Electric connection assembly and manufacturing device and electric connection method thereof

Abstract

The embodiment of the invention discloses an electric connection assembly and an electric connection method, the electric connection assembly comprises an electronic device and a circuit board which are connected, the electronic device comprises a device body and a plurality of conductive structures connected to the surface of the device body, and conductive paste is arranged on one side, back to the device body, of each conductive structure. The conductive paste bodies are not completely the same in height, and the surfaces, back to the electronic device, of the conductive paste bodies are located on the same plane, so that the conductive paste bodies are in conductive connection with the circuit board. The electric connection method comprises the following steps: providing an electronic device which is provided with a plurality of conductive structures; fixing the electronic device so that the conductive structure is located above the device body; arranging a conductive paste distributor above the electronic device, wherein the conductive paste distributor is provided with a plurality of through holes corresponding to the conductive structures; distributing the conductive paste to the top surface of each conductive structure through each through hole; turning over the electronic device to enable the conductive structure to be located below the device body; and conductively connecting the electronic device with the circuit board through the conductive paste.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electrical connection, and particularly relates to an electrical connection assembly, a manufacturing device thereof and an electrical connection method. BACKGROUND

[0002] In the industrial technical field, some electrical connection assemblies are formed by press-fitting electronic devices on circuit boards, but edge warping problems are prone to occur for electronic devices with relatively large areas, which causes the conductive structures arranged thereon to be inclined to different degrees and easily affects the electrical connection effect of the electronic devices and the circuit boards. SUMMARY

[0003] The application aims to provide an electrical connection assembly, a manufacturing device thereof and an electrical connection method, which can solve the problem of the electrical connection effect of electronic devices and circuit boards being affected by edge warping of the electronic devices in the related art.

[0004] In a first aspect, the application provides an electrical connection assembly, which comprises an electronic device and a circuit board connected to each other, the electronic device comprises a device body and a plurality of conductive structures connected to the surface of the device body, each of the conductive structures is provided with a conductive paste body on the side opposite to the device body, the heights of the conductive paste bodies are not completely the same, and the surfaces of the conductive paste bodies opposite to the electronic device are located on the same plane, so that the conductive paste bodies are respectively in conductive connection with the circuit board.

[0005] In a second aspect, the application further provides a manufacturing device of the electrical connection assembly, which is applied to the above-mentioned electrical connection assembly, and comprises a conductive paste body dispenser, which is used to distribute the conductive paste bodies to the surfaces of the conductive structures of the electronic device.

[0006] The conductive paste body dispenser comprises a dispenser body and a plurality of through holes arranged on the dispenser body, the positions of the through holes correspond to the positions of the conductive structures respectively, the conductive paste bodies are arranged on the surfaces of the conductive structures through the through holes, and the conductive paste bodies are respectively filled in the corresponding through holes, so that the surfaces of the conductive paste bodies opposite to the conductive structures are located on the same plane.

[0007] In a third aspect, the application further provides an electrical connection method, which is applied to the above-mentioned electrical connection assembly, and comprises the following steps.

[0008] Providing an electronic device, the electronic device has a plurality of conductive structures, and the heights of at least part of the conductive structures are different;

[0009] Fixing the electronic device, so that the conductive structures of the electronic device are located above the device body of the electronic device;

[0010] A conductive paste dispenser is arranged above the electronic device, the conductive paste dispenser comprises a dispenser body and a plurality of through holes arranged on the dispenser body, the positions of the through holes correspond to the conductive structures of the electronic device respectively;

[0011] The conductive paste is dispensed through the through holes of the conductive paste dispenser to the top surfaces of the conductive structures of the electronic device;

[0012] The electronic device is turned over so that the conductive structures are below the device body;

[0013] The electronic device is conductively connected to the circuit board through the conductive paste.

