspect, in an optional implementation of the embodiments of this application, the contact position between the board and the busbar includes the position where the surface of the board contacts the surface of the busbar and the position where the pins of the busbar are inserted into the vias of the board.

[0015] This implementation method helps to improve the comprehensiveness of contact positions, thereby increasing the sufficiency of the contact position coordinates of the slats and avoiding omissions.

[0016] According to a second aspect of the embodiments of this application, a method for co-simulation of multiple boards and busbars is provided, the method comprising: Multiple plates and busbars are stitched together using the mesh stitching method described above; The simulation parameters are calculated using a solver.

[0017] According to a third aspect of the embodiments of this application, an electronic device is provided, the electronic device including a memory and a processor; The memory is used to store computer programs; The processor is used to execute the computer program to implement the steps of the method described above.

[0018] According to a fourth aspect of the present application, a computer-readable storage medium is provided, the computer-readable storage medium storing a computer program that, when run on a computer or processor, causes the computer or processor to perform the steps of the method described above.

[0019] According to a fifth aspect of the embodiments of this application, a computer program product is provided, the computer program product comprising computer instructions that, when executed by a computer or processor, cause the steps of the method described above to be performed.

[0020] The technical effects achieved by the second to fifth aspects mentioned above are similar to those achieved by the corresponding technical means in the first aspect, and will not be repeated here. Attached Figure Description

[0021] Figure 1 This is a flowchart of a mesh stitching method for joint simulation of multiple plates and busbars provided in an embodiment of this application; Figure 2 This is a flowchart of the electrothermal co-simulation of multiple boards and busbars in a specific scenario, provided in an embodiment of this application; Figure 3 This is an assembly flowchart of the combined electrothermal simulation of multiple boards and busbars in a specific scenario, provided in an embodiment of this application. Figure 4 This is a flowchart of the electrothermal co-simulation of multiple boards and busbars in a specific scenario, provided in an embodiment of this application; Figure 5 This is a structural block diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0022] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0023] It should be understood that "multiple" as mentioned herein refers to two or more. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. In addition, to facilitate a clear description of the technical solutions of the embodiments of this application, the terms "first," "second," etc., are used in the embodiments of this application to distinguish identical or similar items with substantially the same function and effect. Those skilled in the art will understand that the terms "first," "second," etc., do not limit the quantity or execution order, and the terms "first," "second," etc., do not necessarily imply that they are different.

[0024] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.

[0025] First, the technical background and / or terminology involved in the embodiments of this application will be introduced. With the rapid development of power electronics technology towards higher power density, higher efficiency, and higher reliability, modern electronic devices, such as new energy vehicle systems, industrial frequency converters, and server power supplies, are constantly increasing their power levels, often needing to handle continuous high currents of hundreds or even thousands of amperes. This trend poses a severe challenge to traditional printed circuit board (PCB) power routing technology. Conventional PCB power circuits rely on copper traces or power planes to carry current. Their current-carrying capacity is limited by the thickness of the copper foil, which not only occupies PCB area and squeezes signal routing space, leading to an increase in the number of layers and higher costs, but more importantly, it introduces unacceptable resistive losses. These losses are converted into heat, causing localized high-temperature hot spots on the PCB, endangering the integrity of the insulating substrate, reducing system efficiency, and ultimately threatening the reliability and lifespan of the entire product.

[0026] Busbar technology has been incorporated into PCB design and system integration. A busbar is a freestanding, rigid or flexible structural component made of highly conductive metal, whose core advantage lies in its extremely large conductor cross-sectional area. Connected to critical high-current nodes on the PCB via mechanical means (such as soldering, crimping, or screw fastening), the busbar can efficiently carry current in the main power path with extremely low resistance and inductance.

[0027] Traditional 2D simulation targets PCB layouts, treating the PCB's laminated structure as an infinitely large parallel plane, meshing only in the XY plane and stacking in the Z direction. Traditional 3D simulation techniques target busbars and systems. Traditional 2D and 3D simulation techniques are fragmented. Each is effective within its applicable scope, but cannot handle the precise electrothermal co-simulation of systems like "multi-board + busbar" systems. All these problems stem from dimensional gaps, algorithmic barriers, and lack of coupling. Therefore, the industry urgently needs a new method and device that can seamlessly integrate 2D and 3D modeling to achieve efficient and accurate bidirectional electrothermal coupling simulation.

