Small-size series capacitor and preparation method thereof

Abstract

The invention discloses a small-size series capacitor and a preparation method thereof. The series capacitor comprises a connecting sheet, two capacitor chips, a solder layer, a ceramic body and two adhesive layers, the two capacitor chips are arranged at an interval and are connected with the connecting sheet; each capacitor chip comprises a capacitor chip body and two end electrodes arranged at the two ends of the capacitor chip body; the solder layer is arranged on the surface, opposite to the capacitor chip, of the connecting sheet and is connected with the opposite end electrode; the ceramic body is arranged between the two capacitor chips, the size of the ceramic body is the same as that of the capacitor chips, and a first end, opposite to the connecting sheet, of the ceramic body is provided with a connecting electrode; the connecting electrode is connected with the connecting sheet through the solder layer; the two adhesive layers are respectively arranged between the ceramic body and the adjacent capacitor chips; the ceramic body is arranged between the two capacitor chips, so that the strength of the whole structure of the product can be enhanced, the reliability of the product can be improved, and an electrical isolation effect can also be realized; the method is suitable for some key control systems so as to improve the reliability and stability of the whole system.

Description

Technical Field

[0001] This invention belongs to the field of capacitor manufacturing, specifically relating to a small-size series capacitor and its manufacturing method. Background Technology

[0002] With the development of technology, fields such as power supply, industry, automotive, military, and aerospace are placing increasingly higher demands on the miniaturization of components. In some critical control systems, redundancy design is required to improve system reliability. By designing a series structure, if one chip is short-circuited, another chip can still function normally, and the entire system can still operate. Currently, there are no 0402-sized packaged series capacitors on the market. This capacitor achieves a small package size, with dimensions of only 1.6mm × 0.5mm × 1.2mm (length × width × height). The small size makes the fabrication of series capacitors difficult and complicates reliability, requiring further improvement. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a small-size series capacitor and its preparation method.

[0004] The present invention adopts the following technical solution: A small-sized series capacitor includes a connecting piece, two capacitor chips, a solder layer, a ceramic body, and two adhesive layers; Two capacitor chips are arranged at intervals and connected to a connecting piece. Each capacitor chip includes a capacitor chip body and two electrodes disposed at both ends of the capacitor chip body. The solder layer is located on the opposite side of the connector and the capacitor chip, and is connected to the opposite terminal electrode; A ceramic body is disposed between two capacitor chips. Its size is the same as that of the capacitor chips. A connecting electrode is provided at its first end opposite to the connecting piece. Its second end is flush with the bottom of the two capacitor chips. The connecting electrode is connected to the connecting piece via a solder layer. Two adhesive layers are respectively placed between the ceramic body and the adjacent capacitor chip.

[0005] Furthermore, its dimensions are as follows: length × width × height is 1.6±0.2mm × 0.5±0.1mm × 1.2±0.2mm.

[0006] Furthermore, the dimensions of the capacitor chip are as follows: length × width × height is 0.5±0.1mm × 0.5±0.1mm × 1.0±0.1mm.

[0007] Furthermore, the connecting electrode includes a first external electrode layer, a second external electrode layer, and a third external electrode layer arranged sequentially from the inside to the outside, wherein the third external electrode layer is a tin-lead alloy layer.

[0008] Furthermore, the solder layer is a tin-lead alloy solder layer.

[0009] Furthermore, the first outer electrode layer is a silver electrode layer or a copper electrode layer, and the second outer electrode layer is a nickel electrode layer.