[0014] In the embodiments of the present application, the conductive paste is arranged on the conductive structures of the electronic device respectively, and the surfaces of the conductive paste away from the electronic device are located on the same plane. Even if the edge of the electronic device is warped due to the large area of the electronic device, the height of each conductive structure arranged thereon is different, the conductive height of each conductive structure is kept consistent by the conductive paste, each conductive structure can be conductively connected to the circuit board through the corresponding conductive paste, the electronic device and the circuit board are stably electrically connected, and the electrical connection performance is not affected by the edge warping of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a structural schematic diagram of an electrical connection assembly disclosed by the embodiments of the present application;

[0016] Figure 2 is a schematic diagram of the adsorption component adsorbing the electronic device disclosed by the embodiments of the present application;

[0017] Figure 3 is a schematic diagram of the adsorption component placing the electronic device on the conductive paste dispenser disclosed by the embodiments of the present application;

[0018] Figure 4 is a schematic diagram of the fixing component fixing the electronic device and the conductive paste dispenser disclosed by the embodiments of the present application;

[0019] Figure 5 is a schematic diagram of the fixing component, the electronic device and the conductive paste dispenser after being turned over disclosed by the embodiments of the present application;

[0020] Figure 6 is a schematic diagram of the printing component printing the conductive paste on the surface of the conductive paste dispenser disclosed by the embodiments of the present application;

[0021] Figure 7is a schematic view of the fixed component, the electronic device and the conductive paste dispenser after being flipped again after the conductive paste dispensing process is completed according to the embodiment of the present application;

[0022] Figure 8 is a schematic view of the conductive paste dispenser and the electronic device when they are separated according to the embodiment of the present application.

[0023] Legend of reference signs:

[0024] 10 - electrical connection assembly,

[0025] 100 - electronic device, 110 - device body, 120 - conductive structure, 120a - guide arc surface,

[0026] 200 - conductive paste,

[0027] 300 - circuit board,

[0028] 400 - conductive paste dispenser, 410 - dispenser body, 420 - through hole, 430 - paste printing surface,

[0029] 500 - printing component,

[0030] 600 - fixed component,

[0031] 700 - adsorption component. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present application.

[0033] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second" and the like are generally of a kind, not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally means that the front and rear associated objects are in an "or" relationship.

[0034] The electrical connection assembly, its manufacturing device and electrical connection method provided by the embodiments of the present application will be described in detail below in combination with the drawings and specific embodiments and their application scenarios.

[0035] Please refer to Figure 1 The electric connection assembly 10 disclosed by the embodiment of the present application comprises an electronic device 100 and a circuit board 300 connected with each other, and the electronic device 100 can be conductively connected with the circuit board 300.

[0036] Specifically, the electronic device 100 can be a chip, and the electronic device 100 comprises a device body 110 and a plurality of conductive structures 120 connected to the surface of the device body 110. The conductive structure 120 can be a solder ball, a conductive block or a conductive column, etc. The embodiment of the present application does not limit the number and specific structure form of the conductive structure 120.

[0037] The side of each conductive structure 120 away from the device body 110 is provided with a conductive paste 200, and the height of each conductive paste 200 is not completely same. The surface of each conductive paste 200 away from the electronic device 100 is located in the same plane, so that each conductive paste 200 is conductively connected with the circuit board 300.

[0038] The conductive height of each conductive structure 120 is not completely same, so that the height of each conductive paste 200 is not completely same. Alternatively, the height of each conductive structure 120 is not same, and the height of each conductive paste 200 is not same, so that the surface of each conductive paste 200 away from the electronic device 100 is located in the same plane; or, the height of a part of the conductive structure 120 is different, and the height of another part of the conductive structure 120 is same. In order to adapt to the conductive structure 120, the height of a part of the conductive paste 200 is not same, and the height of another part of the conductive paste 200 is same, so that the surface of each conductive paste 200 away from the electronic device 100 is located in the same plane.

[0039] Alternatively, after the conductive paste 200 is sequentially dotted on the side of each conductive structure 120 away from the device body 110, the conductive paste 200 can be flattened by using a structure with a plane, so that the surface of each conductive paste 200 away from the electronic device 100 is located in the same plane; or, the conductive paste 200 is directly distributed to the surface of each conductive structure 120 by using the conductive paste distributor 400 (such as a steel mesh) in the following text, and at the same time of distributing the conductive paste 200, the surface of the conductive paste 200 away from the electronic device 100 is ensured to be located in the same plane. Of course, other ways can also be adopted, and the embodiment of the present application does not limit the setting mode of the conductive paste 200.