[0028] Based on this, embodiments of this application provide a mesh stitching method, simulation method, and product for joint simulation of multiple plates and busbars, referencing... Figure 1 The flowchart shown is a mesh stitching method for co-simulation of multiple plates and busbars. The method includes the following processing steps.

[0029] S100. After simulating the assembly of the two-dimensional layout of multiple boards and the three-dimensional model of the busbar in the simulation software, the contact position between the boards and the busbar is obtained, and the contact position coordinates of the boards and busbars are obtained.

[0030] In this context, "board" refers to a PCB (Printed Circuit Board), "2D layout" refers to a 2D or 2.5D graphic of the board, and "busbar" refers to a 3D model. After assembling the board and busbar in simulation software, the contact position between the board and busbar can be obtained using the simulation software's recognition plugin or other scanning tools. Alternatively, the contact position can be obtained through algorithms or manual input. It's important to note that the contact position between the board and busbar is fixed; that is, the contact positions mentioned in this embodiment are the required contact points, not the points where the board and busbar would contact each other arbitrarily. In other words, both the board and busbar have electrical connection points. After connecting these points according to usage requirements, the point where the board and busbar contact each other is the contact position.

[0031] In this system, both the board and the busbar are located within a coordinate system. Once the contact position is known, the coordinates of the contact position of the busbar can be obtained. It should be noted that since the contact position between the board and the busbar may be a region, the coordinates of the contact position of the busbar can be the coordinates of a corner of the contact position or the coordinates of the entire contact position. If the contact position between the board and the busbar is a point-to-point contact, then the coordinates of the contact position of the busbar include the coordinates of multiple points.

[0032] S102. Determine the conformal region between the plate and the busbar based on the contact position coordinates of the slats.

[0033] In this context, a conformal region refers to a mesh generation process where two or more geometrically independent objects, each with its own mesh, have perfectly connected meshes at their boundaries, sharing nodes as if they were a single entity from the beginning. Furthermore, the essence of simulation is solving for physical fields (electromagnetic fields, temperature fields, stress fields, etc.). These fields must satisfy specific continuity conditions at the boundaries of different materials. For example, in thermal simulation, the temperature and heat flux on both sides of the boundary must be equal; in electromagnetic simulation, the electric and magnetic fields on both sides of the boundary must satisfy specific boundary relationships. By sharing nodes at the boundaries, conformal meshes naturally and enforceably guarantee the continuity of these physical quantities, thereby greatly improving computational accuracy.

[0034] After determining the coordinates of the contact position of the slats, the contact positions of the slats and the busbars can be constructed into a conformal region.

[0035] S104. The conformal region is divided according to the acquisition point, and the non-conformal region is divided into two dimensions.

[0036] Here, "acquisition points" refers to key locations. These points can be identified automatically by simulation software or other software, or they can be manually preset points, such as power pins of a CPU chip or pads of a decoupling capacitor. This embodiment does not limit this. "Mesh generation," also called "subdivision," is a core preprocessing step in simulation. It discretizes a continuous physical entity (such as a copper sheet) into countless small, simple units (such as triangles or quadrilaterals) so that the computer can solve it numerically. Specifically, the subdivision process based on acquisition points mainly includes: Initial global meshing: The software first performs an initial, relatively uniform meshing of the entire PCB layout based on the geometry.

[0037] Identify Acquisition Points: The software reads the user-specified list of "acquisition points" (i.e., those key PINs).

[0038] Local mesh refinement: The software automatically refines the mesh around each "acquisition point". This means that the mesh cells become smaller and denser near the acquisition point.

[0039] Simulation calculations were performed on a refined mesh. Because the mesh is finer near the acquisition point, the calculated fields (electric field, magnetic field, current density) and results (voltage, impedance) are much more accurate here than in other areas.

[0040] 2D meshing refers to dividing a two-dimensional planar graphic into a mesh. It only considers the geometry of the object in the X and Y directions, ignoring its thickness (Z direction). The generated mesh cells are planar cells, such as triangles and quadrilaterals.