[0010] A method for fabricating a small-sized series capacitor specifically includes the following steps: Step 1: Two capacitor chips are fixed to both sides of the ceramic body with adhesive layer using a stacking fixture, and then sent into an oven to cure the adhesive layer, thus obtaining a capacitor semi-finished product. Step 2: Solder is printed on the connecting piece using a printing fixture. Then, the connected piece with the printed solder and the obtained capacitor semi-finished product are sent into the assembly fixture. After assembly by the assembly fixture, they are sent into the reflow soldering process for welding. Step 3: Place the welded product in an ultrasonic cleaning device to clean the welded product and obtain the small-sized series capacitor. The assembly fixture includes an assembly table, a limiting block, a limiting pin, and two clamping blocks. The limiting block is fixed to the assembly table by the limiting pin, and its opposite sides are provided with multiple inwardly extending limiting grooves. The two clamping blocks are spaced apart on the assembly table, opposite to the two sides of the limiting block. The opposite sides of the clamping blocks and the limiting blocks are provided with multiple clamping parts that are opposite to the multiple limiting grooves, and multiple clamping magnets that cooperate with the assembly table are provided on them. When assembling the connecting piece with the capacitor semi-finished product, the connecting piece with solder printing completed is placed in the limiting groove with the solder layer facing upwards; the placement position of the capacitor semi-finished product is adjusted so that the connecting electrode of the ceramic body faces downwards, and then it is placed vertically into the limiting groove so that the capacitor semi-finished product is supported on the connecting piece and connected to the solder layer; then the position of the clamping block is adjusted so that the clamping part on the clamping block is embedded in the corresponding limiting groove. Due to the cooperation between the clamping magnet and the assembly table, the clamping block is fixed on the assembly table, clamping and fixing the connecting piece and the capacitor semi-finished product.

[0011] Furthermore, the printing fixture includes a printing table, multiple printing magnets, a printing plate, and fixing pins. The multiple printing magnets are arranged sequentially on the printing table. The printing plate is fixed on the printing table by the fixing pins and has multiple printing holes, each of which corresponds to one of the multiple printing magnets. When printing solder on the connecting piece, the connecting piece is placed into the corresponding printing hole and is attracted and fixed by the corresponding printing magnet to ensure the printing of solder.

[0012] Furthermore, the solder layer has a thickness of 0.1 mm, the printed circuit board has a thickness of 0.2 mm, the printed hole has a depth of 0.2 mm, and the printed magnet has a thickness of 0.1 mm.

[0013] Furthermore, the stacking fixture includes a stacking platform, a mounting plate, positioning pins, and two positioning blocks. The mounting plate is fixed to the stacking platform by the positioning pins, and its opposite sides are provided with a plurality of inwardly extending positioning grooves. The two positioning blocks are spaced apart on the stacking platform, opposite to the two sides of the mounting plate. The opposite side of the positioning block and the mounting plate is provided with a positioning part that is opposite to the plurality of positioning grooves, and a plurality of positioning magnets that cooperate with the stacking platform are provided thereon. During the preparation of the capacitor semi-finished product, a capacitor chip is first placed in a positioning groove, and adhesive is applied to the opposite surface of the capacitor chip and the positioning block. Then, the ceramic body is placed in the positioning groove and connected with the adhesive. Next, adhesive is applied to the opposite surface of the ceramic body and the positioning block, and then another capacitor chip is placed in and connected with the adhesive. Finally, the positioning block is moved so that the positioning part abuts against the opposite capacitor chip. The positioning block is fixed on the stacking platform by the cooperation of the positioning magnet and the stacking platform, clamping and positioning the two capacitor chips and the ceramic body in the positioning groove.

[0014] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are as follows: The series capacitor of this application can achieve a small-size package, with dimensions of only 1.6mm × 0.5mm × 1.2mm (length × width × height), which can be applied to miniaturized integrated circuits; the series connection can improve the withstand voltage of the product, and in the series design, if one capacitor chip is short-circuited, the other capacitor chip can still work normally. This redundancy design is very suitable for some critical control systems to improve the reliability and stability of the entire system; wherein, the ceramic body placed between the two capacitor chips can enhance the strength of the entire product structure, improve the reliability of the product, and also achieve electrical isolation. Since the ceramic body only has a connecting electrode on one end opposite to the connecting piece, and the other end has no end capping layer, it has insulating properties. The series connection can only be achieved when the product is soldered onto the PCB board. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a series capacitor. Figure 2 This is a front view of a series capacitor. Figure 3 This is a side view of a series capacitor. Figure 4 This is a schematic diagram of the internal structure of a capacitor chip. Figure 5 This is a schematic diagram of the internal structure of the ceramic body; Figure 6 Schematic diagram of the stacking fixture Figure 1 ; Figure 7 Schematic diagram of the stacking fixture Figure 2 ; Figure 8 Schematic diagram of the printing fixture Figure 1 ; Figure 9 for Figure 8 Enlarged view of some of the structures in the image; Figure 10 Schematic diagram of the assembly fixture Figure 1 ; Figure 11 Schematic diagram of the assembly fixture Figure 2 ; Figure 12 This is a schematic diagram showing the current flow direction when a series capacitor is soldered onto a PCB board. In the diagram, 1. Connecting piece; 2. Capacitor chip; 3. Solder layer; 4. Ceramic body; 5. Adhesive layer; 6. Stacking fixture; 7. Printing fixture; 8. Assembly fixture; 21. Capacitor chip body; 22. Terminal electrode; 23. Dielectric layer; 24. Inner electrode; 25. Copper electrode; 26. Nickel electrode; 27. Tin-lead alloy electrode; 41. Connecting electrode; 42. First outer electrode layer; 43. Second outer electrode layer; 44. Third outer electrode layer; 61. Stacking platform; 62. Mounting plate; 63. Positioning pin; 64. Positioning block; 65. Positioning groove; 66. Positioning part; 67. Positioning magnet; 71. Printing platform; 72. Printing magnet; 73. Printing board; 74. Fixing pin; 75. Printing hole; 81. Assembly platform; 82. Limiting block; 83. Limiting pin; 84. Clamping block; 85. Limiting groove; 86. Clamping part; 87. Clamping magnet. Detailed Implementation

