A miniaturized high-density high-heat-consumption phased array antenna structure

Abstract

This invention discloses a miniaturized, high-density, high-heat-dissipation phased array antenna structure, belonging to the field of phased array antenna technology. From top to bottom, it includes an antenna array, an amplifier assembly, a relay (TR) assembly, and a power supply and control assembly. One end of multiple RF connectors passes through the amplifier assembly and plugs into the TR assembly; the other end of the RF connectors plugs into the antenna array. The TR assembly has connector sockets corresponding to the RF connectors, and these connector sockets adopt a multi-in-one structure. A first airflow channel is formed between the amplifier assembly and the TR assembly through heat sink fins, and a second airflow channel is formed between the TR assembly and the power supply and control assembly through heat sink fins. A shared fan assembly is located on one side of the first and second airflow channels. This invention solves the problems of high-density connector insertion and removal, and also solves the heat dissipation problem of high-density, high-heat-dissipation stacked structures.

Description

Technical Field

[0001] This invention belongs to the field of phased array antenna technology, and in particular relates to a miniaturized, high-density, high-heat-dissipation phased array antenna structure. Background Technology

[0002] With the rapid development of phased array technology in China, the scale of phased arrays is increasing, and the number of channels is also growing. The channel spacing of phased array antennas is gradually decreasing, the structure is becoming more compact, and heat dissipation is becoming more concentrated. The quality of their structural and thermal design directly affects the performance of phased array antennas. Due to the needs of certain projects or missions, phased array antennas, while limited in size and weight, often also require high-density integration of TR components, which further increases the difficulty of structural interconnection.

[0003] To address the interconnection issue between the antenna array and the TR (Transmission Unit) components in this type of phased array antenna, the current conventional design method involves using SSMP-KK connectors for mating and interlocking within the overall design. The number of SSMP-KK connectors can range from dozens to hundreds. However, this design often results in misalignment of the connectors, difficulty in inserting and removing the SSMP-KK connectors, and a high rate of SSMP-KK failures per insertion or removal, with connectors frequently failing before reaching their lifespan. Furthermore, this approach increases the overall size and weight of the device, as well as subsequent costs.

[0004] As phased array antennas develop towards higher integration, there is a need for a miniaturized, high-density, and high-heat-dissipation phased array antenna structure. Summary of the Invention

[0005] The purpose of this invention is to provide a miniaturized, high-density, high-heat-dissipation phased array antenna structure to solve the problems existing in the background art.

[0006] The objective of this invention is achieved through the following technical solution:

[0007] A miniaturized, high-density, high-heat-dissipation phased array antenna structure includes, from top to bottom, an antenna array, an amplifier assembly, a TR assembly, a power supply and control assembly, with one end of multiple RF connectors passing through the amplifier assembly and plugging into the TR assembly, and the other end of the RF connectors plugging into the antenna array. The TR assembly has a connector socket corresponding to the position of the RF connector, and the connector socket adopts a multi-in-one structure.

[0008] The amplifier assembly and the TR assembly form a first airflow channel through heat sink fins, and the TR assembly and the power supply and control assembly form a second airflow channel through heat sink fins. A set of shared fan assemblies is provided on one side of the first airflow channel and the second airflow channel.

[0009] Furthermore, the amplifier assembly is provided with guide holes corresponding to the position of the RF connector, and multiple sets of guide holes are arranged in a horizontal array. A set of multiple horizontal guide holes is arranged along the direction of the air duct, and a through air duct is formed between two adjacent rows of RF connectors.

[0010] Furthermore, a set of waterproof sealing grooves is provided outside a row of multiple horizontal guide holes.

[0011] Furthermore, the antenna array adopts a segmented structure, and the segments of the antenna array are connected to the radio frequency connector to form a complete antenna array.

[0012] Furthermore, the bottom surface of the amplifier assembly is provided with short heat dissipation fins located between two rows of horizontal guide holes.

[0013] Furthermore, a positioning pin and positioning hole structure are provided between the antenna array and the amplifier assembly, and the amplifier assembly and the TR assembly, as well as the TR assembly and the power supply and control assembly, are connected to each other by screws.

[0014] Furthermore, the RF connector is SSMP-KK, and the connector socket is SSMP-JWHD.

[0015] The beneficial effects of this invention are:

[0016] 1) By centrally connecting hundreds of RF connectors onto a single TR component, the high-density integration requirement of the TR component is ensured, and it is convenient to interconnect with the amplification component through the RF connector, thereby realizing the integration and miniaturization of the phased array.

[0017] 2) By designing guide holes, multi-functional connector sockets, and a modular antenna array structure, the RF connectors are easily plugged in and fixed, reducing alignment requirements, improving assembly efficiency, lowering labor costs, and avoiding loose connections and incomplete assembly that may occur during manual assembly. This ensures reliable connection. It also extends the lifespan of the connectors and prevents damage to components due to incorrect plugging or unplugging.