[0041] S106. The partitioned layout and busbar information are transmitted to the solver so that the solver stitches together the multiple boards and busbars.

[0042] In this embodiment, the conformal region between the board and the busbar is determined by obtaining the contact position between the board and the busbar, so that the two-dimensional layout and the three-dimensional model form a whole and realize the fusion between different dimensions.

[0043] In one possible embodiment of this application, determining the conformal region between the plate and the busbar based on the contact position coordinates of the slats includes: The intersecting area of ​​the slats is determined based on the coordinates of the slat contact positions. The solder and busbar are constructed into a new body and tetrahedral meshed, wherein the solder is used to fill the contact positions between boards and between boards and busbars; Calculate the grid points at the contact surface between the busbar and the plate after the tetrahedral mesh is applied, and obtain the coordinates of the grid points on the busbar. The conformal region is determined based on the intersection area of ​​the slats and the coordinates of the slat grid points.

[0044] Tetrahedral meshing refers to discretizing a three-dimensional geometry by filling it with countless tetrahedral units, thus facilitating numerical computation. Specifically, tetrahedral meshing mainly includes: Surface triangulation: First, a 2D mesh of triangles (surface mesh) is generated on the outer surface of the 3D object. This mesh defines the shape and boundaries of the object.

[0045] Volume mesh generation: Then, using the surface triangular mesh as the boundary, tetrahedral elements are automatically filled into the interior of the object until the entire volume is filled.

[0046] Mesh optimization: The software smooths and optimizes the generated mesh to avoid overly sharp or poor-quality tetrahedrons (which can lead to calculation errors or decreased accuracy).

[0047] In this implementation, when determining the conformal region between the board and the busbar, the intersection area of ​​the board and the busbar is first determined based on the coordinates of the contact position of the board and the busbar. Then, the solder and the busbar are combined into a new body. Tetrahedral meshing is performed on the new body to obtain the mesh points of the contact surface between the busbar and the board. Finally, the conformal region is determined by the intersection area of ​​the board and the coordinates of the mesh points of the board and the busbar, so that the accuracy and precision of the conformal region can be guaranteed.

[0048] Optionally, in one implementation of this embodiment, determining the conformal region based on the intersection region of the slats and the coordinates of the slat grid points includes: If there are no holes in the intersection area between the board and the busbar, the area where the surfaces intersect is determined based on the coordinates of the points on the board grid at the boundary and is taken as the conformal area. If there are holes in the board and no holes in the busbar, the location of the hole is determined based on the coordinates of the points on the board grid, and the external intersection area outside the hole is taken as the conformal area. If there are holes in the board at the contact point of the busbar and no holes in the busbar, the location of the hole is determined based on the coordinates of the points on the board grid, and the common area outside the hole is taken as the conformal area.

[0049] The hole can be a cavity or a slot or other hole-like structure, and this embodiment does not limit the specific hole.

[0050] This implementation method helps to save computing resources and improve computing efficiency.

[0051] Optionally, in one implementation of this embodiment, the simulation assembly of the two-dimensional layout of multiple boards and the three-dimensional model of the busbar in simulation software includes: Obtain the two-dimensional layout and the three-dimensional model; Obtain the electrical connection points that need to be connected to the busbar, wherein the electrical connection points include at least one of connection points on the board and connection points on the busbar; Integrate the coordinates of the electrical connection points into the same coordinate system; Solder is applied to the electrical connection points at the locations where contact is required between the board and the busbar, as well as between the boards, to complete the assembly.

[0052] Electrical connection points, also known as PINs or network nodes, refer to the connection points on the board and busbar models.

[0053] By adopting this implementation method, the assembly precision and accuracy are improved through electrical connection points and integrated coordinate system.

[0054] Optionally, in one implementation of this embodiment, integrating the coordinates of the electrical connection points into the same coordinate system includes: Select a board as the substrate; Perform coordinate transformation on all boards and busbars relative to the base plate's coordinate system.

[0055] This implementation method can reduce the computational resource consumption of the integrated coordinate system and improve its efficiency.

[0056] Optionally, in one implementation of this embodiment, the contact position between the board and the busbar includes the position where the surface of the board contacts the surface of the busbar and the position where the pins of the busbar are inserted into the vias of the board.