[0040] When the area of ​​the electronic device 100 is large, its edges are prone to warping, resulting in different heights of the conductive structures 120 disposed thereon. Consequently, when the electronic device 100 is connected to the circuit board 300, the conductive structures 120 cannot simultaneously establish a conductive connection with the circuit board 300. Therefore, in this embodiment, conductive paste 200 is provided on the side of each conductive structure 120 facing away from the device body 110. The conductive paste 200 compensates for the insufficient conductive height of the conductive structures 120, enabling the conductive height of each conductive structure 120 to become more consistent through the corresponding conductive paste 200. This ensures that each conductive structure 120 simultaneously and stably establishes a conductive connection with the circuit board 300, guaranteeing that the electrical connection performance is not affected by the edge warping of the electronic device 100.

[0041] In an optional embodiment, combined with Figure 1 and Figure 2 As shown, the conductive structure 120 includes solder balls, each solder ball having a conductive arc surface 120a. The conductive arc surface 120a is opposite to the device body 110, and conductive paste 200 is disposed on the conductive arc surface 120a. Optionally, each conductive structure 120 may include solder balls, or only some conductive structures 120 may include solder balls.

[0042] In this embodiment, the conductive paste 200 is disposed on the conductive structure 120 via the conductive arc surface 120a. The conductive arc surface 120a serves as a contact surface, resulting in a larger contact area between the conductive paste 200 and the conductive structure 120. This increases the connection area between the conductive paste 200 and the conductive structure 120, improves the stability of the conductive paste 200 disposed on the conductive structure 120, and further facilitates the conductive connection between the conductive structure 120 and the circuit board 300 via the conductive paste 200, thereby enhancing the stability of the conductive connection.

[0043] Of course, in other embodiments, the conductive paste 200 can be configured in a shape other than a solder ball, and the conductive structure 120 can be provided with a conductive plane, through which the conductive paste 200 can be disposed on the conductive structure 120.

[0044] The electrical connection component 10 in this embodiment can be applied to BGA (Ball Grid Array) packaging technology, where the electronic device 100 is a chip. This technology achieves electrical connection and mechanical fixation between the chip and the circuit board 300 through solder balls on the bottom of the chip. Of course, the electrical connection component 10 can also be applied to other technologies besides BGA.

[0045] In an optional embodiment, the plane containing the surface of each conductive paste 200 facing away from the electronic device 100 is parallel to the reference plane of the device body 110.

[0046] It should be noted that the reference plane of the device body 110 is the plane in which the device body 110 is in a flat placement state and has not been warped (no thermal stress, mechanical stress), i.e. the plane in which the device body 110 has not been warped.

[0047] When each conductive paste 200 is conductively connected with the circuit board 300, the plane in which the surface of each conductive paste 200 faces away from the electronic device 100 is parallel to the plane in which the circuit board 300 is located. Since the surface of each conductive paste 200 faces away from the electronic device 100 is parallel to the reference plane of the device body 110, the plane in which the circuit board 300 is located is also parallel to the reference plane of the device body 110. Even if the device body 110 is warped, the plane in which the circuit board 300 is located tends to be parallel to the plane in which the device body 110 is located, which is conducive to reducing the distance between the circuit board 300 and the device body 110, reducing the height of the conductive paste 200, reducing the conductive resistance, and ensuring that the circuit board 300 and the electronic device 100 are continuously and stably electrically connected.

[0048] Of course, in other embodiments, the plane in which the surface of each conductive paste 200 faces away from the electronic device 100 can not be parallel to the reference plane of the device body 110.

[0049] In optional embodiments, the conductive structures 120 are uniformly distributed on the surface of the device body 110. Since the conductive paste 200 is arranged on the basis of the conductive structure 120, the conductive paste 200 is also uniformly distributed. Optionally, the conductive structures 120 can be uniformly distributed on the surface of the device body 110 in the form of a square array, a circular array, etc.

[0050] With the present embodiment, the conductive structures 120 and the conductive paste 200 are uniformly distributed, and therefore the connection positions of the conductive paste 200 and the circuit board 300 are also uniformly distributed, which is conducive to stably connecting the conductive paste 200 and the circuit board 300 and further improving the connection stability.

[0051] Of course, in other embodiments, the conductive structures 120 can not be uniformly distributed on the surface of the device body 110, and therefore the conductive paste 200 can also not be uniformly distributed.

[0052] In optional embodiments, the conductive paste 200 can be a tin paste.

