Cooling device, electronic device, and method for mounting cooling device

Abstract

The application provides a cooling device, an electronic device and a mounting method of the cooling device, and relates to the technical field of memory cooling, wherein the cooling device comprises a base, a liquid cooling part, the base and the liquid cooling part are used for being in contact with at least two surfaces of a part to be cooled, the base is provided with a heat conduction part, and the liquid cooling part is connected with the base through the heat conduction part. The cooling device, the electronic device and the mounting method of the cooling device provided by the application solve the problem of poor heat dissipation effect of a solid state disk in the prior art.

Description

Technical Field

[0001] This application relates to the field of memory cooling technology, and in particular to a cooling device, electronic device, and method for installing the cooling device. Background Technology

[0002] M.2 SSD (Solid State Drive) is a type of memory module widely used in servers, data centers, and high-performance computing devices. It is typically mounted on a PCB board and plugged into a connector on the PCB board.

[0003] In related technologies, fans are commonly used to cool solid-state drives (SSDs). During installation, the fan's exhaust end is directed towards the top surface of the SSD (the side facing away from the PCB); or a thermally conductive component is placed in contact with the top surface of the SSD, and then the fan cools the component.

[0004] However, the above methods for cooling solid-state drives are not very effective and cannot meet the high-efficiency cooling requirements in some scenarios. Summary of the Invention

[0005] This application provides a cooling device, an electronic device, and a method for installing the cooling device to solve the problem of poor heat dissipation of solid-state drives in related technologies.

[0006] In a first aspect, this application provides a cooling device, comprising:

[0007] Base;

[0008] A liquid cooling component, wherein the base and the liquid cooling component are used to contact at least two surfaces of the component to be cooled, the base is provided with a heat-conducting component, and the liquid cooling component is connected to the base through the heat-conducting component.

[0009] In one possible implementation, the heat-conducting component includes at least two side plates disposed on the base, the base and any two adjacent side plates forming a receiving cavity for accommodating the component to be cooled;

[0010] The liquid cooling component is located inside the receiving cavity. The liquid cooling component and the base are used to contact the two surfaces opposite to the heat dissipation component, respectively. The liquid cooling component is connected to the side plates on both sides of the receiving cavity.

[0011] In one possible implementation, the liquid cooling component is provided with a connecting assembly, which includes a fixed plate and two movable plates. The fixed plate is connected to the liquid cooling component, and the movable plates are slidably connected to the fixed plate. The two movable plates are detachably connected to the side plates on both sides of the receiving cavity.

[0012] In one possible implementation, the movable plate has a first positioning part, and the side plate has a second positioning part;

[0013] The connecting assembly further includes at least two first elastic elements, which connect the fixed plate and the movable plate. The movable plate is configured to slide relative to the fixed plate under the action of the first elastic elements, so that the first positioning part corresponds to and engages with the second positioning part.

[0014] In one possible implementation, at least two second positioning portions are provided corresponding to the same first positioning portion, and the at least two second positioning portions are distributed along the depth direction of the receiving cavity.

[0015] In one possible implementation, at least one of the liquid cooling component and the base has a thermally conductive layer on its surface for contacting the component to be cooled.

[0016] In one possible implementation, it further includes an abutment and a second elastic member. The base is provided with a mounting portion. The abutment is slidably disposed on the base and corresponds to the mounting portion. The second elastic member is disposed on the mounting portion and connects the base and the abutment.

[0017] The abutment is configured to abut against the end of the heat-dissipating component under the action of the second elastic member, thereby confining the heat-dissipating component within the receiving cavity.

[0018] In one possible implementation, at least two mounting portions are provided, and the at least two mounting portions are distributed along the length direction of the receiving cavity.

[0019] Secondly, this application provides an electronic device, including a PCB board, a heat sink, and a cooling device as described in any of the above embodiments;

[0020] The component to be cooled is mounted on the PCB board;

[0021] The base of the cooling device is mounted on the PCB board, and the liquid cooling component of the cooling device is connected to the base through the heat-conducting component of the cooling device. The base and the liquid cooling component are in contact with at least two surfaces of the component to be cooled.

[0022] Thirdly, this application provides a method for installing a cooling device, for installing the cooling device described in any of the above embodiments, comprising the following steps:

[0023] The liquid cooling component in the cooling device is mounted on the base via the heat-conducting component in the cooling device;

[0024] At least one surface of the component to be cooled is in contact with the base, and at least another surface of the component to be cooled is in contact with the liquid cooling component.

