PCB golden finger beveling machine with self-cleaning and recycling functions
By combining a detection system with color mark sensors and metal sensors, along with automatic feeding and positioning using linear motors and CCD cameras, precise beveling of three-dimensional modules and milling components, and automatic debris monitoring and cleaning by a negative pressure recovery system, the problem of scratches and debris in existing PCB beveling equipment has been solved, achieving efficient and precise beveling and clean recycling.
Patent Information
- Application Number
- CN202511708217.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-20
- Publication Date
- 2026-02-13
AI Technical Summary
Existing PCB beveling equipment cannot effectively prevent scratches and abrasions, which can lead to short circuits. Furthermore, the adhesion of debris affects production continuity and quality, and it is difficult to handle beveling of boards of different specifications.
The detection system combines color mark sensors and metal sensors. It uses a linear motor to drive the feeding assembly and CCD camera for automatic feeding and positioning. It uses a three-way module and milling assembly for precise beveling. It also uses a negative pressure recovery system to automatically collect debris and uses a photosensitive plate to monitor the amount of debris to adjust the cleaning efficiency.
This technology improves the precision and automation of PCB board bevel processing, avoids missed processing and debris adhesion, ensures production continuity and quality stability, and enhances processing efficiency and cleaning effectiveness.
Smart Images

Figure CN121531572A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of PCB beveling machine technology, specifically a PCB gold finger beveling machine with self-cleaning and recycling function. Background Technology
[0002] Gold fingers are gold-plated connection points on the edge of a PCB, used to insert into sockets or connect to other circuit boards to ensure the reliability of electrical connections. They are commonly found in memory modules, graphics cards, expansion cards, etc.
[0003] PCB gold fingers are typically made of copper, plated with gold or a nickel-gold alloy to improve conductivity and corrosion resistance. Beveling the gold fingers on the PCB prevents burrs or sharp edges from damaging the socket, makes insertion easier, and reduces wear. Simultaneously, the beveling enhances the mechanical strength of the gold fingers, extending their lifespan. Therefore, the angle and length of the beveling must be strictly controlled to ensure compatibility.
[0004] Furthermore, most beveling equipment currently cannot avoid scratches and abrasions, which can lead to short circuits and cause mass scrapping of PCB products in severe cases. Additionally, the amount of debris generated during the beveling of gold fingers on PCBs of different specifications is unpredictable, resulting in some debris adhering to the moving platform or product surface, affecting continuous production efficiency and quality. Summary of the Invention
[0005] The purpose of this invention is to provide a PCB board gold finger beveling machine with self-cleaning and recycling function to solve the problems mentioned in the prior art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: The beveling machine includes a frame, a feeding device, a processing device, a transfer device, and a linear motor. The fixed end of the linear motor is fastened to the frame, the output end of the linear motor is fastened to the feeding device, and the transfer device is fastened to the frame. The transfer device is used to drive the processing device and the PCB board to move. Two processing devices are provided.
[0007] The frame serves as the main mounting base for installing other devices. The feeding device automatically transports the PCB board and padding paper, and the transfer provides linear displacement, thereby driving the processing device to move and perform inclined surface processing on the PCB board. The linear motor is also used to provide linear displacement for the station transfer of the PCB board and padding paper.
[0008] Furthermore, the feeding device includes a feeding component, a transfer component, and a receiving component. The linear motor has three output terminals, which are respectively connected to the feeding component, the transfer component, and the receiving component. The feeding component is equipped with a color mark sensor and a metal sensor.
[0009] The feeding assembly is used for automatic material loading and includes a transfer assembly and a receiving assembly. A linear motor with three output terminals drives the movement of these three assemblies. During loading, a color mark sensor detects whether the item is a backing paper or a PCB board. If it's backing paper, the feeding assembly moves it to the transfer station where the transfer assembly is located, and then the receiving assembly moves it to the final receiving station. If the product is a PCB board, it is moved to the processing station for bevel machining. After processing, it is moved to the next processing station. The color mark sensor serves as the primary detection element, and a metal sensor is also included for secondary detection to prevent missed processing due to color mark sensor malfunction.