[0053] The tin paste is in a paste state at room temperature and is in a liquid state when heated and welded, and has strong fluidity, which can better adapt to the high-temperature process of BGA welding, compensate for the gap generated between the electronic device 100 and the circuit board 300 after the electronic device 100 is warped, and is conducive to realizing high-strength mechanical connection and stable electrical connection.

[0054] Of course, the conductive paste 200 can also be other paste capable of conducting electricity other than tin paste.

[0055] In optional embodiments, the electronic device 100 and the circuit board 300 are connected through a press-fit joint. Specifically, after the conductive structures 120 are provided with the conductive paste 200 on the side facing away from the device body 110, the electronic device 100 and the circuit board 300 are connected through a press-fit joint, that is, the electronic device 100 and the circuit board 300 are connected through a press-fit method.

[0056] With the present embodiment, the press-fit method is conducive to compacting the conductive path and reducing the contact resistance, thereby improving the consistency of the conductive connection between the conductive paste 200 and the circuit board 300; the electronic device 100 and the circuit board 300 form the electrical connection assembly 10 through a press-fit method, thereby improving the mechanical connection strength of the electrical connection and facilitating the improvement of the environmental interference resistance.

[0057] Of course, in other embodiments, the electronic device 100 and the circuit board 300 can be connected through other methods other than the press-fit method.

[0058] Based on the electrical connection assembly 10 disclosed in the present application, the present embodiment also discloses a manufacturing device for the electrical connection assembly 10, which is applied to the electrical connection assembly 10 in the above-mentioned embodiments, and reference is made to Figures 2-7 The manufacturing device is mainly used for providing the conductive paste 200 on the electronic device 100. Specifically, the manufacturing device comprises a conductive paste dispenser 400, which is used to dispense the conductive paste 200 to the surface of each conductive structure 120 of the electronic device 100.

[0059] Reference is made to Figure 3 The conductive paste dispenser 400 comprises a dispenser body 410 and a plurality of through holes 420 provided on the dispenser body 410, and the through holes 420 are used for the conductive paste 200 to pass through so that the conductive paste 200 reaches the surface of the conductive structure 120 corresponding to the through hole 420. The position of each through hole 420 corresponds to the position of each conductive structure 120, and the conductive paste 200 is provided on the surface of each conductive structure 120 through each through hole 420. Each conductive paste 200 is filled in the corresponding through hole 420, specifically, the filling height of each through hole 420 is consistent, so that the conductive paste 200 fills each corresponding through hole 420, and the surface of each conductive paste 200 facing away from the conductive structure 120 is located on the same plane.

[0060] The dispenser body 410 can be a plate structure, and the through holes 420 can be square holes, circular holes, etc., and the present embodiment does not limit the specific structure of the conductive paste dispenser 400. In summary, the conductive paste 200 can be dispensed to the surface of each conductive structure 120 through each through hole 420.

[0061] Referring to Figure 6 As shown in the figure, in the case that the electronic device 100 is located below the conductive paste dispenser 400, and the through holes 420 are in one-to-one correspondence with the conductive structures 120, the conductive paste 200 can be filled into each through hole 420, so that the conductive paste 200 can accurately reach the surface of each conductive structure 120.

[0062] By using the conductive paste dispenser 400 to dispense the conductive paste 200, the conductive paste 200 can be accurately dispensed on the surface of each conductive structure 120, the setting process of the conductive paste 200 can be simplified, and the surfaces of each conductive paste 200 away from the conductive structure 120 are located in the same plane, which creates conditions for the conductive connection between the electronic device 100 and the circuit board 300.

[0063] Alternatively, the conductive paste dispenser 400 can be a steel mesh, and the through holes 420 can be directly formed by using the holes of the steel mesh, without the need to separately open the through holes 420 in the dispenser body 410. Of course, the conductive paste dispenser 400 can also be formed by opening the through holes 420 in a solid plate structure.

[0064] In further embodiments, referring to Figure 6 As shown in the figure, the dispenser body 410 is provided with a paste printing surface 430, and each through hole 420 extends to the paste printing surface 430. Then, by printing the conductive paste 200 on the paste printing surface 430, the conductive paste 200 can enter each through hole 420 in turn. The manufacturing device further includes a printing component 500, which is used to print the conductive paste 200 on the paste printing surface 430, so that the conductive paste 200 enters each through hole 420.