[0016] The present invention will be further described below through specific embodiments.

[0017] Reference Figures 1 to 3 As shown, a small-sized series capacitor includes a connecting piece 1, two capacitor chips 2, a solder layer 3, a ceramic body 4, and two adhesive layers 5; specifically, the dimensions of the small-sized series capacitor are as follows: length (E) × width (D) × height (H) is 1.6±0.2mm × 0.5±0.1mm × 1.2±0.2mm.

[0018] Connector 1 is made of 4J42 Kovar alloy material. 4J42 Kovar alloy material is a series of constant expansion alloys that can match soft glass and ceramics with different expansion coefficients within a given temperature range by adjusting the nickel content. Its expansion coefficient and Curie point increase with increasing nickel content. This alloy is widely used in the sealing structure of electronic products. Electrical connection with two capacitor chips 2 is achieved through connector 1.

[0019] Two capacitor chips 2 are arranged at intervals and connected to the connecting piece 1. Each capacitor chip 2 includes a capacitor chip body 21 and two end electrodes 22 disposed at both ends of the capacitor chip body 21. Specifically, the end electrodes 22 include a copper electrode 25, a nickel electrode 26, and a tin-lead alloy electrode 27 arranged sequentially from the inside to the outside. Furthermore, the dimensions of the capacitor chip 2 are as follows: length × width × height is 0.5±0.1mm × 0.5±0.1mm × 1.0±0.1mm. In this dimension-limited manner, the arrangement of the capacitor chip 2 is the same as its arrangement in a series capacitor. The voltage of a single capacitor chip 2 is 6V and the capacitance is 107uF. When two capacitor chips 2 are connected in series, the withstand voltage can reach 12V.

[0020] Reference Figure 4 As shown, the capacitor chip body 21 is formed by stacking and firing dielectric layers in sequence. Specifically, the dielectric layer includes a dielectric layer 23 and an internal electrode 24 printed on the dielectric layer 23. The material of the internal electrode 24 is palladium silver metal, and the material of the dielectric layer 23 is barium titanate ceramic.

[0021] Solder layer 3 is disposed on the opposite side of connector 1 and capacitor chip 2 and connected to the opposite terminal electrode 22; wherein, the solder is tin-lead alloy solder, and the high-temperature solder composition is Sn10Pb90. The melting point of this solder after welding is 280℃, which can prevent the risk of connector 1 and capacitor chip 2 falling apart during customer use.

[0022] Reference Figure 5 As shown, a ceramic body 4 is disposed between two capacitor chips 2, and its size is the same as that of the capacitor chips 2. A connecting electrode 41 is disposed at the first end opposite to the connecting piece 1, and its second end is flush with the bottom of the two capacitor chips 2. Specifically, the connecting electrode 41 is connected to the connecting piece 1 via a solder layer 3, and includes a first external electrode layer 42, a second external electrode layer 43, and a third external electrode layer 44 disposed sequentially from the inside to the outside. The first external electrode layer 42 is a silver electrode layer or a copper electrode layer, the second external electrode layer 43 is a nickel electrode layer, and the third external electrode layer 44 is a tin-lead alloy layer.