[0010] Furthermore, the frame is equipped with two CCD cameras, the feeding assembly includes a feeding platform and a feeding suction cup, the transfer assembly includes a transfer platform and a transfer suction cup, and the receiving assembly includes a receiving platform and a receiving suction cup. The three outputs of the linear motor are respectively fixedly connected to the feeding suction cup, the transfer suction cup, and the receiving suction cup. The feeding platform, the transfer platform, and the receiving platform are respectively placed on the frame, with the transfer platform located between the feeding platform and the receiving platform. The two CCD cameras are respectively fixedly connected to the feeding suction cup and the receiving suction cup.
[0011] CCD cameras are installed at both ends of the frame to capture images of the PCB board at the processing station, obtaining its current position information for easy repositioning of the processing device and the PCB board. During loading, the item is placed on the feeding platform. The item type is first determined: if it's a padding paper, the first output of a linear motor moves the feeding suction cup, using negative pressure to move the padding paper to the transfer platform. The third output of the linear motor then moves the receiving suction cup to the receiving platform. If it's a PCB board, the feeding suction cup moves it to the first processing station for bevel processing. The two CCD cameras move with the feeding and receiving suction cups respectively, facilitating automatic item positioning.
[0012] Furthermore, the transfer suction cup includes a lifting cylinder, which is fastened to the output end of the linear motor in the middle. The output end of the lifting cylinder is provided with a transmission plate, the transmission plate is provided with a reversing motor, and the output end of the reversing motor is provided with a suction nozzle.
[0013] When processing polygonal lines on a PCB board, an automatic angle adjustment is achieved using a transfer suction cup. The second output of a linear motor is used to drive the lifting cylinder to move and to drive the transmission plate to move vertically. After the initially processed PCB board moves to the transfer platform, the lifting cylinder drives the transmission plate to move down until the suction nozzle is attached to the surface of the PCB board. The reversing motor drives the suction nozzle to rotate, thereby adjusting the angle of the PCB board.
[0014] Furthermore, the transfer includes a transverse module, with a carrier plate on one side of the transverse module, and two pressure cylinders on the frame. The output end of the pressure cylinder is equipped with a pressure plate, which is used to press the PCB board onto the base plate.
[0015] A transverse module is set up at two processing stations. The carrier plate is placed on the frame to support the PCB board. A lever is set at the output end of the transverse module to push the PCB board to the corresponding position. The pressure cylinder is fixed on the frame and outputs downward displacement, which drives the pressure plate to move down. The pressure plate and the base plate fixed on the frame below cooperate to clamp the PCB board. After fixing, the bevel is processed.
[0016] Furthermore, the transfer also includes two three-way modules. The processing device includes a milling assembly. The two three-way modules are used to drive the milling assembly to move, and the output direction of the traverse module is towards the milling assembly.
[0017] The three-axis module includes an X module, a Z module, and a Y module, which are connected in sequence to drive the milling assembly to move in three coordinates, facilitating the processing of PCB boards. By setting up two sets, processing efficiency is improved.
[0018] Furthermore, the milling assembly includes a mounting plate, a three-way module output end and a mounting plate that are fastened together. The mounting plate is equipped with two milling motors, and the output end of the milling motors is equipped with milling cutters. The two milling cutters in the same group face the same side of the PCB board on both sides. Tool setting cameras are provided on both sides of the frame, and the tool setting cameras face the two milling cutters.
[0019] The mounting plate is fixed to the output end of the Y module. The mounting plate is used to fix two milling motors. The milling motors are used to output torque to drive the milling cutter to rotate, thereby milling the inclined surface of the PCB board. By setting two milling cutters at each station, double-sided milling can be performed to improve milling efficiency. A tool setting camera is set up for automatic tool setting.
[0020] Furthermore, a recycling assembly is provided on one side of the mounting plate. The recycling assembly includes a recycling cover, an exhaust pipe, a light-emitting plate, and a photosensitive plate. The recycling cover and the mounting plate are fastened together. The recycling cover has a collection chamber with the inlet facing two milling cutters. An exhaust duct is provided on one side of the collection chamber, and the exhaust pipe is connected to the exhaust duct pipe. A light-emitting plate and a photosensitive plate are respectively provided on the two side walls of the collection chamber. The light-emitting plate emits light in the direction of the light towards the photosensitive plate. Two electrodes are provided on the photosensitive plate, and the two electrodes and two terminals of the power supply are electrically connected to form a collection circuit.