[0057] This implementation method helps to improve the comprehensiveness of contact positions, thereby increasing the sufficiency of the contact position coordinates of the slats and avoiding omissions.

[0058] According to a second aspect of the embodiments of this application, a method for co-simulation of multiple boards and busbars is provided, the method comprising: Multiple plates and busbars are stitched together using the mesh stitching method described above; The simulation parameters are calculated using a solver.

[0059] In the above embodiments of this application, the descriptions of each embodiment have their own emphasis. Parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments. The steps illustrated in the related flowcharts can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowcharts, in some cases, the steps shown or described may be performed in a different order than that shown here. In other words, the order of steps described in the foregoing embodiments is merely an example. Reasonable adjustments to the order of steps based on the content of the embodiments of this application are also within the protection scope of the embodiments of this application.

[0060] In one specific implementation of this application embodiment, the multi-board and busbar co-simulation method includes the following processing steps: like Figure 2 , Figure 3 and Figure 4 As shown, first import the layout to find out which pins (electrical connection points) need to be connected to busbars. After the boards are connected by busbars, the positional relationship between the boards may be parallel in the Z direction or perpendicular in the Z direction.

[0061] Each board and each busbar has its own coordinate system. Based on the pin information selected by the customer and the busbar model, one board needs to be selected as the substrate. The coordinate systems of the other boards and busbars are transformed relative to the substrate, so that all boards and busbars are placed in the same coordinate system relative to the substrate. The positional relationship between the busbar and the board is surface contact, or the busbar pins may be inserted into the via holes of the board. The positional relationship between boards is also the same. Then, solder needs to be filled at the contact points so that all boards and busbars are completely connected at the connection points.

[0062] After assembly, the contact position between the board and the busbar needs to be obtained, and the actual intersection area needs to be calculated using boolean operations. Finally, the solder and busbar are constructed into a new body and then tetrahedralized (because busbars are usually anisotropic). The mesh points of the contact surface of the meshed busbar need to be calculated.

[0063] The next step is to mesh the layout. Before meshing, it's necessary to obtain all regions intersecting with the busbars and the meshing grid points of the busbars in those regions. When performing 2D meshing on the layout, other regions are meshed normally, but this region doesn't need to be meshed; instead, the meshing information of the bottom surface of the busbars is used directly. This ensures conformal contact surfaces. Finally, the layout and busbar information are passed to the solver, which stitches the multiple volumes together and calculates the simulation parameters.

[0064] The above solution, through meticulous mesh processing, enables the contact surface to achieve true conformality, both in 2D and 3D.

[0065] This application also provides a computer program product comprising computer instructions that, when executed by a computer or processor, cause the steps of the method described above to be performed.

[0066] This application also provides a computer-readable storage medium storing a computer program that, when run on a computer or processor, causes the computer or processor to perform the steps of the method described above.

[0067] This application also provides an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor is used to execute the computer program to implement the steps of the method described above.

[0068] Specifically, such as Figure 5 As shown, the electronic device includes a processor 100, at least one communication bus 200, a user interface 300, at least one external communication interface 400, and a memory 500. The communication bus 200 is configured to enable communication between these components. The user interface 300 may include a display screen, and the external communication interface 400 may include standard wired and wireless interfaces. The memory 500 stores a computer program. The processor 100 is used to execute the stored computer program in the memory 500 using the methods described above.

[0069] The descriptions of the above computer program products, computer-readable storage media, and electronic devices are similar to those of the above method embodiments, and have similar beneficial effects. For any technical details not disclosed in the computer program products, computer-readable storage media, and electronic devices of this application, please refer to the descriptions of the method embodiments of this application for understanding.

[0070] The sequence numbers or order of description of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0071] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units can be a logical functional division, and in actual implementation, there may be other division methods. For instance, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual coupling, direct coupling, or communication connection may be through some interfaces; the indirect coupling or communication connection between units or modules may be electrical or other forms.