[0025] This application provides a cooling device, electronic device, and installation method for the cooling device. The cooling device comprises: a base; and a liquid cooling component. The base and liquid cooling component are used to contact at least two surfaces of the component to be cooled. A heat-conducting component is provided on the base, and the liquid cooling component is connected to the base through the heat-conducting component. This allows the base to be mounted on a PCB board and the liquid cooling component to be connected to the base via the heat-conducting component when installing a solid-state drive (SSD). The SSD is then connected to a connector on the PCB board, with the base and liquid cooling component contacting at least two surfaces of the SSD. During operation, heat from at least one surface of the SSD corresponding to the liquid cooling component can be directly transferred to the liquid cooling component; heat from at least one surface of the SSD not corresponding to the liquid cooling component can be transferred to the liquid cooling component through the transfer path of the base and the heat-conducting component. In other words, the liquid cooling component can dissipate heat from multiple surfaces of the SSD directly and indirectly, greatly improving the SSD's heat dissipation capacity. This meets the high-efficiency heat dissipation requirements of SSDs in certain scenarios and solves the problem of poor heat dissipation performance of SSDs in related technologies. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0027] Figure 1 A schematic diagram of the mounting structure of a cooling device on a PCB board provided in an embodiment of this application;

[0028] Figure 2 for Figure 1 An exploded view of the intermediate cooling device mounted on the PCB board;

[0029] Figure 3 for Figure 2 Exploded view of the central base;

[0030] Figure 4 for Figure 2 A schematic diagram of the installation structure of the connecting components;

[0031] Figure 5 for Figure 2 A schematic diagram of the exploded structure of the heat-conducting layer on the liquid cooling component.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10-PCB board; 11-Connector;

[0034] 20-Solid State Drive;

[0035] 100 - Base; 110 - Mounting part;

[0036] 200 - Liquid-cooled components;

[0037] 300 - Heat-conducting component; 310 - Side plate; 311 - Second positioning part; 312 - Guide rib;

[0038] 400 - Reception cavity;

[0039] 500 - Connecting assembly; 510 - Fixing plate; 511 - Guide post; 512 - Limiting screw; 520 - Movable plate; 521 - First positioning part; 530 - First elastic element;

[0040] 600 - Thermal conductive layer; 610 - Thermal conductive pad; 620 - PI film;

[0041] 700 - Abutment; 710 - Extension; 720 - Protrusion;

[0042] 800 - Second elastic element.

[0043] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0044] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0045] In related technologies, M.2 SSD is a type of memory module widely used in servers, data centers, and high-performance computing devices. It is a type of solid-state drive and is typically mounted on a printed circuit board (PCB). During installation, solid-state drives are usually plugged into connectors on the PCB.

[0046] Secondly, fans are commonly used to cool solid-state drives (SSDs). During installation, the fan's exhaust end is directed towards the top surface of the SSD (the side facing away from the PCB); or a heat-conducting component is placed in contact with the top surface of the SSD, and then the fan cools the component.

[0047] However, the above-mentioned methods for cooling SSDs are not very effective and cannot meet the high-efficiency cooling requirements in some scenarios. For example, as the storage and computing power requirements of SSDs increase, efficient cooling is necessary to keep SSDs in good working order. In such cases, using a fan to cool only one side of the SSD is insufficient to achieve efficient cooling.

[0048] Based on this, embodiments of this application provide a cooling device, an electronic device, and a method for installing the cooling device. The cooling device includes: a base; and a liquid cooling component. The base and liquid cooling component are used to contact at least two surfaces of the component to be cooled. A heat-conducting component is provided on the base, and the liquid cooling component is connected to the base through the heat-conducting component. Therefore, when installing a solid-state drive (SSD), the base can be mounted on a PCB board, and the liquid cooling component can be connected to the base through the heat-conducting component. The SSD is then connected to a connector on the PCB board, with the base and liquid cooling component contacting at least two surfaces of the SSD. During operation, heat on at least one surface of the SSD corresponding to the liquid cooling component can be directly transferred to the liquid cooling component; heat on at least one surface of the SSD not corresponding to the liquid cooling component can be transferred to the liquid cooling component through the transfer path of the base and the heat-conducting component. In other words, the liquid cooling component can dissipate heat from multiple surfaces of the SSD directly and indirectly, greatly improving the SSD's heat dissipation capacity. This satisfies the high-efficiency heat dissipation requirements of SSDs in some scenarios and solves the problem of poor heat dissipation performance of SSDs in related technologies.

[0049] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0050] like Figure 1 and Figure 2 As shown in the embodiment of this application, a cooling device includes:

[0051] Base 100, base 100 is used to be mounted on PCB board 10;

[0052] The liquid cooling component 200 and the base 100 are used to contact at least two surfaces of the component to be cooled. The base 100 is provided with a heat-conducting component 300, and the liquid cooling component 200 is connected to the base 100 through the heat-conducting component 300.