[0023] Two adhesive layers 5 are respectively disposed between the ceramic body 4 and the adjacent capacitor chip 2; specifically, the adhesive layer 5 is made of red glue, which is a single-component heat-curing epoxy resin, suitable for various chip components, and can obtain stable bonding strength; the two capacitor chips 2 are bonded to the ceramic body 4 through the adhesive layer 5, thereby improving the overall structural strength of the series capacitor.

[0024] In the fabrication of small-sized series capacitors, the connection between the two capacitor chips 2 and the ceramic body 4 is first completed by the stacking fixture 6, then the solder layer 3 on the connecting piece 1 is printed by the printing fixture 7, and then the connecting piece 1, the two capacitor chips 2, and the ceramic body 4 are assembled and reflow soldered by the assembly fixture 8.

[0025] Reference Figures 6 to 7 As shown, the stacking fixture 6 includes a stacking platform 61, a mounting plate 62, positioning pins 63, and two positioning blocks 64. The mounting plate 62 is fixed to the stacking platform 61 by the positioning pins 63, and its opposite sides are provided with a plurality of inwardly extending positioning grooves 65. The two positioning blocks 64 are fixed to the stacking platform 61 at intervals, opposite to the two sides of the mounting plate 62. The opposite side of the positioning blocks 64 and the mounting plate 62 is provided with positioning parts 66 that are opposite to the plurality of positioning grooves 65, and a plurality of positioning magnets 67 are provided on them that magnetically engage with the stacking platform 61. When the two capacitor chips 2 and the ceramic body 4 are stacked and welded, the positioning parts 66 can abut against the opposite capacitor chips 2 to clamp and position the two capacitor chips 2 and the ceramic body 4.

[0026] Reference Figures 8 to 9 As shown, the printing fixture 7 includes a printing table 71, multiple printing magnets 72, a printing plate 73, and fixing pins 74. The multiple printing magnets 72 are arranged sequentially on the printing table 71. The printing plate 73 is fixed to the printing table 71 by the fixing pins 74 and has multiple printing holes 75, which correspond one-to-one with the multiple printing magnets 72. Specifically, the thickness of the solder layer 3 is 0.1 mm, the thickness of the printing plate 73 is 0.2 mm, the depth of the printing holes 75 is 0.2 mm, and the thickness of the printing magnets 72 is 0.1 mm. By limiting the depth of the printing holes 75, the thickness of the printing plate 73, and the thickness of the printing magnets 72, it is ensured that the solder layer 3 of accurate thickness can be printed on the connecting piece 1, so as to ensure that the size of the prepared series capacitor meets the required environmental requirements.

[0027] Reference Figures 10 to 11 As shown, the assembly fixture 8 includes an assembly table 81, a limiting block 82, a limiting pin 83, and two clamping blocks 84. The limiting block 82 is fixed to the assembly table 81 by the limiting pin 83, and its two opposite sides are provided with a plurality of inwardly extending limiting grooves 85. The two clamping blocks 84 are fixed to the assembly table 81 at intervals, opposite to the two sides of the limiting block 82. The opposite surfaces of the clamping blocks 84 and the limiting block 82 are provided with a plurality of clamping parts 86 that are opposite to the plurality of limiting grooves 85, and a plurality of clamping magnets 87 that are magnetically attracted to the assembly table 81 are provided on them. When the capacitor semi-finished product is connected to the connecting piece 1, the clamping parts 86 will be embedded in the relative limiting grooves 85 to clamp and fix the capacitor semi-finished product and the connecting piece 1.

