Composite busbar plastic dipping device and plastic dipping method

By using the suspended conveyor line and fluidized impregnation mechanism of the composite busbar dip coating device, exposed areas are automatically shielded and powder agglomerates are broken up, solving the problems of shielding and uneven powder distribution in composite busbar dip coating and improving dip coating efficiency and effect.

CN121506640APending Publication Date: 2026-02-10ZHUZHOU BOYA TECH
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Patent Information

Application Number
CN202512010462.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-29
Publication Date
2026-02-10

AI Technical Summary

Technical Problem

In the existing composite busbar dip coating process, the connecting surfaces and bolt holes need to be masked. The uneven distribution and agglomeration of powder in the fluidized bed affect the dip coating effect, resulting in a cumbersome process and low efficiency.

Method used

The composite busbar dip coating device, which employs a suspended conveyor line, a preheating mechanism, a fluidized impregnation mechanism, a plasticizing mechanism, and an air-cooling channel, utilizes a hanging structure to automatically shield exposed positions. The fluidized impregnation mechanism disperses the powder through compressed air input in the air chamber and a pulse backflushing structure, ensuring uniform powder fluidization.

Benefits of technology

It achieves uniform powder fluidization without the need for masking liquid or masking sleeve, improves dip coating efficiency, avoids powder agglomeration, and ensures the dip coating effect.

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Abstract

The invention discloses a composite busbar plastic dipping device and a plastic dipping method. The composite busbar plastic dipping device comprises a suspension conveying line, a preheating mechanism, a fluidization dipping mechanism, a plasticizing mechanism and an air cooling channel, the lifting appliance structure is used for installing the busbar, after the busbar is installed, the first shielding block and the second shielding block automatically shield the positions, needing to be exposed, of the busbar, so that shielding liquid or a shielding sleeve does not need to be adopted for shielding the positions, after plastic dipping is completed, the busbar can be directly taken down, and the overall efficiency is greatly improved; according to the fluidization dipping mechanism, compressed air is input through a plurality of air chambers, so that the input quantity of different positions can be independently adjusted, and a sensor on the top or the side wall of a fluidized bed is matched, so that uniform fluidization of the whole powder is ensured; according to the plastic dipping device, the pulse back-blowing structure is additionally arranged, the pulse back-blowing structure adopts a regular pulse back-blowing mode to scatter agglomerated powder, and an inclined blowing head is additionally arranged at the position of the side wall prone to contamination, so that the powder agglomeration phenomenon is avoided, and the plastic dipping effect is guaranteed.
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