[0053] The component to be cooled can be a solid-state drive 20 (such as an M.2 SSD), a hard disk drive, or other electronic devices requiring heat dissipation. In this embodiment, the solid-state drive 20 is used as an example. It should be noted that the PCB board 10 has a connector 11 adapted to the solid-state drive 20. During installation, the end of the solid-state drive 20 with the interface (usually located at the length end of the solid-state drive 20) must be inserted into the connector 11.

[0054] In this embodiment, the base 100 can be mounted on the PCB board by screwing, bonding, or other means. For example, multiple through holes or threaded holes can be pre-drilled on the base 100 so that screws can be used to fasten the base 100 to the PCB board 10. In practice, a countersunk groove can also be provided at the upper end of the through hole or threaded hole on the base 100 so that the screw head can be inserted; for example, the upper end of the through hole or threaded hole can be provided with a taper or chamfer that matches the screw head.

[0055] A heat-conducting component 300 is provided on the base 100, and the liquid cooling component 200 is connected to the base 100 through the heat-conducting component 300. Furthermore, while the solid-state drive 20 is connected to the connector 11, the base 100 and the liquid cooling component 200 also make contact with at least two surfaces of the solid-state drive 20.

[0056] The liquid cooling component 200 is a liquid cooling plate, and its model is not limited. For example, the liquid cooling component 200 includes a plate body and a coolant channel disposed inside the plate body. An inlet pipe and an outlet pipe, communicating with the coolant channel, can be integrally formed, screwed, welded, or connected to the outside of the plate body by means of welding, screwing, or other methods. In use, coolant (such as water or refrigerant) is introduced into the coolant channel through the inlet pipe and then discharged through the outlet pipe, allowing the coolant to carry away the heat transferred to the liquid cooling component 200, thus achieving the purpose of heat dissipation for the solid-state drive 20. Alternatively, the liquid cooling component 200 can also be a cold plate from existing products.

[0057] Therefore, when installing the solid-state drive 20, the base 100 can be mounted on the PCB board 10 and the liquid cooling component 200 can be connected to the base 100 through the heat-conducting component 300. The solid-state drive 20 can be connected to the connector 11 on the PCB board 10, and the base 100 and the liquid cooling component 200 can contact at least two surfaces of the solid-state drive 20.

[0058] During operation, heat from at least one surface of the solid-state drive 20 corresponding to the liquid cooling component 200 can be directly transferred to the liquid cooling component 200. Heat from at least one surface of the solid-state drive 20 not corresponding to the liquid cooling component 200 can be transferred to the liquid cooling component 200 through the transfer path of the base 100 and the heat-conducting component 300. In other words, the liquid cooling component 200 can dissipate heat from multiple surfaces of the solid-state drive 20 through direct and indirect means, greatly improving the heat dissipation capacity of the solid-state drive 20. This allows it to meet the high-efficiency heat dissipation requirements of the solid-state drive 20 in certain scenarios, solving the problem of poor heat dissipation performance of the solid-state drive 20 in related technologies.

[0059] It should be noted that the base 100, liquid cooling component 200, and heat-conducting component 300 can all be made of materials such as stainless steel, copper, aluminum, alloy, or other materials with good thermal conductivity.

[0060] In some embodiments, such as Figure 2 and Figure 3 As shown, the heat-conducting component 300 includes at least two side plates 310 disposed on the base 100, and the base 100 and any adjacent side plates 310 form a receiving cavity 400, which is used to receive the component to be cooled.

[0061] The liquid cooling component 200 is located inside the receiving cavity 400. The liquid cooling component 200 and the base 100 are used to contact the two surfaces opposite to the component to be cooled, respectively. The liquid cooling component 200 is connected to the side plates 310 on both sides of the receiving cavity 400.

[0062] In this embodiment, the base 100 is horizontally mounted on the PCB board 10, and two side plates 310 are provided. The two side plates 310 are distributed on both sides of the base 100 in its width direction, so that the two side plates 310 are spaced apart, and the side plates 310 extend vertically towards the side of the base 100 away from the PCB board 10, so that the base 100 and the two side plates 310 together form a U-shaped receiving cavity 400. It should be noted that the width of the receiving cavity 400 is adapted to the width of the solid-state drive 20, and the connector 11 on the PCB board 10 is located on one side of the receiving cavity 400 in its length direction. The side plates 310 are made of materials such as stainless steel, copper, aluminum, alloy, or other materials with good thermal conductivity.

[0063] In practice, the lower end of the side plate 310 can be connected to the side surface of the base 100 by screwing, integral molding, welding or other means.