[0021] The system automatically collects the grinding debris generated during cutting by setting up a recycling component. The debris is automatically guided through the collection chamber on the recycling hood. The end of the collection chamber is connected to an exhaust duct and an exhaust pipe, which is connected to a fan. By connecting to a negative pressure air source, a negative pressure is created inside the collection chamber. Under the action of the pressure difference, the grinding debris is drawn into the collection chamber by the airflow. The light-emitting plate acts as a surface light source to emit light, which passes through the debris layer and illuminates the photosensitive plate. The photosensitive plate supports the photosensitive material. Under the illumination of the light, electron-hole pairs are excited to participate in the conduction, making the collection circuit conduct. The current is positively correlated with the light intensity, that is, the greater the light intensity, the greater the current in the collection circuit, thereby automatically monitoring the amount of debris collected.
[0022] Furthermore, the processing device also includes a shut-off component. The exhaust duct is provided with a flow-blocking channel. The shut-off component also includes a flow-blocking electromagnet and a flow-blocking plate. The flow-blocking electromagnet and the flow-blocking plate are respectively placed on both sides of the flow-blocking channel. The flow-blocking electromagnet is electrically connected to the collection circuit. A tension spring is provided on one side of the flow-blocking plate. The tension spring is fastened to the flow-blocking channel on one side. The flow-blocking plate and the flow-blocking channel are slidably connected.
[0023] By setting a cutoff component, the cross-sectional area of the intercepting channel in the exhaust duct is locally adjusted. The current signal collected by the collection circuit is used as the control signal for the intercepting electromagnet, ensuring that the intercepting electromagnet is always energized and positively correlated. The intercepting plate is made of ferromagnetic material and is attracted to the intercepting electromagnet. When the debris increases instantaneously, the collection circuit controls the instantaneous input current of the intercepting electromagnet to decrease, causing the tension spring to drive the intercepting plate to contract and slide away from the intercepting electromagnet until the attraction of the intercepting electromagnet and the elastic force of the tension spring are balanced. At this time, the remaining flow area after the intercepting plate intercepts the exhaust duct increases, thereby adjusting the cleaning efficiency in a timely manner according to the amount of debris and ensuring the cleaning quality.
[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: A color mark sensor is used to detect whether the item is padding paper or a PCB board. If it is padding paper, the feeding assembly moves it to the transfer station where the transfer assembly is located, and then the receiving assembly moves it to the receiving station at the end. If the product is a PCB board, it is moved to the processing station for bevel processing. After processing, it is moved to the subsequent station. A color mark sensor serves as the primary detection element, while a metal sensor provides secondary identification of the items to prevent missed processing due to sensor malfunction. A negative pressure air source creates negative pressure within the collection chamber. Under this pressure difference, grinding debris flows into the chamber with the airflow. A light-emitting plate acts as a surface light source, emitting light that passes through the debris layer and illuminates a photosensitive plate. This plate, supporting the photosensitive material, generates electron-hole pairs under light, activating the collection circuit. The current is positively correlated with light intensity; higher light intensity results in a higher current, allowing for automatic monitoring of the collected debris. When debris increases instantaneously, the collection circuit reduces the instantaneous input current to the current-blocking electromagnet, causing the tension spring to retract the current-blocking plate and slide it away from the electromagnet until the electromagnet's attraction and the spring's elasticity are balanced. At this point, the remaining flow area of the current-blocking plate after the exhaust duct increases, allowing for timely adjustment of cleaning efficiency based on debris volume to ensure cleaning quality. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the three-way module structure of the present invention; Figure 3 This is a schematic diagram of the linkage between the feeding suction cup and the metal sensor of the present invention; Figure 4 This is a schematic diagram of the transmission plate drive of the present invention; Figure 5 This is a schematic diagram of the reversing power transmission of the transfer suction cup of the present invention; Figure 6 This is a schematic diagram of debris recycling according to the present invention; Figure 7 This is a schematic diagram of the cutoff component structure of the present invention; Figure 8 for Figure 7 A magnified view of a portion of the view (A).