[0028] Its preparation method specifically includes the following steps: Step 1: Using the stacking fixture 6, two capacitor chips 2 are fixed to both sides of the ceramic body 4 with adhesive layer 5, and then placed in an oven at 150°C for 10 minutes to cure the adhesive layer 5, resulting in a capacitor semi-finished product. When stacking the two capacitor chips 2 and the ceramic body 4, first place one capacitor chip 2 in the positioning groove 65, apply adhesive to the opposite surface of the capacitor chip 2 and the positioning block 64, and then place the ceramic body 4 into the positioning groove 65 and connect it with the adhesive. Then apply adhesive to the opposite surface of the ceramic body 4 and the positioning block 64, and then place the other capacitor chip and connect it with the adhesive. Finally, move the positioning block 64 so that the positioning part 66 abuts against the opposite capacitor chip 2, and fix the positioning block 64 on the stacking table 61 through the cooperation of the positioning magnet 67 and the stacking table 61, clamping and positioning the two capacitor chips 2 and the ceramic body 4 in the positioning groove 65. Step 2: Solder is printed on the connecting piece 1 by the printing fixture 7. When the connecting piece 1 is printed with solder, the printing plate 73 is fixed on the printing table 71 by the fixing pin 74. The connecting piece 1 is placed into the corresponding printing hole 75 and is attracted and fixed by the corresponding printing magnet 72. Then, solder is poured into the printing plate 73 and the solder is slowly scraped by the scraper so that the solder fills the entire printing hole 75. Then the printing plate 73 is removed to complete the printing of solder on the connecting piece 1. Step 3: The solder-printed connector 1 and the obtained capacitor semi-finished product are fed into the assembly fixture 8. After assembly by the assembly fixture 8, they are sent to the reflow soldering machine for welding. When assembling the connector 1 and the capacitor semi-finished product, the solder-printed connector 1 is placed in the limiting groove 85 with the solder layer 3 facing upward. The placement position of the capacitor semi-finished product is adjusted so that the connecting electrode 41 of the ceramic body 4 faces downward, and then it is placed vertically into the limiting groove 85 so that the capacitor semi-finished product is supported on the connector 1 and connected to the solder layer 3. Then the position of the clamping block 84 is adjusted so that the clamping part 86 on the clamping block 84 is embedded in the corresponding limiting groove 85. Due to the cooperation between the clamping magnet 87 and the assembly table 81, the clamping block 84 is fixed on the assembly table 81, clamping and fixing the connector 1 and the capacitor semi-finished product. Step 4: Place the welded product in an ultrasonic cleaning device and ultrasonically clean it for 30 minutes with alcohol and xylene solvent to obtain a small-sized series capacitor.

[0029] The series capacitor of this application can achieve a small package size, with dimensions of only 1.6mm × 0.5mm × 1.2mm (length × width × height), making it suitable for use in miniaturized integrated circuits. The series connection improves the voltage withstand capability, and in this design, if one capacitor chip 2 is short-circuited, the other capacitor chip 2 can still function normally. This redundancy design is highly suitable for critical control systems to improve the overall system reliability and stability. The ceramic body 4 placed between the two capacitor chips 2 enhances the overall structural strength and reliability of the product, while also providing electrical isolation. Since the ceramic body 4 only has a connecting electrode 41 at the end opposite to the connecting piece 1, and no end capping layer at the other end, it exhibits insulating properties. The series connection can only be achieved when the product is soldered onto a PCB board.

[0030] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A small-sized series capacitor, characterized in that: It includes a connector, two capacitor chips, a solder layer, a ceramic body, and two adhesive layers; Two capacitor chips are arranged at intervals and connected to a connecting piece. Each capacitor chip includes a capacitor chip body and two electrodes disposed at both ends of the capacitor chip body. The solder layer is located on the opposite side of the connector and the capacitor chip, and is connected to the opposite terminal electrode; A ceramic body is disposed between two capacitor chips. Its size is the same as that of the capacitor chips. A connecting electrode is provided at its first end opposite to the connecting piece. Its second end is flush with the bottom of the two capacitor chips. The connecting electrode is connected to the connecting piece via a solder layer. Two adhesive layers are respectively placed between the ceramic body and the adjacent capacitor chip.

2. A small-size series capacitor according to claim 1, characterized in that: Its dimensions are as follows: length × width × height is 1.6±0.2mm × 0.5±0.1mm × 1.2±0.2mm.

3. A small-size series capacitor according to claim 2, characterized in that: The dimensions of the capacitor chip are as follows: length × width × height is 0.5±0.1mm × 0.5±0.1mm × 1.0±0.1mm.

4. A small-size series capacitor according to claim 1, characterized in that: The connecting electrode includes a first external electrode layer, a second external electrode layer and a third external electrode layer arranged sequentially from the inside to the outside, wherein the third external electrode layer is a tin-lead alloy layer.