[0072] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0073] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0074] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. The computer program product includes one or more computer instructions. When the computer instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer, or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., digital versatile disc (DVD)), or a semiconductor medium (e.g., solid state disk (SSD)). It is worth noting that the computer-readable storage medium mentioned in the embodiments of this application can be a non-volatile storage medium; in other words, it can be a non-transient storage medium. It should be noted that the information (including but not limited to user device information, user personal information, etc.), data (including but not limited to data used for analysis, stored data, displayed data, etc.), and signals involved in the embodiments of this application are all authorized by the user or fully authorized by all parties, and the collection, use, and processing of related data must comply with the relevant laws, regulations, and standards of the relevant countries and regions. For example, the scene data of the current frame in the 3D virtual scene involved in the embodiments of this application, the client's device information, and the scene interaction information are all obtained with full authorization.

[0075] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A mesh stitching method for joint simulation of multiple plates and busbars, characterized in that, The method includes: After simulating the assembly of multiple 2D layouts of boards and 3D models of busbars in simulation software, the contact positions between the boards and busbars are obtained, and the contact position coordinates of the boards and busbars are obtained. The conformal region between the plate and the busbar is determined based on the contact position coordinates of the slats; The conformal region is partitioned according to the acquisition point, and the non-conformal region is partitioned in two dimensions. The partitioned layout and busbar information are transmitted to the solver so that the solver can stitch together multiple boards and busbars.

2. The mesh stitching method for joint simulation of multiple plates and busbars according to claim 1, characterized in that, The determination of the conformal region between the plate and the busbar based on the contact position coordinates of the slats includes: The intersecting area of ​​the slats is determined based on the coordinates of the slat contact positions. The solder and busbar are constructed into a new body and tetrahedral meshed, wherein the solder is used to fill the contact positions between boards and between boards and busbars; Calculate the grid points at the contact surface between the busbar and the plate after the tetrahedral mesh is applied, and obtain the coordinates of the grid points on the busbar. The conformal region is determined based on the intersection area of ​​the slats and the coordinates of the slat grid points.

3. The mesh stitching method for joint simulation of multiple plates and busbars according to claim 2, characterized in that, The determination of the conformal region based on the intersection region of the slats and the coordinates of the slat grid points includes: If there are no holes in the intersection area between the board and the busbar, the area where the surfaces intersect is determined based on the coordinates of the points on the board grid at the boundary and is taken as the conformal area. If there are holes in the board and no holes in the busbar, the location of the hole is determined based on the coordinates of the points on the board grid, and the external intersection area outside the hole is taken as the conformal area. If there are holes in the board at the contact point of the busbar and no holes in the busbar, the location of the hole is determined based on the coordinates of the points on the board grid, and the common area outside the hole is taken as the conformal area.

4. The mesh stitching method for joint simulation of multiple plates and busbars according to claim 1, characterized in that, The simulation assembly of the two-dimensional layout of multiple boards and the three-dimensional model of the busbars in simulation software includes: Obtain the two-dimensional layout and the three-dimensional model; Obtain the electrical connection points that need to be connected to the busbar, wherein the electrical connection points include at least one of connection points on the board and connection points on the busbar; Integrate the coordinates of the electrical connection points into the same coordinate system; Solder is applied to the electrical connection points at the locations where contact is required between the board and the busbar, as well as between the boards, to complete the assembly.

5. The mesh stitching method for joint simulation of multiple plates and busbars according to claim 4, characterized in that, Integrating the coordinates of the electrical connection points into the same coordinate system includes: Select a board as the substrate; Perform coordinate transformation on all boards and busbars relative to the base plate's coordinate system.

6. The mesh stitching method for joint simulation of multi-plate and busbar according to any one of claims 1-5, characterized in that, The contact positions between the board and the busbar include the positions where the board surface contacts the busbar surface and the positions where the busbar pins are inserted into the vias of the board.

7. A method for joint simulation of multiple boards and busbars, characterized in that, The method includes: Multiple plates and busbars are stitched together using the mesh stitching method described in any one of claims 1-6; The simulation parameters are calculated using a solver.

8. An electronic device, characterized in that, The electronic device includes a memory and a processor; The memory is used to store computer programs; The processor is configured to execute the computer program to implement the steps of the method according to any one of claims 1-7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed on a computer or processor, causes the computer or processor to perform the steps of the method according to any one of claims 1-7.

10. A computer program product, characterized in that, The computer program product includes computer instructions that, when executed by a computer or processor, cause the steps of the method described in any one of claims 1-7 to be performed.

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