[0065] Alternatively, the printing component 500 can be a doctor blade or a squeegee, which is used to print the conductive paste 200 on the surface of the dispenser body 410 (i.e., the surface away from the conductive structure 120), so that the conductive paste 200 directly enters each through hole 420, further simplifying the dispensing process of the conductive paste 200.

[0066] By adopting the embodiment, the conductive paste 200 can be directly distributed into each via hole 420 by printing the conductive paste 200 through the paste printing surface 430, and the excess conductive paste 200 on the surface of the paste printing surface 430 can be scraped off by the printing component 500 when printing the conductive paste 200, so that the conductive paste 200 only enters the via hole 420, and the surface of each conductive paste 200 away from the conductive structure 120 is kept in the same plane, that is, the surface of each conductive paste 200 away from the conductive structure 120 is kept in the same plane. In this way, the distribution process of the conductive paste 200 and the operation of keeping each conductive paste 200 in the same plane are not needed to be performed respectively, which is beneficial to simplify the setting process of the conductive paste 200.

[0067] Of course, in other embodiments, the distributor body 410 can not be provided with the paste printing surface 430, and the conductive paste 200 can be separately filled into each via hole 420, and then the surfaces of each conductive paste 200 away from the conductive structure 120 are kept in the same plane by flattening or other ways after the filling is completed.

[0068] In optional embodiments, as shown in Figures 4-5 and Figure 7 The manufacturing device further includes a fixing component 600, which is used to fix the conductive paste distributor 400 and the electronic device 100. In the case that the conductive paste distributor 400 distributes the conductive paste 200, the fixing component 600 fixes the conductive paste distributor 400 to the electronic device 100, so that the via hole 420 is opposite to the conductive structure 120, and the relative position between the conductive paste distributor 400 and the electronic device 100 is fixed.

[0069] Specifically, as shown in Figure 3 After the relative position between the conductive paste distributor 400 and the electronic device 100 is determined, that is, each via hole 420 is opposite to the corresponding conductive structure 120, the conductive paste distributor 400 and the electronic device 100 can be fixed by using the fixing component 600.

[0070] Optionally, the fixing component 600 can be a magnetic clamp, or the fixing component 600 can be a clamping assembly, and the conductive paste distributor 400 and the electronic device 100 are fixed by clamping. The specific structure and fixing mode of the fixing component 600 are not limited in the embodiments of the application.

[0071] By adopting the embodiment, the manufacturing device is additionally provided with the fixing component 600, which is beneficial to accurately fix the conductive paste distributor 400 and the electronic device 100, so that the conductive paste distributor 400 and the electronic device 100 do not relatively deviate during the distribution of the conductive paste 200, the setting position of the conductive paste 200 is prevented from deviating, and the conductive paste 200 can be accurately distributed into each via hole 420.

[0072] Of course, in other embodiments, the manufacturing device can not be provided with the fixing component 600, and the conductive paste dispenser 400 and the electronic device 100 can be manually controlled to ensure that the relative positions of the two are fixed during the dispensing of the conductive paste 200.

[0073] In further embodiments, the fixing component 600 can be a magnetic clamp, and the fixing component 600 includes a first clamp and a second clamp that can be magnetically attracted to clamp the conductive paste dispenser 400 and the electronic device 100.

[0074] Specifically, the first clamp and the second clamp are magnetically attracted to each other to clamp the conductive paste dispenser 400 and the electronic device 100. Optionally, the first clamp and the second clamp can be respectively provided with magnetic members that are magnetically opposite, or at least part of the first clamp and at least part of the second clamp are respectively magnetic members that are magnetically opposite.

[0075] With this embodiment, the first clamp and the second clamp clamp and fix the conductive paste dispenser 400 and the electronic device 100 directly through the magnetic attraction structure, without the need for separate additional operations to fix the conductive paste dispenser 400 and the electronic device 100 to the fixing component 600. The structure and fixing method of the fixing component 600 are simpler.

[0076] Based on the electric connection assembly 10 disclosed in the present application, an electric connection method is also disclosed in the embodiments of the present application, which is applied to the electric connection assembly 10 described above and is used to connect the electronic device 100 and the circuit board 300.