[0018] 3) The three-layer heat source and two-channel structure can dissipate heat from the three layers of heat sources through a set of fan components. While ensuring heat dissipation, the number of fan components is reduced and the volume is reduced, making it suitable for miniaturizing the phased array antenna structure. Attached Figure Description

[0019] Figure 1 This is an exploded view of a miniaturized, high-density, high-heat-dissipation phased array antenna structure according to the present invention.

[0020] Figure 2 This is a schematic diagram of the overall structure of a miniaturized, high-density, high-heat-dissipation phased array antenna according to the present invention.

[0021] Figure 3 This is a schematic diagram of the guide hole arrangement of the present invention;

[0022] Figure 4 This is a schematic diagram of the four-in-one connector socket structure in this invention;

[0023] Figure 5 This is a schematic diagram of the first and second air ducts in this invention;

[0024] In the diagram, 1-antenna array, 2-amplifier assembly, 3-TR assembly, 4-power supply and control assembly, 5-RF connector, 6-fan assembly, 7-guide hole, 8-waterproof sealing groove, 9-first air duct, 10-second air duct. Detailed Implementation

[0025] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] See Figures 1-5 The present invention provides a technical solution:

[0027] like Figure 1 and Figure 2 As shown, a miniaturized, high-density, high-heat-dissipation phased array antenna structure includes, from top to bottom, an antenna array 1, an amplifier assembly 2, a TR assembly 3, and a power supply and control assembly 4. The amplifier assembly 2 and the TR assembly 3, as well as the TR assembly 3 and the power supply and control assembly 4, are all connected and fixed to the outside of the antenna array 1 and the power supply and control assembly 4 by screws.

[0028] The amplifier assembly 2 has guide holes 7. One end of multiple sets of RF connectors 5 passes through the guide holes 7 on the amplifier assembly 2 and is inserted into the TR assembly 3. The portion of the RF connectors 5 located above the amplifier assembly 2 is inserted into the antenna array 1. Preferably, the RF connectors 5 are SSMP-KK, and the connector sockets are SSMP-JWHD.

[0029] Among them, such as Figure 3 As shown, the amplifier assembly 2 is provided with guide holes 7 at the position corresponding to the RF connector 5. Multiple sets of guide holes 7 are arranged in a horizontal array. By setting multiple rows of horizontal guide holes 7, several RF connectors 5 can be plugged in, and hundreds of RF connectors 5 can be plugged into one TR assembly 3.

[0030] By setting guide holes 7, the RF connector 5 and guide holes 7 can be matched one-to-one, so there is no need for manual alignment. Just place it in the corresponding hole and press down to insert it into the connector socket. This improves assembly efficiency, reduces labor costs, and avoids loosening or incomplete assembly that may occur during manual assembly, thus ensuring connection reliability.

[0031] TR component 3 has a connector socket at the position corresponding to RF connector 5, such as Figure 4 As shown, the connector socket adopts a four-in-one structure. A set of connector sockets has socket holes for inserting four RF connectors 5. The multi-in-one structure can improve the positioning effect of RF connector 5 insertion. At the same time, the multi-in-one connector socket can facilitate installation and improve installation efficiency. Similarly, the RF connector 5 can also be set as a multi-in-one structure to improve insertion efficiency and reduce alignment requirements.

[0032] Furthermore, such as Figure 1 As shown, the antenna array 1 adopts a segmented structure. The segments of the antenna array 1 are connected to the RF connector 5 to form a complete antenna array 1. The segmented structure of the antenna array 1 can reduce the alignment requirements and reduce the positioning accuracy of the whole installation.

[0033] Furthermore, a positioning pin and positioning hole structure are provided between the antenna array 1 and the amplifier assembly 2, which can improve the insertion accuracy of the antenna array 1.

[0034] Furthermore, such as Figure 3 As shown, a row of multiple horizontal guide holes 7 are provided in the waterproof sealing groove 8.

[0035] By setting a waterproof sealing groove 8, sealing components such as sealing rubber can be installed inside the groove. After the phased array antenna structure is installed as a whole, it can achieve a waterproof sealing effect on the insertion position of the RF connector 5.

[0036] like Figure 2 and Figure 5 As shown, the phased array antenna structure of this scheme integrates a high-density TR component 3 within a very small volume. The amplifier component 2, TR component 3, and power supply and control component 4 are three layers of heat sources. The heat dissipation of TR component 3 is approximately 760W, that of amplifier component 2 is approximately 550W, and that of power supply and control component 4 is approximately 500W.

[0037] With a sandwich arrangement, a first air duct 9 is formed between the amplifier component 2 and the TR component 3 through heat dissipation fins, and a second air duct 10 is formed between the TR component 3 and the power supply and control component 4 through heat dissipation fins. At the same time, the first air duct 9 and the second air duct 10 share a set of fan components 6 on one side. The three heat sources can be cooled by a set of fan components 6. While ensuring heat dissipation, the number of fan components 6 is reduced, the volume is reduced, and it is suitable for miniaturizing the phased array antenna structure.