[0064] Secondly, the liquid cooling component 200 is located within the receiving cavity 400, and the liquid cooling component 200 is also connected to the side plates 310 on both sides of the receiving cavity 400. It can be understood that the side plates 310 not only provide a certain degree of support for the liquid cooling component 200, but also transfer heat from the base 100 to the liquid cooling component 200.

[0065] During installation, first mount the base 100 onto the PCB board 10. Then, horizontally place the solid-state drive 20 into the receiving cavity 400, ensuring that the lower surface of the solid-state drive 20 contacts the base 100, and connect the end of the solid-state drive 20 with the interface to the connector 11. Next, place the liquid cooling component 200 into the receiving cavity 400 and connect the liquid cooling component 200 to the side plates 310, ensuring that the liquid cooling component 200 contacts the upper surface of the solid-state drive 20.

[0066] Therefore, the heat from the upper surface of the solid-state drive 20 can be directly transferred to the liquid cooling component 200. The heat from the lower surface of the solid-state drive 20 can be transferred to the liquid cooling component 200 through the transfer path of the base 100 and the side plate 310. This greatly improves the heat dissipation capacity of the solid-state drive 20, so as to meet the high-efficiency heat dissipation requirements of the solid-state drive 20 in some scenarios.

[0067] It should be noted that, in order to ensure the stability of heat transfer between the side plate 310 and the liquid cooling component 200, the width of the liquid cooling component 200 can be reasonably set so that the width of the liquid cooling component 200 matches the width of the receiving cavity 400. That is to say, when the liquid cooling component 200 is placed in the receiving cavity 400, the opposite two side surfaces of the liquid cooling component 200 in the width direction can be in contact with the two side plates 310.

[0068] In practice, flexible thermally conductive materials or flexible thermally conductive pads can be filled between the liquid cooling component 200 and the side plate 310 to reduce contact thermal resistance, such as silicon-based thermally conductive materials or graphite-based thermally conductive materials.

[0069] In other embodiments, the side surface of the solid-state drive 20 may also be in contact with the base 100 or the liquid cooling component 200 to dissipate heat from more surfaces. Furthermore, the number of side plates 310 in the heat-conducting component 300 can be set according to actual needs, such as one, three, or other numbers, without limitation.

[0070] In some embodiments, such as Figure 2 , Figure 3 and Figure 4 As shown, a connecting assembly 500 is provided on the liquid cooling component 200. The connecting assembly 500 includes a fixed plate 510 and two movable plates 520. The fixed plate 510 is connected to the liquid cooling component 200, and the movable plates 520 are slidably connected to the fixed plate 510. The two movable plates 520 are detachably connected to the side plates 310 on both sides of the receiving cavity 400.

[0071] In this embodiment, the fixing plate 510 is vertically arranged and connected to the side of the liquid cooling component 200 facing away from the base 100. The extending direction of the fixing plate 510 is consistent with the extending direction of the liquid cooling component 200. The fixing plate 510 can be connected to the liquid cooling component 200 by welding, screwing, bonding, integral molding or other means.

[0072] Two movable plates 520 are distributed on both sides of the fixed plate 510 along the distribution direction of the two side plates 310, so that the two movable plates 520 correspond to the two side plates 310 respectively, and the extension direction of the movable plates 520 is consistent with the extension direction of the fixed plate 510. The movable plates 520 are slidably connected to the fixed plate 510, and the movable plates 520 are detachably connected to the corresponding side plates 310.

[0073] Therefore, after the liquid cooling component 200 is inserted into the receiving cavity 400, the two movable plates 520 can be slid towards the side plates 310 respectively to connect the two movable plates 520 to the side plates 310, thereby completing the fixation of the liquid cooling component 200. Secondly, when disassembling the liquid cooling component 200, the movable plates 520 can be slid in the opposite direction to separate the movable plates 520 from the side plates 310.

[0074] In some embodiments, such as Figure 3 and Figure 4 As shown, the movable plate 520 has a first positioning part 521, and the side plate 310 has a second positioning part 311;

[0075] The connecting assembly 500 also includes at least two first elastic members 530. The first elastic members 530 connect the fixed plate 510 and the movable plate 520. The movable plate 520 is configured to slide relative to the fixed plate 510 under the action of the first elastic members 530, so that the first positioning part 521 corresponds to and engages with the second positioning part 311.

[0076] In addition, at least two second positioning parts 311 are provided corresponding to the same first positioning part 521, and the at least two second positioning parts 311 are distributed along the depth direction of the receiving cavity 400.