[0077] The electric connection method includes:

[0078] S100, providing an electronic device 100, the electronic device 100 having a plurality of conductive structures 120, at least part of the conductive structures 120 having different heights.

[0079] Optionally, the electronic device 100 can be a chip, and the conductive structures 120 can be structures such as solder balls, conductive blocks, or conductive columns, and the heights of some of the conductive structures 120 can be different, or the heights of all of the conductive structures 120 can be different.

[0080] S200, fixing the electronic device 100 so that the conductive structures 120 of the electronic device 100 are located above the device body 110 of the electronic device 100. Optionally, the chip is fixed so that the solder balls are located above the chip.

[0081] S300, disposing a conductive paste dispenser 400 above the electronic device 100, the conductive paste dispenser 400 comprising a dispenser body 410 and a plurality of through holes 420 disposed on the dispenser body 410, each through hole 420 corresponding to a conductive structure 120 of the electronic device 100.

[0082] Optionally, the conductive paste dispenser 400 is a steel mesh, and the steel mesh is disposed above the chip, each through hole 420 of the steel mesh corresponding to each solder ball, wherein the through hole 420 can be a square hole, a circular hole, etc.

[0083] S400, dispensing the conductive paste 200 through each through hole 420 of the conductive paste dispenser 400 to the top surface of each conductive structure 120 of the electronic device 100.

[0084] Optionally, the conductive paste 200 can be a tin paste, and the conductive paste 200 can be printed on the surface of the conductive paste dispenser 400 by using a printing component 500, so that the conductive paste 200 is sequentially dispensed into each through hole 420 and further dispensed to the top surface of each conductive structure 120.

[0085] In addition, before dispensing the conductive paste 200, the conductive paste dispenser 400 and the electronic device 100 are fixed by using a fixing component 600, so as to ensure that each through hole 420 corresponds to each conductive structure 120.

[0086] S500, turning over the electronic device 100 so that the conductive structure 120 is below the device body 110.

[0087] Optionally, after the dispensing process of the conductive paste 200 is completed, the fixing component 600 can be turned over by 180°, so as to realize the turning over process of the electronic device 100, and then the fixing component 600 releases the conductive paste dispenser 400 and the electronic device 100, the conductive paste dispenser 400 and the electronic device 100 are separated, and then the electronic device 100 is connected to the circuit board 300.

[0088] S600, electrically connecting the electronic device 100 to the circuit board 300 through the conductive paste 200.

[0089] Optionally, the electronic device 100 and the circuit board 300 can be connected by a press-fit method, so as to realize the electrically connecting of the conductive paste 200 to the circuit board 300.

[0090] By using the above electric connection method, the conductive paste 200 is arranged on the surface of each conductive structure 120 of the electronic device 100, and the surface of each conductive paste 200 opposite to the conductive structure 120 is in the same plane, so that the conductive height of each conductive structure 120 is consistent, which is beneficial to the stable electric connection between the electronic device 100 and the circuit board 300, and ensures that the electric connection performance is not affected by the edge warping of the electronic device 100.

[0091] In optional embodiments, the electronic device 100 can be a chip, the conductive structure 120 can be a solder ball, and the conductive paste dispenser 400 can be a steel mesh. The electric connection method is as follows:

[0092] Referring to Figure 2 , the chip is adsorbed and taken out from a tray in which the chip is placed by the adsorption component 700 (for example, a suction cup), and the solder ball is located below the chip; referring to Figure 3 and Figure 4 , the chip is transported to above the steel mesh (that is, the conductive paste dispenser 400) by the adsorption component 700, the solder ball corresponds to each through hole 420 of the steel mesh, and then the chip and the steel mesh are fixed by the fixing component 600 (for example, a magnetic clamp), so that the chip and the steel mesh are relatively fixed; the chip and the steel mesh are turned over 180° by the fixing component 600, referring to Figure 5 , the steel mesh is located above the chip; referring to Figure 6 , the tin paste is printed on the surface (that is, the paste printing surface 430) of the steel mesh by the printing component 500 (for example, a doctor blade), so that the tin paste enters each through hole 420 and is distributed to the surface of each solder ball through each through hole 420, and in the printing process, the tin paste fills each through hole 420, the surface of each tin paste opposite to the solder ball is flush with the paste printing surface 430, so that the surface of each tin paste opposite to the solder ball is in the same plane, and the conductive height is consistent.