[0026] In the diagram: 1. Frame; 2. Feeding device; 21. Feeding assembly; 211. Feeding platform; 212. Feeding suction cup; 22. Transfer assembly; 221. Transfer platform; 222. Transfer suction cup; 2221. Lifting cylinder; 2222. Transmission plate; 2223. Reversing motor; 2224. Suction nozzle; 23. Receiving assembly; 231. Receiving platform; 232. Receiving suction cup; 3. Processing device; 31. Milling assembly; 311. Mounting plate; 312. Milling motor; 313. Milling cutter; 32. Recycling assembly; 3 21. Recycling hood; 3211. Collection chamber; 3212. Cut-off channel; 3213. Exhaust duct; 322. Exhaust pipe; 323. Light-emitting plate; 324. Photosensitive plate; 325. Electrode; 33. Cut-off assembly; 331. Cut-off electromagnet; 332. Cut-off plate; 333. Tension spring; 4. Transfer; 41. Three-way module; 42. Lateral module; 43. Pressure plate; 44. Lowering cylinder; 45. Carrier plate; 5. Linear motor; 6. Color mark sensor; 7. Metal sensor; 8. CCD camera; 9. Tool setting camera. Detailed Implementation
[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0028] Example: Figures 1-8 As shown, the present invention provides a technical solution for a PCB board gold finger beveling machine with self-cleaning and recycling function.
[0029] The beveling machine includes a frame 1, a feeding device 2, a processing device 3, a transfer device 4, and a linear motor 5. The fixed end of the linear motor 5 is fastened to the frame 1, the output end of the linear motor 5 is fastened to the feeding device 2, the transfer device 4 is fastened to the frame 1, and the transfer device 4 is used to drive the processing device 3 and the PCB board to move. Two processing devices 3 are provided.
[0030] The frame 1 serves as the main mounting base for installing other devices. The feeding device 2 automatically transports the PCB board and padding paper. The transfer device 4 provides linear displacement, thereby driving the processing device 3 to move and perform inclined surface processing on the PCB board. The linear motor 5 is also used to provide linear displacement for the station transfer of the PCB board and padding paper.
[0031] Furthermore, the feeding device 2 includes a feeding component 21, a transfer component 22, and a receiving component 23. The linear motor 5 is provided with three output ends, which are respectively connected to the feeding component 21, the transfer component 22, and the receiving component 23. The feeding component 21 is provided with a color mark sensor 6 and a metal sensor 7.
[0032] The feeding assembly 21 is used for automatic feeding, and includes a transfer assembly 22 and a receiving assembly 23. A linear motor 5 has three output terminals, which drive the movement of these three assemblies. During feeding, a color mark sensor 6 detects whether the item is padding paper or a PCB board. If it is padding paper, the feeding assembly 21 moves it to the transfer station located at the transfer assembly 22, and the receiving assembly 23 moves it to the final receiving station. If the product is a PCB board, it is moved to the processing station for bevel processing. After processing, it is moved to the subsequent station. The color mark sensor 6 serves as the primary detection element, and a metal sensor 7 is also included for secondary detection to prevent missed processing due to color mark sensor malfunction.
[0033] Furthermore, the frame 1 is equipped with two CCD cameras 8, the feeding assembly 21 includes a feeding platform 211 and a feeding suction cup 212, the transfer assembly 22 includes a transfer platform 221 and a transfer suction cup 222, and the receiving assembly 23 includes a receiving platform 231 and a receiving suction cup 232. The three output ends of the linear motor 5 are respectively fastened to the feeding suction cup 212, the transfer suction cup 222 and the receiving suction cup 232. The feeding platform 211, the transfer platform 221 and the receiving platform 231 are respectively placed on the frame 1, with the transfer platform 221 located between the feeding platform 211 and the receiving platform 231. The two CCD cameras 8 are respectively fastened to the feeding suction cup 212 and the receiving suction cup 232.
[0034] CCD cameras 8 are installed at both ends of the frame 1. These cameras capture images of the PCB board at the processing station to obtain its current position information, facilitating the adjustment of the processing device and the PCB board position by the transfer unit 4. During loading, the item is placed on the feeding platform 211. The type of item is first determined. If it is padding paper, the first output of the linear motor 5 drives the feeding suction cup 212 to move, using negative pressure suction to move the padding paper to the transfer platform 221. Then, the third output of the linear motor 5 drives the receiving suction cup 232 to move the padding paper to the receiving platform 231. If it is a PCB board, the feeding suction cup 212 moves it to the first processing station for bevel processing. The two CCD cameras 8 move with the feeding suction cup 212 and the receiving suction cup 232 respectively, facilitating automatic positioning of the item.