[0077] In this embodiment, the first positioning part 521 is a prism-shaped pin, which can be fixed to the side of the movable plate 520 opposite to the fixed plate 510 by integral molding, welding or other means; the second positioning part 311 is a socket adapted to the pin. In other embodiments, the first positioning part 521 can also be a socket, and the second positioning part 311 can be a pin adapted to the socket; of course, the pin can also be other shapes.

[0078] Specifically, the movable plate 520 has two first positioning portions 521, and the side plate 310 has four second positioning portions 311, with two of the second positioning portions 311 corresponding to one of the first positioning portions 521, and the other two second positioning portions 311 corresponding to the other first positioning portion 521. The two second positioning portions 311 corresponding to the same first positioning portion 521 are positioned along the depth direction of the receiving cavity 400 (i.e.,...). Figure 3 (Z-direction of the coordinate system) spaced distribution.

[0079] The connecting assembly 500 also includes at least two first elastic elements 530, which can be springs or sheet springs. In this embodiment, the first elastic element 530 is a spring, and four first elastic elements 530 are provided corresponding to the same movable plate 520. The first elastic elements 530 are located between the fixed plate 510 and the movable plate 520, and the two ends of the first elastic elements 530 abut against the fixed plate 510 and the movable plate 520 respectively.

[0080] Meanwhile, multiple guide posts 511 can be provided on the fixed plate 510, and multiple guide holes are opened on the movable plate 520. The guide posts 511 are correspondingly inserted into the guide holes, so that the movable plate 520 can slide relative to the fixed plate 510 along the guide posts 511. Furthermore, the first elastic member 530 can be correspondingly sleeved on the guide post 511 to support the first elastic member 530 through the guide post 511, thereby improving the performance of the first elastic member 530.

[0081] Furthermore, a limiting screw 512 can be threaded onto the end of the guide post 511 away from the fixed plate 510. The limiting screw 512 is located on the side of the movable plate 520 opposite to the fixed plate 510, and the diameter of the screw head in the limiting screw 512 is larger than the diameter of the guide hole. Thus, the sliding distance of the movable plate 520 on the guide post 511 can be limited by the limiting screw 512, reducing the possibility of the movable plate 520 falling off the guide post 511.

[0082] When installing the liquid cooling component 200, first press the movable plate 520 so that both movable plates 520 slide toward the fixed plate 510 to avoid the side plate 310. Then, insert the liquid cooling component 200 into the receiving cavity 400. When the first positioning part 521 on the movable plate 520 is aligned with the second positioning part 311, release the movable plate 520 so that the first positioning part 521 is inserted into the second positioning part 311, thereby completing the fixation of the liquid cooling component 200.

[0083] It should be noted that the connecting assembly 500 on the liquid cooling component 200 can be pre-assembled in the factory, so that the liquid cooling component 200 can be installed or removed simply by pressing the movable plate 520 at the site of use. This reduces the steps of using screws to fasten the liquid cooling component 200 on site, realizing a "screwless design" and effectively improving the installation efficiency of the liquid cooling component 200 on site.

[0084] At this time, multiple second positioning parts 311 are provided corresponding to the same first positioning part 521, and the installation height of the liquid cooling component 200 can be adjusted according to the actual thickness of the solid-state drive 20, so as to be compatible with solid-state drives 20 of various sizes or other components to be cooled, and improve the adaptability of the cooling device.

[0085] In other embodiments, the first positioning part 521 and the second positioning part 311 may be configured in other quantities according to actual needs, and there is no limitation thereto. In implementation, the first positioning part 521 (prism-shaped pin) may also be tapered so as to be inserted with the second positioning part 311. Of course, the first positioning part 521 may also be configured as a wedge, so that the upper surface of the first positioning part 521 gradually slopes downward from the end near the movable plate 520 to the end away from the movable plate 520, so that when the first positioning part 521 is inserted with the second positioning part 311, the wedge-shaped first positioning part 521 can automatically reduce the gap between the liquid cooling component 200 and the solid-state drive 20, thereby improving the contact effect between the liquid cooling component 200 and the solid-state drive 20.

[0086] In some embodiments, such as Figure 3 As shown, to improve the ease with which the liquid-cooled component 200 can be inserted into the receiving cavity 400, a guide rib 312 can be provided on the side of the side plate 310 facing the liquid-cooled component 200, and the guide rib 312 extends vertically. At this time, a groove that matches the guide rib 312 is provided on the side of the liquid-cooled component 200.

[0087] Therefore, when the liquid cooling component 200 is installed, the slot on the liquid cooling component 200 can be matched with the guide rib 312 so that the liquid cooling component 200 extends into the receiving cavity 400 along the guide rib 312, thereby facilitating the alignment of the first positioning part 521 and the second positioning part 311.