[0093] After the printing process is completed, referring to Figure 7 , the chip and the steel mesh are turned over 180° again by the fixing component 600, so that the solder ball is located below the chip; referring to Figure 8 , the fixing component 600 releases the chip and the steel mesh, the chip is separated from the steel mesh, and the chip is further electrically connected to the circuit board 300 through the tin paste, forming Figure 1 the electric connection assembly 10 shown in the figure.

[0094] The embodiments of the present application are described above with reference to the drawings, but the present application is not limited to the specific embodiments described above, and the specific embodiments described above are only illustrative but not limiting, and those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope protected by the claims.

Claims

1. An electrical connection assembly, characterized in that, The device includes an electronic component (100) and a circuit board (300) connected together. The electronic component (100) includes a component body (110) and a plurality of conductive structures (120) connected to the surface of the component body (110). Each conductive structure (120) has a conductive paste (200) on the side facing away from the component body (110). The height of each conductive paste (200) is not exactly the same. The surfaces of each conductive paste (200) facing away from the electronic component (100) are all located on the same plane so that each conductive paste (200) is electrically connected to the circuit board (300).

2. The electrical connection assembly according to claim 1, characterized in that, The conductive structure (120) includes solder balls, each solder ball having a conductive arc surface (120a), and the conductive paste (200) is disposed on the conductive arc surface (120a).

3. The electrical connection assembly according to claim 1, characterized in that, The plane containing the surface of each conductive paste (200) facing away from the electronic device (100) is parallel to the reference plane of the device body (110).

4. The electrical connection assembly according to claim 1, characterized in that, The conductive structure (120) is uniformly distributed on the surface of the device body (110).

5. The electrical connection assembly according to claim 1, characterized in that, The conductive paste (200) includes solder paste.

6. The electrical connection assembly according to claim 1, characterized in that, The electronic device (100) and the circuit board (300) are connected by a press-fit joint.

7. An apparatus for manufacturing an electrical connection component, applied to the electrical connection component (10) according to any one of claims 1-6, characterized in that, The fabrication apparatus includes a conductive paste dispenser (400) for dispensing conductive paste (200) onto the surfaces of each of the conductive structures (120) of the electronic device (100); The conductive paste dispenser (400) includes a dispenser body (410) and a plurality of through holes (420) disposed on the dispenser body (410). The position of each through hole (420) corresponds to the position of each conductive structure (120). The conductive paste (200) is disposed on the surface of each conductive structure (120) through each through hole (420), and each conductive paste (200) fills the corresponding through hole (420) so that the surfaces of each conductive paste (200) facing away from the conductive structure (120) are located on the same plane.

8. The manufacturing apparatus according to claim 7, characterized in that, The dispenser body (410) is provided with a paste printing surface (430), and each of the through holes (420) extends to the paste printing surface (430). The manufacturing apparatus further includes a printing component (500) for printing the conductive paste (200) onto the paste printing surface (430) so that the conductive paste (200) enters each of the through holes (420).

9. The manufacturing apparatus according to claim 7, characterized in that, The manufacturing apparatus also includes a fixing component (600). When the conductive paste dispenser (400) dispenses the conductive paste (200), the fixing member (600) fixes the conductive paste dispenser (400) to the electronic device (100) so that the through hole (420) is aligned with the conductive structure (120).

10. An electrical connection method applied to the electrical connection assembly (10) according to any one of claims 1-6, characterized in that, The method includes: An electronic device (100) is provided, the electronic device (100) having a plurality of conductive structures (120), at least some of the conductive structures (120) having different heights; The electronic device (100) is fixed such that the conductive structure (120) of the electronic device (100) is located above the device body (110) of the electronic device (100); A conductive paste dispenser (400) is provided above the electronic device (100). The conductive paste dispenser (400) includes a dispenser body (410) and a plurality of through holes (420) provided on the dispenser body (410). The position of each through hole (420) corresponds to a plurality of conductive structures (120) of the electronic device (100). Conductive paste (200) is dispensed to the top surface of each of the conductive structures (120) of the electronic device (100) through the through holes (420) of the conductive paste dispenser (400); The electronic device (100) is flipped so that the conductive structure (120) is located below the device body (110); The electronic device (100) is electrically connected to the circuit board (300) through the conductive paste (200).

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