[0035] Furthermore, the transfer suction cup 222 includes a lifting cylinder 2221, which is fastened to the output end of the linear motor 5. The output end of the lifting cylinder 2221 is provided with a transmission plate 2222, and the transmission plate 2222 is provided with a reversing motor 2223. The output end of the reversing motor 2223 is provided with a suction nozzle 2224.
[0036] When processing polygonal lines on a PCB board, the angle is automatically adjusted by the transfer suction cup 222. The second output end of the linear motor 5 is used to drive the lifting cylinder 2221 to move and to drive the transmission plate 2222 to move vertically. After the pre-processed PCB board moves to the transfer platform 221, the lifting cylinder 2221 drives the transmission plate 2222 to move down until the suction nozzle 2224 is adsorbed on the surface of the PCB board. The reversing motor 2223 drives the suction nozzle 2224 to rotate, thereby driving the PCB board to adjust its angle.
[0037] Furthermore, the transfer unit 4 includes a transverse transfer module 42, a carrier plate 45 is provided on one side of the transverse transfer module 42, and two pressing cylinders 44 are provided on the frame 1. The output end of the pressing cylinder 44 is provided with a pressure plate 43, which is used to press the PCB board onto the base plate.
[0038] A transverse module 42 is set at two processing stations. A carrier plate 45 is placed on the frame 1 to support the PCB board. A lever is set at the output end of the transverse module 42 to push the PCB board to the corresponding position. A pressure cylinder 44 is fixed on the frame 1 and outputs downward displacement to drive the pressure plate 43 to move down. The pressure plate 43 and the base plate fixed on the frame 1 cooperate to clamp the PCB board. After fixing, the bevel processing is performed.
[0039] Furthermore, the transfer device 4 also includes a three-way module 41, with two three-way modules 41 provided. The processing device 3 includes a milling assembly 31. The two three-way modules 41 are used to drive the milling assembly 31 to move, and the output direction of the transverse module 42 is towards the milling assembly 31.
[0040] The three-axis module 41 includes an X module, a Z module, and a Y module, which are connected in sequence to drive the milling assembly 31 to move in three coordinates, facilitating the processing of the PCB board. By setting two sets, the processing efficiency is improved.
[0041] Furthermore, the milling assembly 31 includes a mounting plate 311, the output end of the three-way module 41 is fastened to the mounting plate 311, the mounting plate 311 is provided with two milling motors 312, the output end of the milling motors 312 is provided with milling cutters 313, the two milling cutters 313 in the same group face the same side of the PCB board respectively, and the two sides of the frame 1 are respectively provided with tool setting cameras 9, which face the two milling cutters 313.
[0042] Mounting plate 311 is fixed to the output end of Y module. Mounting plate 311 is used to fix two milling motors 312. Milling motors 312 are used to output torque to drive milling cutter 313 to rotate, thereby milling the inclined surface of PCB board. By setting two milling cutters 313 at each station, double-sided milling is performed to improve milling efficiency. Tool setting camera 9 is set for automatic tool setting.
[0043] Furthermore, a recycling assembly 32 is provided on one side of the mounting plate 311. The recycling assembly 32 includes a recycling cover 321, an exhaust pipe 322, a light-emitting plate 323, and a photosensitive plate 324. The recycling cover 321 and the mounting plate 311 are fastened together. The recycling cover 321 is provided with a collection chamber 3211. The inlet of the collection chamber 3211 faces the two milling cutters 313. An exhaust duct 3213 is provided on one side of the collection chamber 3211. The exhaust pipe 322 and the exhaust duct 3213 are connected. The light-emitting plate 323 and the photosensitive plate 324 are respectively provided on the two side walls of the collection chamber 3211. The light-emitting direction of the light-emitting plate 323 faces the photosensitive plate 324. The photosensitive plate 324 is provided with two pole posts 325. The two pole posts 325 and the two terminals of the power supply are electrically connected to form a collection circuit.
[0044] The chipping material generated during cutting is automatically collected by the recycling component 32. The chipping material is automatically guided through the collection chamber 3211 on the recycling cover 321. The end of the collection chamber 3211 is connected to the exhaust pipe 322 via the exhaust duct 3213. The exhaust pipe 322 is connected to a fan. By connecting to a negative pressure air source, a negative pressure is created inside the collection chamber 3211. Under the pressure difference, the chipping material generated during grinding flows into the collection chamber 3211 with the airflow. The light-emitting plate 323 serves as a surface light source to emit light, which passes through the chipping material layer and illuminates the photosensitive plate 324. The photosensitive plate 324 supports the photosensitive material. Under the illumination of the light, electron-hole pairs are excited to participate in the conduction, making the collection circuit conduct. The current magnitude is positively correlated with the light intensity, that is, the greater the light intensity, the greater the current of the collection circuit, thereby automatically monitoring the amount of chipping material collected.