[0088] In practice, a notch can be made at the upper end of the side plate 310 and at the location corresponding to the movable plate 520. This notch allows the finger to pass through during the process of pressing the movable plate 520 and inserting the liquid cooling component 200 into the receiving cavity 400, thereby reducing the possibility of obstruction during the installation of the liquid cooling component 200.

[0089] In addition, rough textures can be provided on the side of the movable plate 520 that needs to contact the fingers to increase the frictional resistance between the movable plate 520 and the fingers, making it easier to operate.

[0090] In some embodiments, such as Figure 3 and Figure 5 As shown, at least one of the liquid cooling component 200 and the base 100 has a thermally conductive layer 600 on its surface for contacting the component to be cooled.

[0091] In this embodiment, a thermally conductive layer 600 is provided on the side of the liquid cooling component 200 facing the solid-state drive 20 and on the side of the base 100 facing the solid-state drive 20. The thermally conductive layer 600 can be connected to the liquid cooling component 200 or the base 100 by adhesive, abutment, snap-fit ​​or other means.

[0092] Therefore, both the liquid cooling component 200 and the base 100 can come into contact with the solid-state drive 20 through the heat-conducting layer 600, thereby improving the heat transfer efficiency between the solid-state drive 20 and the liquid cooling component 200 and the base 100.

[0093] In implementation, the thermal conductive layer 600 may include a thermally conductive pad 610 and a PI film 620 laminated together, with the PI film 620 located on the side of the thermally conductive pad 610 facing the solid-state drive 20. The thermally conductive pad 610 may be made of a silicon-based or graphite-based thermally conductive material, etc.; the PI film is a polyimide film.

[0094] In some embodiments, such as Figure 2 and Figure 3 As shown, it also includes an abutment 700 and a second elastic member 800. A mounting part 110 is provided on the base 100. The abutment 700 is slidably disposed on the base 100 and corresponds to the mounting part 110. The second elastic member 800 is disposed on the mounting part 110 and connects the base 100 and the abutment 700.

[0095] The abutment 700 is configured to abut against the end of the heat-dissipating component under the action of the second elastic member 800, so as to confine the heat-dissipating component within the receiving cavity 400.

[0096] In this embodiment, the abutment 700 can be a strip structure, a block structure, or other shapes, and there is no limitation thereto. The abutment 700 is slidably connected to the base 100 along the length direction of the base 100, and the abutment 700 is located on the upper surface of the base 100. The abutment 700 and the connector 11 are respectively located on both sides of the receiving cavity 400 in the length direction.

[0097] Secondly, both ends of the abutment 700 in the width direction of the base 100 are engaged with the side edge of the base 100 to ensure that the abutment 700 has better stability when sliding relative to the base 100 and is not easy to fall off the base 100.

[0098] The mounting portion 110 may be a hole or groove formed on the upper surface of the base 100. The mounting portion 110 has a strip-shaped structure and extends along the sliding direction of the abutment member 700. At this time, the abutment member 700 has an extension portion 710 that extends into the mounting portion 110, allowing the extension portion 710 to slide within the mounting portion 110. The second elastic member 800 is a spring that is housed within the mounting portion 110. The extending direction of the second elastic member 800 is consistent with the sliding direction of the abutment member 700. The two ends of the second elastic member 800 are connected to the base 100 and the extension portion 710 by snap-fit, abutment, adhesive, or other means, and the second elastic member 800 is located on the side of the extension portion 710 away from the receiving cavity 400. The second elastic member 800 has an elastic effect on the extension 710 and the abutment 700, so that the abutment 700 can be kept at the end of the mounting portion 110 facing the receiving cavity 400 under the action of the second elastic member 800, or the abutment 700 has a tendency to slide towards the receiving cavity 400.

[0099] Therefore, when installing the solid-state drive 20, first slide the abutment 700 away from the receiving cavity 400, then insert the solid-state drive 20 into the receiving cavity 400, and insert one end of the solid-state drive 20 in the length direction (i.e., the end where the interface is located) into the connector 11. At this time, the solid-state drive 20 can be laid horizontally on the upper surface of the base 100. Next, release the control of the abutment 700. Under the action of the second elastic member 800, the abutment 700 can automatically slide towards the receiving cavity 400 and abut against the end of the solid-state drive 20 away from the connector 11, thereby relatively firmly confining the solid-state drive 20 within the receiving cavity 400, ensuring the stability of the solid-state drive 20 during use, and being in a better heat dissipation state.

[0100] Furthermore, such as Figure 3 As shown, at least two mounting portions 110 can be provided, and the at least two mounting portions 110 are spaced apart along the length of the receiving cavity 400. Therefore, according to the specifications of the actual solid-state drive 20, the abutment member 700 can be installed at different positions of the mounting portions 110 to secure solid-state drives 20 of different lengths, improving compatibility. At this time, the heat-conducting layer 600 on the base 100 can be adapted to the length of the solid-state drive 20, and clearance holes can also be provided in the area of ​​the heat-conducting layer 600 corresponding to the mounting portion 110.