5. A small-size series capacitor according to claim 3, characterized in that: The solder layer is a tin-lead alloy solder layer.

6. A small-size series capacitor according to claim 3, characterized in that: The first external electrode layer is a silver electrode layer or a copper electrode layer, and the second external electrode layer is a nickel electrode layer.

7. The method for fabricating a small-size series capacitor according to claim 1, characterized in that: Specifically, the steps include the following: Step 1: Two capacitor chips are fixed to both sides of the ceramic body with adhesive layer using a stacking fixture, and then sent into an oven to cure the adhesive layer, thus obtaining a capacitor semi-finished product. Step 2: Solder is printed on the connecting piece using a printing fixture. Then, the connected piece with the printed solder and the obtained capacitor semi-finished product are sent into the assembly fixture. After assembly by the assembly fixture, they are sent into the reflow soldering process for welding. Step 3: Place the welded product in an ultrasonic cleaning device to clean the welded product and obtain the small-sized series capacitor. The assembly fixture includes an assembly table, a limiting block, a limiting pin, and two clamping blocks. The limiting block is fixed to the assembly table by the limiting pin, and its opposite sides are provided with multiple inwardly extending limiting grooves. The two clamping blocks are spaced apart on the assembly table, opposite to the two sides of the limiting block. The opposite sides of the clamping blocks and the limiting blocks are provided with multiple clamping parts that are opposite to the multiple limiting grooves, and multiple clamping magnets that cooperate with the assembly table are provided on them. When assembling the connecting piece with the capacitor semi-finished product, the connecting piece with solder printing completed is placed in the limiting groove with the solder layer facing upwards; the placement position of the capacitor semi-finished product is adjusted so that the connecting electrode of the ceramic body faces downwards, and then it is placed vertically into the limiting groove so that the capacitor semi-finished product is supported on the connecting piece and connected to the solder layer; then the position of the clamping block is adjusted so that the clamping part on the clamping block is embedded in the corresponding limiting groove. Due to the cooperation between the clamping magnet and the assembly table, the clamping block is fixed on the assembly table, clamping and fixing the connecting piece and the capacitor semi-finished product.

8. The method for fabricating a small-size series capacitor according to claim 7, characterized in that: The printing fixture includes a printing table, multiple printing magnets, a printing plate, and fixing pins. The multiple printing magnets are arranged sequentially on the printing table. The printing plate is fixed on the printing table by the fixing pins and has multiple printing holes, which correspond one-to-one with the multiple printing magnets. When printing solder on the connecting piece, the connecting piece is placed into the corresponding printing hole and is attracted and fixed by the corresponding printing magnet to ensure the printing of solder.

9. The method for fabricating a small-size series capacitor according to claim 8, characterized in that: The solder layer has a thickness of 0.1 mm, the printed circuit board has a thickness of 0.2 mm, the printed hole has a depth of 0.2 mm, and the printed magnet has a thickness of 0.1 mm.

10. A method for fabricating a small-size series capacitor according to claim 7, characterized in that: The stacking fixture includes a stacking platform, a mounting plate, positioning pins, and two positioning blocks. The mounting plate is fixed to the stacking platform by the positioning pins, and its opposite sides are provided with a plurality of inwardly extending positioning grooves. The two positioning blocks are provided at intervals on the stacking platform, opposite to the two sides of the mounting plate. The opposite side of the positioning block and the mounting plate is provided with a positioning part that is opposite to the plurality of positioning grooves, and a plurality of positioning magnets that cooperate with the stacking platform are provided thereon. During the preparation of the capacitor semi-finished product, a capacitor chip is first placed in a positioning groove, and adhesive is applied to the opposite surface of the capacitor chip and the positioning block. Then, the ceramic body is placed in the positioning groove and connected with the adhesive. Next, adhesive is applied to the opposite surface of the ceramic body and the positioning block, and then another capacitor chip is placed in and connected with the adhesive. Finally, the positioning block is moved so that the positioning part abuts against the opposite capacitor chip. The positioning block is fixed on the stacking platform by the cooperation of the positioning magnet and the stacking platform, clamping and positioning the two capacitor chips and the ceramic body in the positioning groove.

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