[0045] Furthermore, the processing device 3 also includes a cut-off component 33. The exhaust duct 3213 is provided with a flow-blocking channel 3212. The cut-off component 33 also includes a flow-blocking electromagnet 331 and a flow-blocking plate 332. The flow-blocking electromagnet 331 and the flow-blocking plate 332 are respectively placed on both sides of the flow-blocking channel 3212. The flow-blocking electromagnet 331 is electrically connected to the collection circuit. A tension spring 333 is provided on one side of the flow-blocking plate 332. One side of the tension spring 333 is fastened to the flow-blocking channel 3212. The flow-blocking plate 332 and the flow-blocking channel 3212 are slidably connected.
[0046] By setting the cut-off component 33, the cross-sectional area of the intercepting channel 3212 in the exhaust duct 3213 is locally adjusted. The current signal collected by the collection circuit is used as the control signal for the control input intercepting electromagnet 331, so that the intercepting electromagnet 331 is always energized and positively correlated. The intercepting plate 332 is made of ferromagnetic material and is attracted to the intercepting electromagnet 331. When the debris increases instantaneously, the collection circuit controls the instantaneous input current of the intercepting electromagnet 331 to decrease, so that the tension spring 333 drives the intercepting plate 332 to contract and slide away from the intercepting electromagnet 331 until the attraction of the intercepting electromagnet 331 and the elastic force of the tension spring 333 are balanced. At this time, the remaining flow area of the intercepting plate 332 after intercepting the exhaust duct 3213 increases, thereby adjusting the cleaning efficiency in a timely manner according to the amount of debris and ensuring the cleaning quality.
[0047] The working principle of this invention is as follows: A color mark sensor 6 detects whether the item is a backing paper or a PCB board. If it is backing paper, the feeding assembly 21 moves it to the transfer station of the transfer assembly 22, and then the receiving assembly 23 moves it to the receiving station at the end. If the product is a PCB board, it is moved to the processing station for bevel processing. After processing, it is moved to the subsequent station. The color mark sensor 6 serves as the main detection element, and a metal sensor 7 is also used for secondary detection to avoid missed processing due to color mark sensor malfunction. By connecting a negative pressure air source, a negative pressure is created inside the collection chamber 3211. Under the pressure difference, the grinding debris flows into the collection chamber 3211 with the airflow. The light-emitting plate 323, as a surface light source, emits light that passes through the debris layer and illuminates the photosensitive plate 324. The photosensitive plate 324 supports the photosensitive material. Under light illumination, electron-hole pairs are excited to participate in conductivity, thus conducting the collection circuit. The current magnitude is positively correlated with the light intensity; that is, the greater the light intensity, the greater the current in the collecting circuit, thus automatically monitoring the amount of debris collected. When the amount of debris increases instantaneously, the collecting circuit controls the instantaneous input current of the current-cutting electromagnet 331 to decrease, causing the tension spring 333 to drive the current-cutting plate 332 to contract and slide away from the current-cutting electromagnet 331 until the attraction force of the current-cutting electromagnet 331 and the elastic force of the tension spring 333 are balanced. At this time, the remaining flow area of the current-cutting plate 332 after the exhaust duct 3213 increases, thereby adjusting the cleaning efficiency in a timely manner according to the amount of debris to ensure the cleaning quality.
[0048] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A PCB board gold finger beveling machine with self-cleaning and recycling function, characterized in that: The beveling machine includes a frame (1), a feeding device (2), a processing device (3), a transfer device (4), and a linear motor (5). The fixed end of the linear motor (5) is fastened to the frame (1), and the output end of the linear motor (5) is fastened to the feeding device (2). The transfer device (4) is fastened to the frame (1). The transfer device (4) is used to drive the processing device (3) and the PCB board to move. Two processing devices (3) are provided.
2. The PCB board gold finger beveling machine with self-cleaning and recycling function according to claim 1, characterized in that: The feeding device (2) includes a feeding component (21), a transfer component (22) and a receiving component (23). The linear motor (5) is provided with three output terminals, which are respectively connected to the feeding component (21), the transfer component (22) and the receiving component (23). The feeding component (21) is provided with a color mark sensor (6) and a metal sensor (7).