[0101] It should be noted that, in order to facilitate the installation of the abutment 700 on the base 100, the abutment 700 can be made of plastic or other materials. This allows the abutment 700 to have a certain elastic deformation capability at both ends in the width direction of the base 100, so that the abutment 700 can be snapped onto the base 100 by pressing from top to bottom.

[0102] Secondly, if some solid-state drives 20 have a slot at the end away from the connector 11, a protrusion 720 can be provided on the abutment 700 at the position corresponding to the slot, so that when the abutment 700 abuts against the solid-state drive 20, the protrusion 720 can cooperate with the slot on the solid-state drive 20, thereby further improving the positioning effect of the solid-state drive 20.

[0103] In summary, the cooling device provided in this application embodiment allows heat from the upper surface of the solid-state drive 20 to be directly transferred to the liquid cooling component 200. Heat from the lower surface of the solid-state drive 20 can be transferred to the liquid cooling component 200 through the transfer path of the base 100 and the side plate 310. This significantly improves the heat dissipation capacity of the solid-state drive 20, enabling it to meet the high-efficiency heat dissipation requirements of the solid-state drive 20 in certain scenarios and solving the problem of poor heat dissipation performance of the solid-state drive 20 in related technologies.

[0104] An electronic device provided in this application includes a PCB board 10, a heat sink, and a cooling device from any of the above embodiments;

[0105] The heat sink is mounted on PCB board 10;

[0106] The base 100 in the cooling device is mounted on the PCB board 10. The liquid cooling component 200 in the cooling device is connected to the base 100 through the heat-conducting component 300 in the cooling device. The base 100 and the liquid cooling component 200 are in contact with at least two surfaces of the component to be cooled.

[0107] In this embodiment, a connector 11 is provided on the PCB board 10, and the component to be heat-suppressed is connected to the connector 11. The component to be heat-suppressed can be a solid-state drive 20, and the solid-state drive 20 is connected to the connector 11. Of course, the component to be heat-suppressed can also be other types of hard drives. The connector 11 can be an existing product, and its structure is not limited.

[0108] Secondly, the cooling device has been described in detail in the above embodiments, and will not be repeated here.

[0109] It should be noted that the base 100 is mounted on the PCB board 10, and the liquid cooling component 200 is connected to the base 100 through the heat-conducting component 300 in the cooling device. Specifically, the liquid cooling component 200 is connected to the side plate 310 through the connecting assembly 500, and the base 100 and the liquid cooling component 200 are in contact with the lower and upper surfaces of the solid-state drive 20, respectively.

[0110] Therefore, the heat from the upper surface of the solid-state drive 20 can be directly transferred to the liquid cooling component 200. The heat from the lower surface of the solid-state drive 20 can be transferred to the liquid cooling component 200 through the transfer path of the base 100 and the side plate 310. This greatly improves the heat dissipation capacity of the solid-state drive 20, so as to meet the high-efficiency heat dissipation requirements of the solid-state drive 20 in some scenarios, and solves the problem of poor heat dissipation performance of the solid-state drive 20 in related technologies.

[0111] This application provides an embodiment of a cooling device installation method for installing the cooling device in any of the above embodiments, comprising the following steps:

[0112] The base 100 of the cooling device is mounted on the PCB board 10. Specifically, the base 100 can be fastened to the PCB board 10 by screws.

[0113] The component to be cooled is mounted on the PCB board 10, and at least one surface of the component is in contact with the base 100. In this embodiment, the solid-state drive 20 can be connected to the connector 11 on the PCB board 10, and the solid-state drive 20 is placed on the base 100, with the lower surface of the solid-state drive 20 in contact with the upper surface of the base 100.

[0114] The liquid cooling component 200 in the cooling device is mounted on the base 100 via the heat-conducting component 300 in the cooling device, and at least one other surface of the component to be cooled is in contact with the liquid cooling component 200. In this embodiment, the liquid cooling component 200 can be fixed in the receiving cavity 400 by pressing the movable plate 520, so that the first positioning part 521 on the movable plate 520 is correspondingly inserted into the second positioning part 311 on the side plate 310, and the liquid cooling component 200 is in contact with the upper surface of the solid-state drive 20.