[0038] At the same time, such as Figure 3 As shown, a set of multiple horizontal guide holes 7 are arranged along the direction of the air duct, and a through air duct is formed between two adjacent rows of RF connectors 5, which improves the ventilation effect between the amplifier assembly 2 and the TR assembly 3 and avoids heat accumulation caused by the dense connection of the RF connectors 5.

[0039] At the same time, such as Figure 5 As shown, the bottom surface of the amplifier assembly has short heat dissipation fins located between two rows of horizontal guide holes. These short heat dissipation fins conduct heat between the adjacent rows of RF connectors.

[0040] In the transmit state (where the antenna assembly has the highest heat dissipation): the highest temperature at the bottom of the amplifier assembly 2 heat sink is 86.3℃. Considering the chip thermal resistance (JC) index of 11.4℃ / W, the heat dissipation of the bidirectional amplifier chip is 1W, and the highest operating temperature of the chip node is 86.3℃ + 11.4℃ / W × 1W = 97.7℃. The node temperature is required to be less than 150℃ when the chip is working, and the simulated junction temperature is lower than the chip's allowable junction temperature.

[0041] In the receiving state (TR component has the highest heat dissipation): the highest temperature at the bottom of the heat sink of TR component 3 is 89.4℃. Considering the chip thermal resistance (JC) index of 11.4℃ / W, the heat dissipation of the bidirectional amplifier chip is 1.12W, and the highest operating temperature of the chip node is 89.4℃ + 11.4℃ / W × 1W = 102.2℃. The node temperature is required to be less than 175℃ when the chip is working, and the simulated junction temperature is lower than the chip's allowable junction temperature.

[0042] Therefore, the two-channel heat dissipation structure of this solution can ensure heat dissipation effect while maintaining a compact structure and small size.

[0043] The installation process of the phased array antenna structure in this scheme is as follows:

[0044] 1. First, install the internal components of TR assembly 3, including the connector socket; then turn amplifier assembly 2 over and tighten TR assembly 3 into the corresponding screw holes on amplifier assembly 2 with screws.

[0045] 2. Next, turn the amplifier assembly 2 over and place it upright. Insert the RF connector 5 into the corresponding guide hole 7 of the amplifier assembly 2 and press it down to insert it into the connector socket of the TR assembly 3.

[0046] 3. Next, align the antenna array 1 downwards with the positioning pin hole on the amplifier assembly 2, press down, install the antenna array 1 with the RF connector 5, and then tighten it with screws. The amplifier assembly 2 and the TR assembly 3 are interconnected through the RF connector 5.

[0047] 4. Finally, securely connect the lower part of the TR component 3 to the power supply and control component 4, and simultaneously install the fan component 6. The above description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related field techniques or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A miniaturized, high-density, high-heat-dissipation phased array antenna structure, characterized in that: From top to bottom, the components include an antenna array (1), an amplifier assembly (2), a TR assembly (3), and a power supply and control assembly (4). One end of multiple RF connectors (5) passes through the amplifier assembly (2) and is inserted into the TR assembly (3). The other end of the RF connectors (5) is inserted into the antenna array (1). The TR assembly (3) is provided with a connector socket corresponding to the position of the RF connectors (5). The connector socket adopts a multi-in-one structure. The amplifier assembly (2) and the TR assembly (3) form a first air duct (9) through heat dissipation fins, and the TR assembly (3) and the power supply and control assembly (4) form a second air duct (10) through heat dissipation fins. A set of shared fan assemblies (6) is provided on one side of the first air duct (9) and the second air duct (10). The amplifier assembly (2) is provided with guide holes (7) corresponding to the position of the radio frequency connector (5). Multiple sets of guide holes (7) are arranged in a horizontal array. A set of multiple horizontal guide holes (7) are arranged along the direction of the air duct, and a through air duct is formed between two adjacent rows of radio frequency connectors (5).

2. The miniaturized, high-density, high-heat-dissipation phased array antenna structure according to claim 1, characterized in that: A set of waterproof sealing grooves (8) are provided outside a row of horizontal guide holes (7).

3. The miniaturized, high-density, high-heat-dissipation phased array antenna structure according to claim 1, characterized in that: The antenna array (1) adopts a segmented structure. The segments of the antenna array (1) are connected to the radio frequency connector (5) to form a complete antenna array (1).

4. The miniaturized, high-density, high-heat-dissipation phased array antenna structure according to claim 1, characterized in that: The amplifier assembly (2) has short heat dissipation fins on its bottom surface located between two rows of horizontal guide holes (7).

5. The miniaturized, high-density, high-heat-dissipation phased array antenna structure according to claim 1, characterized in that: The antenna array (1) and the amplifier assembly (2) are provided with a positioning pin and positioning hole structure. The amplifier assembly (2) and the TR assembly (3), and the TR assembly (3) and the power supply and control assembly (4) are connected by screws.

6. The miniaturized, high-density, high-heat-dissipation phased array antenna structure according to claim 1, characterized in that: The radio frequency connector (5) is SSMP-KK, and the connector socket is SSMP-JWHD.

Images