3. A PCB board gold finger beveling machine with self-cleaning and recycling function according to claim 2, characterized in that: The frame (1) is equipped with two CCD cameras (8). The feeding assembly (21) includes a feeding platform (211) and a feeding suction cup (212). The transfer assembly (22) includes a transfer platform (221) and a transfer suction cup (222). The receiving assembly (23) includes a receiving platform (231) and a receiving suction cup (232). The three output ends of the linear motor (5) are respectively fastened to the feeding suction cup (212), the transfer suction cup (222) and the receiving suction cup (232). The feeding platform (211), the transfer platform (221) and the receiving platform (231) are respectively placed on the frame (1). The transfer platform (221) is located between the feeding platform (211) and the receiving platform (231). The two CCD cameras (8) are respectively fastened to the feeding suction cup (212) and the receiving suction cup (232).
4. A PCB board gold finger beveling machine with self-cleaning and recycling function according to claim 3, characterized in that: The transfer suction cup (222) includes a lifting cylinder (2221), which is fastened to the output end of the linear motor (5). The output end of the lifting cylinder (2221) is provided with a transmission plate (2222), and the transmission plate (2222) is provided with a reversing motor (2223). The output end of the reversing motor (2223) is provided with a suction nozzle (2224).
5. A PCB board gold finger beveling machine with self-cleaning and recycling function according to claim 4, characterized in that: The transfer (4) includes a transverse module (42), a carrier plate (45) is provided on one side of the transverse module (42), and two pressure cylinders (44) are provided on the frame (1). The output end of the pressure cylinder (44) is provided with a pressure plate (43), which is used to press the PCB board onto the base plate.
6. A PCB board gold finger beveling machine with self-cleaning and recycling function according to claim 5, characterized in that: The transfer (4) also includes a three-way module (41), two of which are provided. The processing device (3) includes a milling assembly (31). The two three-way modules (41) are used to drive the milling assembly (31) to move. The output direction of the transverse module (42) is toward the milling assembly (31).
7. A PCB board gold finger beveling machine with self-cleaning and recycling function according to claim 6, characterized in that: The milling assembly (31) includes a mounting plate (311). The output end of the three-way module (41) is fastened to the mounting plate (311). The mounting plate (311) is provided with two milling motors (312). The output end of the milling motors (312) is provided with milling cutters (313). The two milling cutters (313) in the same group face the same side of the PCB board. The frame (1) is provided with tool setting cameras (9) on both sides. The tool setting cameras (9) face the two milling cutters (313).
8. A PCB board gold finger beveling machine with self-cleaning and recycling function according to claim 7, characterized in that: The mounting plate (311) is provided with a recycling assembly (32) on one side. The recycling assembly (32) includes a recycling cover (321), an exhaust pipe (322), a light-emitting plate (323), and a photosensitive plate (324). The recycling cover (321) and the mounting plate (311) are fastened together. The recycling cover (321) is provided with a collection chamber (3211). The inlet of the collection chamber (3211) faces two milling cutters (313). The collection chamber (3211) is provided with an exhaust duct (3213) on one side. The exhaust pipe (322) and the exhaust duct (3213) are connected. The two walls of the collection chamber (3211) are respectively provided with a light-emitting plate (323) and a photosensitive plate (324). The light-emitting direction of the light-emitting plate (323) faces the photosensitive plate (324). The photosensitive plate (324) is provided with two poles (325). The two poles (325) and the two terminals of the power supply are electrically connected to form a collection circuit.
9. A PCB board gold finger beveling machine with self-cleaning and recycling function according to claim 8, characterized in that: The processing device (3) further includes a cut-off component (33). The exhaust duct (3213) is provided with a flow interception channel (3212). The cut-off component (33) further includes a flow interception electromagnet (331) and a flow interception plate (332). The flow interception electromagnet (331) and the flow interception plate (332) are respectively placed on both sides of the flow interception channel (3212). The flow interception electromagnet (331) is electrically connected to the collection circuit. A tension spring (333) is provided on one side of the flow interception plate (332). One side of the tension spring (333) is fastened to the flow interception channel (3212). The flow interception plate (332) and the flow interception channel (3212) are slidably connected.