[0115] In some scenarios, the liquid cooling component 200 can be first locked to the uppermost second positioning part 311 in the side plate 310 to provide more installation space for the solid-state drive 20. Then, the solid-state drive 20 is tilted into the receiving cavity 400 from the side of the liquid cooling component 200, and then aligned with the connector 11. Simultaneously, the solid-state drive 20 is laid flat, and the abutment 700 is simultaneously engaged at the end of the solid-state drive 20 furthest from the connector 11, completing the horizontal installation of the solid-state drive 20 and ensuring that the lower surface of the solid-state drive 20 contacts the base 100. Then, by pressing the movable plate 520, the liquid cooling component 200 is adjusted to the second positioning part 311 that matches the solid-state drive 20, bringing the liquid cooling component 200 into contact with the upper surface of the solid-state drive 20.

[0116] Therefore, the heat from the upper surface of the solid-state drive 20 can be directly transferred to the liquid cooling component 200. The heat from the lower surface of the solid-state drive 20 can be transferred to the liquid cooling component 200 through the transfer path of the base 100 and the side plate 310. This greatly improves the heat dissipation capacity of the solid-state drive 20, so as to meet the high-efficiency heat dissipation requirements of the solid-state drive 20 in some scenarios, and solves the problem of poor heat dissipation performance of the solid-state drive 20 in related technologies.

[0117] It should be noted that when disassembling the cooling device, simply reverse the above steps.

[0118] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A cooling device, characterized in that, include: Base (100); Liquid cooling component (200), the base (100) and the liquid cooling component (200) are used to contact at least two surfaces of the component to be cooled, the base (100) is provided with a heat-conducting component (300), and the liquid cooling component (200) is connected to the base (100) through the heat-conducting component (300); The heat-conducting component (300) includes at least two side plates (310) disposed on the base (100), and the base (100) and any two adjacent side plates (310) form a receiving cavity (400) for accommodating the heat-dissipating component; The liquid cooling component (200) is located inside the receiving cavity (400). The liquid cooling component (200) and the base (100) are used to contact the two surfaces opposite to the heat dissipation component, respectively. The liquid cooling component (200) is connected to the side plates (310) on both sides of the receiving cavity (400). The liquid cooling component (200) is provided with a connecting assembly (500), which includes a fixed plate (510) and two movable plates (520). The fixed plate (510) is connected to the liquid cooling component (200), and the movable plates (520) are slidably connected to the fixed plate (510). The two movable plates (520) are detachably connected to the side plates (310) on both sides of the receiving cavity (400).

2. The cooling device according to claim 1, characterized in that, The movable plate (520) has a first positioning part (521), and the side plate (310) has a second positioning part (311). The connecting assembly (500) further includes at least two first elastic members (530), the first elastic members (530) connecting the fixed plate (510) and the movable plate (520), the movable plate (520) being configured to slide relative to the fixed plate (510) under the action of the first elastic members (530) so that the first positioning part (521) corresponds to and engages with the second positioning part (311).

3. The cooling device according to claim 2, characterized in that, At least two second positioning portions (311) are provided corresponding to the same first positioning portion (521), and the at least two second positioning portions (311) are distributed along the depth direction of the receiving cavity (400).

4. The cooling device according to any one of claims 1-3, characterized in that, At least one of the liquid cooling component (200) and the base (100) has a thermally conductive layer (600) on its surface for contacting the component to be cooled.

5. The cooling device according to any one of claims 1-3, characterized in that, It also includes an abutment (700) and a second elastic member (800). The base (100) is provided with a mounting part (110). The abutment (700) is slidably disposed on the base (100) and corresponds to the mounting part (110). The second elastic member (800) is disposed on the mounting part (110) and connects the base (100) and the abutment (700). The abutment (700) is configured to abut against the end of the heat-dissipating component under the action of the second elastic member (800) to confine the heat-dissipating component within the receiving cavity (400).

6. The cooling device according to claim 5, characterized in that, At least two mounting portions (110) are provided, and at least two mounting portions (110) are distributed along the length direction of the receiving cavity (400).

7. An electronic device, characterized in that, Includes a PCB board (10), a component to be cooled, and a cooling device as described in any one of claims 1-6; The heat-dissipating component is disposed on the PCB board (10); The base (100) in the cooling device is disposed on the PCB board (10). The liquid cooling component (200) in the cooling device is connected to the base (100) through the heat-conducting component (300) in the cooling device. The base (100) and the liquid cooling component (200) are in contact with at least two surfaces of the component to be cooled.

8. A method for installing a cooling device, characterized in that, For installing the cooling device according to any one of claims 1-6, the following steps are included: The liquid cooling component (200) in the cooling device is mounted on the base (100) via the heat-conducting component (300) in the cooling device; At least one surface of the component to be cooled is brought into contact with the base (100), and at least another surface of the component to be cooled is brought into contact with the liquid cooling component (200).

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